CN115036669A

CN115036669A - Antenna packaging structure and manufacturing method thereof

Info

Publication number: CN115036669A
Application number: CN202210727612.5A
Authority: CN
Inventors: 刘硕; 林耀剑; 周青云
Original assignee: Jiangsu Changjiang Electronics Technology Co Ltd
Current assignee: JCET Group Co Ltd
Priority date: 2022-06-22
Filing date: 2022-06-22
Publication date: 2022-09-09

Abstract

The invention discloses an antenna packaging structure and a manufacturing method thereof, wherein the packaging structure comprises at least one antenna substrate and a circuit substrate, the antenna substrate is arranged above the circuit substrate, an input antenna is arranged in the antenna substrate, the antenna substrate and the circuit substrate are welded/fixed through a support piece, the antenna packaging structure also comprises a thin film layer, the thin film layer completely covers the upper surface and the side wall surface of the antenna substrate and extends to the upper surface of the circuit substrate along the side wall surface of the antenna substrate, and a closed cavity is formed by the thin film layer, the lower surface of the antenna substrate and the upper surface of the circuit substrate in a surrounding manner. A thin film layer is formed on the surface of the antenna substrate, a closed cavity is formed between the thin film layer and the lower surface of the antenna substrate and between the thin film layer and the upper surface of the circuit substrate in an enclosing mode, signal transmission loss caused by filling of plastic packaging materials between the circuit substrate and the antenna substrate is reduced, meanwhile, the situation that a signal transmission cavity between the circuit substrate and the antenna substrate is completely exposed in the air is avoided, and the reliability of an antenna packaging structure is improved.

Description

Antenna packaging structure and manufacturing method thereof

Technical Field

The invention relates to the technical field of antenna packaging, in particular to an antenna packaging structure and a manufacturing method thereof.

Background

With the coming of high-speed communication times such as 5G and VR, millimeter wave communication gradually becomes mainstream, and the design and application requirements of millimeter wave antennas are more and more vigorous. Since the length of a transmission path in a millimeter wave frequency band has a great influence on the signal amplitude loss, the traditional architecture mode of an IC + PCB + Antenna has been unable to meet the requirement of high performance, and the architecture of an IC + packaged Antenna becomes the mainstream, which is AiP (Antenna in Package) technology.

The antenna packaging structure mainly adopts a mode of stacking two or more substrates, the upper substrate is a multi-band input antenna (28G, 40G and 60G), the lower substrate is used for wiring, the distance between the upper substrate and the lower substrate is different along with the difference of antenna frequency, the lower the antenna frequency is, the larger the distance between the upper substrate and the lower substrate is, and therefore the consistent interval height can be kept by mixing and matching part of nuclear balls or high-melting-point balls between the upper substrate and the lower substrate. In the prior art, the antenna is directly exposed in the air, the reliability is low, the antenna packaging structure is subjected to integral plastic packaging for improving the reliability and facilitating the subsequent board loading process, but the transmission performance between the antennas can be reduced by plastic packaging materials around the antenna.

Disclosure of Invention

The invention aims to provide an antenna packaging structure and a manufacturing method thereof.

In order to achieve one of the above objects, an embodiment of the present invention provides an antenna package structure, including at least one antenna substrate and a circuit substrate, wherein the antenna substrate is disposed above the circuit substrate, an input antenna is disposed in the antenna substrate, and the antenna substrate and the circuit substrate are fixed by a supporting member, wherein,

the antenna packaging structure further comprises a thin film layer, the thin film layer completely covers the upper surface and the side wall surface of the antenna substrate and extends to the upper surface of the circuit substrate along the side wall surface of the antenna substrate, and a closed cavity is formed between the thin film layer and the lower surface of the antenna substrate and between the thin film layer and the upper surface of the circuit substrate in an enclosing mode.

As a further improvement of an embodiment of the present invention, the thin film layer is an organic polymer film, and has a dielectric constant less than 3.5 and a dielectric loss less than 0.006.

As a further improvement in one embodiment of the present invention, the thin film layer has a thickness greater than 40 μm.

As a further improvement of the embodiment of the present invention, the antenna substrate includes a first antenna substrate, a second antenna substrate, and a third antenna substrate, wherein an input antenna with a 28G frequency is provided in the first antenna substrate, an input antenna with a 40G frequency is provided in the second antenna substrate, and an input antenna with a 60G frequency is provided in the third antenna substrate.

As a further improvement of the embodiment of the present invention, a distance between the first antenna substrate and the circuit substrate is larger than a distance between the second antenna substrate and the circuit substrate, and a distance between the second antenna substrate and the circuit substrate is larger than a distance between the third antenna substrate and the circuit substrate.

As a further improvement of one embodiment of the invention, the supporting member is a solder ball and/or a core ball and/or a curing glue.

As a further improvement of an embodiment of the present invention, a plurality of beam bumps are formed on the upper surface of the antenna substrate where the input antenna is disposed, the beam bumps protrude upward along the antenna substrate, and the film layer further covers the upper surface of the beam bumps.

As a further improvement of an embodiment of the present invention, the beam bump has a conical structure and has a lens function.

As a further improvement of an embodiment of the present invention, an included angle between the conical surface of the conical structure and the bottom surface is less than 45 degrees.

As a further improvement of an embodiment of the present invention, the beam bump material is a composition of aluminum oxide and epoxy resin, and has a dielectric constant greater than 4 and a dielectric loss less than 0.006.

As a further improvement of an embodiment of the present invention, the antenna package structure further includes at least 1 rf chip, and a metal solder ball disposed on the lower surface of the circuit substrate, where the metal solder ball is used to electrically connect with an external circuit.

As a further improvement of an embodiment of the present invention, the antenna package structure further includes a plastic package body, and the plastic package body completely covers the film layer and the uncovered upper surface of the circuit substrate.

The invention also provides a manufacturing method of the antenna packaging structure, which comprises the following steps:

providing at least one antenna substrate and a circuit substrate, wherein an input antenna is arranged in the antenna substrate;

arranging a support part on the upper surface of the circuit substrate, and fixing the antenna substrate above the circuit substrate through the support part;

and forming a thin film layer on the upper surface and the side wall surface of the antenna substrate, wherein the thin film layer extends to the upper surface of the circuit substrate along the side wall surface of the antenna substrate, and a closed cavity is formed between the thin film layer and the lower surface of the antenna substrate as well as between the thin film layer and the upper surface of the circuit substrate.

As a further improvement of an embodiment of the present invention, providing at least one antenna substrate and a circuit substrate, where an input antenna is disposed in the antenna substrate specifically includes:

providing a first antenna substrate, a second antenna substrate and a third antenna substrate, wherein an input antenna with 28G frequency is arranged in the first antenna substrate, an input antenna with 40G frequency is arranged in the second antenna substrate, and an input antenna with 60G frequency is arranged in the third antenna substrate.

As a further improvement of an embodiment of the present invention, the forming a supporting member on the upper surface of the circuit substrate, and fixing the antenna substrate above the circuit substrate through the supporting member specifically includes:

soldering tin balls and/or dispensing glue on the upper surface of the circuit substrate, and fixedly placing the first antenna substrate, the second antenna substrate and the third antenna substrate above the circuit substrate through the soldering tin balls and/or dispensing glue;

the distance between the first antenna substrate and the circuit substrate is larger than the distance between the second antenna substrate and the circuit substrate, and the distance between the second antenna substrate and the circuit substrate is larger than the distance between the third antenna substrate and the circuit substrate.

As a further improvement of an embodiment of the present invention, the forming of the thin film layer on the upper surface and the side wall surface of the antenna substrate, the extending of the thin film layer along the side wall surface of the antenna substrate to the upper surface of the circuit substrate, and the enclosing of the thin film layer between the lower surface of the antenna substrate and the upper surface of the circuit substrate to form a sealed cavity, specifically includes:

and by utilizing a film pressing process, forming a thin film layer with the thickness of more than 40 mu m on the upper surfaces and the side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate, wherein the thin film layer extends to the upper surface of the circuit substrate along the side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate respectively, and the thin film layer is enclosed between the lower surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate and the upper surface of the circuit substrate to form a closed cavity.

As a further improvement of an embodiment of the present invention, before forming the thin film layer on the upper surface and the side wall surface of the antenna substrate on which the input antenna is provided, the method further includes:

and a plurality of beam bumps in a conical structure are manufactured on the upper surface of the antenna substrate, which is correspondingly provided with the input antenna, and the beam bumps protrude upwards along the antenna substrate.

As a further improvement of an embodiment of the present invention, the manufacturing method further includes the steps of:

and forming a film layer with the thickness of more than 40 mu m on the upper surface of the beam bump by using a film pressing process.

and plastically packaging the upper surface of the thin film layer and the uncovered upper surface of the circuit substrate.

The invention has the beneficial effects that: a thin film layer is formed on the surface of the antenna substrate, a closed cavity is formed between the thin film layer and the lower surface of the antenna substrate and between the thin film layer and the upper surface of the circuit substrate in an enclosing mode, signal transmission loss caused by filling of plastic packaging materials between the circuit substrate and the antenna substrate is reduced, meanwhile, the situation that a signal transmission cavity between the circuit substrate and the antenna substrate is completely exposed in the air is avoided, and the reliability of an antenna packaging structure is improved.

Drawings

Fig. 1 is a side view of an antenna package structure according to an embodiment of the invention.

Fig. 2 is a side view of an antenna package structure in embodiment 1 of the present invention.

Fig. 3 is a top view of the antenna package structure (before molding) in embodiment 1 of the present invention.

Fig. 4 is a side view of an antenna package structure in embodiment 2 of the present invention.

Fig. 5 is a top view of an antenna package structure (before being molded) in embodiment 2 of the present invention.

Fig. 6 is a side view of an antenna package structure with another beam bump structure in embodiment 2 of the present invention.

Fig. 7 is a flowchart illustrating a method for manufacturing an antenna package structure according to an embodiment of the invention.

Fig. 8 is a schematic flowchart of a manufacturing method of an antenna package structure in embodiment 1 of the present invention.

Fig. 9(a) to (d) are a flow of steps of manufacturing the antenna package structure in embodiment 1 of the present invention.

Fig. 10 is a schematic flowchart of a manufacturing method of an antenna package structure in embodiment 2 of the present invention.

Fig. 11(a1) and (a2) are flowcharts of manufacturing steps of the antenna package structure in embodiment 2 of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail and completely with reference to the following detailed description of the invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

For convenience in explanation, the description herein uses terms indicating relative spatial positions, such as "upper," "lower," "rear," "front," and the like, to describe one element or feature's relationship to another element or feature as illustrated in the figures. The term spatially relative position may encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "above" other elements or features would then be oriented "below" or "above" the other elements or features. Thus, the exemplary term "below" can encompass both a spatial orientation of below and above.

As shown in fig. 1, the present embodiment provides an antenna package structure, which includes at least one antenna substrate 1 and a circuit substrate 2, wherein the antenna substrate 1 is disposed above the circuit substrate 2, and an input antenna is disposed in the antenna substrate 1.

The antenna substrate 1 and the circuit substrate 2 are fixed by a support 3, and the support 3 is a solder ball and/or a core ball 31 and/or a curing glue 32. In the present embodiment, the middle position of the upper surface of the circuit substrate 2 is dispensed for bonding and fixing the antenna substrate 1 and the circuit substrate 2, solder balls and/or core balls 31 having the same height as the solidified glue 32 are welded at the two ends of the upper surface of the circuit substrate 2, the antenna substrate 1 and the circuit substrate 2 are welded together, and the surface plane of the antenna substrate 1 is ensured to be at the same position height.

Of course, in some other embodiments of the present invention, the antenna substrate 1 may also be fixed by arranging the metal posts and the glue at the same height on the upper surface of the circuit substrate 2, the fixing manner between the antenna substrate 1 and the circuit substrate 2 is not limited in the present invention, and it is only required to ensure that the plane of the antenna substrate 1 fixed above the circuit substrate 2 is at the same position height, and the signal transmission between the two is not affected.

Specifically, the distance between the antenna substrate 1 and the wiring substrate 2, that is, the antenna cavity height can be controlled by controlling the height of the support 3. The antenna cavity height is related to the frequency of the input antenna arranged in the antenna substrate 1, and the higher the frequency of the input antenna is, the lower the antenna cavity height is.

Further, the antenna package structure in this embodiment further includes a film layer 4, the film layer 4 completely covers the upper surface and the sidewall surface of the antenna substrate 1, and extends to the upper surface of the circuit substrate 2 along the sidewall surface of the antenna substrate 1, and a closed cavity 5 is defined between the film layer 4 and the lower surface of the antenna substrate 1 and the upper surface of the circuit substrate 2. The thin film layer 4 can form a closed cavity structure between the antenna substrate 1 and the circuit substrate 2, so that the loss of signal transmission between the antenna substrate 1 and the circuit substrate 2 can be effectively reduced, the cavity formed between the antenna substrate 1 and the circuit substrate 2 is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved.

The material of the Film layer 4 may be an organic polymer Film composed of one or more of organic polymer materials such as ABF (Ajinomoto Build-Up Film) and epoxy resin. Specifically, the thin film layer 4 has a thickness of more than 40 μm, a dielectric constant of less than 3.5, and a dielectric loss of less than 0.006, so as to reduce the loss of signal transmission.

Here, the thicker the thin film layer 4 is, the higher the manufacturing cost is, and the corresponding dielectric constant and dielectric loss are also increased; the thinner the film layer 4 is, the higher the requirement for the manufacturing process is, and the film is easily damaged in the manufacturing process. Therefore, in practical applications, the thickness of the thin film layer 4 can be set according to the process and cost considerations, and it is only necessary to ensure that the dielectric constant is less than 3.5 and the dielectric loss is less than 0.006.

The following two examples are provided to illustrate some embodiments of the invention.

Example 1

As shown in fig. 2 and 3, which are schematic diagrams of an antenna package structure in embodiment 1 of the present invention, the antenna package structure in this embodiment is a multi-module antenna package structure, the antenna substrate 1 specifically includes a first antenna substrate 11, a second antenna substrate 12, and a third antenna substrate 13, an input antenna 111 with a frequency of 28G is disposed in the first antenna substrate 11, an input antenna 121 with a frequency of 40G is disposed in the second antenna substrate 12, and an input antenna 131 with a frequency of 60G is disposed in the third antenna substrate 13. Specifically, the specific size of the antenna substrate with different frequency input antennas disposed above the circuit substrate 2 can be designed according to actual requirements.

In other embodiments, other numbers of antenna substrates 1 may be provided, and the frequency of the input antenna provided to the antenna substrate 1 may also be specifically adjusted.

The first antenna substrate 11 and the circuit substrate 2, the second antenna substrate 12 and the circuit substrate 2, and the third antenna substrate 13 and the circuit substrate 2 are soldered/fixed by the supporting member 3, specifically, the solder balls and/or the core balls 31 and the glue 32 are fixed by the soldering, and the distances between the antenna substrates with different input frequencies and the circuit substrate 2 are adjusted by controlling the heights of the corresponding solder balls and/or the core balls 31 and the glue 32.

Because the height of the antenna cavity is related to the frequency of the input antenna arranged in the antenna substrate 1, the height of the antenna cavity can be obtained by simulation according to the performance of the antenna substrate with different frequencies, and the higher the frequency of the input antenna of the antenna substrate is, the lower the height of the antenna cavity is. When the input antenna is a millimeter antenna with a frequency band of 28G-60G, the height of the antenna cavity can be controlled to be 45-250 μm.

Specifically, in the present embodiment, the distance between the first antenna substrate 11 and the circuit substrate 2 is greater than the distance between the second antenna substrate 12 and the circuit substrate 2, and the distance between the second antenna substrate 12 and the circuit substrate 2 is greater than the distance between the third antenna substrate 13 and the circuit substrate 2.

Further, the antenna package structure in this embodiment further includes a film layer 4, the film layer 4 completely covers the upper surface and the sidewall of the first antenna substrate 11, and extends to the upper surface of the circuit substrate 2 along the sidewall of the first antenna substrate 11, and a first sealed cavity 51 is enclosed between the film layer 4 and the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2; the film layer 4 completely covers the upper surface and the side wall surface of the second antenna substrate 12, and extends to the upper surface of the circuit substrate 2 along the side wall surface of the second antenna substrate 12, and a second closed cavity 52 is enclosed between the film layer 4 and the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2; the film layer 4 completely covers the upper surface and the side wall surface of the third antenna substrate 13, and extends to the upper surface of the circuit substrate 2 along the side wall surface of the third antenna substrate 13, and a third sealed cavity (not shown in the figure) is enclosed between the film layer 4 and the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2. Specifically, the height of the first sealed cavity 51 is greater than that of the second sealed cavity 52, and the height of the second sealed cavity 52 is greater than that of the third sealed cavity.

The thin film layer 4 can simultaneously form a closed cavity structure between each antenna substrate with different antenna cavity heights and the circuit substrate 2, so that the loss of signal transmission between each antenna substrate and the circuit substrate 2 can be effectively reduced, the cavity formed between each antenna substrate and the circuit substrate 2 is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved.

The material of the thin film layer 4 may be an organic polymer film composed of one or more of organic polymer materials such as ABF and epoxy resin. Specifically, the thin film layer 4 has a thickness of more than 40 μm, a dielectric constant of less than 3.5, and a dielectric loss of less than 0.006, so as to reduce the loss of signal transmission.

The antenna package structure in this embodiment further includes at least one rf chip 6, where the invention is not limited to the manufacturing process of packaging the rf chip 6 on the surface of the circuit substrate 2, and the rf chip 6 may be soldered to a specific position on the circuit substrate 2 through a flip chip process or a conventional flip chip process, and the invention is also not limited thereto, and may be flip-chip soldered to the lower surface of the circuit substrate 2 or soldered to the upper surface of the circuit substrate 2. In the embodiment, the structure that the chip is flip-chip ball-bonded on the lower surface of the circuit substrate 2 is used for explanation, and the underfill is further filled at the welding position of the radio frequency chip 6 and the circuit substrate 2, so as to prevent the problem that the welding position of the radio frequency chip 6 and the circuit substrate 2 is broken due to thermal stress or mechanical impact, and enhance the bonding force between the two.

Furthermore, in order to realize transmission between the antenna package structure and an external signal, a metal solder ball 7 is further disposed on the lower surface of the circuit substrate 2, and the metal solder ball 7 is used for electrically connecting with an external circuit.

Furthermore, in order to enhance the reliability of the antenna package structure and adjust the warpage of the substrate, the antenna package structure in this embodiment further includes a plastic package body 8, and the plastic package body 8 completely covers the film layer 4 and the uncovered upper and lower surfaces of the circuit substrate 2.

The plastic package body 8 is made of an EMC (Epoxy Molding Compound) material with low dielectric constant and low dielectric loss, specifically a silicon dioxide and Epoxy resin material composition, and the material performance of the material satisfies that the dielectric constant is less than 3, the dielectric loss is less than 0.006, and the loss of signal transmission between substrates is reduced.

Of course, in some other embodiments of the present invention, the molding compound 8 may also be a molding compound of one or more of phenolic resin, silica gel, amino group, unsaturated resin, and the like, and the present invention is not limited herein, and the material properties of the molding compound 8 may satisfy that the dielectric constant is less than 3, and the dielectric loss is less than 0.006.

Example 2

As shown in fig. 4 and 5, which are schematic diagrams of an antenna package structure in embodiment 2 of the present invention, different from the structure in embodiment 1, in this embodiment, a plurality of beam bumps 9 are formed at the upper surface of the antenna substrate 1 where the input antenna is correspondingly disposed, and the beam bumps 9 protrude upward along the antenna substrate 1, so as to achieve an effect of focusing and transmitting signals transmitted by the antenna.

Specifically, beam bumps 9 are formed at positions corresponding to the input antenna 111 having a frequency of 28G on the upper surface of the first antenna substrate 11, the input antenna 121 having a frequency of 40G on the upper surface of the second antenna substrate 12, and the input antenna 131 having a frequency of 60G on the upper surface of the third antenna substrate 13 shown in fig. 3, respectively. The beam bumps 9 are arranged at the input antenna position, so that the directivity of antenna signal emission of the antenna substrate can be enhanced, and mutual interference among different emission signals can be avoided.

The beam bump 9 is specifically a conical structure, and can collect and transmit transmission signals of the antenna substrate to the greatest extent. In order to facilitate the processing, the included angle between the conical surface of the conical structure and the bottom surface is set to be less than 45 degrees, and the conical structure has the function of a lens. The beam bump 9 is made of an EMC material with high dielectric constant and low dielectric loss, specifically a composition of aluminum oxide and epoxy resin, the larger the dielectric constant of the material for making the beam bump 9 is, the higher the constraint of the material field is, in order to further enhance the beam capability of the beam bump 9, the specific material for making the beam bump 9 has the performance that the dielectric constant is greater than 4, and the dielectric loss is less than 0.006.

The beam bump 9 forms a conical lens, and an included angle between the conical surface and the bottom surface of the conical structure is set to be less than 45 degrees, so that the loss of signal transmission can be reduced while the signal transmitted by the antenna is focused and transmitted.

It is understood that the top corners of the beam bumps 9 are rounded due to process manufacturing errors, which makes it difficult to form a standard tapered structure at the top corners of the beam bumps 9.

In other embodiments of the present invention, as shown in fig. 6, the beam bump 9 having a conical structure includes a base 91 at a bottom end thereof, the stability of the beam bump 9 disposed on the surface of the antenna substrate is enhanced, and the base 91 and the beam bump 9 are integrally formed and made of the same material. The specific thickness of the base 91 is not limited herein, and may be designed according to the actual application requirements.

The beam bumps 9 may also be a tower-house type structure, a prismatic structure, or some other structure with upward protruding points, and all fall within the protection scope of the present invention, and it is sufficient that the beam bumps 9 can form a beam and signals sent from the beam bumps are not interfered with each other.

In this embodiment, the film layer 4 completely covers the upper surface of the beam bump 9, and the upper surfaces and the side wall surfaces of the first antenna substrate 11, the second antenna substrate 12, and the third antenna substrate 13 that are not covered by the beam bump 9, and extends to the upper surface of the circuit substrate 2 along the side wall surfaces of the first antenna substrate 11, the second antenna substrate 12, and the third antenna substrate 13. Similarly, the thin film layer 4 is enclosed with a first sealed cavity 51 between the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2, a second sealed cavity 52 between the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2, and a third sealed cavity (not shown) between the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2.

Specifically, the height of the first sealed cavity 51 is greater than that of the second sealed cavity 52, and the height of the second sealed cavity 52 is greater than that of the third sealed cavity.

The thin film layer 4 can simultaneously form a closed cavity structure between the antenna substrate with different antenna cavity heights and the circuit substrate 2, so that the loss of signal transmission between the antenna substrate and the circuit substrate 2 can be effectively reduced, the cavity formed between the antenna substrate and the circuit substrate 2 is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved.

The antenna package structure in this embodiment further includes a radio frequency chip 6 flip-chip mounted on the lower surface of the circuit substrate 2, a metal solder ball 7 for electrically connecting to an external circuit, and a molding compound 8, and the specific structural configuration is the same as that in embodiment 1, which is not described herein again.

As shown in fig. 7, the present invention further provides a method for manufacturing an antenna package structure, including the steps of:

s1: at least one antenna substrate 1 and a circuit substrate 2 are provided, and an input antenna is disposed in the antenna substrate 1.

S2: a support member 3 is formed on the upper surface of the wiring substrate 2, and the antenna substrate 1 is fixed above the wiring substrate 2 by the support member 3.

S3: a film layer 4 is formed on the upper surface and the side wall surface of the circuit substrate 2, the film layer 4 extends to the upper surface of the circuit substrate 2 along the side wall surface of the antenna substrate 1, and a closed cavity 5 is formed between the film layer 4 and the lower surface of the antenna substrate 1 and the upper surface of the circuit substrate 2 in an enclosing mode.

To further describe the method for manufacturing the antenna package structure in some embodiments of the present invention in detail, the following method for manufacturing the antenna package structure in example 1 and example 2 is described in detail.

As shown in fig. 8, a schematic flow chart of a manufacturing method of an antenna package structure in embodiment 1 of the present invention specifically includes the steps of:

s11: a first antenna substrate 11, a second antenna substrate 12, a third antenna substrate 13 and a circuit substrate 2 are provided.

Specifically, an input antenna of 28G frequency is provided in the first antenna substrate 11, an input antenna of 40G frequency is provided in the second antenna substrate 12, and an input antenna of 60G frequency is provided in the third antenna substrate 13.

S21: solder balls and/or core balls 31 are soldered and/or dispensed on the upper surface of the circuit substrate 2, and the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 are fixedly placed above the circuit substrate 2 through the solder balls and/or core balls 31 and/or dispensed.

Specifically, as shown in fig. 9(a), glue is dispensed on the upper surface of the circuit substrate 2, the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 are respectively bonded and fixed with the circuit substrate 2, solder balls and/or core balls 31 having the same height as the solidified glue 32 are respectively soldered at two ends of the upper surface of the circuit substrate 2 opposite to the antenna substrates placed above the upper surface, the antenna substrates are soldered with the circuit substrate 2, and the surface planes of the antenna substrates are ensured to be parallel to the surface of the circuit substrate 2. In some other embodiments of the present invention, the antenna substrates and the circuit substrate may be adhered and fixed together by dispensing holes on the antenna substrates.

More specifically, since the antenna cavity height is related to the input antenna frequency provided in the antenna substrate, attention needs to be paid to the spacing between the antenna substrate and the wiring substrate 2 for each different antenna frequency. In this embodiment, the height of the solder ball and/or the core ball 31 and/or the glue 32 between the first antenna substrate 11 and the circuit substrate 2 is controlled to be greater than the height of the solder ball and/or the core ball 31 and/or the glue 32 between the second antenna substrate 12 and the circuit substrate 2, the height of the solder ball and/or the core ball 31 and/or the glue 32 between the second antenna substrate 12 and the circuit substrate 2 is controlled to be greater than the height of the solder ball and/or the core ball 31 and/or the glue 32 between the third antenna substrate 13 and the circuit substrate 2, that is, the distance formed between the first antenna substrate 11 and the circuit substrate 2 is greater than the distance formed between the second antenna substrate 12 and the circuit substrate 2, and the distance formed between the second antenna substrate 12 and the circuit substrate 2 is greater than the distance formed between the third antenna substrate 13 and the circuit substrate 2.

S31: utilize the press mold technology, form the thin layer 4 that thickness is greater than 40 mu m at the upper surface and the lateral wall face of first antenna base plate 11, second antenna base plate 12 and third antenna base plate 13, thin layer 4 extends to circuit substrate 2 upper surface along the lateral wall face of first antenna base plate 11, second antenna base plate 12 and third antenna base plate 13 respectively thin layer 4 respectively with first antenna base plate 11, second antenna base plate 12 and third antenna base plate 13 lower surface with enclose between circuit substrate 2 upper surface and establish airtight cavity 5.

The material of the thin film layer 4 can be an organic polymer film composed of one or more of organic polymer materials such as ABF, epoxy resin and the like, the dielectric constant of the organic polymer film is less than 3.5, and the dielectric loss of the organic polymer film is less than 0.006, so that the loss of signal transmission is reduced.

Specifically, as shown in fig. 9(b), the thin film layer 4, the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2 are surrounded to form a first sealed cavity 51, the thin film layer 4, the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2 are surrounded to form a second sealed cavity 52, and the thin film layer 4, the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2 are surrounded to form a third sealed cavity (not shown in the figure). Of course, the height of the first sealed cavity 51 is greater than that of the second sealed cavity 52, and the height of the second sealed cavity 52 is greater than that of the third sealed cavity.

S41: and flip-chip bonding the radio frequency chip 6 on the lower surface of the circuit substrate 2 by using a flip-chip bonding process.

The invention does not limit the specific manufacturing process of packaging the radio frequency chip 6 on the lower surface of the circuit substrate 2, and the radio frequency chip 6 can be welded on the lower surface of the circuit substrate 2 by the conventional flip chip process. Certainly, the welding position of the radio frequency chip 6 and the circuit substrate 2 is filled with underfill, so that the problem that the welding position of the radio frequency chip 6 and the circuit substrate 2 is broken due to thermal stress or mechanical impact is solved, and the bonding force between the two is enhanced.

S51: a metal solder ball 7 is soldered to the lower surface of the wiring substrate 2, as shown in fig. 9 (c).

In order to realize the transmission of the antenna packaging structure and external signals, a metal solder ball 7 is welded on the lower surface of the circuit substrate 2 and is used for realizing electrical connection with an external circuit.

S61: the upper surface of the plastic-molded thin film layer 4 and the uncovered upper and lower surfaces of the circuit board 2 are shown in fig. 9 (d).

As shown in fig. 10, which is a schematic flow chart of a manufacturing method of an antenna package structure in embodiment 2 of the present invention, different from the manufacturing method of the structure in embodiment 1, before performing a lamination process, the method further includes the steps of:

sa: a plurality of beam bumps 9 in a conical structure are manufactured on the upper surface of the antenna substrate 1, which is correspondingly provided with the input antenna, and the beam bumps 9 extend upwards along the antenna substrate.

The beam bump 9 of the conical structure may be injection molded in a mold having a conical structure. Specifically, as shown in fig. 11(a1), beam bumps 9 having a conical structure are formed at positions corresponding to the input antennas of 28G frequency on the upper surface of the first antenna substrate 11, at positions corresponding to the input antennas of 40G frequency on the upper surface of the second antenna substrate 12, and at positions corresponding to the input antennas of 60G frequency on the upper surface of the third antenna substrate 13, respectively.

In order to facilitate the processing, the included angle between the conical surface and the bottom surface of the beam bump 9 with the conical structure is usually less than 45 degrees, and the lens has a lens function. The beam bump 9 is made of an EMC material with high dielectric constant and low dielectric loss, specifically a composition of aluminum oxide and epoxy resin, the larger the dielectric constant of the material for making the beam bump 9 is, the higher the constraint of the material field is, in order to further enhance the beam capability of the beam bump 9, the specific material for making the beam bump 9 has the performance that the dielectric constant is greater than 4, and the dielectric loss is less than 0.006.

The beam bump 9 is made to form a conical lens, and the included angle between the conical surface and the bottom surface of the same conical structure is smaller than 45 degrees, so that the loss of signal transmission can be reduced while the signal transmitted by the antenna can be focused and transmitted.

It can be understood that, due to process manufacturing errors, the top corners of the beam bumps 9 are difficult to be manufactured into a standard tapered structure, so that the structure in which the top corners of the beam bumps 9 are manufactured into rounded corners is also within the protection scope of the present invention.

In some other embodiments of the present invention, as shown in fig. 11(a2), a base 91 is further formed at the bottom of the beam bump 9, the stability of the beam bump 9 disposed on the surface of the antenna substrate is enhanced, and the base 91 and the beam bump 9 are integrally formed and made of the same material. The specific thickness of the base 91 is not limited herein, and may be designed according to the actual application requirements.

S32: by utilizing a film pressing process, a film layer 4 with the thickness of more than 40 microns is formed on the upper surface of the beam bump 9, the upper surface and the side wall surface of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 which are not covered by the beam bump 9, the film layer 4 extends to the upper surface of the circuit substrate 2 along the side wall surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 respectively, and a closed cavity 5 is formed between the film layer 4 and the lower surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 and between the lower surface of the film layer 4 and the upper surface of the circuit substrate 2 in a surrounding manner.

Similarly, the material of the thin film layer 4 may be an organic polymer film composed of one or more of organic polymer materials such as ABF and epoxy resin, and the dielectric constant of the organic polymer film is less than 3.5, and the dielectric loss of the organic polymer film is less than 0.006, so as to reduce the loss of signal transmission.

A film pressing process is performed on the basis of the structure shown in fig. 11(a1), as shown in fig. 11(b), the thin film layer 4 and the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2 are enclosed to form a first sealed cavity 51, the thin film layer 4 and the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2 are enclosed to form a second sealed cavity 52, and the thin film layer 4 and the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2 are enclosed to form a third sealed cavity (not shown). Of course, the height of the first sealed cavity 51 is greater than that of the second sealed cavity 52, and the height of the second sealed cavity 52 is greater than that of the third sealed cavity.

The steps of the other manufacturing methods are the same as those of the structure manufacturing method in embodiment 1, and are not described herein in detail, and the specific manufacturing process is shown in fig. 11(a1) to 11 (d).

In summary, the thin film layer is formed on the surface of the antenna substrate, and the enclosed cavity is formed between the thin film layer and the lower surface of the antenna substrate as well as between the thin film layer and the upper surface of the circuit substrate, so that the loss of signal transmission caused by the filling of the plastic package material between the circuit substrate and the antenna substrate is reduced, meanwhile, the signal transmission cavity between the circuit substrate and the antenna substrate is prevented from being completely exposed in the air, and the reliability of the antenna packaging structure is improved. In addition, a plurality of beam wave salient points are formed at the positions where the antenna is arranged on the surface of the antenna substrate, so that the signal emission directivity of the antenna substrate is enhanced, and the mutual interference of the emission signals of different antennas is avoided.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims

1. The utility model provides an antenna packaging structure, includes at least one antenna substrate and circuit substrate, the antenna substrate set up in circuit substrate top, be provided with input antenna in the antenna substrate, the antenna substrate with it is fixed through support piece between the circuit substrate, its characterized in that:

2. The antenna package structure of claim 1, wherein the thin film layer is an organic polymer film having a dielectric constant of less than 3.5 and a dielectric loss of less than 0.006.

3. The antenna package structure of claim 2, wherein the thin film layer thickness is greater than 40 μ ι η.

4. The antenna package structure of claim 1, wherein the antenna substrate comprises a first antenna substrate, a second antenna substrate, and a third antenna substrate, wherein an input antenna with a 28G frequency is disposed in the first antenna substrate, an input antenna with a 40G frequency is disposed in the second antenna substrate, and an input antenna with a 60G frequency is disposed in the third antenna substrate.

5. The antenna package structure of claim 4, wherein a spacing between the first antenna substrate and the circuit substrate is greater than a spacing between the second antenna substrate and the circuit substrate, and wherein a spacing between the second antenna substrate and the circuit substrate is greater than a spacing between the third antenna substrate and the circuit substrate.

6. The antenna package structure of claim 1, wherein the supporting element is a solder ball and/or a core ball and/or a curing glue.

7. The antenna package structure of any one of claims 1 to 6, wherein a plurality of beam bumps are formed on the upper surface of the antenna substrate where the input antenna is disposed, the beam bumps protruding upward along the antenna substrate, and the film layer further covers the upper surface of the beam bumps.

8. The antenna package structure of claim 7, wherein the beam bump is a conical structure with a lens function.

9. The antenna package structure of claim 8, wherein an included angle between the tapered surface and the bottom surface of the conical structure is less than 45 degrees.

10. The antenna package structure of claim 9, wherein the beam bump material is a combination of alumina and epoxy, and has a dielectric constant greater than 4 and a dielectric loss less than 0.006.

11. The antenna package structure of claim 7, further comprising at least 1 RF chip and a solder ball disposed on the lower surface of the circuit substrate, wherein the solder ball is electrically connected to an external circuit.

12. The antenna package structure of claim 7, further comprising a plastic package body, wherein the plastic package body completely covers the film layer and the uncovered upper surface of the circuit substrate.

13. A manufacturing method of an antenna packaging structure is characterized by comprising the following steps:

14. The method for manufacturing an antenna package structure according to claim 13, wherein the providing at least one antenna substrate and a circuit substrate includes providing an input antenna in the antenna substrate, and specifically includes:

15. The method for manufacturing an antenna package structure according to claim 14, wherein the forming a supporting element on the upper surface of the circuit substrate and fixing the antenna substrate above the circuit substrate through the supporting element specifically includes:

16. The method for manufacturing an antenna package structure according to claim 15, wherein the forming of the thin film layer on the upper surface and the side wall surface of the antenna substrate, the thin film layer extending to the upper surface of the circuit substrate along the side wall surface of the antenna substrate, and the enclosing of the thin film layer between the lower surface of the antenna substrate and the upper surface of the circuit substrate to form a sealed cavity, specifically comprises:

17. The method for manufacturing the antenna package structure according to claim 16, further comprising, before forming the thin film layers on the upper surface and the side wall surfaces of the antenna substrate on which the input antenna is correspondingly disposed:

18. The method for manufacturing the antenna package structure according to claim 17, wherein the method further comprises the steps of:

19. The method for manufacturing the antenna package structure according to claim 18, further comprising: