CN115036226A - Power semiconductor module packaging structure - Google Patents
Power semiconductor module packaging structure Download PDFInfo
- Publication number
- CN115036226A CN115036226A CN202210958017.2A CN202210958017A CN115036226A CN 115036226 A CN115036226 A CN 115036226A CN 202210958017 A CN202210958017 A CN 202210958017A CN 115036226 A CN115036226 A CN 115036226A
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- power semiconductor
- semiconductor module
- plate
- vacuum
- supporting plate
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 32
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000003825 pressing Methods 0.000 claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 25
- 238000005507 spraying Methods 0.000 claims abstract description 25
- 238000007789 sealing Methods 0.000 claims abstract description 24
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 239000000523 sample Substances 0.000 claims description 23
- 239000003292 glue Substances 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 13
- 239000004593 Epoxy Substances 0.000 claims description 6
- 230000009349 indirect transmission Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 abstract description 16
- 239000011347 resin Substances 0.000 abstract description 16
- 230000008859 change Effects 0.000 abstract description 4
- 239000002245 particle Substances 0.000 abstract description 3
- 238000002347 injection Methods 0.000 abstract description 2
- 239000007924 injection Substances 0.000 abstract description 2
- 238000000889 atomisation Methods 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0036—Flash degasification
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D19/00—Degasification of liquids
- B01D19/0073—Degasification of liquids by a method not covered by groups B01D19/0005 - B01D19/0042
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B15/00—Details of spraying plant or spraying apparatus not otherwise provided for; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B3/00—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements
- B05B3/02—Spraying or sprinkling apparatus with moving outlet elements or moving deflecting elements with rotating elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
- B05B9/0403—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump with pumps for liquids or other fluent material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a power semiconductor module packaging structure, which comprises a shell, wherein the front surface of the shell is provided with a containing cavity, the bottom of the containing cavity is fixedly provided with a supporting plate with a groove for placing a semiconductor, the top of the containing cavity is provided with a pressure sealing mechanism, and the top of the shell is provided with a control board for controlling the pressure sealing mechanism, and the power semiconductor module packaging structure is characterized in that the pressure sealing mechanism comprises a sealing system for sealing the semiconductor in the supporting plate by driving a pressing plate by a telescopic cylinder, a vacuum system for removing bubbles in vacuum by a vacuum pump during packaging and a spraying system for spraying epoxy resin by atomizing nozzles, the vacuum system is vacuumized to form negative pressure so that bubbles in the epoxy resin float and separate out, the epoxy resin is sprayed by the atomizing nozzles to be wetted in advance, the corner positions are covered by fine resin particles, and the change of the edge resin tension brought by small atomized resin during the subsequent resin injection in large quantity plays a guiding role, the covering efficiency of the resin is improved, the generation of bubbles is reduced, and the development prospect is good.
Description
Technical Field
The invention relates to the field of semiconductor packaging, in particular to a power semiconductor module packaging structure.
Background
The semiconductor package is a process of processing a wafer passing a test according to a product model and a functional requirement to obtain an independent chip, and a circuit pin on a silicon wafer is connected to an external joint by a lead so as to be connected with other devices.
In the prior art, epoxy resin is generally used for packaging, but certain air bubbles often exist inside the epoxy resin during pouring of the epoxy resin, so that certain gaps exist in the formed epoxy resin layer, the epoxy resin layer is easy to crack during actual use, to solve the problem of bubbles in the packaging process, there is a transmission type chip packaging apparatus with application No. CN202111161480.6, which is searched for, and presses the epoxy resin layer through the external magnetic field force control module to collapse the bubbles, during actual packaging, the local instantaneous force applied to the molten epoxy resin under the action of the applied magnetic field is suddenly increased, although the internal gap is eliminated, new tiny bubbles are easily generated at the stressed periphery due to instantaneous overlarge stress, so that a certain gap still exists in the epoxy resin layer after packaging.
Therefore, a new type of semiconductor module package structure is needed to solve the above problems.
Disclosure of Invention
The invention aims to provide a power semiconductor module packaging structure.
In order to achieve the purpose, the invention provides the following technical scheme:
the utility model provides a power semiconductor module packaging structure, which comprises an outer shell, the front of shell is provided with the holding chamber, the bottom in holding chamber is fixed with the layer board of placing the semiconductor and taking the recess, the top in holding chamber is provided with seals the pressure mechanism, the top of shell is provided with the control panel that carries out the control of sealing the pressure mechanism, a serial communication port, seal the pressure mechanism and include and drive the pressing plate by the telescoping cylinder and carry out the sealing system that seals to the semiconductor in the layer board to and carry out the vacuum system that the bubble was removed in vacuum by the vacuum pump and carry out the paint finishing of epoxy atomizing spraying through the atomizer during encapsulation.
As a further scheme of the invention: the sealing system comprises a guide cover, a telescopic cylinder, a pressure spring and a pressing plate, the guide cover is fixed at the top of the housing accommodating cavity, the bottom of the guide cover is connected with the pressing plate in a sliding mode, the telescopic cylinder in the vertical direction is arranged on the inner side of the guide cover, the front end of the telescopic cylinder is in indirect transmission connection with the pressing plate through the pressure spring, and the spraying system is arranged at the bottom end of the pressing plate.
As a further scheme of the invention: the encapsulation head includes probe, carousel and atomizer, and the probe is fixed on the mounting bracket, is provided with the carousel of vertical orientation in the probe, and the carousel carries out the angle along the level and rotates, and atomizer eccentric settings is on the carousel down.
As a further scheme of the invention: the spraying system comprises a glue barrel, a mounting frame and a packaging head, wherein the mounting frame is fixed at the front end of the telescopic cylinder, the packaging head corresponding to the supporting plate groove is installed at the bottom of the mounting frame, an atomizing nozzle is arranged at the bottom of the packaging head, the packaging head is communicated with the glue barrel fixed at the top end of the guide cover, and an electric control valve is arranged to control glue discharging of the atomizing nozzle.
As a further scheme of the invention: the encapsulation head includes probe, carousel and atomizer, and the probe is fixed on the mounting bracket, is provided with the carousel of vertical orientation in the probe, and the carousel carries out the angle along the level and rotates, and atomizer eccentric settings is on the carousel down.
As a further scheme of the invention: the guide groove of vertical direction is provided with in the department that corresponds of frame plate and probe, and probe sliding connection is in the guide groove, and the joint is done sealed processing, is provided with vertical rack in the guide groove, and there is the transmission wheelset that stretches out and rack toothing one side of probe, and the output and the carousel transmission of transmission wheelset are connected, realize the drive of carousel.
As a further scheme of the invention: a pressure pump is arranged between the glue barrel and the atomizing nozzle to control the glue pressure.
As a further scheme of the invention: the vacuum system comprises a vacuum pump, the vacuum pump is communicated with an exhaust hole arranged at the bottom of the packaging head through a pipeline, and an electric control valve is connected in series on the pipeline to control the on-off of a pipeline air path.
As a further scheme of the invention: the vacuum system also comprises a vacuum chamber which is connected in series between the vacuum pump and the electric control valve.
Advantageous effects
1. The sealing and pressing mechanism comprises a vacuum system for removing bubbles in vacuum by a vacuum pump and a spraying system for spraying epoxy resin in an atomizing spray head in an atomizing mode, the vacuum system is vacuumized to form negative pressure, so that bubbles in the epoxy resin float and are separated out, the epoxy resin is sprayed by the atomizing spray head to be wetted in advance, fine resin particles are used for covering corner positions, and edge resin tension change caused by small atomized resin is used for guiding when a large amount of resin is injected subsequently, so that the resin covering efficiency is improved, and the bubbles are reduced.
2. The atomizing nozzle is eccentrically arranged on the rotary table downwards, the atomizing nozzle is eccentrically arranged in a rotating manner, the horizontal coverage area of the atomizing nozzle is increased, the spraying uniformity at each position is also improved through movement, the pressure pump is arranged between the glue barrel and the atomizing nozzle to control glue pressure, the discharge pressure of epoxy resin is adjusted through the arrangement of the pressure pump, the atomizing and wetting effects are achieved through applying high pressure at the early stage, the purpose of uniform and slow release is achieved through reducing the pressure at the later stage, the diffusion range is reduced, the flow at the unit area is increased, the paving efficiency of the epoxy resin is ensured, and the possibility that small bubbles are generated due to the fact that a part of the area is not covered in time when the flow is too small is further reduced.
3. The vacuum system also comprises a vacuum chamber, the vacuum chamber is connected in series between the vacuum pump and the electric control valve, the vacuum chamber can be vacuumized in advance through the arrangement of the vacuum chamber, and then the vacuum chamber is connected with the space between the supporting plate and the pressing plate, so that the air pressure is balanced, the reduction of the air pressure between the space between the supporting plate and the pressing plate is accelerated, the precipitation of bubbles is accelerated, and the time of vacuum operation is shortened.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic structural diagram of the pressing mechanism of the present invention.
Fig. 3 is a structural sectional view of the pressing mechanism of the present invention.
FIG. 4 is a schematic diagram of the structure of the platen and the painting system of the present invention.
Fig. 5 is an enlarged view of the structure at a in fig. 4 according to the present invention.
Fig. 6 is a schematic view of the structure of the mounting frame of the present invention.
Fig. 7 is a schematic view of a package structure according to the present invention.
FIG. 8 is a schematic view of the epoxy spraying of the present invention.
In FIGS. 1-8: the device comprises a shell, 2 supporting plates, 3 sealing and pressing mechanisms, 4 rubber barrels, 5 vacuum chambers, 6 vacuum pumps, 7 guide covers, 8 telescopic cylinders, 9 mounting frames, 10 packaging heads, 1001 probes, 1002 rotary discs, 1003 atomizing nozzles, 1004 transmission wheel sets, 1005 exhaust holes, 11 pressing plates, 1101 frame plates, 1102 rubber plates, 1103 racks, 12 pressing springs and 13 control plates.
Detailed Description
The following will clearly and completely describe the specific technical scheme of the invention with reference to fig. 1-8 in the attached drawings of the specification of the invention;
referring to fig. 1-8, fig. 1 is a schematic overall structure diagram of an embodiment of the present invention; FIG. 2 is a schematic view of the sealing mechanism of the present invention; FIG. 3 is a structural cross-sectional view of a sealing mechanism of the present invention; FIG. 4 is a partial schematic view of the platen of the present invention; FIG. 5 is a schematic view of the platen structure of the present invention; FIG. 6 is a schematic diagram of a package structure according to the present invention; FIG. 7 is a schematic view of the epoxy spraying of the present invention.
The power semiconductor module packaging structure provided by the embodiment comprises a shell 1, wherein a containing cavity is formed in the front face of the shell 1, a supporting plate 2 with a groove for placing a semiconductor is fixed at the bottom of the containing cavity, a sealing mechanism 3 is arranged at the top of the containing cavity, and a control board 13 for controlling the sealing mechanism 3 is arranged at the top of the shell 1, and the power semiconductor module packaging structure is characterized in that the sealing mechanism 3 comprises a sealing system for sealing the semiconductor in the supporting plate 2 by driving a pressing plate 11 through a telescopic cylinder 8, a vacuum system for removing bubbles in vacuum through a vacuum pump 6 during packaging, and a spraying system for spraying epoxy resin through an atomizing nozzle 1003;
the vacuum system is vacuumized to form negative pressure, so that bubbles in the epoxy resin float upwards and are separated out, the epoxy resin is wetted in advance by spraying of the atomizing nozzle 1003, fine resin particles are used for covering corner positions, and edge resin tension change caused by the small atomized resin during subsequent resin injection in a large amount plays a guiding role, so that the resin covering efficiency is improved, and the bubbles are reduced.
Wherein, sealing system includes direction lid 7, telescoping cylinder 8, pressure spring 12 and clamp plate 11, direction lid 7 is fixed at the top in 1 holding chamber of shell, bottom sliding connection has clamp plate 11, the inboard of direction lid 7 is provided with the telescoping cylinder 8 of vertical direction, the front end of telescoping cylinder 8 is passed through pressure spring 12 and is connected with the indirect transmission of clamp plate 11, spraying system sets up the bottom at clamp plate 11, borrow by the indirect elastic connection of pressure spring 12, the tightness of pushing down of clamp plate 11 has both been guaranteed, also can prevent the structural deformation that the too big pressure leads to, play the guard action.
Specifically, the pressing plate 11 is composed of a frame plate 1101 and a rubber plate 1102 fixed to the bottom of the frame plate 1101, the frame plate 1101 is connected to the bottom end of the guide cover 7 in an indirect transmission mode with the telescopic cylinder 8 in a sliding mode, the rubber plate 1102 made of soft rubber materials is fixed to the bottom face of the frame plate 1101, a protruding frame structure corresponding to a groove in the surface of the supporting plate is arranged on the bottom face of the rubber plate 1102, the spraying system is arranged on the inner side of the frame structure of the rubber plate 1102, the edge of the groove of the supporting plate is sealed through the rubber plate 1102, and air tightness is improved.
Specifically, the spraying system comprises a glue barrel 4, a mounting frame 9 and an encapsulation head 10, wherein the mounting frame 9 is fixed at the front end of a telescopic cylinder 8, the encapsulation head 10 corresponding to a groove of a supporting plate 2 is installed at the bottom of the mounting frame 9, an atomization nozzle 1003 is arranged at the bottom of the encapsulation head 10, the atomization nozzle 1003 is communicated with the glue barrel 4 fixed at the top end of a guide cover 7, and an electric control valve is arranged to control glue discharging of the atomization nozzle 1003;
through the movable setting of mounting bracket 9 and layer board 2, after atomizer 1003 starts, can bring the change in height, and then improve the homogeneity of spraying.
Further, the packaging head 10 comprises a probe 1001, a turntable 1002 and an atomizing nozzle 1003, the probe 1001 is fixed on the mounting rack 9, the vertically oriented turntable 1002 is arranged in the probe 1001, the turntable 1002 rotates horizontally at an angle, and the atomizing nozzle 1003 faces downwards and is eccentrically arranged on the turntable 1002;
the atomization nozzle 1003 is eccentrically and rotatably arranged, so that the horizontal coverage area of the atomization nozzle 1003 is increased, and the uniformity of spraying at each position is improved through movement.
Furthermore, a vertical guide groove is formed in the corresponding position of the frame plate 1101 and the probe 1001, the probe 1001 is slidably connected in the guide groove, the joint of the probe 1001 and the guide groove is sealed, a vertical rack 1103 is arranged in the guide groove, a protruding transmission wheel set 1004 is arranged on one side of the probe 1001 and meshed with the rack 1103, and the output end of the transmission wheel set 1004 is in transmission connection with the rotary table 1002 to realize the driving of the rotary table 1002;
through the arrangement of the rack 1103 and the transmission wheel set 1004, the rotary table 1002 is driven by the relative movement between the pressing plate 11 and the packaging head 10, so that the number of internal driving components is reduced, and the failure rate is reduced.
Further, a pressure pump is arranged between the glue barrel 4 and the atomizing nozzle 1003 to control glue pressure;
borrow by the setting of force pump, adjust epoxy's discharge pressure, reach the moist effect of atomizing through applying high pressure earlier stage, later stage plays the purpose at the uniform velocity slow release through reducing pressure, reduces the diffusion scope, improves the flow of unit area department, guarantees epoxy's the efficiency of laying cover, and then reduces the possibility that the subregion in time does not cover the production microbubble and is wrapped up when because of the flow undersize.
Further, the vacuum system comprises a vacuum pump 6, the vacuum pump 6 is communicated with an exhaust hole 1005 formed in the bottom of the packaging head through a pipeline, an electric control valve is connected in series on the pipeline to control the on-off of a pipeline air path, and the vacuum pump 6 is communicated with and controlled by the air path in the space between the supporting plate 2 and the pressing plate 11.
Furthermore, the vacuum system also comprises a vacuum chamber 5, the vacuum chamber 5 is connected in series between the vacuum pump 6 and the electric control valve, the vacuum chamber 5 can be vacuumized in advance through the arrangement of the vacuum chamber 5, the vacuum chamber 5 is connected with the space between the supporting plate 2 and the pressing plate 11, the air pressure is balanced, the reduction of the air pressure between the space between the supporting plate 2 and the pressing plate 11 is accelerated, the separation of bubbles is accelerated, and the time of vacuum operation is shortened.
In the implementation of the technical solution described in this embodiment, the semiconductor to be packaged is placed in the recess of the supporting plate 2, the starting device, the vacuum pump 6 is started, the vacuum chamber 5 is pre-vacuumized, the telescopic cylinder 8 is started to drive the pressing plate 11 to move downwards, the groove of the supporting plate 2 is closed, then the atomizing nozzle 1003 is started, a layer of atomized epoxy resin liquid drops are uniformly sprayed on the surface of the semiconductor under the driving of the rotary table 1002, then the pressure is automatically adjusted through a pressure pump, the atomization is stopped, the epoxy resin continuously flows out to gradually cover the surface of the semiconductor, after the resin is coated, and opening a valve between the vacuum chamber 5 and the packaging head 10, communicating the vacuum chamber 5 with the space between the support plate 2 and the pressing plate 11, vacuumizing, separating out bubbles in the epoxy resin under the action of pressure, and then curing the epoxy resin to finish packaging.
Claims (9)
1. A power semiconductor module package structure, comprising:
the device comprises a shell (1) for fixing, supporting and protecting the whole components, wherein the front surface of the shell (1) is provided with an accommodating cavity for packaging;
the supporting plate (2) for placing the semiconductor is fixed at the bottom of the accommodating cavity, and corresponding grooves are formed in the surface of the supporting plate (2);
the top of the accommodating cavity is provided with a sealing mechanism (3), the sealing mechanism (3) comprises a sealing system, a vacuum system and a spraying system, and the top of the shell (1) is provided with a control panel (13) for controlling the sealing mechanism (3);
the sealing system comprises a telescopic cylinder (8) and a pressure plate (11), wherein the telescopic cylinder (8) drives the pressure plate (11) to be matched with the supporting plate (2) to seal the semiconductor in the supporting plate (2);
the vacuum system is used for vacuumizing a space formed by the pressing plate (11) and the supporting plate (2) by a vacuum pump (6) to remove bubbles;
the spraying system is used for spraying epoxy resin in an atomizing way through an atomizing nozzle (1003).
2. The power semiconductor module package structure of claim 1, wherein: the sealing system includes:
the guide cover (7) is fixed at the top of the accommodating cavity of the shell (1) and guides movement;
the bottom of the guide cover (7) is connected with the pressing plate (11) in a sliding mode, the inner side of the guide cover (7) is provided with a telescopic cylinder (8) in the vertical direction, the front end of the telescopic cylinder (8) is connected with the pressing plate (11) in an indirect transmission mode through a pressure spring (12) to drive the pressing plate (11) and seal the top of a groove of the supporting plate (2), and the spraying system is arranged at the bottom end of the pressing plate (11).
3. The power semiconductor module package structure of claim 2, wherein: the platen (11) includes:
the frame plate (1101) is connected to the bottom end of the guide cover (7) in a sliding mode and is indirectly connected with the telescopic cylinder (8) in a transmission mode;
the bottom surface of the frame plate (1101) is fixed with the rubber plate (1102) made of soft rubber, the bottom surface of the rubber plate (1102) is provided with a protruding frame structure corresponding to the groove on the surface of the supporting plate (2), and the spraying system is arranged on the inner side of the frame structure of the rubber plate (1102).
4. The power semiconductor module package structure of claim 2, wherein: the spray coating system includes:
the mounting rack (9) is fixed at the front end of the telescopic cylinder (8), the bottom of the mounting rack (9) is provided with a packaging head (10) corresponding to the groove of the supporting plate (2), and the bottom of the packaging head (10) is provided with an atomizing nozzle (1003) for spraying epoxy resin;
glue bucket (4), set up on the top of direction lid (7), carry out epoxy's storage, be connected through pipeline and atomizer (1003) to be provided with the play of automatically controlled valve control atomizer (1003) and glue.
5. The power semiconductor module package structure of claim 4, wherein: the packaging head (10) comprises a probe (1001), a rotary table (1002) and an atomizing nozzle (1003), the probe (1001) is fixed on a mounting frame (9), the rotary table (1002) with vertical orientation is arranged in the probe (1001), the rotary table (1002) rotates at an angle along the horizontal direction, and the atomizing nozzle (1003) is eccentrically arranged on the rotary table (1002) downwards.
6. The power semiconductor module package structure according to any one of claims 3 or 5, wherein: the guide groove in the vertical direction is formed in the corresponding position of the frame plate (1101) and the probe (1001), the probe (1001) is connected in the guide groove in a sliding mode, the joint position is sealed, a vertical rack (1103) is arranged in the guide groove, a protruding transmission wheel set (1004) is meshed with the rack (1103) on one side of the probe (1001), the output end of the transmission wheel set (1004) is in transmission connection with the rotary table (1002), and driving of the rotary table (1002) is achieved.
7. The power semiconductor module package structure of claim 4, wherein: and a pressure pump is arranged between the glue barrel (4) and the atomizing nozzle (1003) to control glue pressure.
8. The power semiconductor module package structure of claim 4, wherein: the vacuum system comprises a vacuum pump (6), the vacuum pump (6) is communicated with an exhaust hole (1005) formed in the bottom of the packaging head (10) through a pipeline, and an electric control valve is connected to the pipeline in series to control the on-off of a pipeline air passage.
9. The power semiconductor module package structure of claim 8, wherein: the vacuum system further comprises:
the vacuum chamber (5) and the large-volume hollow chamber are connected in series between the vacuum pump (6) and the electric control valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210958017.2A CN115036226B (en) | 2022-08-11 | 2022-08-11 | Power semiconductor module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210958017.2A CN115036226B (en) | 2022-08-11 | 2022-08-11 | Power semiconductor module packaging structure |
Publications (2)
| Publication Number | Publication Date |
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| CN115036226A true CN115036226A (en) | 2022-09-09 |
| CN115036226B CN115036226B (en) | 2022-11-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210958017.2A Active CN115036226B (en) | 2022-08-11 | 2022-08-11 | Power semiconductor module packaging structure |
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| Country | Link |
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| CN (1) | CN115036226B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4439386A (en) * | 1980-10-22 | 1984-03-27 | Thaddeus Antczak | Vacuum injection molding process |
| JPS59156725A (en) * | 1983-02-25 | 1984-09-06 | Yamashiro Seiki Seisakusho:Kk | Nozzle device of injection molding machine |
| JP4353248B2 (en) * | 1994-06-22 | 2009-10-28 | セイコーエプソン株式会社 | Electronic components |
| CN112295789A (en) * | 2020-10-23 | 2021-02-02 | 南京云海轻金属精密制造有限公司 | Spraying device with adjustable atomization degree |
| CN112427163A (en) * | 2020-10-06 | 2021-03-02 | 湖北超卓航空科技股份有限公司 | High-efficient hot spraying device |
| CN212943625U (en) * | 2020-07-07 | 2021-04-13 | 鸡泽县翼鑫塑料制品有限公司 | Precise injection molding piece spraying equipment |
-
2022
- 2022-08-11 CN CN202210958017.2A patent/CN115036226B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4439386A (en) * | 1980-10-22 | 1984-03-27 | Thaddeus Antczak | Vacuum injection molding process |
| JPS59156725A (en) * | 1983-02-25 | 1984-09-06 | Yamashiro Seiki Seisakusho:Kk | Nozzle device of injection molding machine |
| JP4353248B2 (en) * | 1994-06-22 | 2009-10-28 | セイコーエプソン株式会社 | Electronic components |
| CN212943625U (en) * | 2020-07-07 | 2021-04-13 | 鸡泽县翼鑫塑料制品有限公司 | Precise injection molding piece spraying equipment |
| CN112427163A (en) * | 2020-10-06 | 2021-03-02 | 湖北超卓航空科技股份有限公司 | High-efficient hot spraying device |
| CN112295789A (en) * | 2020-10-23 | 2021-02-02 | 南京云海轻金属精密制造有限公司 | Spraying device with adjustable atomization degree |
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| Publication number | Publication date |
|---|---|
| CN115036226B (en) | 2022-11-08 |
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