CN115026412A - Laser processing device and method for brittle product - Google Patents
Laser processing device and method for brittle product Download PDFInfo
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- CN115026412A CN115026412A CN202110214411.0A CN202110214411A CN115026412A CN 115026412 A CN115026412 A CN 115026412A CN 202110214411 A CN202110214411 A CN 202110214411A CN 115026412 A CN115026412 A CN 115026412A
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- 238000012545 processing Methods 0.000 title claims abstract description 141
- 238000000034 method Methods 0.000 title abstract description 11
- 238000007493 shaping process Methods 0.000 claims abstract description 41
- 238000003754 machining Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000033001 locomotion Effects 0.000 claims description 18
- 238000003672 processing method Methods 0.000 claims description 12
- 238000005260 corrosion Methods 0.000 claims description 11
- 230000007797 corrosion Effects 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000011521 glass Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
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- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Optics & Photonics (AREA)
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- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
The invention belongs to the technical field of laser processing, and relates to a laser processing device and a method for a brittle product, wherein the laser processing device comprises: the laser, the beam shaping component and the focusing element; the laser is used for emitting laser beams; the beam shaping component is arranged on an emergent light path of the laser and is used for shaping and modulating a laser beam emitted by the laser to obtain a modulated beam; the focusing element is arranged above a brittle product to be processed and used for focusing the modulated light beam to obtain a processing light beam with a plurality of focuses, wherein the focuses of the processing light beam are at preset distances in the horizontal distance and the vertical distance. This application can improve yields and machining efficiency when processing brittle material.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser processing device and method for a brittle product.
Background
With the rapid development of the electronic market, the demand of the electronic display screen is higher and higher. The outer screen of a common electronic display screen is glass, and before formal use, the glass needs to be chamfered so that sharp edges and fixed points become smooth. In the prior art, a traditional mechanical grinding processing method and a laser processing method are generally adopted, and the processing yield of the traditional mechanical grinding processing method is low for thinner and thinner glass; the existing laser processing method needs to cut repeatedly to chamfer the glass, and the efficiency is not high. Therefore, how to improve the efficiency and yield of chamfering or other cutting of brittle products such as glass becomes a problem to be solved urgently.
Disclosure of Invention
The embodiment of the invention aims to solve the technical problems of low processing yield and low processing efficiency when processing brittle products.
In order to solve the above technical problem, an embodiment of the present invention provides a laser processing apparatus for a brittle product, which adopts the following technical solutions:
the laser processing apparatus includes: the laser, the beam shaping component and the focusing element;
the laser is used for emitting laser beams;
the beam shaping component is arranged on an emergent light path of the laser and is used for shaping and modulating a laser beam emitted by the laser to obtain a modulated beam;
the focusing element is arranged above a brittle product to be processed and used for focusing the modulated light beam to obtain a processing light beam with a plurality of focuses, wherein the focuses of the processing light beam are at preset distances in the horizontal distance and the vertical distance.
Further, the beam shaping assembly comprises: the beam expanding and collimating element and the beam modulating element;
the beam expanding and collimating element is arranged on an emergent light path of the laser and is used for expanding and collimating laser beams of the laser;
the beam modulation element and the beam modulation element are coaxially arranged, and are used for modulating the laser beam after beam expanding and collimating to obtain a modulated beam with preset phase distribution.
Further, the beam expanding and collimating element comprises at least two lenses arranged in parallel.
Furthermore, a reflecting element is arranged between the beam shaping component and the focusing element and used for reflecting the modulated light beam.
Further, the focusing unit is a high power objective lens, the numerical aperture value of the high power objective lens is between 0.4 and 0.8, and the magnification is greater than or equal to 20 times.
Further, the laser processing device also comprises an object stage for placing the brittle product, and the object stage is arranged right below the focusing element.
Furthermore, the laser processing device also comprises a movement assembly, and the movement assembly is connected with the objective table to control the movement of the objective table.
Furthermore, the laser processing device further comprises a grabbing component, wherein the grabbing component is arranged on the adjacent side of the objective table to grab the brittle products before or after processing.
In order to solve the above technical problem, an embodiment of the present invention further provides a laser processing method using the above laser processing apparatus, where the method includes:
the laser device emits laser beams, the laser beams are shaped and modulated by the beam shaping assembly to obtain modulated beams, the modulated beams are focused by the focusing element to obtain processing beams with a plurality of focuses, and the horizontal distance and the vertical distance between the focuses of the processing beams are preset distances;
controlling the processing light beam to project onto a brittle product to be processed according to a preset processing path for scanning so as to enable the brittle product to be processed to form a modifying region along the processing path;
and putting the scanned product into a preset corrosive solution for corrosion treatment, so that the material to be removed falls off from the product along the processing path.
Further, before the laser emits a laser beam, the laser beam is processed by a laser processing optical path, the method further includes:
receiving processing morphology parameters and product parameters corresponding to the product, wherein the product parameters comprise product refractive index and thickness;
calculating the horizontal distance and the vertical distance between the focuses when the processing light beam is transmitted in the air according to the processing morphology parameters, the refractive index and the thickness;
adjusting a beam modulating element in the beam shaping component based on the horizontal distance and the vertical distance.
According to the laser processing device and method for the brittle product provided by the embodiment of the application, compared with the prior art, the laser processing device and method at least have the following beneficial effects:
the laser processing apparatus includes: the laser device comprises a laser device, a beam shaping component and a focusing element, wherein the laser device is used for emitting laser beams, the beam shaping component is arranged on an emergent light path of the laser device and is used for shaping and modulating the laser beams emitted by the laser device to obtain modulated beams, and the modulated beams are beams with preset phase distribution; the modulated light beam is focused by the focusing element to obtain a plurality of focus processing light beams, wherein each focus of the processing light beams is in a preset distance on the horizontal distance and the vertical distance, so that the processing light beams are in a preset shape to meet the cutting requirement; the machining light beam can be used for cutting and forming at one time, so that repeated reciprocating cutting is avoided, and the cutting efficiency is improved; and the laser is used for cutting, so that the yield is improved.
Drawings
In order to illustrate the solution of the invention more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are some embodiments of the invention, and that other drawings may be derived from these drawings by a person skilled in the art without inventive effort. Wherein:
FIG. 1 is a schematic structural diagram of a laser processing apparatus for brittle products according to an embodiment of the present invention;
FIG. 2 is a schematic view of another embodiment of a laser machining apparatus for brittle products according to the present invention;
FIG. 3 is a schematic view of another embodiment of a laser machining apparatus for brittle products according to the present invention;
FIG. 4 is a graph of a focus distribution of various focuses within a brittle product according to an embodiment of the present invention;
FIG. 5 is a phase distribution diagram of a modulated light beam according to an embodiment of the present invention;
FIG. 6 is a diagram illustrating the final effect of a brittle product according to an embodiment of the present invention;
FIG. 7 is a graph of the final effect of a brittle product according to another embodiment of the present invention;
fig. 8 is a schematic flow chart of a laser processing method according to an embodiment of the present application.
The reference numbers in the drawings are as follows:
1. a laser; 2. a beam shaping component; 21. a beam expanding and collimating element; 22. a light beam modulation element; 3. a focusing element; 4. a reflective element; 5. an object stage.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, e.g., the terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., refer to an orientation or position based on that shown in the drawings, are for convenience of description only and are not to be construed as limiting of the present disclosure.
The terms "including" and "having," and any variations thereof in the description and claims of this invention and the description of the figures above, are intended to cover non-exclusive inclusions; the terms "first," "second," and the like in the description and in the claims, or in the drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential order.
In the description and claims of the present invention and in the description of the above figures, when an element is referred to as being "fixed" or "mounted" or "disposed" or "connected" to another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
Furthermore, reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In order to make the technical solutions better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
It should be noted that the laser processing device is used for chamfering or performing other cutting on the brittle product, and finally cutting the brittle product into a preset shape.
The embodiment of the invention provides a laser processing device for a brittle product, which comprises a laser 1, a beam shaping component 2 and a focusing element 3, wherein the laser 1 is arranged on the laser processing device;
the laser 1 is used for emitting laser beams;
the beam shaping component 2 is arranged on an emergent light path of the laser 1 and is used for shaping and modulating a laser beam emitted by the laser 1 to obtain a modulated beam;
the focusing element 3 is arranged above the brittle product to be processed and used for focusing the modulated light beam to obtain a processing light beam with a plurality of focuses, wherein the focuses of the processing light beam are at preset distances in the horizontal distance and the vertical distance.
It can be understood that the working principle of the laser processing device is roughly as follows: a laser beam emitted by a laser 1 sequentially passes through a beam shaping assembly 2 and a focusing element 3 to generate a processing beam with a plurality of focuses, as shown in fig. 4, in an embodiment, each focus of the processing beam has a preset distance in a horizontal distance and a vertical distance, and by adopting the processing beam, the plurality of focuses can be in a preset shape in a brittle product, and compared with the existing laser focuses which are only vertically arranged in the brittle product, a specific shape is processed, for example, chamfering is performed on the brittle product, and the processing can be performed by performing scanning for a plurality of times by using the beam; the processing light beam can directly arrange the focus in the brittle product and form an angle required by chamfering, and can be obtained by realizing 1-time scanning; when the machining beam is irradiated into the brittle product, the brittle product forms a cavity at the focal position.
The laser beam emitted by the laser 1 is a laser beam with Gaussian distribution, namely a Gaussian beam, the amplitude of the cross section of the Gaussian beam meets a Gaussian function, and the phase peak-valley difference value is 0; the use of a gaussian beam facilitates shaping modulation by the beam shaping assembly 2 and results in a better modulated beam.
Compared with the prior art, the laser processing device at least has the following beneficial effects: the laser processing apparatus includes: the laser device comprises a laser device 1, a beam shaping component 2 and a focusing element 3, wherein the laser device 1 is used for emitting laser beams, and the beam shaping component 2 is arranged on an emergent light path of the laser device 1 and is used for shaping and modulating the laser beams emitted by the laser device 1 to obtain modulated beams, and the modulated beams are beams with preset phase distribution; the modulated light beam is focused by the focusing element 3 to obtain a plurality of focus processing light beams, wherein each focus of the processing light beams is in a preset distance on the horizontal distance and the vertical distance, so that the processing light beams are in a preset shape to meet the cutting requirement; the processing light beam can be used for cutting and forming at one time, so that repeated reciprocating cutting is avoided, and the cutting efficiency is improved; and the laser is used for cutting, so that the yield is improved.
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.
As shown in fig. 1, in some embodiments of the present invention, the laser 1 is an ultrashort pulse laser, the wavelength of the laser beam emitted by the ultrashort pulse laser is 300nm to 1100nm, the pulse width is 300fs to 50000fs, the repetition frequency is 10KH to 200KH, the single pulse energy is 10uJ to 1000uJ, and the power of the ultrashort pulse laser is 1W to 100W.
As shown in fig. 2, in some embodiments of the invention, the beam shaping assembly 2 comprises: a beam expanding and collimating element 21 and a beam modulating element 22;
the beam expanding and collimating element 21 is arranged on an emergent light path of the laser 1 and is used for expanding and collimating laser beams of the laser 1;
the beam modulation element 22 and the beam expanding and collimating element 21 are coaxially arranged, and modulate the laser beam after beam expanding and collimating to obtain a modulated beam with preset phase distribution.
Specifically, the laser beam firstly enters the beam expanding collimation element 21 for beam expanding collimation after being emitted from the laser 1, the amplitude of the laser beam after beam expanding collimation on the cross section also meets the gaussian function, the phase peak-valley difference is 0, and compared with the laser beam after beam expanding collimation, the light spot size is increased.
The laser beam after beam expansion and collimation enters the beam modulation element 22 to be modulated, so as to obtain a modulated beam with preset phase distribution, in this embodiment, as shown in fig. 5, the preset phase distribution is that a plurality of arc-shaped strip-shaped areas are provided, the phase of each area is zigzag, the curvature centers of the arc-shaped strips are on the same straight line, and the width of the arc-shaped strip increases with the decrease of the curvature radius; from the phase distribution shown in fig. 5, an effect diagram in which a plurality of focal points are located inside the processing member as shown in fig. 4 can be obtained, and the respective focal points are spaced apart from each other by a first distance in the horizontal direction and a second distance in the vertical direction, so that the transparent brittle product can be cut at a predetermined angle. The distance between each adjacent focus perpendicular to the light propagation direction is a first distance, the distance between each adjacent focus perpendicular to the light propagation direction is a second distance, the position relationship of the plurality of focus when propagating in the air corresponds to the preset phase distribution, and further, the distance perpendicular to the light propagation direction is relatively parallel to the straight line where the curvature centers of the plurality of arc-shaped bands in fig. 5 are located, and the relative parallel means that the reflection law is satisfied in an actual processing system.
Still further, the beam modulation element 22 includes, but is not limited to, the diffractive optical element and the spatial light modulator element, any element that can make the laser beam reach the above-mentioned predetermined phase distribution can be the beam modulation element 22, and in a preferred embodiment, the beam modulation element 22 is a diffractive optical element.
The laser beam is shaped and modulated by arranging the beam expanding and collimating element 21 and the beam modulating element 22, so that a modulated beam with preset phase distribution is obtained, and a subsequently obtained processing beam has a plurality of focuses.
In some embodiments of the present invention, the beam expanding and collimating element 21 comprises at least two lenses arranged in parallel;
the beam expanding collimation of the laser beam is carried out by arranging at least two lenses, so that the structure is simple, and a better effect is realized.
In some embodiments of the present invention, as shown in fig. 3, a reflective element 4 is further disposed between the beam shaping component 2 and the focusing element 3 for reflecting the modulated light beam;
specifically, by arranging the reflecting element 4 between the beam shaping assembly 2 and the focusing element 3, the volume of the whole laser processing device can be reduced, and the overlong length along the axial direction is avoided; the reflecting element 4 is an optical element having at least one reflecting surface, and totally reflects the modulated light beam obtained by the processing of the light beam shaping component 2 onto the focusing element 3.
By arranging the reflecting element 4 between the beam shaping assembly 2 and the focusing element 3, the effect of reducing the whole laser processing device is achieved.
In some embodiments of the present invention, the focusing unit is a high power objective lens having a numerical aperture value between 0.4 and 0.8 and a magnification equal to or greater than 20.
Specifically, the numerical aperture is the product of the refractive index of the medium between the objective lens and the object and the sine of half of the aperture angle, the numerical aperture value is increased, the higher the magnification, the higher the system resolution, and the smaller the field width and the working distance.
Therefore, when the focusing unit adopts a high-power objective lens with the numerical aperture value of 0.4-0.8 and the magnification of more than or equal to 20 times, the focusing effect is better.
In some embodiments of the invention, as shown in fig. 3, the laser processing apparatus further comprises a stage 5 for placing the brittle product, wherein the stage 5 is placed directly below the focusing element 3.
The object stage 5 is arranged to place the transparent fragile product so as to bear and fix the transparent fragile product and prevent the transparent fragile product from sliding randomly during processing.
In some embodiments of the present invention, the laser processing apparatus further comprises a motion assembly, which is connected to the stage 5 to control the movement of the stage 5.
Specifically, the laser processing device still includes control assembly and motion subassembly, drives objective table 5 through control assembly control motion subassembly and removes to drive fragile product and remove, the removal includes removal modes such as translation and rotation, through making fragile product with predetermined angular velocity or translation speed, makes fragile product remove for the machining beam, so that the machining beam scans along predetermineeing the route, finally forms the processing orbit along predetermineeing the processing route on fragile product, specifically for form the multiple point that has the predetermined interval on predetermineeing the route, formed the modification region promptly.
The control module controls the object stage 5, namely, the brittle product is controlled to rotate at a preset angular velocity or move at a preset speed, and a plurality of points with preset intervals can be obtained on the brittle product by combining the frequency of the processing light beam.
The control component controls the movement of the movement component so that the processing light beam can move along a preset processing path to scan the brittle product.
Furthermore, the motion assembly can be a galvanometer beam control system or a moving platform, or a combination of the galvanometer beam control system and the moving platform, and the galvanometer beam control system is an accurate control system and can realize accurate movement of the brittle product along a preset processing path.
The movement assembly is connected with the objective table 5, so that the movement of the brittle product is finally realized, the processing light beam is used for processing the brittle product along a preset path, and the effect of accurate control is realized.
In some embodiments of the present invention, the laser processing apparatus further comprises a gripping assembly disposed adjacent to the stage 5 for gripping the brittle product before or after processing.
Specifically, the gripping device comprises a mechanical arm, the gripping device is used for feeding and discharging the brittle products, and the control assembly is used for controlling the gripping assembly to feed and discharge the brittle products.
This application is through will snatching the subassembly setting and being in 5 adjacent sides of objective table realize the last unloading to the fragile product.
Referring to FIG. 3, a glass substrate with a thickness of 200 μm is processed by taking the preferred embodiment of the present application as an example to illustrate the whole process flow;
in this embodiment, the wavelength of the laser beam emitted by the laser 1 is 1030 nm, the single pulse energy is 200 μ J, the repetition frequency is 50kHZ, and the pulse width is 6 ps; the laser beam passes through the beam expanding and collimating element 21, the beam modulating element 22, the reflecting element 4 and the focusing element 3 to obtain a processing beam, and the processing beam can penetrate through a glass substrate with the thickness of 200 microns.
The control assembly controls the grabbing assembly to grab the glass substrate onto the objective table 5.
The processing light beam is distributed with 40 focusing light spots in the glass substrate, the size of each light spot is 5 microns, the distance between adjacent light spots in the first direction is 6 microns, and the distance along the second direction is 8 microns; the control component controls the motion component to move along a preset path, the processing light beam scans along the preset path in a dotting mode at a 6-micrometer point interval, and a modification region is formed in the scanned preset path region;
the control component controls the grabbing component to grab the scanned glass substrate into the corrosion tank; the corrosion tank is filled with a corrosive solution, and the corrosive solution comprises hydrofluoric acid and nitric acid.
As shown in fig. 6, since the area scanned by the processing beam can be corroded by the corrosion solution faster than the area not scanned by the processing beam, the scanned glass substrate is placed in the corrosion tank, and the glass substrate is taken out by the grabbing assembly after a preset time, and the material to be removed automatically falls off from the glass substrate; in this embodiment, the preset time is greater than 3 hours.
The laser 1, the beam expanding and collimating element 21, the beam modulating element 22, the reflecting element 4, the focusing element 3, the objective table 5, the moving assembly, the control assembly and the grabbing assembly are all arranged on the base and fixed.
Through adopting ultrashort pulse laser instrument transmission laser beam, expand beam collimation component 21 and beam modulation component 22 and carry out the plastic modulation to laser beam, obtain the modulation light beam that has preset phase distribution, reflect through reflecting element 4 again to the reflection focuses on focusing element 3, obtain the processing light beam, the processing light beam has a plurality of focuses, just be the distance of predetermineeing on horizontal distance and vertical distance between each focus, a plurality of focuses run through the glass substrate, through the cooperation of control assembly, motion subassembly and objective table 5, make the processing light beam along predetermineeing the processing route and process glass substrate, when processing this kind of thickness thinner brittle product, can improve processing yields and machining efficiency.
In other embodiments of the present application, as shown in fig. 7, different focal point profiles may be achieved by adjusting the beam modulating element 22 to change the phase profile of the modulated beam, thereby resulting in different cutting surfaces for more complex profile machining, i.e. double-sided chamfer and circular arc profile machining as in fig. 7.
In order to solve the above technical problem, the present application further provides a laser processing method using the above laser processing apparatus, and fig. 8 is a schematic flow chart of the laser processing method according to an embodiment of the present application.
In the present embodiment, a laser processing method will be described with reference to fig. 3, the laser processing method including:
s1, emitting a laser beam by a laser 1, shaping and modulating the laser beam by a beam shaping component 2 to obtain a modulated beam, and focusing the modulated beam by a focusing element 3 to obtain a processing beam with a plurality of focuses, wherein the focuses of the processing beam are at preset distances in the horizontal distance and the vertical distance;
specifically, the control assembly controls the grabbing assembly to grab the fragile product onto the objective table; the beam shaping assembly 2 comprises a beam expanding and collimating element 21 and a beam modulating element 22, a laser beam is firstly subjected to beam expanding and collimating by the beam expanding and collimating element 21, a laser processing beam subjected to beam expanding and collimating is then modulated by the beam modulating element 22 to obtain a modulated beam with preset phase distribution, the modulated beam is then focused by the focusing element 3 to obtain a processing beam with a plurality of focuses, the position relation of the plurality of focuses during propagation in the air corresponds to the preset phase distribution, and the preset distances are formed between the focuses of the processing beam in the horizontal distance and the vertical distance; and the machining beam penetrates through the brittle product;
as shown in fig. 5, the preset phase is distributed into a plurality of arc-shaped belt-shaped regions, the phase of each region is zigzag, the curvature centers of the arc-shaped belts are on the same straight line, and the width of the arc-shaped belt is increased along with the decrease of the curvature radius.
Further, before the modulated light beam enters the focusing element 3, the modulated light beam is reflected by the reflecting element 4 and reflected to the focusing element 3, and the volume of the laser processing device can be reduced through the reflection of the reflecting element 4, so that the overlong length of the laser processing device along the axial direction is avoided.
S2, controlling the processing light beam to project onto the brittle product to be processed according to a preset processing path for scanning so as to enable the brittle product to be processed to form a modifying region along the processing path;
specifically, the brittle product is placed on an object stage 5, the object stage 5 is connected to the motion assembly, and the object stage 5 is controlled by a control assembly to move in a rotating or translating manner and the like; the processing light beam has a certain frequency, and is matched with the processing light beam through the moving assembly, so that the processing light beam is projected to the brittle product to be processed according to the preset processing path for scanning, and after scanning, a plurality of points at preset intervals are arranged on the preset processing path of the brittle product, namely the modification region.
And S3, putting the scanned product into a preset corrosive solution for corrosion treatment, so that the material to be removed falls off from the product along the processing path.
Specifically, the control component also controls the grabbing component to carry out loading and unloading on the brittle products, after scanning is finished, the control component controls the grabbing component to grab the scanned brittle products into a corrosion tank, corrosive solution is filled in the corrosion tank, after the scanned brittle products are placed in the corrosive solution, the corrosion speed of the scanned area on the brittle products is higher than that of the scanned area;
the corrosive solution comprises hydrofluoric acid and nitric acid;
and after the scanned brittle product is placed in a corrosive solution for a preset time, the control assembly controls the grabbing assembly to take out the brittle product, and at the moment, the material to be removed is separated from the product along the processing path. Therefore, the cutting and separating treatment of the brittle product is completed, and the preset time is more than 3 hours in the embodiment of the application.
The laser beam is emitted by a laser 1, the laser beam is processed by a beam shaping component 2 and a focusing element 3 to obtain a processing beam with a plurality of focuses, the focuses are at preset distances in horizontal distance and vertical distance, the processing beam is scanned in a brittle product according to a preset processing path through the cooperation of a control component, a moving component and an objective table 5, and a modification region is formed in the scanned region; and then through the cooperation of the control assembly, the moving assembly and the objective table 5, the scanned brittle product is placed in a corrosive solution for corrosion treatment, so that the material to be removed is separated along a preset processing path, and the yield and the processing efficiency of the brittle product can be improved when the outline of the brittle product is processed.
Further, before the laser 1 emits a laser beam, the laser beam is processed by a laser processing optical path, the method further includes:
receiving processing morphology parameters and product parameters corresponding to the product, wherein the processing morphology parameters comprise chamfering angles and chamfering widths, and the product parameters comprise product refractive indexes and thicknesses;
calculating the horizontal distance and the vertical distance between the focuses when the processing light beam propagates in the air according to the angle value, the refractive index and the thickness;
the beam modulating element 22 in the beam shaping component 2 is adjusted based on the horizontal and vertical distances.
Specifically, processing morphology parameters and brittle product parameters input by a user are received, the processing morphology parameters comprise chamfering angles and chamfering widths, the product parameters comprise product refractive indexes and thicknesses, and the horizontal distance and the vertical distance between focuses of the processing light beams during propagation in the air are calculated according to the chamfering angles, the chamfering widths, the refractive indexes and the thicknesses;
furthermore, as the number of the focuses is fixed and uniformly distributed, the horizontal distance and the vertical distance between the focuses in the brittle product can be obtained after the thickness of the brittle product and the angle value to be processed are known; the horizontal distance is the separation distance in the vertical light propagation direction, and the vertical distance is the separation distance in the light propagation direction.
Because the refractive indexes of air and the brittle product are different, when laser enters the brittle product from the air, refraction occurs, and the focal point of the laser in the air is deeper than that of the laser in the material by combining the transmission distance in the air multiplied by the refractive index of the material; therefore, when the vertical distance of the laser focus in the air is 8 microns, the corresponding vertical distance of the laser inside the material needs to be divided by the corresponding refractive index. The beam modulation element 22 in the beam shaping component 2 is adjusted according to the horizontal distance and the vertical distance, so that the laser beam passes through the beam modulation element 22 again to obtain a phase distribution corresponding to the horizontal distance and the vertical distance when the focal point is in the air.
The light beam modulation element 22 is regulated and controlled by receiving and processing the refractive index, the thickness and the angle value to be processed of the product to be processed, and a plurality of focuses are distributed in the brittle product to be processed according to the angle value to be processed.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that modifications can be made to the embodiments described in the foregoing detailed description, or equivalents can be substituted for some of the features described therein. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.
Claims (10)
1. A laser machining apparatus for brittle products, characterized in that the laser machining apparatus comprises: the laser, the beam shaping component and the focusing element;
the laser is used for emitting laser beams;
the beam shaping component is arranged on an emergent light path of the laser and is used for shaping and modulating a laser beam emitted by the laser to obtain a modulated beam;
the focusing element is arranged above a brittle product to be processed and used for focusing the modulated light beam to obtain a processing light beam with a plurality of focuses, wherein the focuses of the processing light beam are at preset distances in the horizontal distance and the vertical distance.
2. The laser processing apparatus of claim 1, wherein the beam shaping assembly comprises: the beam expanding and collimating element and the beam modulating element;
the beam expanding and collimating element is arranged on an emergent light path of the laser and is used for expanding and collimating laser beams of the laser;
the beam modulation element and the beam modulation element are coaxially arranged, and are used for modulating the laser beam after beam expanding and collimating to obtain a modulated beam with preset phase distribution.
3. The laser processing apparatus of claim 2, wherein the beam expanding and collimating element comprises at least two lenses arranged in parallel.
4. The laser processing apparatus of claim 2, wherein a reflecting element is further disposed between the beam shaping assembly and the focusing element for reflecting the modulated beam.
5. The laser processing apparatus of claim 1, wherein the focusing unit is a high power objective lens having a numerical aperture value between 0.4 and 0.8 and a magnification equal to or greater than 20.
6. The laser processing apparatus of claim 2, further comprising a stage on which the brittle product is placed, the stage being positioned directly below the focusing element.
7. The laser processing apparatus of claim 6, further comprising a motion assembly coupled to the stage to control stage movement.
8. The laser processing apparatus according to claim 6, further comprising a grasping assembly disposed adjacent to the stage for grasping the brittle product before or after processing.
9. A laser processing method using the laser processing apparatus according to any one of claims 1 to 8, characterized by comprising:
the laser device emits laser beams, the laser beams are shaped and modulated by the beam shaping assembly to obtain modulated beams, the modulated beams are focused by the focusing element to obtain processing beams with a plurality of focuses, and the horizontal distance and the vertical distance between the focuses of the processing beams are preset distances;
controlling the processing light beam to project onto a brittle product to be processed according to a preset processing path for scanning so as to enable the brittle product to be processed to form a modifying region along the processing path;
and putting the scanned product into a preset corrosive solution for corrosion treatment, so that the material to be removed falls off from the product along the processing path.
10. The laser processing method of claim 9, wherein before the laser emits the laser beam, the laser beam is processed by the laser processing optical path, further comprising:
receiving processing morphology parameters and product parameters corresponding to the product, wherein the product parameters comprise product refractive index and thickness;
calculating the horizontal distance and the vertical distance between the focuses when the processing light beam is transmitted in the air according to the processing morphology parameters, the refractive index and the thickness;
adjusting a beam modulating element in the beam shaping component based on the horizontal distance and the vertical distance.
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