CN115023858A - Rfid标签 - Google Patents
Rfid标签 Download PDFInfo
- Publication number
- CN115023858A CN115023858A CN202080077912.2A CN202080077912A CN115023858A CN 115023858 A CN115023858 A CN 115023858A CN 202080077912 A CN202080077912 A CN 202080077912A CN 115023858 A CN115023858 A CN 115023858A
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- Prior art keywords
- rfid
- rfid tag
- antenna
- substrate
- tag
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
- G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Abstract
本发明涉及包括RFID标牌(V7)的RFID标签(1),该标牌包括RFID天线(5)和IC(6),该IC附接至天线上,使得天线和IC形成RFID标牌。本发明的标签还包括:具有第一表面(3)和第二表面(4)的长形基底(2),其中,第一表面被硅化,并且第二表面承载RFID标牌(7);以及被布置在基底的第二表面上并且在RFID标牌上方的粘性粘合层(8)。
Description
技术领域
本发明涉及包括RFID标牌(RFID tag)的RFID标签(RFID label),该标牌包括RFID天线和IC,该IC附接至天线上,使得天线和IC形成RFID标牌。
在下文中,将频繁使用RFID(射频识别)标牌的表述。RFID标牌是旨在附接至射频识别系统中待识别的对象上的标牌。
RFID标牌包括RFID天线和RFID IC(集成电路或微芯片),该IC电连接至天线上。
RFID标签在本上下文中是携载RFID标牌的标签。标签旨在通过标签的粘合层附接至不同种类的物体上。
现有技术-问题
图A公开了RFID标签的常规三层结构。RFID标签结构包括具有天线(A2)和IC(A3)的基底(A1)。结构还包括具有覆盖天线和IC的粘合剂的面纸层(A4)、粘合剂(A5)和硅化剥离层(A6),当将RFID标签附接至物体上时,该硅化剥离层被去除。
图B公开了RFID标签的常规双层结构。结构包括具有天线(A2)和IC(A3)的基底(A1)。结构还包括粘合剂(A5)、硅化剥离层(A6),当将RFID标签附接至物体上时,该硅化剥离层被去除。
上述现有技术的缺点在于,它们都需要若干层和/或剥离层以附接标签,这进而是昂贵的而且不是环境友好的。
发明目的
本发明的目的是提供更环境友好的RFID标签,其与现有技术相比,更成本有效,并且进而解决了上述问题。
发明内容
根据本发明,RFID标签的特征在于,RFID标签还包括:
-具有第一表面和第二表面的长形基底,其中,第一表面被硅化,并且第二表面承载RFID标牌,以及
-被布置在基底的第二表面上和RFID标牌上方的粘性粘合层。
本发明的附图和具体实施方式
图A和图B公开了具有两个和三个标签结构的传统RFID标签的现有技术,参见上文“现有技术-问题”。
图1公开了根据本发明的RFID标签的示意图。
在下文中,将参照图1更详细地描述本发明。本发明公开了RFID标签1,RFID标签1包括基底2,基底2具有第一表面3和背离第一表面3的相反的第二表面4。基底优选地由纸或纸板材料制成。然而,技术人员认识到其他非导电基底材料也是可以的。
第一表面3被硅化,即表面已经用硅涂覆或处理,使得表面具有不粘特性。第二表面4是未处理的,即它没有被硅化。
RFID标签还包括RFID标牌7,该标牌包括RFID天线5和集成芯片(IC)6。IC电连接至天线,使得天线和IC形成RFID标牌。RFID标牌在未处理的第二表面4上附接至基底。
技术人员认识到,可以有许多方式在第二表面上形成RFID标牌。在形成天线的第一实施方式中,导电固体颗粒以预定义图案形成在腹板(web)的第二表面上。
然后固化导电材料以形成凝固的、更紧凑的天线图案。这可以例如通过应用合适的加热器加热来实现。因此,优选地将导电材料加热至超过导电材料的特征熔化温度的温度。
可以按照WO2013/113995、WO2009/135985、WO2008/006941和WO2016/189446中的一个或多个中公开的方式进行导电颗粒的转印和固化以及凝固。所有所述文献在此通过引用,全文并入本文。
此外,也可以使用形成图案化的导电材料的其他方式。在第二实施方式中,RFID天线的形成可以通过使用导电墨的增材印刷(additive printing)来进行。导电墨是包含导电颗粒的墨。导电墨例如可以是银墨、铜墨或石墨烯墨。然后通过将导电墨干燥或用热空气、辐射(UV、EB)、光子固化、激光或一些其他处理方法处理导电墨,使其导电。
在第三实施方式中,通过首先为第二表面提供优选为铝箔的导电层来形成RFID天线。然后减去部分导电层,使得套筒材料腹板(collar material web)上的剩余导电层形成RFID天线。将导电层减去成期望的导电图案可以例如通过切割、研磨、刷涂等来进行。
此后,方法包括将RFID IC附接至天线上的步骤,使得在IC和天线之间建立电连接,其中,形成RFID标牌3。
RFID标签还包括应用至基底的第二表面4上和RFID标牌7上方的粘性粘合层8。因此,粘合层覆盖天线5、IC 6和第二表面4。
长形基底2承载若干RFID标牌7,这些标牌被布置在基底的第二表面上。RFID标牌以两个相邻RFID标牌之间具有预定距离的方式进行布置。
在优选实施方式中,基底在两个相邻标牌之间穿孔,使得标牌可以在RFID标牌应用过程中手动或自动分离。然而,技术人员认识到其他分离方法也是可以的,例如经由剪刀或刀或类似设备切割,其中穿孔不是必需的。
RFID标签被卷起以形成卷,其中,硅化的第一表面3面对并覆盖粘性粘合层8。由于硅化表面4覆盖了粘合层8,在卷中,不需要额外的硅化衬垫或类似物来保护粘合层8。
完成的粘性RFID标签可以通过在应用期间切割标签并然后将RFID标签直接固定至期望的物体上来实现。
与传统的RFID标签相比,本发明具有几个优点。本发明的标签仅由一个单基底层组成,即不需要剥离层或附加层。本发明的主要优点是使原材料的量最小化,这使得成本最优化和环境友好的非常薄的产品结构成为可能。这意味着每个卷将具有大约两倍以上的标签,这进而意味着运输成本和相关的污染将大大降低。因为卷较少地需要调换,生产过程变得更高效。与常规RFID标签相比,产品的碳足迹明显减少。
在上文中,已经基于一些具体实施方式描述了本发明。然而,本领域技术人员认识到,在所附权利要求书的范围内,其他实施方式和变型也是可以的。
Claims (9)
1.一种包括RFID标牌(7)的RFID标签(1),所述标牌包括RFID天线(5)和IC(6),所述IC附接至所述天线上,使得所述天线和所述IC形成所述RFID标牌,其特征在于,所述标签还包括:
-具有第一表面(3)和第二表面(4)的长形基底(2),其中,所述第一表面被硅化,并且所述第二表面承载所述RFID标牌(7),以及
-被布置在所述基底的所述第二表面上和所述RFID标牌上方的粘性粘合层(8)。
2.根据权利要求1所述的RFID标签,其特征在于,所述RFID标签被卷起以形成卷,使得所述基底的所述硅化的第一表面(3)面对并覆盖所述粘合层(8)。
3.根据权利要求1至2中任一项所述的RFID标签,其特征在于,所述基底(2)由纸或纸板制成。
4.根据权利要求1至3中任一项所述的RFID标签,其特征在于,所述长形基底承载若干RFID标牌,所述若干RFID标牌以两个相邻RFID标牌之间具有预定距离的方式布置在所述基底上。
5.根据权利要求4所述的RFID标签,其特征在于,所述基底在两个相邻标牌之间穿孔,使得所述标牌能够在标牌应用过程中手动或自动分离。
6.根据权利要求1至5中任一项所述的RFID标签,其特征在于,所述RFID天线直接形成在所述基底的所述第二表面上,并且所述IC附接至所述天线上,使得在所述IC和所述天线之间建立电连接。
7.根据权利要求6所述的RFID标签,其特征在于,所述RFID天线由导电固体颗粒的天线图案形成,并且所述导电材料被加热至超过所述材料的特征熔点的温度,使得形成所述RFID天线。
8.根据权利要求6所述的RFID标签,其特征在于,所述RFID天线通过增材印刷来制造,其中,所述天线使用导电墨来印刷。
9.根据权利要求6所述的RFID标签,其特征在于,所述基底与导电层层压在一起,并且其中,所述RFID通过使用减材制造来形成,其中,部分所述导电层被减去,使得所述基底腹板上的剩余导电层形成所述RFID天线。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE1951287-0 | 2019-11-08 | ||
SE1951287A SE543748C2 (en) | 2019-11-08 | 2019-11-08 | Rfid label |
PCT/IB2020/060346 WO2021090189A1 (en) | 2019-11-08 | 2020-11-04 | Rfid label |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115023858A true CN115023858A (zh) | 2022-09-06 |
Family
ID=75849606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080077912.2A Pending CN115023858A (zh) | 2019-11-08 | 2020-11-04 | Rfid标签 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11928536B2 (zh) |
EP (1) | EP4055660A4 (zh) |
CN (1) | CN115023858A (zh) |
BR (1) | BR112022008802A2 (zh) |
SE (1) | SE543748C2 (zh) |
WO (1) | WO2021090189A1 (zh) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6618024B1 (en) | 2002-03-21 | 2003-09-09 | Brady Worldwide, Inc. | Holographic label with a radio frequency transponder |
JP2005019571A (ja) * | 2003-06-24 | 2005-01-20 | Canon Inc | チップの実装方法及び実装基板の製造装置 |
AU2004269715A1 (en) * | 2003-08-29 | 2005-03-10 | Peter S. Atherton | A radio frequency identification tag with tamper detection capability |
US7259678B2 (en) | 2003-12-08 | 2007-08-21 | 3M Innovative Properties Company | Durable radio frequency identification label and methods of manufacturing the same |
DE102006052517A1 (de) | 2006-11-06 | 2008-05-08 | Bielomatik Leuze Gmbh + Co.Kg | Chipmodul für ein RFID-System |
JP5167828B2 (ja) * | 2008-01-21 | 2013-03-21 | 凸版印刷株式会社 | 偽造防止用icタグ |
US8857724B2 (en) * | 2009-03-10 | 2014-10-14 | Wal-Mart Stores, Inc. | Universal RFID tags and methods |
US9076092B2 (en) * | 2009-05-08 | 2015-07-07 | Confidex Ltd. | RFID transponder and a method for fabricating the same |
JP5351789B2 (ja) * | 2010-01-29 | 2013-11-27 | サトーホールディングス株式会社 | Rfidラベルおよびrfidラベルの加工方法 |
WO2012110702A2 (en) * | 2011-02-17 | 2012-08-23 | Upm Rfid Oy | Label with radio frequency transponder |
US20140079894A1 (en) * | 2012-09-17 | 2014-03-20 | Sihl Gmbh | Multilayer article having cold seal coatings |
CN103824109B (zh) * | 2014-03-12 | 2018-01-23 | 厦门英诺尔信息科技有限公司 | 一种rfid防转移且不残胶的电子标签及其制成方法 |
US10474940B2 (en) * | 2014-12-23 | 2019-11-12 | 3M Innovative Properties Company | Flexible radio frequency identification tags |
SE539800C2 (en) * | 2015-05-26 | 2017-12-05 | Stora Enso Oyj | Method and arrangement for producing electrically conductive patterns on substrates |
EP3435359A1 (de) * | 2017-07-26 | 2019-01-30 | Mediaform Informationssysteme GmbH | Kennzeichnungsband und verfahren zu dessen herstellung |
SE541026C2 (en) * | 2017-10-13 | 2019-03-12 | Stora Enso Oyj | Method and arrangement for producing a label with integrated electrically conductive pattern |
-
2019
- 2019-11-08 SE SE1951287A patent/SE543748C2/en unknown
-
2020
- 2020-11-04 BR BR112022008802A patent/BR112022008802A2/pt unknown
- 2020-11-04 US US17/755,766 patent/US11928536B2/en active Active
- 2020-11-04 CN CN202080077912.2A patent/CN115023858A/zh active Pending
- 2020-11-04 WO PCT/IB2020/060346 patent/WO2021090189A1/en unknown
- 2020-11-04 EP EP20884198.1A patent/EP4055660A4/en active Pending
Also Published As
Publication number | Publication date |
---|---|
US11928536B2 (en) | 2024-03-12 |
EP4055660A4 (en) | 2023-11-29 |
US20220414412A1 (en) | 2022-12-29 |
BR112022008802A2 (pt) | 2022-07-26 |
WO2021090189A1 (en) | 2021-05-14 |
EP4055660A1 (en) | 2022-09-14 |
SE1951287A1 (en) | 2021-05-09 |
SE543748C2 (en) | 2021-07-13 |
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