CN115023039A - Display module and electronic equipment - Google Patents
Display module and electronic equipment Download PDFInfo
- Publication number
- CN115023039A CN115023039A CN202210540926.4A CN202210540926A CN115023039A CN 115023039 A CN115023039 A CN 115023039A CN 202210540926 A CN202210540926 A CN 202210540926A CN 115023039 A CN115023039 A CN 115023039A
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- Prior art keywords
- wiring layer
- layer
- fpc
- nfc
- display module
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
- H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/273—Adaptation for carrying or wearing by persons or animals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a display module and electronic equipment, wherein the display module comprises a main screen and an FPC (flexible printed circuit); the FPC comprises a substrate layer and a wiring layer, wherein the wiring layer comprises an NFC wiring layer and a second wiring layer; the NFC wiring layer is arranged on the periphery of the second wiring layer; the substrate layer is arranged between the NFC wiring layer and the second wiring layer; the second wiring layer is an MFPC wiring layer or a TPFPC wiring layer; the NFC wiring layer is communicated with the second wiring layer through the through hole, and the outgoing line is connected to the connector; the FPC is bonded with the main screen through the ACF. NFC routing layer deviates from substrate layer one side and is equipped with the line protective layer of walking, walks line protective layer one side and is equipped with the ferrite, and the second routing layer deviates from substrate layer one side and is equipped with the cover film. Still include FPC extension, FPC links to each other with FPC extension through bending region. And the FOF binding area is used for binding the COF IC. The FPC contained in the display module integrates NFC, so that the complicated welding and attaching steps in the traditional technology are reduced, and the cost is reduced; the problem of poor performance caused by welding cold solder is avoided, and the product stability is improved.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to a display module and electronic equipment.
Technical Field
At present, the requirement for the function integration level of wearable electronic products is higher and higher, swiping a bus card or shopping through wearable equipment with an NFC function becomes a trend of future consumption, in the era of rapid popularization of electronic payment, the wearable equipment with the NFC function plays an extremely important role in life, the existing design is generally conducted through welding an independent NFC and an independent main screen FPC through a welding pad, and the problem that the performance is unstable due to poor welding exists. The competitive power of the cost in the industry is getting bigger and bigger, and all large factories optimize the product design by a method to the greatest extent, so that the loss of manpower and material resources is reduced. However, how to solve the above technical problems has become a technical problem to be solved urgently in the industry.
Disclosure of Invention
The invention discloses a display module and electronic equipment, and aims to solve the technical problems in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows: a display module, comprising: a main screen and an FPC;
the FPC comprises a substrate layer and a wiring layer, wherein the wiring layer comprises an NFC wiring layer and a second wiring layer; the NFC wiring layer is arranged on the periphery of the second wiring layer; the substrate layer is arranged between the NFC wiring layer and the second wiring layer;
the second wiring layer is an MFPC wiring layer or a TPFPC wiring layer;
the NFC wiring layer is communicated with the second wiring layer through the through hole, and the outgoing line is connected to the connector; the FPC and the main screen are connected in a binding mode through the ACF.
As preferred technical scheme, NFC wiring layer deviates from substrate layer one side and is equipped with the line protective layer of walking.
As preferred technical scheme, walk line protective layer and deviate from NFC routing layer one side and be equipped with the ferrite.
As a preferred technical scheme, a covering film is arranged on one side, away from the base material layer, of the second routing layer.
As the preferred technical scheme, the flexible printed circuit board further comprises an FPC extending part, and the FPC is connected with the FPC extending part through the bending area.
As the preferred technical scheme, the FPC extending part and the bending area are integrally formed.
As a preferred technical solution, the chip further comprises a FOF binding region for binding the COF IC.
Preferably, the connector is a BTB connector or a ZIF connector.
As a preferred technical scheme, the FPC also comprises a component area, and the components are components on the MFPC or the TPFPC.
The invention also discloses electronic equipment comprising the display module.
Compared with the prior art, the invention has the following technical effects: (1) the FPC in the display module is integrated with NFC, and the NFC is integrated in the MFPC or TPFPC in a wiring layer mode, so that the complex welding and attaching steps in the traditional technology are reduced, and the cost is reduced; the problems of poor performance, inaccurate alignment and the like caused by welding insufficient solder are avoided, and the product stability is improved; (2) meanwhile, the NFC antenna is integrated on the main screen FPC by using a conventional double-layer substrate board, so that material cost and process are reduced, and cost is reduced. Therefore, the electronic equipment manufactured by using the display module realizes the NFC integration effect on one hand, and is low in production cost and stable in product on the other hand, so that the market competitiveness is improved.
Description of the drawings:
fig. 1 is a schematic diagram of an FPC structure integrated with an NFC antenna according to embodiment 1 of the present invention;
fig. 2 is a schematic diagram of an FPC structure integrated with an NFC antenna according to embodiment 1 of the present invention;
fig. 3 is a schematic structural diagram of a display module according to embodiment 1 of the present invention;
fig. 4 is a schematic structural view of another display module according to embodiment 2 of the present invention;
fig. 5 is a schematic structural diagram of another display module according to embodiment 3 of the present invention.
Description of reference numerals:
1-FPC; 2-an NFC routing layer; 3-a substrate layer; 31-a through hole; 4-a second routing layer; 5, routing protective layer; 6-ferrite; 7-a cover film; 8-upper glass substrate layer; 9-lower glass substrate layer; 10-a binding region; 11-touch FPC; 12-IC binding region; 13-IC glue dispensing area; 14-FOF binding region; 15-a bending zone; 16-an extension; 17-component.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings.
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In order to solve the problems in the prior art, the embodiment provides a display module, which comprises a main screen and an FPC. The FPC (flexible circuit board) is an FPC integrating an NFC (Near Field Communication) antenna, and specifically, an NFC line and an MFPC (main flexible circuit board) line are integrated into one FPC, or an NFC line and a TPFPC (touch screen flexible circuit board) line are integrated into one FPC. The NFC circuit and the MFPC circuit or the NFC circuit and the TPFPC circuit are arranged on a conventional two-layer board and are communicated through-hole jumpers, at least one through hole is formed, and the outlet wires are connected with a connector after being communicated and are connected with the MCU of the mainboard. The FPC and the main screen are connected in a binding mode through the ACF.
This FPC of collection NFC antenna is applied to all kinds of display module assemblies, and is specific, and the display module assembly can be display module assemblies such as oncell structure AM display module assembly (containing the flexible screen), outcell structure AM display module assembly (containing the flexible screen), AM owner screen (containing the flexible screen), oncell structure TFT display module assembly, outcell structure TFT display module assembly, LCM display module assembly structure.
Example 1
Fig. 1-2 are schematic diagrams illustrating an FPC structure integrated with an NFC antenna according to embodiment 1 of the present invention, fig. 3 is a schematic diagram illustrating a display module structure according to the present invention, and a detailed description will be given below of a display module according to the present invention with reference to fig. 1-3.
As shown in fig. 3, the display module includes a main panel (an upper glass substrate layer 38 and a lower glass substrate layer 39, the lower glass substrate layer 39 fully covers the upper glass substrate layer 38) and an FPC 1.
Further, referring to fig. 1-fig. 2, the FPC1 included in the display module includes a substrate layer 3 and a wiring layer, where the wiring layer includes an NFC wiring layer 2 and a second wiring layer 4; the substrate layer 3 is arranged between the NFC wiring layer 2 and the second wiring layer 4; wherein, the substrate layer 3 adopts a conventional two-layer plate design.
In this embodiment, the second wiring layer 4 is an MFPC1 wiring layer, and in some other embodiments, the second wiring layer 4 is a TPFPC1 wiring layer;
preferably, MFPC1 routing layer or TPFPC1 routing layer is routed to the middle top layer, and NFC routing layer 2 is routed to the peripheral bottom layer, and in other embodiments, the reverse is also true, i.e., NFC routing layer 2 is routed to the peripheral top layer, and MFPC1 routing layer or TPFPC1 routing layer is routed to the middle bottom layer. That is, the MFPC1 routing layer or the TPFPC1 routing layer is disposed in the middle of the NFC routing layer 2, and the top layer or the bottom layer may be disposed interchangeably without limitation. Locate the periphery with NFC wiring layer 2, can increase wire winding length, wire winding length is long, just need not wind too many circles, and the total area just can reduce, and the flexibility is higher.
As shown in fig. 1-2, preferably, NFC wiring layer 2 and second wiring layer 4 are connected through via 31, and the outgoing line is connected to a connector and connected to the MCU of the motherboard. Above-mentioned through-hole 31 includes VIA hole VIA, and specific through-hole 31 quantity can set up according to actual need, and through-hole 31 all designs for running through substrate layer 3. The connector is a BTB connector or a ZIF connector. The FPC1 and the main screen are connected in the bonding area through ACF bonding.
As shown in fig. 1, preferably, a trace protection layer 5 is arranged on a side of the NFC wiring layer 2 away from the substrate layer 3, and the trace protection layer 5 may be a cover film 7 or green oil; walk line protective layer 5 and deviate from NFC routing layer 2 one side and be equipped with ferrite 6, do NFC coil and MFPC or TPFPC on same FPC1, paste ferrite 6 behind SMT (Surface Mounted Technology Surface mounting Technology), can realize integrated purpose, need not the back end and go to weld and assemble. Further, the NFC trace protection layer 5 may also be double-sided adhesive, and the double-sided adhesive is used for adhering the ferrite 6; the second routing layer 4 is equipped with the cover film 7 on the side of deviating from the substrate layer 3, and the cover film 7 can choose for use the same kind with the cover film 7 of routing protective layer 5.
Preferably, in some embodiments, the FPC1(Flexible Printed Circuit) is a Flexible Printed Circuit board with high reliability and excellent performance, which is made of polyimide or polyester film as a base material. The FPC1 has the characteristics of high wiring density, light weight, thin thickness, and good bendability.
As shown in fig. 1-3, it is preferable that an FPC1 extension 16 is further included, and an FPC1 is connected to FPC1 extension 16 through a bending region 15. The bending region 15 is subjected to special softening treatment, and has good flexibility and bending performance. The FPC1, the FPC1 extending portion 16 and the bending region 15 are integrally formed. Preferably, the grid copper is paved in the bending area 15; or the number of routing layers of the bending area 15 is reduced; or windowing the NFC trace protection layer 5 corresponding to the bending area 15; or the covering film 7 corresponding to the bending area 15 is windowed and brushed with green oil.
Preferably, the NFC antenna further comprises a binding region 10, wherein the binding region 10 comprises FPC1 binding regions for binding with the FPC1 of the collective NFC antenna in fig. 1. A second bonding region (not shown) is further provided on the opposite side of the bonding region 10, and the second bonding region is used for bonding the touch FPC 11.
Preferably, the bonding structure further comprises a FOF (FPC1onfilm) bonding area 14, wherein an Anisotropic Conductive Film (ACF) is adopted in the FOF bonding (a COF and FPC1 bonding process) to realize electrical connection. The FOF binding region 14 is used for binding the COF IC.
Preferably, the driver IC bonding apparatus further comprises an IC bonding area 12, and the IC bonding area 12 is used for bonding the driver IC. An IC dispensing area 13 is also provided around the IC bonding area 12.
Referring to fig. 4 and 5, FPC1 also includes a component 17 area, where component 17 is a component 17 on MFPC1 or TPFPC 1. The component 17 section comprises a capacitor and/or a resistor and/or a diode. And the capacitor plays a role in voltage stabilization or filtering. And the resistor plays a role in pull-up or electrostatic protection. The diode plays a role in electrostatic protection or preventing voltage from flowing backwards.
The FPC1 included in the display module is integrated with NFC, and the NFC is integrated in MFPC1 or TPFPC1 in a wiring layer mode, so that the complex steps of welding, attaching and assembling in the traditional technology are reduced, and the cost is reduced; the problems of poor performance, inaccurate alignment and the like caused by welding cold joint are avoided, the product stability is improved, and further the market competitiveness is improved.
Example 2
Referring to fig. 4, an embodiment of the present invention provides a schematic structural diagram of an oncell AM display module (including a flexible screen), where the display module includes an FPC1 that integrates NFC and MFPC1 in the above embodiment, the FPC1 is provided with a device 17 region of the MFPC1, and a FOF bonding region 14, and after bonding, a ferrite 6 required by NFC is attached. Preferably, the driver IC bonding apparatus further comprises an IC bonding area 12, and the IC bonding area 12 is used for bonding the driver IC. Similarly, the FPC1 in the display modules such as the outcell structure AM display module (including the flexible screen), the AM main screen (including the flexible screen), the oncell structure TFT display module, the outcell structure TFT display module, and the LCM display module can adopt the FPC1 integrating the NFC and the MFPC 1.
Example 3
Referring to fig. 5, a schematic structural diagram of another one cell structure AM display module (including a flexible panel) is shown in the embodiment of the present invention, and unlike the embodiment described above, the display module includes an FPC1 that integrates NFC and a TPFPC1, and the FPC1 is provided with a component 17 region of the TPFPC 1. Similarly, the FPC1 in the display modules such as the outcell structure AM display module (including the flexible screen), the AM main screen (including the flexible screen), the oncell structure TFT display module, the outcell structure TFT display module, and the LCM display module can adopt the FPC1 integrating the NFC and the TPFPC 1.
Example 4
An embodiment of the present invention provides a structure of an electronic device, where the electronic device includes the display module that uses the FPC1 incorporating an NFC antenna. The electronic equipment comprises intelligent wearable equipment (such as an intelligent watch, an intelligent bracelet, intelligent glasses and the like).
The electronic equipment has a data processing function, and has the functions of character display, data analysis, voice feedback, dynamic or virtual images and the like based on data processing. Further, the electronic device also has a wireless communication function and the like.
Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A display module, comprising: a main screen and an FPC;
the FPC comprises a substrate layer and a wiring layer, wherein the wiring layer comprises an NFC wiring layer and a second wiring layer; the NFC wiring layer is arranged on the periphery of the second wiring layer; the substrate layer is arranged between the NFC wiring layer and the second wiring layer;
the second wiring layer is an MFPC wiring layer or a TPFPC wiring layer;
the NFC wiring layer is communicated with the second wiring layer through the through hole, and the outgoing line is connected to the connector; the FPC and the main screen are connected in a binding mode through the ACF.
2. The display module assembly of claim 1, wherein a trace protection layer is disposed on a side of the NFC trace layer opposite to the substrate layer.
3. The display module according to claim 2, wherein a ferrite is disposed on a side of the trace protection layer away from the NFC trace layer.
4. The display module according to claim 1, wherein a cover film is disposed on a side of the second routing layer facing away from the substrate layer.
5. The display module of claim 1, further comprising an FPC extension, wherein the FPC is connected to the FPC extension through a bending region.
6. The display module according to claim 5, wherein the FPC is integrally formed with the FPC extension and the bending region.
7. The display module of claim 1, further comprising a FOF binding region for binding a COF IC.
8. The display module of claim 1, wherein the connector is a BTB connector or a ZIF connector.
9. The display module according to claim 1, wherein the FPC further comprises a component area, and the components are components on an MFPC or a TPFPC.
10. An electronic device, comprising the display module according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210540926.4A CN115023039A (en) | 2022-05-17 | 2022-05-17 | Display module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210540926.4A CN115023039A (en) | 2022-05-17 | 2022-05-17 | Display module and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115023039A true CN115023039A (en) | 2022-09-06 |
Family
ID=83068862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210540926.4A Pending CN115023039A (en) | 2022-05-17 | 2022-05-17 | Display module and electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN115023039A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150113747A (en) * | 2014-03-31 | 2015-10-08 | 주식회사 온플렉스 | Flexible copper clad laminate for wireless charging and near field communication antenna and method manufacturing thereof |
| KR20160109751A (en) * | 2015-03-13 | 2016-09-21 | (주)파인일렉컴 | Double surface type flexible printed circuit board for NFC and manufacturing method thereof |
| KR20160136486A (en) * | 2015-05-19 | 2016-11-30 | 주식회사 아이엠텍 | Antenna structure for portable phone |
| CN206059641U (en) * | 2016-09-26 | 2017-03-29 | 上海德门电子科技有限公司 | NFC antenna and electronic equipment based on dual platen cabling |
| CN110336114A (en) * | 2019-05-09 | 2019-10-15 | 天通凯美微电子有限公司 | The integrated electronic equipment of near field communication NFC antenna, wireless charging and display screen |
| CN111258459A (en) * | 2020-03-31 | 2020-06-09 | 厦门天马微电子有限公司 | Display module, driving method thereof and display device |
| CN112384004A (en) * | 2020-11-16 | 2021-02-19 | 京东方科技集团股份有限公司 | Circuit board assembly, display assembly, assembly method of display assembly and display device |
| US20210185843A1 (en) * | 2019-12-13 | 2021-06-17 | Samsung Electronics Co., Ltd. | Electronic device includng coils |
-
2022
- 2022-05-17 CN CN202210540926.4A patent/CN115023039A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150113747A (en) * | 2014-03-31 | 2015-10-08 | 주식회사 온플렉스 | Flexible copper clad laminate for wireless charging and near field communication antenna and method manufacturing thereof |
| KR20160109751A (en) * | 2015-03-13 | 2016-09-21 | (주)파인일렉컴 | Double surface type flexible printed circuit board for NFC and manufacturing method thereof |
| KR20160136486A (en) * | 2015-05-19 | 2016-11-30 | 주식회사 아이엠텍 | Antenna structure for portable phone |
| CN206059641U (en) * | 2016-09-26 | 2017-03-29 | 上海德门电子科技有限公司 | NFC antenna and electronic equipment based on dual platen cabling |
| CN110336114A (en) * | 2019-05-09 | 2019-10-15 | 天通凯美微电子有限公司 | The integrated electronic equipment of near field communication NFC antenna, wireless charging and display screen |
| US20210185843A1 (en) * | 2019-12-13 | 2021-06-17 | Samsung Electronics Co., Ltd. | Electronic device includng coils |
| CN111258459A (en) * | 2020-03-31 | 2020-06-09 | 厦门天马微电子有限公司 | Display module, driving method thereof and display device |
| CN112384004A (en) * | 2020-11-16 | 2021-02-19 | 京东方科技集团股份有限公司 | Circuit board assembly, display assembly, assembly method of display assembly and display device |
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