CN114828390A - FPC (flexible printed circuit), display module and electronic equipment with NFC (near field communication) antenna - Google Patents
FPC (flexible printed circuit), display module and electronic equipment with NFC (near field communication) antenna Download PDFInfo
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- CN114828390A CN114828390A CN202210520856.6A CN202210520856A CN114828390A CN 114828390 A CN114828390 A CN 114828390A CN 202210520856 A CN202210520856 A CN 202210520856A CN 114828390 A CN114828390 A CN 114828390A
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- 238000004891 communication Methods 0.000 title description 4
- 238000005452 bending Methods 0.000 claims abstract description 40
- 239000010410 layer Substances 0.000 claims description 114
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 229910000859 α-Fe Inorganic materials 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 5
- 239000011521 glass Substances 0.000 description 20
- 239000000758 substrate Substances 0.000 description 19
- 238000005476 soldering Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000011022 operating instruction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The FPC integrated with the NFC antenna comprises the following components: the FPC comprises an FPC body, a plurality of wiring layers and a plurality of connecting wires; the NFC module comprises an NFC wiring layer; the edge of the FPC body is also provided with a bending part which is communicated with the FPC body and the NFC module; the bending part comprises a bending part routing layer; at least one wiring layer of the FPC body, the bending part wiring layer and the NFC wiring layer are integrally formed. The embodiment of the invention also discloses a display module and electronic equipment, and the FPC body on the FPC and the NFC module are integrally formed, so that the complexity of welding the existing FPC and NFC is avoided.
Description
Technical Field
The invention relates to the technical field of electronic equipment, in particular to an FPC (flexible printed circuit) integrated with an NFC (near field communication) antenna, a display module and electronic equipment.
Background
With the development of economy and the popularization of wireless payment technology, swiping a bus card or shopping through the wearable device with the NFC function becomes a trend of future consumption, the wearable device with the NFC function is more and more popular with consumers due to the reasons of convenient wearing, convenient payment, novel payment form and the like, and the wearable device with the NFC function plays an extremely important role in life in the era of rapid popularization of electronic payment.
However, the existing design is generally to connect the independent NFC and the independent main screen FPC through pad bonding, which is cumbersome to operate and has the problem of unstable performance due to poor bonding.
How to solve the technical problems becomes a technical problem to be solved urgently in the industry.
Disclosure of Invention
In order to solve at least the above technical problem, an embodiment of the present invention provides an FPC integrated with an NFC antenna, wherein a routing layer of the FPC is connected to an NFC routing layer by a bending portion 104/208, and the three are integrally formed, so that the complexity of soldering the existing FPC to the NFC antenna is avoided.
In order to achieve the above object, an FPC integrated with an NFC antenna provided in an embodiment of the present invention includes:
the FPC comprises an FPC body, a plurality of wiring layers and a plurality of connecting wires;
the NFC module comprises an NFC wiring layer;
the edge of the FPC body is also provided with a bending part which is communicated with the FPC body and the NFC module;
the bending part comprises a bending part routing layer;
at least one wiring layer of the FPC body, the bending part wiring layer and the NFC wiring layer are integrally formed.
In some exemplary embodiments, the bending part routing layer comprises mesh copper, and the size of the mesh copper of the bending part routing layer is larger than that of the mesh copper of the FPC body routing layer.
In some exemplary embodiments, the number of routing layers of the bending part is less than that of the routing layers of the FPC body.
In some exemplary embodiments, the bending part includes an NFC protection layer disposed at one side of the NFC wiring layer.
In some exemplary embodiments, the NFC protective layer comprises a coating of green oil.
In some exemplary embodiments, the NFC protection layer includes a frame-type NFC protection layer.
In some exemplary embodiments, the NFC module further includes:
and the ferrite is arranged on the NFC protective layer.
In some exemplary embodiments, a FOF bonding area is further included, and the FOF bonding area is used for bonding a COF IC.
In order to achieve the above object, an embodiment of the present invention further provides a display module, which includes the FPC integrated with the NFC antenna.
In order to achieve the above object, an embodiment of the present invention further provides an electronic device, which includes the FPC integrated with the NFC antenna or the display module.
The FPC integrated with the NFC antenna comprises the following components: the FPC comprises an FPC body, a plurality of wiring layers and a plurality of connecting wires; the NFC module comprises an NFC wiring layer; the edge of the FPC body is also provided with a bending part which is communicated with the FPC body and the NFC module; the bending part comprises a bending part routing layer; at least one wiring layer of the FPC body, the bending part wiring layer and the NFC wiring layer are integrally formed. According to the FPC integrated with the NFC antenna, disclosed by the embodiment of the invention, the FPC body on the FPC and the NFC module are integrally formed, so that the complicacy that the conventional FPC needs to be welded with NFC is avoided, and the problem of poor performance caused by cold welding of welding is further avoided; the welding steps are saved, the assembly is not needed, and the cost is reduced; the problem of misalignment is avoided; the stability of the product is improved, and further the market competitiveness is improved.
Drawings
In order to more clearly illustrate one or more embodiments or prior art solutions of the present specification, reference will now be made briefly to the attached drawings, which are needed in the description of one or more embodiments or prior art, and it should be apparent that the drawings in the description below are only some of the embodiments described in the specification, and that other drawings may be obtained by those skilled in the art without inventive exercise.
Fig. 1 is a schematic diagram of an FPC structure integrated with an NFC antenna according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a display module according to an embodiment of the invention.
Description of reference numerals:
101/209-FPC body; 102/210-NFC module; 103/211-FPC extension; 104/208-bending part; 105-a first bend; 106-a second bend; 107-stiffening plate; 108-a weld; 109/205-IC binding area; 110/206-dispensing area; 111/207-FOF binding region; 112-FPC punching; 113-NFC punching; 201-lower glass substrate layer; 202-upper glass substrate layer; 203-binding area; 204-touch FPC.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are described herein for the purpose of illustration and explanation and not limitation.
An embodiment of the present invention provides an FPC integrated with an NFC antenna, including:
the FPC comprises an FPC body, a plurality of wiring layers and a plurality of connecting wires;
the NFC module comprises an NFC wiring layer;
the edge of the FPC body is also provided with a bending part which is communicated with the FPC body and the NFC module;
the bending part comprises a bending part routing layer;
at least one wiring layer of the FPC body, the bending part wiring layer and the NFC wiring layer are integrally formed.
Example 1
Fig. 1 is a schematic structural diagram of an FPC integrated with an NFC antenna according to an embodiment of the present invention, and the FPC integrated with the NFC antenna according to the embodiment of the present invention will be described in detail with reference to fig. 1.
The FPC integrated with the NFC antenna comprises the following components: the flexible printed circuit board comprises an FPC body 101/209, an NFC module 102/210, and a first bending portion 105104/208.
In some exemplary embodiments, FPC body 101/209 includes multiple routing layers.
In some exemplary embodiments, the routing layers on FPC body 101/209 may include 2 routing layers, 3 routing layers, or even more routing layers, as desired.
In some exemplary embodiments, NFC module 102/210 includes an NFC trace layer.
In some exemplary embodiments, the NFC routing layer may have only one routing layer.
In some exemplary embodiments, bend 104/208 is located at an edge of FPC body 101/209.
In some exemplary embodiments, the bending portion 104/208 is used to communicate the FPC body 101/209 and the NFC module 102/210.
In some exemplary embodiments, at least one routing layer on the FPC body 101/209 is connected to the bending portion 104/208 (for example, when the routing layer includes multiple routing layers, one routing layer may be connected to the bending portion 104/208, or two routing layers may be connected to the bending portion 104/208 as required).
In some exemplary embodiments, the bend 104/208 is connected to the NFC trace layer.
In some exemplary embodiments, the bend 104/208 includes a bend routing layer that is connected to the NFC routing layer.
In some exemplary embodiments, the coupling includes an electrical connection.
In some exemplary embodiments, the routing layer includes metal traces.
In some exemplary embodiments, at least one routing layer of the FPC body 101/209, the bending routing layer, and the NFC routing layer are integrally formed.
In some exemplary embodiments, a substrate layer is further disposed between the plurality of routing layers of FPC body 101/209, and the substrate layer is used for insulation between adjacent routing layers.
In some exemplary embodiments, electrical connections are also included between the connected routing layers of FPC body 101/209.
In some exemplary embodiments, the outside of FPC body 101/209 is provided with a coverlay.
In some exemplary embodiments, the routing layer of FPC body 101/209 includes mesh copper or solid copper.
In some exemplary embodiments, the routing layer of FPC body 101/209 is made of solid copper to facilitate testing for electromagnetic compatibility and electrostatic discharge performance.
In some exemplary embodiments, the bend 104/208 includes a bend 104/208 routing layer.
In some exemplary embodiments, the routing layer of bend 104/208 comprises mesh copper.
In some exemplary embodiments, at least one routing layer of the FPC body 101/209, the routing layer of the bent portion 104/208, and the NFC routing layer are integrally formed.
In some exemplary embodiments, the mesh copper of the routing layer of bend 104/208 is larger in size than the mesh copper of the routing layer of FPC body 101/209.
In some exemplary embodiments, the number of routing layers of bending portion 104/208 is less than the number of routing layers of FPC body 101/209.
In some exemplary embodiments, the bending portion 104/208 includes an NFC protection layer disposed on one side of the NFC wiring layer.
In some exemplary embodiments, the NFC protective layer includes a green oil coating (i.e., a green oil coating on a surface of the NFC protective layer).
In some exemplary embodiments, the NFC protection layer includes a frame-type NFC protection layer (i.e., a design that windows the FC protection layer, or does not lay an NFC protection layer on the NFC wiring layer).
In some exemplary embodiments, a ferrite is further included, and the ferrite is disposed on the NFC protection layer (i.e., if the NFC module 102/210 has an NFC wiring layer as the middle layer and is covered with the NFC protection layer on one side of the NFC wiring layer, the ferrite is disposed on the NFC protection layer).
In some exemplary embodiments, a FOF binding region 111/207 is further included, and a FOF binding region 111/207 is used to bind COF ICs.
In some exemplary embodiments, an Anisotropic Conductive Film (ACF) is used in a fof (fpconfilm) bonding (a COF to FPC bonding process) to achieve electrical connection.
In some exemplary embodiments, a weld 108 is also included, the weld 108 being for connection (welding) with an exterior.
In some exemplary embodiments, an IC bonding area 109/205 is further included, and IC bonding area 109/205 is used to bond the IC.
In some exemplary embodiments, an IC dispensing region 110/206 is also provided around the IC bonding region 109/205.
In some exemplary embodiments, a first bent portion 105104/208 is further provided, and the FPC body 101/209 is connected to the FPC extension 103/211 through the first bent portion 105104/208.
In some exemplary embodiments, a second bent portion 106104/208 is further disposed at the other end of the FPC extension 103/211, and the other end of the second bent portion 106104/208 is connected to the reinforcing plate 107.
In some exemplary embodiments, the stiffener 107 comprises a stiffened steel plate, PI stiffening, or FR4 stiffening.
In some exemplary embodiments, FPC punch-outs 112 are also provided on FPC body 101/209 (FPC punch-outs 112 may be multiple).
In some exemplary embodiments, the NFC module 102/210 further includes an NFC punch-out 113 (the NFC punch-out 113 may also be multiple).
In some exemplary embodiments, the FPC punch-outs 112 correspond to the NFC punch-outs 113 (i.e., the FPC punch-outs 112 overlap the NFC punch-outs 113 when the FPC body 101/209 is mated with the NFC module 102/210 through the bend 104/208).
In some exemplary embodiments, the FPC body 101/209 may also be attached to the FPC extension 103/211 through the first bending portion 105104/208.
In some exemplary embodiments, the bending portion 104/208, the first bending portion 105104/208, and the second bending portion 106104/208 are formed by the same technique to bend themselves, or different techniques to fit the devices at two adjacent ends.
In some exemplary embodiments, when FPC body 101/209 is mated with NFC module 102/210, the side of the NFC model with the ferrite faces away from FPC body 101/209 (i.e., the ferrite must not be sandwiched between FPC body 101/209 and the NFC model).
In some exemplary embodiments, the FPC (Flexible Printed Circuit) is a Flexible Printed Circuit board with high reliability and excellent quality, which is made of a polyimide or polyester film as a base material.
In some exemplary embodiments, the FPC has high wiring density, light weight, thin thickness, and good bendability.
In some exemplary embodiments, the FPC integrated with the NFC antenna may further include a component section including a capacitor and/or a resistor and/or a diode.
In some exemplary embodiments, the capacitor, acts as a voltage regulator or filter.
In some exemplary embodiments, the resistor, acts as a pull-up or electrostatic protection.
In some exemplary embodiments, the diode functions as an electrostatic protection or prevents voltage from flowing backward.
In some exemplary embodiments, NFC (Near Field Communication).
In some exemplary embodiments, the FPC integrated with the NFC antenna according to the embodiment of the present invention integrates the NNFC module 102/210 and the FPC body 101/209, so that the risk of insufficient soldering caused by soldering between the separate NFC and the separate FPC is avoided.
In some exemplary embodiments, the FPC integrated with the NFC antenna according to the embodiments of the present invention integrates the NFC module 102/210 and the FPC body 101/209, so that the cost is reduced, the assembly is not required, the soldering step is saved, and the problem of misalignment is avoided.
Example 2
Fig. 2 is a schematic structural diagram of a display module according to an embodiment of the invention, and the display module according to the embodiment of the invention will be described in detail with reference to fig. 2.
The display module of the embodiment of the invention comprises: an upper glass substrate layer 202 and a lower glass substrate layer 201.
In some exemplary embodiments, the lower glass substrate layer 201 is larger in size than the upper glass substrate layer 202.
In some exemplary embodiments, the lower glass substrate layer 201 fully covers the upper glass substrate layer 202.
In some exemplary embodiments, the lower glass substrate layer 201 includes an underlying glass.
In some exemplary embodiments, the upper glass substrate layer 202 comprises an upper glass layer.
In some exemplary embodiments, the bonding region 203 is provided in a region where the lower glass substrate layer 201 is larger than the upper glass substrate layer 202 (in the figure, the lower glass substrate layer 201 is larger than the upper glass substrate layer 202 for a more obvious size relationship between the two surfaces, and the lower glass substrate layer 201 may be larger than the upper glass substrate layer 202 only when the bonding region 203 needs to be established).
In some exemplary embodiments, the upper and lower glass substrate layers 202, 201 may also be sized as needed for the actual binding bend.
In some exemplary embodiments, the bonding region 203 comprises an FPC bonding region.
In some exemplary embodiments, the FPC bonding area is used for bonding the FPC of the set NFC antenna of the above embodiments.
In some exemplary embodiments, the bonding region 203 further includes a FOG bonding region, where the FOG bonding region is used to bond the FPC and the display glass of the integrated NFC antenna of the above embodiments; the binding process adopts Anisotropic Conductive Film (ACF) to realize electrical connection.
In some exemplary embodiments, a second bonding region (not shown) is further disposed on an opposite side of the bonding region 203, and the second bonding region is used for bonding the touch FPC 204.
In some exemplary embodiments, when the display module of the embodiment of the application is assembled, and the NFC module 102/210 is attached to the FPC body 101/209, the ferrite on the NFC module 102/210 is on a side of the NFC module 102/210 facing away from the FPC body 101/209; in addition, when the FPC of the NFC antenna is assembled with the display module, the ferrite is arranged on the outer layer of the back of the display module.
In some exemplary embodiments, the display module according to the embodiments of the present invention employs the FPC integrated with the NFC antenna, and the problem of soldering between the FPC and the NFC antenna does not occur, so that the product stability is improved, and the market competitiveness is further improved.
Example 3
In the structure of the electronic device according to the embodiment of the present invention, in a hardware level, the electronic device includes a processor, and optionally further includes a bus, a network interface, and a memory. The Memory may include a Memory, such as a Random-Access Memory (RAM), and may further include a non-volatile Memory, such as at least 1 disk Memory. Of course, the electronic device may also include hardware required for other services.
The processor, the network interface, and the memory may be connected to each other via a bus, which may be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc.
And the memory is used for storing programs. In particular, the program may include program code including computer operating instructions.
In some exemplary embodiments, the electronic device includes the FPC integrated with the NFC antenna described above.
In some exemplary embodiments, a display device is mounted on the electronic device, and the display device employs the display module of the above embodiments.
In some exemplary embodiments, the electronic device comprises a smart wearable device (e.g., a smart watch, a smart bracelet, etc.).
Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An FPC integrated with an NFC antenna, comprising:
the FPC comprises an FPC body, a plurality of wiring layers and a plurality of connecting wires, wherein the FPC body comprises a plurality of wiring layers;
the NFC module comprises an NFC wiring layer;
a bending part is further arranged at the edge of the FPC body and is communicated with the FPC body and the NFC module;
the bending part comprises a bending part routing layer;
the FPC body comprises at least one wiring layer, a bending part wiring layer and an NFC wiring layer which are integrally formed.
2. The FPC integrated with an NFC antenna according to claim 1, wherein the bent part routing layer comprises mesh copper, and the size of the mesh copper of the bent part routing layer is larger than that of the mesh copper of the FPC body routing layer.
3. The FPC assembly of NFC antenna of claim 1, wherein the number of routing layers of the bending portion is less than the number of routing layers of the FPC body.
4. The FPC integrated with an NFC antenna according to claim 1, wherein the bending portion includes an NFC protection layer disposed on one side of the NFC routing layer.
5. The FPC of claim 4, wherein the NFC protection layer comprises a green oil coating.
6. The FPC of a set NFC antenna of claim 4, wherein the NFC protection layer comprises a frame-type NFC protection layer.
7. The FPC integrated with an NFC antenna according to claim 5 or 6, wherein the NFC module further comprises:
a ferrite disposed on the NFC protective layer.
8. The FPC integrated with an NFC antenna according to claim 1, further comprising FOF bonding areas for bonding COF ICs.
9. A display module comprising the FPC integrated with an NFC antenna according to any one of claims 1 to 8.
10. An electronic device, characterized by comprising the FPC integrated with an NFC antenna according to any one of claims 1 to 8, or the display module according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210520856.6A CN114828390A (en) | 2022-05-12 | 2022-05-12 | FPC (flexible printed circuit), display module and electronic equipment with NFC (near field communication) antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210520856.6A CN114828390A (en) | 2022-05-12 | 2022-05-12 | FPC (flexible printed circuit), display module and electronic equipment with NFC (near field communication) antenna |
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| Publication Number | Publication Date |
|---|---|
| CN114828390A true CN114828390A (en) | 2022-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210520856.6A Pending CN114828390A (en) | 2022-05-12 | 2022-05-12 | FPC (flexible printed circuit), display module and electronic equipment with NFC (near field communication) antenna |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577370A (en) * | 2017-08-31 | 2018-01-12 | 北京小米移动软件有限公司 | Contactor control device and electronic equipment |
| CN207427559U (en) * | 2017-09-11 | 2018-05-29 | 广东乐芯智能科技有限公司 | A kind of FPC welding points bending structure |
| CN208190699U (en) * | 2018-03-22 | 2018-12-04 | 比亚迪股份有限公司 | Integrated circuit board and mobile terminal |
| CN211128572U (en) * | 2019-12-24 | 2020-07-28 | 深圳市实佳电子有限公司 | Wearable equipment with NFC function |
| CN113923863A (en) * | 2021-09-30 | 2022-01-11 | 京东方科技集团股份有限公司 | Flexible circuit device, display module and electronic device |
-
2022
- 2022-05-12 CN CN202210520856.6A patent/CN114828390A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107577370A (en) * | 2017-08-31 | 2018-01-12 | 北京小米移动软件有限公司 | Contactor control device and electronic equipment |
| CN207427559U (en) * | 2017-09-11 | 2018-05-29 | 广东乐芯智能科技有限公司 | A kind of FPC welding points bending structure |
| CN208190699U (en) * | 2018-03-22 | 2018-12-04 | 比亚迪股份有限公司 | Integrated circuit board and mobile terminal |
| CN211128572U (en) * | 2019-12-24 | 2020-07-28 | 深圳市实佳电子有限公司 | Wearable equipment with NFC function |
| CN113923863A (en) * | 2021-09-30 | 2022-01-11 | 京东方科技集团股份有限公司 | Flexible circuit device, display module and electronic device |
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