CN115020286A - Method and system for sorting and picking crystal grains - Google Patents
Method and system for sorting and picking crystal grains Download PDFInfo
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Abstract
The invention provides a method and a system for sorting and picking crystal grains, wherein the method comprises the steps of carrying out image scanning on the crystal grains to obtain a first scanning figure file, determining the coordinate positions of all the crystal grains, then carrying out testing and image scanning on the crystal grains, outputting the testing data and a second scanning figure file of the crystal grains, carrying out image combination processing on the first scanning figure file and the second scanning figure file to obtain a first target figure file, then comparing the coordinate position of a special soldier crystal grain in the first target figure file with the first scanning figure file, if the coordinate position of the special soldier crystal grain in the first target figure file is qualified, obtaining the testing data, then carrying out automatic optical detection and sorting on the crystal grains, carrying out image combination processing and consistency comparison of the coordinate positions of the special soldier crystal grains in each process, and after the comparison is qualified, sorting the standard crystal grains according to the testing data and the corresponding second coordinate position The alignment of the special soldier crystal grains is carried out before and after optical detection and sorting, so that the problem of error in crystal grain sorting is effectively prevented.
Description
Technical Field
The invention relates to the technical field of chip back-end processes, in particular to a method and a system for sorting and picking crystal grains.
Background
With the rise of small-distance display, the mini LED (sub-millimeter light emitting diode) chip has taken down a great market share with the advantages of rich color, energy conservation, long service life, lightness and the like, and the mini LED chip gradually steps into the mass production stage, certainly along with a series of problems, especially the sorting and sorting problem of the rear-stage crystal grains of the mini LED chip.
The traditional crystal grain sorting and sorting needs to be subjected to the processes of testing, AOI, sorting and the like, the positions of the crystal grains need to be checked in each process so as to avoid the situation of wrong alignment, but in the process of checking the positions of the crystal grains, the checked areas are too few, so that the situation of crystal grain dislocation occurs, and finally, the sorting and sorting errors are caused.
Disclosure of Invention
Therefore, the present invention is directed to a method and a system for sorting and picking die, so as to solve the problem of errors in sorting and picking die in the prior art.
According to an embodiment of the present invention, there is provided a sorting method for a die, the method including:
placing crystal grains in an array, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, and the standard crystal grains are uniformly distributed around the special standard crystal grains;
carrying out image scanning on the crystal grains, outputting a first scanning image file, and determining a first coordinate position of the special soldier crystal grains and a second coordinate position of the standard crystal grains according to the first scanning image file;
testing the crystal grain, scanning an image after the testing is finished, and outputting bin value data and a second scanning image file of the crystal grain;
combining the first scanning image file and the second scanning image file to obtain a first target image file, and acquiring a third coordinate position of the special soldier crystal grain in the first target image file;
judging whether the third coordinate position is consistent with the first coordinate position or not;
if yes, acquiring bin value data, performing automatic optical detection and image scanning on the crystal grains, and outputting a third scanning image file;
combining the first target image file and the third scanning image file to obtain a second target image file, and acquiring a fourth coordinate position of the special soldier crystal grain in the second target image file;
judging whether the fourth coordinate position is consistent with the first coordinate position or not;
if yes, sorting and image scanning the crystal grains, and outputting a fourth scanning picture file;
combining the second target image file and the fourth scanning image file to obtain a third target image file, and acquiring a fifth coordinate position of the special soldier crystal grain in the third target image file;
judging whether the fifth coordinate position is consistent with the first coordinate position;
and if so, picking the standard crystal grain according to the bin value data and the corresponding second coordinate position.
Further, the step of placing the dies in an array, the dies including a special target die and a standard die, wherein the step of uniformly distributing the standard die around the special target die comprises:
obtaining the chip size of an LED chip for preparing crystal grains, wherein the chip size comprises the length and the width of a chip, and respectively determining the row spacing and the column spacing of the special soldier crystal grains according to the length and the width of the chip;
defining the array according to the row spacing and the column spacing, and establishing a coordinate system, wherein the array consists of a plurality of frames, each frame corresponds to a coordinate position, and the frames are used for placing the crystal grains so as to limit the positions of the crystal grains.
Further, the step of obtaining the chip size of the LED chip for preparing the crystal grain, where the crystal grain includes a special soldier crystal grain and a standard crystal grain, and the chip size includes a chip length and a chip width, and the step of respectively determining the row spacing and the column spacing of the special soldier crystal grain according to the chip length and the chip width includes:
and dividing the length of the chip and the width of the chip by a spacing parameter respectively to obtain the corresponding row spacing and the corresponding column spacing.
Further, the step of performing image scanning on the crystal grain, outputting a first scanning image file, and determining a first coordinate position of the special soldier crystal grain and a second coordinate position of the standard crystal grain according to the first scanning image file includes:
acquiring a special soldier graph of the special soldier crystal grain and a standard graph of the standard crystal grain, and respectively determining the sashes where the special soldier graph and the standard graph are located according to the special soldier graph and the standard graph;
and acquiring the first coordinate position and the second coordinate position according to the sash and the coordinate system.
Further, in the step of combining the first scanned drawing file and the second scanned drawing file to obtain the first target drawing file, a first sash of the first scanned drawing file and a second sash of the second scanned drawing file are obtained, and the first sash and the second sash are overlapped to obtain the first target drawing file.
Further, the step of picking the standard die according to the bin data and the corresponding second coordinate position includes:
dividing the array into a plurality of blocks by taking the special soldier crystal grain as a center, wherein the blocks comprise a plurality of standard crystal grains;
and picking the standard crystal grains from the block according to the bin value data and the corresponding second coordinate position.
Further, the step of picking the standard die from the block according to the bin data and the corresponding second coordinate position comprises:
and identifying the corresponding special soldier crystal grain in the block every preset time so as to correct the standard crystal grain in the block.
Further, in the step of testing the crystal grain, performing image scanning after the test is finished, and outputting bin value data of the crystal grain and the second scanning image file, the bin value data of the special model crystal grain is preset bin value data.
Another aspect of the embodiments of the present invention provides a sorting system for dies, the system comprising:
the placement module is used for placing crystal grains in the array, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, and the standard crystal grains are uniformly distributed around the special standard crystal grains;
the image scanning module is used for carrying out image scanning on the crystal grains, outputting a first scanning image file, and determining a first coordinate position of the special soldier crystal grains and a second coordinate position of the standard crystal grains according to the first scanning image file;
the testing module is used for testing the crystal grains, scanning images after the testing is finished, and outputting bin value data and a second scanning image file of the crystal grains;
the first image combination processing module is used for carrying out image combination processing on the first scanning image file and the second scanning image file to obtain a first target image file and obtain a third coordinate position of the special soldier crystal grain in the first target image file;
the first judgment module is used for judging whether the third coordinate position is consistent with the first coordinate position;
an optical detection module, configured to, when it is determined that the third coordinate position is consistent with the first coordinate position, obtain the bin value data, perform automatic optical detection and image scanning on the grain, and output a third scanning image file;
the second image combination processing module is used for carrying out image combination processing on the first target image file and the third scanning image file to obtain a second target image file and obtain a fourth coordinate position of the special soldier crystal grain in the second target image file;
the second judgment module is used for judging whether the fourth coordinate position is consistent with the first coordinate position;
the sorting module is used for sorting and image scanning the crystal grains and outputting a fourth scanning image file when the fourth coordinate position is judged to be consistent with the first coordinate position;
the third image combination processing module is used for carrying out image combination processing on the second target image file and the fourth scanning image file to obtain a third target image file and obtain a fifth coordinate position of the special soldier crystal grain in the third target image file;
the third judging module is used for judging whether the fifth coordinate position is consistent with the first coordinate position;
and the picking module is used for picking the standard crystal grain according to the bin value data and the corresponding second coordinate position when the fifth coordinate position is judged to be consistent with the first coordinate position.
Further, the system further comprises:
the distance determining module is used for obtaining the chip size of an LED chip for preparing crystal grains, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, the chip size comprises the chip length and the chip width, and the line distance and the column distance of the special standard crystal grains are respectively determined according to the chip length and the chip width;
and the coordinate system establishing module is used for defining the array according to the row spacing and the column spacing and establishing a coordinate system, wherein the array consists of a plurality of frames, each frame corresponds to a coordinate position, and the frames are used for placing the crystal grains so as to limit the positions of the crystal grains.
Compared with the prior art: the method comprises placing special soldier crystal grains and standard crystal grains in an array, scanning to obtain a first scanning image file, determining coordinate positions of all crystal grains according to the first scanning image file, testing and scanning the crystal grains, outputting bin data of the crystal grains and a second scanning image file, combining the first scanning image file and the second scanning image file to obtain a first target image file, comparing the coordinate position of the special soldier crystal grains in the first target image file with that of the first scanning image file, if the coordinate position is the same, obtaining bin data, performing automatic optical detection and image scanning on the crystal grains, outputting a third scanning image file, combining the first target image file with the third scanning image file to obtain a second target image file, and comparing the coordinate position of the special soldier crystal grains in the second target image file with that of the first scanning image file, if the coordinate position is the same, the crystal grains are sorted and image-scanned, a fourth scanning image file is output, the second target image file and the fourth scanning image file are combined to be processed to obtain a third target image file, then the coordinate position of the special soldier crystal grains in the third target image file is compared with the first scanning image file, if the coordinate position is the same, the standard crystal grains are picked according to bin value data and the corresponding second coordinate position, and the method effectively prevents the error problem of grain sorting and picking by carrying out the alignment of the special soldier crystal grains before and after bin value testing, optical detection and sorting.
Drawings
Fig. 1 is a flow chart of a sorting method for dies according to a first embodiment of the invention;
fig. 2 is a flow chart of a sorting system for dies according to a second embodiment of the invention.
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Several embodiments of the invention are presented in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
Referring to fig. 1, a method for sorting dies according to a first embodiment of the invention is shown, which includes steps S01 to S12.
Step S01, placing crystal grains in an array, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, and the standard crystal grains are uniformly distributed around the special standard crystal grains.
In the embodiment, in order to use the special soldier crystal grain as the reference point, thereby the standard crystal grain evenly distributed around the special soldier crystal grain is identified, different patterns are arranged on the surfaces of the special soldier crystal grain and the standard crystal grain, wherein, the pattern of the special soldier crystal grain is a 7-shaped pattern, because the 7-shaped pattern is an asymmetric pattern, and the edge and corner are clear, the rapid identification is convenient in the image identification process, and meanwhile, the error is not easy to occur.
It should be noted that the arrangement of the array is related to the chip size of the LED chip for preparing the dies, where the chip size includes a chip length and a chip width, and the row pitch and the column pitch of the special soldier dies are respectively determined according to the chip length and the chip width, and specifically, the chip length and the chip width are respectively divided by the pitch parameter to obtain the corresponding row pitch and column pitch, for example, the chip length and the chip width are respectively 150 μm and 60 μm, in this embodiment, the pitch parameter is 5, the row pitch is 30 μm, and the column pitch is 12 μm, it can be understood that the interval of the special soldier dies in each row is 30 μm, and the interval of the special soldier dies in each column is 12 μm, so as to define the array, and establish the coordinate system.
The array is composed of a plurality of frames, each frame corresponds to a coordinate position, the frames are used for placing crystal grains to limit the positions of the crystal grains, and specifically, when the special soldier crystal grains are placed in the frames in the array, the frames for placing the standard crystal grains are not positioned in the same row or the same column of the special soldier crystal grains, namely, a plurality of standard crystal grains are contained in a rectangle formed by enclosing four mutually adjacent special soldier crystal grains.
Step S02, performing image scanning on the crystal grain, outputting a first scanning image file, and determining a first coordinate position of the special soldier crystal grain and a second coordinate position of the standard crystal grain according to the first scanning image file.
Specifically, a special soldier graph of the special soldier crystal grain and a standard graph of the standard crystal grain are obtained, frames where the special soldier graph and the standard graph are located, namely the frame where the 7-shaped pattern is located and the frame where the non-7-shaped pattern is located are respectively determined according to the special soldier graph and the standard graph, and a first coordinate position and a second coordinate position are obtained according to the frames and a coordinate system.
Step S03, testing the die, performing image scanning after the test is finished, and outputting bin value data and a second scanning image file of the die.
It should be noted that the dies are sorted according to the size of the bin value, that is, the dies within a bin value range are sorted into one class, so the testing of the dies is a more critical process, the testing process often needs to contact the dies through a probe, and during the contact, a situation of offset may occur, in order to check the situation of offset, after the testing is finished, an image scan is performed, and bin data of all the dies and a second scan image file are output, wherein, in order to further distinguish the special soldier dies from the standard dies, the bin data of the special soldier dies is preset bin data, and in this embodiment, the preset bin data is 1000 bins.
Step S04, combining the first scanned image file and the second scanned image file to obtain a first target image file, and obtaining a third coordinate position of the special soldier crystal grain in the first target image file.
The method comprises the steps of obtaining a first frame of a first scanning image file and a second frame of a second scanning image file, superposing the first frame and the second frame to obtain a first target image file, wherein the positions of the frames in the scanning image file are fixed, the positions of crystal grains may change in the operation process, for example, the crystal grains rotate at a certain angle and shift to other frames, and the like.
Step S05, determining whether the third coordinate position is consistent with the first coordinate position, if yes, executing step S06.
It can be understood that when the third coordinate position is consistent with the first coordinate position, it indicates that each of the special soldier crystal grains is located in its respective sash, and the standard crystal grains within the area controlled by each of the special soldier crystal grains are also located in the sash.
Step S06, the bin value data is obtained, the crystal grain is automatically and optically detected and image scanned, and a third scanning picture file is output.
Step S07, combining the first target drawing file and the third scanned drawing file to obtain a second target drawing file, and obtaining a fourth coordinate position of the special soldier crystal grain in the second target drawing file.
Step S08, determining whether the fourth coordinate position is consistent with the first coordinate position, if yes, executing step S09.
In step S09, the die is sorted and image-scanned, and a fourth scan image file is output.
Step S10, combining the second target drawing file and the fourth scanned drawing file to obtain a third target drawing file, and obtaining a fifth coordinate position of the special soldier crystal grain in the third target drawing file.
Step S11, determining whether the fifth coordinate position is consistent with the first coordinate position, if yes, executing step S12.
Step S12, the standard die is picked according to the bin data and the corresponding second coordinate position.
In the present embodiment, the array is divided into several blocks with a special model die as the center, the blocks include several standard dies, wherein the number of the blocks can be set according to the number of the special model crystal grains, and the special model crystal grains are taken as the center, selecting standard dies from the block according to the bin value data and the corresponding second coordinate position, a standard die may be located by a particular soldier die into a block managed by this particular soldier die, can improve the accuracy and efficiency of sorting and picking, in addition, because the possibility of shrinking the film can occur in the picking process, namely, the position of the standard crystal grain is deviated, and the corresponding special model crystal grain in the block is identified by every preset time interval, the block can be quickly positioned, and the standard crystal grains in the block can be corrected, thereby effectively preventing positioning failure and crystal grain picking errors caused by film shrinkage.
In summary, the embodiment of the invention obtains the first scanning image file by placing the special soldier crystal grain and the standard crystal grain in the array and scanning the image, determines the coordinate position of all the crystal grains according to the first scanning image file, then tests and scans the crystal grains, outputs the bin value data of the crystal grains and the second scanning image file, combines the first scanning image file and the second scanning image file to obtain the first target image file, then compares the coordinate position of the special soldier crystal grain in the first target image file with the first scanning image file, if the coordinate position is the same, obtains the bin value data, automatically and optically detects and scans the crystal grains, outputs the third scanning image file, processes the first target image file and the third scanning image file to obtain the second target image file, then compares the coordinate position of the special soldier crystal grain in the second target image file with the first scanning image file, if the coordinate position is the same, the crystal grains are sorted and image-scanned, a fourth scanning image file is output, the second target image file and the fourth scanning image file are combined to obtain a third target image file, the coordinate position of the special soldier crystal grain in the third target image file is compared with the first scanning image file, if the coordinate position is the same, the standard crystal grain is picked according to bin value data and the corresponding second coordinate position, the method effectively prevents the error problem of grain sorting and selecting by aligning the special soldier crystal grains before and after bin value test, optical detection and sorting, particularly, identifying the corresponding special soldier crystal grains in the block at intervals of a preset time, the block can be quickly positioned, and the standard crystal grains in the block can be corrected, thereby effectively preventing positioning failure caused by film shrinkage and further improving the accuracy of sorting and picking.
Example two
Referring to fig. 2, the sorting system 200 for die according to an embodiment of the present invention includes: a placing module 201, an image scanning module 202, a testing module 203, a first image combining processing module 204, a first judging module 205, an optical detecting module 206, a second image combining processing module 207, a second judging module 208, a sorting module 209, a third image combining processing module 210, a third judging module 211 and a picking module 212, wherein:
the placement module 201 is used for placing crystal grains in an array, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, and the standard crystal grains are uniformly distributed around the special standard crystal grains;
the image scanning module 202 is configured to perform image scanning on the crystal grain, output a first scanning image file, and determine a first coordinate position of the special soldier crystal grain and a second coordinate position of the standard crystal grain according to the first scanning image file;
the test module 203 is configured to test the grain, perform image scanning after the test is finished, and output bin value data of the grain and a second scanning image file, where the bin value data of the special model grain is preset bin value data;
a first mapping processing module 204, configured to map the first scanned image file and the second scanned image file to obtain a first target image file, and obtain a third coordinate position of the special soldier crystal grain in the first target image file;
a first determining module 205, configured to determine whether the third coordinate position is consistent with the first coordinate position;
an optical detection module 206, configured to, when it is determined that the third coordinate position is consistent with the first coordinate position, obtain the bin value data, perform automatic optical detection and image scanning on the die, and output a third scanning image file;
a second mapping processing module 207, configured to map the first target image file and the third scanned image file to obtain a second target image file, and obtain a fourth coordinate position of the special soldier crystal grain in the second target image file;
a second determining module 208, configured to determine whether the fourth coordinate position is consistent with the first coordinate position;
a sorting module 209, configured to, when it is determined that the fourth coordinate position is consistent with the first coordinate position, sort and image-scan the crystal grain, and output a fourth scan image file;
a third mapping processing module 210, configured to map the second target image file and the fourth scanned image file to obtain a third target image file, and obtain a fifth coordinate position of the special soldier crystal grain in the third target image file;
a third determining module 211, configured to determine whether the fifth coordinate position is consistent with the first coordinate position;
and a picking module 212, configured to pick the standard die according to the bin value data and the corresponding second coordinate position when it is determined that the fifth coordinate position is consistent with the first coordinate position.
Further, the sorting system 200 for dies further includes:
the spacing determining module is used for obtaining the chip size of an LED chip for preparing crystal grains, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, the chip size comprises the chip length and the chip width, and the line spacing and the column spacing of the special standard crystal grains are respectively determined according to the chip length and the chip width;
and the coordinate system establishing module is used for defining the array according to the row spacing and the column spacing and establishing a coordinate system, wherein the array consists of a plurality of frames, each frame corresponds to a coordinate position, and the frames are used for placing the crystal grains so as to limit the positions of the crystal grains.
Further, the distance determination module includes:
and the computing unit is used for dividing the chip length and the chip width by the space parameters respectively to obtain the corresponding row space and the corresponding column space.
Further, the image scanning module 202 includes:
the sash determining unit is used for acquiring a special soldier graph of the special soldier crystal grain and a standard graph of the standard crystal grain, and respectively determining the sashes where the special soldier graph and the standard graph are located according to the special soldier graph and the standard graph;
and the coordinate position acquisition unit is used for acquiring the first coordinate position and the second coordinate position according to the sash and the coordinate system.
Further, the first graph combining processing module 204 includes:
and the sash coincidence unit is used for acquiring a first sash of the first scanning drawing file and a second sash of the second scanning drawing file, and coinciding the first sash and the second sash to obtain a first target drawing file.
Further, the picking module 212 includes:
the partitioning unit is used for dividing the array into a plurality of blocks by taking the special soldier crystal grain as a center, and each block comprises a plurality of standard crystal grains;
and the picking unit is used for picking the standard crystal grains from the block according to the bin value data and the corresponding second coordinate position.
Further, the picking module 212 further includes:
and the correcting unit is used for identifying the corresponding special soldier crystal grain in the block at every preset time interval so as to correct the standard crystal grain in the block.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for sorting and picking die, the method comprising:
placing crystal grains in an array, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, and the standard crystal grains are uniformly distributed around the special standard crystal grains;
carrying out image scanning on the crystal grains, outputting a first scanning image file, and determining a first coordinate position of the special soldier crystal grains and a second coordinate position of the standard crystal grains according to the first scanning image file;
testing the crystal grain, scanning an image after the testing is finished, and outputting bin value data and a second scanning image file of the crystal grain;
combining the first scanning image file and the second scanning image file to obtain a first target image file, and acquiring a third coordinate position of the special soldier crystal grain in the first target image file;
judging whether the third coordinate position is consistent with the first coordinate position or not;
if yes, acquiring bin value data, performing automatic optical detection and image scanning on the crystal grains, and outputting a third scanning image file;
combining the first target image file and the third scanning image file to obtain a second target image file, and acquiring a fourth coordinate position of the special soldier crystal grain in the second target image file;
judging whether the fourth coordinate position is consistent with the first coordinate position or not;
if yes, sorting and image scanning the crystal grains, and outputting a fourth scanning picture file;
combining the second target image file and the fourth scanning image file to obtain a third target image file, and acquiring a fifth coordinate position of the special soldier crystal grain in the third target image file;
judging whether the fifth coordinate position is consistent with the first coordinate position;
and if so, picking the standard crystal grain according to the bin value data and the corresponding second coordinate position.
2. The method of sorting dies according to claim 1, wherein the step of placing dies in an array, the dies including a special monster die and a standard die, wherein the standard die is evenly distributed around the special monster die comprises:
obtaining the chip size of an LED chip for preparing crystal grains, wherein the chip size comprises the length and the width of a chip, and respectively determining the row spacing and the column spacing of the special soldier crystal grains according to the length and the width of the chip;
defining the array according to the row spacing and the column spacing, and establishing a coordinate system, wherein the array consists of a plurality of frames, each frame corresponds to a coordinate position, and the frames are used for placing the crystal grains so as to limit the positions of the crystal grains.
3. The die sorting method according to claim 2, wherein the step of obtaining chip sizes of LED chips used for manufacturing the dies, the dies including a special-standard die and a standard die, the chip sizes including a chip length and a chip width, and the step of determining the row pitch and the column pitch of the special-standard die respectively according to the chip length and the chip width comprises:
and dividing the length of the chip and the width of the chip by a spacing parameter respectively to obtain the corresponding row spacing and the corresponding column spacing.
4. The method of claim 2, wherein the step of image scanning the die, outputting a first scan pattern file, and determining the first coordinate position of the special target die and the second coordinate position of the standard die according to the first scan pattern file comprises:
acquiring a special soldier graph of the special soldier crystal grain and a standard graph of the standard crystal grain, and respectively determining the sashes where the special soldier graph and the standard graph are located according to the special soldier graph and the standard graph;
and acquiring the first coordinate position and the second coordinate position according to the sash and the coordinate system.
5. The method of claim 1, wherein the step of combining the first and second scanned drawing files to obtain the first target drawing file comprises obtaining a first frame of the first scanned drawing file and a second frame of the second scanned drawing file, and overlapping the first frame and the second frame to obtain the first target drawing file.
6. The die sorting method according to claim 1, wherein the step of sorting the standard die according to the bin data and the corresponding second coordinate position comprises:
dividing the array into a plurality of blocks by taking the special soldier crystal grain as a center, wherein the blocks comprise a plurality of standard crystal grains;
and picking the standard crystal grains from the block according to the bin value data and the corresponding second coordinate position.
7. The die sorting method according to claim 6, wherein the step of sorting the standard die from the block according to the bin data and the corresponding second coordinate position comprises:
and identifying the corresponding special soldier crystal grain in the block every preset time so as to correct the standard crystal grain in the block.
8. The method as claimed in claim 1, wherein the bin data of the specific model die is predetermined bin data in the step of testing the die, scanning the die after the testing, and outputting the bin data of the die and the second scan pattern.
9. A sorting system for dies, the system comprising:
the placement module is used for placing crystal grains in the array, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, and the standard crystal grains are uniformly distributed around the special standard crystal grains;
the image scanning module is used for carrying out image scanning on the crystal grains, outputting a first scanning image file, and determining a first coordinate position of the special soldier crystal grains and a second coordinate position of the standard crystal grains according to the first scanning image file;
the testing module is used for testing the crystal grains, scanning images after the testing is finished, and outputting bin value data and a second scanning image file of the crystal grains;
the first image combination processing module is used for carrying out image combination processing on the first scanning image file and the second scanning image file to obtain a first target image file and obtain a third coordinate position of the special soldier crystal grain in the first target image file;
the first judgment module is used for judging whether the third coordinate position is consistent with the first coordinate position;
an optical detection module, configured to, when it is determined that the third coordinate position is consistent with the first coordinate position, obtain the bin value data, perform automatic optical detection and image scanning on the grain, and output a third scanning image file;
the second image combination processing module is used for carrying out image combination processing on the first target image file and the third scanning image file to obtain a second target image file and obtain a fourth coordinate position of the special soldier crystal grain in the second target image file;
the second judgment module is used for judging whether the fourth coordinate position is consistent with the first coordinate position;
the sorting module is used for sorting and image scanning the crystal grains and outputting a fourth scanning image file when the fourth coordinate position is judged to be consistent with the first coordinate position;
the third image combination processing module is used for carrying out image combination processing on the second target image file and the fourth scanning image file to obtain a third target image file and obtain a fifth coordinate position of the special soldier crystal grain in the third target image file;
the third judging module is used for judging whether the fifth coordinate position is consistent with the first coordinate position;
and the picking module is used for picking the standard crystal grain according to the bin value data and the corresponding second coordinate position when the fifth coordinate position is judged to be consistent with the first coordinate position.
10. The sorting system for dies according to claim 9, further comprising:
the distance determining module is used for obtaining the chip size of an LED chip for preparing crystal grains, wherein the crystal grains comprise special standard crystal grains and standard crystal grains, the chip size comprises the chip length and the chip width, and the line distance and the column distance of the special standard crystal grains are respectively determined according to the chip length and the chip width;
and the coordinate system establishing module is used for defining the array according to the row spacing and the column spacing and establishing a coordinate system, wherein the array consists of a plurality of frames, each frame corresponds to a coordinate position, and the frames are used for placing the crystal grains so as to limit the positions of the crystal grains.
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| CN115346901A (en) * | 2022-10-17 | 2022-11-15 | 江西兆驰半导体有限公司 | LED wafer sorting method |
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| KR20160052198A (en) * | 2014-11-04 | 2016-05-12 | 세메스 주식회사 | Method of obtaining location information of dies |
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