CN115020274A - Cleaning device - Google Patents

Cleaning device Download PDF

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Publication number
CN115020274A
CN115020274A CN202210195968.9A CN202210195968A CN115020274A CN 115020274 A CN115020274 A CN 115020274A CN 202210195968 A CN202210195968 A CN 202210195968A CN 115020274 A CN115020274 A CN 115020274A
Authority
CN
China
Prior art keywords
spindle
chuck table
main shaft
cleaning
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210195968.9A
Other languages
Chinese (zh)
Inventor
畑亮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN115020274A publication Critical patent/CN115020274A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Confectionery (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Sealing Using Fluids, Sealing Without Contact, And Removal Of Oil (AREA)

Abstract

The invention provides a cleaning device, which can block the communication between the space of a main shaft unit side and a cleaning chamber for accommodating a chuck worktable for a long time. The seal portion for blocking the communication between the space between the housing and the spindle and the cleaning chamber has a magnetic fluid in contact with the spindle. Therefore, the communication between the space and the cleaning chamber can be blocked without bringing the solids into contact with each other. As a result, wear of the seal portion caused by rotation of the main shaft can be reduced, and communication between the space and the cleaning chamber can be blocked for a long period of time.

Description

Cleaning device
Technical Field
The present invention relates to a cleaning apparatus.
Background
In a manufacturing process of various electronic components such as a semiconductor device chip, a plate-shaped object to be processed such as a silicon wafer, a glass substrate, or a resin package substrate on which a device is formed is processed using a cutting tool, a laser beam, or the like. When the workpiece is machined in this way, machining chips such as chips and shavings may be generated and adhere to the front surface of the workpiece.
Therefore, the workpiece is cleaned after processing, for example, in a cleaning apparatus having a cleaning chamber in which a chuck table having a flat holding surface and a nozzle for supplying a cleaning liquid to the holding surface are accommodated. The chuck table is generally capable of generating a negative pressure in a space on the holding surface to suck the workpiece and generating a positive pressure in the space on the holding surface to separate from the workpiece, and is rotatable about a straight line passing through the center of the holding surface and perpendicular to the holding surface as a rotation axis.
In this cleaning device, the cleaning liquid is supplied from the nozzle to the front surface of the workpiece in a state where the back surface side of the workpiece is sucked and held by the chuck table and the chuck table is rotated. Thereby, the chips or scraps adhering to the front surface of the workpiece are removed. The chuck table used in this way is rotatably supported by the spindle unit.
The spindle unit has: a spindle supporting the chuck table; and a bearing that rotatably supports the main shaft. Then, by operating a motor connected to an end of the spindle, the chuck table rotates together with the spindle. In addition, in order to prevent a lubricant such as grease provided inside the bearing from scattering around, the main shaft and the bearing are housed in a housing in the main shaft unit.
The space on the holding surface of the chuck table communicates with the negative pressure supply pipe and the positive pressure supply pipe connected to the housing via a negative pressure or positive pressure supply pipe formed inside the spindle and a pressure variable portion as a space defined by an oil seal between the housing and the spindle. Then, a negative pressure is generated in the space above the holding surface by operating a negative pressure supply source connected to a negative pressure supply pipe, and a positive pressure is generated in the space above the holding surface by operating a positive pressure supply source connected to a positive pressure supply pipe. In many cases, lubricating oil is provided at the interface between the oil seal and the main shaft so as not to hinder the rotation of the main shaft.
Here, the spindle has an end portion protruding from the housing so as to be coupled to the chuck table. In addition, an opening into which an end of the spindle is inserted is provided in a cleaning chamber that houses the chuck table. Therefore, the space between the housing and the spindle may communicate with the cleaning chamber through the opening. In this case, the lubricant scattered from the bearing and/or the lubricant scattered from the interface between the oil seal and the main shaft may be mixed into the cleaning chamber and adhere to the front surface of the workpiece.
Therefore, in the apparatus having such a chuck table, a seal member is generally provided to block communication between the space on the chuck table side and the space on the spindle unit side (see, for example, patent document 1). The seal member is formed of, for example, a V-ring, and is provided so that a lip portion contacts a rotatable sealed portion.
Patent document 1: japanese patent laid-open publication No. 2018-73930
When the sealing member contacts the rotatable sealed portion, the sealing member is worn away as the sealed portion rotates, and therefore it is difficult to block the communication between the space on the chuck table side and the space on the spindle unit side for a long period of time.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a cleaning apparatus capable of blocking communication between a space on the spindle unit side and a cleaning chamber in which a chuck table is housed for a long period of time.
According to the present invention, there is provided a cleaning apparatus having: a chuck table for holding a workpiece by a holding surface; a nozzle for supplying a cleaning liquid to the workpiece held by the chuck table; and a spindle unit that rotatably supports the chuck table, wherein the cleaning device cleans the workpiece in a cleaning chamber that houses the chuck table and the nozzle, the spindle unit including: a spindle for supporting the chuck table; a bearing rotatably supporting the main shaft; and a housing that houses a part of the spindle and the bearing, a pressure variable portion and an opening portion being provided between the housing and the spindle, the pressure variable portion being provided between a negative pressure supply pipe and a positive pressure supply pipe connected to the housing and a negative pressure or positive pressure supply pipe formed inside the spindle and communicating with a space on the holding surface and being disposed at a position farther from the chuck table than the bearing, the opening portion being provided between the bearing and the pressure variable portion and being opened via a through hole formed in the housing or an opening pipe connected to the housing, the spindle having an end portion protruding from the housing, a part of the cleaning chamber being defined by a cover member having an opening into which the end portion of the spindle is inserted, a seal portion being provided between the cover member and the end portion of the spindle and blocking communication between the space between the housing and the spindle and the cleaning chamber, the sealing part has: an annular magnetic ring provided on an inner peripheral surface of the cover member defining the opening; and the magnetic fluid is arranged on the inner side of the magnetic ring and is in contact with the end part of the spindle.
In the present invention, it is preferable that the end portion of the main shaft includes: a cylindrical sealed portion that is in contact with the magnetic fluid; and a cylindrical extension portion having the same diameter as the sealed portion and extending from the sealed portion toward the chuck table.
In the present invention, the seal portion that blocks communication between the space between the housing and the spindle and the cleaning chamber has a magnetic fluid that contacts the spindle. Therefore, in the present invention, the communication between the space and the chamber for washing is blocked without bringing the solids into contact with each other. As a result, wear of the seal portion caused by rotation of the main shaft can be reduced, and communication between the space and the cleaning chamber can be blocked for a long period of time.
In the present invention, an opening portion is provided between the bearing and the pressure variable portion. Thus, even when leakage from the pressure variable portion to the opening portion occurs due to pressure variation in the pressure variable portion, variation in pressure around the bearing can be suppressed. Therefore, scattering of a lubricant such as grease provided inside the bearing can be suppressed.
In addition, when such an opening portion is provided, it is possible to suppress variation in pressure around the seal portion. Therefore, the magnetic fluid contained in the seal portion can be prevented from flowing out. As a result, the communication between the space between the housing and the spindle and the cleaning chamber can be blocked for a long period of time.
Drawings
Fig. 1 is a perspective view schematically showing an example of a processing apparatus.
Fig. 2 is a partially cut-away perspective view schematically showing an example of the cleaning apparatus.
Fig. 3 is a side view, partly in section, schematically showing the spindle, the housing, the cover member, and the like.
Fig. 4 is a partially enlarged view of fig. 3.
Description of the reference symbols
2: a cutting device; 4: a base (4 a: opening); 6: a mobile station; 8: a dustproof anti-dripping cover; 10: a chuck table (10 a: a porous plate); 12: a support structure (12 a: standing part, 12 b: arm part); 14: a Y-axis direction moving mechanism; 16: a Y-axis guide rail; 18: moving the plate along the Y axis; 20: a screw shaft; 22: a Z-axis direction moving mechanism; 24: a Z-axis guide rail; 26: moving the plate along the Z axis; 28: a screw shaft; 30: an electric motor; 32: a cutting unit; 34: a spindle housing; 36: a cutting tool; 38: a shooting unit; 40: a cleaning device; 42: a chuck table (42 a: porous plate); 44: a cleaning chamber body (44 a: outer peripheral wall, 44 b: bottom wall, 44 c: inner peripheral wall); 46: an exhaust pipe; 48: a water discharge port; 50: a drain pipe; 52: a support leg; 54: a cleaning unit (54 a: shaft part, 54 b: arm part, 54 c: nozzle); 56: a drying unit (56 a: shaft part, 56 b: arm part, 56 c: nozzle); 58: a spindle unit; 60: a main shaft (60 a: a negative pressure or positive pressure supply pipe); 62: an electric motor; 64: a support mechanism; 66: a cylinder; 68: a support leg; 70: a housing; 72: a cover member; 74: a bearing; 76: opening the tube; 78: a negative pressure supply tube; 80: a positive pressure supply tube; 82a, 82 b: oil sealing; 84: sealing parts (84 a: magnetic ring, 84 b: ring sheet, 84 c: magnetic fluid).
Detailed Description
Embodiments of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view schematically showing an example of a machining apparatus (cutting apparatus) provided with a cleaning apparatus. In addition, the X-axis direction (front-back direction) and the Y-axis direction (left-right direction) shown in fig. 1 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (up-down direction) is a direction perpendicular to the X-axis direction and the Y-axis direction (vertical direction).
The cutting apparatus 2 shown in fig. 1 includes a base 4 for supporting each component. A rectangular opening 4a whose longitudinal direction is parallel to the X-axis direction is formed in the upper surface of the base 4. The opening 4a is provided with a movable stage 6 and a bellows-shaped dust-proof and drip-proof cover 8 which expands and contracts with the movement of the movable stage 6. An X-axis direction moving mechanism (not shown) for moving the movable stage 6 in the X-axis direction is provided below the dust-proof and drip-proof cover 8.
A chuck table 10 is provided on the upper surface of the moving stage 6. The chuck table 10 has a disk-shaped porous plate 10a exposed upward, and has a function of sucking and holding a workpiece placed on the porous plate 10 a. The upper surface of the porous plate 10a is substantially flat and serves as a holding surface for holding the workpiece. A suction passage (not shown) having one end connected to a suction source (not shown) such as an injector provided outside the chuck table 10 is formed inside the chuck table 10.
The other end of the suction path reaches the porous plate 10 a. Therefore, when the suction source is operated in a state where the workpiece is placed on the holding surface, the workpiece is sucked and held by the chuck table 10. The chuck table 10 is connected to a rotation drive source (not shown) for the chuck table such as a motor. When the chuck table rotation drive source is operated, the chuck table 10 rotates about a straight line passing through the center of the holding surface and perpendicular to the holding surface as a rotation axis.
A support structure 12 is provided in the vicinity of the opening 4a on the upper surface of the base 4. The support structure 12 includes: an erected portion 12a extending from the upper surface of the base 4 in the Z-axis direction; and an arm portion 12b extending from an upper end of the standing portion 12a in the Y-axis direction so as to straddle the opening 4 a. A Y-axis direction moving mechanism 14 is provided on the front surface side of the arm portion 12 b.
The Y-axis direction moving mechanism 14 has a pair of Y-axis rails 16 fixed to the front surface of the arm portion 12b and extending in the Y-axis direction. A Y-axis moving plate 18 is connected to the front surfaces of the pair of Y-axis rails 16 so as to be slidable along the pair of Y-axis rails 16.
Further, a screw shaft 20 extending in the Y-axis direction is disposed between the pair of Y-axis guides 16. A motor (not shown) for rotating the screw shaft 20 is connected to one end of the screw shaft 20. A nut portion (not shown) that receives balls rolling on the surface of the rotating screw shaft 20 is provided on the surface of the screw shaft 20 on which the spiral groove is formed, thereby constituting a ball screw.
That is, when the screw shaft 20 rotates, the balls circulate in the nut portion, and the nut portion moves in the Y-axis direction. The nut portion is fixed to the rear surface side of the Y-axis moving plate 18. Therefore, when the screw shaft 20 is rotated by a motor connected to one end of the screw shaft 20, the Y-axis moving plate 18 moves in the Y-axis direction together with the nut portion.
A Z-axis direction moving mechanism 22 is provided on the front surface side of the Y-axis moving plate 18. The Z-axis direction moving mechanism 22 has a pair of Z-axis rails 24 fixed to the front surface of the Y-axis moving plate 18 and extending in the Z-axis direction. A Z-axis moving plate 26 is connected to the front surfaces of the pair of Z-axis rails 24 so as to be slidable along the pair of Z-axis rails 24.
Further, a screw shaft 28 extending in the Z-axis direction is disposed between the pair of Z-axis guide rails 24. A motor 30 for rotating the screw shaft 28 is connected to one end of the screw shaft 28. A nut portion (not shown) that receives balls rolling on the surface of the rotating screw shaft 28 is provided on the surface of the screw shaft 28 on which the spiral groove is formed, thereby constituting a ball screw.
That is, when the screw shaft 28 rotates, the balls circulate in the nut portion, and the nut portion moves in the Z-axis direction. The nut portion is fixed to the rear surface side of the Z-axis moving plate 26. Therefore, when the screw shaft 28 is rotated by the motor 30, the Z-axis moving plate 26 moves in the Z-axis direction together with the nut portion.
A cutting unit 32 is fixed to a lower portion of the Z-axis moving plate 26. The cutting unit 32 has a cylindrical spindle housing 34 whose longitudinal direction is parallel to the Y-axis direction. A cylindrical main shaft (not shown) having a longitudinal direction parallel to the Y-axis direction is housed in the main shaft housing 34. The spindle is rotatably supported by the spindle case 34.
The spindle has a tip portion projecting outward of the spindle case 34, and a cutting tool 36 having an annular cutting edge is attached to the tip portion. The base end of the spindle is connected to a rotary drive source (not shown) for a cutting tool such as a motor built in the spindle housing 34.
An imaging unit 38 fixed to a lower portion of the Z-axis moving plate 26 is provided at a position adjacent to the cutting unit 32 in the X-axis direction. The shooting unit 38 includes, for example: light sources such as LEDs (Light Emitting diodes); an objective lens; and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.
The machining of the workpiece in the cutting device 2 is performed, for example, in the following order. First, the imaging unit 38 images the workpiece sucked and held by the chuck table 10. Then, the cutting unit 32 is aligned with the workpiece based on the image obtained by the imaging. Specifically, the Y-axis direction moving mechanism 14 and/or the Z-axis direction moving mechanism 22 adjust the position of the cutting unit 32, and/or the X-axis direction moving mechanism and/or the chuck table rotation driving source adjust the position and/or the orientation of the chuck table 10 that sucks and holds the workpiece.
Next, the cutting tool 36 is brought into contact with the workpiece while rotating. Specifically, in a state where the cutting tool rotary drive source rotates the spindle to which the cutting tool 36 is attached at the tip end portion, the Y-axis direction moving mechanism 14 and/or the Z-axis direction moving mechanism 22 moves the cutting unit 32, and/or the X-axis direction moving mechanism and/or the chuck table rotary drive source moves the chuck table 10 which sucks and holds the workpiece. Thereby, the desired processing is performed on the workpiece.
Further, a cleaning device 40 is provided in a position forward of the support structure 12 on the upper surface of the base 4. Fig. 2 is a partially cut-away perspective view schematically showing the cleaning device 40. The cleaning device 40 has a chuck table 42. The chuck table 42 has a disk-shaped porous plate 42a exposed upward, and has a function of sucking and holding the workpiece placed on the porous plate 42 a. The upper surface of the porous plate 42a is substantially flat and serves as a holding surface for holding the workpiece.
A cleaning chamber body 44 surrounding the chuck table 42 is provided around the chuck table 42. The cleaning chamber body 44 includes: a cylindrical outer peripheral wall 44 a; an annular bottom wall 44b extending radially inward from a lower end of the outer peripheral wall 44 a; and a cylindrical inner peripheral wall 44c erected from an inner end portion of the bottom wall 44 b.
An exhaust port (not shown) is provided in the outer peripheral wall 44a, and the exhaust port is connected to an exhaust pump (not shown) via an exhaust pipe 46. A drain port 48 is provided in the bottom wall 44b, and a drain pipe 50 extending downward is connected to the drain port 48. Further, a plurality of (e.g., three) support legs 52 are fixed to the lower surface of the bottom wall 44 b. The plurality of support legs 52 are provided at substantially equal intervals along the circumferential direction of the bottom wall 44b, and support the chamber main body for cleaning 44.
A disk-shaped lid (not shown) is provided above the cleaning chamber body 44. The diameter of the cap is longer than the inner diameter of the peripheral wall 44 a. The lower surface of the lid is disposed so as to contact the upper surface of the outer peripheral wall 44a, thereby preventing cutting chips attached to the workpiece or cleaning liquid used for cleaning from being scattered onto the upper surface of the base 4 during cleaning of the workpiece.
A cleaning unit 54 and a drying unit 56 are disposed inside the outer peripheral wall 44 a. The cleaning unit 54 and the drying unit 56 have tubular shaft portions 54a and 56a inserted into the bottom wall 44b, respectively. The shaft portions 54a, 56a are tubular members extending in a direction perpendicular to the holding surface of the chuck table 42 outside the chuck table 42. A rotation drive source (not shown) such as a motor for rotating the shaft portions 54a, 56a is connected to the lower end sides of the shaft portions 54a, 56 a.
The arm portions 54b, 56b are connected to the upper end portions of the shaft portions 54a, 56 a. The arm portions 54b and 56b are tubular members extending from the upper end portions of the shaft portions 54a and 54a in a direction parallel to the holding surface of the chuck table 42 by a length corresponding to a distance from the center of the chuck table 42. The tip portions of the arm portions 54b and 56b (the end portions of the arm portions 54b and 56b on the side not connected to the shaft portions 54a and 56 a) are provided with downward nozzles 54c and 56 c.
The shaft portion 54a and the arm portion 54b are in communication with a cleaning liquid supply source (not shown). Therefore, for example, when the shaft portion 54a is rotated so that the nozzle 54c is positioned above the chuck table 42 and then the cleaning liquid is supplied from the cleaning liquid supply source to the shaft portion 54a and the arm portion 54b, the cleaning liquid is supplied from the nozzle 54c to the holding surface of the chuck table 42.
The shaft portion 56a and the arm portion 56b communicate with an air supply source (not shown). Therefore, for example, when air is supplied from the air supply source to the shaft portion 56a and the arm portion 56b after the shaft portion 56a is rotated so that the nozzle 56c is positioned above the chuck table 42, air is supplied from the nozzle 56c to the holding surface of the chuck table 42.
The spindle unit 58 penetrates vertically through a cylindrical space present inside the inner circumferential wall 44 c. The spindle unit 58 has a spindle 60 formed of ferritic or martensitic stainless steel or the like. The upper end side of the spindle 60 is connected to the chuck table 42, and supports the chuck table 42. A motor 62 is connected to a lower end portion of the spindle 60, and when the motor 62 is operated, the chuck table 42 rotates about a straight line passing through the center of the holding surface and perpendicular to the holding surface as a rotation axis.
The motor 62 is supported by a support mechanism 64 so as to be movable in the vertical direction. The support mechanism 64 includes a plurality of (e.g., three) air cylinders 66 attached to the motor 62, and support legs 68 are connected to lower portions of the air cylinders 66. When the plurality of air cylinders 66 are simultaneously operated, the motor 62 and the chuck table 42 are moved up and down.
For example, when the workpiece is carried in and out in the cleaning device 40, the support mechanism 64 is operated to position the chuck table 42 at a predetermined carrying in and out position, and when the workpiece is cleaned, the chuck table 42 is positioned at a cleaning position below the carrying in and out position. Fig. 2 schematically shows the cleaning device 40 in a state where the chuck table 42 is at the carrying-in/out position.
A housing 70 and a cover member 72 are provided around the spindle 60. Fig. 3 is a partially cross-sectional side view schematically showing the spindle 60, the housing 70, the cover member 72, and the like, and fig. 4 is a partially enlarged view of fig. 3. In fig. 3 and 4, the cleaning device 40 is schematically shown in a state where the chuck table 42 is in the cleaning position.
The housing 70 has a cylindrical shape having an outer diameter shorter than the inner diameter of the inner peripheral wall 44c, and is fixed to the motor 62 via a coupling member (not shown). An outer race of the bearing 74 is fixed to an inner peripheral surface of an upper portion of the housing 70. The inner race of the bearing 74 is in contact with the main shaft 60 to rotatably support the main shaft 60.
Further, the housing 70 is provided with three through holes arranged vertically and penetrating the housing 70 in the radial direction. A tubular open pipe 76 is connected to a through hole closest to the bearing 74 among the three through holes. The open pipe 76 communicates an annular space (open portion) a between the housing 70 and the main shaft 60 with a space outside the housing 70. In addition, the open pipe 76 may not be provided. That is, the open portion a may communicate with the space outside the housing 70 through a through hole penetrating the housing 70.
A tubular negative pressure supply pipe 78 and a tubular positive pressure supply pipe 80 are connected to the remaining two through holes, respectively. The negative pressure supply pipe 78 communicates an annular space (pressure variable portion) B between the housing 70 and the main shaft 60, which is farther from the bearing 74 than the opening portion a, with a negative pressure supply source (suction source) such as an ejector. The positive pressure supply pipe 80 communicates the pressure variable portion B with a positive pressure supply source such as an air supply source.
Annular oil seals 82a and 82B are provided at the boundary between the opening portion a and the pressure variable portion B and at the boundary between the outer space below the pressure variable portion B and the pressure variable portion B, respectively. The pressure variable portion B can communicate with a negative pressure or positive pressure supply pipe 60a formed inside the main shaft 60. The negative pressure or positive pressure supply pipe 60a communicates with a space on the holding surface of the chuck table 42 via a flow path (not shown) formed inside the chuck table 42.
The cover member 72 has: an annular top wall 72 a; and a cylindrical side wall 72b extending downward from an outer end of the top wall 72 a. Further, the inner diameter of the top wall 72a is longer than the inner diameter of the bearing 74. In addition, the outer diameter of the top wall 72a and the inner diameter of the side wall 72b are longer than the outer diameter of the inner peripheral wall 44 c.
An upper end portion of the spindle 60 protruding from the housing 70 is inserted into the top wall 72 a. In other words, the cover member 72 has an opening into which the upper end of the spindle 60 is inserted. An annular seal 84 is provided between the cover member 72 and the upper end portion of the spindle 60 to block communication between a space (e.g., the opening portion a and the pressure variable portion B) between the housing 70 and the spindle 60 and a space on the chuck table 42 side.
The seal portion 84 has an annular magnet ring 84a provided on the inner peripheral surface of the top wall 72 a. The magnet ring 84a is formed of a permanent magnet, and is provided such that the N-pole and the S-pole are in contact with a pair of annular ring pieces 84b, respectively. Further, a magnetic fluid 84c is provided between the ring piece 84b and the spindle 60.
The magnetic fluid 84c is held along the lines of magnetic flux formed between the magnetic ring 84a and the ring segments 84b and the main shaft 60. The magnetic fluid 84c is, for example, an alkyl naphthyl magnetic fluid containing strong magnetic fine particles such as magnetite or manganese zinc ferrite and a surfactant. Alternatively, the magnetic fluid 84c may be a fluorine oil-based magnetic fluid containing ferromagnetic fine particles and a surfactant.
Here, when the cleaning device 40 is transported, the magnetic fluid 84c as a fluid may be diffused to the outside of the space between the spindle 60 and the ring piece 84b due to the inclination of the spindle 60 or the like. The spindle 60 is preferably shaped to form a magnetic field that can suppress the outflow of the magnetic fluid 84c even in such a case.
For example, the upper end of the spindle 60 that protrudes from the housing 70 and is inserted into the opening (inside the top wall 72 a) of the cover member 72 preferably includes: a cylindrical sealed portion in contact with the magnetic fluid 84 c; and an extending portion extending upward from the sealed portion and having the same diameter as the sealed portion. When the extension portion is provided in this manner, the magnetic fluid 84c can be inhibited from flowing out even when the magnetic fluid 84c spreads upward from the space between the main shaft 60 and the ring piece 84 b.
When the spindle 60 rotates, frictional heat is generated by friction between the spindle 60 and the magnetic fluid 84 c. Further, when the main shaft 60 is heated by frictional heat, for example, the oil seals 82a and 82b may be deteriorated.
Therefore, the magnetic force of the magnetic ring 84a is preferably weak on the premise that the magnetic fluid 84c of an amount capable of blocking the communication between the two spaces is held between the ring piece 84b and the main shaft 60. For example, the magnetic force of the magnetic ring 84a is preferably 400G to 800G.
Similarly, the thickness of the magnetic ring 84a is preferably thin so as to be able to hold the magnetic fluid 84c between the ring piece 84b and the spindle 60 in an amount that can block the communication between the two spaces. For example, as shown in fig. 4, the thickness of the magnetic ring 84a is preferably reduced so that the magnetic fluid 84c in contact with the pair of ring pieces 84b can be integrated without being separated. Specifically, the thickness of the magnetic ring 84a is preferably 3mm to 5 mm.
As shown in fig. 3, in the state where the chuck table 42 is at the cleaning position, the lower surface of the ceiling wall 72a of the cover member 72 is sufficiently close to the upper surface of the inner peripheral wall 44c of the cleaning chamber body 44. Therefore, in the cleaning apparatus 40, the cleaning chamber is defined by the cleaning chamber main body 44, the lid disposed so as to contact the upper surface of the outer peripheral wall 44a of the cleaning chamber main body 44, the cover member 72, and the sealing portion 84.
The cleaning of the workpiece in the cleaning device 40 included in the cutting apparatus 2 is performed, for example, in the following order. First, the workpiece processed as described above is placed on the chuck table 42 at the carrying-in/out position. Next, after the chuck table 42 is moved to the cleaning position, the workpiece is sucked and held by the chuck table 42.
Next, the lid is disposed so as to contact the upper surface of the outer peripheral wall 44a of the cleaning chamber body 44 to form a cleaning chamber, and the shaft 54a is rotated so as to position the nozzle 54c of the cleaning unit 54 above the workpiece. Then, in a state where the cleaning chamber is exhausted through the exhaust pipe 46, the cleaning liquid is supplied from the nozzle 54c to the workpiece while the chuck table 42 is rotated. Thereby, chips and the like adhering to the front surface of the workpiece are removed.
Next, the shaft 54a is rotated so that the nozzle 54c of the cleaning unit 54 is retracted from above the workpiece, and the shaft 56a is rotated so that the nozzle 56c of the drying unit 56 is positioned above the workpiece. Subsequently, air is supplied from the nozzle 56c to the workpiece while rotating the chuck table 42. Thereby, the cleaning liquid and the like adhering to the front surface of the workpiece are removed.
Next, the shaft 56a is rotated so as to retract the nozzle 56c of the drying unit 56 from above the workpiece. Subsequently, after the chuck table 42 is moved to the carrying-in/out position, the workpiece is carried out from the chuck table 42. Thus, the workpiece is cleaned.
In the cleaning device 40, the seal portion 84 that blocks the communication between the space (e.g., the opening portion a and the pressure variable portion B) between the housing 70 and the spindle 60 and the cleaning chamber has the magnetic fluid 84c that is in contact with the spindle 60. Therefore, in the cleaning device 40, the communication between the space and the cleaning chamber is blocked without bringing the solids into contact with each other. As a result, wear of the seal portion 84 accompanying rotation of the main shaft 60 can be reduced, and communication between the space and the cleaning chamber can be blocked for a long period of time.
In the cleaning device 40, an opening portion a is provided between the bearing 74 and the pressure variable portion B. Thus, even when leakage from the pressure variable portion B to the opening portion a occurs due to pressure variation in the pressure variable portion B, pressure variation around the bearing 74 can be suppressed. Therefore, scattering of the lubricant such as grease provided inside the bearing 74 can be suppressed.
In addition, when such an opening portion a is provided, it is possible to suppress variation in pressure around the seal portion 84. Therefore, the magnetic fluid 84c contained in the seal portion 84 can be prevented from flowing out. As a result, the communication between the space between the housing 70 and the spindle 60 and the cleaning chamber can be blocked for a long period of time.
The structure, method, and the like of the above embodiment can be modified and implemented as appropriate without departing from the scope of the object of the present invention.

Claims (2)

1. A cleaning device, comprising:
a chuck table for holding a workpiece by a holding surface;
a nozzle for supplying a cleaning liquid to the workpiece held by the chuck table; and
a spindle unit rotatably supporting the chuck table,
the cleaning device cleans the processed object in a cleaning chamber for accommodating the chuck worktable and the nozzle,
it is characterized in that the preparation method is characterized in that,
the spindle unit includes:
a spindle for supporting the chuck table;
a bearing rotatably supporting the main shaft; and
a housing that houses a part of the main shaft and the bearing,
a pressure variable portion and an opening portion are provided between the housing and the main shaft,
the pressure variable part is arranged between a negative pressure supply pipe and a positive pressure supply pipe connected with the shell and the negative pressure or positive pressure supply pipe formed in the main shaft and communicated with the space on the holding surface, and is arranged at a position far away from the chuck worktable than the bearing,
the opening part is arranged between the bearing and the pressure variable part and is opened through a through hole formed on the shell or an opening pipe connected with the shell,
the spindle has an end portion protruding from the housing,
a part of the cleaning chamber is defined by a cover member having an opening into which the end of the spindle is inserted,
a sealing part is arranged between the cover component and the end part of the main shaft, the sealing part blocks the communication between the space between the shell and the main shaft and the cleaning chamber,
the sealing part has:
an annular magnetic ring provided on an inner peripheral surface of the cover member defining the opening; and
and the magnetic fluid is arranged on the inner side of the magnetic ring and is in contact with the end part of the spindle.
2. The cleaning device of claim 1,
the end portion of the main shaft has:
a cylindrical sealed portion that is in contact with the magnetic fluid; and
and a cylindrical extension portion having the same diameter as the sealed portion and extending from the sealed portion toward the chuck table.
CN202210195968.9A 2021-03-03 2022-03-01 Cleaning device Pending CN115020274A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021033263A JP2022134248A (en) 2021-03-03 2021-03-03 Cleaning device
JP2021-033263 2021-03-03

Publications (1)

Publication Number Publication Date
CN115020274A true CN115020274A (en) 2022-09-06

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Application Number Title Priority Date Filing Date
CN202210195968.9A Pending CN115020274A (en) 2021-03-03 2022-03-01 Cleaning device

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JP (1) JP2022134248A (en)
KR (1) KR20220124634A (en)
CN (1) CN115020274A (en)
TW (1) TW202236410A (en)

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Publication number Priority date Publication date Assignee Title
JP6783624B2 (en) 2016-10-27 2020-11-11 株式会社ディスコ Cleaning equipment

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JP2022134248A (en) 2022-09-15
TW202236410A (en) 2022-09-16

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