CN115020252A - Manufacturing method of TR (transmitter-receiver) assembly - Google Patents
Manufacturing method of TR (transmitter-receiver) assembly Download PDFInfo
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- CN115020252A CN115020252A CN202210953177.8A CN202210953177A CN115020252A CN 115020252 A CN115020252 A CN 115020252A CN 202210953177 A CN202210953177 A CN 202210953177A CN 115020252 A CN115020252 A CN 115020252A
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- 238000005245 sintering Methods 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims description 29
- 238000005476 soldering Methods 0.000 claims description 29
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- 238000010438 heat treatment Methods 0.000 claims description 19
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of a TR component, which comprises the following steps: a plurality of components are respectively fixed on the first circuit board and the second circuit board; sintering the first circuit board fixed with the component on the first surface of the shell to obtain a first part; placing a first component on a tool base, placing each first eutectic chip on a first surface of a shell in the first component, placing a limiting tool cover plate on one side of the first component, which is far away from the tool base, aligning a first positioning pin in the limiting tool cover plate with a second positioning pin on the tool base, and enabling each first eutectic chip to be located in a limiting range of a corresponding limiting pin, and fixing the limiting tool cover plate on the tool base to obtain a second component; and (4) placing the second component into a sintering furnace for sintering, and removing the tool base and the limiting tool cover plate after sintering. The invention can simplify the process steps and improve the manufacturing efficiency, the sintering penetration rate and the reliability of the TR component.
Description
Technical Field
The invention relates to the technical field of microwaves, in particular to a manufacturing method of a TR component.
Background
The TR component is widely applied to active phased array radars, is mainly used for realizing amplification of transmitting signals, amplification of receiving signals and control of signal amplitude and phase, and comprises low-noise amplifier, power amplifier, amplitude limiter, phase shifter and the like. One active phased array radar contains thousands of TR components, the cost of the TR components generally exceeds 50 percent of the total cost of the radar, and the market space is wide.
However, the conventional TR module has a complicated manufacturing process and low manufacturing efficiency, and the manufactured TR module has poor reliability.
Disclosure of Invention
The invention provides a manufacturing method of a TR component, which can simplify the process steps and improve the manufacturing efficiency, the sintering penetration rate and the reliability of the TR component.
According to an aspect of the present invention, there is provided a method for manufacturing a TR module, the method comprising the steps of:
a plurality of components are respectively fixed on the first circuit board and the second circuit board;
sintering the first circuit board fixed with the component on the first surface of the shell to obtain a first part;
the method comprises the steps of obtaining a first eutectic chip and a second eutectic chip, wherein the first eutectic chip comprises a power amplifier and a driving amplifier, and the second eutectic chip comprises a multifunctional chip, an amplitude limiting low-noise amplifier chip, a phase modulation block, an adjustable attenuator chip, a power divider chip and a chip capacitor;
placing the first component on a tool base, placing each first eutectic chip on a first surface of a shell in the first component, placing a limiting tool cover plate on one side, far away from the tool base, of the first component, aligning a first positioning pin in the limiting tool cover plate with a second positioning pin on the tool base, and enabling each first eutectic chip to be located in a limiting range of a corresponding limiting pin, and then fixing the limiting tool cover plate on the tool base to obtain a second component, wherein a plurality of limiting pins are arranged on one side, close to the first eutectic chips, of the limiting tool cover plate, and each first eutectic chip corresponds to one limiting pin;
sintering the second component in a sintering furnace, and removing the tool base and the limiting tool cover plate after sintering to obtain a third component;
fixing a second circuit board provided with components and the second eutectic chips on one side, far away from the first circuit board, of the shell in the third component to obtain a fourth component;
performing wire bonding on the fourth component to obtain a fifth component;
and capping the fifth component to obtain the TR assembly.
Optionally, the limit pin includes a plurality of limit columns distributed at intervals;
the positioning of each first eutectic chip in the limiting range of the corresponding limiting pin comprises:
and enabling a limiting column in the limiting pin to surround the first eutectic chip corresponding to the limiting pin, and enabling the movable distance of the first eutectic chip in the limiting pin to be smaller than a set distance.
Optionally, the obtaining the first eutectic chip and the second eutectic chip specifically includes:
and respectively eutectic-crystallizing a plurality of different chips to be eutectic-crystallized on different carriers through soldering lugs to obtain the first eutectic chip and the second eutectic chip.
Optionally, fixing a plurality of components on the first circuit board and the second circuit board respectively specifically includes:
coating first solder paste on the positions of the components of the first circuit board and the second circuit board;
placing components at the positions where the first circuit board and the second circuit board are coated with the first solder paste;
and placing the first circuit board with the components and the second circuit board with the components on a heating platform to be sintered at a first set temperature.
Optionally, the first component further comprises a connector;
obtaining the first part specifically includes:
cleaning a first surface and a second surface of the shell, wherein the first surface and the second surface of the shell are arranged oppositely;
placing a soldering lug on the first surface of the shell, injecting soldering flux, and placing the first circuit board sintered with components on the soldering lug;
coating a second solder paste on the outer part of the connector, and inserting the connector into the corresponding position of the shell to obtain a second sub-component;
placing the second sub-assembly on a heating platform to be sintered at a second set temperature;
after sintering, welding the connector with a micro-strip in the first circuit board through a solder wire to obtain a connector component;
and cleaning the connector part to obtain a second part.
Optionally, eutectic chips to be eutectic are respectively eutectic to different carriers through the bonding pads, and obtaining the first eutectic chip and the second eutectic chip specifically includes:
setting the temperature of the eutectic platform as a third set temperature;
placing a carrier on the eutectic table;
placing a solder pad on the carrier;
after the to-be-eutectic chips are melted, placing a plurality of to-be-eutectic chips on corresponding carriers, and clamping the to-be-eutectic chips by using tweezers to rub on the carriers, so that the to-be-eutectic chips are in seamless connection with the carriers, and the first eutectic chips and the second eutectic chips are obtained.
Optionally, the second circuit board to be provided with components and parts and each second eutectic chip are all fixed on one side of the shell in the third component far away from the first circuit board, and obtaining the fourth component specifically includes:
coating conductive adhesive on the back surface of the second circuit board provided with the components by using a dispenser;
bonding a second circuit board provided with components to one side, far away from the first circuit board, of the shell to obtain a fourth sub-component;
baking the fourth sub-assembly in an oven at a fourth set temperature for a first set time period;
bonding the second eutectic chip to one side, far away from the first circuit board, of the shell of the baked fourth sub-component by using a dispenser;
and placing the fourth sub-component bonded with the second eutectic chip in an oven, and baking the fourth sub-component at a fifth set temperature for a second set time to obtain the fourth component.
Optionally, the wire bonding the fourth component specifically includes:
setting the temperature of the bonding heating platform to be a sixth set temperature, and preheating for a third set time;
fixing the fourth component on the bonding heating platform;
and carrying out gold wire bonding on the fourth component by using a bonding machine.
Optionally, the step of capping the fifth component specifically includes:
placing the fifth part within a vacuum pre-bake system;
setting the vacuum pre-drying system to be in a vacuum state, setting the temperature to be a seventh set temperature and setting the working time to be a fourth set time, and performing pre-drying treatment on the fifth component;
after the pre-baking treatment, a first cover plate is placed on one side of the shell, which is far away from the first circuit board, a second cover plate is placed on one side of the shell, which is far away from the second circuit board, and laser sealing is carried out, so that the first cover plate and the second cover plate are integrally connected with the shell.
Optionally, will spacing frock apron is fixed specifically include on the frock base:
and penetrating a screw through the limiting tool cover plate and fixing the screw on the tool base.
The embodiment provides a manufacturing method of a TR component, which comprises the following steps: the method comprises the steps of obtaining a first component, obtaining first eutectic chips and second eutectic chips, placing the first component on a tool base before sintering the first eutectic chips to corresponding positions on a first surface of a shell, then placing a limiting tool cover plate on one side, far away from the tool base, of a first circuit board in the first component, and aligning a first positioning pin in the limiting tool cover plate with a second positioning pin on the tool base. The limiting tool cover plate further comprises limiting pins corresponding to the first eutectic chips, and therefore the first eutectic chips are required to be located in the limiting ranges of the corresponding limiting pins. The limiting pin can prevent the first eutectic chip from moving to the positions of other devices in the process of sintering each first eutectic chip, and therefore reliability of the TR component is improved. The limiting pin can also prevent the corresponding first eutectic chip from floating upwards in the sintering process, so that the limiting pin can enable the first eutectic chip to be in close contact with the shell in the sintering process, and the sintering penetration rate is improved. The plurality of limiting pins are arranged in the limiting tool cover plate, so that the plurality of first eutectic chips can be sintered simultaneously, the manufacturing steps are simplified, and the manufacturing efficiency is improved. And sintering each first eutectic chip to the first surface of the shell to obtain a third component, fixing a second circuit board and a second eutectic chip on one side, far away from the first circuit board, of the shell in the third component to obtain a fourth component, then carrying out lead bonding on the fourth component, and capping after the lead bonding, thereby obtaining the TR component. The manufacturing method of the TR component provided by the embodiment can simplify the process steps and improve the manufacturing efficiency, the sintering penetration rate and the reliability of the TR component.
It should be understood that the statements in this section do not necessarily identify key or critical features of the embodiments of the present invention, nor do they necessarily limit the scope of the invention. Other features of the present invention will become apparent from the following description.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating a method for fabricating a TR component according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first circuit board to which a plurality of components are fixed according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a fixture base and a limiting fixture cover plate fixedly connected according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a fourth component provided in accordance with an embodiment of the present invention;
FIG. 5 is a schematic diagram of a wire-bonded first circuit board according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a second circuit board with wire bonds according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a TR assembly provided in accordance with an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a fourth component provided in accordance with an embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Fig. 1 is a schematic flow chart of a method for manufacturing a TR device according to an embodiment of the present invention, and referring to fig. 1, the method for manufacturing a TR device according to the embodiment includes the following steps:
and S110, fixing a plurality of components on the first circuit board and the second circuit board respectively.
Specifically, one of the first circuit board to which the component is fixed and the second circuit board to which the component is fixed is a power supply board, and the other is a microwave circuit board. A plurality of components including resistors, capacitors and chips with pins can be respectively fixed on the first circuit board and the second circuit board by sintering or welding. And clamping the components by using tweezers respectively, placing the components at corresponding positions on the first circuit board and corresponding positions on the second circuit board, and fixing the components on the first circuit board and the second circuit board. Referring to fig. 2, fig. 2 is a schematic structural diagram of a first circuit board to which a plurality of components are fixed according to an embodiment of the present invention.
And S120, sintering the first circuit board fixed with the component on the first surface of the shell to obtain the first component.
Specifically, the housing has conductivity. And sintering the first circuit board fixed with the component on the shell to electrically connect the shell and the first circuit board.
S130, obtaining a first eutectic chip and a second eutectic chip, wherein the first eutectic chip comprises a power amplifier and a driving amplifier, and the second eutectic chip comprises a multifunctional chip, an amplitude limiting low-noise amplifier chip, a phase modulation block, an adjustable attenuator chip, a power divider chip and a chip capacitor.
Specifically, the first eutectic chip and the second eutectic chip are chips used when the TR component normally works. The obtained first eutectic chip and the second eutectic chip may be fixed on the case.
S140, the first component is placed on the tool base, the first eutectic chips are placed on the first surface of the shell in the first component, the limiting tool cover plate is placed on one side, away from the tool base, of the first component, the first locating pins in the limiting tool cover plate are aligned with the second locating pins on the tool base, each first eutectic chip is located in the limiting range of the corresponding limiting pin, then the limiting tool cover plate is fixed on the tool base, and the second component is obtained.
Specifically, fig. 3 is a schematic structural diagram of a fixture base and a limiting fixture cover plate fixedly connected according to an embodiment of the present invention, and referring to fig. 3, the first positioning pin 10 and the second positioning pin may be through holes, or one of the through holes and the other protruding portion, and the protruding portion may pass through the through hole. The number of the first aligning pins 10 and the number of the second aligning pins may be plural. After the first positioning pin 10 is aligned with the second positioning pin, the limiting pin 20 in the limiting tool cover plate 110 needs to be aligned with the corresponding first eutectic chip, and finally the first eutectic chip is located within the limiting range of the corresponding limiting pin 20.
If the spacing tool cover plate 110 and the spacing tool base 120 provided in this embodiment are not provided, in the process of sintering the first eutectic chip to the corresponding position on the first surface of the housing, the first eutectic chip may move, possibly upward, possibly left and right, and back and forth, and if the first eutectic chip moves and is connected to the position of another device, the TR assembly may be unqualified. The limiting pins 20 corresponding to the first eutectic chips are arranged in the limiting tool cover plate 110 in this embodiment, and the limiting pins 20 can limit the moving range of the corresponding first eutectic chips, so that the moving range of the first eutectic chips is small in the sintering process, and the first eutectic chips cannot move to the positions of other devices, thereby improving the success rate of sintering. And the spacing pin 20 can also prevent the corresponding first eutectic chip from moving upwards too much, so that the first eutectic chip can be fully contacted with the shell, thereby improving the sintered penetration rate. Spacing frock apron 110 includes the spacer pin 20 that each first eutectic chip corresponds in to can make a plurality of first eutectic chips sinter simultaneously, power amplifier and driver amplifier can sinter simultaneously to the casing promptly, need not to sinter each first eutectic chip respectively, avoided causing the good first eutectic chip of previous sintering to take place to remove when sintering a back first eutectic chip, both improved the preparation efficiency, also further improved the reliability of TR subassembly. The limiting tool cover plate 110 is fixed on the tool base 120, so that relative displacement between the limiting tool cover plate 110 and the tool base 120 can be prevented in the process of sintering the first eutectic chip to the shell. It should be noted that the first circuit board may include through holes corresponding to the first eutectic chips, and when the first eutectic chip is placed on the first surface of the housing, the first eutectic chip may be placed on the first surface of the housing after passing through the through holes in the first circuit board.
S150, placing the second component into a sintering furnace for sintering, and removing the tool base and the limiting tool cover plate after sintering to obtain a third component.
Specifically, the second component is placed in a sintering furnace, a door cover of the sintering furnace is closed, the sintering furnace is in a vacuum state, a sintering process curve is called to sinter the second component, the second component is taken out after sintering, the second component is placed on filter paper to be naturally cooled to room temperature, then a tooling base and a limiting tooling cover plate are removed to obtain a third component, and the third component is reversely buckled (one side of a shell, which is far away from a first circuit board, is outward) in an anti-static turnover box.
And S160, fixing the second circuit board provided with the components and the second eutectic chips on one side, far away from the first circuit board, of the shell in the third component to obtain a fourth component.
Specifically, fig. 4 is a schematic structural diagram of a fourth component provided in accordance with an embodiment of the present invention. The second circuit board provided with the component is fixed on the second surface of the shell, and the first surface and the second surface of the shell are arranged oppositely. The second eutectic chip may be fixed to the second circuit board or to the second surface of the housing. Fix first circuit board and second circuit board respectively on the first face and the second face of casing, rather than all fixing first circuit board and second circuit board at the coplanar of casing to can reduce the surface area of casing, finally reduce the surface area of TR subassembly, make the TR subassembly of producing more miniaturized. The second circuit board provided with the component and the second eutectic chips are fixed on one side, away from the first circuit board, of the shell in the third component, and can be fixed in a sintering mode or a conductive adhesive bonding mode.
And S170, carrying out wire bonding on the fourth component to obtain a fifth component.
Specifically, the wire bonding may electrically connect the component in the fourth component with the corresponding component, the first circuit board, and the second circuit board. Fig. 5 is a schematic structural diagram of a first circuit board after wire bonding according to an embodiment of the present invention, and fig. 6 is a schematic structural diagram of a second circuit board after wire bonding according to an embodiment of the present invention. In wire bonding, an appropriate wire diameter may be selected depending on the type of device. The material of the lead may be gold. And after wire bonding, connecting the fourth component subjected to wire bonding with an external test circuit, debugging and testing the fourth component subjected to wire bonding, and obtaining a fifth component after the test is qualified.
And S180, capping the fifth component to obtain the TR component.
Specifically, the fifth component is covered, so that the first circuit board, the second circuit board, the first eutectic chip and the like in the TR component can be prevented from being polluted by external water vapor, dust and the like, and the reliability of the TR component is improved. Fig. 7 is a schematic structural diagram of a TR module according to an embodiment of the present invention. After the cover is sealed by laser, marking is carried out on the TR component, and the product model, the production batch, the trademark and the like of the TR component can be marked on the TR component.
The embodiment provides a manufacturing method of a TR component, which comprises the following steps: the method comprises the steps of obtaining a first component, obtaining first eutectic chips and second eutectic chips, placing the first component on a tool base before sintering the first eutectic chips to corresponding positions on a first surface of a shell, then placing a limiting tool cover plate on one side, far away from the tool base, of a first circuit board in the first component, and aligning a first positioning pin in the limiting tool cover plate with a second positioning pin on the tool base. The spacing tooling cover plate further comprises spacing pins corresponding to the first eutectic chips, and therefore, the first eutectic chips are required to be positioned in the spacing ranges of the corresponding spacing pins. The limiting pin can prevent the first eutectic chip from moving to the positions of other devices in the process of sintering each first eutectic chip, and therefore reliability of the TR component is improved. The limiting pin can also prevent the corresponding first eutectic chip from floating upwards in the sintering process, so that the limiting pin can enable the first eutectic chip to be in close contact with the shell in the sintering process, and the sintering penetration rate is improved. The plurality of limiting pins are arranged in the limiting tool cover plate, so that the plurality of first eutectic chips can be sintered at the same time, the manufacturing steps are simplified, and the manufacturing efficiency is improved. And sintering each first eutectic chip to the first surface of the shell to obtain a third component, fixing a second circuit board and a second eutectic chip on one side, far away from the first circuit board, of the shell in the third component to obtain a fourth component, then carrying out lead bonding on the fourth component, and capping after the lead bonding, thereby obtaining the TR component. The manufacturing method of the TR component provided by the embodiment can simplify the process steps and improve the manufacturing efficiency, the sintering penetration rate and the reliability of the TR component.
Optionally, the limiting pin comprises a plurality of limiting columns distributed at intervals; the method for enabling each first eutectic chip to be located in the limiting range of the corresponding limiting pin comprises the following steps: and enabling the limiting column in the limiting pin to surround the first eutectic chip corresponding to the limiting pin, and enabling the movable distance of the first eutectic chip in the limiting pin to be smaller than the set distance.
Specifically, the number of the limiting posts in the limiting pin may be determined according to the shape of the corresponding first eutectic chip, for example, if the shape of the first eutectic chip corresponding to one limiting pin is a cuboid, the number of the limiting posts in the limiting pin may be four, and the limiting posts may be located at the vertex of the first eutectic chip. The movable distance is the movable distance of the first eutectic chip in the plane of the first surface of the shell and the movable distance of the first eutectic chip far away from the shell. The set distance can prevent the first eutectic chip from moving to the positions of other devices and also can prevent the first eutectic chip from being excessively far away from the shell.
Optionally, the obtaining the first eutectic chip and the second eutectic chip specifically includes: and respectively eutectic-crystallizing a plurality of different chips to be eutectic-crystallized on different carriers through soldering lugs to obtain a first eutectic chip and a second eutectic chip.
Specifically, first eutectic chip and second eutectic chip can produce too much heat at the course of the work, because the heat-sinking capability of the material that constitutes the soldering lug is stronger, and the melting point is high, consequently, set up the heat-sinking capability that the soldering lug can improve first eutectic chip in first eutectic chip, also can make first eutectic chip be difficult for melting by the solder joint that the soldering lug becomes in the course of the work. Different chips to be eutectic correspond to different carriers, the shapes and the sizes of the carriers are suitable for the chips to be eutectic corresponding to the carriers, and the carriers have conductivity.
Optionally, fixing a plurality of components on the first circuit board and the second circuit board respectively specifically includes: coating first solder paste on the positions of the components of the first circuit board and the second circuit board; placing components at the positions of the first circuit board and the second circuit board coated with the first solder paste; and placing the first circuit board with the components and the second circuit board with the components on a heating platform to be sintered at a first set temperature.
Specifically, applying a first solder paste to the component locations of the first circuit board and the second circuit board includes: the dispenser is opened, a continuous dispensing mode is adopted, the pressure of the dispenser is set to be 30-60 psi, the pressure range can enable the dispenser to uniformly output first soldering paste, and then a proper amount of first soldering paste is dispensed at the position of a component of the first circuit board. Placing components at the locations where the first and second circuit boards are coated with the first solder paste specifically includes: the components are respectively clamped by tweezers and then placed at the position where the first solder paste is coated on the first circuit board and the position where the first solder paste is coated on the second circuit board. The first solder paste may comprise SN 63 PB 37 The melting point of the first solder paste may be 183 ℃. Will place the first circuit board of placing components and parts and place the second circuit board of components and parts and place and carry out the sintering with first settlement temperature on heating platform and specifically include: the first set temperature is the temperature of the heating platform, and the first set temperature can beAnd (3) at 200-220 ℃, observing under a microscope in the process of sintering the components by the heating platform, and slightly correcting by using tweezers if the components shift and tilt. And after sintering, placing the first circuit board fixed with the components and the second circuit board fixed with the components on filter paper, naturally cooling, and storing in a culture dish for later use.
On the basis of the above embodiment, optionally, the first component further includes a connector therein; obtaining the first component specifically includes: cleaning a first surface and a second surface of the shell, wherein the first surface and the second surface of the shell are arranged oppositely; placing a soldering lug on the first surface of the shell, injecting soldering flux, and placing the first circuit board sintered with the components on the soldering lug; coating a second solder paste on the outer part of the connector, and inserting the connector into a corresponding position of the shell to obtain a second sub-component; placing the second sub-assembly on a heating platform to be sintered at a second set temperature; after sintering, welding the connector with the micro-strip in the first circuit board through a solder wire to obtain a connector component; and cleaning the connector part to obtain a second part.
Specifically, the wide mouth tweezers are used for clamping alcohol cotton soaked with pure alcohol to clean the first surface and the second surface of the shell. Placing a soldering lug on the first surface of the shell at the position for placing the first circuit board and injecting soldering flux through the needle tube, wherein the composition of the soldering lug can be Sn 96.5 Ag 3 Cu 0.5 The melting point of the solder pad may be 217 deg.C, and the flux has a low residue characteristic. Opening the dispenser and adopting a continuous dispensing mode, setting the pressure of the dispenser to be 45-60 psi, and dispensing a circle of second solder paste on the outer edge of the metal of the connector by using the dispenser, wherein the melting point of the second solder paste is 217 ℃, and the components of the second solder paste are Sn 96.5 Ag 3 Cu 0.5 . And inserting the connector into the corresponding position of the shell, wherein the connector is positioned on the side surface of the shell, and the side surface of the shell is adjacent to the first surface. A second bead of solder paste is then dispensed continuously at the gap of the outer ring where the connector contacts the housing. Then, a pressing block tooling fixture is placed on one side, far away from the shell, of the first circuit board, so that the pressing block tooling fixture prevents the first circuit board from moving, and the connector is adjusted under a microscopeThe pins are aligned with the micro-strips in the first circuit board, resulting in a second sub-assembly. The second set temperature is the temperature of the heating table, and the second set temperature can be 255-265 ℃. In the sintering process, when the second solder paste begins to melt, the connector is slightly stirred by the tweezers, so that the second solder paste fully flows, the first circuit board is not required to be displaced in the process, if the first circuit board is displaced, the sintering position of the first circuit board is ensured to be correct by the tweezers, and the pressing block fixture is slightly rubbed to ensure that the first circuit board is fully contacted with the shell. And after sintering, taking the sintered assembly off the heating platform, and placing the assembly on filter paper for natural cooling. And setting the temperature of an electric soldering iron to be 300-350 ℃, and welding the connector and the micro-strip in the first circuit board by using a soldering tin wire with the melting point of 217 ℃ to obtain a connector part. The cleaning of the connector part specifically comprises: and (3) cleaning by using a vapor phase cleaning machine, and placing the connector part in a cleaning tank filled with a cleaning agent at 60 ℃ for boiling for 20-25 min, so that the soldering flux in the first circuit board is released, and the problem of short circuit caused by the fact that the soldering flux is remained in the first circuit board is prevented. And then taking out the boiled connector part and placing the connector part in a culture dish filled with 60 ℃ absolute ethyl alcohol for scrubbing, scrubbing the surface of the first circuit board and the welding part of the connector by using a yellow soft hair brush, scrubbing the gaps around the first circuit board by using a flesh hard hair brush for 4-6 min, placing the connector part after being brushed in an oven at 40-60 ℃ for baking for 4-6 min, taking out the baked connector part, and naturally cooling to 22-25 ℃ to obtain a second part.
Optionally, eutectic chips to be treated in a plurality of different modes are respectively eutectic on different carriers through the soldering lug, and obtaining the first eutectic chip and the second eutectic chip specifically includes: setting the temperature of the eutectic platform as a third set temperature; placing the carrier on a eutectic platform; placing the bonding pad on a carrier; after the to-be-eutectic chips are melted, placing a plurality of to-be-eutectic chips on corresponding carriers, and clamping the to-be-eutectic chips on the carriers by using tweezers to rub the to-be-eutectic chips on the carriers, so that the to-be-eutectic chips are in seamless connection with the carriers, and a first eutectic chip and a second eutectic chip are obtained.
Specifically, the chip to be eutectic comprises a power amplifier to be eutectic, a driving amplifier to be eutectic, a multifunctional chip to be eutectic, an amplitude limiting low-noise amplifier chip to be eutectic, a phase modulation block to be eutectic, an adjustable attenuator chip to be eutectic, a power divider chip to be eutectic and a chip capacitor to be eutectic. Different chips to be eutectic correspond to different carriers. The third set temperature comprises 300 ℃ to 320 ℃. After the temperature of the eutectic platform is set to be the third set temperature, the carrier is placed on the eutectic platform through tweezers, the soldering lug is tiled on the carrier, the soldering lug is observed, when the soldering lug is melted, the soldering lug melted solder is evenly tiled on the carrier through the tweezers, the prepared eutectic chip to be treated is placed on the corresponding carrier, the eutectic chip to be treated is clamped through the tweezers to be fully rubbed, excessive air in the middle is removed, when the carrier is in close contact with the eutectic chip to be treated and gaps are not formed around, the first eutectic chip and the second eutectic chip are obtained, and then the first eutectic chip and the second eutectic chip are clamped into the anti-static object carrying box through the tweezers.
Optionally, the second circuit board that will be provided with components and parts and each second eutectic chip all fix the casing in the third part and keep away from one side of first circuit board, obtain the fourth part and specifically include: coating conductive adhesive on the back surface of the second circuit board provided with the components by using a dispenser; bonding a second circuit board provided with components to one side of the shell, which is far away from the first circuit board, so as to obtain a fourth sub-component; baking the fourth sub-assembly in the oven at a fourth set temperature for a first set time period; bonding the second eutectic chip to one side, far away from the first circuit board, of the shell of the baked fourth sub-component by using a dispenser; and placing the fourth sub-assembly bonded with the second eutectic chip in an oven to be baked for a second set time at a fifth set temperature to obtain a fourth sub-assembly.
Specifically, the fourth set temperature is 100-150 ℃, the first set time is 1h, the fifth set temperature is 100-150 ℃, and the second set time is 1 h-2 h.
Fig. 8 is a schematic structural diagram of a fourth component according to an embodiment of the present invention, and referring to fig. 8, obtaining the fourth component specifically includes: opening the dispenser and adopting a continuous dispensing mode, setting the pressure of the dispenser to be 30-60 psi, uniformly dispensing a layer of conductive adhesive with 1Oz/8Oz latticed components on the back surface (the surface without fixed components) of the second circuit board, placing the second circuit board with the components on the corresponding position of the second surface of the shell by using tweezers, and slightly pressing the second circuit board to ensure that the second circuit board is completely contacted with the shell and is fully bonded with the shell. Inserting the other part of the connector 210 into the corresponding position of the shell, then placing a pressing block tool clamp 220 on one side of the second circuit board far away from the shell, enabling the pressing block tool clamp 220 to prevent the second circuit board from moving, then fixing the connector 210 on the shell, taking out the insulators packaged into single-pin glass and six-pin glass, uniformly coating a circle of conductive adhesive with the component of 1Oz/8Oz on the outer edge of each insulator, then inserting each insulator into the corresponding position of the shell, and then connecting the micro-strip 230 in the second circuit board with the connector 210 to obtain a fourth sub-component; and baking the fourth sub-component in the oven at a fourth set temperature for a first set time, and after baking is finished, taking out the baked fourth sub-component and placing the baked fourth sub-component on filter paper for natural cooling. And opening the dispenser, adopting a continuous dispensing mode, setting the pressure of the dispenser to be 30-60 psi, dispensing a proper amount of conductive adhesive at the position corresponding to the glued second eutectic chip, respectively clamping each second eutectic chip by using tweezers and flatly placing the second eutectic chip at the corresponding position of the second surface of the shell, and placing the fourth sub-component bonded with the second eutectic chip in an oven to bake for a second set time at a fifth set temperature, wherein the adhesive amount is determined according to the size of each second eutectic chip. And after baking is finished, taking out the fourth sub-component bonded with the second eutectic chip from the oven with the cotton glove, and naturally cooling to 22-25 ℃ to obtain the fourth component. It should be noted that the connector 210 directly connected to the microstrip 230 in the second circuit board may be different from the connector directly connected to the microstrip in the first circuit board.
Optionally, the wire bonding the fourth component specifically includes: setting the temperature of the bonding heating platform to be a sixth set temperature, and preheating for a third set time; fixing the fourth component on the bonding heating platform; and carrying out gold wire bonding on the fourth component by using a bonding machine.
Specifically, the sixth set temperature is 95-105 ℃, and the third set time is 10-20 min. When the fourth component is fixed on the bonding heating platform, the flatness of the fourth component needs to be ensured. The gold wire bonding by using the bonding machine specifically comprises the following steps: the height of the workbench is adjusted to ensure that the tip of the cleaver is slightly lower than a welded device when the tip of the cleaver is at the lowest; turning on POWER supply (POWER SWITCH) on MODEL 747677E three-way Bonder to enter "MODEL 7700-Ball Bonder", and toggling SWITCH "BUFFER" to convert program mode BUFFER. The tool is adjusted to heat the knob, and the cleaver is adjusted to be 0 without heating the knob; and performing gold wire bonding according to the wire bonding diagram. The lead wire should be accurately aligned to the middle position of the bonding pad during bonding to ensure the beauty and avoid short circuit.
Optionally, the step of capping the fifth component specifically includes: placing the fifth part in a vacuum pre-bake system; setting the vacuum pre-drying system to be in a vacuum state, setting the temperature to be a seventh set temperature and setting the working time to be a fourth set time, and performing pre-drying treatment on the fifth component; after the pre-baking treatment, the first cover plate is placed on one side of the shell, which is far away from the first circuit board, the second cover plate is placed on one side of the shell, which is far away from the second circuit board, and the laser sealing cover is carried out, so that the first cover plate and the second cover plate are integrally connected with the shell.
Specifically, the seventh set temperature is 100 ℃, and the fourth set time period is 16 h. The first cover plate and the second cover plate can prevent external water vapor, dust and the like from polluting a first circuit board, a second circuit board, a first eutectic chip and the like in the TR component, and the first cover plate and the second cover plate can be made of metal materials. When placing first apron, need to guarantee that power amplifier can ground connection, guarantee that power amplifier can good scattering in the course of the work. FIG. 6 is a schematic diagram of the structure of the TR assembly after laser capping.
Optionally, fix spacing frock apron and specifically include on the frock base: and the screw penetrates through the limiting tool cover plate and is fixed on the tool base.
Specifically, with continued reference to fig. 3, the limiting tooling cover plate in fig. 3 includes a screw hole 30, and the screw passes through the screw hole 30 and is fixed on the tooling base. The limiting tool cover plate is fixed on the tool base through the screws, so that the limiting tool cover plate can be conveniently assembled and disassembled, and can be recycled.
It should be understood that various forms of the flows shown above may be used, with steps reordered, added, or deleted. For example, the steps described in the present invention may be executed in parallel, sequentially, or in different orders, and are not limited herein as long as the desired result of the technical solution of the present invention can be achieved.
The above-described embodiments should not be construed as limiting the scope of the invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be made in accordance with design requirements and other factors. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A manufacturing method of a TR component is characterized by comprising the following steps:
a plurality of components are respectively fixed on the first circuit board and the second circuit board;
sintering the first circuit board fixed with the component on the first surface of the shell to obtain a first part;
the method comprises the steps of obtaining a first eutectic chip and a second eutectic chip, wherein the first eutectic chip comprises a power amplifier and a driving amplifier, and the second eutectic chip comprises a multifunctional chip, an amplitude limiting low-noise amplifier chip, a phase modulation block, an adjustable attenuator chip, a power divider chip and a chip capacitor;
placing the first component on a tooling base, placing each first eutectic chip on a first surface of a shell in the first component, placing a limiting tooling cover plate on one side of the first component far away from the tooling base, aligning a first positioning pin in the limiting tooling cover plate with a second positioning pin on the tooling base, and enabling each first eutectic chip to be positioned in a limiting range of a corresponding limiting pin, and then fixing the limiting tooling cover plate on the tooling base to obtain a second component, wherein a plurality of limiting pins are arranged on one side of the limiting tooling cover plate close to the first eutectic chips, and each first eutectic chip corresponds to one limiting pin;
sintering the second component in a sintering furnace, and removing the tool base and the limiting tool cover plate to obtain a third component after sintering;
fixing a second circuit board provided with components and the second eutectic chips on one side, far away from the first circuit board, of the shell in the third component to obtain a fourth component;
performing wire bonding on the fourth component to obtain a fifth component;
and capping the fifth component to obtain the TR assembly.
2. The method of manufacturing according to claim 1, wherein the spacer pin comprises a plurality of spaced apart spacer posts;
the positioning of each first eutectic chip in the limiting range of the corresponding limiting pin comprises:
and enabling a limiting column in the limiting pin to surround the first eutectic chip corresponding to the limiting pin, and enabling the movable distance of the first eutectic chip in the limiting pin to be smaller than a set distance.
3. The method of claim 1, wherein the obtaining the first eutectic chip and the second eutectic chip specifically comprises:
and respectively eutectic-crystallizing a plurality of different chips to be eutectic-crystallized on different carriers through soldering lugs to obtain the first eutectic chip and the second eutectic chip.
4. The manufacturing method of claim 1, wherein the fixing of the plurality of components on the first circuit board and the second circuit board respectively specifically comprises:
coating first solder paste on the positions of the components of the first circuit board and the second circuit board;
placing components at the positions where the first circuit board and the second circuit board are coated with the first solder paste;
and placing the first circuit board with the components and the second circuit board with the components on a heating platform to be sintered at a first set temperature.
5. The method of manufacturing of claim 1, wherein the first component further comprises a connector;
obtaining the first component specifically includes:
cleaning a first surface and a second surface of the shell, wherein the first surface and the second surface of the shell are arranged oppositely;
placing a soldering lug on the first surface of the shell, injecting soldering flux, and placing the first circuit board sintered with components on the soldering lug;
coating a second solder paste on the outer part of the connector, and inserting the connector into the corresponding position of the shell to obtain a second sub-component;
placing the second sub-assembly on a heating platform to be sintered at a second set temperature;
after sintering, welding the connector with a micro-strip in the first circuit board through a solder wire to obtain a connector component;
and cleaning the connector part to obtain a second part.
6. The manufacturing method according to claim 3, wherein the eutectic chips to be eutectic are eutectic-bonded to different carriers through bonding pads, respectively, and obtaining the first eutectic chip and the second eutectic chip specifically comprises:
setting the temperature of the eutectic platform as a third set temperature;
placing a carrier on the eutectic table;
placing a solder pad on the carrier;
after the to-be-eutectic chips are melted, placing a plurality of to-be-eutectic chips on corresponding carriers, and clamping the to-be-eutectic chips by using tweezers to rub on the carriers, so that the to-be-eutectic chips are in seamless connection with the carriers, and the first eutectic chips and the second eutectic chips are obtained.
7. The manufacturing method according to claim 1, wherein the fixing of the second circuit board provided with the component and each of the second eutectic chips to a side of the housing of the third component, which is away from the first circuit board, specifically includes:
coating conductive adhesive on the back surface of the second circuit board provided with the components by using a dispenser;
bonding a second circuit board provided with components to one side, far away from the first circuit board, of the shell to obtain a fourth sub-component;
baking the fourth sub-assembly in an oven at a fourth set temperature for a first set time period;
bonding the second eutectic chip to one side, far away from the first circuit board, of the shell of the baked fourth sub-component by using a dispenser;
and placing the fourth sub-component bonded with the second eutectic chip in an oven, and baking the fourth sub-component at a fifth set temperature for a second set time period to obtain the fourth component.
8. The method of manufacturing according to claim 1, wherein wire bonding the fourth component specifically comprises:
setting the temperature of the bonding heating platform to be a sixth set temperature, and preheating for a third set time;
fixing the fourth component on the bonding heating platform;
and carrying out gold wire bonding on the fourth component by using a bonding machine.
9. The method of manufacturing according to claim 1, wherein capping the fifth component specifically comprises:
placing the fifth part within a vacuum pre-bake system;
setting the vacuum pre-drying system to be in a vacuum state, setting the temperature to be a seventh set temperature and setting the working time to be a fourth set time, and performing pre-drying treatment on the fifth component;
after the pre-baking treatment, a first cover plate is placed on one side of the shell, which is far away from the first circuit board, a second cover plate is placed on one side of the shell, which is far away from the second circuit board, and laser sealing is carried out, so that the first cover plate and the second cover plate are integrally connected with the shell.
10. The manufacturing method according to claim 1, wherein the step of fixing the limiting tool cover plate on the tool base specifically comprises:
and penetrating a screw through the limiting tool cover plate and fixing the screw on the tool base.
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Address after: 230088 building e, Anhui scientific and technological achievements transformation demonstration base, No. 425, Chuangxin Avenue, high tech Zone, Hefei, Anhui Patentee after: Hefei Silicon Valley Microelectronics Co.,Ltd. Address before: 230088 building e, Anhui scientific and technological achievements transformation demonstration base, No. 425, Chuangxin Avenue, high tech Zone, Hefei, Anhui Patentee before: HEFEI IC VALLEY MICROELECTRONICS Co.,Ltd. |
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