CN115016680B - Touch device and electronic equipment - Google Patents
Touch device and electronic equipment Download PDFInfo
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- CN115016680B CN115016680B CN202210599322.7A CN202210599322A CN115016680B CN 115016680 B CN115016680 B CN 115016680B CN 202210599322 A CN202210599322 A CN 202210599322A CN 115016680 B CN115016680 B CN 115016680B
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- 239000012790 adhesive layer Substances 0.000 claims description 39
- 239000010410 layer Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000004033 plastic Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 230000000994 depressogenic effect Effects 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005382 thermal cycling Methods 0.000 abstract description 18
- 238000010586 diagram Methods 0.000 description 22
- 239000003292 glue Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000001000 micrograph Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000012795 verification Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 101150110969 gap1 gene Proteins 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011664 nicotinic acid Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/043—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using propagating acoustic waves
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Acoustics & Sound (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Position Input By Displaying (AREA)
Abstract
The application relates to the technical field of touch display, and provides a touch device and electronic equipment. In the touch device and the electronic equipment, the touch device at least comprises a cover plate, an ultrasonic sensing piece and a bonding layer. Through setting up the constant head tank on the apron, set up step portion in the constant head tank, when the ultrasonic sensing piece was located on the locating surface of step portion, the region that forms between the diapire of ultrasonic sensing piece and constant head tank can be used for the holding tie coat. Therefore, when the ultrasonic sensing piece is tightly pressed with the cover plate, the bonding layer can be ensured to have a certain thickness, and then the bonding layer is not easy to peel off during thermal cycling, so that the reliability of the touch device is improved, and the structural failure of the touch device is avoided.
Description
Technical Field
The present disclosure relates to touch display technologies, and in particular, to a touch device and an electronic device.
Background
In the related art, after the ultrasonic sensing piece or the cover plate is coated with the adhesive, the ultrasonic sensing piece and the cover plate are tightly pressed, and the ultrasonic sensing piece and the cover plate are fixed by means of the adhesive layer. However, the adhesive layer between the ultrasonic sensing element and the cover plate is easy to peel off after thermal cycling, so that the connecting structure of the ultrasonic sensing element and the cover plate is invalid.
Disclosure of Invention
Based on this, it is necessary to provide a touch device and an electronic apparatus, so as to improve the reliability of the touch device and avoid the structural failure of the touch device.
According to one aspect of the present application, there is provided a touch device, including:
the first surface of the cover plate is provided with a positioning groove;
the ultrasonic sensing piece is positioned in the positioning groove; and
the ultrasonic sensing piece is adhered in the positioning groove by the aid of the adhesive layer;
the positioning groove is provided with a step part, and the step part is provided with a positioning surface for positioning the ultrasonic sensing piece in a first direction;
the ultrasonic sensing piece is positioned on the positioning surface, and the adhesive layer is arranged in an area formed between the ultrasonic sensing piece and the bottom wall of the positioning groove;
the first direction is perpendicular to the first surface.
In one embodiment, the step portion includes at least one step;
each of the steps has the positioning face that positions the ultrasonic sensing element in the first direction;
the ultrasonic sensing piece is positioned on the positioning surface corresponding to the step.
In one embodiment, the plane of each positioning surface is a reference plane, and the plane of the bottom wall is a first plane;
the reference plane, the first plane and the first surface are parallel to each other;
and along the first direction, the distance between two adjacent surfaces among the reference plane, the first plane and the first surface is 100 micrometers to 150 micrometers.
In one embodiment, the detent has a plurality of circumferential side walls;
along the first direction, two adjacent ones of the bottom wall, the positioning surface and the first surface are connected by means of one circumferential side wall.
In one embodiment, the material of the adhesive layer includes at least one of epoxy, polyacrylic, and phenolic.
In one embodiment, the material of the cover plate comprises metal or plastic.
In one embodiment, the ultrasonic sensing element comprises an ultrasonic receiving unit and an ultrasonic transmitting unit which are stacked along the first direction;
the ultrasonic wave transmitting unit is closer to the cover plate than the ultrasonic wave receiving unit.
In one embodiment, the ultrasound transmitting unit further comprises a housing;
the shell is towards the side surface of apron towards keeping away from the direction of apron is sunken to be formed with the depressed part, ultrasonic wave receiving element with the ultrasonic wave transmitting unit holds in the depressed part.
In one embodiment, a side surface of the ultrasonic wave transmitting unit facing the cover plate is flush with a side surface of the housing facing the cover plate.
In one embodiment, the ultrasonic wave transmitting unit includes a first piezoelectric sheet, and the ultrasonic wave receiving unit includes a second piezoelectric sheet.
According to another aspect of the present application, an embodiment of the present application provides an electronic device, including the touch device described above.
In the touch device and the electronic equipment, the touch device at least comprises a cover plate, an ultrasonic sensing piece and a bonding layer. Through setting up the constant head tank on the apron, set up step portion in the constant head tank, when the ultrasonic sensing piece was located on the locating surface of step portion, the region that forms between the diapire of ultrasonic sensing piece and constant head tank can be used for the holding tie coat. Therefore, when the ultrasonic sensing piece is tightly pressed with the cover plate, the bonding layer can be ensured to have a certain thickness, and then the bonding layer is not easy to peel off during thermal cycling, so that the reliability of the touch device is improved, and the structural failure of the touch device is avoided.
Additional aspects and advantages of embodiments of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the application.
Drawings
Fig. 1 is a schematic structural diagram of a touch device in an embodiment of the related art;
fig. 2 is a schematic structural diagram of a touch device according to another embodiment of the related art;
FIG. 3 is a schematic structural diagram of a touch device according to an embodiment of the present disclosure;
FIG. 4 is a schematic structural diagram of a touch device according to a comparative example of the present application;
fig. 5 is a schematic structural diagram of a touch device in a first state according to an embodiment of the present application;
FIG. 6 is a schematic structural diagram of a touch device in a second state according to an embodiment of the present disclosure;
FIG. 7 is a schematic diagram illustrating thermal deformation between the bonding layer, the cover plate and the ultrasonic sensor after thermal cycling of the touch device according to an embodiment of the present disclosure;
FIG. 8 is a schematic view of thermal deformation between the bonding layer and the cover plate, and between the bonding layer and the ultrasonic sensor after thermal cycling of the touch device according to a comparative example of the present application;
FIG. 9 is a scanning electron microscope image of an adhesive layer of a touch device after thermal cycling in an embodiment of the present application;
FIG. 10 is a scanning electron microscope image of the bonding layer of the touch device of FIG. 4 after thermal cycling;
FIG. 11 is a schematic diagram of a pressing measurement waveform of the touch device shown in FIG. 4 after the assembly is completed;
FIG. 12 is a waveform diagram of the pressing force of the touch device after thermal cycling shown in FIG. 4;
FIG. 13 is a schematic diagram of a pressing measurement waveform of a touch device according to an embodiment of the present disclosure;
fig. 14 is a waveform diagram of a pressing measurement of a touch device after thermal cycling in an embodiment of the present application.
Reference numerals simply denote:
f: finger 10: upper cover
20: piezoelectric element 30: colloid
40: light guide column
100: cover plate 101: a first surface
110: positioning groove 111: step part
1111: step a: positioning surface
112: bottom wall 113: side wall
114: circumferential side wall
200: ultrasonic sensing element 210: ultrasonic wave receiving unit
220: an ultrasonic wave transmitting unit 230: outer casing
231: recess portion
300: adhesive layer
R0: reference plane R1: first plane
F1: first direction
h1, h2, h3: distance of
d1, d2: size of the device
z1, z2, z3, z4: region(s)
Detailed Description
In order to make the above objects, features and advantages of the present application more comprehensible, a detailed description of embodiments accompanied with figures is provided below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of embodiments of the present application. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application. The embodiments of the present application may be implemented in many other ways than those described herein, and similar modifications may be made by those skilled in the art without departing from the spirit of the invention, so that the embodiments of the present application are not limited to the specific embodiments disclosed below.
It will be appreciated that the terms "first," "second," and the like, as used herein, may be used to describe various terms, and are not to be interpreted as indicating or implying a relative importance or an implicit indication of the number of technical features being indicated. However, unless specifically stated otherwise, these terms are not limited by these terms. These terms are only used to distinguish one term from another. In the description of the embodiments of the present application, the meaning of "a plurality", "a number" or "a plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.
In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
In the description of embodiments of the present application, unless explicitly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intermediary. Moreover, a first feature being "above," "over" and "on" a second feature may be that the first feature is directly above or obliquely above the second feature, or simply indicates that the first feature level is higher than the second feature level. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature level is less than the second feature level.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
Fig. 1 is a schematic structural diagram of a touch device according to an embodiment of the related art; fig. 2 is a schematic structural diagram of a touch device according to another embodiment of the related art; for convenience of explanation, only portions related to the related art embodiments are shown.
As shown in fig. 1, in an embodiment of the related art, the touch device includes an upper cover 10, a piezoelectric element 20 and a glue 30, wherein the piezoelectric element 20 is fixed to the upper cover 10 by the glue 30. The piezoelectric element 20 generates a fixed frequency of ultrasonic waves. When the finger f touches the switch, the waveform of the ultrasonic wave is changed, and the piezoelectric element 20 performs a switch command after sensing.
The inventor of the present application has noted that, after the piezoelectric element 20 or the upper cover 10 is glued, the glue 30 flows or extends outwards from the lamination space formed between the piezoelectric element 20 and the upper cover 10 in the process of tightly laminating the piezoelectric element 20 and the upper cover 10, so that the thickness of the glue layer formed by the glue 30 is reduced. After thermal cycling, the thinned gel layer is more likely to peel off, thereby disabling the connection structure of the piezoelectric element 20 and the upper cover 10. In addition, as shown in fig. 2, if the glue 30 is too much, the glue 30 overflows during the pressing process. The overflowed gel 30 adheres to the surrounding elements (e.g., the light guide posts 40) of the piezoelectric element 20. When the light guide post 40 is pried, the piezoelectric element 20 is driven, and the reliability of the connection between the piezoelectric element 20 and the upper cover 10 is also affected.
Based on this, the embodiment of the application can effectively improve the reliability of the touch device by improving the structure of the touch device, thereby avoiding the occurrence of some of the problems noted above. The touch device provided in the embodiments of the present application is described in the following with reference to the related descriptions of some embodiments.
Fig. 3 is a schematic structural diagram of a touch device according to an embodiment of the disclosure; FIG. 4 is a schematic structural diagram of a touch device according to a comparative example of the present application; for ease of illustration, only the portions relevant to the examples of the present application and the comparative examples of the present application are shown.
In some embodiments, referring to fig. 3, a touch device is provided, and the touch device includes a cover plate 100, an ultrasonic sensing element 200, and an adhesive layer 300. The first surface 101 of the cover plate 100 is provided with a positioning groove 110. The ultrasonic sensing element 200 is positioned in the positioning groove 110. The adhesive layer 300 is disposed in the positioning groove 110, and the ultrasonic sensing element 200 is adhered in the positioning groove 110 by means of the adhesive layer 300. The positioning groove 110 is provided with a step 111, and the step 111 has a positioning surface a for positioning the ultrasonic sensor 200 in the first direction F1 (i.e., the up-down direction illustrated in fig. 3). The ultrasonic sensing element 200 is positioned on the positioning surface a, and an adhesive layer 300 is arranged in an area formed between the ultrasonic sensing element 200 and the bottom wall 112 of the positioning groove 110. The first direction F1 is perpendicular to the first surface 101.
The "ultrasonic sensor 200" refers to a device that can generate an ultrasonic signal with a fixed frequency, or can receive a reflected ultrasonic signal to perform a sensing function.
In some comparative examples, referring to fig. 4, if the positioning groove 110 is not provided, the cover plate 100 and the ultrasonic sensor 200 pressed together will thin the thickness of the adhesive layer 300, as analyzed above. As is apparent from a combination of fig. 3 and 4, the adhesive layer 300 in both structures is not uniform in thickness. In fig. 3 of the embodiment of the present application, due to the step portion, it is possible to ensure that the adhesive layer 300 has a certain thickness.
Fig. 5 is a schematic structural diagram of a touch device in a first state according to an embodiment of the present application; fig. 6 is a schematic structural diagram of a touch device in a second state according to an embodiment of the present application; for convenience of explanation, only portions relevant to the embodiments of the present application are shown. The "first state" refers to a state in which the touch device is not yet assembled, and the "second state" refers to a state in which the touch device is assembled.
Thus, as shown in fig. 5 and 6, when the ultrasonic sensor 200 is positioned on the positioning surface a of the stepped portion 111, a region formed between the ultrasonic sensor 200 and the bottom wall 112 of the positioning groove 110 may be used to accommodate the adhesive layer 300. In this way, on the one hand, it is possible to ensure that the adhesive layer 300 has a certain thickness, and thus the adhesive layer 300 is not easily peeled off during thermal cycling. On the other hand, even if the adhesive layer 300 overflows, it is limited in the positioning groove 110, and thus the overflowed glue is prevented from adhering to other components. Therefore, by providing the positioning groove 110 and the step portion 111 in the positioning groove 110, the reliability of the touch device can be improved, and structural failure of the touch device can be avoided.
In some embodiments, referring to fig. 3, the step 111 includes at least one step 1111. Each step 1111 has a positioning surface a that positions the ultrasonic sensing member 200 in the first direction F1. The ultrasonic sensor 200 is positioned at the positioning surface a of the corresponding step 1111. For example, fig. 3 illustrates a case where the step portion 111 includes one step 1111. Of course, the step 111 may also include a plurality of steps 1111. When the step portion 111 includes a plurality of steps 1111, if glue overflow occurs, the adhesive layer 300 is limited in the positioning groove 110 due to the more steps 1111.
In particular to some embodiments, the step 111 may be formed on the bottom wall 112 of the positioning groove 110. At this time, a plurality of stepped portions 111 spaced apart from each other and independent from each other may be provided on the bottom wall 112 of the positioning groove 110. Each of the stepped portions 111 may include at least one step 1111 thereon. Of course, in particular to other embodiments, as shown in fig. 3, the step 111 may be provided on the side wall 113 of the positioning groove 110 and around the bottom wall 112 of the positioning groove 110. May be selected according to the specific use case, and is not particularly limited in the embodiments of the present application.
In some embodiments, please continue to refer to fig. 3, the plane of each positioning surface a is a reference plane R0, and the plane of the bottom wall 112 is a first plane R1. The reference plane R0, the first plane R1 and the first surface 101 are parallel to each other. The distance between adjacent two surfaces among the reference plane R0, the first plane R1, and the first surface 101 along the first direction F1 is 100 micrometers to 150 micrometers. Therefore, the thickness can be controlled and glue overflow can be avoided according to the use requirement.
The "adjacent two surfaces" refer to two planes adjacent to each other in the first direction F1. Taking one step as an example in fig. 3, the first surface 101, the reference plane R0, and the first plane R1 are sequentially disposed along the first direction F1. At this time, the first surface 101 is adjacent to the reference plane R0, the first plane R1 is adjacent to the reference plane R0, and the reference plane R0 is located between the first surface 101 and the first plane R1. The distance h1 between the first surface 101 and the reference plane R0 is 100 micrometers to 150 micrometers, and the distance h2 between the first plane R1 and the reference plane R0 is 100 micrometers to 150 micrometers. When two steps are provided, two positioning surfaces a are provided, namely two reference planes R0 are correspondingly provided, and the first surface 101, the reference plane R0 and the first plane R1 are sequentially arranged along the first direction F1. Along the first direction F1, the first surface 101 is adjacent to a reference plane R0 located upstream, the first plane R1 is adjacent to a reference plane R0 located downstream, and the two reference planes R0 are located between the first surface 101 and the first plane R1. At this time, the distance between the adjacent two faces may be set with reference to the above range. In the case where the step portion 111 has three or more steps 1111, the same can be said, and the description thereof will be omitted. It should be noted that the distances between two adjacent surfaces may be the same or different, which is not particularly limited in the embodiment of the present application.
In some embodiments, referring to fig. 3, the positioning groove 110 has a plurality of circumferential sidewalls 114. Adjacent two of the bottom wall 112, the positioning surface a and the first surface 101 are connected by means of a circumferential side wall 114 along the first direction F1. That is, the stepped portion 111 is formed around the sidewall 113 of the positioning groove 110. The circumferential side walls 114 together constitute the side walls 113. As such, the structure formed for positioning the ultrasonic sensing member 200 may be further defined.
It should be noted that, taking fig. 3 as an example, the bottom wall 112 is adjacent to the positioning surface a, the bottom wall 112 is connected to the positioning surface a by the corresponding circumferential side wall 114, the first surface 101 is adjacent to the positioning surface a, and the first surface 101 is connected to the positioning surface a by the corresponding circumferential side wall 114. When two steps are provided, there are two positioning surfaces a and three circumferential side walls 114, and the first surface 101, the positioning surface a, and the bottom wall 112 are sequentially disposed along the first direction F1. In the first direction F1, the first surface 101 is connected to an upstream-located positioning surface a by means of one circumferential side wall 114, the upstream-located positioning surface a is connected to a downstream-located positioning surface a by means of another circumferential side wall 114, and the downstream-located positioning surface a is connected to the bottom wall 112 by means of yet another circumferential side wall 114. In the case where the step portion 111 has three or more steps 1111, the same can be said, and the description thereof will be omitted. It should be noted that, the circumferential side wall 114 may have a planar structure, a curved structure, or other structures. When the circumferential sidewall 114 is in a planar structure, the plane thereof is parallel to the first direction F1 or disposed at an angle. For example, fig. 3 illustrates a case where the circumferential side wall 114 has a planar structure and is parallel to the first direction F1. The setting may be performed according to actual use conditions, and this is not particularly limited in the embodiment of the present application.
With continued reference to fig. 3, in some embodiments, the ultrasonic sensor 200 includes an ultrasonic receiving unit 210 and an ultrasonic transmitting unit 220 stacked along a first direction F1. The ultrasonic wave transmitting unit 220 is closer to the cover plate 100 than the ultrasonic wave receiving unit 210. Alternatively, the ultrasonic wave transmitting unit 220 includes a first piezoelectric sheet, and the ultrasonic wave receiving unit 210 includes a second piezoelectric sheet. That is, the ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210 may be provided in the form of a piezoelectric sheet. Of course, other structures that can implement ultrasonic sensing may be provided, and the embodiment of the present application is not particularly limited.
In particular to some embodiments, the ultrasound transmission unit 220 further comprises a housing 230. A recess 231 is formed in a surface of the housing 230 facing the cover plate 100 toward a direction away from the cover plate 100, and the ultrasonic wave receiving unit 210 and the ultrasonic wave transmitting unit 220 are accommodated in the recess 231. In this way, the ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210 can be protected by the housing 230.
To achieve good acoustic wave transmission, in some embodiments, please continue to refer to fig. 3, a side surface of the ultrasonic wave transmitting unit 220 facing the cover plate 100 is flush with a side surface of the housing 230 facing the cover plate 100.
In some embodiments, the ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210 may be provided in a piezoelectric sheet structure of a disc shape. Correspondingly, the positioning groove may be provided in a shape that mates with the wafer-shaped ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210. Taking fig. 3 as an example, to control the volume of the adhesive layer 300, the size d1 of the groove (i.e., the diameter of the groove) accommodating the adhesive layer 300 may be set to be slightly smaller than the diameter of the ultrasonic sensor 200. To avoid glue overflow, the dimension d2 of the groove (i.e., the diameter of the groove) supporting the ultrasonic sensor 200 may be set to be slightly larger than the diameter of the ultrasonic sensor 200. Alternatively, d1 may be 8 mm to 9.5 mm. d2 may be 9.7 mm to 10.3 mm. The setting may be performed according to actual use conditions, and this is not particularly limited in the embodiment of the present application.
Since the ultrasonic sensor 200 needs to transmit and receive signals, the adhesive layer 300 between the ultrasonic sensor 200 and the cover plate 100 needs to have good acoustic wave transmission and adhesion. In some embodiments, the material of the adhesive layer 300 includes at least one of epoxy, polyacrylic, and phenolic.
In some embodiments, the material of the cover plate 100 includes metal or plastic. When the metal material is selected, the material such as aluminum alloy, stainless steel or brass can be selected. When the plastic material is selected, polycarbonate, polyamide fiber or acrylonitrile-butadiene-styrene plastic and other materials can be selected. The selection may be made according to actual use conditions, and the embodiment of the present application is not particularly limited thereto.
The touch device provided in the embodiments of the present application will be further described with reference to the above embodiments and fig. 7 to 10.
The thermal cycle simulation flow is as follows: firstly, locking the touch device by using screws at normal temperature; secondly, heating the touch device to 70 ℃; finally, the temperature of the touch device is reduced to minus 30 ℃. After the thermal cycle is completed, the touch device is subjected to tensile verification of peeling of the adhesive layer 300.
Fig. 7 and 8 illustrate thermal deformation between the adhesive layer 300 and the cover plate 100, the ultrasonic sensor 200 after thermal cycling. In the case where three ultrasonic sensing members 200 spaced apart from each other are provided on the cover plate 100 in fig. 7 and 8, the three ultrasonic sensing members 200 are cylindrical. The cover plate 100 in fig. 7 is provided with three positioning slots 110 spaced from each other, and the three positioning slots 110 are in one-to-one correspondence with the three ultrasonic sensing elements 200. The cover plate 100 in fig. 8 is not provided with the positioning groove 110.
It should be noted that Gap represents a color that generates a different Gap, gap1 represents a specific Gap size in mm, and negative represents a Gap generated, and the larger the vertical of the negative represents a Gap larger. The gap is a region formed between the adhesive layer 300 and the cover plate 100 and the ultrasonic sensor 200 due to peeling of the adhesive layer 300. Gaps of different sizes have different colors, which will also follow the change in gap size. The change in color means that the color changes gradually from a warm tone to a cool tone as the gap becomes larger.
As shown in fig. 7 and 8, the change in color appears as a gradual transition from a warm tone to a cool tone from the center to the outside. It can be seen that the gap is concentrated in the edge region of the ultrasonic sensing member 200. The gap of the edge area of the ultrasonic sensing element 200 is about 0.1 micrometer through the touch device after thermal cycling. The gap created in fig. 7 is smaller than the gap created in fig. 8.
Fig. 9 and 10 illustrate scanning electron microscope images of the adhesive layer 300 after thermal cycling. Fig. 9 is a schematic diagram of a touch device according to an embodiment of the present application, and fig. 10 is a schematic diagram of the touch device shown in fig. 4. As shown in fig. 9, there is a small bubble in the region z1 and some peeling occurs in the region z2, but the thickness of the adhesive layer 300 is uniform as a whole. As shown in fig. 10, there are many small bubbles in the region z3, the peeled state is mostly treated in the region z4, and the thickness of the adhesive layer 300 is not uniform as a whole. In the subsequent tensile verification process, the tensile stress of the adhesive layer 300 of the touch device shown in fig. 9 is greater than that of the adhesive layer 300 of the touch device shown in fig. 10.
FIG. 11 is a schematic diagram illustrating a pressing measurement waveform of the touch device shown in FIG. 4 after the touch device is assembled; FIG. 12 is a graph illustrating a waveform of the pressing force of the touch device of FIG. 4 after thermal cycling; FIG. 13 is a schematic diagram illustrating a pressing measurement waveform after the touch device is assembled according to an embodiment of the present disclosure; FIG. 14 is a diagram illustrating a waveform of a pressing force measurement of a touch device after thermal cycling according to an embodiment of the present disclosure; for convenience of explanation, only portions relevant to the embodiments of the present application are shown. The touch device in fig. 11 and 12 is not provided with the positioning groove 110, and the touch device in fig. 13 and 14 is provided with the positioning groove 110.
In fig. 11 to 14, UDC is an ultrasonic-converted digital reading, which is a reading obtained by converting ultrasonic waves into digital signals for comparison. freq is the frequency of the ultrasonic wave. L1 represents a curve generated when a finger touches the cover plate 100, and L2 represents a curve generated when the finger leaves the cover plate 100. As shown in fig. 11 to 14, the touch device provided in the embodiment of the present application can still keep close contact after thermal cycling, and the operation is normal.
As can be seen from the above test procedure, the reliability of the touch device provided in the embodiment of the present application is significantly better than that of the touch device in the comparative example.
Based on the same inventive concept, the embodiment of the application also provides an electronic device, which comprises the touch device in the embodiment.
It should be understood that the electronic device provided in the above embodiment may be applied to fields such as a mobile phone terminal, a bionic electronic device, an electronic skin, a wearable device, a vehicle-mounted device, an internet of things device, and an artificial intelligent device. For example, the electronic device may be a mobile phone terminal, a tablet, a palm top computer, an ipod, a smart watch, a laptop computer, a television, a monitor, or the like. The electronic device provided in the foregoing embodiment may be the device illustrated in the foregoing, which is not specifically limited in the embodiments of the present application.
In summary, in the touch device provided by the embodiment of the present application, by disposing the positioning groove 110 on the cover plate 100, the step portion 111 is disposed in the positioning groove 110, and when the ultrasonic sensor 200 is positioned on the positioning surface a of the step portion 111, the area formed between the ultrasonic sensor 200 and the bottom wall 112 of the positioning groove 110 can be used for accommodating the adhesive layer 300. In this way, when the ultrasonic sensor 200 is tightly pressed against the cover plate 100, the adhesive layer 300 can be ensured to have a certain thickness, so that the adhesive layer 300 is not easy to peel off during thermal cycling. In addition, even if the adhesive layer 300 overflows, the adhesive layer is limited in the positioning groove 110, so that the overflowed adhesive is prevented from adhering to other components. Therefore, the reliability of the touch device is improved, and structural failure of the touch device is avoided.
The technical features of the above embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples merely represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of protection of the present application is to be determined by the claims appended hereto.
Claims (10)
1. A touch device, comprising:
the first surface of the cover plate is provided with a positioning groove;
the ultrasonic sensing piece is positioned in the positioning groove; and
the ultrasonic sensing piece is adhered in the positioning groove by the aid of the adhesive layer;
the positioning groove is provided with a step part, and the step part comprises at least one step; each step is provided with a positioning surface for positioning the ultrasonic sensing piece in a first direction;
the positioning groove is provided with a plurality of circumferential side walls; along the first direction, the bottom wall of the positioning groove, the positioning surface and the adjacent two of the first surface are connected by means of the circumferential side wall;
the ultrasonic sensing piece is positioned on the positioning surface corresponding to the step, and the bonding layer is arranged in an area formed between the ultrasonic sensing piece and the bottom wall;
the first direction is perpendicular to the first surface.
2. The touch device of claim 1, wherein the plane of each positioning surface is a reference plane, and the plane of the bottom wall is a first plane;
the reference plane, the first plane and the first surface are parallel to each other;
and along the first direction, the distance between two adjacent surfaces among the reference plane, the first plane and the first surface is 100 micrometers to 150 micrometers.
3. The touch device of claim 1, wherein the step is provided on the bottom wall.
4. The touch device of any of claims 1-3, wherein the material of the adhesive layer comprises at least one of an epoxy, a polyacrylic, and a phenolic.
5. A touch device according to any of claims 1-3, wherein the material of the cover plate comprises metal or plastic.
6. The touch device according to any one of claims 1 to 3, wherein the ultrasonic sensing element includes an ultrasonic receiving unit and an ultrasonic transmitting unit stacked along the first direction;
the ultrasonic wave transmitting unit is closer to the cover plate than the ultrasonic wave receiving unit.
7. The touch device of claim 6, wherein the ultrasonic wave transmitting unit further comprises a housing;
the shell is towards the side surface of apron towards keeping away from the direction of apron is sunken to be formed with the depressed part, ultrasonic wave receiving element with the ultrasonic wave transmitting unit holds in the depressed part.
8. The touch device according to claim 7, wherein a side surface of the ultrasonic wave emitting unit facing the cover plate is flush with a side surface of the housing facing the cover plate.
9. The touch device of claim 6, wherein the ultrasonic wave transmitting unit comprises a first piezoelectric sheet and the ultrasonic wave receiving unit comprises a second piezoelectric sheet.
10. An electronic device comprising a touch device according to any of claims 1-9.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210599322.7A CN115016680B (en) | 2022-05-30 | 2022-05-30 | Touch device and electronic equipment |
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| CN202210599322.7A CN115016680B (en) | 2022-05-30 | 2022-05-30 | Touch device and electronic equipment |
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| CN115016680A CN115016680A (en) | 2022-09-06 |
| CN115016680B true CN115016680B (en) | 2023-08-01 |
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| CN106325396A (en) * | 2016-10-19 | 2017-01-11 | 广东欧珀移动通信有限公司 | Mobile terminal, cover plate component and manufacturing method of cover plate component |
| CN108008780A (en) * | 2018-01-22 | 2018-05-08 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN207851686U (en) * | 2018-01-22 | 2018-09-11 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN111338511A (en) * | 2020-02-28 | 2020-06-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
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| CN109714915A (en) * | 2017-10-25 | 2019-05-03 | 杭州疆域创新医疗科技有限公司 | Opening-closing structure and electronic device with the opening-closing structure |
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| CN105045347A (en) * | 2015-08-31 | 2015-11-11 | 广东欧珀移动通信有限公司 | Terminal front cover assembly and mobile terminal |
| CN106325396A (en) * | 2016-10-19 | 2017-01-11 | 广东欧珀移动通信有限公司 | Mobile terminal, cover plate component and manufacturing method of cover plate component |
| CN108008780A (en) * | 2018-01-22 | 2018-05-08 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN207851686U (en) * | 2018-01-22 | 2018-09-11 | 广东欧珀移动通信有限公司 | Electronic equipment |
| CN111338511A (en) * | 2020-02-28 | 2020-06-26 | 昆山国显光电有限公司 | Display panel, display device and preparation method of display panel |
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Effective date of registration: 20240115 Address after: 518109, Building E4, 101, Foxconn Industrial Park, No. 2 East Ring 2nd Road, Fukang Community, Longhua Street, Longhua District, Shenzhen City, Guangdong Province (formerly Building 1, 1st Floor, G2 District), H3, H1, and H7 factories in K2 District, North Shenchao Optoelectronic Technology Park, Minqing Road, Guangdong Province Patentee after: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee after: Interface Technology (Chengdu) Co., Ltd. Patentee after: GENERAL INTERFACE SOLUTION Ltd. Address before: No.689 Hezuo Road, West District, high tech Zone, Chengdu City, Sichuan Province Patentee before: Interface Technology (Chengdu) Co., Ltd. Patentee before: INTERFACE OPTOELECTRONICS (SHENZHEN) Co.,Ltd. Patentee before: Yicheng Photoelectric (Wuxi) Co.,Ltd. Patentee before: GENERAL INTERFACE SOLUTION Ltd. |