CN115016680A

CN115016680A - Touch device and electronic equipment

Info

Publication number: CN115016680A
Application number: CN202210599322.7A
Authority: CN
Inventors: 杨苡甄; 陈全正
Original assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; Yecheng Optoelectronics Wuxi Co Ltd; General Interface Solution Ltd
Current assignee: Interface Optoelectronics Shenzhen Co Ltd; Interface Technology Chengdu Co Ltd; General Interface Solution Ltd
Priority date: 2022-05-30
Filing date: 2022-05-30
Publication date: 2022-09-06
Anticipated expiration: 2042-05-30
Also published as: CN115016680B

Abstract

The application relates to the technical field of touch display, and provides a touch device and electronic equipment. In the touch device and the electronic device, the touch device at least comprises a cover plate, an ultrasonic sensing piece and a bonding layer. Through set up the constant head tank on the apron, set up step portion in the constant head tank, when ultrasonic sensing piece was located the locating surface of step portion, the region that forms between the diapire of ultrasonic sensing piece and constant head tank can be used for the holding tie coat. So, closely when laminating ultrasonic sensing spare and apron, can guarantee that the tie coat has certain thickness, and then make when thermal cycle, the tie coat is difficult for peeling off to improve touch device's reliability, avoided touch device's structural failure.

Description

Touch device and electronic equipment

Technical Field

The present disclosure relates to touch display technologies, and particularly to a touch device and an electronic apparatus.

Background

In the related art, after the ultrasonic sensing member or the cover plate is coated with glue, the ultrasonic sensing member and the cover plate are tightly pressed, and the ultrasonic sensing member and the cover plate are fixed by means of a glue layer. However, the adhesive layer between the ultrasonic sensor and the cover plate is easily peeled off after thermal cycling, so that the connection structure between the ultrasonic sensor and the cover plate is failed.

Disclosure of Invention

Accordingly, there is a need for a touch device and an electronic apparatus, which can improve the reliability of the touch device and avoid the structural failure of the touch device.

According to an aspect of the present application, there is provided a touch device including:

the cover plate is provided with a positioning groove on a first surface;

the ultrasonic sensing piece is positioned in the positioning groove; and

the ultrasonic sensing piece is arranged in the positioning groove and is bonded in the positioning groove by virtue of the bonding layer;

the positioning groove is provided with a step part, and the step part is provided with a positioning surface used for positioning the ultrasonic sensing piece in a first direction;

the ultrasonic sensing piece is positioned on the positioning surface, and the bonding layer is arranged in an area formed between the ultrasonic sensing piece and the bottom wall of the positioning groove;

the first direction is perpendicular to the first surface.

In one embodiment, the step portion comprises at least one step;

each step has the positioning face that positions the ultrasonic sensor in the first direction;

the ultrasonic sensing piece is positioned on the positioning surface corresponding to the step.

In one embodiment, a plane where each positioning surface is located is a reference plane, and a plane where the bottom wall is located is a first plane;

the reference plane, the first plane and the first surface are parallel to each other;

along the first direction, the distance between two adjacent faces of the reference plane, the first plane and the first surface is 100-150 micrometers.

In one embodiment, the detent groove has a plurality of circumferential side walls;

along the first direction, two adjacent ones of the bottom wall, the positioning surface and the first surface are connected by means of the circumferential side wall.

In one embodiment, the material of the adhesive layer includes at least one of an epoxy resin, a polyacrylic resin, and a phenolic resin.

In one embodiment, the material of the cover plate comprises metal or plastic.

In one embodiment, the ultrasonic sensing member includes an ultrasonic receiving unit and an ultrasonic transmitting unit which are stacked in the first direction;

the ultrasonic wave transmitting unit is closer to the cover plate than the ultrasonic wave receiving unit.

In one embodiment, the ultrasound transmission unit further comprises a housing;

the surface of one side of the shell facing the cover plate is recessed towards the direction far away from the cover plate to form a recessed part, and the ultrasonic receiving unit and the ultrasonic transmitting unit are contained in the recessed part.

In one embodiment, a side surface of the ultrasonic wave emitting unit facing the cover plate is flush with a side surface of the housing facing the cover plate.

In one embodiment, the ultrasonic wave transmitting unit includes a first piezoelectric sheet, and the ultrasonic wave receiving unit includes a second piezoelectric sheet.

According to another aspect of the present application, an embodiment of the present application provides an electronic device, which includes the touch device described above.

In the touch device and the electronic device, the touch device at least comprises a cover plate, an ultrasonic sensing piece and a bonding layer. Through set up the constant head tank on the apron, set up step portion in the constant head tank, when ultrasonic sensing piece was located the locating surface of step portion, the region that forms between the diapire of ultrasonic sensing piece and constant head tank can be used for the holding tie coat. So, closely when laminating ultrasonic sensing spare and apron, can guarantee that the tie coat has certain thickness, and then make when thermal cycle, the tie coat is difficult for peeling off to improve touch device's reliability, avoided touch device's structural failure.

Additional aspects and advantages of embodiments of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the present application.

Drawings

Fig. 1 is a schematic structural diagram of a touch device in an embodiment of the related art;

FIG. 2 is a schematic structural diagram of a touch device in another embodiment of the related art;

fig. 3 is a schematic structural diagram of a touch device according to an embodiment of the present disclosure;

FIG. 4 is a schematic structural diagram of a touch device in a comparative example of the present application;

fig. 5 is a schematic structural diagram illustrating a touch device in a first state according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram illustrating a touch device in a second state according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram illustrating thermal deformation among the bonding layer, the cover plate, and the ultrasonic sensor after thermal cycling of the touch device according to an embodiment of the present disclosure;

FIG. 8 is a schematic diagram illustrating thermal deformation between the adhesive layer and the cover plate and between the adhesive layer and the ultrasonic sensor after thermal cycling of the touch device according to a comparative example of the present disclosure;

FIG. 9 is a scanning electron microscope image of an adhesive layer after thermal cycling of a touch device according to an embodiment of the present disclosure;

fig. 10 is a scanning electron microscope image of the bonding layer after thermal cycling of the touch device in fig. 4;

fig. 11 is a schematic view illustrating a pressing measurement waveform of the assembled touch device in fig. 4;

FIG. 12 is a diagram illustrating a waveform of the pressure measurement of the touch device after thermal cycling in FIG. 4;

fig. 13 is a schematic diagram illustrating a pressing measurement waveform after assembling a touch device according to an embodiment of the present disclosure;

fig. 14 is a waveform diagram of a pressing measurement of a touch device after thermal cycling according to an embodiment of the present application.

Notation of elements for simplicity:

f: the finger 10: upper cover

20: the piezoelectric element 30: colloid

40: light guide pole

100: cover plate 101: first surface

110: positioning groove 111: step part

1111: step a: locating surface

112: bottom wall 113: side wall

114: circumferential side wall

200: the ultrasonic sensing member 210: ultrasonic receiving unit

220: the ultrasonic wave emitting unit 230: outer casing

231: concave part

300: adhesive layer

R0: reference plane R1: first plane

F1: a first direction

h1, h2, h 3: distance between two adjacent plates

d1, d 2: size of

z1, z2, z3, z 4: region(s)

Detailed Description

In order to make the aforementioned objects, features and advantages of the present application more comprehensible, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth to provide a thorough understanding of embodiments of the present application. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. The embodiments of this application can be implemented in many different ways than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the invention and therefore the embodiments of this application are not limited to the specific embodiments disclosed below.

It is to be understood that the terms "first," "second," and the like as used herein may be used herein to describe various terms of art, and are not to be construed as indicating or implying relative importance or implicit ly indicating a number of technical features being indicated. However, these terms are not intended to be limiting unless specifically stated. These terms are only used to distinguish one term from another. In the description of the embodiments of the present application, "a plurality" or "a plurality" means at least two, e.g., two, three, etc., unless specifically defined otherwise.

In the description of the embodiments of the present application, unless otherwise explicitly stated or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.

In the description of the embodiments of the present application, unless otherwise explicitly specified or limited, a first feature "on" or "under" a second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may mean that the first feature is directly above or obliquely above the second feature, or that only the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely below the second feature, or may simply mean that the first feature is at a lesser level than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application in the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Fig. 1 is a schematic structural diagram of a touch device in an embodiment of the related art; FIG. 2 is a schematic structural diagram of a touch device in another embodiment of the related art; for convenience of explanation, only portions related to the related art embodiments are shown.

Taking a touch device as a metal touch switch as an example, as shown in fig. 1, in an embodiment of the related art, the touch device includes an upper cover 10, a piezoelectric element 20 and a glue 30, and the piezoelectric element 20 is fixed with the upper cover 10 by the glue 30. The piezoelectric element 20 generates a fixed frequency of the ultrasonic wave. When the finger f touches the switch, the waveform of the ultrasonic wave changes, and the piezoelectric element 20 executes a switch command after sensing it.

The inventor of the present application has noticed that, in the process of tightly pressing the piezoelectric element 20 and the upper cover 10 after applying the glue on the piezoelectric element 20 or the upper cover 10, the glue 30 flows or spreads outwards from the pressing space formed between the piezoelectric element 20 and the upper cover 10, and thus the thickness of the glue layer formed by the glue 30 becomes thinner. After the thermal cycle, the thinned colloidal layer is more likely to peel off, so that the connection structure of the piezoelectric element 20 and the upper cover 10 is failed. In addition, as shown in fig. 2, if the amount of the glue 30 is too much, the glue 30 may overflow during the pressing process. The glue 30 will adhere to the components (e.g., the light guide posts 40) surrounding the piezoelectric element 20. Prying the light guide bar 40 will bring the piezoelectric element 20 along, and will also affect the reliability of the connection between the piezoelectric element 20 and the cover 10.

Therefore, the reliability of the touch device can be effectively improved by improving the structure of the touch device, and the problems noted above are avoided. The touch device provided in the embodiments of the present application is described below with reference to some embodiments.

Fig. 3 is a schematic structural diagram of a touch device according to an embodiment of the disclosure; FIG. 4 is a schematic structural diagram of a touch device in a comparative example of the present application; for convenience of explanation, only portions related to examples of the present application and comparative examples of the present application are shown.

In some embodiments, referring to fig. 3, a touch device is provided in the present application, and the touch device includes a cover plate 100, an ultrasonic sensor 200, and an adhesive layer 300. The first surface 101 of the cover plate 100 is provided with a positioning groove 110. The ultrasonic sensor 200 is located in the positioning groove 110. The adhesive layer 300 is disposed in the positioning groove 110, and the ultrasonic sensor 200 is adhered to the positioning groove 110 by the adhesive layer 300. Wherein the positioning groove 110 is provided with a step portion 111, and the step portion 111 has a positioning surface a for positioning the ultrasonic sensor 200 in the first direction F1 (i.e., the up-down direction illustrated in fig. 3). The ultrasonic sensor 200 is positioned on the positioning surface a, and an adhesive layer 300 is disposed in an area formed between the ultrasonic sensor 200 and the bottom wall 112 of the positioning groove 110. The first direction F1 is perpendicular to the first surface 101.

The "ultrasonic sensor 200" may generate an ultrasonic signal with a fixed frequency, or may receive a reflected ultrasonic signal to perform a sensing function.

In some comparative examples, referring to fig. 4, if the positioning groove 110 is not provided, the cover plate 100 and the ultrasonic sensor 200 are pressed together to reduce the thickness of the adhesive layer 300, as discussed above. As is apparent from the combination of fig. 3 and 4, the adhesive layer 300 is not uniform in thickness in both configurations. In fig. 3 of the embodiment of the present application, a step portion is present, so that the adhesive layer 300 has a certain thickness.

Fig. 5 is a schematic structural diagram illustrating a touch device in a first state according to an embodiment of the disclosure; fig. 6 is a schematic structural diagram illustrating a touch device in a second state according to an embodiment of the present disclosure; for convenience of explanation, only portions related to the embodiments of the present application are shown. The "first state" refers to a state in which the touch device is not assembled yet, and the "second state" refers to a state in which the touch device is assembled.

Thus, as shown in fig. 5 and 6, when the ultrasonic sensing member 200 is positioned on the positioning surface a of the step portion 111, an area formed between the ultrasonic sensing member 200 and the bottom wall 112 of the positioning groove 110 may be used to accommodate the adhesive layer 300. In this way, on the one hand, a certain thickness of the adhesive layer 300 can be ensured, so that the adhesive layer 300 is not easily peeled off during thermal cycling. On the other hand, even if the bonding layer 300 overflows, it is retained in the positioning groove 110, so as to prevent the overflowing glue from adhering to other components. Therefore, by providing the positioning groove 110 and the step portion 111 in the positioning groove 110, the reliability of the touch device can be improved, and the structural failure of the touch device can be avoided.

In some embodiments, referring to fig. 3, the step 111 includes at least one step 1111. Each step 1111 has a positioning face a for positioning the ultrasonic sensor 200 in the first direction F1. The ultrasonic sensor 200 is positioned at the positioning surface a corresponding to the step 1111. For example, fig. 3 illustrates a case where the step portion 111 includes one step 1111. Of course, the step part 111 may further include a plurality of steps 1111. When the step portion 111 includes a plurality of steps 1111, if the glue overflow occurs, the adhesive layer 300 is limited in the positioning groove 110 due to the plurality of steps 1111.

In some embodiments, the step 111 may be formed on the bottom wall 112 of the positioning groove 110. In this case, a plurality of steps 111 may be provided on the bottom wall 112 of the positioning groove 110, spaced apart from each other and independent from each other. Each step portion 111 may include at least one step 1111 thereon. Of course, in other embodiments, as shown in fig. 3, the step portion 111 may be disposed on the sidewall 113 of the positioning slot 110 and around the bottom wall 112 of the positioning slot 110. The selection can be performed according to specific use cases, and the embodiment of the present application does not specifically limit this.

In some embodiments, referring to fig. 3, the plane of each positioning surface a is the reference plane R0, and the plane of the bottom wall 112 is the first plane R1. The reference plane R0, the first plane R1, and the first surface 101 are parallel to each other. Along the first direction F1, a distance between two adjacent faces among the reference plane R0, the first plane R1 and the first surface 101 is 100 to 150 micrometers. Therefore, the thickness can be controlled and the glue overflow can be avoided according to the use requirement.

Note that "two adjacent faces" refer to two planes adjacent in the first direction F1. Taking fig. 3 as an example of providing a step, the first surface 101, the reference plane R0 and the first plane R1 are sequentially arranged along the first direction F1. At this time, the first surface 101 is adjacent to the reference plane R0, the first plane R1 is adjacent to the reference plane R0, and the reference plane R0 is located between the first surface 101 and the first plane R1. The distance h1 between the first surface 101 and the reference plane R0 is 100 to 150 microns and the distance h2 between the first plane R1 and the reference plane R0 is 100 to 150 microns. When two steps are provided, there are two positioning surfaces a, i.e. two reference planes R0 corresponding thereto, and the first surface 101, the reference plane R0, the reference plane R0, and the first plane R1 are sequentially arranged along the first direction F1. Along the first direction F1, the first surface 101 is adjacent to a reference plane R0 located upstream, the first plane R1 is adjacent to a reference plane R0 located downstream, and the two reference planes R0 are located between the first surface 101 and the first plane R1. At this time, the distance between the adjacent two faces may be set with reference to the above range. In the case where the step portion 111 has three or more steps 1111, the same can be said, and the description thereof will not be repeated. It should also be noted that, the distances between different adjacent two surfaces may be the same or different, and this is not specifically limited in this application embodiment.

In some embodiments, with continued reference to fig. 3, the positioning slot 110 has a plurality of circumferential sidewalls 114. Along the first direction F1, adjacent two of the bottom wall 112, the positioning surface a and the first surface 101 are connected by a circumferential side wall 114. That is, the stepped portion 111 is formed around the sidewall 113 of the positioning groove 110. The circumferential side walls 114 together constitute the side wall 113. As such, the structure forming the means for positioning the ultrasound sensing element 200 may be further defined.

It should be noted that, taking fig. 3 as an example, the bottom wall 112 is adjacent to the positioning surface a, the bottom wall 112 is connected to the positioning surface a by the corresponding circumferential side wall 114, the first surface 101 is adjacent to the positioning surface a, and the first surface 101 is connected to the positioning surface a by the corresponding circumferential side wall 114. When two steps are provided, there are two positioning surfaces a and three circumferential side walls 114, and the first surface 101, the positioning surfaces a, and the bottom wall 112 are arranged in sequence along the first direction F1. In the first direction F1, the first surface 101 is connected to the positioning surface a located upstream by means of one circumferential side wall 114, to the positioning surface a located downstream by means of another circumferential side wall 114, and to the bottom wall 112 by means of a further circumferential side wall 114. In the case where the step portion 111 has three or more steps 1111, the same can be said, and the description thereof will be omitted. It should be noted that the circumferential sidewall 114 may have a planar structure, a curved structure, or other shapes. When the circumferential sidewall 114 is planar, it is disposed in a plane parallel to or at an angle with respect to the first direction F1. For example, fig. 3 illustrates the circumferential sidewall 114 as a planar structure and parallel to the first direction F1. The method can be set according to actual use conditions, and the method is not particularly limited in the embodiment of the application.

With continued reference to fig. 3, in some embodiments, the ultrasonic sensing element 200 includes an ultrasonic receiving unit 210 and an ultrasonic transmitting unit 220 stacked along the first direction F1. The ultrasonic wave transmitting unit 220 is closer to the cap plate 100 than the ultrasonic wave receiving unit 210. Alternatively, the ultrasonic wave transmitting unit 220 includes a first piezoelectric sheet, and the ultrasonic wave receiving unit 210 includes a second piezoelectric sheet. That is, the ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210 may be provided in the form of a piezoelectric sheet. Of course, other structures capable of implementing ultrasonic sensing may be provided, and this is not particularly limited by the embodiments of the present application.

In particular, in some embodiments, the ultrasound emitting unit 220 further comprises a housing 230. A recess 231 is formed by recessing a side surface of the housing 230 facing the cover plate 100 in a direction away from the cover plate 100, and the ultrasonic wave receiving unit 210 and the ultrasonic wave transmitting unit 220 are accommodated in the recess 231. Thus, the ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210 can be protected by the housing 230.

To further achieve good acoustic transmission, in some embodiments, with continued reference to fig. 3, a side surface of the ultrasonic wave emitting unit 220 facing the cover plate 100 is flush with a side surface of the housing 230 facing the cover plate 100.

In some embodiments, the ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210 may be provided as a piezoelectric sheet structure in a circular sheet shape. Correspondingly, the positioning groove may be provided in a shape to fit the disc-shaped ultrasonic wave transmitting unit 220 and the ultrasonic wave receiving unit 210. In order to control the volume of the adhesive layer 300, taking fig. 3 as an example, the dimension d1 of the tank body accommodating the adhesive layer 300 (i.e., the diameter of the tank body) may be set slightly smaller than the diameter of the ultrasonic sensor 200. To avoid the glue overflow, the dimension d2 of the tank body supporting the ultrasonic sensor 200 (i.e., the diameter of the tank body) may be set to be slightly larger than the diameter of the ultrasonic sensor 200. Alternatively, d1 may be 8 millimeters to 9.5 millimeters. d2 may be 9.7 mm to 10.3 mm. The method can be set according to actual use conditions, and the method is not particularly limited in the embodiment of the application.

Since the ultrasonic sensor 200 needs to transmit and receive signals, the adhesive layer 300 between the ultrasonic sensor 200 and the cover plate 100 needs to have good transmission of sound waves and adhesion. In some embodiments, the material of the tie layer 300 includes at least one of an epoxy resin, a polyacrylic resin, and a phenolic resin.

In some embodiments, the material of the cover plate 100 includes metal or plastic. When the metal material is selected, the material can be selected from aluminum alloy, stainless steel or brass, etc. When a plastic material is selected, polycarbonate, polyamide fiber or acrylonitrile-butadiene-styrene plastic and other materials can be selected. The selection can be performed according to the actual use situation, and this is not particularly limited in the embodiments of the present application.

The touch device provided in the embodiments of the present application is further described below with reference to the above embodiments and fig. 7 to 10.

The thermal cycle simulation process comprises the following steps: firstly, locking a touch device by using a screw at normal temperature; secondly, heating the touch device to 70 ℃; and finally, cooling the touch device to-30 ℃. After the thermal cycle is completed, the touch device is subjected to tension verification of the peeling of the adhesive layer 300.

Fig. 7 and 8 illustrate thermal deformation between the adhesive layer 300 and the cover plate 100 and the ultrasonic sensor 200 after thermal cycling. In the case where three ultrasonic sensors 200 spaced apart from each other are disposed on the cover plate 100 in fig. 7 and 8, the three ultrasonic sensors 200 are cylindrical. The cover plate 100 in fig. 7 is provided with three positioning grooves 110 spaced from each other, and the three positioning grooves 110 correspond to the three ultrasonic sensing members 200 one by one. The cover plate 100 of fig. 8 is not provided with the positioning groove 110.

It should be noted that Gap represents colors with different gaps, Gap1 represents specific Gap sizes in millimeters, negative numbers represent gaps, and the larger the vertical of the negative numbers, the larger the Gap. The gap is an area formed between the adhesive layer 300 and the cover plate 100 and the ultrasonic sensor 200 due to peeling of the adhesive layer 300. The gaps of different sizes have different colors, and as the size of the gap changes, the color also changes. The color change means that the color gradually transits from the warm tone to the cool tone as the gap becomes larger.

As shown in fig. 7 and 8, the color change appears as a gradual transition from the warm tone to the cool tone from the center to the outside. It can be seen that the gap is concentrated in the edge region of the ultrasonic sensing element 200. In the touch device after thermal cycling, the gap in the edge region of the ultrasonic sensor 200 is about 0.1 μm. The gap created in fig. 7 is smaller than the gap created in fig. 8.

Fig. 9 and 10 illustrate scanning electron micrographs of the bonding layer 300 after thermal cycling. Fig. 9 is a touch device according to an embodiment of the present disclosure, and fig. 10 is the touch device illustrated in fig. 4. As shown in fig. 9, there were a few small bubbles in the region z1, and there was little peeling in the region z2, but the thickness of the adhesive layer 300 was uniform as a whole. As shown in fig. 10, there are many small bubbles in the region z3, the peeled state is mostly treated in the region z4, and the thickness of the adhesive layer 300 as a whole is uneven. In the subsequent tensile force verification process, the tensile stress of the adhesive layer 300 of the touch device shown in fig. 9 is greater than that of the adhesive layer 300 of the touch device shown in fig. 10.

FIG. 11 is a schematic view illustrating a pressing measurement waveform of the assembled touch device shown in FIG. 4; FIG. 12 is a diagram illustrating a waveform of a pressure measurement of the touch device after thermal cycling in FIG. 4; fig. 13 is a schematic diagram illustrating a pressing measurement waveform after the touch device is assembled according to an embodiment of the present disclosure; FIG. 14 is a waveform illustrating a pressing measurement after thermal cycling of a touch device according to an embodiment of the present disclosure; for ease of illustration, only portions relevant to the embodiments of the present application are shown. The touch device in fig. 11 and 12 is not provided with the positioning groove 110, and the touch device in fig. 13 and 14 is provided with the positioning groove 110.

In fig. 11 to 14, UDC is a reading of ultrasonic wave converted digital, and is a reading of ultrasonic wave converted digital signal for comparison. freq is the frequency of the ultrasonic wave. L1 represents the curve generated by the finger touching the cover 100, and L2 represents the curve generated by the finger leaving the cover 100. As shown in fig. 11 to 14, the touch device provided in the embodiment of the present application can still maintain close contact after thermal cycling, and operate normally.

As can be seen from the above test procedures, the reliability of the touch device provided by the embodiment of the present application is significantly better than that of the touch device in the comparative example.

Based on the same inventive concept, an embodiment of the present application further provides an electronic device, which includes the touch device in the above embodiment.

It should be understood that the electronic device provided by the above embodiment can be applied to the fields of mobile phone terminals, bionic electronics, electronic skins, wearable devices, vehicle-mounted devices, internet of things devices, artificial intelligence devices, and the like. For example, the electronic device may be a mobile phone terminal, a tablet, a palmtop, an ipod, a smart watch, a laptop, a television, a monitor, or the like. The electronic device provided in the foregoing embodiment may be the device illustrated above, and this is not particularly limited in this embodiment of the application.

To sum up, in the touch device provided in the embodiment of the present application, the positioning groove 110 is disposed on the cover plate 100, the step portion 111 is disposed in the positioning groove 110, and when the ultrasonic sensing element 200 is positioned on the positioning surface a of the step portion 111, the area formed between the ultrasonic sensing element 200 and the bottom wall 112 of the positioning groove 110 can be used for accommodating the adhesive layer 300. Thus, when the ultrasonic sensor 200 is tightly pressed against the cover plate 100, the adhesive layer 300 can be ensured to have a certain thickness, so that the adhesive layer 300 is not easy to peel off during thermal cycling. In addition, even if the bonding layer 300 overflows, it is retained in the positioning groove 110, so as to prevent the overflowing glue from adhering to other components. Therefore, the reliability of the touch device is improved, and the structural failure of the touch device is avoided.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A touch device, comprising:

the positioning groove is formed in the first surface of the cover plate;

the ultrasonic sensing piece is positioned in the positioning groove; and

the bonding layer is arranged in the positioning groove, and the ultrasonic sensing piece is bonded in the positioning groove by means of the bonding layer;

the first direction is perpendicular to the first surface.

2. The touch device of claim 1, wherein the step portion comprises at least one step;

3. The touch device of claim 2, wherein a plane of each positioning surface is a reference plane, and a plane of the bottom wall is a first plane;

4. The touch device of claim 2, wherein the positioning groove has a plurality of circumferential side walls;

5. The touch device of any one of claims 1-4, wherein the material of the adhesive layer comprises at least one of epoxy, polyacrylic, and phenolic.

6. The touch device of any one of claims 1-4, wherein the cover plate comprises a material selected from the group consisting of metal and plastic.

7. The touch device according to any one of claims 1 to 4, wherein the ultrasonic sensor includes an ultrasonic receiving unit and an ultrasonic transmitting unit stacked in the first direction;

8. The touch device of claim 7, wherein the ultrasonic wave emitting unit further comprises a housing;

9. The touch device of claim 8, wherein a side surface of the ultrasonic wave emitting unit facing the cover plate is flush with a side surface of the housing facing the cover plate.

10. The touch device according to claim 7, wherein the ultrasonic wave emitting unit includes a first piezoelectric sheet, and the ultrasonic wave receiving unit includes a second piezoelectric sheet.

11. An electronic device comprising the touch device according to any one of claims 1 to 10.