CN115016570A - Temperature control method and related equipment - Google Patents
Temperature control method and related equipment Download PDFInfo
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- CN115016570A CN115016570A CN202210760993.7A CN202210760993A CN115016570A CN 115016570 A CN115016570 A CN 115016570A CN 202210760993 A CN202210760993 A CN 202210760993A CN 115016570 A CN115016570 A CN 115016570A
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- 238000000034 method Methods 0.000 title claims abstract description 54
- 230000017525 heat dissipation Effects 0.000 claims abstract description 92
- 238000001816 cooling Methods 0.000 claims description 43
- 230000009467 reduction Effects 0.000 claims description 13
- 238000004590 computer program Methods 0.000 claims description 11
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 15
- 238000010586 diagram Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 6
- 238000005265 energy consumption Methods 0.000 description 6
- 238000011161 development Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000004422 calculation algorithm Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The application discloses a temperature control method, which comprises the steps of obtaining temperature values of all components in target equipment; determining whether a component to be radiated exists in the target equipment or not according to each temperature value; if the target equipment has the component to be radiated, controlling a driving assembly to drive a radiator to a radiating position corresponding to the component to be radiated so as to enable the radiator to radiate and cool the component to be radiated at the radiating position. By the aid of the technical scheme, the electronic equipment can be cooled while heat dissipation is achieved, the problem of high noise is avoided, and equipment performance and user experience are effectively improved. The application also discloses an electronic device, a temperature control device and a computer readable storage medium, all having the above beneficial effects.
Description
Technical Field
The present disclosure relates to the field of device heat dissipation technologies, and in particular, to a temperature control method, and further relates to an electronic device, a temperature control apparatus, a temperature control device, and a computer-readable storage medium.
Background
With the rapid development of electronic technology and the continuous expansion of electronic device functions, people have higher and higher requirements for the stability of electronic devices. However, in many cases, the electronic device generates a large amount of heat due to long-term operation, which causes a large increase in the internal temperature of the electronic device, and affects the stability thereof. In the related art, a fan cooling mode is adopted for cooling electronic equipment, that is, fans are installed near each key heating component in the electronic equipment to achieve cooling, and at the moment, for a single piece of electronic equipment, a plurality of fans need to be installed, however, superposition of the plurality of fans causes excessive noise, and user experience is affected; meanwhile, since some components of the electronic device are not equipped with a fan for direct blowing, when the temperature rises, the fan is required to operate at a higher rotation speed, which causes a more significant noise problem.
Therefore, how to avoid the problem of over-high noise while achieving heat dissipation and temperature reduction of the electronic device is a problem to be urgently solved by those skilled in the art.
Disclosure of Invention
The temperature control method can achieve heat dissipation and cooling of electronic equipment, avoid the problem of overhigh noise and effectively improve equipment performance and user experience; another object of the present application is to provide an electronic device, a temperature control apparatus, a temperature control device, and a computer readable storage medium, all having the above-mentioned advantages.
In a first aspect, the present application provides a temperature control method, comprising:
acquiring temperature values of all components in target equipment;
determining whether a component to be radiated exists in the target equipment or not according to each temperature value;
if the target equipment has the component to be radiated, controlling a driving assembly to drive a radiator to a radiating position corresponding to the component to be radiated so as to enable the radiator to radiate and cool the component to be radiated at the radiating position.
Optionally, the determining, according to each of the temperature values, whether a component to be cooled exists in the target device includes:
for each component, obtaining an allowable temperature value of the component;
calculating a temperature difference between the temperature value and the allowable temperature value;
and when the temperature difference value is lower than a first threshold value, determining the component as the component to be cooled.
Optionally, the control drive assembly drives the radiator to a heat dissipation position corresponding to the component to be cooled, so that the radiator is in the heat dissipation position is after the component to be cooled performs heat dissipation and cooling, the control drive assembly further includes:
and when the temperature difference exceeds a second threshold value, sending a stop operation instruction to the radiator so as to stop the radiator from operating.
Optionally, after determining whether a component to be cooled exists in the target device according to each of the temperature values, the method further includes:
when the number of the components to be radiated exceeds 1, taking the component to be radiated corresponding to the temperature difference value with the minimum value as a first component to be radiated;
correspondingly, control drive assembly with the radiator drive extremely wait to dispel the heat dissipation position that the components and parts correspond, so that the radiator is in the heat dissipation position does wait to dispel the heat the components and parts and carry out the heat dissipation cooling, include:
and controlling the driving assembly to drive the radiator to a first radiating position corresponding to the first component to be radiated so that the radiator can radiate and cool the first component to be radiated at the first radiating position.
Optionally, control drive assembly will the radiator drives to the first heat dissipation position that first components and parts that wait to dispel the heat correspond, so that the radiator is in first heat dissipation position is that first components and parts that wait to dispel the heat carry out the heat dissipation cooling, include:
controlling the driving assembly to drive the radiator to a first radiating position corresponding to the first component to be radiated;
determining working parameters of the radiator according to the number of the components to be radiated;
and sending the working parameters to the radiator so that the radiator operates at the first radiating position according to the working parameters to radiate and cool the first component to be radiated.
Optionally, the controlling and driving assembly drives the heat sink to the heat dissipation position corresponding to the component to be dissipated includes:
acquiring the current position of the radiator, and determining the heat dissipation position corresponding to the component to be dissipated;
determining a moving route from the current position to the heat dissipation position in a radiator moving route map corresponding to the target device;
and controlling the driving assembly to drive the heat radiator from the current position to the heat radiating position according to the moving route.
In a second aspect, the application further discloses an electronic device, which comprises a main controller, a plurality of device components, a radiator, a driving assembly and a radiator moving track, wherein each device component is provided with a temperature sensor, and the radiator moving track is connected with a radiating position corresponding to each device component;
the main controller is used for judging whether each equipment component is a component to be radiated according to the temperature values uploaded by the temperature sensors, if so, the driving assembly is controlled to drive the radiator to a radiating position corresponding to the component to be radiated according to the radiator moving track, so that the radiator performs radiating and cooling on the radiating position of the component to be radiated.
In a third aspect, the present application also discloses a temperature control device, comprising:
the acquisition module is used for acquiring temperature values of all components in the target equipment;
the judgment module is used for determining whether the target equipment has a component to be radiated according to each temperature value;
and the control module is used for controlling the driving assembly to drive the radiator to a radiating position corresponding to the component to be radiated if the component to be radiated exists in the target equipment, so that the radiator is in the radiating position to perform radiating and cooling on the component to be radiated.
In a fourth aspect, the present application further discloses a temperature control apparatus, comprising:
a memory for storing a computer program;
a processor for implementing the steps of any of the temperature control methods described above when executing the computer program.
In a fifth aspect, the present application further discloses a computer readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of any of the temperature control methods described above.
The application provides a temperature control method, which comprises the following steps: acquiring temperature values of all components in target equipment; determining whether a component to be radiated exists in the target equipment or not according to each temperature value; if the target equipment has the component to be radiated, controlling a driving assembly to drive a radiator to a radiating position corresponding to the component to be radiated so as to enable the radiator to radiate and cool the component to be radiated at the radiating position.
Use the technical scheme that this application provided, it is portable to have set up drive assembly in electronic equipment and realized the radiator, in electronic equipment operation process, at first acquire the temperature value of each components and parts among them, then confirm whether the components and parts that correspond need the cooling according to the temperature value, if need the cooling, then the direct control drive assembly drives the radiator to the heat dissipation position that the components and parts that need the cooling correspond, make the radiator locate to operate in this heat dissipation position so that dispel the heat and cool down for components and parts, it is obvious, because the radiator is portable, therefore, need not to set up the heat dissipation cooling that a plurality of radiators can realize electronic equipment in electronic equipment, and the reduction of radiator quantity can effectively reduce noise problem and energy consumption problem, electronic equipment performance and user experience have further been promoted.
The electronic device, the temperature control device and the computer readable storage medium provided by the application all have the beneficial effects, and are not repeated herein.
Drawings
In order to more clearly illustrate the technical solutions in the prior art and the embodiments of the present application, the drawings used in the description of the prior art and the embodiments of the present application will be briefly described below. Of course, the following description of the drawings related to the embodiments of the present application is only a part of the embodiments of the present application, and it will be obvious to those skilled in the art that other drawings can be obtained from the provided drawings without any creative effort, and the obtained other drawings also belong to the protection scope of the present application.
FIG. 1 is a schematic flow chart of a temperature control method provided herein;
fig. 2 is a schematic structural diagram of an electronic device provided in the present application;
FIG. 3 is a schematic structural diagram of a temperature control device provided in the present application;
fig. 4 is a schematic structural diagram of a temperature control apparatus provided in the present application.
Detailed Description
The core of the application is to provide a temperature control method, the temperature control method can avoid the problem of overhigh noise while realizing the heat dissipation and cooling of the electronic equipment, and effectively improves the equipment performance and the user experience; another core of the present application is to provide an electronic device, a temperature control apparatus, a temperature control device, and a computer-readable storage medium, which also have the above-mentioned advantages.
In order to more clearly and completely describe the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a temperature control method.
Referring to fig. 1, fig. 1 is a schematic flow chart of a temperature control method provided in the present application, which may include the following steps S101 to S103.
S101: and acquiring temperature values of all components in the target equipment.
The step aims to obtain a temperature value of each component in the target device, where the target device is an electronic device such as a computer and a server that needs to perform temperature control, and the component is each hardware component in the target device such as a CPU (Central Processing Unit), a display card, a memory, and more specifically, the component may be all components or part of key components that the target device may generate heat during an actual operation process. Of course, the specific type of the component requiring temperature control may be set by a technician according to actual conditions, and the component requiring temperature control is also different for different target devices, which is not limited in the present application.
In an implementation process, a temperature sensor may be disposed in a component that needs to be temperature-controlled in advance, so as to acquire a temperature value of each component of a target device in an operation process in real time, and report the temperature value to a master Controller in real time, where the master Controller is an execution main body for implementing temperature control. Furthermore, after the main controller receives the temperature values uploaded by the temperature sensors, the temperature control of the components in the target equipment can be realized according to the temperature values.
S102: and determining whether the target equipment has a component to be cooled according to each temperature value.
The method aims to realize the identification of the type of the component, judge whether the component to be radiated exists in the target equipment, namely judge whether each component in the target equipment is the component to be radiated, and the component to be radiated is the component which needs to be subjected to temperature control (mainly referred to as radiating and cooling herein). That is to say, when the component is a component to be cooled, it needs to be cooled, and when the component is a component to be cooled, it does not need to be cooled. And determining whether the target equipment has the component to be cooled can be realized according to the received temperature values.
In a possible implementation manner, the determining whether the component to be cooled exists in the target device according to each temperature value may include the following steps:
for each component, obtaining an allowable temperature value of the component;
calculating a temperature difference value between the temperature value and the allowable temperature value;
and when the temperature difference value is lower than a first threshold value, determining the component as a component to be radiated.
The embodiment of the application provides an implementation mode for determining whether a component to be cooled exists in target equipment according to each temperature value. In the implementation process, for each component in the target equipment, firstly obtaining an allowable temperature value, wherein the allowable temperature value is an upper limit of the working temperature of the corresponding component, and when the temperature of the component reaches the allowable temperature value, the component has a risk of being damaged; further, the temperature difference value between the temperature value of the component and the allowable temperature value is calculated, when the temperature difference value is lower than a first threshold value, it is indicated that the current temperature of the component is about to reach the allowable temperature value, and the risk of damage exists, and at the moment, the component can be determined as the component to be cooled.
The specific value of the first threshold does not affect the implementation of the technical scheme, and the specific value is set by a technician according to the actual situation, which is not limited by the application. It will be appreciated that for different types of components, or different types of components of the same type, the allowable temperature values and the first threshold may all be different.
S103: if the target equipment has the component to be cooled, the driving assembly is controlled to drive the radiator to the radiating position corresponding to the component to be cooled, so that the radiator can cool the component to be cooled at the radiating position.
The step aims to realize the heat dissipation and cooling treatment of the component to be cooled. Specifically, in the development process of the target device, a heat dissipation position can be reserved for each component which needs to be subjected to temperature control in the target device, so that an optimal position for dissipating heat and cooling each component is provided for the heat radiator.
In the implementation process, when it is determined that the target device has the component to be cooled, that is, when it is determined that a certain component in the target device is the component to be cooled, a control instruction can be issued to the driving assembly to control the driving assembly to drive the radiator to the cooling position corresponding to the component to be cooled, and when the radiator reaches the cooling position, the radiator can enter the working state to cool the component to be cooled. That is to say, which components and parts in the target equipment need dispel the heat, then can drive the radiator to the heat dissipation position that this components and parts correspond through drive assembly, from this, realized carrying out the radiating purpose of cooling down for all components and parts in the electronic equipment based on a radiator to effectively reduce energy consumption problem and noise problem. The heat sink may be a fan.
In a possible implementation manner, the controlling the driving assembly to drive the heat sink to the heat dissipation position corresponding to the component to be heat dissipated may include the following steps:
acquiring the current position of a radiator, and determining the heat dissipation position corresponding to a component to be dissipated;
determining a moving route from the current position to the heat dissipation position in a radiator moving route map corresponding to the target equipment;
and controlling the driving assembly to drive the radiator from the current position to the radiating position according to the moving route.
The embodiment of the application provides a method for controlling a driving assembly to drive a radiator to a heat dissipation position corresponding to a component to be cooled. As described above, in the development process of the target device, a heat dissipation position may be reserved for each component that needs to be temperature-controlled in the target device, so that after the development of the target device is completed, the heat dissipation positions may be connected by cables to form a heat sink movement track, and a corresponding heat sink movement route map is generated. Further, the radiator movement road map corresponding to the target device is stored in a storage medium which can be called by the main controller, so that the main controller can directly call the radiator movement road map when the temperature control is carried out.
After a certain unitary device is determined to be a device to be radiated, a corresponding radiating position can be determined, and the current position of the radiator can be obtained; further, a radiator movement route map in a storage medium is retrieved, and a movement route from the current position of the radiator to a heat dissipation position corresponding to the component to be heat dissipated is determined by referring to the radiator movement route map, of course, the number of the movement routes may not be unique, may be one or multiple, when the number of the movement routes is multiple, the movement route with the shortest movement distance may be selected, and when the number of the movement routes with the shortest movement distance is multiple, one of the movement routes may be selected; and finally, after the moving route is determined, the driving assembly can be directly controlled to drive the radiator to the radiating position corresponding to the component to be radiated according to the moving route.
It can be seen that, in the temperature control method provided in the embodiment of the present application, the driving assembly is arranged in the electronic device to implement that the heat sink is movable, in an operation process of the electronic device, first, a temperature value of each component is obtained, then, whether the corresponding component needs to be cooled is determined according to the temperature value, if the component needs to be cooled, the driving assembly is directly controlled to drive the heat sink to a heat dissipation position corresponding to the component that needs to be cooled, so that the heat sink operates at the heat dissipation position to facilitate heat dissipation and cooling of the component, obviously, because the heat sink is movable, the heat dissipation and cooling of the electronic device can be implemented without arranging a plurality of heat sinks in the electronic device, and reduction of the number of the heat sinks can effectively reduce noise problems and energy consumption problems, thereby further improving performance of the electronic device and user experience.
In an embodiment of the application, the control driving assembly drives the heat sink to a heat dissipation position corresponding to the component to be cooled, so that after the heat sink cools the component to be cooled at the heat dissipation position, the method may further include the following steps:
and when the temperature difference exceeds a second threshold value, sending a stop operation instruction to the radiator so as to stop the radiator from operating.
In order to effectively reduce energy consumption loss, in the process of cooling and radiating the component to be radiated by using the radiator, the temperature difference between the temperature value of the component to be radiated and the allowable temperature value can be monitored in real time, when the temperature difference exceeds a second threshold value, the temperature value of the component to be radiated is reduced to be within a normal temperature range, the component to be radiated does not need to be cooled and radiated again, at the moment, a stop operation instruction can be sent to the radiator, so that the radiator stops operating, namely, the radiator stops cooling and radiating the component to be radiated.
Similarly, the specific value of the second threshold does not affect the implementation of the present technical solution, and may be set by a technician according to an actual situation, which is not limited in the present application. Obviously, the second threshold is larger than the first threshold, for example, the first threshold may be set to 25 degrees, and the second threshold may be set to 45 degrees.
In an embodiment of the application, after determining whether the component to be cooled exists in the target device according to each temperature value, the method further includes: when the number of the components to be cooled exceeds 1, taking the component to be cooled corresponding to the temperature difference value with the minimum value as a first component to be cooled;
correspondingly, above-mentioned control drive assembly drives the radiator to the heat dissipation position that waits heat dissipation components and parts to make the radiator dispel the heat the cooling for waiting heat dissipation components and parts in the heat dissipation position, can include: the driving assembly is controlled to drive the radiator to a first radiating position corresponding to the first component to be radiated, so that the radiator can radiate and cool the first component to be radiated at the first radiating position.
It can be understood that, in the actual operation process of the target device, the number of the components to be cooled may not be unique, that is, a situation that a plurality of components to be cooled exist simultaneously may occur.
In this application embodiment, when the quantity of waiting to dispel the heat components and parts exceeds 1 in the target device, can compare all temperature difference values that wait to dispel the heat components and parts correspond to select the minimum temperature difference value of value to wait to dispel the heat components and parts as first waiting to dispel the heat components and parts, the first components and parts that need the radiator to dispel the heat and cool down that also. Furthermore, the heat dissipation position corresponding to the first component to be cooled is referred to as a first heat dissipation position, so that when the first component to be cooled is subjected to heat dissipation and temperature reduction treatment, the driving assembly can be controlled to drive the heat sink to the first heat dissipation position, and the heat sink is subjected to heat dissipation and temperature reduction for the first component to be cooled at the first heat dissipation position.
Furthermore, when the temperature difference value of the first component to be cooled reaches the corresponding second threshold value, a new first component to be cooled can be searched for from the remaining components to be cooled, the radiator is driven to perform heat dissipation and cooling on the components to be cooled, and so on until all the components to be cooled in the current target equipment are cooled.
In an embodiment of the application, the above-mentioned control driving assembly drives the heat sink to a first heat dissipation position corresponding to the first component to be cooled, so that the heat sink cools the first component to be cooled at the first heat dissipation position, which may include the following steps:
controlling the driving assembly to drive the radiator to a first radiating position corresponding to the first component to be radiated;
determining working parameters of the radiator according to the number of the components to be radiated;
and sending the working parameters to the radiator so that the radiator operates at the first radiating position according to the working parameters to radiate and cool the first component to be radiated.
In order to further improve the cooling efficiency, the radiator can be controlled to operate according to different heat dissipation parameters under different conditions. Specifically, when a first component to be cooled is determined and the radiator is driven to a first cooling position corresponding to the first component to be cooled, the working parameters of the radiator can be determined according to the number of the current components to be cooled in the target device, and the radiator is controlled to operate according to the working parameters.
Taking a radiator as an example, in a possible implementation manner, if only one component to be radiated in the target device is provided, the fan may be controlled to operate at 30% of the rotation speed; if the number of the components to be radiated in the target equipment reaches 2, the fan can be controlled to operate at a first radiating position at a rotating speed of 50%; if the number of the components to be cooled in the target device reaches 4, the fan can be controlled to operate at a rotation speed of 100% at the first cooling position.
Obviously, the higher the rotating speed of the fan is, the heat dissipation and cooling effects on other components to be dissipated which are not directly blown except the first component to be dissipated can be achieved. Therefore, the radiator is controlled to operate according to different working parameters under different conditions, and the cooling speed can be effectively increased.
The embodiment of the application provides electronic equipment.
Referring to fig. 2, fig. 2 is a schematic structural diagram of an electronic device provided in the present application, where the electronic device may include a main controller, a plurality of device components (fig. 2 only shows 3 components as examples: component 1, component 2, and component 3), a heat sink, a driving assembly, and a heat sink moving track (a shaded portion shown in fig. 2), where each device component is provided with a temperature sensor, and the heat sink moving track is connected to a heat dissipation position corresponding to each device component;
the main controller is used for judging whether each equipment component is a component to be radiated according to the temperature values uploaded by each temperature sensor, if so, the driving assembly is controlled to drive the radiator to a radiating position corresponding to the component to be radiated according to the radiator moving track, and therefore the radiator can be cooled at the radiating position for the component to be radiated.
For the electronic equipment needing temperature control, the temperature control of each key heating component (component 1, component 2 and component 3) in the electronic equipment is realized through a built-in main controller, and each component is provided with a corresponding temperature sensor (temperature sensor 1, temperature sensor 2 and temperature sensor 3) and is used for carrying out temperature acquisition on the corresponding component in the operation process of the electronic equipment (real-time acquisition in the operation process of the electronic equipment) and uploading the temperature acquisition to the main controller. From this, the master controller can judge whether each components and parts need to dispel the heat and cool down according to each temperature value received to when confirming certain components and parts (supposing components and parts 2) need dispel the heat and cool down, send drive instruction to drive assembly to make the ancestor east subassembly drive radiator move to corresponding heat dissipation position (corresponding to components and parts 2, the heat dissipation position is heat dissipation position 2 promptly), make the radiator work at this heat dissipation position, so that carry out the heat dissipation cooling processing for corresponding components and parts (components and parts 2 promptly).
Wherein, judge whether each components and parts need dispel the heat the cooling according to each temperature value, specifically can be: and judging whether the temperature difference between the actual temperature value of the component and the upper limit value (allowable temperature value) of the allowable use temperature is lower than a preset safety threshold (first threshold), and if so, determining that the component needs to be cooled.
Further, taking a radiator as an example of a fan, when only one component needing heat dissipation and temperature reduction in the electronic equipment is needed, controlling the fan to work at a corresponding heat dissipation position at a rotating speed of 33%; in the same time period, when two components needing heat dissipation and temperature reduction in the electronic equipment are needed, the fan is driven to the heat dissipation position of the component with the minimum temperature difference, and the fan is controlled to work at the heat dissipation position at a rotating speed of 50%; in the same time period, when three components needing heat dissipation and temperature reduction in the electronic equipment are needed, the fan is driven to the heat dissipation position of the component with the minimum temperature difference, and the fan is controlled to work at the heat dissipation position at a rotating speed of 100%.
And finally, when the temperature of each component in the electronic equipment is reduced to be within a normal range, namely when heat dissipation and temperature reduction are not needed to be carried out continuously, a stop operation instruction can be sent to the radiator so as to stop the radiator from working.
It is thus clear that the electronic equipment that this application embodiment provided, it is portable to have set up the drive assembly among them and realized the radiator, in electronic equipment operation process, at first obtain the temperature value of each components and parts among them, then confirm whether the components and parts that correspond need the cooling according to the temperature value, if need the cooling, then the direct control drive assembly drives the radiator to the heat dissipation position that the components and parts that need the cooling correspond, make the radiator operate in this heat dissipation position department so that dispel the heat and cool down for components and parts, it is obvious, because the radiator is portable, therefore, need not to set up the heat dissipation cooling that a plurality of radiators can realize electronic equipment in electronic equipment, and the reduction of radiator quantity can effectively reduce noise problem and energy consumption problem, electronic equipment performance and user experience have further been promoted.
The embodiment of the application provides a temperature control device.
Referring to fig. 3, fig. 3 is a schematic structural diagram of a temperature control device provided in the present application, where the temperature control device may include:
the acquisition module 1 is used for acquiring temperature values of all components in target equipment;
the judgment module 2 is used for determining whether the target equipment has a component to be radiated according to each temperature value;
and the control module 3 is used for controlling the driving assembly to drive the radiator to a radiating position corresponding to the component to be radiated if the component to be radiated exists in the target equipment, so that the radiator can radiate and cool the component to be radiated at the radiating position.
It is thus clear that the temperature control device that this application embodiment provided, it is portable to have set up drive assembly in electronic equipment and realized the radiator, in electronic equipment operation process, at first acquire the temperature value of each components and parts among them, then whether the components and parts that confirm to correspond according to the temperature value need cool down, if need cool down, then direct control drive assembly drives the radiator to the heat dissipation position that the components and parts that need cool down correspond, make the radiator operate in this heat dissipation position department so that dispel the heat and cool down for components and parts, obviously, because the radiator is portable, therefore, need not to set up the heat dissipation cooling that a plurality of radiators can realize electronic equipment in electronic equipment, and the reduction of radiator quantity can effectively reduce noise problem and energy consumption problem, electronic equipment performance and user experience have further been promoted.
In an embodiment of the present application, the determining module 2 may include:
the temperature value acquisition unit is used for acquiring the allowable temperature value of each component;
a temperature difference calculation unit for calculating a temperature difference between the temperature value and the allowable temperature value;
and the component judgment unit is used for determining the component as a component to be cooled when the temperature difference value is lower than a first threshold value.
In an embodiment of the application, the temperature control device may further include an instruction issuing module, configured to drive the heat sink to a heat dissipation position corresponding to the component to be cooled at the control driving assembly, so that after the heat sink performs heat dissipation and cooling on the component to be cooled at the heat dissipation position, when the temperature difference exceeds a second threshold, an operation stop instruction is sent to the heat sink, so that the heat sink stops operating.
In an embodiment of the application, the temperature control apparatus may further include a selection module, configured to, after determining whether there is a component to be dissipated in the target device according to each temperature value, when the number of the components to be dissipated exceeds 1, use the component to be dissipated corresponding to the temperature difference value with the smallest value as the first component to be dissipated;
correspondingly, the control module 3 may be specifically configured to control the driving assembly to drive the heat sink to a first heat dissipation position corresponding to the first component to be cooled, so that the heat sink performs heat dissipation and cooling for the first component to be cooled at the first heat dissipation position.
In an embodiment of the present application, the control module 3 may include:
the driving unit is used for controlling the driving assembly to drive the radiator to a first radiating position corresponding to the first component to be radiated;
the working parameter determining unit is used for determining the working parameters of the radiator according to the number of the components to be radiated;
and the radiator control unit is used for sending the working parameters to the radiator so that the radiator runs at the first radiating position according to the working parameters to radiate and cool the first component to be radiated.
In an embodiment of the present application, the control module 3 may include:
the position information acquisition unit is used for acquiring the current position of the radiator and determining the heat dissipation position corresponding to the component to be cooled;
a moving route determining unit, configured to determine a moving route from a current location to a heat dissipation location in a radiator moving route map corresponding to a target device;
and the radiator driving unit is used for controlling the driving assembly to drive the radiator from the current position to the radiating position according to the moving route.
For the introduction of the apparatus provided in the embodiment of the present application, please refer to the method embodiment described above, which is not described herein again.
The embodiment of the application provides temperature control equipment.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a temperature control apparatus provided in the present application, where the temperature control apparatus may include:
a memory for storing a computer program;
a processor, when executing a computer program, may implement the steps of any of the temperature control methods described above.
As shown in fig. 4, which is a schematic diagram of a composition structure of a temperature control device, the temperature control device may include: a processor 10, a memory 11, a communication interface 12 and a communication bus 13. The processor 10, the memory 11 and the communication interface 12 all communicate with each other through a communication bus 13.
In the embodiment of the present application, the processor 10 may be a Central Processing Unit (CPU), an application specific integrated circuit, a digital signal processor, a field programmable gate array or other programmable logic device, etc.
The processor 10 may call a program stored in the memory 11, and in particular, the processor 10 may perform operations in embodiments of the temperature control method.
The memory 11 is used for storing one or more programs, the program may include program codes, the program codes include computer operation instructions, in this embodiment, the memory 11 stores at least the program for implementing the following functions:
acquiring temperature values of all components in target equipment;
determining whether a component to be radiated exists in the target equipment or not according to each temperature value;
if the target equipment has the component to be cooled, the driving assembly is controlled to drive the radiator to the radiating position corresponding to the component to be cooled, so that the radiator can cool the component to be cooled at the radiating position.
In one possible implementation, the memory 11 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application program required for at least one function, and the like; the storage data area may store data created during use.
Further, the memory 11 may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device or other volatile solid state storage device.
The communication interface 12 may be an interface of a communication module for connecting with other devices or systems.
Of course, it should be noted that the structure shown in fig. 4 does not constitute a limitation of the temperature control device in the embodiment of the present application, and in practical applications, the temperature control device may include more or less components than those shown in fig. 4, or some components may be combined.
The embodiment of the application provides a computer readable storage medium.
The computer-readable storage medium provided in the embodiments of the present application stores a computer program, and the computer program, when executed by a processor, can implement the steps of any one of the temperature control methods described above.
The computer-readable storage medium may include: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.
For introduction of the computer-readable storage medium provided in the embodiment of the present application, please refer to the above method embodiment, which is not described herein again.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.
Those of skill would further appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both, and that the various illustrative components and steps have been described above generally in terms of their functionality in order to clearly illustrate this interchangeability of hardware and software. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module may reside in Random Access Memory (RAM), memory, Read Only Memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.
The technical solutions provided by the present application are described in detail above. The principles and embodiments of the present application are explained herein using specific examples, which are provided only to help understand the method and the core idea of the present application. It should be noted that, for those skilled in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall into the protection scope of the present application.
Claims (10)
1. A method of temperature control, comprising:
acquiring temperature values of all components in target equipment;
determining whether a component to be radiated exists in the target equipment or not according to each temperature value;
if the target equipment has the component to be radiated, controlling a driving assembly to drive a radiator to a radiating position corresponding to the component to be radiated so as to enable the radiator to radiate and cool the component to be radiated at the radiating position.
2. The temperature control method according to claim 1, wherein the determining whether a component to be cooled exists in the target device according to each temperature value includes:
for each component, obtaining an allowable temperature value of the component;
calculating a temperature difference between the temperature value and the allowable temperature value;
and when the temperature difference value is lower than a first threshold value, determining the component as the component to be radiated.
3. The temperature control method according to claim 2, wherein the controlling and driving assembly drives the heat sink to a heat dissipation position corresponding to the component to be heat dissipated, so that after the heat sink performs heat dissipation and temperature reduction on the component to be heat dissipated at the heat dissipation position, the method further comprises:
and when the temperature difference exceeds a second threshold value, sending a stop operation instruction to the radiator so as to stop the radiator from operating.
4. The temperature control method according to claim 2, wherein after determining whether the component to be cooled exists in the target device according to each of the temperature values, the method further comprises:
when the number of the components to be radiated exceeds 1, taking the component to be radiated corresponding to the temperature difference value with the minimum value as a first component to be radiated;
correspondingly, control drive assembly with the radiator drive extremely wait to dispel the heat dissipation position that the components and parts correspond, so that the radiator is in the heat dissipation position does wait to dispel the heat the components and parts and carry out the heat dissipation cooling, include:
and controlling the driving assembly to drive the radiator to a first radiating position corresponding to the first component to be radiated so that the radiator can radiate and cool the first component to be radiated at the first radiating position.
5. The temperature control method according to claim 4, wherein the controlling the driving assembly to drive the heat sink to a first heat dissipation position corresponding to the first component to be heat dissipated so that the heat sink performs heat dissipation and temperature reduction on the first component to be heat dissipated at the first heat dissipation position comprises:
controlling the driving assembly to drive the radiator to a first radiating position corresponding to the first component to be radiated;
determining working parameters of the radiator according to the number of the components to be radiated;
and sending the working parameters to the radiator so that the radiator operates at the first radiating position according to the working parameters to radiate and cool the first component to be radiated.
6. The temperature control method according to any one of claims 1 to 5, wherein the controlling and driving assembly drives the heat sink to a heat dissipation position corresponding to the component to be heat dissipated includes:
acquiring the current position of the radiator, and determining the heat dissipation position corresponding to the component to be dissipated;
determining a moving route from the current position to the heat dissipation position in a radiator moving route map corresponding to the target device;
and controlling the driving assembly to drive the heat radiator from the current position to the heat radiating position according to the moving route.
7. An electronic device is characterized by comprising a main controller, a plurality of device components, a radiator, a driving assembly and a radiator moving track, wherein each device component is provided with a temperature sensor, and the radiator moving track is connected with a radiating position corresponding to each device component;
the main controller is used for judging whether each equipment component is a component to be radiated according to the temperature values uploaded by the temperature sensors, if so, the driving assembly is controlled to drive the radiator to a radiating position corresponding to the component to be radiated according to the radiator moving track, so that the radiator performs radiating and cooling on the radiating position of the component to be radiated.
8. A temperature control apparatus, comprising:
the acquisition module is used for acquiring temperature values of all components in the target equipment;
the judging module is used for determining whether the target equipment has a component to be radiated according to each temperature value;
and the control module is used for controlling the driving assembly to drive the radiator to a radiating position corresponding to the component to be radiated if the component to be radiated exists in the target equipment, so that the radiator is in the radiating position to perform radiating and cooling on the component to be radiated.
9. A temperature control apparatus, comprising:
a memory for storing a computer program;
a processor for implementing the steps of the temperature control method according to any one of claims 1 to 6 when executing the computer program.
10. A computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, which computer program, when being executed by a processor, carries out the steps of the temperature control method according to any one of claims 1 to 6.
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| CN202210760993.7A CN115016570A (en) | 2022-06-30 | 2022-06-30 | Temperature control method and related equipment |
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| CN202210760993.7A CN115016570A (en) | 2022-06-30 | 2022-06-30 | Temperature control method and related equipment |
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Application publication date: 20220906 |