CN108337859A - Radiating subassembly and its control method, intelligent sound, electronic equipment and storage medium - Google Patents
Radiating subassembly and its control method, intelligent sound, electronic equipment and storage medium Download PDFInfo
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- CN108337859A CN108337859A CN201810131955.9A CN201810131955A CN108337859A CN 108337859 A CN108337859 A CN 108337859A CN 201810131955 A CN201810131955 A CN 201810131955A CN 108337859 A CN108337859 A CN 108337859A
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- radiating subassembly
- temperature value
- sliding part
- temperature
- temperature sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20209—Thermal management, e.g. fan control
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of radiating subassembly, it is set in the shell of electronic equipment, radiating subassembly include be arranged in shell and can opposite shell sliding sliding part and the radiator that is set on sliding part, radiator moves under the drive of sliding part in shell, with the electronic element radiating to different location.The invention also discloses a kind of control method of radiating subassembly, intelligent sound, electronic equipment and storage mediums.In technical solution of the present invention, radiating subassembly includes the sliding part being arranged in shell and the radiator that is arranged on sliding part, sliding part can be slided with respect to shell, so, radiator can move under the drive of sliding part in shell, with the electronic element radiating to different location, realization quickly radiates to electronic equipment local location, improves the radiating efficiency of radiating subassembly.
Description
Technical field
The present invention relates to domestic electric appliance field, more particularly to a kind of radiating subassembly and its control method, intelligent sound,
Electronic equipment and storage medium.
Background technology
With the fast development of science and technology, intelligent electronic device has progressed into family, such as intelligent appliance or intelligent domestic
Robot etc..Since intelligent electronic device has multiple functions, in this way, it is built-in, there are many electronic components, for example, being built-in with place
Device, air detection module, camera module, display module, acoustic control plate and power module etc. are managed, intelligent electronic device is being run
In the process, these electronic components will produce a large amount of heat, and especially multiple electronic components are run simultaneously, in confined space heat
Rapid accumulation, if heat is discharged not in time, can influence the performance and service life of household intelligent robot.
Therefore, intelligent electronic device has been generally designed radiator structure, for example, can generally be arranged in intelligent electronic device
Then radiator fan designs corresponding heat emission hole heat dissipation so that generate convection effects in intelligent electronic device, realize on the shell
The effect of ventilation heat dissipation.However, the radiator structure in existing intelligent electronic device be fixed it is constant, if smart electronics are set
The standby electronic component of interior discrete Hot-air fan farther out is in running order or is in the condition of high temperature, and radiator fan can only also pass through sky
Interior air transmits heat dissipation, cannot quickly disperse the heat on the electronic component, in this way, existing radiator structure dissipates
The thermal efficiency is not high.
Invention content
The main purpose of the present invention is to provide a kind of radiating subassemblies, it is intended to it is not high to solve existing radiating subassembly radiating efficiency
The problem of.
To achieve the above object, the present invention provides a kind of radiating subassembly, and the radiating subassembly is set to the shell of electronic equipment
In vivo, the radiating subassembly include be arranged in the shell and can opposite shell sliding sliding part and be set to the cunning
Radiator on moving part, the radiator move under the drive of the sliding part in the shell, to be set to the electronics
The electronic element radiating of standby different location.
Preferably, the radiating subassembly further includes the sliding rail of setting on the housing, and the sliding part is installed in described
On sliding rail, the relatively described sliding rail sliding of the sliding part.
Preferably, the radiating subassembly further includes the temperature sensor being set in the shell on each electronic component.
Preferably, the radiating subassembly further includes the actuator being set in the shell, the actuator and the cunning
Moving part connects, to drive the sliding part to be slided along the sliding rail.
To achieve the goals above, the present invention also provides a kind of intelligent sound, the intelligent sound includes as described above
Radiating subassembly.
To achieve the goals above, the present invention also provides a kind of control method of radiating subassembly, the controls of the radiating subassembly
Method processed includes the following steps：
The temperature value that each temperature sensor detects is obtained, determines that the corresponding temperature of temperature value for meeting preset condition passes
Sensor；
The position that the actuator drives the sliding part to be moved to the corresponding electronic component of the temperature sensor is controlled,
With to the electronic element radiating.
Preferably, when the temperature value that temperature sensor detects is more than the first preset temperature value, judge that the temperature passes
Sensor is the corresponding temperature sensor of temperature value for meeting preset condition.
Preferably, the control sliding part is moved to the step of the position of the corresponding electronic component of the temperature sensor
Suddenly include：
When the corresponding temperature sensor of temperature value for meeting preset condition is multiple, obtains the temperature sensor and correspond to
Electronic component in highest priority electronic component；
The corresponding position of electronic component that the actuator drives the sliding part to be moved to highest priority is controlled, with right
The electronic element radiating.
Preferably, the determination meets the step of temperature value corresponding temperature sensor of preset condition and includes：
Obtain highest temperature value in the temperature value that each temperature sensor detects；
Determine the corresponding temperature sensor of highest temperature value.
Preferably, the temperature value for obtaining each temperature sensor and detecting, determines the temperature value for meeting preset condition
After the step of corresponding temperature sensor, further include：
Judge whether the temperature value for meeting preset condition is more than the second preset temperature value；
It is greater than or equal to the second preset temperature value in the temperature value for meeting preset condition, increases the power of radiator,
Wherein, the second preset temperature value is more than first preset temperature value.
To achieve the goals above, the present invention also proposes that a kind of electronic equipment, the electronic equipment include memory, processing
Device, the computer program that is stored on the memory and can run on the processor and heat dissipation group as described above
The step of part, the computer program realizes the control method of radiating subassembly as described above when being executed by the processor.
Preferably, the electronic equipment is intelligent sound.
To achieve the goals above, the present invention also proposes a kind of storage medium, and heat dissipation group is stored on the storage medium
The control program of part, the control program of the radiating subassembly realize the control of radiating subassembly as described above when being executed by processor
The step of method.
A kind of radiating subassembly and its control method, intelligent sound, electronic equipment and the storage that the embodiment of the present invention proposes are situated between
Matter, the radiating subassembly include the sliding part being arranged in shell and the radiator that is arranged on the sliding part, the cunning
Moving part can be slided with respect to shell, in this way, the radiator can move under the drive of sliding part in the shell, with to difference
The electronic element radiating of position, realization quickly radiate to electronic equipment local location, improve dissipating for radiating subassembly
The thermal efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of radiating subassembly first embodiment in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of radiating subassembly second embodiment in the embodiment of the present invention；
Fig. 3 is the apparatus structure schematic diagram for the hardware running environment that the embodiment of the present invention is related to；
Fig. 4 is the flow diagram of the control method first embodiment of radiating subassembly of the present invention；
Fig. 5 is the flow diagram of the control method second embodiment of radiating subassembly of the present invention；
Fig. 6 is the flow diagram of the control method 3rd embodiment of radiating subassembly of the present invention；
Fig. 7 is the flow diagram of the control method fourth embodiment of radiating subassembly of the present invention.
The embodiments will be further described with reference to the accompanying drawings for the realization, the function and the advantages of the object of the present invention.
Specific implementation mode
It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
The primary solutions of the embodiment of the present invention are：The temperature value that each temperature sensor detects is obtained, is determined full
The corresponding temperature sensor of temperature value of sufficient preset condition；Controlling the actuator drives the sliding part to be moved to the temperature
The position of the corresponding electronic component of sensor, with to the electronic element radiating.
Since in the prior art, the radiator structure of intelligent electronic device is usually built-in radiator fan, then on the shell
Design corresponding heat emission hole heat dissipation so that generate convection effects in intelligent electronic device, realize the effect of ventilation heat dissipation.However,
This radiator structure be fixed it is constant, if the electronic component of discrete Hot-air fan farther out is in work in intelligent electronic device
State is in the condition of high temperature, and radiator fan also can only transmit heat dissipation by air in space, will cannot quickly be somebody's turn to do
Heat on electronic component disperses, in this way, existing radiator structure radiating efficiency is not high.
The present invention provides a solution, and the radiating subassembly of the removable heat dissipation of one group of radiator is arranged, is set according to electronics
Standby part radiating requirements, mobile radiating subassembly radiate to the local location by short distance, accelerate the office to corresponding position
The heat dissipation of portion position, in this way, being greatly improved heat dissipation effect of the radiating subassembly to electronic equipment.
As shown in Figure 1, Fig. 1 is the structural schematic diagram of radiating subassembly first embodiment in the embodiment of the present invention.
The present invention provides a kind of radiating subassembly, and the radiating subassembly is set in the shell 10 of the electronic equipment, described
Radiating subassembly includes that interior in the shell 10 and can be with respect to the sliding of shell 10 sliding part (not shown) and setting is arranged
In the radiator 210 on the sliding part, the radiator 210 moves under the drive of the sliding part in the shell 10
It is dynamic, with the electronic element radiating of different location in the shell 10 to electronic equipment.The radiator 210 can be fan or heat dissipation
The component of the heat dissipations such as piece.
Due to being usually provided with a variety of electronic components in the shell 10 of electronic equipment, and there are same flat for each electronic component
Face different location distribution, it is also possible to there are spatial distributions, in this way, the radiating requirements of the electronic component in order to meet different location,
The radiator 210 being arranged on the radiating subassembly is slidably extremely radiated without position with the electronic component to different location.
In the radiating subassembly of the present embodiment, there is sliding part, the radiator 210 to slide between the radiator 210 and shell 10
It can be moved between the different location in shell 10 under the drive of part, for example, leftmost electronic component is in shell 10
When hot operation state, the radiator 210 can be moved to the leftmost position of shell 10 in the drive of sliding part, positive
It radiates to the electronic component, accelerates the heat dissipation of the electronic component；If the electronic component of rightmost is in height in shell 10
When temperature state, the radiator 210 can the drive of sliding part be moved to shell 10 rightmost position, it is positive against should
Electronic component radiates, and accelerates the heat dissipation of the electronic component.
Radiator 210 is driven to be moved in shell 10, it can be achieved that different location in this way, moveable sliding part is arranged
Electronic component radiates, and when realizing that part is in the condition of high temperature, concentrates and radiates to part, improve the heat dissipation of radiating subassembly
Efficiency.
It is understood that the sliding part is realized there are many modes of the sliding of shell 10 relatively, such as in the shell
Sliding slot is recessed in 10, the sliding part is installed in the sliding slot, and can be moved along the sliding slot；Alternatively, in the shell
The compatible guide rail of the sliding part is set in 10, in this way, the sliding part can move on the guide rail.It is appreciated that
It is that the sliding part can also can be other forms with respect to the mode that shell 10 slides, and not repeat one by one herein.
In technical solution of the present invention, the radiating subassembly includes the sliding part being arranged in shell 10 and is arranged described
Radiator 210 on sliding part, the sliding part can be slided with respect to shell 10, in this way, the radiator 210 can be in sliding part
It moves in the shell 10 under drive, with the electronic element radiating to different location, realizes quickly to electronic equipment
Local location radiates, and improves the radiating efficiency of radiating subassembly.
Preferably, the radiating subassembly further includes the sliding rail 220 being arranged on the shell 10, and the sliding part is installed in
On the sliding rail 220, the relatively described sliding rail 220 of the sliding part slides.The sliding rail 220 can be fixed on the shell 10
On, it can also be set in cavity made of the shell 10 encloses.
In the embodiment of the present invention, sliding rail 220 is set on the housing 10, and the sliding rail 220 parallel with shell 10 can be set
It sets, electronic component of the shell 10 into shell 10 can also be deviated from and extended, in this way, the sliding rail 220 can not only drive
The movement between the electronic component of different location of the radiator 210 is radiated with the electronic component to different location, may be used also
It drives the radiator 210 close to the electronic component, closely accelerates to radiate to the electronic component to realize.
It is understood that the sliding rail 220 is in the shape of a spiral, the radiator 210 is under the drive of sliding part, along sliding rail
220 move in the shape of a spiral.In the present embodiment, 220 preferred helical form of the sliding rail, sliding part is moved along helical form sliding rail 220
Range is wider, and the position that can be moved is more accurate, realizes that heat dissipation effect is more preferable.
The sliding part realization is moved on sliding rail 220, can manually control sliding part movement by the way that drive rod is arranged,
Its movement can be automatically controlled by the way that actuator is arranged, specifically, the radiating subassembly further includes being set in the shell
Actuator (is not marked in figure), and the actuator is connect with the sliding part, to drive the sliding part to be slided along the sliding rail 220
It is dynamic.Specifically, the actuator can be dual-axle motor, and the sliding part can be driven to be moved in X-axis or Z axis, realize driving
It moves in the space of the sliding part.
In order to realize automatically controlling for the monitoring of each electronic component temperature in shell 10 and sliding part shift position, institute
It further includes being set in the temperature sensor in the shell 10 on each electronic component namely the shell 10 to state radiating subassembly
Each electronic component by temperature sensor implement monitor its temperature, by implementation monitor its temperature variations, implement from
Dynamic control sliding part movement, with the corresponding position of electronic component for driving radiator 210 to radiate to needs.
As shown in Fig. 2, Fig. 2 is the structural schematic diagram of radiating subassembly second embodiment in the embodiment of the present invention.
In the embodiment of the present invention, the radiating subassembly differs except 220 structure of sliding rail with the sliding rail 220 in first embodiment
Outside causing, other structures are consistent with the structure of the radiating subassembly in first embodiment, do not repeat one by one herein.Wherein, the present embodiment
In sliding rail 220 can be moved on the sliding rail 220 in crosswise in crosswise namely the sliding part, to realize up and down
The movement of position.
It is understood that the sliding rail 220 in radiating subassembly proposed by the present invention can also be other structures, for example, institute
It is multidimensional sliding rail 220 etc. to state sliding rail 220.
The present invention also proposes a kind of intelligent sound, which includes radiating subassembly as described above, the heat dissipation group
Part concrete structure is with reference to above-described embodiment, since this intelligent sound uses whole technical solutions of above-mentioned all embodiments, because
This at least has all advantageous effects caused by the technical solution of above-described embodiment, and this is no longer going to repeat them.
As shown in figure 3, the terminal structure schematic diagram for the hardware running environment that Fig. 3, which is the embodiment of the present invention, to be related to.
Terminal of the embodiment of the present invention can be domestic robot, can also be that the electronics such as intelligent controller, intelligent air condition are set
It is standby.
As shown in figure 3, the terminal may include：Processor 1001, such as CPU, network interface 1004, user interface
1003, memory 1005, communication bus 1002.Wherein, communication bus 1002 is for realizing the connection communication between these components.
User interface 1003 may include display screen (Display), input unit such as keyboard (Keyboard), optional user interface
1003 can also include standard wireline interface and wireless interface.Network interface 1004 may include optionally that the wired of standard connects
Mouth, wireless interface (such as WI-FI interfaces).Memory 1005 can be high-speed RAM memory, can also be stable memory
(non-volatile memory), such as magnetic disk storage.Memory 1005 optionally can also be independently of aforementioned processor
1001 storage device.
It will be understood by those skilled in the art that electronic equipment shown in Fig. 3 does not constitute the limit to electronic devices structure
It is fixed, may include either combining certain components or different components arrangement than illustrating more or fewer components.For example, electric
Sub- device structure can also include camera, RF (Radio Frequency, radio frequency) circuit, sensor, display module, sky
Gas detection module, core control panel module, voicefrequency circuit, WiFi module, spare electromagnetic module etc..Wherein, sensor is such as
Temperature sensor etc..Sensor is set on each electronic component in electronic equipment, such as sensor is set to core control
In plate module, in real time detect core control panel temperature, core control panel when the temperature is excessively high, processor passes through sensing
The temperature signal control sliding part that device is sent drives radiator to be moved to the corresponding position of core control panel, with face core control
Making sheet is radiated, and the radiating efficiency of core control panel is accelerated.
As shown in figure 3, as may include operating system, network communication mould in a kind of memory 1005 of storage medium
The control application program of block, Subscriber Interface Module SIM and radiating subassembly.
In terminal shown in Fig. 3, network interface 1004 is mainly used for connecting background server, is carried out with background server
Data communicate；User interface 1003 is mainly used for connecting client (user terminal), with client into row data communication；And processor
1001 can be used for calling the control application program of the radiating subassembly stored in memory 1005, and execute following operation：
The temperature value that each temperature sensor detects is obtained, determines that the corresponding temperature of temperature value for meeting preset condition passes
Sensor；
The position that the actuator drives the sliding part to be moved to the corresponding electronic component of the temperature sensor is controlled,
With to the electronic element radiating.
Further, processor 1001 can call the control application program of the radiating subassembly stored in memory 1005,
Also execute following operation：
When the temperature value that temperature sensor detects is more than the first preset temperature value, judge that the temperature sensor is full
The corresponding temperature sensor of temperature value of sufficient preset condition.
Further, processor 1001 can call the control application program of the radiating subassembly stored in memory 1005,
Also execute following operation：
When the corresponding temperature sensor of temperature value for meeting preset condition is multiple, obtains the temperature sensor and correspond to
Electronic component in highest priority electronic component；
The corresponding position of electronic component that the actuator drives the sliding part to be moved to highest priority is controlled, with right
The electronic element radiating.
Further, processor 1001 can call the control application program of the radiating subassembly stored in memory 1005,
Also execute following operation：
Obtain highest temperature value in the temperature value that each temperature sensor detects；
Determine the corresponding temperature sensor of the highest temperature value of the temperature.
Further, processor 1001 can call the control application program of the radiating subassembly stored in memory 1005,
Also execute following operation：
Judge whether the temperature value for meeting preset condition is more than the second preset temperature value；
It is greater than or equal to second preset value in the temperature value for meeting preset condition, increases the power of radiator,
Wherein, the second preset temperature value is more than first preset temperature value.
It is the first embodiment of the control method of radiating subassembly provided by the invention, the radiating subassembly with reference to Fig. 4, Fig. 4
Control method include：
Step S10 obtains the temperature value that each temperature sensor detects, determines that the temperature value for meeting preset condition corresponds to
Temperature sensor；
The temperature sensor is set on each electronic component in the electronic equipment where radiating subassembly, for real-time
Detect the temperature of each electronic component.It is understood that the electronic component is in running order or is in standby shape
When state, heat is will produce, in this way, setting temperature sensor detects the temperature of electronic component in real time, even if electronic component is in
When standby mode, if the temperature value of detected electronic component meets preset condition, S20 is thened follow the steps.If part electronics
Element is in running order, and when part electronic component is in standby, it can only detect in running order electronics member
The temperature value of part, and then determine the corresponding temperature sensor of temperature value for meeting preset condition；Each electricity can also be detected in real time
The temperature value of subcomponent, and then corresponding temperature sensor is worth come temperature according to identical preset condition, to execute step
S20。
Preferably, in the embodiment of the present invention, whether judgement temperature value meets preset condition, can be by presetting a temperature
Value judges that the temperature value meets preset condition when the temperature value detected is greater than or equal to the preset temperature value.
Specifically, when the temperature value that temperature sensor detects is more than the first preset temperature value, the temperature is judged
Sensor is the corresponding temperature sensor of temperature value for meeting preset condition.
The first preset temperature value is preset in system, if the temperature of electronic component is in the range less than the first preset temperature value
It is interior, judge that the electronic component is under safe working temperature and work, work does not influence the work of electronic component at such a temperature
Performance and service life.If the temperature of electronic component is greater than or equal to the first preset temperature value, judge at the electronic component
It works under high temperature, the working performance and service life of electronic component, Ye Jisuo can be seriously affected for a long time by working at such a temperature
State the maximum temperature value that the first preset temperature value is electronic component safe working temperature.
If temperature when detected temperature value is unsatisfactory for preset condition namely on electronic component is described first
When below preset temperature value, electronic component is under safe temperature and works, then in order to result in waste of resources, controls the sliding part
It is moved to initial position, and reduces the power of the radiator or closes the radiator.
In the present embodiment, by presetting the first preset temperature value, whether the temperature value detected by judgement temperature sensor
More than or equal to the first preset temperature value, determine whether the corresponding electronic component of the temperature sensor is in hot operation shape
State, in order to radiate to electronic component, in this way, realize the electronic component for determining need to radiate in time, it is quickly right to realize
The electronic component to radiate radiates.
Alternatively, whether judgement temperature value meets preset condition, the temperature value that can also be detected in the temperature sensor
In, highest temperature value is obtained, judges the temperature value to meet the temperature value of preset condition.
Specifically, obtaining highest temperature value in the temperature value that each temperature sensor detects；Determine the temperature
The corresponding temperature sensor of highest temperature value, judges the corresponding temperature sensor of the temperature value to meet the temperature of preset condition
The corresponding temperature sensor of angle value.
In the present embodiment, when obtaining the temperature value that each temperature sensor detects, acquired temperature is directly determined
The highest temperature value of temperature in value, and then the corresponding temperature sensor of the highest temperature value of temperature, with to the sensor institute
Electronic component in position radiates.
In the present embodiment, the highest temperature value of temperature is directly acquired, the corresponding temperature of the highest temperature value of temperature passes
Sensor radiates in order to which radiator is directly moved to the corresponding positions of electronic parts of the temperature sensor, and it is right in time to realize
The electronic element radiating to work under maximum temperature state.
Step S20 controls the actuator and the sliding part is driven to be moved to the corresponding electronics member of the temperature sensor
The position of part, with to the electronic element radiating.
Specifically, after determination meets the corresponding temperature sensor of temperature value of preset condition, the temperature sensing is obtained
The position of device, and then control the actuator and the sliding part is driven to be moved to the corresponding electronic component of the temperature sensor
Position, at this point, sliding part drive radiator is also moved to the position of the corresponding electronic component of the temperature sensor, to institute
It states electronic component and carries out closely positive heat dissipation.
It is corresponded to it is understood that the control actuator drives the sliding part to be moved to the temperature sensor
Electronic component position the step of may include：
Calculate sliding part present position and determination meets the corresponding temperature sensor institute of the temperature value of preset condition
The distance between corresponding electronic component；
The sliding part is calculated according to the distance and needs mobile step number, is controlled the actuator and is driven the sliding part
The mobile step number, to be moved to the position of the corresponding electronic component of the temperature sensor.
In the present embodiment, the displacement distance of sliding part is determined by calculating mobile step number, in this way, the movement of sliding part
Position is more accurate.
Alternatively, the control actuator drives the sliding part to be moved to the corresponding electronics member of the temperature sensor
The step of position of part can also include：
After determining and meeting the corresponding temperature sensor of temperature value of preset condition, where opening the temperature sensor
Position sensor on electronic component；
It controls the actuator and drives the sliding part movement, and in the inductive signal for receiving the position sensor
When, stop the mobile sliding part.
It is also provided with position sensor on each electronic component, for incuding sliding part.When determination needs to radiate first
Electronic component when, open the position sensor on the electronic component, in this way, during driving the sliding part, connecing
When receiving the inductive signal of open position sensor, stop driving the sliding part, at this point, the sliding part has been moved into institute
State the position of the corresponding electronic component of temperature sensor.
It is understood that each position sensor can also be marked, the position sensor is opened in real time, determining
When the location sensitive signal received is that the position sensor on the electronic component for needing to radiate is sent, stop the mobile sliding
Part, at this point, judging that the sliding part has been moved into the position of the corresponding electronic component of the temperature sensor.
In technical solution of the present invention, the temperature value that each temperature sensor detects is obtained, determination meets preset condition
The corresponding temperature sensor of temperature value controls the actuator driving sliding part and is moved to the corresponding electronics of the temperature sensor
The position of element drives radiator to be dissipated to the electronic component in different location by moving sliding part in real time
Heat quickly disperses the heat of local electronic element in this way, realizing, improves heat dissipation effect.
It is the second embodiment of the control method of radiating subassembly provided by the invention with reference to Fig. 5, Fig. 5, is based on above-mentioned Fig. 4 institutes
The step of embodiment shown, the step S10 determines the temperature value for meeting preset condition corresponding temperature sensor, can also wrap
It includes：
Step S110 obtains the temperature value more than or equal to the first preset temperature value；
Step S120 obtains highest temperature value in the temperature value more than or equal to the first preset temperature value；
Step S130 determines the corresponding temperature sensor of the highest temperature value.
In the present embodiment, the first preset temperature value is determined as the maximum temperature value of electronic component safe working temperature, works as electricity
When the temperature of subcomponent is greater than or equal to the first preset temperature value, electronic component enters hot operation state, in this way, being dissipated determining
When which electronic component hot device first radiates to, selection temperature value is highest in the electronic component for entering hot operation state
Electronic component radiates, and when system operation can quickly determine the element for needing to radiate, so realize in time to electronic component into
Row heat dissipation.
It is the 3rd embodiment of the control method of radiating subassembly provided by the invention with reference to Fig. 6, Fig. 6, is based on above-mentioned Fig. 4 institutes
The embodiment shown, the step S20, controlling the actuator, to drive the sliding part to be moved to the temperature sensor corresponding
The step of position of electronic component includes：
Step S210 obtains the temperature when the corresponding temperature sensor of temperature value for meeting preset condition is multiple
The electronic component of highest priority in the corresponding electronic component of sensor；
It is corresponding to control the electronic component that the actuator drives the sliding part to be moved to highest priority by step S220
Position, with to the electronic element radiating.
In the temperature value of acquisition, have it is multiple when meeting preset condition, according in electronic equipment electronic component it is important
The heat-resisting quantity of property or electronic component, presets the priority of electronic component, and highest priority is first thermal component, according to
Priority puts in order, and is carried out successively to the corresponding electronic component of the corresponding temperature sensor of temperature value for meeting preset condition
Heat dissipation.For example, in household robot device, core control panel module is the most important component of domestic robot, and it is long-term
Work be easy to generate heat, adstante febre influences the performance of entire domestic robot, in this way, set the core control panel module as
The electronic component of highest priority, and standby power supply module is primary battery using the electronic component just begun to use after complete, such as
This can be arranged standby power supply module be the lower electronic component of priority, when temperature sensor detect core control panel module and
When the temperature of standby power supply module is satisfied by preset condition namely the temperature of the core control panel module and standby power supply module
When being all higher than or being equal to first preset temperature value, no matter whether core control panel module temperature is less than standby power supply module
Sliding part is moved to the position of core control panel module by temperature, and control radiator radiates to core control panel module,
When the temperature of core control panel module decreases below the first preset temperature value, then controls sliding part and be moved to second priority pole
The position of electronic component, and so on, until all electronic component under safe working temperature all in working.
In the present embodiment, control radiator first radiates to the higher electronic component of priority, so, it is ensured that important
Electronic component be not damaged, ensure that the working performance of electronic equipment, reduce the replacement cost of important electronic component.
If it is understood that the corresponding temperature sensor of the temperature value for meeting preset condition be it is multiple when, can be with root
According to the judgement of radiator position and the nearest temperature sensor in position, radiate successively from the near to the remote；Or temperature
It is worth highest electronic component, first radiates to the highest electronic component of temperature value；Alternatively, can also be according to other modes to full
The corresponding electronic component of temperature value of sufficient preset condition radiates, and does not repeat one by one herein.
It is the fourth embodiment of the control method of radiating subassembly provided by the invention with reference to Fig. 7, Fig. 7, is based on above-mentioned Fig. 4 institutes
The embodiment shown, the step S10 obtain the temperature value that each temperature sensor detects, determine the temperature for meeting preset condition
After the step of being worth corresponding temperature sensor, further include：
Step S30, judges whether the temperature value for meeting preset condition is more than the second preset temperature value, wherein described
Second preset temperature value is more than first preset temperature value；
Step S40 increases when the temperature value for meeting preset condition is greater than or equal to second preset temperature value
The power of radiator, wherein the radiator is fan.
Second preset temperature value is more than first preset temperature value, is more than described second in the temperature of electronic component
When preset temperature value, the electronic component is in high-risk status, if can not radiate in time, the electronic component is extremely easy to damage
It is bad.
The radiator be fan, when the corresponding electronic component of the temperature value for meeting preset condition, especially priority most
The high or highest electronic component of temperature value illustrates if the temperature value of electronic component is greater than or equal to the second preset temperature value
Temperature on the electronic component is very high, at this time, it may be necessary to increase the rotating speed of fan, so that the electronic component reaches fast cooling
Purpose prevents from damaging the electronic component.
It is understood that above-mentioned steps S30 and step S40 can be executed before step S20, can also S20 it
After execute, it is preferable that the step S30 and step S40 are executed after step S20.
It is understood that the present embodiment is equally applicable to the reality described in above-mentioned Fig. 5 the embodiment described and above-mentioned Fig. 6
Apply example.
In the present embodiment, after determination meets the corresponding temperature sensor of temperature value of preset condition, the mobile cunning
Moving part is to the position of the corresponding electronic component of the temperature sensor, in conjunction with the power for increasing radiator, realize much sooner and
Quickly cool down to the electronic component, in this way, better heat-radiation effect.
The present invention also proposes a kind of electronic equipment, which includes：Memory, processor and it is stored in the storage
On device and the computer program that can be run on the processor and radiating subassembly as described above, the computer program quilt
The processor realizes each step of the control method of the radiating subassembly described in embodiment as above when executing.
In addition, the embodiment of the present invention also proposes a kind of storage medium, the control of radiating subassembly is stored on the storage medium
Processing procedure sequence realizes the control of the radiating subassembly as described in above-described embodiment when the control program of the radiating subassembly is executed by processor
Each step of method processed.
The embodiments of the present invention are for illustration only, can not represent the quality of embodiment.
Through the above description of the embodiments, those skilled in the art can be understood that above-described embodiment side
Method can add the mode of required general hardware platform to realize by software, naturally it is also possible to by hardware, but in many cases
The former is more preferably embodiment.Based on this understanding, technical scheme of the present invention substantially in other words does the prior art
Going out the part of contribution can be expressed in the form of software products, which is stored in one as described above
In storage medium (such as ROM/RAM, magnetic disc, CD), including some instructions use so that a station terminal equipment (can be mobile phone,
Computer, server, air conditioner, domestic robot or network equipment etc.) execute side described in each embodiment of the present invention
Method.
It should be noted that herein, the terms "include", "comprise" or its any other variant are intended to non-row
His property includes, so that process, method, article or system including a series of elements include not only those elements, and
And further include other elements that are not explicitly listed, or further include for this process, method, article or system institute it is intrinsic
Element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that including this
There is also other identical elements in the process of element, method, article or system.
It these are only the preferred embodiment of the present invention, be not intended to limit the scope of the invention, it is every to utilize this hair
Equivalent structure or equivalent flow shift made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant skills
Art field, is included within the scope of the present invention.
Claims (13)
1. a kind of radiating subassembly, is set in the shell of electronic equipment, which is characterized in that the radiating subassembly includes being arranged in institute
It states in shell and the sliding part that can be slided with respect to shell and the radiator being set on the sliding part, the radiator is in institute
It states and is moved in the shell under the drive of sliding part, dissipated with the electronic component of different location in the shell to the electronic equipment
Heat.
2. radiating subassembly as described in claim 1, which is characterized in that the radiating subassembly further includes being arranged on the housing
Sliding rail, the sliding part is installed on the sliding rail, the relatively described sliding rail sliding of the sliding part.
3. radiating subassembly as claimed in claim 1 or 2, which is characterized in that the radiating subassembly further includes being set to the shell
Temperature sensor on internal each electronic component.
4. radiating subassembly as claimed in claim 2, which is characterized in that the radiating subassembly further includes being set in the shell
Actuator, the actuator is connect with the sliding part, to drive the sliding part to be slided along the sliding rail.
5. a kind of intelligent sound, which is characterized in that the intelligent sound includes the heat dissipation as described in claim 1-4 any one
Component.
6. a kind of control method of radiating subassembly, which is characterized in that the control method of the radiating subassembly includes the following steps：
The temperature value that each temperature sensor detects is obtained, determines the corresponding temperature sensing of temperature value for meeting preset condition
Device；
The position that the actuator drives the sliding part to be moved to the corresponding electronic component of the temperature sensor is controlled, with right
The electronic element radiating.
7. the control method of radiating subassembly as claimed in claim 6, which is characterized in that in the temperature that temperature sensor detects
When value is more than the first preset temperature value, the temperature sensor is judged for the corresponding temperature sensing of temperature value that meets preset condition
Device.
8. the control method of radiating subassembly as claimed in claim 7, which is characterized in that the control sliding part is moved to
The step of position of the corresponding electronic component of the temperature sensor includes：
When the corresponding temperature sensor of temperature value for meeting preset condition is multiple, the corresponding electricity of the temperature sensor is obtained
The electronic component of highest priority in subcomponent；
The corresponding position of electronic component that the actuator drives the sliding part to be moved to highest priority is controlled, with to described
Electronic element radiating.
9. the control method of radiating subassembly as claimed in claim 6, which is characterized in that the determination meets the temperature of preset condition
The step of angle value corresponding temperature sensor includes：
Obtain highest temperature value in the temperature value that each temperature sensor detects；
Determine the corresponding temperature sensor of highest temperature value.
10. the control method of the radiating subassembly as described in claim 6-9 any one, which is characterized in that the acquisition is each
The temperature value that temperature sensor detects, after the step of determining the temperature value corresponding temperature sensor for meeting preset condition,
Further include：
Judge whether the temperature value for meeting preset condition is more than the second preset temperature value；
When the temperature value for meeting preset condition is greater than or equal to second preset temperature value, increase the work(of radiator
Rate.
11. a kind of electronic equipment, which is characterized in that the electronic equipment includes memory, processor, is stored in the memory
The upper and computer program that can be run on the processor and the radiating subassembly as described in Claims 1-4 any one,
Realizing the radiating subassembly as described in any one of claim 6 to 10 when the computer program is executed by the processor
The step of control method.
12. electronic equipment as claimed in claim 11, which is characterized in that the electronic equipment is intelligent sound.
13. a kind of storage medium, which is characterized in that the control program of radiating subassembly is stored on the storage medium, it is described to dissipate
The control of the radiating subassembly as described in any one of claim 6 to 10 is realized when the control program of hot component is executed by processor
The step of method.
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| CN201810131955.9A CN108337859B (en) | 2018-02-08 | 2018-02-08 | Heat dissipation assembly, control method thereof, intelligent sound box, electronic equipment and storage medium |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810131955.9A CN108337859B (en) | 2018-02-08 | 2018-02-08 | Heat dissipation assembly, control method thereof, intelligent sound box, electronic equipment and storage medium |
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| CN108337859B CN108337859B (en) | 2020-05-22 |
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ID=62928400
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| CN111405839A (en) * | 2020-05-22 | 2020-07-10 | 京东方科技集团股份有限公司 | Electronic device |
| CN111458567A (en) * | 2020-04-14 | 2020-07-28 | 贵州电网有限责任公司 | Intelligent radiating feeder automation tester |
| CN111587027A (en) * | 2019-02-18 | 2020-08-25 | 维沃移动通信有限公司 | Terminal and heat dissipation control method |
| CN112947730A (en) * | 2021-04-01 | 2021-06-11 | 山东英信计算机技术有限公司 | Embedded coil radiation type server automatic temperature control system and method |
| CN115016570A (en) * | 2022-06-30 | 2022-09-06 | 浪潮(山东)计算机科技有限公司 | Temperature control method and related equipment |
| FR3134680A1 (en) * | 2022-04-13 | 2023-10-20 | Laurent Vidal | Thermal regulation assembly |
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| CN111405839A (en) * | 2020-05-22 | 2020-07-10 | 京东方科技集团股份有限公司 | Electronic device |
| CN112947730A (en) * | 2021-04-01 | 2021-06-11 | 山东英信计算机技术有限公司 | Embedded coil radiation type server automatic temperature control system and method |
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