CN114994506A - Device and method for realizing semi-automatic measurement of server mainboard signals - Google Patents
Device and method for realizing semi-automatic measurement of server mainboard signals Download PDFInfo
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Abstract
The invention belongs to the technical field of server signal measurement, and particularly provides a device and a method for realizing semi-automatic measurement of a server mainboard signal, wherein the device comprises a matrix point positioning light plate, an image identification module, a probe control module, a probe module, a measurement processing module and a display interface; the image identification module is used for carrying out primary imaging on the mainboard which is arranged in front of the matrix point positioning light plate and faces the probe, and carrying out matrix point imaging on the surface image of the mainboard by combining matrix points formed by the matrix point positioning light plate and outputting the matrix point imaging to a display interface for displaying; a user selects a matrix point of a target measuring point through a display interface and inputs the matrix point to the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism; the measurement processing module processes the information measured by the probe and outputs the processed information to the display interface. Efficiency and accuracy are improved in mainboard signal measurement.
Description
Technical Field
The invention relates to the technical field of server signal measurement, in particular to a device and a method for realizing semi-automatic measurement of a server mainboard signal.
Background
The server is a core device for providing computing services and is also an important component in the field of computer hardware. From the market scale, with the rapid development of services such as cloud computing and big data, the demand for servers is also rapidly increased.
When the server mainboard is designed, analog simulation is carried out on the whole signal of the mainboard, and when the simulation result meets the requirement, the scheme is determined to carry out actual production. However, the quality of the actual circuit signal is often affected by factors such as the actual resistance-capacitance error of the device, the loss error of the PCB board itself, and the crosstalk error between the devices. Therefore, for the actual main board, the actual point measurement of the key signals of the main board is still needed after the return of the main board, and the quality is judged. Meanwhile, when a suspected BUG caused by the signal quality problem occurs on the main board, the actual measurement of the main board signal is also needed to provide a reference basis for the BUG;
at present, the measurement of the signal or time sequence of the main board in the laboratory is still performed by using the traditional method of oscilloscope and probe point measurement. For many signal points which are inconvenient to measure, such as the back of a main board, the edge of a connector and a device dense area, operations such as flying lines and the like are often required to measure; when the actual signals of multiple points need to be measured simultaneously, multiple people need to respectively measure different measuring points or carry out operations such as a large number of flying wires and the like; therefore, on one hand, measurement efficiency is reduced while errors are introduced, and meanwhile, measurement stability cannot be guaranteed, on the other hand, a signal path lengthened after flying has an influence on signal quality of an actual signal point, and the signal path has only a reference value, but not accurate signal point quality reflection.
Disclosure of Invention
Aiming at the situation that when a plurality of actual signals are required to be measured simultaneously, a plurality of persons are required to respectively measure different measuring points or carry out a large amount of operations such as flying line and the like; therefore, on one hand, the measurement efficiency is reduced while errors are introduced, and meanwhile, the measurement stability cannot be guaranteed.
The technical scheme of the invention is as follows:
in a first aspect, the technical scheme of the invention provides a device for realizing semi-automatic measurement of signals of a server mainboard, which comprises a matrix point positioning light plate, an image identification module, a probe control module, a probe module, a measurement processing module and a display interface;
the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base;
the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the movement of the probe in the X-axis direction, the Y-axis direction and the Z-axis direction is controlled through the probe control module;
the image identification module is used for carrying out primary imaging on the mainboard which is arranged in front of the matrix point positioning light plate and faces the probe, and carrying out matrix point imaging on the surface image of the mainboard by combining matrix points formed by the matrix point positioning light plate and outputting the matrix point imaging to a display interface for displaying;
a user selects a matrix point of a target measurement point through a display interface and inputs the matrix point into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism;
the probe module is connected with the measurement processing module; the device is used for processing and outputting the information measured by the probe to a display interface.
Before a main board signal is measured, the probe is suspended above a matrix point positioning light plate, matrix point position correction and position positioning are carried out on the probe point through a transmitting chip arranged in the probe, and when the probe is suspended above the matrix point positioning light plate, the probe can be suspended above the matrix point positioning light plate through a mechanical arm. Placing the main board on the surface of a matrix point positioning light plate, and preliminarily drawing and forming matrix points by the matrix point positioning light plate through self-luminous light transmittance; the image recognition module at the side of the probe performs primary imaging on the front surface of the main board, and performs matrix point imaging on the image of the surface of the main board on the image and the formed matrix points; displaying the imaging result through a display interface; the user selects the setting of various electrical parameters of the probe through the display interface, selects the matrix point of the target measuring point, and sets the preset height from the surface of the plate, wherein the previous imaging result is displayed through the display interface, the user can select the setting of various electrical parameters of the probe by the system at the moment, and selects the matrix point of the target measuring point, and sets the preset height from the surface of the plate, so as to ensure the distance with a point margin between the target measuring point and the target measuring point; the user transmits the related data set by the display interface to the probe control module; the probe is controlled to move right above the measuring point through the probe control module, and the height difference between the probe and the main plate is positioned through an infrared module in the probe module side image acquisition module, so that the probe is controlled to descend to set the preset height away from the surface of the plate; adjusting the height of the probe by rotating the Z-axis fine adjustment mechanism to correct the distance between the probe and the measuring point; after the fine adjustment and correction are finished, the probe is placed on the surface of the measuring point, and the measurement imaging of the signal is controlled; and after the measurement is finished, storing the image, and controlling to increase the probe to the initial position.
Preferably, the image recognition module comprises an image acquisition module, an image recognition module and a first processor;
the image acquisition module is connected with the first processor through the image identification module;
the image acquisition module is used for carrying out primary image acquisition on a main board arranged in front of the matrix point positioning light plate and inputting acquired image information into the first processor through the image identification module;
and the first processor is used for carrying out matrix point imaging on the surface of the main board on the image acquired by the image acquisition module and the matrix point formed by the matrix point positioning light plate.
Preferably, the image acquisition module is fixed on the side of the probe module;
the image acquisition module is internally provided with an infrared module, and the height difference between the probe and the surface of the mainboard is monitored through the infrared reflection of the infrared module; transmitting the monitoring information to the control module through the first processor;
the control module is used for controlling the Z-axis moving mechanism to move according to the received height difference so as to drive the probe to reach a set distance from the surface of the main board;
the image recognition module is connected with the first processor through the cache module.
Preferably, two parallel grooves are arranged on the base; a Y-axis moving mechanism is arranged in each groove;
the main board is arranged between the two grooves on the base;
the Y-axis moving mechanism comprises a first motor, a first screw rod, a first sliding block and a first support;
the first screw rod is arranged in the groove, the first motor is arranged on the side surface of the base, and an output shaft of the first motor penetrates through the side surface of the base and is connected with the first screw rod in the groove; the end part of one end of the first screw rod, which is far away from the first motor, is connected with the first support through a bearing; the first screw rod penetrates through a threaded hole in the side face of the first sliding block to be connected with the first sliding block, and a Z-axis moving mechanism is arranged on the upper surface of each first sliding block.
After the height distance between the probe and the main board is adjusted to a certain height through the Z-axis moving mechanism, the probe is moved to the position above a measuring point by controlling the Y-axis moving mechanism to move, the probe is adjusted to the position right above the measuring point by controlling the X-axis moving mechanism, and the probe is adjusted to the surface of the main board through the Z-axis fine adjustment mechanism to perform measurement imaging.
Preferably, the Z-axis moving mechanism comprises a first electric telescopic rod; the fixed end of the first electric telescopic rod is fixed on the upper surface of the first sliding block, and the moving end of the first electric telescopic rod is connected with the Z-axis fine adjustment mechanism; and one ends of the two Z-axis fine adjustment mechanisms, which are far away from the first electric telescopic rod, are connected through a top end connecting plate.
Preferably, the Z-axis fine adjustment mechanism comprises a supporting plate, a second screw rod, a second sliding block and a manual rotation knob;
one end of the supporting plate is connected with the moving end of the first electric telescopic rod, and the other end of the supporting plate is connected with the top end connecting plate; threaded holes are respectively formed in the two ends of the top end connecting plate;
a groove is formed in the supporting plate, one end of the second screw rod is connected with the inner wall of the groove of the supporting plate through a bearing, and the other end of the second screw rod penetrates through a threaded hole in the top end connecting plate to be connected with the manual rotating knob;
the second screw rod penetrates through a threaded hole in the side face of the second sliding block to be connected with the second sliding block, and the upper surface of the second sliding block is connected with the X-axis moving mechanism.
Preferably, the X-axis moving mechanism comprises a third motor, a transverse connecting plate, a third screw rod, a third sliding block and a second support;
the two Z-axis fine adjustment mechanisms are respectively a first Z-axis fine adjustment mechanism and a second Z-axis fine adjustment mechanism; the second support is fixed on the side surface of the second Z-axis fine adjustment mechanism;
one end of the transverse connecting plate is connected to the upper surface of the second sliding block of the first Z-axis fine adjustment mechanism, and the other end of the transverse connecting plate is connected to the upper surface of the second sliding block of the second Z-axis fine adjustment mechanism;
the third motor is fixed at one end of the transverse connecting plate connected with the first Z-axis fine adjustment mechanism, an output shaft of the third motor is connected with one end of a third screw rod, and the other end of the third screw rod is connected with the second support through a bearing;
the third screw rod penetrates through a threaded hole in the side face of the third sliding block to be connected with the third sliding block, and the lower surface of the third sliding block is connected with the probe;
the first motor, the first electric telescopic rod and the third motor are respectively connected with the probe control module.
Preferably, the measurement processing module comprises an amplifier, the input end of the amplifier is connected with the probe, the output end of the amplifier is connected with the analog-to-digital conversion module through the sample-and-hold module, the output end of the analog-to-digital conversion module is connected with the second processor through the high-speed memory device, and the second processor is connected with the display interface.
In a second aspect, the present invention further provides a method for semi-automatically measuring a signal of a server motherboard, including the following steps:
placing the main board on the surface of a matrix point positioning light plate, and preliminarily drawing and forming matrix points by the matrix point positioning light plate through self-luminous light transmittance;
the image acquisition module at the side of the probe performs primary imaging on the front surface of the main board and transmits the image to the first processor, and the first processor performs matrix point imaging on the image on the surface of the main board on the image and the formed matrix points;
displaying the imaging result through a display interface;
the user selects the setting of various electrical parameters of the probe through the display interface, selects the matrix point of the target measurement point, sets the preset height from the surface of the plate, and transmits the relevant data set by the user through the display interface to the probe control module through the first processor;
the probe is controlled to move right above the measuring point through the probe control module, and the height difference between the probe and the main plate is positioned through an infrared module in the probe module side image acquisition module, so that the probe is controlled to descend to set the preset height away from the surface of the plate;
adjusting the height of the probe by rotating the manual rotating knob to correct the distance between the probe and the measuring point;
after the manual correction is finished, the probe is placed on the surface of the measuring point, and the measurement imaging of the signal is controlled;
and after the measurement is finished, storing the image, and controlling to increase the probe to the initial position.
Preferably, the main board is placed on the surface of a matrix point positioning light plate, and the step of preliminarily drawing and forming matrix points by the self-luminous light transmittance of the matrix point positioning light plate is preceded by the following steps:
the probe is suspended above the matrix point positioning light plate, and the matrix point position correction and position positioning are carried out on the probe point through a transmitting chip arranged in the probe.
According to the technical scheme, the invention has the following advantages: a user selects a matrix point of a target measurement point through a display interface and inputs the matrix point into the probe control module; the probe control module controls the probe to move to a preset height right above a measuring point, the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism, and the efficiency and accuracy are improved in the main board signal measurement.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
Therefore, compared with the prior art, the invention has prominent substantive features and remarkable progress, and the beneficial effects of the implementation are also obvious.
Drawings
In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present invention, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
FIG. 1 is a schematic block diagram of an apparatus of one embodiment of the present invention.
Fig. 2 is a schematic block diagram of an apparatus of another embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a probe module according to an embodiment of the invention.
FIG. 4 is a schematic view of a Y-axis moving mechanism in the probe module according to the embodiment of the present invention.
Detailed Description
In the present stage, the measurement of the signal or time sequence of the main board in the laboratory is still performed by using the traditional method of point measurement by an oscilloscope and a probe. For many signal points which are inconvenient to measure, such as the back of a main board, the edge of a connector and a device dense area, operations such as flying lines and the like are often required to measure; when the actual signals of multiple points need to be measured simultaneously, multiple persons need to measure different measuring points respectively, or a large amount of flying wires and other operations are carried out; therefore, on one hand, measurement efficiency is reduced while errors are introduced, and meanwhile, measurement stability cannot be guaranteed, on the other hand, a signal path lengthened after flying has an influence on signal quality of an actual signal point, and the signal path has only a reference value, but not accurate signal point quality reflection. In the traditional probe and oscilloscope measurement device, an image identification link and a semi-automatic control link are added, and the traditional signal measurement mode is optimized; the core of the image identification link lies in matrix point acquisition, imaging is carried out on a main board facing the probe, then preliminary image acquisition processing is carried out, and high-density matrix point division is carried out on the image for positioning and reference of subsequent specific probe test point positions. The principle of the semi-automatic control link is based on the imaging of matrix points to carry out horizontal plane positioning; the height of the vertical plane probe is controlled by considering that the welding points of the test points of the mainboard are not seen at the same height and the surface shape is not fixed, so that the equipment is difficult to coexist with high precision and flexibility; this application sets up the fine setting of Z axle direction and goes on through manual, also can be carried out reality by the operator perpendicularly and control, greatly increased controllability and economic nature on the cost. In order to make those skilled in the art better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a device for implementing semi-automatic measurement of a server motherboard signal, including a matrix point positioning optical plate, an image recognition module, a probe control module, a probe module, a measurement processing module, and a display interface;
the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base;
the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the movement of the probe in the X-axis direction, the Y-axis direction and the Z-axis direction is controlled through the probe control module;
the image identification module is used for carrying out primary imaging on the mainboard which is arranged in front of the matrix point positioning light plate and faces the probe, and carrying out matrix point imaging on the surface image of the mainboard by combining matrix points formed by the matrix point positioning light plate and outputting the matrix point imaging to a display interface for displaying;
a user selects a matrix point of a target measuring point through a display interface and inputs the matrix point to the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism;
the probe module is connected with the measurement processing module; the device is used for processing and outputting the information measured by the probe to a display interface.
In the probe of the present application, the transmission chip incorporated therein corrects the position of the matrix point and positions the probe point. The matrix point positioning light plate is a light plate which is electrified and self-luminous, and the object plane matrix point imaging of a certain degree can be carried out on the shelter object of the light plate through the permeability of the upper light source.
Before a main board signal is measured, the probe is suspended above a matrix point positioning light plate, matrix point position correction and position positioning are carried out on the probe point through a transmitting chip arranged in the probe, and when the probe is suspended above the matrix point positioning light plate, the probe can be suspended above the matrix point positioning light plate through a mechanical arm. Placing the main board on the surface of a matrix point positioning light plate, and preliminarily drawing and forming matrix points by the matrix point positioning light plate through self-luminous light transmittance; the image recognition module at the side of the probe performs primary imaging on the front surface of the main board, and performs matrix point imaging on the image of the surface of the main board on the image and the formed matrix points; displaying the imaging result through a display interface; the user selects the setting of various electrical parameters of the probe through the display interface, selects the matrix point of the target measuring point, and sets the preset height from the surface of the plate, wherein the previous imaging result is displayed through the display interface, the user can select the setting of various electrical parameters of the probe by the system at the moment, and selects the matrix point of the target measuring point, and sets the preset height from the surface of the plate, so as to ensure the distance with a point margin between the target measuring point and the target measuring point; the user transmits the related data set by the display interface to the probe control module; the probe is controlled to move to a position right above the measuring point through the probe control module, and the height difference between the probe and the main plate is positioned through the infrared module in the probe module side image acquisition module, so that the probe is controlled to descend to set the preset height away from the surface of the plate; adjusting the height of the probe by rotating the Z-axis fine adjustment mechanism to correct the distance between the probe and the measuring point; after the fine adjustment and correction are finished, the probe is placed on the surface of the measuring point, and the measurement imaging of the signal is controlled; and after the measurement is finished, storing the image, and controlling to increase the probe to the initial position.
In some embodiments, the image recognition module comprises an image acquisition module, an image recognition module, and a first processor;
the image acquisition module is connected with the first processor through the image recognition module;
the image acquisition module is used for carrying out primary image acquisition on a main board arranged in front of the matrix point positioning light plate and inputting acquired image information into the first processor through the image identification module;
and the first processor is used for carrying out matrix point imaging on the surface of the main board on the image acquired by the image acquisition module and the matrix point formed by the matrix point positioning light plate.
It should be noted here that the image capturing module has a camera module with a certain imaging capability, and meanwhile, the infrared module is built in the module, so that the height difference can be monitored through infrared reflection, and the image capturing module is fixed on the side of the probe module. The image acquisition module is internally provided with an infrared module, and the height difference between the probe and the surface of the mainboard is monitored through the infrared reflection of the infrared module; the monitoring information is transmitted to the control module through the first processor;
the control module is used for controlling the Z-axis moving mechanism to move according to the received height difference so as to drive the probe to reach a set distance from the surface of the main board;
the image recognition module is connected with the first processor through the cache module.
As shown in fig. 3 and 4, in some embodiments, the base is provided with two parallel grooves; a Y-axis moving mechanism is arranged in each groove;
the main board is arranged between the two grooves on the base;
the Y-axis moving mechanism comprises a first motor 101, a first screw rod 102, a first sliding block 103 and a first support 104;
the first screw rod 102 is arranged in the groove, the first motor 101 is arranged on the side surface of the base 100, and an output shaft of the first motor 101 penetrates through the side surface of the base 100 and is connected with the first screw rod 102 in the groove; the end part of the first lead screw 102 far away from the first motor 101 is connected with a first support 104 through a bearing; the first screw rod 102 penetrates through a threaded hole on the side surface of the first slide block 103 to be connected with the first slide block 103, and a Z-axis moving mechanism is arranged on the upper surface of each first slide block 103. It should be noted here that the two first lead screws 102 rotate simultaneously and each rotation drives the first slide block to move for an equal distance, so that the parallel connection is ensured not to be inclined.
In some embodiments, the Z-axis moving mechanism comprises a first motorized telescoping rod 200; the fixed end of the first electric telescopic rod 200 is fixed on the upper surface of the first sliding block 103, and the moving end of the first electric telescopic rod 200 is connected with the Z-axis fine adjustment mechanism; the ends of the two Z-axis fine adjustment mechanisms far away from the first electric telescopic rod 200 are connected through a top end connecting plate 400. Here, each movement of the two first electric telescopic rods is also simultaneous and the movement distance of each movement is also the same.
Specifically, the Z-axis fine adjustment mechanism comprises a support plate 300, a second screw rod 302, a second slide block 303 and a manual rotation knob 301;
one end of the support plate 300 is connected to the moving end of the first electric telescopic rod 200, and the other end of the support plate 300 is connected to the top end connection plate 400; threaded holes are respectively formed in two ends of the top end connecting plate 400;
a groove is formed in the support plate 300, one end of the second screw rod 302 is connected with the inner wall of the groove of the support plate 300 through a bearing, and the other end of the second screw rod 302 penetrates through a threaded hole in the top end connecting plate 400 to be connected with the manual rotating knob 301;
the second screw rod 302 passes through a threaded hole in the side surface of the second slider 303 to be connected with the second slider 303, and the upper surface of the second slider 303 is connected with the X-axis moving mechanism. When the height is finely adjusted by manually rotating the knob 301 at every time, it is ensured that the fine adjustment on both sides is the same and the transverse connecting plate is kept parallel to the main plate.
Performing horizontal plane positioning based on the imaging of the matrix points; the control of the vertical plane probe height module can carry out distance calculation by calculating the time difference of sending and receiving reflected signals, a preset height distance needs to be set, and the preset height is adjusted by moving the Z-axis moving mechanism up and down, but the surface shape is indefinite considering that the welding points of the test points of the main board are not seen, so that the high precision and the flexibility of the equipment are not easy to coexist; after the preset height distance is reached, the manual rotary button is manually rotated to correspondingly adjust the height through the Z-axis fine adjustment mechanism, namely, the manual rotary button can be used for actually controlling the height vertically, so that the controllability and the economical efficiency in cost are greatly increased, and the manual rotary button is more practical.
In some embodiments, the X-axis moving mechanism includes a third motor 501, a transverse connection plate 500, a third lead screw 502, a third slider 503, and a second support 504;
the two Z-axis fine adjustment mechanisms are respectively a first Z-axis fine adjustment mechanism and a second Z-axis fine adjustment mechanism; the second support 504 is fixed on the side of the second Z-axis fine adjustment mechanism;
one end of the transverse connection plate 500 is connected to the upper surface of the second slider 303 of the first Z-axis fine adjustment mechanism, and the other end of the transverse connection plate 500 is connected to the upper surface of the second slider 303 of the second Z-axis fine adjustment mechanism;
a third motor 501 is fixed at one end of the transverse connecting plate 500 connected with the first Z-axis fine adjustment mechanism, an output shaft of the third motor 501 is connected with one end of a third screw rod 502, and the other end of the third screw rod 502 is connected with a second support 504 through a bearing;
the third screw rod 502 passes through a threaded hole in the side surface of the third slide block 503 and is connected with the third slide block 503, and the lower surface of the third slide block 503 is connected with the probe 600;
the first motor 101, the first electric telescopic rod 200 and the third motor 501 are respectively connected with the probe control module.
As shown in fig. 2, it should be noted that the probe control module includes a controller; the measurement processing module comprises an amplifier, the input end of the amplifier is connected with the probe, the output end of the amplifier is connected with the analog-to-digital conversion module through the sample-hold module, the output end of the analog-to-digital conversion module is connected with the second processor through the high-speed memory device, and the second processor is connected with the display interface.
In the application scene of multi-point measurement, each probe can have a built-in chip that sends a signal in the probe structure, and image acquisition module need one probe have can, the location of probe each other can cooperate through the built-in orientation module of probe, can carry out the multiple spot selection in the system simultaneously, multi-point measurement, the location of height can align or just finely tune with the probe that has the image acquisition module equally, implements the decline of certain degree height and rises.
In addition, the embodiment of the invention also provides a semi-automatic measurement method for the signals of the server mainboard, which comprises the following steps:
step 1: placing the main board on the surface of a matrix point positioning light plate, and preliminarily drawing and forming matrix points by the matrix point positioning light plate through self-luminous light transmittance;
and 2, step: the image acquisition module at the side of the probe performs primary imaging on the front surface of the mainboard and transmits the image to the first processor, and the first processor performs matrix point imaging on the image of the surface of the mainboard on the image and the formed matrix points;
and step 3: displaying the imaging result through a display interface;
and 4, step 4: the user selects the setting of various electrical parameters of the probe through the display interface, selects the matrix point of the target measurement point, sets the preset height from the surface of the plate, and transmits the relevant data set by the user through the display interface to the probe control module through the first processor;
and 5: the probe is controlled to move right above the measuring point through the probe control module, and the height difference between the probe and the main plate is positioned through an infrared module in an image acquisition module at the side of the probe module, so that the probe is controlled to descend to set the preset height away from the surface of the plate;
and 6: adjusting the height of the probe by rotating the manual rotating knob to correct the distance between the probe and the measuring point;
and 7: after the manual correction is finished, the probe is already arranged on the surface of the measuring point, and the measurement imaging of the signal is controlled;
and 8: and after the measurement is finished, storing the image, and controlling to increase the probe to the initial position.
The method is based on a device for realizing semi-automatic measurement of a server mainboard signal, and comprises a matrix point positioning light plate, an image identification module, a probe control module, a probe module, a measurement processing module and a display interface; the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base; the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the movement of the probe in the X-axis direction, the Y-axis direction and the Z-axis direction is controlled by the probe control module; the image identification module is used for carrying out primary imaging on the mainboard which is arranged in front of the matrix point positioning light plate and faces the probe, and carrying out matrix point imaging on the surface image of the mainboard by combining matrix points formed by the matrix point positioning light plate and outputting the matrix point imaging to a display interface for displaying; a user selects a matrix point of a target measurement point through a display interface and inputs the matrix point into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism; the probe module is connected with the measurement processing module; the device is used for processing and outputting the information measured by the probe to a display interface. The probe module in the embodiment can be a manipulator and a probe carried by the manipulator for moving and positioning the probe. Matrix point positioning light plate: when the light panel is electrified and self-luminous, the sheltering object of the light panel can be subjected to object plane matrix point imaging to a certain degree through the penetrability of the upper light source; an image acquisition module: the camera module has certain imaging capability, and meanwhile, an infrared module is arranged in the camera module, so that the height difference can be monitored through infrared reflection, and the camera module is fixed on the side of the probe module; a probe module; the traditional probe module of front end is connected with the rear end through the manipulator, embeds the chip of sending a letter, has certain locate function.
In addition, it should be noted that, before the step of placing the main board on the surface of the matrix point positioning light plate, the matrix point positioning light plate performs preliminary drawing and forming of matrix points through self-luminous light transmittance, the method includes: the probe is suspended above the matrix point positioning light plate, and the matrix point position correction and position positioning are carried out on the probe point through a transmitting chip arranged in the probe.
In some embodiments, the probe module can be implemented by using the mechanical structure of the probe module provided in the above device embodiments, and the specific steps include:
the controller controls the first motor to enable the probe to move back and forth above the main board to reach the top of the test point along the Y-axis direction, at the moment, a built-in transmitting chip in the probe is used for positioning the test point, the controller controls the first electric telescopic rod to move to enable the probe to reach a preset height distance from the main board, the height distance is collected through an infrared module in the image collecting module, the controller controls the third motor to move to enable the probe to be aligned with the measurement point, the manual rotating button is manually rotated to downwardly adjust the probe to the surface of the main board measurement point, and the probe is used for measuring and imaging. Controllable semi-automatic mainboard signal measurement's scheme has just been realized, has promoted signal measurement's efficiency simultaneously also to a certain extent reduces the error of test signal moreover.
Although the present invention has been described in detail in connection with the preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Various equivalent modifications or substitutions can be made on the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and these modifications or substitutions are within the scope of the present invention/any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A device for realizing semi-automatic measurement of signals of a server mainboard is characterized by comprising a matrix point positioning light plate, an image identification module, a probe control module, a probe module, a measurement processing module and a display interface;
the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base;
the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the movement of the probe in the X-axis direction, the Y-axis direction and the Z-axis direction is controlled through the probe control module;
the image identification module is used for carrying out primary imaging on the mainboard which is arranged in front of the matrix point positioning light plate and faces the probe, and carrying out matrix point imaging on the surface image of the mainboard by combining matrix points formed by the matrix point positioning light plate and outputting the matrix point imaging to a display interface for displaying;
a user selects a matrix point of a target measurement point through a display interface and inputs the matrix point into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism;
the probe module is connected with the measurement processing module; the system is used for processing and outputting the information measured by the probe to a display interface.
2. The device for realizing the semi-automatic measurement of the signals of the server mainboard according to claim 1, wherein the image recognition module comprises an image acquisition module, an image recognition module and a first processor;
the image acquisition module is connected with the first processor through the image identification module;
the image acquisition module is used for carrying out primary image acquisition on a main board arranged in front of the matrix point positioning light panel and inputting acquired image information into the first processor through the image identification module;
and the first processor is used for carrying out matrix point imaging on the surface of the main board on the image acquired by the image acquisition module and the matrix point formed by the matrix point positioning light plate.
3. The device for realizing the semi-automatic measurement of the signals of the server main board according to the claim 2, wherein the image acquisition module is fixed at the side of the probe module;
the image acquisition module is internally provided with an infrared module, and the height difference between the probe and the surface of the mainboard is monitored through the infrared reflection of the infrared module; transmitting the monitoring information to the control module through the first processor;
the control module is used for controlling the Z-axis moving mechanism to move according to the received height difference so as to drive the probe to reach a set distance from the surface of the main board;
the image recognition module is connected with the first processor through the cache module.
4. The device for realizing the semi-automatic measurement of the signals of the server mainboard according to claim 3, wherein two parallel grooves are formed on the base; a Y-axis moving mechanism is arranged in each groove;
the main board is arranged between the two grooves on the base;
the Y-axis moving mechanism comprises a first motor, a first screw rod, a first sliding block and a first support;
the first screw rod is arranged in the groove, the first motor is arranged on the side surface of the base, and an output shaft of the first motor penetrates through the side surface of the base and is connected with the first screw rod in the groove; the end part of one end of the first screw rod, which is far away from the first motor, is connected with the first support through a bearing; the first screw rod penetrates through a threaded hole in the side face of the first sliding block to be connected with the first sliding block, and a Z-axis moving mechanism is arranged on the upper surface of each first sliding block.
5. The device for realizing the semi-automatic measurement of the signals of the server main board according to claim 4, wherein the Z-axis moving mechanism comprises a first electric telescopic rod; the fixed end of the first electric telescopic rod is fixed on the upper surface of the first sliding block, and the moving end of the first electric telescopic rod is connected with the Z-axis fine adjustment mechanism; and one ends of the two Z-axis fine adjustment mechanisms, which are far away from the first electric telescopic rod, are connected through a top end connecting plate.
6. The device for realizing the semi-automatic measurement of the signals of the server mainboard according to claim 5, wherein the Z-axis fine adjustment mechanism comprises a supporting plate, a second screw rod, a second sliding block and a manual rotation knob;
one end of the supporting plate is connected with the moving end of the first electric telescopic rod, and the other end of the supporting plate is connected with the top end connecting plate; threaded holes are respectively formed in the two ends of the top end connecting plate;
a groove is formed in the supporting plate, one end of the second screw rod is connected with the inner wall of the groove of the supporting plate through a bearing, and the other end of the second screw rod penetrates through a threaded hole in the top end connecting plate to be connected with the manual rotating knob;
the second screw rod penetrates through a threaded hole in the side face of the second sliding block to be connected with the second sliding block, and the upper surface of the second sliding block is connected with the X-axis moving mechanism.
7. The device for realizing the semi-automatic measurement of the signals of the server mainboard according to claim 6, wherein the X-axis moving mechanism comprises a third motor, a transverse connecting plate, a third screw rod, a third slide block and a second support;
the two Z-axis fine adjustment mechanisms are respectively a first Z-axis fine adjustment mechanism and a second Z-axis fine adjustment mechanism; the second support is fixed on the side surface of the second Z-axis fine adjustment mechanism;
one end of the transverse connecting plate is connected to the upper surface of the second sliding block of the first Z-axis fine adjustment mechanism, and the other end of the transverse connecting plate is connected to the upper surface of the second sliding block of the second Z-axis fine adjustment mechanism;
the third motor is fixed at one end of the transverse connecting plate connected with the first Z-axis fine adjustment mechanism, an output shaft of the third motor is connected with one end of a third screw rod, and the other end of the third screw rod is connected with the second support through a bearing;
the third screw rod penetrates through a threaded hole in the side face of the third sliding block to be connected with the third sliding block, and the lower surface of the third sliding block is connected with the probe;
the first motor, the first electric telescopic rod and the third motor are respectively connected with the probe control module.
8. The device according to claim 7, wherein the measurement processing module comprises an amplifier, an input terminal of the amplifier is connected to the probe, an output terminal of the amplifier is connected to the analog-to-digital conversion module through the sample-and-hold module, an output terminal of the analog-to-digital conversion module is connected to the second processor through the high-speed memory device, and the second processor is connected to the display interface.
9. A semi-automatic measurement method for a server mainboard signal is characterized by comprising the following steps:
placing the main board on the surface of a matrix point positioning light plate, and preliminarily drawing and forming matrix points by the matrix point positioning light plate through self-luminous light transmittance;
the image acquisition module at the side of the probe performs primary imaging on the front surface of the main board and transmits the image to the first processor, and the first processor performs matrix point imaging on the image on the surface of the main board on the image and the formed matrix points;
displaying the imaging result through a display interface;
the user selects the setting of various electrical parameters of the probe through the display interface, selects the matrix point of the target measurement point, sets the preset height from the surface of the plate, and transmits the relevant data set by the user through the display interface to the probe control module through the first processor;
the probe is controlled to move to a position right above the measuring point through the probe control module, and the height difference between the probe and the main plate is positioned through an infrared module in an image acquisition module at the side of the probe module, so that the probe is controlled to descend to set the preset height away from the surface of the plate;
adjusting the height of the probe by rotating the manual rotating knob to correct the distance between the probe and the measuring point;
after the manual correction is finished, the probe is already arranged on the surface of the measuring point, and the measurement imaging of the signal is controlled;
and after the measurement is finished, storing the image, and controlling to increase the probe to the initial position.
10. The method for semi-automatically measuring the signal of the server motherboard according to claim 9, wherein the step of placing the motherboard on the surface of a matrix point positioning light plate, the step of preliminarily drawing and shaping the matrix points by the self-luminous light transmittance of the matrix point positioning light plate comprises:
the probe is suspended above the matrix point positioning light plate, and the matrix point position correction and position positioning are carried out on the probe point through a transmitting chip arranged in the probe.
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| CN109143042A (en) * | 2018-10-31 | 2019-01-04 | 重庆矢崎仪表有限公司 | FCT detection device and detection method based on optics and machine vision |
| CN110837036A (en) * | 2019-11-07 | 2020-02-25 | 东南大学 | Circuit board fault automatic detection system |
| CN214310782U (en) * | 2021-01-25 | 2021-09-28 | 苏州伊欧陆系统集成有限公司 | PCB double-sided test probe station |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102854251A (en) * | 2012-08-29 | 2013-01-02 | 北京工业大学 | Supersonic imaging system utilizing virtual instrument technology, and imaging method thereof. |
| CN109143042A (en) * | 2018-10-31 | 2019-01-04 | 重庆矢崎仪表有限公司 | FCT detection device and detection method based on optics and machine vision |
| CN110837036A (en) * | 2019-11-07 | 2020-02-25 | 东南大学 | Circuit board fault automatic detection system |
| CN214310782U (en) * | 2021-01-25 | 2021-09-28 | 苏州伊欧陆系统集成有限公司 | PCB double-sided test probe station |
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