CN114994506B - Device and method for realizing semi-automatic measurement of server main board signals - Google Patents
Device and method for realizing semi-automatic measurement of server main board signals Download PDFInfo
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
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Abstract
The invention belongs to the technical field of server signal measurement, and particularly provides a device and a method for realizing semi-automatic measurement of a server main board signal, wherein the device comprises a matrix point positioning light plate, an image recognition module, a probe control module, a probe module, a measurement processing module and a display interface; the image recognition module is used for carrying out preliminary imaging on a main board arranged in front of the matrix point positioning light plate and carrying out matrix point imaging of a main board surface image by combining matrix points formed by the matrix point positioning light plate, and outputting the matrix point imaging to the display interface for display; the user selects matrix points of the target measurement points through the display interface and inputs the matrix points into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism; and the measurement processing module processes the information measured by the probe and outputs the processed information to the display interface. And efficiency and accuracy are improved in the measurement of the main board signals.
Description
Technical Field
The invention relates to the technical field of server signal measurement, in particular to a device and a method for realizing semi-automatic measurement of signals of a server main board.
Background
Servers are core devices that provide computing services and are also an important component of the computer hardware field. From the market scale, with the rapid development of cloud computing, big data and other services, the demand for servers is also rapidly growing.
When the server main board is designed, the whole signals of the main board are simulated, and when the simulation result meets the requirement, the scheme is determined to carry out actual production. However, the quality of the actual circuit signal is often affected by factors such as actual resistance-capacitance errors of the devices, loss errors of the PCB, crosstalk errors among the devices, and the like. Therefore, for an actual main board, actual spot measurement is still required to be carried out on key signals of the main board after board returning, and quality is judged. Meanwhile, when the main board has BUG suspected to be generated due to signal quality problem, actual measurement is required to be carried out on the main board signal so as to provide reference for the DEBUG;
the signal or time sequence measurement of the main board is still carried out by the traditional method of oscilloscope and probe point measurement. For many signal points inconvenient to measure, such as the back surface of a main board, the edge of a connector and a device dense area, flying wires and other operations are often needed to be carried out for measurement; when the multi-point actual signals are required to be measured simultaneously, a plurality of people are required to measure different measuring points respectively, or a large number of flying lines and the like are required to be performed; on the one hand, errors are introduced, meanwhile, the measurement efficiency is reduced, meanwhile, the measurement stability is not guaranteed, on the other hand, a lengthened signal path after flying leads has an influence on the signal quality of an actual signal point, and the signal path has only reference value, and is not an accurate reflection of the signal point quality.
Disclosure of Invention
Aiming at the situation that when a plurality of actual signals are needed to be measured simultaneously, a plurality of persons are needed to measure different measuring points respectively, or a large number of flying lines and the like are carried out; on the one hand, errors are introduced, meanwhile, the measurement efficiency is reduced, and meanwhile, the measurement stability is not guaranteed.
The technical scheme of the invention is as follows:
in a first aspect, the present invention provides a device for implementing semi-automatic measurement of a server motherboard signal, including a matrix point positioning light board, an image recognition module, a probe control module, a probe module, a measurement processing module and a display interface;
the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base;
the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the probe is controlled to move in the X-axis, Y-axis and Z-axis directions through the probe control module;
the image recognition module is used for carrying out preliminary imaging on a main board arranged in front of the matrix point positioning light plate and carrying out matrix point imaging of a main board surface image by combining matrix points formed by the matrix point positioning light plate, and outputting the matrix point imaging to the display interface for display;
the user selects matrix points of the target measurement points through the display interface and inputs the matrix points into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism;
the probe module is connected with the measurement processing module; and the device is used for processing and outputting the information measured by the probe to a display interface.
Before measuring the main board signal, the probe is suspended above the matrix point positioning light plate, and the probe point is corrected and positioned by the transmission chip built in the probe. Placing the main board on the surface of a matrix point positioning light board, and primarily drawing and forming matrix points by the matrix point positioning light board through self-luminous light transmittance; the image recognition module at the side of the probe performs preliminary imaging on the front surface of the main board, and performs matrix point imaging on the image and the formed matrix points on the surface image of the main board; displaying the imaging result through a display interface; the user selects the setting of various electrical parameters of the probe through the display interface, selects matrix points of target measurement points, and sets the preset height of the off-board surface, wherein the previous imaging result is displayed through the display interface, the user can select the setting of various electrical parameters of the probe at the moment through the system, and selects the matrix points of the target measurement points, and sets the preset height of the off-board surface, so as to ensure the distance with point allowance between the off-board surface and the measurement points; the user transmits the related data set by the display interface to the probe control module; the probe is controlled to move to the position right above the measuring point by the probe control module, and the height difference between the probe and the main board is positioned by the infrared module in the probe module side image acquisition module, so that the probe is controlled to descend and set the preset height from the surface of the board; the height of the probe is adjusted through the Z-axis fine adjustment mechanism to correct the distance between the probe and the measuring point; after the fine adjustment correction is finished, the probe is arranged on the surface of the measuring point, and the signal measurement imaging is controlled; and (5) after the measurement is finished, storing the image, and controlling the probe to be lifted to an initial position.
Preferably, the image recognition module comprises an image acquisition module, an image recognition module and a first processor;
the image acquisition module is connected with the first processor through the image identification module;
the image acquisition module is used for carrying out preliminary image acquisition on the main board arranged in front of the matrix point positioning light plate and inputting acquired image information into the first processor through the image recognition module;
and the first processor is used for imaging the matrix points on the surface of the main board by the image acquired by the image acquisition module and the matrix points formed by the matrix point positioning light plate.
Preferably, the image acquisition module is fixed at the side of the probe module;
the image acquisition module is internally provided with an infrared module, and the monitoring of the height difference of the probe from the surface of the main board is realized through the infrared reflection of the infrared module; transmitting the monitoring information to the control module through the first processor;
the control module is used for controlling the Z-axis moving mechanism to move according to the received height difference so as to drive the probe to reach a set distance from the surface of the main board;
the image recognition module is connected with the first processor through the cache module.
Preferably, the base is provided with two parallel grooves; a Y-axis moving mechanism is arranged in each groove;
the main board is arranged between the two grooves on the base;
the Y-axis moving mechanism comprises a first motor, a first screw rod, a first sliding block and a first support;
the first screw rod is arranged in the groove, the first motor is arranged on the side surface of the base, and an output shaft of the first motor penetrates through the side surface of the base to be connected with the first screw rod in the groove; the end part of one end of the first screw rod, which is far away from the first motor, is connected with a first support through a bearing; the first screw rod passes through a threaded hole on the side surface of the first sliding block and is connected with the first sliding block, and a Z-axis moving mechanism is arranged on the upper surface of each first sliding block.
After the height distance between the probe and the main board reaches a certain height, the probe is moved to the upper part of the measuring point by controlling the Y-axis moving mechanism to move, the probe is adjusted to the position right above the measuring point by controlling the X-axis moving mechanism, and the probe is adjusted to the surface of the main board by the Z-axis fine adjusting mechanism to perform measurement imaging.
Preferably, the Z-axis moving mechanism includes a first electric telescopic rod; the fixed end of the first electric telescopic rod is fixed on the upper surface of the first sliding block, and the moving end of the first electric telescopic rod is connected with the Z-axis fine adjustment mechanism; one ends of the two Z-axis fine tuning mechanisms, which are far away from the first electric telescopic rod, are connected through a top connecting plate.
Preferably, the Z-axis fine adjustment mechanism comprises a support plate, a second screw rod, a second sliding block and a manual rotation knob;
one end of the supporting plate is connected with the moving end of the first electric telescopic rod, and the other end of the supporting plate is connected with the top connecting plate; screw holes are respectively formed at two ends of the top connecting plate;
a groove is formed in the supporting plate, one end of the second screw rod is connected with the inner wall of the groove of the supporting plate through a bearing, and the other end of the second screw rod penetrates through a threaded hole in the top connecting plate to be connected with the manual rotation knob;
the second screw rod passes through a threaded hole on the side surface of the second sliding block and is connected with the second sliding block, and the upper surface of the second sliding block is connected with the X-axis moving mechanism.
Preferably, the X-axis moving mechanism comprises a third motor, a transverse connecting plate, a third screw rod, a third sliding block and a second support;
the two Z-axis fine tuning mechanisms are a first Z-axis fine tuning mechanism and a second Z-axis fine tuning mechanism respectively; the second support is fixed on the side surface of the second Z-axis fine adjustment mechanism;
one end of the transverse connecting plate is connected to the upper surface of the second sliding block of the first Z-axis fine adjustment mechanism, and the other end of the transverse connecting plate is connected to the upper surface of the second sliding block of the second Z-axis fine adjustment mechanism;
the third motor is fixed at one end of the transverse connecting plate, which is connected with the first Z-axis fine adjustment mechanism, an output shaft of the third motor is connected with one end of a third screw rod, and the other end of the third screw rod is connected with the second support through a bearing;
the third screw rod passes through a threaded hole on the side surface of the third sliding block and is connected with the third sliding block, and the lower surface of the third sliding block is connected with the probe;
the first motor, the first electric telescopic rod and the third motor are respectively connected with the probe control module.
Preferably, the measurement processing module comprises an amplifier, the input end of the amplifier is connected with the probe, the output end of the amplifier is connected with the analog-to-digital conversion module through the sample and hold module, the output end of the analog-to-digital conversion module is connected with the second processor through the high-speed storage device, and the second processor is connected with the display interface.
In a second aspect, the present invention further provides a method for semi-automatically measuring signals of a server motherboard, including the following steps:
placing the main board on the surface of a matrix point positioning light board, and primarily drawing and forming matrix points by the matrix point positioning light board through self-luminous light transmittance;
the image acquisition module at the side of the probe performs preliminary imaging on the front surface of the main board and transmits the preliminary imaging to the first processor, and the first processor performs matrix point imaging on the image and the formed matrix points on the surface image of the main board;
displaying the imaging result through a display interface;
the user selects the setting of various electrical parameters of the probe through the display interface, selects matrix points of target measurement points, sets the preset height of the off-board surface, and transmits related data set by the user through the display interface to the probe control module through the first processor;
the probe is controlled to move to the position right above the measuring point by the probe control module, and the height difference between the probe and the main board is positioned by the infrared module in the probe module side image acquisition module, so that the probe is controlled to descend and set the preset height from the surface of the board;
the height of the probe is adjusted by rotating the manual rotation knob to correct the distance between the probe and the measuring point;
after the manual correction is finished, the probe is arranged on the surface of the measuring point, and the signal measurement imaging is controlled;
and (5) after the measurement is finished, storing the image, and controlling the probe to be lifted to an initial position.
Preferably, the step of placing the main board on the surface of the matrix point positioning light board, and the matrix point positioning light board performs preliminary drawing and shaping of matrix points through self-luminous light transmittance comprises:
the probe is suspended above the matrix point positioning optical plate, and the position of the matrix point is corrected and positioned through a transmitting chip arranged in the probe.
From the above technical scheme, the invention has the following advantages: the user selects matrix points of the target measurement points through the display interface and inputs the matrix points into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, the probe is arranged on the surface of the measuring point through the Z-axis fine adjustment mechanism, and efficiency and accuracy are improved in main board signal measurement.
In addition, the invention has reliable design principle, simple structure and very wide application prospect.
It can be seen that the present invention has outstanding substantial features and significant advances over the prior art, as well as its practical advantages.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic block diagram of an apparatus of one embodiment of the invention.
Fig. 2 is a schematic block diagram of an apparatus of another embodiment of the present invention.
Fig. 3 is a schematic diagram of a probe module according to an embodiment of the invention.
FIG. 4 is a schematic view of a Y-axis movement mechanism in a probe module according to an embodiment of the invention.
Detailed Description
The signal or time sequence measurement of the main board is still carried out by the traditional method of oscilloscope and probe point measurement. For many signal points inconvenient to measure, such as the back surface of a main board, the edge of a connector and a device dense area, flying wires and other operations are often needed to be carried out for measurement; when the multi-point actual signals are required to be measured simultaneously, a plurality of people are required to measure different measuring points respectively, or a large number of flying lines and the like are required to be performed; on the one hand, errors are introduced, meanwhile, the measurement efficiency is reduced, meanwhile, the measurement stability is not guaranteed, on the other hand, a lengthened signal path after flying leads has an influence on the signal quality of an actual signal point, and the signal path has only reference value, and is not an accurate reflection of the signal point quality. In the traditional probe and oscilloscope measuring device, an image recognition link and a semiautomatic control link are newly added, so that a traditional signal measuring mode is optimized; the core of the image recognition link is matrix point acquisition, imaging is carried out on a main board facing the probe, then preliminary image acquisition processing is carried out, and high-density matrix point division is carried out on the image for positioning and reference of the subsequent specific probe test points. The principle of the semi-automatic control link is based on imaging of matrix points, and horizontal plane positioning is carried out; the control of the height of the vertical plane probe considers that the welding spots of the test points of the main board are different in height and the surface shape is different, so that the high precision and the flexibility of the equipment are not easy to coexist; the fine adjustment of the Z-axis direction is manually performed, namely, the Z-axis direction can be actually controlled by an operator vertically, and the controllability and the economical efficiency in the cost are greatly improved. In order to make the technical solution of the present invention better understood by those skilled in the art, the technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a device for implementing semi-automatic measurement of signals of a server motherboard, including a matrix point positioning light board, an image recognition module, a probe control module, a probe module, a measurement processing module and a display interface;
the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base;
the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the probe is controlled to move in the X-axis, Y-axis and Z-axis directions through the probe control module;
the image recognition module is used for carrying out preliminary imaging on a main board arranged in front of the matrix point positioning light plate and carrying out matrix point imaging of a main board surface image by combining matrix points formed by the matrix point positioning light plate, and outputting the matrix point imaging to the display interface for display;
the user selects matrix points of the target measurement points through the display interface and inputs the matrix points into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism;
the probe module is connected with the measurement processing module; and the device is used for processing and outputting the information measured by the probe to a display interface.
In the present application, the probe is corrected for the position of the matrix point and the position is located by the transmitting chip incorporated in the probe. The matrix point positioning light plate is an electrified self-luminous light plate, and object plane matrix point imaging can be carried out on a shielding object of the light plate to a certain degree through the trafficability of an upper light source.
Before measuring the main board signal, the probe is suspended above the matrix point positioning light plate, and the probe point is corrected and positioned by the transmission chip built in the probe. Placing the main board on the surface of a matrix point positioning light board, and primarily drawing and forming matrix points by the matrix point positioning light board through self-luminous light transmittance; the image recognition module at the side of the probe performs preliminary imaging on the front surface of the main board, and performs matrix point imaging on the image and the formed matrix points on the surface image of the main board; displaying the imaging result through a display interface; the user selects the setting of various electrical parameters of the probe through the display interface, selects matrix points of target measurement points, and sets the preset height of the off-board surface, wherein the previous imaging result is displayed through the display interface, the user can select the setting of various electrical parameters of the probe at the moment through the system, and selects the matrix points of the target measurement points, and sets the preset height of the off-board surface, so as to ensure the distance with point allowance between the off-board surface and the measurement points; the user transmits the related data set by the display interface to the probe control module; the probe is controlled to move to the position right above the measuring point by the probe control module, and the height difference between the probe and the main board is positioned by the infrared module in the probe module side image acquisition module, so that the probe is controlled to descend and set the preset height from the surface of the board; the height of the probe is adjusted through the Z-axis fine adjustment mechanism to correct the distance between the probe and the measuring point; after the fine adjustment correction is finished, the probe is arranged on the surface of the measuring point, and the signal measurement imaging is controlled; and (5) after the measurement is finished, storing the image, and controlling the probe to be lifted to an initial position.
In some embodiments, the image recognition module includes an image acquisition module, an image recognition module, and a first processor;
the image acquisition module is connected with the first processor through the image identification module;
the image acquisition module is used for carrying out preliminary image acquisition on the main board arranged in front of the matrix point positioning light plate and inputting acquired image information into the first processor through the image recognition module;
and the first processor is used for imaging the matrix points on the surface of the main board by the image acquired by the image acquisition module and the matrix points formed by the matrix point positioning light plate.
It should be noted here that, the image acquisition module has the camera module of certain imaging capability, and the infrared module of module embeds simultaneously, and the monitoring of difference in height is realized to the reflection of accessible infrared, is fixed in the side of probe module. The image acquisition module is internally provided with an infrared module, and the monitoring of the height difference of the probe from the surface of the main board is realized through the infrared reflection of the infrared module; transmitting the monitoring information to the control module through the first processor;
the control module is used for controlling the Z-axis moving mechanism to move according to the received height difference so as to drive the probe to reach a set distance from the surface of the main board;
the image recognition module is connected with the first processor through the cache module.
In some embodiments, as shown in fig. 3 and 4, two parallel grooves are provided on the base; a Y-axis moving mechanism is arranged in each groove;
the main board is arranged between the two grooves on the base;
the Y-axis moving mechanism comprises a first motor 101, a first screw rod 102, a first sliding block 103 and a first support 104;
the first screw rod 102 is arranged in the groove, the first motor 101 is arranged on the side surface of the base 100, and an output shaft of the first motor 101 penetrates through the side surface of the base 100 to be connected with the first screw rod 102 in the groove; the end part of one end, far away from the first motor 101, of the first screw rod 102 is connected with a first support 104 through a bearing; the first screw rod 102 passes through a threaded hole on the side surface of the first slider 103 and is connected with the first slider 103, and a Z-axis moving mechanism is arranged on the upper surface of each first slider 103. It should be noted that, the two first screws 102 rotate simultaneously and the moving distances of the first sliders driven by each rotation are equal, so that parallelism is guaranteed not to incline.
In some embodiments, the Z-axis movement mechanism includes a first motorized telescopic bar 200; the fixed end of the first electric telescopic rod 200 is fixed on the upper surface of the first sliding block 103, and the moving end of the first electric telescopic rod 200 is connected with the Z-axis fine adjustment mechanism; one end of the two Z-axis fine tuning mechanisms, which is far away from the first electric telescopic rod 200, is connected through a top end connecting plate 400. Here, each movement of the two first electric telescopic links is also simultaneous and the distance of movement is also the same.
Specifically, the Z-axis fine adjustment mechanism includes a support plate 300, a second screw rod 302, a second slider 303, and a manual rotation knob 301;
one end of the supporting plate 300 is connected with the moving end of the first electric telescopic rod 200, and the other end of the supporting plate 300 is connected with the top connecting plate 400; threaded holes are respectively formed at two ends of the top connecting plate 400;
the support plate 300 is provided with a groove, one end of the second screw rod 302 is connected with the inner wall of the groove of the support plate 300 through a bearing, and the other end of the second screw rod 302 passes through a threaded hole on the top end connecting plate 400 to be connected with the manual rotation knob 301;
the second screw rod 302 passes through a threaded hole on the side surface of the second slider 303 to be connected with the second slider 303, and the upper surface of the second slider 303 is connected with the X-axis moving mechanism. Every time the knob 301 is manually turned to perform fine adjustment of the height, the fine adjustment on both sides is ensured to be the same, and the transverse connection plate is kept parallel to the main board.
Performing horizontal plane positioning based on imaging of matrix points; the control of the vertical plane probe height module can calculate the distance by calculating the time difference between the transmitted and received reflected signals, a preset height distance is required to be set, and the preset height is adjusted by the upward and downward movement of the Z-axis moving mechanism, but the welding spots of the test points of the main board are considered to be different in height, and the surface shape is not fixed, so that the high precision and the flexibility of the equipment are not easy to coexist; after reaching the preset height distance, the manual rotation button is manually rotated to correspondingly adjust the height through the Z-axis fine adjustment mechanism, namely, the height can be actually controlled by an operator vertically, so that the controllability and the economical efficiency in the cost are greatly improved, and the device is more practical.
In some embodiments, the X-axis movement mechanism includes a third motor 501, a transverse connection plate 500, a third lead screw 502, a third slider 503, and a second mount 504;
the two Z-axis fine tuning mechanisms are a first Z-axis fine tuning mechanism and a second Z-axis fine tuning mechanism respectively; the second support 504 is fixed on the side of the second Z-axis fine adjustment mechanism;
one end of the transverse connection plate 500 is connected to the upper surface of the second slider 303 of the first Z-axis fine adjustment mechanism, and the other end of the transverse connection plate 500 is connected to the upper surface of the second slider 303 of the second Z-axis fine adjustment mechanism;
the third motor 501 is fixed at one end of the transverse connection plate 500 connected with the first Z-axis fine adjustment mechanism, an output shaft of the third motor 501 is connected with one end of a third screw rod 502, and the other end of the third screw rod 502 is connected with a second support 504 through a bearing;
the third screw rod 502 passes through a threaded hole on the side surface of the third slider 503 to be connected with the third slider 503, and the lower surface of the third slider 503 is connected with the probe 600;
the first motor 101, the first electric telescopic rod 200 and the third motor 501 are respectively connected with the probe control module.
As shown in fig. 2, it should be noted that the probe control module includes a controller; the measuring and processing module comprises an amplifier, wherein the input end of the amplifier is connected with the probe, the output end of the amplifier is connected with the analog-to-digital conversion module through the sample and hold module, the output end of the analog-to-digital conversion module is connected with the second processor through the high-speed storage device, and the second processor is connected with the display interface.
In the application scene of multipoint measurement, each probe is provided with a built-in signaling chip in the probe structure, the image acquisition module is needed to be provided with one probe, the probes can be mutually positioned and coordinated through the positioning module arranged in the probe, multipoint selection can be performed in the system, the multipoint measurement can be performed, the positioning of the height can be aligned or fine-tuned with the probe with the image acquisition module, and the lowering and rising of the height are implemented to a certain extent.
In addition, the embodiment of the invention also provides a semi-automatic measurement method for the signals of the server main board, which comprises the following steps:
step 1: placing the main board on the surface of a matrix point positioning light board, and primarily drawing and forming matrix points by the matrix point positioning light board through self-luminous light transmittance;
step 2: the image acquisition module at the side of the probe performs preliminary imaging on the front surface of the main board and transmits the preliminary imaging to the first processor, and the first processor performs matrix point imaging on the image and the formed matrix points on the surface image of the main board;
step 3: displaying the imaging result through a display interface;
step 4: the user selects the setting of various electrical parameters of the probe through the display interface, selects matrix points of target measurement points, sets the preset height of the off-board surface, and transmits related data set by the user through the display interface to the probe control module through the first processor;
step 5: the probe is controlled to move to the position right above the measuring point by the probe control module, and the height difference between the probe and the main board is positioned by the infrared module in the image acquisition module at the side of the probe module, so that the probe is controlled to descend and set the preset height from the surface of the board;
step 6: the height of the probe is adjusted by rotating the manual rotation knob to correct the distance between the probe and the measuring point;
step 7: after the manual correction is finished, the probe is arranged on the surface of the measuring point, and the signal measurement imaging is controlled;
step 8: and (5) after the measurement is finished, storing the image, and controlling the probe to be lifted to an initial position.
It should be noted that the method is based on a device for realizing semi-automatic measurement of signals of a server main board, and comprises a matrix point positioning light plate, an image recognition module, a probe control module, a probe module, a measurement processing module and a display interface; the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base; the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the probe is controlled to move in the X-axis, Y-axis and Z-axis directions through the probe control module; the image recognition module is used for carrying out preliminary imaging on a main board arranged in front of the matrix point positioning light plate and carrying out matrix point imaging of a main board surface image by combining matrix points formed by the matrix point positioning light plate, and outputting the matrix point imaging to the display interface for display; the user selects matrix points of the target measurement points through the display interface and inputs the matrix points into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism; the probe module is connected with the measurement processing module; and the device is used for processing and outputting the information measured by the probe to a display interface. In this embodiment, the probe module may be a manipulator and a carried probe for moving and positioning the probe. Matrix point positioning light plate: the electrified self-luminous light plate can image the shielding object of the light plate to a certain degree through the trafficability of the upper light source; and an image acquisition module: the camera module with certain imaging capability is provided with an infrared module, and the infrared module is arranged in the camera module, so that the monitoring of the height difference can be realized through the reflection of infrared rays and the camera module is fixed at the side of the probe module; a probe module; the traditional probe module at the front end is connected with the rear end through a manipulator, and a built-in transmitting chip has a certain positioning function.
In addition, it should be noted that, the steps of placing the motherboard on the surface of the matrix point positioning light board, and performing preliminary drawing and molding of matrix points by the matrix point positioning light board through self-luminous light transmittance include: the probe is suspended above the matrix point positioning optical plate, and the position of the matrix point is corrected and positioned through a transmitting chip arranged in the probe.
In some embodiments, the probe module may be implemented by using the mechanical structure of the probe module provided in the above device embodiments, and the specific steps include:
the controller controls the first motor to enable the probe to move back and forth along the Y-axis direction above the main board to reach the position above the test point, at the moment, the built-in signaling chip in the probe is used for positioning the test point, the controller controls the first electric telescopic rod to move to enable the probe to reach a preset height distance from the main board, the collection of the height distance is carried out through the infrared module in the image collection module, the controller controls the third motor to move to enable the probe to be aligned with the measurement point, the manual rotation button is manually rotated, the probe is downwards adjusted to the surface of the measurement point of the main board, and the probe is used for measurement imaging. The scheme of controllable semi-automatic main board signal measurement is realized, the efficiency of signal measurement is improved, and meanwhile, the error of a test signal is reduced to a certain extent.
Although the present invention has been described in detail by way of preferred embodiments with reference to the accompanying drawings, the present invention is not limited thereto. Various equivalent modifications and substitutions may be made in the embodiments of the present invention by those skilled in the art without departing from the spirit and scope of the present invention, and it is intended that all such modifications and substitutions be within the scope of the present invention/be within the scope of the present invention as defined by the appended claims. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. The device for realizing the semi-automatic measurement of the server main board signals is characterized by comprising a matrix point positioning light plate, an image recognition module, a probe control module, a probe module, a measurement processing module and a display interface;
the probe module comprises a base, a Y-axis moving mechanism is arranged on the base, a Z-axis moving mechanism is connected to the Y-axis moving mechanism, and the Z-axis moving mechanism is connected with an X-axis moving mechanism through a Z-axis fine adjustment mechanism; the X-axis moving mechanism is fixedly connected with a probe; the matrix point positioning light plate is arranged on the base;
the Y-axis moving mechanism, the Z-axis moving mechanism and the X-axis moving mechanism are respectively connected with the probe control module, and the probe is controlled to move in the X-axis, Y-axis and Z-axis directions through the probe control module;
the image recognition module is used for carrying out preliminary imaging on a main board arranged in front of the matrix point positioning light plate and carrying out matrix point imaging of a main board surface image by combining matrix points formed by the matrix point positioning light plate, and outputting the matrix point imaging to the display interface for display;
the user selects matrix points of the target measurement points through the display interface and inputs the matrix points into the probe control module; the probe control module controls the probe to move to a preset height right above the measuring point, and the probe is placed on the surface of the measuring point through the Z-axis fine adjustment mechanism;
the probe module is connected with the measurement processing module; the device is used for processing and outputting the information measured by the probe to a display interface;
two parallel grooves are arranged on the base; a Y-axis moving mechanism is arranged in each groove;
the main board is arranged between the two grooves on the base;
the Y-axis moving mechanism comprises a first motor, a first screw rod, a first sliding block and a first support;
the first screw rod is arranged in the groove, the first motor is arranged on the side surface of the base, and an output shaft of the first motor penetrates through the side surface of the base to be connected with the first screw rod in the groove; the end part of one end of the first screw rod, which is far away from the first motor, is connected with a first support through a bearing; the first screw rod passes through the threaded holes on the side surfaces of the first sliding blocks and is connected with the first sliding blocks, and a Z-axis moving mechanism is arranged on the upper surface of each first sliding block;
the Z-axis moving mechanism comprises a first electric telescopic rod; the fixed end of the first electric telescopic rod is fixed on the upper surface of the first sliding block, and the moving end of the first electric telescopic rod is connected with the Z-axis fine adjustment mechanism; one ends of the two Z-axis fine tuning mechanisms, which are far away from the first electric telescopic rod, are connected through a top connecting plate;
the Z-axis fine adjustment mechanism comprises a support plate, a second screw rod, a second sliding block and a manual rotation knob;
one end of the supporting plate is connected with the moving end of the first electric telescopic rod, and the other end of the supporting plate is connected with the top connecting plate; screw holes are respectively formed at two ends of the top connecting plate;
a groove is formed in the supporting plate, one end of the second screw rod is connected with the inner wall of the groove of the supporting plate through a bearing, and the other end of the second screw rod penetrates through a threaded hole in the top connecting plate to be connected with the manual rotation knob;
the second screw rod passes through a threaded hole on the side surface of the second sliding block and is connected with the second sliding block, and the upper surface of the second sliding block is connected with the X-axis moving mechanism.
2. The device for realizing semi-automatic measurement of server motherboard signals according to claim 1, wherein the image recognition module comprises an image acquisition module, an image recognition module and a first processor;
the image acquisition module is connected with the first processor through the image identification module;
the image acquisition module is used for carrying out preliminary image acquisition on the main board arranged in front of the matrix point positioning light plate and inputting acquired image information into the first processor through the image recognition module;
and the first processor is used for imaging the matrix points on the surface of the main board by the image acquired by the image acquisition module and the matrix points formed by the matrix point positioning light plate.
3. The device for realizing semi-automatic measurement of server motherboard signals according to claim 2, wherein the image acquisition module is fixed at the side of the probe module;
the image acquisition module is internally provided with an infrared module, and the monitoring of the height difference of the probe from the surface of the main board is realized through the infrared reflection of the infrared module; transmitting the monitoring information to the control module through the first processor;
the control module is used for controlling the Z-axis moving mechanism to move according to the received height difference so as to drive the probe to reach a set distance from the surface of the main board;
the image recognition module is connected with the first processor through the cache module.
4. The device for realizing semi-automatic measurement of server motherboard signals according to claim 3, wherein the X-axis moving mechanism comprises a third motor, a transverse connecting plate, a third screw rod, a third slider and a second support;
the two Z-axis fine tuning mechanisms are a first Z-axis fine tuning mechanism and a second Z-axis fine tuning mechanism respectively; the second support is fixed on the side surface of the second Z-axis fine adjustment mechanism;
one end of the transverse connecting plate is connected to the upper surface of the second sliding block of the first Z-axis fine adjustment mechanism, and the other end of the transverse connecting plate is connected to the upper surface of the second sliding block of the second Z-axis fine adjustment mechanism;
the third motor is fixed at one end of the transverse connecting plate, which is connected with the first Z-axis fine adjustment mechanism, an output shaft of the third motor is connected with one end of a third screw rod, and the other end of the third screw rod is connected with the second support through a bearing;
the third screw rod passes through a threaded hole on the side surface of the third sliding block and is connected with the third sliding block, and the lower surface of the third sliding block is connected with the probe;
the first motor, the first electric telescopic rod and the third motor are respectively connected with the probe control module.
5. The device for realizing semi-automatic measurement of a server motherboard signal according to claim 4, wherein the measurement processing module comprises an amplifier, an input end of the amplifier is connected with the probe, an output end of the amplifier is connected with the analog-to-digital conversion module through the sample-and-hold module, an output end of the analog-to-digital conversion module is connected with the second processor through the high-speed storage device, and the second processor is connected with the display interface.
6. A server motherboard signal semi-automatic measurement method based on the device for realizing server motherboard signal semi-automatic measurement as claimed in claim 1, comprising the steps of:
placing the main board on the surface of a matrix point positioning light board, and primarily drawing and forming matrix points by the matrix point positioning light board through self-luminous light transmittance;
the image acquisition module at the side of the probe performs preliminary imaging on the front surface of the main board and transmits the preliminary imaging to the first processor, and the first processor performs matrix point imaging on the image and the formed matrix points on the surface image of the main board;
displaying the imaging result through a display interface;
the user selects the setting of various electrical parameters of the probe through the display interface, selects matrix points of target measurement points, sets the preset height of the off-board surface, and transmits related data set by the user through the display interface to the probe control module through the first processor;
the probe is controlled to move to the position right above the measuring point by the probe control module, and the height difference between the probe and the main board is positioned by the infrared module in the image acquisition module at the side of the probe module, so that the probe is controlled to descend and set the preset height from the surface of the board;
the height of the probe is adjusted by rotating the manual rotation knob to correct the distance between the probe and the measuring point;
after the manual correction is finished, the probe is arranged on the surface of the measuring point, and the signal measurement imaging is controlled;
and (5) after the measurement is finished, storing the image, and controlling the probe to be lifted to an initial position.
7. The method for semi-automatic measurement of signals on a server motherboard according to claim 6, wherein the step of placing the motherboard on a surface of a matrix point positioning light board, and the matrix point positioning light board performs preliminary drawing and shaping of matrix points by self-luminous light transmittance comprises:
the probe is suspended above the matrix point positioning optical plate, and the position of the matrix point is corrected and positioned through a transmitting chip arranged in the probe.
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| CN102854251A (en) * | 2012-08-29 | 2013-01-02 | 北京工业大学 | Supersonic imaging system utilizing virtual instrument technology, and imaging method thereof. |
| CN109143042A (en) * | 2018-10-31 | 2019-01-04 | 重庆矢崎仪表有限公司 | FCT detection device and detection method based on optics and machine vision |
| CN110837036A (en) * | 2019-11-07 | 2020-02-25 | 东南大学 | Circuit board fault automatic detection system |
| CN214310782U (en) * | 2021-01-25 | 2021-09-28 | 苏州伊欧陆系统集成有限公司 | PCB double-sided test probe station |
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2022
- 2022-05-27 CN CN202210590970.6A patent/CN114994506B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102854251A (en) * | 2012-08-29 | 2013-01-02 | 北京工业大学 | Supersonic imaging system utilizing virtual instrument technology, and imaging method thereof. |
| CN109143042A (en) * | 2018-10-31 | 2019-01-04 | 重庆矢崎仪表有限公司 | FCT detection device and detection method based on optics and machine vision |
| CN110837036A (en) * | 2019-11-07 | 2020-02-25 | 东南大学 | Circuit board fault automatic detection system |
| CN214310782U (en) * | 2021-01-25 | 2021-09-28 | 苏州伊欧陆系统集成有限公司 | PCB double-sided test probe station |
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