CN114992604B - LED module with low deformation heat radiation structure - Google Patents
LED module with low deformation heat radiation structure Download PDFInfo
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- CN114992604B CN114992604B CN202210816547.3A CN202210816547A CN114992604B CN 114992604 B CN114992604 B CN 114992604B CN 202210816547 A CN202210816547 A CN 202210816547A CN 114992604 B CN114992604 B CN 114992604B
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- 230000005855 radiation Effects 0.000 title claims description 4
- 238000006243 chemical reaction Methods 0.000 claims abstract description 105
- 230000008859 change Effects 0.000 claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims description 111
- 238000001179 sorption measurement Methods 0.000 claims description 70
- 230000009471 action Effects 0.000 claims description 10
- 230000005294 ferromagnetic effect Effects 0.000 claims description 6
- 230000005291 magnetic effect Effects 0.000 claims description 5
- 230000005489 elastic deformation Effects 0.000 claims description 3
- 239000013013 elastic material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 29
- 238000010521 absorption reaction Methods 0.000 abstract description 15
- 238000010438 heat treatment Methods 0.000 abstract description 7
- 230000002035 prolonged effect Effects 0.000 abstract description 7
- 230000003685 thermal hair damage Effects 0.000 abstract description 3
- 238000001125 extrusion Methods 0.000 description 22
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- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
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- 238000012423 maintenance Methods 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
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- 238000011161 development Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/105—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using magnets
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a led module with a low-deformation radiating structure, which belongs to the field of led modules, wherein a radiating cavity is formed in a led module body, a plurality of radiating holes communicated with the radiating cavity are formed in the lower end of the led module body, and the heat absorption deformation can be generated when the led module body generates higher heat through the cooperation of a thermal deformation bag, a phase change reaction retaining plate, a heat conduction support sleeve and a radiating linkage strip, so that the heat generated by the led module body is absorbed in a thermal deformation way, the heat accumulated in the led module body is discharged through the radiating holes under the deformation effect of the thermal deformation bag and the heat conduction support sleeve, the heat concentration in the led module body is further effectively avoided, the radiating effect of the led module body is improved, the probability of deformation generated by heating a power device in the led module body is effectively reduced, the thermal damage of the led module body is reduced, and the service life of the led module body is prolonged.
Description
Technical Field
The invention relates to the field of led modules, in particular to an led module with a low-deformation heat dissipation structure.
Background
The led module is widely applied in led products, and has great difference in structural and electronic aspects, and simply, a circuit board and a shell with the led are used for forming the led module, and the led module is complicated, and has better service life and luminous intensity due to the control, the constant current source and related heat dissipation treatment.
The LED module can be divided into three types of low power (below 0.3W), medium power (0.3-0.5W) and high power (1W and above) according to the power of a single LED, the high power module is higher in brightness than the low power, the service time is longer, the development trend of the whole LED illumination is that the LED module is more practical, and a plurality of single lamp beads in most LED modules are electrically connected in parallel in order to improve the service life and the durability of the LED module.
In the continuous use of led module, it can produce corresponding heat when the illumination, and the heat dissipation of current led module is handled and is generally used heat conduction heat dissipation to it to structure such as heat conduction fin, but because the component thickness in the led module is thinner, ordinary heat conduction radiating efficiency is lower, easily makes the structure in the led module produce deformation under long-time thermodynamic action, and then easily causes the operation trouble of led module, causes its functional damage, reduces the life of led module.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems existing in the prior art, the invention aims to provide the led module with the low-deformation radiating structure, which can generate heat absorption deformation when the led module body generates higher heat through the cooperation of the heat deformation bag, the phase change reaction retaining plate, the heat conduction support sleeve and the radiating linkage strip, can absorb the heat generated by the led module body in a heat deformation way, and can also discharge the heat accumulated in the led module body through the radiating holes under the action of the deformation of the heat deformation bag and the heat conduction support sleeve, thereby effectively avoiding the concentration of the heat in the led module body, effectively reducing the probability of deformation caused by heating of a power device in the led module body, reducing the heat damage of the led module body and prolonging the service life of the led module body.
2. Technical proposal
In order to solve the problems, the invention adopts the following technical scheme.
The utility model provides a led module with low deformation heat radiation structure, includes led module body, the radiating effect chamber has been seted up in the led module body, a plurality of radiating holes that put through mutually with the radiating effect chamber have been seted up to led module body lower extreme, inner wall fixedly connected with thermal deformation bag on the radiating effect chamber, thermal deformation bag lower extreme fixedly connected with a plurality of heat conduction braces that put through rather than mutually, and thermal conduction brace and louvre cooperation, inner wall fixedly connected with phase transition reaction keeps the board on the thermal deformation bag, phase transition reaction keeps board lower extreme fixedly connected with a plurality of and thermal conduction brace matched with heat dissipation linkage strip, through thermal deformation bag, phase transition reaction keeps board, thermal conduction brace and the cooperation of radiating linkage strip, can produce thermal absorption deformation when led module body produces higher heat, still carries out thermal deformation absorption to led module body produced heat, still discharges through the radiating hole under thermal deformation bag and thermal conduction brace effect and pile up at the inside heat of led module body, and then the inside thermal deformation module body fixedly connected with phase transition reaction keeps the body, and effectively has improved the heat dissipation module and has reduced the heat that the inside the heat source of led module body, and can also have reduced the effect that the heat source of the led module concentrates the heat, and has improved the heat-sink module and has reduced the life-span of the led module.
Further, the thermal deformation bag is filled with thermal expansion gas, and the thermal expansion gas can effectively promote the deformation quantity of the thermal deformation bag when absorbing heat, so that the deformation heat dissipation effect of the thermal deformation bag is improved, and the instant heat dissipation efficiency of the thermal deformation bag is improved.
Further, inner wall fixed connection contact heating panel under the heat conduction brace, and contact heating panel upper end and heat dissipation linkage strip fixed connection, led module body lower extreme fixedly connected with heat dissipation fin seat, contact heating panel passes through heat conduction brace and heat dissipation fin seat cooperation heat dissipation, and the cooperation of contact heating panel and heat dissipation linkage strip can directly turn into heat conduction formula heat dissipation with original air cooling after heat deformation bag and heat conduction brace produce deformation, improves the internal power device of led module and directly with heat dissipation fin seat or external contact's area, and then effectively carries out direct heat dissipation to the inside of led module, reduces the heat conduction step, improves radiating efficiency, and then effectively protects led module body, improves its life, reduces its maintenance cost.
Further, the deformation spring in the heat dissipation linkage strip outside is established to inner wall fixedly connected with cover under the heat conduction branch cover, deformation spring upper end and phase transition reaction keep board fixed connection, deformation spring can be after the heat dissipation is accomplished, and effective supplementary heat conduction branch cover resets the action, improves the reuse rate of thermal deformation bag and heat conduction branch cover, effectively keeps led module body radiating circularity.
Further, the elastic deformation coefficient of the thermal deformation bag is smaller than that of the heat conduction support sleeve, so that the thermal deformation bag deforms before the heat conduction support sleeve, the exhaust efficiency of the thermal deformation bag during deformation is effectively improved, and the heat dissipation efficiency is improved.
Further, the linkage chamber has been seted up in the heat dissipation linkage strip, inner wall fixedly connected with spacing dead lever under the linkage chamber, spacing dead lever upper end fixedly connected with adsorbs the awl groove, heat dissipation linkage strip upper end sliding connection has the reaction ejector pin, reaction ejector pin lower extreme extends to the linkage intracavity to fixedly connected with adsorbs spacing awl piece, and adsorbs spacing awl piece and adsorb the awl groove and cooperate, adsorb the cooperation of awl groove and absorption spacing awl piece, can be according to the degree of formation of heat dissipation linkage strip, act on the reaction stripper plate, can keep the reverse extrusion effect of reaction stripper plate to the inside electric components and parts of led module body when the internal temperature of led module is higher, effectively reduced its probability that produces deformation, reduced the fault rate of led module body.
Further, the inner wall fixedly connected with strong magnetism adsorbs the piece under the adsorption cone groove, adsorb spacing awl piece lower extreme fixedly connected with ferromagnetic adsorption piece, adsorb the awl groove and adsorb spacing awl piece through strong magnetism adsorption piece, be convenient for adsorb the locking of awl groove to adsorbing spacing awl piece for the reaction ejector pin can not produce the backward extrusion effect to the reaction stripper plate when normal temperature, effectively keeps the stability of the inside electric components and parts of led module body.
Further, the guide cone angle matched with the adsorption cone groove is formed in the lower end of the adsorption limiting cone block, the adsorption limiting cone block is made of elastic materials, the matching efficiency of the adsorption limiting cone block and the adsorption cone groove can be effectively improved, the matched smoothness of the adsorption limiting cone block and the adsorption cone groove is improved, the matched abrasion is reduced, and the service life is prolonged.
Further, reaction ejector pin outer end fixedly connected with reaction fixed plate, reaction fixed plate upper end fixedly connected with reaction spring, reaction spring upper end and heat dissipation linkage strip fixed connection, reaction spring can be after absorption awl groove and absorption spacing awl piece unblock, keeps weighing down ascending extrusion force to reaction ejector pin, effectively keeps reaction ejector pin effect.
Further, the reaction holding groove has been seted up to the phase transition reaction holding plate upper end, reaction ejector pin upper end extends to the reaction holding inslot to fixedly connected with reaction stripper plate, reaction stripper plate and reaction holding groove sliding connection, reaction ejector pin are through driving the slip of reaction stripper plate in the holding groove, effectively change the atmospheric pressure between phase transition reaction holding plate and the thermal deformation bag, are convenient for prevent deformation protection to led module body.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) This scheme is through thermal deformation bag, phase transition reaction keeps board, heat conduction brace and the cooperation of heat dissipation linkage strip, can produce the heat absorption deformation when led module body produces higher heat, can carry out the thermal deformation to the heat that led module body produced and absorb, still discharge the heat of piling up inside led module body through the louvre under thermal deformation bag and the effect of heat conduction brace deformation, and then effectively avoid the inside thermal concentration of led module body, when having improved the radiating effect of led module body, can also effectively reduce the probability that the power device in the led module body was heated and is produced deformation, reduce the thermal damage of led module body, improve the life of led module body.
(2) The thermal expansion gas can effectively promote the deformation of the thermal deformation bag while absorbing heat, so that the deformation heat dissipation effect of the thermal deformation bag is improved, and the instantaneous heat dissipation efficiency of the thermal deformation bag is improved.
(3) The cooperation of contact heating panel and heat dissipation linkage strip can be after thermal deformation bag and heat conduction branch cover produce deformation, directly converts original air cooling into heat conduction formula heat dissipation, improves the internal power device of led module and directly with radiating fin seat or external contact's area, and then effectively carries out direct heat dissipation to the inside led module body, reduces the heat conduction step, improves radiating efficiency, and then effectively protects led module body, improves its life, reduces its maintenance cost.
(4) The deformation spring can effectively assist the heat conduction support sleeve to reset after heat dissipation is completed, so that the recycling rate of the heat deformation bag and the heat conduction support sleeve is improved, and the heat dissipation circularity of the led module body is effectively maintained.
(5) The cooperation of absorption awl groove and absorption spacing awl piece can be according to the formation degree of heat dissipation linkage strip, produces the effect to the reaction stripper plate, can keep the reaction stripper plate to the backward extrusion effect of led module body inside electric components and parts when this internal temperature of led module is higher, has effectively reduced its probability that produces deformation, reduces the fault rate of led module body.
(6) The adsorption cone groove can adsorb the adsorption limiting cone block through the strong magnetic adsorption block, so that the adsorption cone groove is convenient to lock the adsorption limiting cone block, and the reaction ejector rod can not produce a backward extrusion effect on the reaction extrusion plate at normal temperature, so that the stability of the electric components inside the led module body is effectively maintained.
(7) The reaction ejector rod effectively changes the air pressure between the phase change reaction retaining plate and the thermal deformation bag by driving the reaction extrusion plate to slide in the retaining groove, so that deformation protection is facilitated for the led module body.
Drawings
FIG. 1 is a schematic diagram of an axial measurement structure of a LED module body according to the present invention;
FIG. 2 is a schematic diagram of the structure of the led module body and thermal deformation bag according to the present invention;
FIG. 3 is a schematic diagram of a heat dissipation and deformation process of a thermal deformation bag according to the present invention;
FIG. 4 is a schematic diagram showing a front view of a LED module body without heat dissipation according to the present invention;
FIG. 5 is a schematic view of the structure of FIG. 4A according to the present invention;
FIG. 6 is a schematic diagram showing a front view of a heat dissipating linkage bar without dissipating heat according to the present invention;
FIG. 7 is a schematic diagram showing a front view of a LED module body with heat dissipation according to the present invention;
FIG. 8 is a schematic view of the structure of FIG. 7B according to the present invention;
FIG. 9 is a schematic diagram showing a front view of a LED module body in a cross-sectional configuration during heat dissipation reaction according to the present invention;
FIG. 10 is a schematic view of the structure of FIG. 9C according to the present invention;
Fig. 11 is a schematic front view of a heat dissipating linkage bar in front view of the heat dissipating linkage of the present invention.
The reference numerals in the figures illustrate:
The heat dissipation device comprises a 1led module body, a 101 heat dissipation hole, a 102 heat dissipation action cavity, a2 heat dissipation fin seat, a 3 heat deformation bag, a 4 phase change reaction retaining plate, a 5 heat conduction support sleeve, a 501 contact heat dissipation plate, a 502 deformation spring, a 6 heat dissipation linkage bar, a 601 linkage cavity, a 7 limit fixed rod, a 701 adsorption cone groove, a 702 reaction ejector rod, a 703 adsorption limit cone block, a 704 reaction spring and a 705 reaction fixed plate.
Description of the embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments, and that all other embodiments obtained by persons of ordinary skill in the art without making creative efforts based on the embodiments in the present invention are within the protection scope of the present invention.
In the description of the present invention, it should be noted that the positional or positional relationship indicated by the terms such as "upper", "lower", "inner", "outer", "top/bottom", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1:
Referring to fig. 1-11, a led module with low deformation heat dissipation structure includes a led module body 1, a heat dissipation cavity 102 is formed in the led module body 1, a plurality of heat dissipation holes 101 connected with the heat dissipation cavity 102 are formed at the lower end of the led module body 1, a thermal deformation bag 3 is fixedly connected to the upper inner wall of the heat dissipation cavity 102, a plurality of heat conduction branch sleeves 5 connected with the thermal deformation bag 3 are fixedly connected to the lower end of the thermal deformation bag 3, the thermal conduction branch sleeves 5 are matched with the heat dissipation holes 101, a phase change reaction retaining plate 4 is fixedly connected to the upper inner wall of the thermal deformation bag 3, a plurality of heat dissipation linkage strips 6 matched with the thermal conduction branch sleeves 5 are fixedly connected to the lower end of the phase change reaction retaining plate 4, and through the cooperation of the thermal deformation bag 3, the phase change reaction retaining plate 4, the thermal conduction branch sleeves 5 and the heat dissipation linkage strips 6, the thermal deformation can be generated when the led module body 1 generates higher heat, the thermal deformation absorption can be performed on the heat generated by the led module body 1, the thermal deformation bag 3 and the thermal conduction branch sleeves 5 are matched with the heat dissipation hole 101, the thermal deformation module body can be effectively prevented from being accumulated in the led module body 1 through the heat dissipation hole 1, and the thermal deformation effect of the led module 1 can be further prolonged, and the heat loss effect of the led module 1 can be further reduced.
Referring to fig. 1-4, fig. 7 and fig. 9, the thermal deformation bag 3 is filled with a thermal expansion gas, which may be an inert gas, such as carbon dioxide, and the thermal expansion gas can absorb heat and simultaneously effectively promote the deformation of the thermal deformation bag 3, improve the deformation heat dissipation effect of the thermal deformation bag 3 and improve the instant heat dissipation efficiency thereof.
Referring to fig. 4-11, the lower inner wall of the heat conduction support sleeve 5 is fixedly connected with the contact heat dissipation plate 501, the upper end of the contact heat dissipation plate 501 is fixedly connected with the heat dissipation linkage bar 6, the lower end of the led module body 1 is fixedly connected with the heat dissipation fin seat 2, the contact heat dissipation plate 501 is matched with the heat dissipation fin seat 2 to dissipate heat through the heat conduction support sleeve 5 and the heat dissipation linkage bar 2, after the heat conduction support sleeve 5 and the heat dissipation support sleeve 501 are deformed, the original air cooling can be directly converted into heat conduction type heat dissipation, the contact area of a power device in the led module body 1 and the heat dissipation fin seat 2 or the outside is improved, the direct heat dissipation is effectively carried out inside the led module body 1, the heat dissipation step is reduced, the heat dissipation efficiency is improved, the led module body 1 is effectively protected, the service life of the led module body is prolonged, and the maintenance cost of the led module is reduced.
Referring to fig. 1-11, a deformation spring 502 sleeved on the outer side of the heat dissipation linkage bar 6 is fixedly connected to the lower inner wall of the heat conduction support sleeve 5, the upper end of the deformation spring 502 is fixedly connected with the phase change reaction retaining plate 4, and the deformation spring 502 can effectively assist the heat conduction support sleeve 5 to perform a reset action after heat dissipation is completed, so that the recycling rate of the heat deformation bag 3 and the heat conduction support sleeve 5 is improved, and the heat dissipation circularity of the led module body 1 is effectively maintained.
Referring to fig. 4-10, the elastic deformation coefficient of the thermal deformation bag 3 is smaller than that of the thermal conduction support sleeve 5, so that the thermal deformation bag 3 deforms earlier than the thermal conduction support sleeve 5, thereby effectively improving the air exhaust efficiency and the heat dissipation efficiency when the thermal deformation bag 3 deforms.
Referring to fig. 6 and 11, a linkage cavity 601 is formed in the heat dissipation linkage bar 6, a limiting fixed rod 7 is fixedly connected to the lower inner wall of the linkage cavity 601, an adsorption cone groove 701 is fixedly connected to the upper end of the limiting fixed rod 7, a reaction ejector rod 702 is slidably connected to the upper end of the heat dissipation linkage bar 6, the lower end of the reaction ejector rod 702 extends into the linkage cavity 601 and is fixedly connected with an adsorption limiting cone block 703, the adsorption limiting cone block 703 is matched with the adsorption cone groove 701, the adsorption cone groove 701 and the adsorption limiting cone block 703 are matched, a reaction extrusion plate can act according to the formation degree of the heat dissipation linkage bar 6, and when the temperature in the led module body 1 is high, the reaction extrusion plate can act on the reverse extrusion of electric components in the led module body 1, so that the probability of deformation of the led module body 1 is effectively reduced, and the failure rate of the led module body 1 is reduced.
Referring to fig. 6 and 11, the lower inner wall of the adsorption cone groove 701 is fixedly connected with a ferromagnetic adsorption block, the lower end of the adsorption limit cone block 703 is fixedly connected with a ferromagnetic adsorption sheet, the adsorption cone groove 701 can adsorb the adsorption limit cone block 703 through the ferromagnetic adsorption block, so that the adsorption cone groove 701 is convenient for locking the adsorption limit cone block 703, and the reaction ejector rod 702 can not produce a backward extrusion effect on the reaction extrusion plate at normal temperature, thereby effectively maintaining the stability of the electric components inside the led module body 1.
Referring to fig. 6 and 11, a guiding cone angle matched with the adsorption cone groove 701 is formed at the lower end of the adsorption limiting cone block 703, and the adsorption limiting cone block 703 is made of an elastic material, so that the matching efficiency of the adsorption limiting cone block 703 and the adsorption cone groove 701 can be effectively improved, the matched smoothness of the adsorption limiting cone block 703 and the adsorption cone groove 701 is improved, the matched abrasion is reduced, and the service life is prolonged.
Referring to fig. 6 and 11, the outer end of the reaction ejector rod 702 is fixedly connected with a reaction fixed plate 705, the upper end of the reaction fixed plate 705 is fixedly connected with a reaction spring 704, the upper end of the reaction spring 704 is fixedly connected with the heat dissipation linkage bar 6, and the reaction spring 704 can maintain an upward extrusion force on the reaction ejector rod 702 after the adsorption cone groove 701 and the adsorption limiting cone block 703 are unlocked, so that the acting effect of the reaction ejector rod 702 is effectively maintained.
Referring to fig. 6 and 11, a reaction holding groove is formed at the upper end of the phase-change reaction holding plate 4, the upper end of the reaction ejector rod 702 extends into the reaction holding groove, and is fixedly connected with a reaction extrusion plate, the reaction extrusion plate is slidably connected with the reaction holding groove, and the reaction ejector rod 702 effectively changes the air pressure between the phase-change reaction holding plate 4 and the thermal deformation bag 3 by driving the reaction extrusion plate to slide in the holding groove, so that the led module body 1 is convenient to be protected from deformation.
Referring to fig. 1 to 11, during the continuous use of the led module body 1, the temperature inside the led module body is continuously raised, when the heat dissipation of the heat dissipation fin seat 2 is not ideal, the thermal deformation bag 3 and the thermal expansion gas inside the thermal deformation bag generate deformation after absorbing heat, the thermal deformation bag 3 continuously deforms and moves downwards, so that the gas in the 302 moves downwards through the heat dissipation holes 101 and is discharged through the installation gaps of the led module body 1 and the heat dissipation fin seat 2, and the heat exchange efficiency is effectively increased; then in the continuous thermal deformation process, the heat dissipation effect is not ideal, so that the thermal expansion gas continuously expands to act on the heat conduction branch sleeve 5, the heat conduction branch sleeve 5 generates thermal expansion deformation, is continuously close to the heat dissipation fin seat 2 and is in contact with the heat dissipation fin seat 2, and the heat inside the led module body 1 is exchanged through direct conduction of the heat conduction branch sleeve 5 and the heat dissipation linkage strip 6, so that the heat dissipation efficiency is improved; when the heat dissipation linkage bar 6 deforms synchronously, the limit fixed rod 7 moves downwards continuously, the adsorption cone groove 701 generates a pulling deformation force on the adsorption limit cone block 703, when the pulling deformation force of the downwards movement is larger than the deformation force and the adsorption force of the adsorption limit cone block 703, the adsorption limit cone block 703 deforms and slides out of the adsorption cone groove 701, the adsorption cone groove 701 releases the locking of the adsorption limit cone block 703, at the moment, the reaction spring 704 generates a reset action, and the reaction fixed plate 705 drives the reaction ejector rod 702 to move upwards, so that the reaction ejector rod 702 pushes the reaction extrusion plate to slide in the holding groove, the air pressure between the reaction extrusion plate and the thermal deformation bag 3 is pressurized, the thermal deformation bag 3 generates an upward extrusion force, and the electric components in the led module body 1 are acted to keep the deformation of the thermal deformation block 703, so that the thermal deformation damage of the thermal deformation block is effectively avoided;
After heat dissipation is completed, the thermal deformation bag 3 and the thermal expansion gas generate recovery deformation, the thermal conduction support sleeve 5 is assisted to reset under the cooperation of the deformation spring 502, at the moment, the thermal deformation bag 3 and the thermal conduction support sleeve 5 are continuously reset, the heat dissipation linkage strip 6 also recovers deformation and drives the limit fixing rod 7 to move upwards, the adsorption cone groove 701 continuously moves to be close to the adsorption limit cone block 703, the ferromagnetic adsorption piece at the lower end of the adsorption limit cone block 703 is subjected to magnetic adsorption through the strong magnetic adsorption block in the adsorption cone groove, the adsorption limit cone block 703 slides into the adsorption cone groove 701 under the action of guiding cone angle, magnetic adsorption and self deformation, then the reaction spring 704 is pulled through the reaction ejector rod 702 and the reaction fixing plate 705, the reaction extrusion plate is driven to reset through the reaction ejector rod 702, and the extrusion effect of the electric components in the pair 1 is contacted; the cooperation of absorption awl groove 701 and absorption spacing awl piece 703 can be according to the formation degree of heat dissipation linkage strip 6, can produce the effect to the reaction stripper plate, can keep the reaction stripper plate to the inside electric components and parts's of led module body 1 backward extrusion effect when led module body 1 internal temperature is higher, effectively reduced the probability that its produced deformation, reduce led module body 1's fault rate, through thermal deformation bag 3, phase transition reaction retainer plate 4, heat conduction brace 5 and heat dissipation linkage strip 6's cooperation, can produce the thermal absorption deformation when led module body 1 produces higher heat, can carry out thermal deformation absorption to the heat that led module body 1 produced, still discharge the heat of piling up inside led module body 1 through louvre 101 under the effect of thermal deformation bag 3 and heat conduction brace 5 deformation, and then effectively avoid the inside thermal concentration of led module body 1, when having improved the effect of led module body 1, can also effectively reduce the probability that power device produced in led module body 1, reduce the probability that the heat dissipation device produced in the led module body 1 is heated, the life of led module 1 is prolonged, and the service life of the thermal damage module is prolonged.
The above description is only of the preferred embodiments of the present invention; the scope of the invention is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present invention, and the technical solution and the improvement thereof are all covered by the protection scope of the present invention.
Claims (5)
1. The utility model provides a led module with low deformation heat radiation structure, includes led module body (1), its characterized in that: a heat dissipation action cavity (102) is formed in the led module body (1), a plurality of heat dissipation holes (101) communicated with the heat dissipation action cavity (102) are formed in the lower end of the led module body (1), a heat deformation bag (3) is fixedly connected to the upper inner wall of the heat dissipation action cavity (102), a plurality of heat conduction branch sleeves (5) communicated with the heat deformation bag (3) are fixedly connected to the lower end of the heat deformation bag, the heat conduction branch sleeves (5) are matched with the heat dissipation holes (101), a phase change reaction retaining plate (4) is fixedly connected to the upper inner wall of the heat deformation bag (3), and a plurality of heat dissipation linkage strips (6) matched with the heat conduction branch sleeves (5) are fixedly connected to the lower end of the phase change reaction retaining plate (4);
The heat conduction support sleeve (5) is fixedly connected with the lower inner wall of the contact heat dissipation plate (501), the upper end of the contact heat dissipation plate (501) is fixedly connected with the heat dissipation linkage strip (6), the lower end of the led module body (1) is fixedly connected with the heat dissipation fin seat (2), and the contact heat dissipation plate (501) is matched with the heat dissipation fin seat (2) for heat dissipation through the heat conduction support sleeve (5);
A linkage cavity (601) is formed in the heat dissipation linkage bar (6), a limit fixed rod (7) is fixedly connected to the lower inner wall of the linkage cavity (601), an adsorption cone groove (701) is fixedly connected to the upper end of the limit fixed rod (7), a reaction ejector rod (702) is slidably connected to the upper end of the heat dissipation linkage bar (6), the lower end of the reaction ejector rod (702) extends into the linkage cavity (601), an adsorption limit cone block (703) is fixedly connected to the reaction ejector rod, and the adsorption limit cone block (703) is matched with the adsorption cone groove (701);
the lower inner wall of the adsorption cone groove (701) is fixedly connected with a strong magnetic adsorption block, the lower end of the adsorption limit cone block (703) is fixedly connected with a ferromagnetic adsorption sheet, the outer end of the reaction ejector rod (702) is fixedly connected with a reaction fixed plate (705), the upper end of the reaction fixed plate (705) is fixedly connected with a reaction spring (704), and the upper end of the reaction spring (704) is fixedly connected with a heat dissipation linkage bar (6);
The phase change reaction maintaining plate (4) is characterized in that a reaction maintaining groove is formed in the upper end of the phase change reaction maintaining plate, the upper end of the reaction ejector rod (702) extends into the reaction maintaining groove and is fixedly connected with a reaction extruding plate, and the reaction extruding plate is in sliding connection with the reaction maintaining groove.
2. The led module with low-deformation heat dissipation structure according to claim 1, wherein: the thermal deformation bag (3) is filled with thermal expansion gas.
3. The led module with low-deformation heat dissipation structure according to claim 1, wherein: the heat conduction support sleeve (5) is characterized in that a deformation spring (502) sleeved on the outer side of the heat dissipation linkage bar (6) is fixedly connected to the lower inner wall of the heat conduction support sleeve, and the upper end of the deformation spring (502) is fixedly connected with the phase change reaction retaining plate (4).
4. The led module with low-deformation heat dissipation structure according to claim 1, wherein: the elastic deformation coefficient of the thermal deformation bag (3) is smaller than that of the thermal conduction support sleeve (5).
5. The led module with low-deformation heat dissipation structure according to claim 1, wherein: the lower end of the adsorption limiting cone block (703) is provided with a guide cone angle matched with the adsorption cone groove (701), and the adsorption limiting cone block (703) is made of an elastic material.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210816547.3A CN114992604B (en) | 2022-07-12 | 2022-07-12 | LED module with low deformation heat radiation structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210816547.3A CN114992604B (en) | 2022-07-12 | 2022-07-12 | LED module with low deformation heat radiation structure |
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| CN114992604B true CN114992604B (en) | 2024-06-14 |
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| CN115539854A (en) * | 2022-08-31 | 2022-12-30 | 罗绷仔 | Outdoor high waterproof type led module of using |
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| US20080093055A1 (en) * | 2006-10-24 | 2008-04-24 | Inventec Corporation | Heat-dissipating structure |
| US20090223555A1 (en) * | 2008-03-05 | 2009-09-10 | Stalix Llc | High Efficiency Concentrating Photovoltaic Module Method and Apparatus |
| CN111128047B (en) * | 2020-01-16 | 2020-11-13 | 无锡市方舟科技电子有限公司 | Temperature self-detection and deformation heat dissipation LED display screen module |
| CN114423263B (en) * | 2022-03-30 | 2022-06-14 | 高润新材料科技(南通)有限公司 | Outdoor communication machine room with high heat exchange performance |
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| CN115539854A (en) * | 2022-08-31 | 2022-12-30 | 罗绷仔 | Outdoor high waterproof type led module of using |
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Effective date of registration: 20240329 Address after: No. 1, Courtyard, Northeast Corner, Intersection of Haihe Avenue and Wuyi West Road, High tech Zone, Anyang City, Henan Province, 455000 Applicant after: Anyang Ruisen Display Technology Co.,Ltd. Country or region after: China Address before: No. 156, Baoqing East Road, Shuangqing District, Shaoyang City, Hunan Province 422000 Applicant before: Xu Qian Country or region before: China |
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