CN114038978B - Through silicon via LED packaging structure of wafer level glass cavity - Google Patents
Through silicon via LED packaging structure of wafer level glass cavity Download PDFInfo
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- CN114038978B CN114038978B CN202111077991.XA CN202111077991A CN114038978B CN 114038978 B CN114038978 B CN 114038978B CN 202111077991 A CN202111077991 A CN 202111077991A CN 114038978 B CN114038978 B CN 114038978B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 37
- 239000011521 glass Substances 0.000 title claims abstract description 14
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 11
- 239000010703 silicon Substances 0.000 title claims abstract description 11
- 230000006835 compression Effects 0.000 claims abstract description 35
- 238000007906 compression Methods 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 238000007789 sealing Methods 0.000 claims description 24
- 238000005538 encapsulation Methods 0.000 claims description 20
- 230000000149 penetrating effect Effects 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 abstract description 14
- 230000017525 heat dissipation Effects 0.000 description 26
- 238000010586 diagram Methods 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 238000011900 installation process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 210000002421 cell wall Anatomy 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a through silicon via LED packaging structure of a wafer level glass cavity, which comprises a packaging seat and a lens, wherein a group of clamping mechanisms which are symmetrical front and back are arranged on the outer surface of the packaging seat, each clamping mechanism comprises a connecting block, a baffle ring, a second compression spring and a clamping head, an installation mechanism is arranged in the packaging seat, and each installation mechanism comprises an installation plate, a clamping block, a fixing rod and a first compression spring. The invention relates to a through silicon via LED packaging structure of a wafer level glass cavity, which belongs to the field of LED packaging, and is convenient for mounting and dismounting a lens and ensuring that the light emitted by an LED chip can be outwards penetrated through the cooperation of a packaging seat, the lens and a clamping mechanism.
Description
Technical Field
The invention relates to the field of LED packaging, in particular to a through silicon via LED packaging structure of a wafer level glass cavity.
Background
A light emitting diode, abbreviated as LED, is a commonly used light emitting device that emits light by energy released by recombination of electrons and holes, and is widely used in the field of illumination. The light emitting diode can efficiently convert electric energy into light energy, and has wide application in modern society, such as illumination, flat panel display, medical devices and the like. The electronic element has appeared in 1962 as early as low-luminosity red light, and then other monochromatic light versions are developed, so that the light emitted by the electronic element can be spread into visible light, infrared light and ultraviolet light, and the luminosity is improved to be equivalent. The application is also used as an indicator light, a display panel and the like at the beginning; with the continuous progress of technology, light emitting diodes have been widely used for displays and illumination. The LED package is to package an LED light emitting chip, and compared with the package of a dust collecting circuit, the LED package is not only required to protect the LED light emitting chip, but also to make the light emitted by the LED light emitting chip externally pass through. But the encapsulation function of current LED only plays a protection and printing opacity effect to LED light emitting chip to this traditional encapsulation mechanism mostly all adopts the packaging structure of leakproofness, leads to the LED lamp to replace once appearing damaging the whole LED lamp, can't effectually change and maintain the LED lamp after damaging, has reduced the recycle value of LED lamp and the practicality of LED lamp, and the holistic heat dispersion of LED lamp has also further been restricted to this leakproofness's packaging structure, the heat that the LED lamp produced when luminous can stay in encapsulation mechanism's inside all the time, can cause the influence to the normal use of LED lamp under the long-time operating condition, also can shorten the life of LED lamp simultaneously.
Disclosure of Invention
The invention mainly aims to provide a through silicon via LED packaging structure of a wafer level glass cavity, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the utility model provides a wafer level glass die cavity's silicon through-hole LED packaging structure, includes encapsulation seat and lens, be equipped with a set of joint mechanism of fore-and-aft symmetry on the surface of encapsulation seat, joint mechanism includes connecting block, baffle ring, second compression spring and dop, the inside of encapsulation seat is equipped with installation mechanism, installation mechanism includes mounting panel, fixture block, fixed block, dead lever and first compression spring, the top surface of mounting panel is equipped with heat radiation structure, heat radiation structure includes radiating fin, locating piece and screw, radiating fin's top surface is equipped with the LED chip.
Preferably, the bottom part of the lens is fixedly provided with a sealing block, the outer surface of the lens is respectively and fixedly provided with a group of right-angle blocks which are symmetrical front and back, the side wall of the lower end part of the right-angle block is provided with a clamping hole, the light generated when the LED chip emits light can be outwards transmitted through the lens, and the lens is conveniently mounted on the packaging seat through the right-angle blocks and the clamping holes formed in the right-angle blocks.
Preferably, two groups of symmetrical pin holes are formed in the top surface of the LED chip, positioning blocks corresponding to the pin holes are fixedly arranged on the top surface of the radiating fin, the positioning blocks are installed in the pin holes in a penetrating mode, threaded holes are formed in the top surface of the positioning blocks, the screws are in threaded connection with the threaded holes, heat generated when the LED chip emits light is absorbed in an accelerating mode through the radiating fin, and heat dissipation performance of the LED chip is improved.
Preferably, the bottom surface four sides of mounting panel are seted up the recess respectively, just movable groove has been seted up respectively to the cell wall both sides of recess, link to each other still set up one installation opening between the recess, be convenient for the removal of fixture block through the recess of seting up on the mounting panel, and the movable groove of seting up is convenient for the removal of fixed block, and the installation opening of seting up then is convenient for the mounting panel location and installs in the encapsulation seat.
Preferably, a fixed rod is fixedly arranged in the movable groove, a first compression spring is sleeved on the rod body of the fixed rod, one end of the first compression spring is fixedly arranged on the groove wall of the movable groove, and the clamping block is enabled to move outwards through stretching operation of the first compression spring.
Preferably, fixed blocks are fixedly installed on front end portions of side walls on two sides of the clamping block respectively, connecting holes are formed in the side walls of the fixed blocks, the fixed blocks are installed on the fixed rods through connection Kong Chuancha, the other ends of the first compression springs are fixedly installed on the inner side walls of the fixed blocks, the LED chips and the radiating fins are clamped and installed on the top surfaces of the mounting plates through reverse stretching force made by the first compression springs, and the fixed blocks move on the fixed rods through the connecting holes.
Preferably, the fixed mounting of encapsulation seat has the card strip that corresponds each other with the installation opening, a set of symmetrical line hole has been seted up on the surface of encapsulation seat, the seal groove has been seted up to the top surface of encapsulation seat, just fixed mounting has the sealing ring in the groove of seal groove, a plurality of louvre has been seted up to the bottom surface of encapsulation seat, seals the LED chip through the sealing block that the installation sealing ring cooperatees lens bottom surface installation in the seal groove, avoids the dust to float to the LED chip on, and the line hole of seting up on the encapsulation seat is convenient for the circuit to insert the LED chip and carry out the circular telegram luminous to the LED chip.
Preferably, a group of front-back symmetrical connecting blocks are fixedly arranged on the outer surface of the packaging seat, through spring grooves are formed in the side walls of the connecting blocks, baffle rings are fixedly arranged in notches at two ends of each spring groove respectively, second compression springs are movably arranged in the spring grooves, clamping heads are fixedly arranged at two ends of each second compression spring respectively, the clamping heads are installed in the baffle rings in a penetrating mode, retracting and extending operations are carried out in the spring grooves through the second compression springs to drive the clamping heads to retract and prop in, and lenses are installed on the packaging seat.
Compared with the prior art, the invention has the following beneficial effects:
according to the LED packaging structure, the mounting and dismounting of the lens are facilitated, the light emitted by the LED chip can be guaranteed to be outwards transmitted through the cooperation of the packaging seat, the lens and the clamping mechanism, the heat generated by the LED chip is absorbed through the radiating fin, the heat is timely emitted to the outside through the radiating holes formed in the packaging seat, the heat radiation performance of the LED chip is improved, the normal use and the service life of the LED chip are guaranteed, and the mounting mechanism is convenient for mounting, dismounting and maintaining the LED chip and the radiating structure.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention;
FIG. 2 is a schematic diagram illustrating the overall structure of the present invention;
FIG. 3 is a schematic diagram of the overall structure of an LED chip according to the present invention;
FIG. 4 is a schematic view of the overall structure of the lens of the present invention;
FIG. 5 is a schematic diagram illustrating a heat dissipation structure according to the present invention;
FIG. 6 is a schematic view of the mounting mechanism of the present invention in a disassembled configuration;
FIG. 7 is a schematic view of the mounting plate of the present invention from the bottom;
fig. 8 is a schematic diagram illustrating the structure separation of the package base and the clamping mechanism according to the present invention.
In the figure: 1. a packaging seat; 2. a lens; 3. a clamping mechanism; 4. an LED chip; 5. a heat dissipation structure; 6. a mounting mechanism; 7. foot holes; 8. a sealing block; 9. a right angle block; 10. a clamping hole; 11. a heat radiation fin; 12. a positioning block; 13. a threaded hole; 14. a screw; 15. a mounting plate; 16. a clamping block; 17. a fixed block; 18. a connection hole; 19. a fixed rod; 20. a first compression spring; 21. a groove; 22. a movable groove; 23. installing a notch; 24. a wire hole; 25. sealing grooves; 26. a seal ring; 27. clamping strips; 28. a heat radiation hole; 29. a connecting block; 30. a spring groove; 31. a baffle ring; 32. a second compression spring; 33. a chuck.
Detailed Description
The invention is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the invention easy to understand.
As shown in fig. 1-8, a through silicon via LED package structure of a wafer level glass cavity comprises a package seat 1 and a lens 2, wherein a group of clamping mechanisms 3 which are symmetrical front and back are arranged on the outer surface of the package seat 1, each clamping mechanism 3 comprises a connecting block 29, a baffle ring 31, a second compression spring 32 and a clamping head 33, a mounting mechanism 6 is arranged in the package seat 1, each mounting mechanism 6 comprises a mounting plate 15, a clamping block 16, a fixing block 17, a fixing rod 19 and a first compression spring 20, a heat dissipation structure 5 is arranged on the top surface of the mounting plate 15, each heat dissipation structure 5 comprises a heat dissipation fin 11, a positioning block 12 and a screw 14, and an LED chip 4 is arranged on the top surface of each heat dissipation fin 11.
In this embodiment, in order to improve the heat dissipation performance of the LED chip 4, two groups of symmetrical pin holes 7 are formed on the top surface of the LED chip 4, the top surface of the heat dissipation fin 11 is fixedly provided with positioning blocks 12 corresponding to the pin holes 7, the positioning blocks 12 are installed in the pin holes 7 in a penetrating manner, the top surface of the positioning blocks 12 is provided with threaded holes 13, the screws 14 are in threaded connection with the threaded holes 13, when the LED chip 4 is installed on the top surface of the heat dissipation fin 11 in use, the positioning blocks 12 installed on the heat dissipation fin 11 are inserted into the pin holes 7 formed on the LED chip 4 in the installation process, and then the screws 14 are screwed into the threaded holes 13 formed on the positioning blocks 12, so that the LED chip 4 is fixed on the heat dissipation fin 11.
In this embodiment, in order to mount the LED chip 4 and the heat dissipation fin 11 on the mounting plate 15, the bottom surface four sides of the mounting plate 15 are respectively provided with a groove 21, two sides of the groove wall of the groove 21 are respectively provided with a movable groove 22, a mounting gap 23 is further provided between the connected grooves 21, a fixing rod 19 is fixedly mounted in the groove of the movable groove 22, a first compression spring 20 is sleeved on the rod body of the fixing rod 19, one end of the first compression spring 20 is fixedly mounted on the groove wall of the movable groove 22, the front end parts of the side walls of two sides of the clamping block 16 are respectively fixedly mounted with a fixing block 17, the side walls of the fixing block 17 are provided with connecting holes 18, the fixing block 17 is installed on the fixing rod 19 in a penetrating manner through the connecting holes 18, the other end of the first compression spring 20 is fixedly mounted on the inner side wall of the fixing block 17 during use, when the LED chip 4 mounted on the heat radiating fin 11 and the heat radiating fin 11 are placed on the top surface of the mounting plate 15, the heat radiating fin 11 is positioned on the top surfaces of the clamping blocks 16 on four sides of the mounting plate 15 and then the LED chip 4 is pressed downwards, at the moment, the four sides of the mounting plate 15 are pressed and move outwards, the clamping blocks 16 move in the grooves 21 formed on the bottom surface of the mounting plate 15, the connecting holes 18 mounted on the fixed blocks 17 move in the movable grooves 22 and force the first compression springs 20 sleeved on the fixed rods 19 mounted in the movable grooves 22 to stretch, the LED chip 4 is continuously pressed downwards until the heat radiating fin 11 is attached to the top surface of the mounting plate 15, at the moment, the LED chip 4 and the heat radiating fin 11 are clamped and fixed on the top surface of the mounting plate 15 due to the direction retraction force caused by the first compression springs 20, if the LED chip 4 is detached, the heat dissipation fins 11 and the LED chip 4 may be ejected upward from the mounting board 15.
In this embodiment, for convenience in mounting the mounting plate 15 in the package base 1 and mounting the lens 2 on the package base 1, the bottom end portion of the lens 2 is fixedly provided with the sealing block 8, the outer surface of the lens 2 is fixedly provided with a group of right-angle blocks 9 which are symmetrical front and back, the side wall of the lower end portion of each right-angle block 9 is provided with a clamping hole 10, the fixed mounting of the package base 1 is provided with a clamping strip 27 which corresponds to the mounting notch 23, the outer surface of the package base 1 is provided with a group of symmetrical line holes 24, the top surface of the package base 1 is provided with a sealing groove 25, the groove inside of the sealing groove 25 is fixedly provided with a sealing ring 26, the bottom surface of the package base 1 is provided with a plurality of heat dissipation holes 28, the outer surface of the package base 1 is fixedly provided with a group of connecting blocks 29 which are symmetrical front and back, the side wall of each connecting block 29 is provided with a through spring groove 30, baffle rings 31 are fixedly arranged in notches at two ends of the spring groove 30 respectively, a second compression spring 32 is movably arranged in the spring groove 30, clamping heads 33 are fixedly arranged at two ends of the second compression spring 32 respectively, the clamping heads 33 are installed in the baffle rings 31 in a penetrating manner, when the LED chip 4 and the radiating fins 11 are both installed on the installation plate 15 in use, the installation plate 15 is installed in the encapsulation seat 1, an installation notch 23 formed on the bottom surface of the installation plate 15 is clamped on a clamping strip 27 installed in the encapsulation seat 1 in the installation process, then a connecting wire penetrates through a wire hole 24 and extends into the encapsulation seat 1, the LED chip 4 is welded together to electrify the LED chip 4, then the lens 2 is installed on the encapsulation seat 1, a right-angle block 9 installed on the lens 2 is aligned with a connecting block 29 installed on the encapsulation seat 1 in the installation process, the sealing block 8 arranged on the bottom surface of the lens 2 is clamped into the sealing groove 25 arranged on the top surface of the packaging seat 1, the sealing block 8 extrudes the sealing ring 26 arranged in the sealing groove 25 to realize the air tightness between the lens 2 and the LED chip 4 so as to prevent dust from drifting down onto the LED chip 4, the convex clamping heads 33 on two sides of the connecting block 29 are extruded by the right angle block 9 while realizing the operation, at the moment, the second compression springs 32 arranged in the spring groove 30 make retracting movement and drive the two ends to retract, so that the head parts of the clamping heads 33 are abutted against the inner wall of the right angle block 9, and then after the clamping heads 33 are not extruded by the right angle block 9 any more, the second compression springs 32 make stretching operation and push the clamping heads 33 at the two ends outwards, and the clamping heads 33 pass through the baffle ring 31 and enter the clamping holes 10 arranged on the right angle block 9 so as to mount the lens 2 onto the packaging seat 1.
It should be noted that, the present invention is a through silicon via LED package structure of a wafer level glass cavity, firstly, the LED chip 4 is mounted on the top surface of the heat dissipation fin 11, the positioning block 12 mounted on the heat dissipation fin 11 is inserted into the foot hole 7 opened on the LED chip 4 during the mounting process, then the screw 14 is screwed into the threaded hole 13 opened on the positioning block 12, so as to fix the LED chip 4 on the heat dissipation fin 11, when the LED chip 4 emits light and generates heat, the heat dissipation fin 11 continuously absorbs the heat generated by the LED chip 4 and emits the heat to the outside through the heat dissipation hole 28 opened on the bottom surface of the package base 1, then the LED chip 4 mounted on the heat dissipation fin 11 and the heat dissipation fin 11 are placed on the top surface of the mounting board 15, when this operation is performed, the heat dissipation fin 11 is located on the top surface of the four side fixture block 16 of the mounting board 15, then the LED chip 4 is pressed downwards, at this time, the four sides of the mounting plate 15 are pressed and moved outwards, the clamping blocks 16 are moved in the grooves 21 formed on the bottom surface of the mounting plate 15, the connecting holes 18 arranged on the fixed blocks 17 are moved in the movable grooves 22, the first compression springs 20 sleeved on the fixed rods 19 arranged in the movable grooves 22 are forced to do stretching movement, the LED chip 4 is continuously pressed downwards until the heat dissipation fins 11 are attached to the top surface of the mounting plate 15, at this time, the LED chip 4 and the heat dissipation fins 11 are clamped and fixed on the top surface of the mounting plate 15 due to the direction retraction force caused by the first compression springs 20, if the LED chip 4 is detached, the heat dissipation fins 11 and the LED chip 4 are ejected upwards from the mounting plate 15, finally the mounting plate 15 is arranged in the packaging seat 1, the mounting notch 23 formed on the bottom surface of the mounting plate 15 is clamped on the clamping strip 27 mounted in the packaging seat 1 in the mounting process, then the connecting wire passes through the wire hole 24 and extends into the packaging seat 1, the LED chips 4 are welded together to electrify the LED chips 4, then the lens 2 is mounted on the packaging seat 1, the right-angle block 9 mounted on the lens 2 is aligned with the connecting block 29 mounted on the packaging seat 1 in the mounting process, the sealing block 8 mounted on the bottom surface of the lens 2 is clamped in the sealing groove 25 formed on the top surface of the packaging seat 1, the sealing block 8 presses the sealing ring 26 mounted in the sealing groove 25 to realize air tightness between the lens 2 and the LED chips 4 so as to prevent dust from drifting onto the LED chips 4, when the operation is realized, the clamping heads 33 protruding from the two sides of the connecting block 29 are extruded by the right-angle blocks 9, at this time, the second compression springs 32 installed in the spring grooves 30 are retracted and drive the two ends to retract, so that the head parts of the clamping heads 33 are propped against the inner wall of the right-angle blocks 9, then after the clamping heads 33 are not extruded by the right-angle blocks 9, the second compression springs 32 are stretched and prop the clamping heads 33 at the two ends outwards, and the clamping heads 33 penetrate through the baffle rings 31 and enter the clamping holes 10 formed in the right-angle blocks 9, so that the lens 2 is installed on the packaging seat 1, and if the lens 2 is to be disassembled, only the lens 2 is required to be pulled upwards, so that the lens 2 and the packaging seat 1 are separated.
The foregoing is only illustrative of the preferred embodiments of the present invention and, although the present invention has been described in detail with reference to the foregoing embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention, and equivalents of the features may be substituted for elements thereof without departing from the true spirit and scope of the invention.
Claims (6)
1. A through silicon via LED packaging structure of a wafer level glass cavity is characterized in that: including encapsulation seat (1) and lens (2), be equipped with a set of joint mechanism (3) of fore-and-aft symmetry on the surface of encapsulation seat (1), joint mechanism (3) are including connecting block (29), backing ring (31), second compression spring (32) and chuck (33), the bottom position fixed mounting of lens (2) has sealing block (8), respectively fixed mounting have a set of right angle piece (9) of fore-and-aft symmetry on the surface of lens (2), just set up draw-in groove (10) on the lower tip position lateral wall of right angle piece (9), fixed mounting has a set of connecting block (29) of fore-and-aft symmetry on the surface of encapsulation seat (1), just set up through spring groove (30) on the lateral wall of connecting block (29), respectively fixed mounting has backing ring (31) in the both ends notch of spring groove (30), both ends fixed mounting of second compression spring (32) have chuck (33) respectively, and install in the spring groove (30), and install (16) in the lateral wall (33), mounting plate (16) are equipped with in the fixed mounting plate (17) of backing ring (6) Dead lever (19) and first compression spring (20), the top surface of mounting panel (15) is equipped with heat radiation structure (5), heat radiation structure (5) are including radiating fin (11), locating piece (12) and screw (14), the top surface of radiating fin (11) is equipped with LED chip (4).
2. The through-silicon-via LED package structure of a wafer level glass cavity of claim 1, wherein: two sets of symmetrical foot holes (7) are formed in the top surface of the LED chip (4), positioning blocks (12) corresponding to the foot holes (7) are fixedly arranged on the top surface of the radiating fin (11), the positioning blocks (12) are installed in the foot holes (7) in a penetrating mode, threaded holes (13) are formed in the top surface of the positioning blocks (12), and screws (14) are in threaded connection with the threaded holes (13).
3. The through-silicon-via LED package structure of a wafer level glass cavity of claim 2, wherein: grooves (21) are respectively formed in four sides of the bottom surface of the mounting plate (15), movable grooves (22) are respectively formed in two sides of the groove wall of the grooves (21), and a mounting notch (23) is formed between the grooves (21) which are connected with each other.
4. A through-silicon via LED package structure of a wafer level glass cavity as defined in claim 3, wherein: a fixed rod (19) is fixedly arranged in the movable groove (22), a first compression spring (20) is sleeved on the rod body of the fixed rod (19), and one end of the first compression spring (20) is fixedly arranged on the groove wall of the movable groove (22).
5. The through-silicon-via LED package structure of claim 4, wherein: fixed blocks (17) are fixedly installed on the front end portions of the side walls on the two sides of the clamping block (16), connecting holes (18) are formed in the side walls of the fixed blocks (17), the fixed blocks (17) are installed on the fixing rods (19) in a penetrating mode through the connecting holes (18), and the other ends of the first compression springs (20) are fixedly installed on the inner side walls of the fixed blocks (17).
6. The through-silicon-via LED package structure of a wafer level glass cavity of claim 5, wherein: the packaging seat (1) is fixedly provided with clamping strips (27) corresponding to the mounting openings (23), a group of symmetrical line holes (24) are formed in the outer surface of the packaging seat (1), a sealing groove (25) is formed in the top surface of the packaging seat (1), a sealing ring (26) is fixedly arranged in the sealing groove (25), and a plurality of radiating holes (28) are formed in the bottom surface of the packaging seat (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111077991.XA CN114038978B (en) | 2021-09-15 | 2021-09-15 | Through silicon via LED packaging structure of wafer level glass cavity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111077991.XA CN114038978B (en) | 2021-09-15 | 2021-09-15 | Through silicon via LED packaging structure of wafer level glass cavity |
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| Publication Number | Publication Date |
|---|---|
| CN114038978A CN114038978A (en) | 2022-02-11 |
| CN114038978B true CN114038978B (en) | 2023-07-07 |
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| CN202111077991.XA Active CN114038978B (en) | 2021-09-15 | 2021-09-15 | Through silicon via LED packaging structure of wafer level glass cavity |
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| CN117790676A (en) * | 2023-12-28 | 2024-03-29 | 广州市添鑫光电有限公司 | Flip LED packaging component |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202067790U (en) * | 2011-03-17 | 2011-12-07 | 江阴长电先进封装有限公司 | LED encapsulation structure for silicon through hole of wafer-level glass cavity |
| CN108598043A (en) * | 2018-06-08 | 2018-09-28 | 马鞍山中杰电子科技有限公司 | A kind of energy-saving diode block |
| CN210743979U (en) * | 2019-06-15 | 2020-06-12 | 永林电子有限公司 | LED chip packaging device with enhanced light emitting structure |
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| TW200834968A (en) * | 2007-02-13 | 2008-08-16 | Harvatek Corp | Method of making light-emitting diode structure with high heat dissipation effect and structure made thereby |
| EP2881647B1 (en) * | 2012-07-23 | 2018-05-23 | Guizhou Guangpusen Photoelectric Co., Ltd | Universal-led-bulb construction method, clamping-ring-structured led bulb, and led lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202067790U (en) * | 2011-03-17 | 2011-12-07 | 江阴长电先进封装有限公司 | LED encapsulation structure for silicon through hole of wafer-level glass cavity |
| CN108598043A (en) * | 2018-06-08 | 2018-09-28 | 马鞍山中杰电子科技有限公司 | A kind of energy-saving diode block |
| CN210743979U (en) * | 2019-06-15 | 2020-06-12 | 永林电子有限公司 | LED chip packaging device with enhanced light emitting structure |
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