CN209843743U - Light-emitting diode light source module - Google Patents
Light-emitting diode light source module Download PDFInfo
- Publication number
- CN209843743U CN209843743U CN201920601943.8U CN201920601943U CN209843743U CN 209843743 U CN209843743 U CN 209843743U CN 201920601943 U CN201920601943 U CN 201920601943U CN 209843743 U CN209843743 U CN 209843743U
- Authority
- CN
- China
- Prior art keywords
- light source
- emitting diode
- source module
- heat dissipation
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 230000017525 heat dissipation Effects 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 5
- 235000017166 Bambusa arundinacea Nutrition 0.000 abstract description 13
- 235000017491 Bambusa tulda Nutrition 0.000 abstract description 13
- 241001330002 Bambuseae Species 0.000 abstract description 13
- 235000015334 Phyllostachys viridis Nutrition 0.000 abstract description 13
- 239000011425 bamboo Substances 0.000 abstract description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model relates to a light source module technical field just discloses a light emitting diode light source module, including base plate and the LED chip and the hemisphere packaging structure of setting at the base plate upper surface, the upper surface center department of base plate has seted up T shape jack, the wide portion of T shape jack is pegged graft and is had with it matched with to place a section of thick bamboo, the fixed inside of placing a section of thick bamboo that sets up of LED chip, the narrow portion of T shape jack is pegged graft and is had matched with spliced pole with it, the upper end of spliced pole and the bobbin base department fixed connection of placing a section of thick bamboo, the lower surface of base plate is equipped with the heating panel, the setting can be dismantled with the lower extreme of spliced pole to the heating panel. The utility model discloses not only can guarantee that the bottom of emitting diode chip can effectively conduct heat, make its perisporium also can obtain effectual heat of conducting moreover, prolong emitting diode's life.
Description
Technical Field
The utility model relates to a light source module technical field especially relates to a light emitting diode light source module.
Background
Currently, Light Emitting Diodes (LEDs) have been replacing Cold Cathode Fluorescent Lamps (CCFLs) as Light Emitting elements of lighting devices due to their characteristics of good Light quality (i.e., spectrum of Light source output) and high Light Emitting efficiency.
At present, the problem of poor heat dissipation mainly exists in the light-emitting diode, and the service life of the light-emitting diode can be obviously shortened due to the higher temperature. The existing light-emitting diode mainly conducts heat to the light-emitting diode chip through the heat dissipation fins, but the existing heat dissipation fins can only be arranged in contact with the bottom of the light-emitting diode chip, the heat dissipation around the existing heat dissipation fins cannot be effectively conducted, and the high-power light-emitting diode chip is often damaged in an accelerated manner. Therefore, the utility model provides a light emitting diode light source module.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the problem of poor heat dissipation effect of the light emitting diode in the prior art and providing a light emitting diode light source module.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a light-emitting diode light source module, includes the base plate and sets up LED chip and the hemisphere packaging structure at the base plate upper surface, T shape jack has been seted up to the upper surface center department of base plate, the wide section of thick bamboo of inserting of T shape has with it matched with to place a section of thick bamboo, the fixed inside of placing a section of thick bamboo that sets up of LED chip, the narrow part of T shape jack is inserted and is had with it matched with spliced pole, the upper end of spliced pole and the bobbin base department fixed connection of placing a section of thick bamboo, the lower surface of base plate is equipped with the heating panel, the setting can be dismantled with the lower extreme of spliced pole to the.
Preferably, the center of the upper surface of the heat dissipation plate is vertically and fixedly provided with a screw, a threaded blind hole is formed in the position, corresponding to the screw, of the lower end of the connecting column, and the screw is in threaded connection with the connecting column through the threaded blind hole.
Preferably, the cross section of the wide part of the T-shaped jack is circular, the cross section of the narrow part of the T-shaped jack is square, and the cross section of the connecting column is square.
Preferably, a plurality of first heat dissipation holes are uniformly distributed in the barrel wall and the barrel bottom of the placing barrel.
Preferably, the lower surface of the heat dissipation plate is provided with a plurality of second heat dissipation holes which are uniformly distributed.
Preferably, the placing cylinder, the connecting column and the heat dissipation plate are all made of graphite.
Compared with the prior art, the utility model provides a light emitting diode light source module possesses following beneficial effect:
1. according to the LED light source module, the LED chips are arranged inside the placing cylinder, so that the bottom of each LED chip can effectively conduct heat, the peripheral wall of each LED chip can also effectively conduct heat, heat inside the hemispherical packaging structure can be quickly dissipated through the connecting columns and the heat dissipation plates arranged below the placing cylinder, and the service life of each LED is prolonged;
2. this emitting diode light source module through setting up the screw rod on the heating panel and setting up the screw thread blind hole on the spliced pole, can realize that heating panel and spliced pole can dismantle the setting to can dismantle emitting diode chip and base plate.
The part that does not relate to in the device all is the same with prior art or can adopt prior art to realize, the utility model discloses the bottom that not only can guarantee the light emitting diode chip can effectively conduct heat, makes its perisporium also can obtain effectual heat of conducting moreover, has prolonged light emitting diode's life.
Drawings
Fig. 1 is a schematic structural diagram of an led light source module according to the present invention;
FIG. 2 is a schematic top view of the placement cartridge of FIG. 1;
fig. 3 is a schematic bottom view of the connecting column of fig. 1.
In the figure: the LED packaging structure comprises a substrate 1, a light emitting diode chip 2, a hemispheric packaging structure 3, a 4T-shaped jack, a placing barrel 5, a connecting column 6, a heat dissipation plate 7, a screw rod 8, a first heat dissipation hole 9, a threaded blind hole 10 and a second heat dissipation hole 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Referring to fig. 1-3, a light emitting diode light source module, including base plate 1 and light emitting diode chip 2 and hemisphere packaging structure 3 of setting at base plate 1 upper surface, T shape jack 4 has been seted up to base plate 1's upper surface center department, the wide portion of T shape jack 4 is pegged graft and is had a matched with section of thick bamboo 5 of placing with it, light emitting diode chip 2 is fixed to be set up in the inside of placing section of thick bamboo 5, the narrow portion of T shape jack 4 is pegged graft and is had matched with spliced pole 6 with it, the upper end of spliced pole 6 and the section of thick bamboo bottom department fixed connection of placing section of thick bamboo 5, the lower surface of base plate 1 is equipped with heating panel 7, heating panel 7.
The screw 8 is vertically and fixedly arranged at the center of the upper surface of the heat dissipation plate 7, a threaded blind hole 10 is formed in the position, corresponding to the screw 8, of the lower end of the connecting column 6, and the screw 8 is in threaded connection with the connecting column 6 through the threaded blind hole 10.
The cross section of the wide part of the T-shaped jack 4 is circular, the cross section of the narrow part of the T-shaped jack 4 is square, and the cross section of the connecting column 6 is square, so that the phenomenon that the screw 8 drives the connecting column 6 to rotate together when the heat dissipation plate 7 rotates can be avoided.
The barrel wall and the barrel bottom of the placing barrel 5 are provided with a plurality of first radiating holes 9 which are evenly distributed, and the first radiating holes 9 can increase the contact area of heat emitted by the placing barrel 5 and the light-emitting diode chip 2, so that the radiating effect of the light-emitting diode chip is improved.
The lower surface of the heat dissipation plate 7 is provided with a plurality of second heat dissipation holes 11 which are uniformly distributed, and the second heat dissipation holes 11 can increase the contact area between the heat dissipation plate 7 and the outside air.
The placing barrel 5, the connecting column 6 and the heat dissipation plate 7 are all made of graphite, and the graphite is good in heat conduction effect and insulating.
The utility model discloses in, during the use, through setting up LED chip 3 in the inside of placing a section of thick bamboo 5, not only can guarantee that LED chip 3's bottom can effectively conduct heat, and make its perisporium also can obtain effectual heat that conducts, through setting up spliced pole 6 and the heating panel 7 of placing a section of thick bamboo 5 below, can spill the inside heat of hemisphere form packaging structure 3 fast, LED's life has been prolonged, through setting up screw rod 8 on heating panel 7 and the screw thread blind hole of setting on spliced pole 6, can realize heating panel 7 and spliced pole 6 can dismantle the setting, thereby can dismantle LED chip 2 and base plate 1.
Claims (5)
1. A light-emitting diode light source module comprises a substrate (1), and a light-emitting diode chip (2) and a hemispheric packaging structure (3) which are arranged on the upper surface of the substrate (1), and is characterized in that: the LED light source is characterized in that a T-shaped jack (4) is formed in the center of the upper surface of the substrate (1), a matched placing barrel (5) is inserted into a wide part of the T-shaped jack (4), the LED chip (2) is fixedly arranged inside the placing barrel (5), a matched connecting post (6) is inserted into a narrow part of the T-shaped jack (4), the upper end of the connecting post (6) is fixedly connected with the barrel bottom of the placing barrel (5), a heat dissipation plate (7) is arranged on the lower surface of the substrate (1), and the heat dissipation plate (7) and the lower end of the connecting post (6) are detachably arranged.
2. The led light source module as claimed in claim 1, wherein: the upper surface center department of heating panel (7) is vertical fixed to be equipped with screw rod (8), screw thread blind hole (10) have been seted up with the position department of corresponding of screw rod (8) to the lower extreme of spliced pole (6), screw rod (8) are through screw thread blind hole (10) and spliced pole (6) threaded connection.
3. The led light source module as claimed in claim 1, wherein: the cross section of the wide part of the T-shaped jack (4) is circular, the cross section of the narrow part of the T-shaped jack (4) is square, and the cross section of the connecting column (6) is square.
4. The led light source module as claimed in claim 1, wherein: the barrel wall and the barrel bottom of the placing barrel (5) are provided with a plurality of first heat dissipation holes (9) which are uniformly distributed.
5. The led light source module as claimed in claim 1, wherein: the lower surface of the heat dissipation plate (7) is provided with a plurality of second heat dissipation holes (11) which are uniformly distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920601943.8U CN209843743U (en) | 2019-04-29 | 2019-04-29 | Light-emitting diode light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920601943.8U CN209843743U (en) | 2019-04-29 | 2019-04-29 | Light-emitting diode light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209843743U true CN209843743U (en) | 2019-12-24 |
Family
ID=68914578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920601943.8U Expired - Fee Related CN209843743U (en) | 2019-04-29 | 2019-04-29 | Light-emitting diode light source module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209843743U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707796A (en) * | 2021-10-22 | 2021-11-26 | 深圳市两岸光电科技有限公司 | Wafer-level LED packaging structure capable of dissipating heat |
-
2019
- 2019-04-29 CN CN201920601943.8U patent/CN209843743U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113707796A (en) * | 2021-10-22 | 2021-11-26 | 深圳市两岸光电科技有限公司 | Wafer-level LED packaging structure capable of dissipating heat |
| CN113707796B (en) * | 2021-10-22 | 2022-01-28 | 深圳市两岸光电科技有限公司 | Wafer-level LED packaging structure capable of dissipating heat |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191224 Termination date: 20200429 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |