CN114992604A - LED module with low heat radiation structure that deforms - Google Patents
LED module with low heat radiation structure that deforms Download PDFInfo
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- CN114992604A CN114992604A CN202210816547.3A CN202210816547A CN114992604A CN 114992604 A CN114992604 A CN 114992604A CN 202210816547 A CN202210816547 A CN 202210816547A CN 114992604 A CN114992604 A CN 114992604A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 102
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/105—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using magnets
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED module with a low-deformation heat dissipation structure, belonging to the field of LED modules, the LED module with the low-deformation heat dissipation structure is characterized in that a heat dissipation action cavity is arranged in an LED module body, a plurality of heat dissipation holes communicated with the heat dissipation action cavity are arranged at the lower end of the LED module body, the LED module body can generate heat absorption deformation when generating higher heat through the cooperation of a thermal deformation bag, a phase change reaction retaining plate, a heat conduction support sleeve and a heat dissipation linkage strip, the heat generated by the LED module body is subjected to thermal deformation absorption, the heat accumulated in the LED module body is discharged through the heat dissipation holes under the deformation action of the thermal deformation bag and the heat conduction support sleeve, further the concentration of the heat in the LED module body is effectively avoided, the heat dissipation effect of the LED module body is improved, and the probability of deformation of a power supply device in the LED module body caused by heating can be effectively reduced, reduce the heat damage of the led module body and prolong the service life of the led module body.
Description
Technical Field
The invention relates to the field of led modules, in particular to an led module with a low-deformation heat dissipation structure.
Background
The led module is a product which is widely applied in led products, and has great difference in structure and electronics, namely, the led module is formed by simply using a circuit board and a shell which are provided with the led, and the led module is more complicated and has better service life and luminous intensity due to the addition of a plurality of controls, constant current sources and related heat dissipation treatment.
The LED module can be divided into a small power (below 0.3W), a medium power (0.3-0.5W) and a large power (1W and above) according to the power of a single LED, the high-power module is higher in brightness than the small power, the service life is longer, the whole LED lighting development trend is later, the LED module is more practical, and in order to prolong the service life of the LED module and improve the durability of the LED module, a plurality of monomer lamp beads in most LED modules are electrically connected in a parallel mode.
In the continuous use process of the LED module, the LED module can generate corresponding heat while illuminating, the heat dissipation treatment of the existing LED module generally uses structures such as heat conduction fins to carry out heat conduction and heat dissipation on the LED module, but because the thickness of components in the LED module is thinner, the efficiency of common heat conduction and heat dissipation is lower, the structures in the LED module are easy to deform under the long-time thermal action, and further the operation fault of the LED module is easy to cause, the function damage of the LED module is caused, and the service life of the LED module is shortened.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide an led module with a low-deformation heat dissipation structure, which can generate heat absorption deformation when the led module body generates high heat through the cooperation of a heat deformation bag, a phase change reaction retaining plate, a heat conduction support sleeve and a heat dissipation linkage strip, can absorb the heat generated by the led module body through thermal deformation, and can also discharge the heat accumulated in the led module body through a heat dissipation hole under the deformation action of the heat deformation bag and the heat conduction support sleeve, so that the concentration of the heat in the led module body is effectively avoided, the heat dissipation effect of the led module body is improved, the probability that a power supply device in the led module body is deformed due to heating can be effectively reduced, the heat damage of the led module body is reduced, and the service life of the led module body is prolonged.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
An LED module with a low-deformation heat dissipation structure comprises an LED module body, wherein a heat dissipation action cavity is formed in the LED module body, a plurality of heat dissipation holes communicated with the heat dissipation action cavity are formed in the lower end of the LED module body, a thermal deformation bag is fixedly connected to the upper inner wall of the heat dissipation action cavity, a plurality of heat conduction support sleeves communicated with the thermal deformation bag are fixedly connected to the lower end of the thermal deformation bag, the heat conduction support sleeves are matched with the heat dissipation holes, a phase change reaction retaining plate is fixedly connected to the upper inner wall of the thermal deformation bag, a plurality of heat dissipation linkage strips matched with the heat conduction support sleeves are fixedly connected to the lower end of the phase change reaction retaining plate, and through the matching of the thermal deformation bag, the phase change reaction retaining plate, the heat conduction support sleeves and the heat dissipation linkage strips, heat absorption deformation can be generated when the LED module body generates high heat, and heat deformation absorption can be performed on the heat generated by the LED module body, still discharge through the louvre under the effect that thermal deformation bag and heat-conduction branch cover deformed and pile up the heat inside the led module body, and then effectively avoid the inside thermal concentration of led module body, when having improved the radiating effect of led module body, can also effectively reduce this internal power supply unit of led module and be heated the probability that produces deformation, reduce the heat damage of led module body, improve the life of led module body.
Furthermore, the thermal deformation bag is filled with thermal expansion gas, and the thermal expansion gas can effectively promote the deformation of the thermal deformation bag when absorbing heat, thereby improving the deformation heat dissipation effect of the thermal deformation bag and the instantaneous heat dissipation efficiency.
Further, inner wall fixed connection contact heating panel under the heat-conduction brace, and contact heating panel upper end and heat dissipation linkage strip fixed connection, led module body lower extreme fixedly connected with radiating fin seat, the heat dissipation of contact heating panel through heat-conduction brace and radiating fin seat cooperation, the cooperation of contact heating panel and heat dissipation linkage strip can be directly turned into heat-conduction formula heat dissipation with original air cooling after thermal deformation bag and heat-conduction brace produce deformation, improves the area that this internal power supply unit of led module is direct and radiating fin seat or external contact, and then effectively reduces the inside direct heat dissipation of led module body, and the heat conduction step improves the radiating efficiency, and then effectively protects led module body, improves its life, reduces its maintenance cost.
Further, the deformation spring in the heat dissipation linkage strip outside is established to inner wall fixedly connected with cover under the heat-conduction branch cover, deformation spring upper end and phase transition reaction keep plate fixed connection, and the deformation spring can be after the heat dissipation is accomplished, effectively supplementary heat-conduction branch cover action of reseing, improves the reuse rate of thermal deformation bag and heat-conduction branch cover, effectively keeps the radiating cyclicity of led module body.
Furthermore, the elastic deformation coefficient of the thermal deformation bag is smaller than that of the thermal conduction branch sleeve, so that the thermal deformation bag deforms in advance of the thermal conduction branch sleeve, the exhaust efficiency of the thermal deformation bag during deformation is effectively improved, and the heat dissipation efficiency is improved.
Further, a linkage cavity is formed in the heat dissipation linkage strip, a limiting fixed rod is fixedly connected to the inner wall of the linkage cavity, an adsorption conical groove is formed in the upper end of the limiting fixed rod, a reaction ejector rod is slidably connected to the upper end of the heat dissipation linkage strip, the lower end of the reaction ejector rod extends into the linkage cavity, a limiting conical block is fixedly connected to the adsorption conical block, the adsorption conical block is matched with the adsorption conical groove, the adsorption conical groove is matched with the adsorption conical block, the phase change reaction retaining plate can act according to the forming degree of the heat dissipation linkage strip, and when the temperature of the led module body is high, the reverse extrusion effect of the phase change reaction retaining plate on the electric components inside the led module body is maintained, the probability of deformation of the phase change retaining plate is effectively reduced, and the fault rate of the led module body is reduced.
Further, adsorb the strong magnetism of inner wall fixedly connected with and adsorb the piece under the awl groove, adsorb spacing awl piece lower extreme fixedly connected with iron magnetism and adsorb the piece, adsorb the awl groove and adsorb spacing awl piece through strong magnetism adsorption block, be convenient for adsorb the locking of awl groove to adsorbing spacing awl piece for the reaction ejector pin can not produce the backward extrusion effect to phase transition reaction holding plate when normal temperature, effectively keeps the stability of the inside electrical components of led module body.
Furthermore, adsorb spacing awl piece lower extreme and offer and adsorb awl groove matched with guide cone angle, adsorb spacing awl piece and adopt elastic material to make, can effectively improve the cooperation efficiency who adsorbs spacing awl piece and adsorb the awl groove, improve its complex smooth degree, reduce the cooperation wearing and tearing, improve life.
Further, board is decided in reaction ejector pin outer end fixedly connected with reaction, board upper end fixedly connected with reaction spring is decided in the reaction, reaction spring upper end and heat dissipation linkage strip fixed connection, reaction spring can be after adsorbing the taper groove and adsorbing spacing awl piece unblock, keep the ascending extrusion force of balanced balance to the reaction ejector pin, effectively keep reaction ejector pin effect.
Further, the phase change reaction keeps the board upper end and has seted up the reaction and keeps the groove, reaction ejector pin upper end extends to the reaction and keeps the inslot to fixedly connected with reaction stripper plate, reaction stripper plate and reaction keep groove sliding connection, reaction ejector pin is through driving the slip of reaction stripper plate in keeping the inslot, effectively changes the atmospheric pressure between phase change reaction stripper plate and the thermal deformation bag, is convenient for prevent deformation protection to led module body.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) this scheme is through the thermal deformation bag, phase transition reaction keeper, the cooperation of heat-conduction branch cover and heat dissipation linkage strip, can produce heat absorption deformation when the led module body produces higher heat, can carry out thermal deformation absorption to the heat that led module body produced, still discharge through the louvre under the effect that thermal deformation bag and heat-conduction branch cover deformed and pile up at the inside heat of led module body, and then effectively avoid the inside thermal concentration of led module body, when having improved the radiating effect of led module body, can also effectively reduce this internal power device of led module and be heated the probability that produces deformation, reduce the heat damage of led module body, improve the life of led module body.
(2) The thermal expansion gas can effectively promote the deformation amount of the thermal deformation bag while absorbing heat, improve the deformation heat dissipation effect of the thermal deformation bag and improve the instantaneous heat dissipation efficiency of the thermal deformation bag.
(3) The cooperation of contact heating panel and heat dissipation linkage strip can produce the deformation back at thermal deformation bag and heat-conduction branch cover, directly turn into the heat-conduction formula heat dissipation with original air cooling, improve the area that this internal power device of led module is direct and heat dissipation fin seat or external contact, and then effectively directly dispel the heat to led module body inside, reduce the heat conduction step, improve the radiating efficiency, and then effectively protect led module body, improve its life, reduce its maintenance cost.
(4) The deformation spring can effectively assist the heat-conduction branch cover to reset after the heat dissipation is accomplished, improves the reuse rate of thermal deformation bag and heat-conduction branch cover, effectively keeps the radiating cyclicity of led module body.
(5) Adsorb the taper groove and adsorb the cooperation of spacing awl piece, can produce the effect to phase transition reaction holding plate according to the formation degree of heat dissipation linkage strip, can keep phase transition reaction holding plate to the backward extrusion effect of the inside electrical components of led module body when this internal temperature of led module is higher, effectively reduced its probability that produces deformation, reduce the fault rate of led module body.
(6) The adsorption taper groove can adsorb the adsorption limiting taper block through the strong magnetic adsorption block, the adsorption taper groove is convenient for locking the adsorption limiting taper block, the reverse action ejector rod can not generate reverse extrusion action on the phase change reverse action retaining plate when the normal temperature is reached, and the stability of an electric component inside the LED module body is effectively maintained.
(7) The reaction ejector rod effectively changes the air pressure between the phase change reaction retaining plate and the thermal deformation bag by driving the reaction extrusion plate to slide in the retaining groove, so that the deformation prevention protection is conveniently carried out on the LED module body.
Drawings
FIG. 1 is a schematic view of an axial structure of an led module body according to the present invention;
FIG. 2 is a schematic view of the fitting axial structure of the led module body and the thermal deformation capsule according to the present invention;
FIG. 3 is a schematic structural diagram illustrating a thermal deformation process of the thermal deformation bladder according to the present invention;
FIG. 4 is a schematic cross-sectional view of a main body of an LED module without heat dissipation according to the present invention;
FIG. 5 is a schematic diagram of the structure at A in FIG. 4 according to the present invention;
FIG. 6 is a schematic cross-sectional view of a heat dissipation linkage bar without heat dissipation according to the present invention;
FIG. 7 is a schematic cross-sectional view of a main body of an LED module according to the present invention;
FIG. 8 is a schematic view of the structure of FIG. 7 at B in accordance with the present invention;
FIG. 9 is a schematic cross-sectional view of a main body of an LED module according to the present invention;
FIG. 10 is a schematic view of the structure of FIG. 9 at C;
fig. 11 is a schematic cross-sectional view of a heat dissipation linkage bar during heat dissipation reaction according to the present invention.
The reference numbers in the figures illustrate:
1led module body, 101 louvres, 102 heat dissipation effect chamber, 2 heat dissipation fin seats, 3 thermal deformation bags, 4 phase transition reaction keep plate, 5 heat-conduction support sleeve, 501 contact heating panel, 502 deformation spring, 6 heat dissipation linkage strip, 601 linkage chamber, 7 spacing fixed rod, 701 adsorption cone groove, 702 reaction ejector pin, 703 adsorption spacing cone block, 704 reaction spring, 705 reaction fixed plate.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is to be understood that the embodiments described are merely exemplary embodiments, rather than exemplary embodiments, and that all other embodiments may be devised by those skilled in the art without departing from the scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-11, an led module with a low deformation heat dissipation structure comprises an led module body 1, a heat dissipation chamber 102 is formed in the led module body 1, a plurality of heat dissipation holes 101 communicated with the heat dissipation chamber 102 are formed at the lower end of the led module body 1, a thermal deformation bladder 3 is fixedly connected to the inner wall of the heat dissipation chamber 102, a plurality of thermal conduction support sleeves 5 communicated with the thermal deformation bladder 3 are fixedly connected to the lower end of the thermal deformation bladder 3, the thermal conduction support sleeves 5 are matched with the heat dissipation holes 101, a phase change reaction retaining plate 4 is fixedly connected to the inner wall of the thermal deformation bladder 3, a plurality of heat dissipation linkage strips 6 matched with the thermal conduction support sleeves 5 are fixedly connected to the lower end of the phase change reaction retaining plate 4, and through the cooperation of the thermal deformation bladder 3, the phase change reaction retaining plate 4, the thermal conduction support sleeves 5 and the heat dissipation linkage strips 6, heat absorption deformation can be generated when the led module body 1 generates high heat, can carry out thermal deformation to the heat that led module body 1 produced and absorb, still discharge through louvre 101 under the effect that thermal deformation bag 3 and heat-conduction branch cover 5 deform and pile up at the inside heat of led module body 1, and then effectively avoid the inside thermal concentration of led module body 1, when having improved the radiating effect of led module body 1, can also effectively reduce the probability that the power supply unit in led module body 1 is heated and produces deformation, reduce the thermal damage of led module body 1, improve the life of led module body 1.
Referring to fig. 1-4, 7 and 9, the thermal deformation bag 3 is filled with a thermal expansion gas, which may be an inert gas such as carbon dioxide, and the thermal expansion gas absorbs heat while effectively promoting the deformation amount of the thermal deformation bag 3, improving the deformation heat dissipation effect of the thermal deformation bag 3, and improving the instantaneous heat dissipation efficiency thereof.
Referring to fig. 4-11, the lower inner wall of the heat-conducting support sleeve 5 is fixedly connected with the contact heat-dissipating plate 501, the upper end of the contact heat-dissipating plate 501 is fixedly connected with the heat-dissipating linkage bar 6, the lower end of the led module body 1 is fixedly connected with the heat-dissipating fin seat 2, the contact heat-dissipating plate 501 is matched with the heat-dissipating fin seat 2 through the heat-conducting support sleeve 5 to dissipate heat, and the contact heat-dissipating plate 501 is matched with the heat-dissipating linkage bar 6 to directly convert the original air cooling into heat-conducting heat dissipation after the thermal deformation bag 3 and the heat-conducting support sleeve 5 deform, so that the area of the power device in the led module body 1 directly contacting with the heat-dissipating fin seat 2 or the outside is increased, thereby effectively dissipating heat directly inside the led module body 1, reducing the heat-conducting step, increasing the heat-dissipating efficiency, further effectively protecting the led module body 1, increasing the service life thereof and reducing the maintenance cost thereof.
Referring to fig. 1-11, the lower inner wall of the heat-conducting support sleeve 5 is fixedly connected with a deformation spring 502 sleeved outside the heat-dissipating linkage bar 6, the upper end of the deformation spring 502 is fixedly connected with the phase-change reaction retaining plate 4, and the deformation spring 502 can effectively assist the heat-conducting support sleeve 5 to perform a reset action after heat dissipation is completed, so that the recycling rate of the heat-deforming bag 3 and the heat-conducting support sleeve 5 is improved, and the heat-dissipating cyclability of the led module body 1 is effectively maintained.
Referring to fig. 4-10, the elastic deformation coefficient of the thermal deformation bag 3 is smaller than that of the thermal conduction support sleeve 5, so that the thermal deformation bag 3 deforms before the thermal conduction support sleeve 5, thereby effectively improving the exhaust efficiency of the thermal deformation bag 3 during deformation and improving the heat dissipation efficiency.
Referring to fig. 6 and 11, a linkage cavity 601 is formed in the heat dissipation linkage strip 6, a limiting fixing rod 7 is fixedly connected to the lower inner wall of the linkage cavity 601, an adsorption conical groove 701 is fixedly connected to the upper end of the limiting fixing rod 7, a reaction ejector rod 702 is slidably connected to the upper end of the heat dissipation linkage strip 6, the lower end of the reaction ejector rod 702 extends into the linkage cavity 601, an adsorption limiting conical block 703 is fixedly connected to the lower inner wall of the linkage cavity, the adsorption limiting conical block 703 is matched with the adsorption conical groove 701, the adsorption conical groove 701 and the adsorption limiting conical block 703 are matched with each other, and the phase change reaction retaining plate 4 can be acted according to the forming degree of the heat dissipation linkage strip 6, so that the reverse extrusion action of the phase change reaction retaining plate 4 on the electric components inside the led module body 1 can be kept when the temperature inside the led module body 1 is high, the probability of deformation of the phase change reaction retaining plate 4 on the electric components inside the led module body 1 is effectively reduced, and the failure rate of the led module body 1 is reduced.
Referring to fig. 6 and 11, the inner wall is fixedly connected with the strong magnetic adsorption block under the adsorption cone groove 701, the lower end of the adsorption limit cone block 703 is fixedly connected with the iron magnetic adsorption sheet, the adsorption cone groove 701 can adsorb the adsorption limit cone block 703 through the strong magnetic adsorption block, so that the adsorption cone groove 701 can lock the adsorption limit cone block 703, the reaction ejector rod 702 can not generate a reverse extrusion effect on the phase change reaction retaining plate 4 at normal temperature, and the stability of the electric components inside the led module body 1 is effectively maintained.
Referring to fig. 6 and 11, the lower end of the adsorption limiting conical block 703 is provided with a guide cone angle matched with the adsorption conical groove 701, and the adsorption limiting conical block 703 is made of an elastic material, so that the matching efficiency of the adsorption limiting conical block 703 and the adsorption conical groove 701 can be effectively improved, the matching smoothness of the adsorption limiting conical block 703 and the adsorption conical groove can be improved, the matching abrasion can be reduced, and the service life can be prolonged.
Referring to fig. 6 and 11, the outer end of the reaction ejector rod 702 is fixedly connected with a reaction fixed plate 705, the upper end of the reaction fixed plate 705 is fixedly connected with a reaction spring 704, the upper end of the reaction spring 704 is fixedly connected with the heat dissipation linkage bar 6, and the reaction spring 704 can keep constant upward extrusion force on the reaction ejector rod 702 after the adsorption conical groove 701 and the adsorption limiting conical block 703 are unlocked, so that the action effect of the reaction ejector rod 702 is effectively kept.
Referring to fig. 6 and 11, a reaction retaining groove is formed in the upper end of the phase change reaction retaining plate 4, the upper end of the reaction ejector rod 702 extends into the reaction retaining groove, and is fixedly connected with a reaction extrusion plate, the reaction extrusion plate is slidably connected with the reaction retaining groove, and the reaction ejector rod 702 drives the reaction extrusion plate to slide in the retaining groove, so that the air pressure between the phase change reaction retaining plate 4 and the thermal deformation bag 3 is effectively changed, and the deformation prevention protection of the led module body 1 is facilitated.
Referring to fig. 1-11, in the continuous use process of the led module body 1, the temperature inside the led module body is continuously raised, when the heat dissipation of the heat dissipation fin base 2 is not ideal, the thermal deformation bag 3 and the thermal expansion gas inside the thermal deformation bag generate deformation after absorbing heat, the thermal deformation bag 3 continuously deforms and moves downward, so that the gas in the chamber 302 moves downward through the heat dissipation hole 101 and is exhausted through the installation gap between the led module body 1 and the heat dissipation fin base 2, and the heat exchange efficiency is effectively increased; then in the continuous thermal deformation process, the heat dissipation effect is not ideal, so that the thermal expansion gas continuously expands to act on the heat conduction branch sleeve 5, the heat conduction branch sleeve 5 generates thermal expansion deformation, continuously approaches the heat dissipation fin seat 2 and is in contact with the heat dissipation fin seat 2, and the heat in the led module body 1 is exchanged through the direct conduction of the heat conduction branch sleeve 5 and the heat dissipation linkage strip 6, so that the heat dissipation efficiency is improved; and when the heat dissipation linkage strip 6 deforms synchronously, the limit fixing rod 7 moves downwards continuously, so that the adsorption conical groove 701 generates pulling deformation force on the adsorption limit conical block 703, when the downward pulling deformation force is larger than the deformation force and the adsorption force of the adsorption limiting conical block 703, the adsorption limiting conical block 703 deforms and slides out of the adsorption conical groove 701, the adsorption conical groove 701 is unlocked from locking the adsorption limiting conical block 703, and the reaction spring 704 generates a reset action, the reaction ram 702 is driven upward by the reaction stator plate 705, causing the reaction ram 702 to push the sliding of the reaction compression plate within the retention slot, the air pressure between the phase change reaction retaining plate 4 and the thermal deformation bag 3 is pressurized, so that the thermal deformation bag 3 generates upward extrusion force to act on the electric components in the led module body 1 to retain the deformation of the electric components, and the thermal deformation damage of the electric components is effectively avoided;
after the heat dissipation is finished, the thermal deformation bag 3 and the thermal expansion gas generate recovery deformation, and the thermal conduction support sleeve 5 is assisted to reset under the cooperation of the deformation spring 502, at the moment, the thermal deformation bag 3 and the thermal conduction support sleeve 5 continuously reset, the heat dissipation linkage strip 6 also recovers deformation, the limiting and fixing rod 7 is driven to move upwards, the adsorption conical groove 701 continuously moves upwards to be close to the adsorption limiting conical block 703, the ferromagnetic adsorption piece at the lower end of the adsorption limiting conical block 703 generates magnetic adsorption through the strong magnetic adsorption block inside the adsorption conical block, so that the adsorption limiting conical block 703 slides into the adsorption conical groove 701 under the actions of cone angle guiding, magnetic adsorption and self deformation, then the reaction spring 704 is pulled through the reaction ejector rod 702 and the reaction fixing plate, the reaction extrusion plate is driven to reset through the reaction ejector rod 702, and the reaction extrusion plate 705 is contacted with the extrusion action of the electric components inside the tube 1; the adsorption cone groove 701 and the adsorption limiting cone block 703 are matched to act on the phase change reaction retaining plate 4 according to the forming degree of the heat dissipation linkage strip 6, so that when the temperature in the led module body 1 is high, the reverse extrusion action of the phase change reaction retaining plate 4 on the electric components in the led module body 1 is maintained, the probability of deformation of the phase change reaction retaining plate 4 is effectively reduced, the failure rate of the led module body 1 is reduced, through the matching of the thermal deformation bag 3, the phase change reaction retaining plate 4, the heat conduction support sleeve 5 and the heat dissipation linkage strip 6, the thermal absorption deformation can be generated when the led module body 1 generates high heat, the heat generated by the led module body 1 can be subjected to thermal deformation absorption, the heat accumulated in the led module body 1 is discharged through the heat dissipation holes 101 under the deformation action of the thermal deformation bag 3 and the heat conduction support sleeve 5, and the concentration of the heat in the led module body 1 is effectively avoided, when having improved led module body 1's radiating effect, can also effectively reduce the probability that the power device in the led module body 1 is heated and produces deformation, reduce led module body 1's heat damage, improve led module body 1's life.
The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (10)
1. The utility model provides a led module with low heat radiation structure that deforms, includes led module body (1), its characterized in that: seted up thermolysis chamber (102) in led module body (1), a plurality of louvres (101) of putting through mutually with thermolysis chamber (102) are seted up to led module body (1) lower extreme, inner wall fixedly connected with thermal deformation bag (3) on thermolysis chamber (102), thermal deformation bag (3) lower extreme fixedly connected with a plurality of rather than thermal-conduction branch cover (5) of putting through mutually, and thermal-conduction branch cover (5) and louvre (101) cooperation, inner wall fixedly connected with phase transition counteraction keeper (4) on thermal deformation bag (3), phase transition counteraction keeper (4) lower extreme fixedly connected with a plurality of and thermal-conduction branch cover (5) matched with heat dissipation linkage strip (6).
2. An led module with low deformation heat dissipation structure as claimed in claim 1, wherein: and the thermal deformation bag (3) is filled with thermal expansion gas.
3. An led module with low deformation heat dissipation structure as claimed in claim 2, wherein: inner wall fixed connection contact heating panel (501) under heat-conduction journal bushing (5), and contact heating panel (501) upper end and heat dissipation linkage strip (6) fixed connection, led module body (1) lower extreme fixedly connected with radiating fin seat (2), contact heating panel (501) dispels the heat through heat-conduction journal bushing (5) and radiating fin seat (2) cooperation.
4. An led module with a low distortion heat dissipation structure as claimed in claim 1, wherein: the heat-conducting branch cover (5) is lower, and the inner wall fixedly connected with cover is established at deformation spring (502) in the heat dissipation linkage strip (6) outside, deformation spring (502) upper end and phase transition reaction keep plate (4) fixed connection.
5. An led module with low deformation heat dissipation structure as claimed in claim 1, wherein: the elastic deformation coefficient of the thermal deformation capsule (3) is smaller than that of the thermal conduction branch sleeve (5).
6. An led module with low deformation heat dissipation structure as claimed in claim 1, wherein: linkage chamber (601) have been seted up in heat dissipation linkage strip (6), linkage chamber (601) lower inner wall fixedly connected with spacing fixed rod (7), spacing fixed rod (7) upper end fixedly connected with adsorbs taper groove (701), heat dissipation linkage strip (6) upper end sliding connection has reaction ejector pin (702), reaction ejector pin (702) lower extreme extends to in linkage chamber (601) to fixedly connected with adsorbs spacing awl piece (703), and adsorbs spacing awl piece (703) and adsorbs taper groove (701) and cooperate.
7. An led module with low distortion heat dissipation structure as claimed in claim 6, wherein: the lower inner wall of the adsorption cone groove (701) is fixedly connected with a strong magnetic adsorption block, and the lower end of the adsorption limiting cone block (703) is fixedly connected with a ferromagnetic adsorption sheet.
8. An led module with low distortion heat dissipation structure as claimed in claim 6, wherein: the lower end of the adsorption limiting conical block (703) is provided with a guide cone angle matched with the adsorption conical groove (701), and the adsorption limiting conical block (703) is made of an elastic material.
9. An led module with low distortion heat dissipation structure as claimed in claim 6, wherein: the outer end of the reaction ejector rod (702) is fixedly connected with a reaction fixed plate (705), the upper end of the reaction fixed plate (705) is fixedly connected with a reaction spring (704), and the upper end of the reaction spring (704) is fixedly connected with the heat dissipation linkage strip (6).
10. An led module with low distortion heat dissipation structure as claimed in claim 9, wherein: the phase change reaction holding plate is characterized in that a reaction holding groove is formed in the upper end of the phase change reaction holding plate (4), the upper end of the reaction ejector rod (702) extends into the reaction holding groove, a reaction extrusion plate is fixedly connected with the reaction ejector rod, and the reaction extrusion plate is connected with the reaction holding groove in a sliding mode.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210816547.3A CN114992604B (en) | 2022-07-12 | 2022-07-12 | LED module with low deformation heat radiation structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210816547.3A CN114992604B (en) | 2022-07-12 | 2022-07-12 | LED module with low deformation heat radiation structure |
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| CN114992604B CN114992604B (en) | 2024-06-14 |
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|---|---|---|---|---|
| US20080093055A1 (en) * | 2006-10-24 | 2008-04-24 | Inventec Corporation | Heat-dissipating structure |
| US20090223555A1 (en) * | 2008-03-05 | 2009-09-10 | Stalix Llc | High Efficiency Concentrating Photovoltaic Module Method and Apparatus |
| CN111128047A (en) * | 2020-01-16 | 2020-05-08 | 钟健美 | Temperature self-detection and deformation heat dissipation LED display screen module |
| CN114423263A (en) * | 2022-03-30 | 2022-04-29 | 高润新材料科技(南通)有限公司 | Outdoor communication machine room with high heat exchange performance |
| CN115539854A (en) * | 2022-08-31 | 2022-12-30 | 罗绷仔 | Outdoor high waterproof type led module of using |
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2022
- 2022-07-12 CN CN202210816547.3A patent/CN114992604B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080093055A1 (en) * | 2006-10-24 | 2008-04-24 | Inventec Corporation | Heat-dissipating structure |
| US20090223555A1 (en) * | 2008-03-05 | 2009-09-10 | Stalix Llc | High Efficiency Concentrating Photovoltaic Module Method and Apparatus |
| CN111128047A (en) * | 2020-01-16 | 2020-05-08 | 钟健美 | Temperature self-detection and deformation heat dissipation LED display screen module |
| CN114423263A (en) * | 2022-03-30 | 2022-04-29 | 高润新材料科技(南通)有限公司 | Outdoor communication machine room with high heat exchange performance |
| CN115539854A (en) * | 2022-08-31 | 2022-12-30 | 罗绷仔 | Outdoor high waterproof type led module of using |
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| CN114992604B (en) | 2024-06-14 |
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