CN114986882A - Preparation system and method of ultrasonic sensor based on laser curing printing technology - Google Patents
Preparation system and method of ultrasonic sensor based on laser curing printing technology Download PDFInfo
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- CN114986882A CN114986882A CN202210601797.5A CN202210601797A CN114986882A CN 114986882 A CN114986882 A CN 114986882A CN 202210601797 A CN202210601797 A CN 202210601797A CN 114986882 A CN114986882 A CN 114986882A
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- 238000007639 printing Methods 0.000 title claims abstract description 42
- 238000005516 engineering process Methods 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims description 23
- 239000013307 optical fiber Substances 0.000 claims abstract description 84
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 57
- 239000011521 glass Substances 0.000 claims abstract description 27
- 238000006073 displacement reaction Methods 0.000 claims abstract description 24
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- 230000008023 solidification Effects 0.000 claims abstract description 7
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- 238000004519 manufacturing process Methods 0.000 claims description 16
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 6
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- 230000035945 sensitivity Effects 0.000 abstract description 8
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- 238000002604 ultrasonography Methods 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
- B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
- B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
- B29C64/135—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask the energy source being concentrated, e.g. scanning lasers or focused light sources
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/227—Driving means
- B29C64/232—Driving means for motion along the axis orthogonal to the plane of a layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/227—Driving means
- B29C64/236—Driving means for motion in a direction within the plane of a layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
- B29C64/264—Arrangements for irradiation
- B29C64/268—Arrangements for irradiation using laser beams; using electron beams [EB]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
- B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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Abstract
The invention discloses a preparation system and a preparation method of an ultrasonic sensor based on a laser curing printing technology. The displacement platform is provided with an optical fiber clamp which is used for clamping an optical fiber; the glass slide is positioned below the optical fiber clamp and used for bearing photoresist; the focusing objective lens is arranged below the glass slide; the laser is arranged below the focusing objective lens and used for emitting laser towards the focusing objective lens and the glass slide, and the emitted laser can be focused through the focusing objective lens so that the focal point of the laser is positioned above the glass slide; the laser controller is used for controlling the light spot movement path and the focus position of the laser so as to enable the light spot focus of the laser to realize laser solidification at each target position, and the ultrasonic sensor with a more stable structure can be conveniently and rapidly prepared at the end face one-step forming sensing structure of the optical fiber, so that the sensitivity and the precision of the sensor are improved.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a system and a method for preparing an ultrasonic sensor based on a laser curing printing technology.
Background
Compared with an electrical ultrasonic sensor, the optical fiber ultrasonic sensor has the advantages of no electromagnetic interference, higher sensitivity, smaller volume and the like, and has more important academic research value and market application prospect. The basic sensing principle of the optical fiber Fabry-Perot ultrasonic sensor based on the film is that when ultrasonic waves act on the film, the film vibration and the film thickness change can be caused, the FP cavity length changes, further the oblique edge of an FP interference spectrum shifts, and the amplitude of the ultrasonic waves can be obtained by detecting the shift amount of the oblique edge of the spectrum.
The optical fiber ultrasonic sensor in the prior art adopts a bonding mode to connect the sensing structure on the optical fiber, and needs to be additionally attached with a film, so that the operation in the manufacturing process is inconvenient, the structure of the ultrasonic sensor is unstable, the splicing part of the sensing structure and the optical fiber can generate light loss, and the signal to noise ratio is reduced. In the manufacturing process, the preparation process of the coated film is complex, the cost is high, the long-term use of the coated film in a severe environment is not realized due to low chemical stability and temperature resistance, and the response degree of the coated film is reduced due to high Young modulus.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a preparation system of an ultrasonic sensor based on a laser curing printing technology, which can be used for conveniently and quickly processing and manufacturing the ultrasonic sensor with a more stable structure.
In order to solve the problems, the technical scheme adopted by the invention is as follows: the preparation system of the ultrasonic sensor based on the laser curing printing technology is characterized by comprising a rack and is arranged on the rack, wherein the rack comprises: the displacement platform is provided with an optical fiber clamp, the displacement platform is used for driving the optical fiber clamp to move along the X-axis direction, the Y-axis direction and the Z-axis direction, and the optical fiber clamp is used for clamping an optical fiber; the glass slide is positioned below the optical fiber clamp and used for bearing photoresist; the focusing objective lens is arranged below the glass slide; the laser is arranged below the focusing objective lens and used for emitting laser, and the emitted laser is focused through the focusing objective lens so that the focal point of the laser is positioned above the glass slide; and the laser controller is used for controlling the spot movement path and the focus position of the laser.
Compared with the prior art, the preparation system has the beneficial effects that:
1. when the preparation system is used for preparing the ultrasonic sensor, an optical fiber clamp can be adopted to clamp the optical fiber, photoresist is dripped on a glass slide, the optical fiber is moved by adopting a displacement platform, the lower end face of the optical fiber is immersed into the photoresist, then a laser and a laser controller are turned on, the laser controller can control the light spot movement path and the focus position of the laser according to a preset running track, so that the photoresist solidification of the light spot focus of the laser is realized at different positions, a sensing structure is printed on the end face of the optical fiber, and the required ultrasonic sensor is finally prepared and obtained;
2. the preparation system can print and form the sensing structure on the end face of the optical fiber at one time, only a printing path needs to be set in advance, the operation is more convenient and faster, and the sensing structure is printed and formed on the end face of the optical fiber, so that the structure of the ultrasonic sensor is more stable, and the sensitivity is higher;
3. the preparation system adopts the focusing objective lens to focus the laser emitted by the laser, so that the laser arranged below the glass slide can be focused above the glass slide, when in printing, only the optical fiber needs to be extended into the photoresist, and the focusing objective lens and the laser do not need to be extended into the photoresist, thus avoiding the trouble of cleaning;
4. during printing, the dripped photoresist is attached to the upper surface of the glass slide, namely, the lower surface of the photoresist is a relatively stable plane, and the refraction angles of laser entering the photoresist from different positions of the lower surface of the photoresist are consistent, so that the focusing position can be conveniently adjusted during printing at each time.
The invention also provides a preparation method of the ultrasonic sensor based on the laser curing printing technology, and the preparation system comprises the following steps:
s100, establishing a model of a supporting structure of an ultrasonic sensor by using three-dimensional mapping software, wherein the outer diameter of the supporting structure is gradually reduced from a first end to a second end of the supporting structure, an inner cavity is formed in the supporting structure, the inner cavity penetrates through the first end of the supporting structure, a thin film structure is formed between the top of the inner cavity and the end face of the second end of the supporting structure, a flow guide groove is formed in the first end of the supporting structure, the flow guide groove is communicated with the inner cavity and the outside of the supporting structure, after modeling is completed, the established model of the supporting structure is stored into a printed file in an STL format, the printed file is led into slicing software, a path file scanned by a laser is manufactured by adopting the slicing software, and the path file is led into the laser controller;
s200, providing an optical fiber, flattening the end face of the first end of the optical fiber, and cleaning the flattened end face;
s300, clamping the optical fiber processed in the step S100 by using an optical fiber clamp, and enabling a first end of the optical fiber to face downwards;
s400, dripping photoresist on the upper end face of the glass slide, and driving the optical fiber clamp to move by adopting a displacement platform so as to immerse the end face of the first end of the optical fiber in the photoresist;
s500, opening a laser and a laser controller, wherein the laser controller controls a scanning path of the laser according to the path file imported in the step S100, so that light spots of the laser are focused at different positions to solidify photoresist, the supporting structure is printed on the end face of the first end of the optical fiber, and the end face of the first end of the supporting structure is attached to and connected with the end face of the first end of the optical fiber;
s600, taking down the optical fiber processed in the step S500, developing the printed support structure, removing uncured photoresist in the support structure, and enabling the uncured photoresist to flow out of the diversion trench;
and S700, plating a metal reflecting film on the end face of the second end of the supporting structure.
Compared with the prior art, the preparation method has the following beneficial effects besides all the technical effects of the preparation system:
1. the preparation method can print the formed supporting structure and the film structure on the end face of the first end of the optical fiber at one time, can simplify the preparation process of the ultrasonic sensor, can form the supporting structure on the end face of the first end of the optical fiber in a printing mode, can enable the structure of the ultrasonic sensor to be more stable, reduces the perturbation to the phase, improves the measurement precision, and can improve the sensitivity of the ultrasonic sensor because the film structure made of photoresist has smaller Young modulus;
2. in the step S100, the first end of the support structure is provided with the guiding groove, and in the step S600, the guiding groove can facilitate the uncured photoresist to flow out, and the size of the guiding groove can be adjusted according to actual requirements to adjust the responsiveness of the ultrasonic sensor.
In the above method for manufacturing an ultrasonic sensor based on the laser curing printing technology, in step S400, the end face of the first end of the optical fiber does not contact with the upper surface of the glass slide.
In the above method for manufacturing an ultrasonic sensor based on a laser curing printing technology, in step S500, the laser controller is used to adjust an initial printing position of the laser: in the vertical direction, the spot focus position of the laser is located at the interface of the glass slide and the photoresist, and in the horizontal direction, the spot focus of the laser is located in the photoresist.
In the above method for manufacturing an ultrasonic sensor based on a laser curing printing technology, in step S600, acetone is used to perform a developing process on the printed support structure, and the developing process time is 20S to 60S.
In the above method for manufacturing an ultrasonic sensor based on the laser curing printing technology, in step S700, a metal reflective film is plated on an end surface of the second end of the supporting structure by evaporation.
In the above method for manufacturing an ultrasonic sensor based on the laser curing printing technology, in step S100, the support structure is in a circular truncated cone shape, and the inner cavity is in a circular hole shape.
In the above method for manufacturing an ultrasonic sensor based on the laser curing printing technology, in step S100, a thickness of a thin film structure formed between the top of the inner cavity and the end surface of the second end of the support structure is less than 10 μm.
In the above method for manufacturing an ultrasonic sensor based on the laser curing printing technology, in step S100, the cavity length of the inner cavity is in a range from 30 micrometers to 100 micrometers.
In the preparation method of the ultrasonic sensor based on the laser curing printing technology, the laser is a picosecond laser.
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a schematic view of a manufacturing system according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an ultrasonic sensor according to an embodiment of the present invention;
fig. 3 is a cross-sectional view of an ultrasonic sensor of an embodiment of the present invention.
The reference numbers illustrate:
a 100 displacement platform, a 110XY axis displacement platform and a 120Z axis displacement platform;
200 optical fiber clamps;
300 glass slides, 310 photoresist;
a 400 focus objective lens;
500 lasers, 510 lasers;
600 a laser controller;
700 supporting structure, 710 inner cavity, 720 film structure, 730 diversion trench;
800 optical fibers;
900 metallic reflective film.
Detailed Description
Referring to fig. 1, an embodiment of the present invention provides a system for preparing an ultrasonic sensor based on picosecond laser curing printing technology, including a frame, and a displacement platform 100, a slide 300, a focusing objective 400, a laser 500 and a laser controller 600 disposed on the frame. The optical fiber clamp 200 is mounted on the displacement platform 100, the displacement platform 100 is used for driving the optical fiber clamp 200 to move along the X-axis direction, the Y-axis direction and the Z-axis direction, and the optical fiber clamp 200 is used for clamping the optical fiber 800; the glass slide 300 is positioned below the optical fiber clamp 200, and the glass slide 300 is used for bearing the photoresist 310; the focusing objective 400 is disposed below the slide 300; the laser 500 is arranged below the focusing objective lens 400, the laser 500 is used for emitting laser 510 towards the focusing objective lens 400 and the slide glass 300, and the emitted laser 510 can be focused through the focusing objective lens 400, so that the focal point of the laser 510 is positioned above the slide glass 300; the laser controller 600 is used to control the spot movement path and the focal position of the laser 500. Specifically, the displacement platform 100 includes an XY-axis displacement platform 110 and a Z-axis displacement platform 120, the XY-axis displacement platform 110 is mounted on the frame and can move along the X-axis direction and the Y-axis direction relative to the frame, and the Z-axis displacement platform 120 is mounted on the ZY-axis displacement platform 100 and can move along the Z-axis direction relative to the XY-axis displacement platform 110.
When the ultrasonic sensor is prepared by using the preparation system, the optical fiber 800 can be clamped by the optical fiber clamp 200, the photoresist 310 is dripped on the glass slide 300, the optical fiber 800 is moved by the displacement platform 100, the lower end face of the optical fiber 800 is immersed into the photoresist 310, then the laser 500 and the laser controller 600 are opened, the laser controller 600 can control the light spot movement path and the focus position of the laser 500 according to the preset movement track, so that the light spot focus of the laser 500 realizes the curing of the photoresist 310 at each target position, and the sensing structure is printed on the end face of the optical fiber 800. The sensing structure can once print the shaping at optic fibre 800 terminal surface, only need set for in advance print the route can, the operation convenient and fast more, the sensing structure is printed the shaping at optic fibre 800 terminal surface moreover, can be so that ultrasonic sensor's structure is more stable, and sensitivity is higher. This preparation system has adopted focus objective 400 to focus laser 510 that laser instrument 500 emitted for the laser 510 that laser instrument 500 emitted that sets up in slide 300 below can focus in the top of slide 300, during the printing, only need extend optic fibre 800 in the photoresist 310 can, and focus objective 400 need not extend in the photoresist 310 with laser instrument 500, the abluent trouble has been removed from, simultaneously, when focus objective 400 moved, photoresist 310 can not be stirred, the effect of printing can not be influenced yet. In addition, during printing, the dripped photoresist 310 is attached to the upper end surface of the glass slide 300, that is, the lower surface of the photoresist 310 is a relatively stable plane, and the refraction angles of the laser 510 entering the photoresist 310 from different positions of the lower surface of the photoresist 310 are consistent, so that the focusing position can be conveniently adjusted during printing each time.
Referring to fig. 2 and 3, an embodiment of the present invention further provides a method for manufacturing an ultrasonic sensor based on a laser curing printing technology, where the manufacturing system in the above embodiment is adopted, and includes the following steps:
s100, establishing a model of the supporting structure 700 of the ultrasonic sensor by using three-dimensional mapping software, wherein the three-dimensional mapping software can adopt SolidWorks and other software. In the established model of the support structure 700, the outer diameter of the support structure 700 is gradually reduced from the first end to the second end of the support structure 700, and the interior of the support structure 700 has an inner cavity 710, and the inner cavity 710 penetrates the first end of the support structure 700 in a vertical direction. And a thin film structure 720 is formed between the top of the inner cavity 710 and the end surface of the second end of the support structure 700, the first end of the support structure 700 has a guiding trench 730, the guiding trench 730 extends along the horizontal direction, and the guiding trench 730 communicates the inner cavity 710 and the outside of the support structure 700. After modeling is completed, the established model of the support structure 700 is stored as a print file in an STL format, the print file is imported into slicing software, the 3D model of the support structure 700 is sliced by the slicing software, the horizontal and vertical slicing accuracy and the print filling mode of the slice are adjusted, a path file scanned by the laser 500 is obtained after slicing, and the path file is imported into the laser controller 600.
S200, providing the optical fiber 800, cutting the end face of the first end of the optical fiber 800 flat, and cleaning the cut end face to make the cut end face of the optical fiber 800 clean and tidy, so as to be beneficial to printing the supporting structure 700 on the end face of the optical fiber 800 in the follow-up process;
s300, clamping the optical fiber 800 processed in the step S100 by using an optical fiber clamp 200, enabling the first end of the optical fiber 800 to face downwards, and enabling the end face of the first end of the optical fiber 800 to be parallel to the upper surface of the glass slide 300;
s400, dripping photoresist 310 on the upper end face of the glass slide 300, and driving the optical fiber clamp 200 to move by adopting the displacement platform 100 so that the end face of the first end of the optical fiber 800 is immersed in the photoresist 310, wherein the photoresist 310 can be made of NOA81 or Green-A and the like;
s500, opening the laser 500 and the laser controller 600, wherein the laser controller 600 controls the scanning path of the laser 500 according to the path file imported in the step S100, so that the light spot of the laser 500 is focused at different positions to cure the photoresist 310, so as to print the support structure 700 on the end face of the first end of the optical fiber 800, and the end face of the first end of the support structure 700 is attached to the end face of the first end of the optical fiber 800;
s600, removing the optical fiber 800 processed in the step S500, performing development treatment on the printed support structure 700, removing the uncured photoresist 310 in the support structure 700, and enabling the uncured photoresist 310 to flow out of the diversion trench 730;
s700, plating a metal reflective film 900 on an end surface of the second end of the support structure 700.
The preparation method can simplify the preparation process of the ultrasonic sensor, in step S100, a model of the ultrasonic sensor and a path file scanned by the laser 500 are prepared in advance, and then, by adopting the preparation system in the above embodiment, the support structure 700 and the thin film structure 720 can be printed and formed at the end face of the first end of the optical fiber 800 at one time, and the support structure 700 is formed at the end face of the first end of the optical fiber 800 in a printing mode, so that the structure of the ultrasonic sensor can be more stable, the perturbation to the phase position can be reduced, the measurement accuracy can be improved, and the thin film structure 720 prepared by adopting the photoresist 310 has smaller young modulus, and the sensitivity of the ultrasonic sensor can be improved. In step S100, channels 730 are disposed at a first end of the support structure 700, and in step S600, the channels 730 facilitate the flow of the uncured photoresist 310. The manufactured ultrasonic sensor comprises a resonant cavity formed by the end face of the first end of the optical fiber 800, the inner cavity 710, the thin film structure 720 and the metal reflecting film 900, and the flow guide groove 730 is communicated with the inner cavity 710 and the external environment, so that the flow guide groove 730 directly influences the hollowing degree of the supporting wall of the resonant cavity, influences the deformation difficulty degree of the supporting wall, and further influences the responsivity and sensitivity of the sensor to ultrasound. Therefore, the required responsivity and sensitivity of the sensor can be obtained by changing the size of the diversion trench 730 according to actual requirements. It should be noted that the sensing structure in the embodiment of the present invention refers to the supporting structure 700 including the thin film structure 720, and the ultrasonic sensor in the embodiment of the present invention is composed of the supporting structure 700, the optical fiber 800 and the metal reflective film 900.
Further, in step S100, the supporting structure 700 is in a circular truncated cone shape, and the inner cavity 710 is in a circular hole shape. Taking the orientation in fig. 2 and 3 as an example, the outer diameter of the lower end of the supporting structure 700 is larger, the outer diameter of the upper end is smaller, and the outer diameter of the end face of the lower end of the supporting structure 700 is the same as the outer diameter of the end face of the first end of the optical fiber 800, which are both 120 micrometers, so that the supporting structure 700 can be connected with the optical fiber 800 conveniently, the connection strength between the supporting structure 700 and the optical fiber 800 is increased, and the structure of the sensor is more stable. The outer diameter of the upper end of the support structure 700 is smaller, so that the materials of the photoresist 310 and the metal reflective film 900 can be saved. Further, in step S100, the thickness of the thin film structure 720 formed between the top of the inner cavity 710 and the end face of the second end of the support structure 700 is less than 10 microns, so that the sensor meets the response frequency requirement for ultrasound. Further, in step S100, the cavity length of the inner cavity 710 ranges from 30 micrometers to 100 micrometers, preferably 50 micrometers, which can facilitate data demodulation and measurement when measuring the spectrum.
Further, in step S400, the end face of the first end of the optical fiber 800 does not contact the upper surface of the slide 300, so that it can be ensured that the interface between the photoresist 310 and the slide 300 is a plane, the lower surface of the photoresist 310 is a relatively stable plane, and the refraction angles of the laser 510 entering the photoresist 310 from different positions of the lower surface of the photoresist 310 are consistent, which is convenient for adjusting the focus position during each printing. Further, in step S500, the laser controller 600 is used to adjust the initial printing position of the laser 500: the spot focus position of the laser 500 is located at the interface of the slide 300 and the photoresist 310 in the vertical direction, and the spot focus of the laser 500 is located within the photoresist 310 in the horizontal direction.
Further, in step S600, the printed supporting structure 700 is developed with acetone for 20S to 60S, so that the uncured photoresist 310 flows out from the flow guide groove 730, and the photoresist 310 can be prevented from being accumulated in the inner cavity 710 and affecting the performance of the sensor. Further, in step S700, a metal reflective film 900 is plated on an end surface of the second end of the supporting structure 700 by evaporation, and the laser 500 is a picosecond laser 500.
It should be noted that in the description of the present invention, if orientation descriptions such as the directions of up, down, front, back, left, right, etc. are referred to, all the orientations or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the referred device or element must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and more than, less than, more than, etc. are understood as excluding the present number, and more than, less than, etc. are understood as including the present number. The description to first or second etc. is for the purpose of distinguishing between technical features and is not to be construed as indicating or implying a relative importance or implying a number of indicated technical features or implying a precedence relationship between indicated technical features.
In the description of the present invention, unless otherwise specifically limited, terms such as set, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention by combining the specific contents of the technical solutions.
The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention is not limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are within the protection scope of the present invention.
Claims (10)
1. The preparation system of the ultrasonic sensor based on the laser curing printing technology is characterized by comprising a rack and arranged on the rack:
the optical fiber clamping device comprises a displacement platform (100), wherein an optical fiber clamp (200) is installed on the displacement platform (100), the displacement platform (100) is used for driving the optical fiber clamp (200) to move along the X-axis direction, the Y-axis direction and the Z-axis direction, and the optical fiber clamp (200) is used for clamping an optical fiber (800);
a glass slide (300) located below the fiber clamp (200), the glass slide (300) for carrying a photoresist (310);
a focusing objective lens (400) disposed below the slide (300);
a laser (500) disposed below the focusing objective (400), the laser (500) being configured to emit laser light (510), the emitted laser light (510) being focused by the focusing objective (400) such that a focal point of the laser light (510) is located above the slide (300); and
and the laser controller (600) is used for controlling the spot motion path and the focus position of the laser (500).
2. A method for preparing an ultrasonic sensor based on laser curing printing technology, which is characterized by adopting the preparation system of claim 1 and comprising the following steps:
s100, establishing a model of a support structure (700) of an ultrasonic sensor by using three-dimensional mapping software, wherein the outer diameter of the support structure (700) is gradually reduced from a first end to a second end of the support structure (700), an inner cavity (710) is arranged in the support structure (700), the inner cavity (710) penetrates through the first end of the support structure (700), a thin film structure (720) is formed between the top of the inner cavity (710) and the end face of the second end of the support structure (700), a flow guide groove (730) is arranged at the first end of the support structure (700), the flow guide groove (730) is communicated with the inner cavity (710) and the outside of the support structure (700), after the modeling is completed, the established model of the support structure (700) is stored into a printed file in an STL format, the printed file is guided into slicing software, and a path file scanned by a laser (500) is manufactured by adopting the slicing software, and importing a path file into the laser controller (600);
s200, providing an optical fiber (800), flattening the end face of the first end of the optical fiber (800), and cleaning the flattened end face;
s300, clamping the optical fiber (800) processed in the step S100 by using an optical fiber clamp (200), and enabling a first end of the optical fiber (800) to face downwards;
s400, dripping photoresist (310) on the upper end face of the glass slide (300), and driving the optical fiber clamp (200) to move by adopting the displacement platform (100) so as to immerse the end face of the first end of the optical fiber (800) in the photoresist (310);
s500, opening a laser (500) and a laser controller (600), wherein the laser controller (600) controls a scanning path of the laser (500) according to the path file imported in the step S100, so that light spots of the laser (500) are focused at different positions to cure the photoresist (310), the supporting structure (700) is printed on the end face of the first end of the optical fiber (800), and the end face of the first end of the supporting structure (700) is attached to and connected with the end face of the first end of the optical fiber (800);
s600, removing the optical fiber (800) processed in the step S500, performing development treatment on the printed support structure (700), removing uncured photoresist (310) in the support structure (700), and enabling the uncured photoresist (310) to flow out of the diversion trench (730);
s700, plating a metal reflecting film (900) on the end face of the second end of the supporting structure (700).
3. The method for preparing an ultrasonic sensor based on laser solidification printing technology according to claim 2, wherein in the step S400, an end face of the first end of the optical fiber (800) is not in contact with an upper surface of the slide glass (300).
4. The method for preparing an ultrasonic sensor based on laser curing printing technology according to claim 2, wherein in the step S500, the laser controller (600) is used to adjust the initial printing position of the laser (500): the laser (500) has a spot focus located at the interface of the slide (300) and the photoresist (310) in the vertical direction, and the laser (500) has a spot focus located within the photoresist (310) in the horizontal direction.
5. The method for manufacturing an ultrasonic sensor based on laser solidification printing technology according to claim 2, wherein in the step S600, the printed support structure (700) is subjected to a developing treatment with acetone for 20S to 60S.
6. The method for manufacturing an ultrasonic sensor based on laser curing printing technology according to claim 2, wherein in step S700, a metal reflective film (900) is plated on an end surface of the second end of the support structure (700) by evaporation.
7. The method for preparing an ultrasonic sensor based on laser solidification printing technology according to claim 2, wherein in the step S100, the support structure (700) is in a circular truncated cone shape, and the inner cavity (710) is in a circular hole shape.
8. The method for preparing an ultrasonic sensor based on laser solidification printing technology according to claim 2, wherein in the step S100, a thickness of the thin film structure (720) formed between the top of the inner cavity (710) and the end face of the second end of the support structure (700) is less than 10 micrometers.
9. The method for manufacturing an ultrasonic sensor based on laser solidification printing technology according to claim 2, wherein in the step S100, the length of the inner cavity (710) ranges from 30 micrometers to 100 micrometers.
10. The method for preparing an ultrasonic sensor based on laser curing printing technology according to claim 2, wherein the laser (500) is a picosecond laser (500).
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Application publication date: 20220902 |