CN114985240A - Multi-frequency multi-mode lead-bonded ultrasonic vibrator - Google Patents
Multi-frequency multi-mode lead-bonded ultrasonic vibrator Download PDFInfo
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- CN114985240A CN114985240A CN202210595948.0A CN202210595948A CN114985240A CN 114985240 A CN114985240 A CN 114985240A CN 202210595948 A CN202210595948 A CN 202210595948A CN 114985240 A CN114985240 A CN 114985240A
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- 239000013078 crystal Substances 0.000 claims abstract description 16
- 239000000919 ceramic Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 238000002604 ultrasonography Methods 0.000 claims 6
- 238000009434 installation Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B3/02—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency involving a change of amplitude
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F15/00—Connecting wire to wire or other metallic material or objects; Connecting parts by means of wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/607—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of mechanical vibrations, e.g. ultrasonic vibrations
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Apparatuses For Generation Of Mechanical Vibrations (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
The invention discloses a multi-frequency multi-mode lead bonding ultrasonic vibrator which comprises a rear cover, a piezoelectric crystal stack, a front cover, an amplitude transformer and a chopper, wherein the amplitude transformer is connected to the front cover through a connecting structure; the rear cover, the piezoelectric crystal stack and the front cover are connected through screws; the piezoelectric crystal stack comprises a plurality of piezoelectric ceramics and a plurality of copper sheet electrodes, and the plurality of piezoelectric ceramics and the plurality of copper sheet electrodes are in staggered joint; the variable amplitude rod is characterized in that a through hole for adjusting the vibration frequency is formed in the variable amplitude rod, and the through hole is formed along the length direction of the variable amplitude rod. The ultrasonic vibrator provides various working frequencies, so that different wire bonding process requirements are met.
Description
Technical Field
The invention relates to an ultrasonic processing device, in particular to a multi-frequency multi-mode lead bonding ultrasonic vibrator.
Background
With the development of integrated circuit chips towards high integration level, multiple leads and fine pitch, higher requirements are put forward on the connection efficiency and reliability of the electrical leads between the bonding pads of the integrated circuit chips and the packaging pins, and lead bonding equipment needs to be continuously developed to meet the requirements of various new semiconductor processes, new materials, new connection reliability and efficiency. At present, the wire bonding technology is dominant in the chip packaging process by virtue of simple process implementation, low cost and suitability for various packaging forms, and will be the mainstream mode of semiconductor package connection in the foreseeable future. The lead bonding ultrasonic vibrator is used as one of core components of the thermosonic IC chip precision packaging equipment, and is used for converting electric energy applied to the piezoelectric ceramic crystal stack into ultrasonic vibration energy of a mechanical amplitude transformer required by the process so as to realize reliable electrical connection between a bonding pad of an integrated circuit chip and a packaging pin. The lead bonding ultrasonic vibrator consists of a rear cover plate, a piezoelectric crystal stack, a front cover plate, a clamp holder, an amplitude transformer and a chopper, and the traditional lead bonding ultrasonic vibrator has single working frequency and small applicable power range and does not meet the frequency requirement required by a specific bonding process.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a multi-frequency multi-mode wire bonding ultrasonic vibrator which provides multiple working frequencies so as to meet different wire bonding process requirements.
The technical scheme for solving the technical problems is as follows:
a multi-frequency multi-mode lead bonding ultrasonic vibrator comprises a rear cover, a piezoelectric crystal stack, a front cover, an amplitude transformer arranged on the front cover and a chopper arranged at the front end of the amplitude transformer; the rear cover, the piezoelectric crystal stack and the front cover are connected through screws; the piezoelectric crystal stack comprises a plurality of piezoelectric ceramics and a plurality of copper sheet electrodes, and the plurality of piezoelectric ceramics and the plurality of copper sheet electrodes are in staggered fit; the variable amplitude rod is characterized in that a through hole for adjusting the vibration frequency is formed in the variable amplitude rod, and the through hole is formed along the length direction of the variable amplitude rod.
The working principle of the lead bonding ultrasonic vibrator is as follows:
the ultrasonic generator transmits a high-frequency alternating-current voltage signal to the piezoelectric ceramic through the copper sheet electrode, and the piezoelectric ceramic generates axial ultrasonic mechanical vibration by utilizing the inverse piezoelectric effect; the back cover, the piezoelectric crystal stack and the front cover are connected through screws, so that the piezoelectric ceramics generate axial ultrasonic mechanical vibration and transmit the ultrasonic mechanical vibration to the front cover; the chopper is arranged at the top end of the amplitude transformer and transmits ultrasonic vibration through the chopper, so that the chopper can move back and forth between a chip lead welding area and a wiring bonding pad of a substrate at ultrasonic frequency, and the lead bonding efficiency is greatly improved; through arranging the through holes at different positions on the amplitude transformer, the vibration mode and the vibration frequency can be changed, so that the amplitude transformer outputs different longitudinal and radial composite modes, and the lead bonding ultrasonic vibrator outputs multi-mode and multi-frequency ultrasonic vibration; in addition, set up the perforation in the length direction of the width of cloth pole, divide into a plurality of parts with the width of cloth pole, each part transmits different ultrasonic waveform for the different orbit of width of cloth pole top output is compared in the structure of traditional compound ultrasonic vibrator that needs more than two vibrators, and the structure is simpler, and efficiency is higher.
According to a preferable scheme of the invention, the amplitude transformer is provided with a connecting structure for connecting and mounting, and the connecting structure is a flange structure.
In a preferred aspect of the present invention, the through hole is an elongated hole, and the elongated hole is provided along the length direction of the horn.
Preferably, one of the elongated holes is provided, and the axis of the elongated hole is coincident with the axis of the horn.
Preferably, one of the elongated holes has an axis that is offset from an axis of the horn by a distance.
Preferably, there are two of the elongated holes, and the two elongated holes are symmetrically arranged about the axis of the horn.
Preferably, there are three of the elongated apertures, with one of the elongated apertures being disposed on one side of the horn axis and the other two being disposed on the other side of the horn axis.
In a preferred embodiment of the present invention, the through holes are array round holes, and the array round holes include a plurality of round holes, and the plurality of round holes are arranged along the length direction of the amplitude transformer.
Preferably, the array round holes are single-row holes, and the array direction of the single-row holes is overlapped with the axial direction of the amplitude transformer.
Preferably, the array circular holes are single-row holes, and the array direction of the single-row holes is arranged at a certain distance away from the axis of the amplitude transformer.
Preferably, the array circular holes are double rows of holes, and the double rows of holes are symmetrically arranged about the axis of the amplitude transformer.
Preferably, the array of circular apertures is three rows of apertures, of which one row is disposed on one side of the horn axis and the other two rows are disposed on the other side of the horn axis.
In a preferable scheme of the invention, the amplitude transformer is a cylindrical amplitude transformer, the through hole is a long hole, the long hole comprises a horizontal long hole and a vertical long hole, and the axis of the horizontal long hole and the axis of the vertical long hole are both superposed with the axis of the amplitude transformer.
In a preferable scheme of the invention, the amplitude transformer is a conical amplitude transformer, the through hole is a long hole, the long hole comprises a horizontal long hole and a vertical long hole, and the axis of the horizontal long hole and the axis of the vertical long hole are both superposed with the axis of the amplitude transformer.
According to a preferable scheme of the invention, the amplitude transformer is a triangular-cone amplitude transformer, the through holes are three elongated holes, and the three elongated holes are respectively arranged on the conical surface of the triangular cone and are communicated with each other.
In a preferable scheme of the invention, the amplitude transformer is a rectangular amplitude transformer, the through holes are rectangular holes, the number of the rectangular holes is four, and the four rectangular holes are respectively arranged on a rectangular surface and are mutually communicated.
Compared with the prior art, the invention has the following beneficial effects:
1. through set up the perforation in the different positions on the amplitude transformer, the ultrasonic vibrator can realize the ultrasonic vibration output of multifrequency multimode.
2. The through holes are arranged on the amplitude transformer, so that the contact area of the amplitude transformer and air is increased, and the heat dissipation capacity of the amplitude transformer is greatly improved
3. The amplitude transformer is provided with the through hole, so that a metal lead can conveniently pass through the amplitude transformer, and the lead bonding is facilitated.
Drawings
Fig. 1-2 are schematic diagrams of a first embodiment of a wire-bonded ultrasonic transducer according to the present invention, where fig. 1 is a front view, fig. 2 is a top view, fig. 3 is a simulation effect diagram, and fig. 4 is a schematic diagram of an output trace of a chopper.
Fig. 5-6 are schematic diagrams of a second embodiment of a wire-bonded ultrasonic transducer according to the present invention, wherein fig. 5 is a top view and fig. 6 is a simulation effect diagram.
Fig. 7 is a plan view of a third embodiment of a wire-bonded ultrasonic transducer of the present invention.
Fig. 8 is a top view of a fourth embodiment of a wire bonded ultrasonic transducer of the present invention.
Fig. 9-10 are schematic diagrams of a fifth embodiment of a wire-bonded ultrasonic transducer according to the present invention, wherein fig. 9 is a top view and fig. 10 is a simulation effect diagram.
Fig. 11 to 12 are schematic views of a sixth embodiment of a wire-bonded ultrasonic transducer according to the present invention, in which fig. 11 is a plan view and fig. 12 is a simulation effect diagram.
Fig. 13 is a plan view of a seventh embodiment of a wire-bonded ultrasonic transducer of the present invention.
Fig. 14 is a top view of an eighth embodiment of a wire bonded ultrasonic transducer of the present invention.
Fig. 15 is a perspective view of a ninth embodiment of a wire-bonded ultrasonic transducer of the present invention.
Fig. 16 is a perspective view of a tenth embodiment of a wire-bonded ultrasonic transducer of the present invention.
Fig. 17 is a perspective view of an eleventh embodiment of a wire-bonded ultrasonic transducer of the present invention.
Fig. 18 is a perspective view of a twelfth embodiment of a wire-bonded ultrasonic transducer according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited thereto.
Example 1
Referring to fig. 1-4, a multi-frequency multi-modal wire bonding ultrasonic vibrator comprises a rear cover 1, a piezoelectric crystal stack, a front cover 2, an amplitude transformer 3 arranged on the front cover 2, and a chopper 4 arranged at the front end of the amplitude transformer 3; the rear cover 1, the piezoelectric crystal stack and the front cover 2 are connected through screws; the piezoelectric crystal stack comprises a plurality of piezoelectric ceramics 5 and a plurality of copper sheet electrodes 6, and the plurality of piezoelectric ceramics 5 and the plurality of copper sheet electrodes 6 are in staggered joint arrangement; the amplitude transformer 3 is provided with a through hole for adjusting the vibration frequency, and the through hole is arranged along the length direction of the amplitude transformer 3.
Referring to fig. 1-4, the horn is provided with a connecting structure for connecting and mounting, and the connecting structure is a flange structure 9. Thus, the ultrasonic vibrator can be mounted on other supports through the flange structure 9, and connection and mounting of the ultrasonic vibrator are completed.
Referring to fig. 1-4, the perforations are elongated holes 8, and the elongated holes 8 are disposed along the length of the horn 3. Thus, the horn 3 is divided into a left part and a right part by the elongated hole 8 arranged along the length direction of the horn 3, and different ultrasonic vibrations are formed on two sides of the round hole 7, so that the top end of the horn 3 outputs an elliptical track.
Referring to fig. 1-4, one of the elongated bores 8 is provided, and the axis of the elongated bore 8 is coincident with the axis of the horn 3. Thus, the elongated hole 8 divides the horn 3 into two symmetrical sections from the left and right, thereby creating an ultrasonic vibration of a particular frequency, mode.
Referring to fig. 1 to 4, the working principle of the wire bonding ultrasonic vibrator is as follows:
the ultrasonic generator transmits a high-frequency alternating-current voltage signal to the piezoelectric ceramic 5 through the copper sheet electrode 6, and the piezoelectric ceramic 5 generates axial ultrasonic mechanical vibration by utilizing the inverse piezoelectric effect; the rear cover 1, the piezoelectric crystal stack and the front cover 2 are connected through screws, so that the piezoelectric ceramics 5 generate axial ultrasonic mechanical vibration and transmit the axial ultrasonic mechanical vibration to the front cover 2, and the amplitude transformer 3 and the front cover 2 are processed into an integrated mechanism and the amplitude transformer 3 plays a role in amplifying amplitude, so that the amplified ultrasonic vibration is output from the top end of the amplitude transformer 3; the chopper 4 is arranged at the top end of the amplitude transformer 3, and ultrasonic vibration is transmitted through the chopper 4, so that the chopper 4 can move back and forth between a chip lead welding area and a wiring pad of a substrate at ultrasonic frequency, and the lead bonding efficiency is greatly improved; through arranging the through holes at different positions on the amplitude transformer 3, the vibration mode and the vibration frequency can be changed, so that different longitudinal and radial composite modes are output, and the lead bonding ultrasonic vibrator can output multi-mode and multi-frequency ultrasonic vibration; in addition, perforations are arranged in the length direction of the amplitude transformer 3, the amplitude transformer 3 is divided into a plurality of parts, and different ultrasonic vibrations are transmitted by the parts, so that the top end of the amplitude transformer 3 outputs an elliptical track; in one embodiment, as shown in FIG. 4, the perforations divide the horn 3 into two sections, with the sections on either side of the perforations transmitting different ultrasonic waveforms, causing the riving knife 4 mounted on top of the horn 3 to output an elliptical trajectory. Compared with the traditional structure of a composite ultrasonic vibrator which needs more than two vibrators, the structure is simpler, and the efficiency is higher.
Example 2
Referring to fig. 4 to 5, the present embodiment is different from embodiment 1 in that one of the elongated holes 8 is provided, and the axis of the elongated hole 8 is offset from the axis of the horn 3 by a certain distance. Thus, the elongated orifice 8 divides the horn 3 into two asymmetric sections from the left and right, thereby creating another specific frequency, mode of ultrasonic vibration.
Example 3
Referring to fig. 6, the present embodiment is different from embodiment 1 in that there are two elongated holes 8, and the two elongated holes 8 are symmetrically arranged about the axis of the horn 3. Thus, the two elongated apertures 8 divide the horn 3 into three sections to create ultrasonic vibrations of another particular frequency, mode.
Example 4
Referring to fig. 7, this embodiment differs from embodiment 1 in that there are three of the elongated holes 8, one of the three elongated holes 8 being disposed on one side of the axis of the horn 3 and the other two being disposed on the other side of the axis of the horn 3. Thus, the three elongated apertures 8 divide the horn 3 into four sections to create ultrasonic vibrations of another particular frequency, mode.
Example 5
Referring to fig. 8 to 9, the present embodiment is different from embodiment 1 in that the through holes are circular holes in an array, the circular holes in the array include a plurality of circular holes 7, and the plurality of circular holes 7 are arranged along the length direction of the horn 3. Thus, the amplitude transformer 3 is divided into a left part and a right part by the round holes 7 arranged along the length direction of the amplitude transformer 3, and different ultrasonic vibrations are formed on two sides of the round holes 7, so that the top end of the amplitude transformer 3 outputs an elliptical track.
Referring to fig. 8-9, the array circular holes are single-row holes, and the array direction of the single-row holes is coincident with the axial direction of the amplitude transformer 3. Thus, the single row of holes divides the horn 3 into two symmetrical sections to create a specific frequency, mode of ultrasonic vibration.
Example 6
Referring to fig. 10 to 11, the present embodiment is different from embodiment 5 in that the array circular holes are a single row of holes, and the array direction of the single row of holes is offset from the axis of the horn 3 by a certain distance. Thus, the single row of holes divides the horn 3 into two asymmetric sections from the left and right, thereby creating another specific frequency, mode of ultrasonic vibration.
Example 7
Referring to fig. 12, the present embodiment is different from embodiment 5 in that the array circular holes are double rows of holes which are symmetrically arranged about the axis of the horn 3. The double row of holes thus divides the horn 3 into three sections, thereby creating ultrasonic vibration of another particular frequency, mode.
Example 8
Referring to fig. 13, this embodiment differs from embodiment 5 in that the array of circular holes is three rows of holes, of which three rows are one row disposed on one side of the axis of the horn 3 and two rows are disposed on the other side of the axis of the horn 3. Thus, the three rows of apertures divide the horn 3 into four sections, thereby creating another specific frequency, mode of ultrasonic vibration.
Example 9
Referring to fig. 14, the difference of this embodiment from embodiment 1 is that the horn 3 is a cylindrical horn 3, the through hole is an elongated hole 8, the elongated hole 8 includes a horizontal elongated hole 8 and a vertical elongated hole 8, and the axis of the horizontal elongated hole 8 and the axis of the vertical elongated hole 8 both coincide with the axis of the horn 3.
Example 10
Referring to fig. 15, the difference of this embodiment from embodiment 1 is that the horn 3 is a conical horn 3, the through hole is an elongated hole 8, the elongated hole 8 includes a horizontal elongated hole 8 and a vertical elongated hole 8, and the axis of the horizontal elongated hole 8 and the axis of the vertical elongated hole 8 both coincide with the axis of the horn 3.
Example 11
Referring to fig. 16, the present embodiment is different from embodiment 1 in that the horn 3 is a triangular-pyramid horn 3, the through hole is an elongated hole 8, and there are three elongated holes 8, and the three elongated holes 8 are respectively disposed on the conical surfaces of the triangular pyramid and are communicated with each other.
Example 12
Referring to fig. 17, the present embodiment is different from embodiment 1 in that the horn 3 is a rectangular horn 3, the through holes are elongated holes 8, four of the elongated holes 8 are provided on a rectangular surface, and the four elongated holes 8 are connected to each other.
The present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents and are included in the scope of the present invention.
Claims (10)
1. A multi-frequency multi-mode lead bonding ultrasonic vibrator comprises a rear cover, a piezoelectric crystal stack, a front cover, an amplitude transformer connected to the front cover through a connecting structure and a chopper arranged at the front end of the amplitude transformer; the rear cover, the piezoelectric crystal stack and the front cover are connected through screws; the piezoelectric crystal stack comprises a plurality of piezoelectric ceramics and a plurality of copper sheet electrodes, and the plurality of piezoelectric ceramics and the plurality of copper sheet electrodes are in staggered fit; the variable amplitude rod is characterized in that a through hole for adjusting the vibration frequency is formed in the variable amplitude rod, and the through hole is formed along the length direction of the variable amplitude rod.
2. The multi-frequency multi-modal wire-bonded ultrasonic vibrator according to claim 1, wherein the horn is provided with a connecting structure for connection and installation, and the connecting structure is a flange structure.
3. A multi-frequency, multi-mode wire-bonded ultrasound transducer according to claim 2, wherein the through-hole is an elongated hole, the elongated hole being disposed along the length of the horn.
4. A multi-frequency, multi-mode wire-bonded ultrasound transducer according to claim 3, wherein one of said slots has an axis coincident with the axis of the horn.
5. The multi-frequency multi-modal wire-bonded ultrasound transducer of claim 3, wherein there are two of said elongated holes, and wherein said two elongated holes are symmetrically disposed about the axis of the horn.
6. A multi-frequency, multi-mode wire-bonded ultrasound transducer according to claim 3, wherein one of the elongated holes has its axis offset from the axis of the horn.
7. A multi-frequency multi-modal wire-bonded ultrasound transducer according to claim 2, wherein the through holes are array circular holes, the array circular holes include a plurality of circular holes, and the plurality of circular holes are arranged along the length direction of the horn.
8. The multi-frequency multi-modal wire-bonded ultrasonic vibrator according to claim 7, wherein the array circular holes are single-row holes, and the array direction of the single-row holes is overlapped with the axial direction of the horn.
9. A multi-frequency multi-modal wire-bonded ultrasound transducer according to claim 7, wherein the array circular holes are a single row of holes, and the array direction of the single row of holes is offset from the axis of the horn by a certain distance.
10. The multi-frequency multi-modal wire-bonded ultrasonic transducer according to claim 7, wherein the array circular holes are double rows of holes, and the double rows of holes are symmetrically arranged about the axis of the horn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210595948.0A CN114985240A (en) | 2022-05-27 | 2022-05-27 | Multi-frequency multi-mode lead-bonded ultrasonic vibrator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210595948.0A CN114985240A (en) | 2022-05-27 | 2022-05-27 | Multi-frequency multi-mode lead-bonded ultrasonic vibrator |
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| CN114985240A true CN114985240A (en) | 2022-09-02 |
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| CN202210595948.0A Pending CN114985240A (en) | 2022-05-27 | 2022-05-27 | Multi-frequency multi-mode lead-bonded ultrasonic vibrator |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121080A (en) * | 1999-10-27 | 2001-05-08 | Kaijo Corp | Ultrasonic horn |
| US20040079580A1 (en) * | 2002-10-28 | 2004-04-29 | Manna Ronald R. | Ultrasonic horn |
| CN108970955A (en) * | 2018-08-22 | 2018-12-11 | 河南理工大学 | Hole-type modal superposition longitudinal-torsional composite ultrasonic vibration processing method and device |
| CN110523606A (en) * | 2019-05-30 | 2019-12-03 | 哈尔滨工业大学（深圳） | The hot ultrasonic transducer of direction vibration and bonding method for microelectronics Packaging |
-
2022
- 2022-05-27 CN CN202210595948.0A patent/CN114985240A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121080A (en) * | 1999-10-27 | 2001-05-08 | Kaijo Corp | Ultrasonic horn |
| US20040079580A1 (en) * | 2002-10-28 | 2004-04-29 | Manna Ronald R. | Ultrasonic horn |
| CN108970955A (en) * | 2018-08-22 | 2018-12-11 | 河南理工大学 | Hole-type modal superposition longitudinal-torsional composite ultrasonic vibration processing method and device |
| CN110523606A (en) * | 2019-05-30 | 2019-12-03 | 哈尔滨工业大学（深圳） | The hot ultrasonic transducer of direction vibration and bonding method for microelectronics Packaging |
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Application publication date: 20220902 |