CN114980515A - Magnetic induction cursor positioning method applied to PCB - Google Patents
Magnetic induction cursor positioning method applied to PCB Download PDFInfo
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- CN114980515A CN114980515A CN202210547203.7A CN202210547203A CN114980515A CN 114980515 A CN114980515 A CN 114980515A CN 202210547203 A CN202210547203 A CN 202210547203A CN 114980515 A CN114980515 A CN 114980515A
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- cursor
- board
- magnetic induction
- points
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- 238000000034 method Methods 0.000 title claims abstract description 60
- 230000006698 induction Effects 0.000 title claims abstract description 44
- 230000008569 process Effects 0.000 claims abstract description 29
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 21
- 239000010941 cobalt Substances 0.000 claims abstract description 21
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000007747 plating Methods 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 238000010030 laminating Methods 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 5
- 238000005457 optimization Methods 0.000 claims abstract 2
- 238000005553 drilling Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000003825 pressing Methods 0.000 abstract description 7
- 238000003475 lamination Methods 0.000 description 12
- 230000008602 contraction Effects 0.000 description 10
- 238000000151 deposition Methods 0.000 description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical group [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a magnetic induction cursor positioning method applied to a PCB (printed circuit board). the method comprises the steps of firstly carrying out optimization design through design data in an exposure program, and respectively adding a cursor point at the diagonal position of a process edge on each surface of the board in the design data of the exposure program; and then only exposing the four cursor points in the film stripping process, covering other positions of the board surface, chemically plating cobalt on the board surface in a chemical mode to form a magnetic induction metal layer at the positions of the four cursor points, and searching positioning points through magnetic induction to position the laminated board in the subsequent laminating process of each layer of board. The method is applied to the magnetic induction cursor positioning method of the PCB to position and press the board, has low offset rate and high board pressing precision, and is suitable for manufacturing and pressing high-end-stage laminated boards.
Description
Technical Field
The invention relates to the technical field of PCB lead drilling, in particular to a magnetic induction cursor positioning method applied to a PCB.
Background
With the improvement of electronic precision and the development of high-end-stage laminate, the PCB is subjected to multiple times of pressing in the manufacturing process, and the deformation compression or expansion of the pp sheet causes the deviation of the alignment hole, so that the conductivity of the whole circuit is affected, and even the corrosion resistance of the circuit board is affected. In order to solve the problem, many factory engineers arrange different positioning holes to improve or search for a compression expansion coefficient to improve the problem, and after 3-5 times or more pressing, the line width distance of more than 75 μm, the alignment holes are deviated due to deformation compression or expansion of the pp sheet, and the deviation rate is up to 20-30%, which is more serious in the aspect of HDI and even IC carrier plates.
Disclosure of Invention
The invention provides a magnetic induction cursor positioning method applied to a PCB, which has low offset rate and high plate laminating precision and is suitable for manufacturing and laminating high-end-stage laminated plates.
In order to achieve the above purpose, the following technical solutions are provided.
A is applied to the magnetic induction cursor positioning method of PCB, the said method is to carry on the optimal design through the design data in the exposure procedure first, in the exposure procedure design data, set up a cursor point in the oblique diagonal position of the technological edge of each side of the board separately; and then only exposing the four cursor points in the film stripping process, covering other positions of the board surface, chemically plating cobalt on the board surface in a chemical mode to form a magnetic induction metal layer at the positions of the four cursor points, and searching positioning points through magnetic induction to position the laminated board in the subsequent laminating process of each layer of board.
In the prior art, alignment holes of different layers deviate due to expansion and contraction of a PP sheet caused by heat during pressing, each layer plate is pressed for one time and then vertically corresponds to the layer plate, and the deviation is increased along with the increase of the number of the layer plates and is larger and larger in the manufacturing of high-order plates. By adopting the cursor positioning method, the laminate is positioned in a magnetic induction cursor mode, and is not influenced by the expansion and contraction of the PP sheet in the positioning process, so that the whole board surface is simultaneously amplified or reduced no matter how the expansion and contraction of the PP sheet change, only the cursor points at four positions are found, the distance between the cursor points and the distance between the cursor points before lamination are calculated by a computer, the expansion and contraction coefficient of the board is calculated, and the positions of each line and hole of the next graph are adjusted, thereby realizing high precision, reducing the lamination offset rate of the high-order board, improving the lamination precision of the board, and being suitable for manufacturing and laminating the high-order laminate.
And further, before the exposure process, the method also comprises the previous process treatment of each laminate, wherein the previous process treatment comprises gold treatment, the film pasting treatment is carried out on the plate surface after the gold treatment, and the exposure process is carried out in an exposure program after the film pasting treatment. The gold plating treatment is nickel-gold plating, so that a nickel-gold metal layer is deposited on the board and then film pasting protection is carried out, and a basis and preparation are provided for a subsequent exposure program.
Further, in the design data, a working plate area and a non-working plate area of each laminate are defined, the working plate area is an area for producing the plate, the non-working plate area is a partial area reserved on four sides of the working plate area, and the process edge is a non-working plate area. The cursor point is arranged in the non-working plate area, so that the positioning is facilitated, and the work of the working plate area is not influenced.
Furthermore, the cursor points on the two sides of the laminate are arranged in a staggered manner, so that the two cursor points on the front side and the two cursor points on the back side of the laminate are respectively arranged at four angular positions of the laminate, the overlapping phenomenon cannot occur, and errors cannot occur in subsequent magnetic induction.
Further, the area of each cursor point is 1mm 2 The above. Ensure that the cursor point can be accurately induced by magnetic induction, avoid leading to the condition of unable response because of cursor point area undersize.
Further, the temperature of the electroless cobalt plating is 35 ℃, and the time is 10 min. Ensuring the effective cobalt plating on the plate and depositing a cobalt metal layer.
Furthermore, the deposition thickness of the magnetic induction metal layer formed by the chemical cobalt plating deposition is 0.1-0.3 microns, and the magnetic induction metal layer is formed at the position of the cursor point on the plate after the cobalt deposition due to the magnetism of the cobalt, so that a foundation and a guarantee are provided for realizing the magnetic induction positioning.
Furthermore, the magnetic induction locating point searching is to search the position of the locating point through an electromagnetic inductor, or set coordinates for memorizing by using a computer language, the length of the opposite angle and the expansion coefficient of expansion after pressing can be calculated according to the position of the locating point on drilling or subsequent exposure data, and then the positions of all lines and holes are adjusted.
Furthermore, the induction thickness of the magnetic induction can reach 10mm, the plate thickness is only 1.5-5 mm, and the high-order layer plate can be accurately positioned by adopting the magnetic induction.
Compared with the prior art, the invention has the following beneficial effects when being applied to the PCB magnetic induction cursor positioning method:
when in lamination, the PP sheet expands with heat and contracts with cold to cause the deviation of alignment holes of different layers, each layer plate is subjected to one-time lamination up-down correspondence to generate deviation, and the deviation is increased along with the increase of the number of the layer plates and is larger and larger in the manufacturing of high-order plates. By adopting the cursor positioning method, the laminate is positioned in a magnetic induction cursor mode, and is not influenced by the expansion and contraction of the PP sheet in the positioning process, so that the whole board surface is simultaneously amplified or reduced no matter how the expansion and contraction of the PP sheet change, only the cursor points at four positions are found, the distance between the cursor points and the distance between the cursor points before lamination are calculated by a computer, the expansion and contraction coefficient of the board is calculated, and the positions of each line and hole of the next graph are adjusted, thereby realizing high precision, reducing the lamination offset rate of the high-order board, improving the lamination precision of the board, and being suitable for manufacturing and laminating the high-order laminate.
Drawings
FIG. 1 is a front view of a laminate with cursor points for use in a magnetic induction cursor positioning method for PCB according to the present invention.
Detailed Description
The following will describe the application of the present invention to a magnetic induction cursor positioning method for PCB in further detail with reference to the specific embodiments and the accompanying drawings.
Referring to fig. 1, in a non-limiting embodiment of the present invention, a magnetic induction cursor positioning method applied to a PCB is first optimized through design data in an exposure program, in which a cursor point 3 is respectively added to an oblique diagonal position of a process edge 3 on each side of a laminate 1; and then only exposing the four cursor points 3 in the film stripping process, covering other positions of the board surface, chemically plating cobalt on the board surface in a chemical mode to form a magnetic induction metal layer at the positions of the four cursor points 3, and searching positioning points through magnetic induction to position the laminated board in the subsequent laminating process of each layer of board 1. In this embodiment, the surface a of the laminate 1 is the front surface, the surface B is the back surface, two cursor points 3 (a 1, B1), (a 2, B2) are respectively disposed at diagonal positions corresponding to the lower left corner and the upper right corner of the surface a, two other cursor points 3 (a 3, B4), (a 4, B4) are respectively disposed at diagonal positions corresponding to the upper left corner and the lower right corner of the surface B corresponding to the surface a, and the four cursor points 3 are respectively located at 4 corner positions of the laminate 1. In the embodiment, after the laminate 1 is chemically plated with cobalt, since copper and gold before lamination are nonmagnetic and cobalt is magnetic, the cursor point 3 can be quickly found for positioning through the electromagnetic inductor, and the positioning is efficient and accurate. Of course, the positions of the four cursor points on the surface A and the surface B can be interchanged, so that the principle that two cursor points on each surface are arranged in diagonal positions and the four cursor points are not overlapped at the same angular position is ensured.
Referring to fig. 1, according to a non-limiting embodiment of the present invention, in the prior art, when the PP sheet expands with heat and contracts with cold, the alignment holes of different layers shift, and each layer board 1 may have a deviation when being pressed vertically and correspondingly once, and in the manufacturing of the high-order board, the deviation may increase with the number of the layer boards 1. In the embodiment, the cursor positioning method is adopted to position the laminate 1 in a magnetic induction cursor mode, and the laminate is not affected by the expansion and contraction of the PP sheet any more in the positioning process, so that no matter how the expansion and contraction of the PP sheet change, the whole board surface is simultaneously enlarged or reduced, as long as the cursor points 3 at four positions are found, the distance between the cursor points 3 and the distance between the cursor points 3 before lamination are calculated by a computer, the expansion and contraction coefficient of the board is calculated, and then the positions of each line and hole of the next graph are adjusted, so that high precision is realized, the lamination offset rate of the high-level board is reduced, the lamination precision of the board is improved, and the method is suitable for manufacturing and laminating the high-level laminate 1.
Referring to fig. 1, a non-limiting embodiment of the present invention further includes a pre-process treatment of each laminate 1 before the exposure process, wherein the pre-process treatment includes a gold plating treatment, a film pasting treatment is performed on the surfaces after the gold plating treatment, and the exposure process is performed in the exposure program after the film pasting treatment. The gold melting treatment is nickel-gold melting, so that a nickel-gold metal layer is deposited on the board and then film pasting protection is carried out, and a foundation and preparation are provided for a subsequent exposure program.
Referring to fig. 1, in a non-limiting embodiment of the present invention, in the design data, a working board area and a non-working board area of each laminate 1 are defined, the working board area is an area for producing a board, the non-working board area is a partial area reserved on four sides of the working board area, and the process edge 3 is a non-working board area. The cursor point 3 is arranged in the non-working plate area, so that the positioning is facilitated and the work of the working plate area is not influenced.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the two cursor points 3 on the two sides of the laminate 1 are staggered to ensure that the two cursor points 3 on the front side and the two cursor points 3 on the back side of the laminate 1 are respectively disposed at four angular positions of the laminate 1, so that no overlapping occurs, and no error occurs in subsequent magnetic induction.
Referring to FIG. 1, in one non-limiting embodiment of the present invention, each cursor point 3 has an area of 1mm 2 The above. Ensure cursor point 3 can be accurately responded to by the magnetic induction, avoid leading to the condition of unable response because of 3 area undersize of cursor point.
Referring to FIG. 1, in one non-limiting embodiment of the present invention, the electroless cobalt plating temperature is 35 ℃ and the electroless cobalt plating time is 10 min. Ensuring the effective cobalt plating on the plate and depositing a cobalt metal layer.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the deposition thickness of the magnetic induction metal layer formed by electroless cobalt deposition is 0.1 to 0.3 μm, and since cobalt has magnetism, the magnetic induction metal layer is formed at the position of the cursor point 3 on the board after cobalt deposition, which provides a basis and guarantee for realizing magnetic induction positioning.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the magnetic induction locating point finding is to find the location of the locating point through an electromagnetic inductor, or to set coordinates for memory by using a computer language, and the length of the diagonal and the expansion coefficient of expansion after pressing can be calculated from the location of the locating point in drilling or subsequent exposure data, and then the location of each line and hole can be adjusted.
Referring to fig. 1, in a non-limiting embodiment of the present invention, the induced thickness of the magnetic induction can reach 10mm, while the plate thickness is only 1.5-5 mm, and the magnetic induction can be used to accurately position the high-order layer plate 1.
The above embodiments are only specific embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.
Claims (9)
1. A magnetic induction cursor positioning method applied to a PCB is characterized in that the method comprises the steps of firstly carrying out optimization design through design data in an exposure program, and respectively adding a cursor point at the diagonal position of a process edge on each surface of a board in the design data of the exposure program; and then only exposing the four cursor points in the film stripping process, covering other positions of the board surface, chemically plating cobalt on the board surface in a chemical mode to form a magnetic induction metal layer at the positions of the four cursor points, and searching positioning points through magnetic induction to position the laminated board in the subsequent laminating process of each layer of board.
2. The method as claimed in claim 1, further comprising a pre-process treatment of each layer plate before the exposure process, wherein the pre-process treatment comprises a gold-plating treatment, the plate is subjected to a film-pasting treatment after the gold-plating treatment, and the exposure process is performed after the film-pasting treatment.
3. The method as claimed in claim 1, wherein the design data defines a working board area and a non-working board area of each layer board, the working board area is an area for producing boards, the non-working board area is a partial area reserved on four sides of the working board area, and the process edge is a non-working board area.
4. The method as claimed in claim 3, wherein the cursor points on both sides of the laminate are staggered to ensure that the two cursor points on the front side and the two cursor points on the back side of the laminate are respectively located at four angular positions of the laminate without overlapping.
5. The method as claimed in claim 4, wherein the area of each cursor point is 1mm 2 As described above.
6. The method as claimed in claim 1, wherein the electroless cobalt plating is performed at 35 ℃ for 10 min.
7. The method as claimed in claim 2, wherein the magnetic induction metal layer formed by electroless cobalt plating is deposited to a thickness of 0.1-0.3 μm.
8. The cursor positioning method for PCB application of any one of claims 1 to 7 wherein the magnetic induction locating points are located by an electromagnetic inductor or are memorized by setting coordinates in a computer language, and the length of the diagonal and the expansion coefficient of the expansion after stitching can be calculated from the location of the locating points in the drilling or subsequent exposure data, and then the location of each line and hole can be adjusted.
9. The method as claimed in claim 8, wherein the magnetic induction thickness of the magnetic induction cursor can reach 10 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210547203.7A CN114980515A (en) | 2022-05-20 | 2022-05-20 | Magnetic induction cursor positioning method applied to PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210547203.7A CN114980515A (en) | 2022-05-20 | 2022-05-20 | Magnetic induction cursor positioning method applied to PCB |
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| Publication Number | Publication Date |
|---|---|
| CN114980515A true CN114980515A (en) | 2022-08-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210547203.7A Pending CN114980515A (en) | 2022-05-20 | 2022-05-20 | Magnetic induction cursor positioning method applied to PCB |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004039676A (en) * | 2002-06-28 | 2004-02-05 | Mitsui Chemicals Inc | Method of manufacturing inductor built-in printed wiring board |
| CN105307397A (en) * | 2015-09-16 | 2016-02-03 | 广州美维电子有限公司 | Circuit board exposure method and device |
| TWI621382B (en) * | 2016-01-06 | 2018-04-11 | 欣興電子股份有限公司 | Circuit board and manufacturing method thereof |
| CN207783297U (en) * | 2018-01-09 | 2018-08-28 | 江西省和盈电路有限公司 | A kind of HDI circuit board positioning devices |
| CN109561605A (en) * | 2018-12-14 | 2019-04-02 | 深圳市景旺电子股份有限公司 | A kind of multi-layer board presses grasping means and the preparation method of sandwich plate of harmomegathus data |
-
2022
- 2022-05-20 CN CN202210547203.7A patent/CN114980515A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004039676A (en) * | 2002-06-28 | 2004-02-05 | Mitsui Chemicals Inc | Method of manufacturing inductor built-in printed wiring board |
| CN105307397A (en) * | 2015-09-16 | 2016-02-03 | 广州美维电子有限公司 | Circuit board exposure method and device |
| TWI621382B (en) * | 2016-01-06 | 2018-04-11 | 欣興電子股份有限公司 | Circuit board and manufacturing method thereof |
| CN207783297U (en) * | 2018-01-09 | 2018-08-28 | 江西省和盈电路有限公司 | A kind of HDI circuit board positioning devices |
| CN109561605A (en) * | 2018-12-14 | 2019-04-02 | 深圳市景旺电子股份有限公司 | A kind of multi-layer board presses grasping means and the preparation method of sandwich plate of harmomegathus data |
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