CN114980483A - Circuit board heat dissipation structure and manufacturing method thereof - Google Patents
Circuit board heat dissipation structure and manufacturing method thereof Download PDFInfo
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- CN114980483A CN114980483A CN202210512611.9A CN202210512611A CN114980483A CN 114980483 A CN114980483 A CN 114980483A CN 202210512611 A CN202210512611 A CN 202210512611A CN 114980483 A CN114980483 A CN 114980483A
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- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application provides a circuit board heat radiation structure and a manufacturing method thereof, wherein the circuit board heat radiation structure comprises: the circuit board comprises a circuit layer and an insulating layer which are mutually laminated, and a mounting hole is formed in the circuit board and penetrates through the circuit layer and the insulating layer; the heat dissipation plate is connected with the circuit substrate in a stacked mode and is positioned on one side, away from the circuit layer, of the insulating layer; the heating component is arranged in the mounting hole and is connected with the heat dissipation plate; the application provides a circuit board heat radiation structure is connected through components and parts that will generate heat and heating panel to solve the technical problem that the radiating efficiency is low that circuit board exists among the prior art.
Description
Technical Field
The present application belongs to the field of circuit board technology, and more particularly, to a circuit board heat dissipation structure and a method for manufacturing the same.
Background
With the continuous development of the electronic communication industry and vehicle-mounted electronics, the requirements on the size of a circuit board are higher and higher, and the requirements on the heat dissipation performance of the circuit board are higher.
At present, in order to improve the heat dissipation performance of a circuit board, some manufacturers adopt a heat dissipation plate such as a temperature equalization plate to be combined with a circuit board, in the existing manufacturing process, the circuit board is directly welded with the heat dissipation plate, so that the circuit board absorbs heat through the heat dissipation plate to achieve the purpose of heat dissipation of the circuit board, however, the circuit board is usually processed by using an adhesive-backed copper foil, an insulating layer is arranged on one surface of the circuit board, and the insulating layer is located between the circuit board and the heat dissipation plate after the circuit board is welded with the heat dissipation plate, so that the heat dissipation efficiency of the whole circuit board is greatly reduced.
Disclosure of Invention
An object of the embodiment of the present application is to provide a circuit board heat dissipation structure to solve the technical problem of low heat dissipation efficiency of a circuit board in the prior art.
In order to achieve the purpose, the technical scheme adopted by the application is as follows: provided is a circuit board heat dissipation structure, including: the circuit board comprises a circuit layer and an insulating layer which are mutually laminated, and a mounting hole is formed in the circuit board and penetrates through the circuit layer and the insulating layer; the heat dissipation plate is mutually laminated and connected with the circuit substrate and is positioned on one side of the insulating layer, which is far away from the circuit layer; and the heating element is arranged in the mounting hole and connected with the heat dissipation plate.
The application provides at least the following beneficial effects: compared with the prior art, this application is through seting up the mounting hole on the circuit substrate, and make the mounting hole run through circuit substrate's circuit layer and insulating layer, with circuit substrate and heating panel range upon range of back together, can install the components and parts that generate heat in the mounting hole and be connected with the heating panel, at the in-process of circuit board work, the heating panel can dispel the heat to circuit substrate, and simultaneously, because the components and parts that generate heat can directly contact with the heating panel, make the heat of the components and parts that generate heat can transmit to the heating panel in high efficiency, thereby the radiating efficiency of circuit board has been improved, the heat dispersion of circuit board has been guaranteed.
In one embodiment, the heat dissipation plate is a temperature equalization plate, wherein the temperature equalization plate is made of copper or aluminum.
In order to achieve the above object, the present application further provides a method for manufacturing a circuit board heat dissipation structure, where the method includes the following steps: pressing the circuit substrate and the heat dissipation plate; etching the circuit layer of the circuit substrate to form a first through hole in the circuit layer; etching the insulating layer of the circuit substrate to form a second through hole in the insulating layer, wherein the second through hole is communicated with the first through hole to form a mounting hole; and installing a heating element in the mounting hole, and connecting the heating element with a heat dissipation plate.
According to all the embodiments of the circuit board heat dissipation structure manufactured by the manufacturing method, the circuit substrate and the heat dissipation plate are pressed together, and then the circuit layer is etched, so that a first through hole is formed in the circuit layer; and the part of the insulating layer corresponding to the position of the first through hole is etched, so that the second through hole is formed in the insulating layer, after the heating element is installed in the first through hole, the heating element can penetrate through the second through hole to be in contact with the heat dissipation plate, heat of the element to be heated can be efficiently transferred to the heat dissipation plate, the heat dissipation efficiency of the circuit board is improved, and the heat dissipation performance of the circuit board is guaranteed.
In one embodiment, the pressing of the circuit substrate and the heat dissipation plate includes the following steps: a first positioning hole is pre-formed in the circuit substrate, and a second positioning hole is pre-formed in the heat dissipation plate; aligning the first and second locating holes; pre-pressing the circuit substrate and the heat dissipation plate; and molding and pressing the circuit substrate and the heat dissipation plate.
In one embodiment, when the circuit substrate and the heat dissipation plate are pre-pressed, one side of the insulating layer, which is far away from the circuit layer, is heated; then the size of the sample is 8kg/cm 2 -15kg/cm 2 The pressing force of the pressing member presses the circuit board and the heat dissipation plate for 180 seconds.
In one embodiment, the circuit substrate is usedWhen the heat dissipation plate is molded and pressed, the size of the heat dissipation plate is 55kg/cm 2 -65kg/cm 2 The circuit substrate and the heat dissipation plate are pressed for 110 seconds by the pressing force, and the pressing temperature is 175-185 ℃.
In one embodiment, before the step of pre-laminating the circuit substrate and the heat dissipation plate, the manufacturing method further includes the following steps: arranging a first silica gel pad and a first release film on one side of the circuit substrate, which is far away from the heat dissipation plate, wherein the first release film is attached between the circuit substrate and the first silica gel pad; the heating panel deviate from circuit substrate one side sets up second silica gel pad and second from the type membrane, and the second is established from the type membrane subsides the heating panel with between the second silica gel pad.
In one embodiment, the etching of the circuit layer includes the following steps: performing pretreatment cleaning on the surface of the circuit layer; performing silk-screen printing on the surface of the circuit layer to form a wet film layer; pre-baking the wet film layer; exposing the pre-baked wet film layer; carrying out development treatment on the wet film layer; and etching the circuit layer.
In one embodiment, in the step of etching the insulating layer, the second via hole is formed by ablating a portion of the insulating layer corresponding to the first via hole with a laser.
In one embodiment, after the step of etching the insulating layer, the manufacturing method further includes the following steps: and carrying out plasma treatment on the first through hole and the second through hole.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a schematic structural diagram of a circuit board heat dissipation structure according to an embodiment of the present disclosure;
fig. 2 is a flowchart of a method for manufacturing a circuit board heat dissipation structure according to an embodiment of the present disclosure;
fig. 3 is a cross-sectional view of a circuit board heat dissipation structure provided in an embodiment of the present application in step S100;
fig. 4 is a cross-sectional view of a circuit board heat dissipation structure provided in an embodiment of the present application in step S200;
fig. 5 is a cross-sectional view of the heat dissipation structure of the circuit board provided in the embodiment of the present application in step S300.
Wherein, in the figures, the various reference numbers:
100. a circuit substrate; 110. a circuit layer; 111. a first through hole; 120. an insulating layer; 121. a second through hole;
200. a heat dissipation plate;
300. and (7) installing holes.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, as used herein, refer to an orientation or positional relationship indicated in the drawings that is solely for the purpose of facilitating the description and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
Referring to fig. 1, a heat dissipation structure of a circuit board according to an embodiment of the present application will be described. The circuit board heat dissipation structure includes a circuit substrate 100, a heat dissipation plate 200, and a heat generating component (not shown).
The circuit board 100 comprises a circuit layer 110 and an insulating layer 120 which are mutually laminated, wherein the circuit board 100 is provided with a mounting hole 300, and the mounting hole 300 penetrates through the circuit layer 110 and the insulating layer 120; the heat dissipation plate 200 and the circuit substrate 100 are connected in a stacked manner, and the heat dissipation plate 200 is located on one side of the insulating layer 120, which is far away from the circuit layer 110; the heating element is installed in the installation hole 300, and the heating element is connected to the heat dissipation plate 200.
For example, as shown in fig. 1, the circuit substrate 100 includes a circuit layer and an insulating layer 120, wherein the circuit layer 110 is a conductive circuit designed according to the user's requirement, a mounting hole 300 penetrates through the circuit substrate 100, the heat dissipation plate 200 and the insulating layer 120 are adhered together, because the casing of the heat dissipation plate 200 is made of a metal material, the heat dissipation plate 200 is located at a side away from the conductive circuit of the circuit substrate 100 to prevent the heat dissipation plate 200 from directly contacting the conductive circuit on the circuit substrate 100, thereby causing a short circuit, and the heat generating component is installed in the mounting hole 300, it can be understood that the heat generating component refers to various electronic components electrically connected with the circuit layer 110, and the heat generating component and the heat dissipation plate 200 can directly transfer heat, thereby preventing the temperature of the heat generating component from being too high.
Further, a first through hole 111 is formed in the circuit layer 110, a second through hole 121 is formed in the insulating layer 120, the second through hole 121 is located in the depth direction of the first through hole 111, and the first through hole 111 and the second through hole 121 communicate with each other to form a mounting hole 300, wherein an electrical component is mounted in the first through hole 111 and conductively connected to the circuit layer 110, and at the same time, the electrical component can contact the heat dissipation plate 200 through the second through hole 121, thereby directly transferring the generated heat to the heat dissipation plate 200, and improving the efficiency of heat transfer.
It is understood that the entire circuit layer 110 generates heat during operation except for the electrical components, wherein the insulating layer 120 is made of a high thermal conductive material, and although the circuit layer 110 is not in direct contact with the heat dissipation plate 200, the heat in the circuit layer 110 can be transferred to the heat dissipation plate through the insulating layer 120, thereby achieving heat dissipation.
The application provides a circuit board heat radiation structure, compared with the prior art, through seting up mounting hole 300 on the circuit substrate 100, and make mounting hole 300 run through circuit substrate 100's circuit layer 110 and insulating layer 120, after being in the same place circuit substrate 100 and heating panel 200 range upon range of link, can install heating element and part in mounting hole 300 and be connected with heating panel 200, at the in-process of circuit board work, heating panel 200 can dispel the heat to circuit substrate 100, and simultaneously, because heating element and part can directly contact with heating panel 200, make heating element and part's heat can transmit to heating panel 200 in high-efficiently, thereby the radiating efficiency of circuit board has been improved, the radiating performance of circuit board has been guaranteed.
In another embodiment of the present application, the heat dissipation plate 200 is a temperature equalization plate, wherein the temperature equalization plate is made of copper or aluminum. Wherein both copper and aluminum have better heat transfer performance, and the heat in the target heat source can be more quickly transferred to the temperature-equalizing plate.
Specifically, referring to fig. 1, in the present embodiment, the heat dissipation plate 200 is a temperature equalization plate, wherein a vacuum cavity with a fine structure is formed inside the temperature equalization plate, and is usually made of copper. When the heat of the heating element is conducted to the temperature equalizing plate, the cooling liquid in the vacuum cavity is heated and evaporated into a vapor state, and when the vapor state cooling liquid flows to a low-temperature area of the vacuum cavity, the vapor state cooling liquid can be condensed and changed into a liquid state, so that the heat is released outwards, the condensed cooling liquid can return to the evaporation heat source by virtue of the capillary pipeline of the microstructure, and the operation is repeated in the cavity.
Referring to fig. 2 to 5, the present application further provides a method for manufacturing a circuit board heat dissipation structure, where the circuit board heat dissipation structure is manufactured by the method for manufacturing a circuit board heat dissipation structure, and the method includes the following steps:
s100: pressing the circuit substrate 100 and the heat dissipation plate 200;
s200: etching the circuit layer 110 of the circuit substrate 100 to form a first through hole 111 in the circuit layer 110;
s300: etching the insulating layer 120 of the circuit substrate 100 so that a second through hole 121 is formed in the insulating layer 120, the second through hole 121 and the first through hole 111 communicating with each other to form a mounting hole 300;
s400: the heat generating component is mounted in the mounting hole 300, and is connected to the heat dissipating plate 200.
In the manufacturing method in the above embodiment, the circuit substrate 100 and the heat dissipation plate 200 are pressed, the heat dissipation plate 200 is bonded to the insulating layer 120 in the circuit substrate 100 after the pressing, then the circuit layer 110 in the circuit substrate 100 is etched, after the etching, the first through hole 111 is formed in the circuit layer 110, then the insulating layer 120 in the circuit substrate 100 is etched, a portion of the insulating layer 120 corresponding to the first through hole 111 is mainly removed, so that the second through hole 121 is formed in the insulating layer 120, the first through hole 111 and the second through hole 121 are communicated with each other to form the mounting hole 300, finally, the heating element is mounted in the mounting hole 300, and the heating element and the heat dissipation plate 200 are connected, so that heat generated by the heating element can be transferred to the heat dissipation plate 200.
It is understood that the main purposes of etching the circuit layer 110 in the circuit substrate 100 in the step S200 are two, one is to form the conductive line in the circuit layer 110, and the other is to form the first through hole 111 in the circuit layer 110.
Specifically, after the circuit substrate 100 and the heat dissipation plate 200 are pressed together, the wiring layer 110 is etched first, so that a first through hole 111 is formed in the wiring layer 110; and the part of the insulating layer 120 corresponding to the position of the first through hole 111 is etched again, so that the second through hole 121 is formed in the insulating layer 120, and after the heating element is installed in the first through hole 111, the heating element can pass through the second through hole 121 to contact with the heat dissipation plate 200, so that the heat of the element to be heated can be efficiently transferred to the heat dissipation plate 200, thereby improving the heat dissipation efficiency of the circuit board and ensuring the heat dissipation performance of the circuit board.
More specifically, the number of the circuit substrates 100 is not limited herein, and a worker may use a plurality of circuit substrates 100 to be pressed together to form a circuit board with a multilayer structure according to actual requirements, and the technical solution of the present application is also applicable.
Furthermore, when the circuit substrate 100 and the heat dissipation plate 200 are pressed together by a worker, the circuit layer 110 is etched to form a conductive circuit, so that the damage to the formed conductive circuit caused by the pressing process can be avoided, and the yield of the product is effectively improved.
In an embodiment of the present application, referring to fig. 2 and 3, the pressing of the circuit substrate 100 and the heat dissipation plate 200 includes the following steps:
s110: a first positioning hole is pre-formed in the circuit substrate 100, and a second positioning hole is pre-formed in the heat dissipation plate 200;
s120: aligning the first positioning hole in the circuit substrate 100 and the second positioning hole in the heat dissipation plate 200;
s130: pre-pressing the circuit substrate 100 and the heat dissipation plate 200;
s140: the circuit board 100 and the heat dissipation plate 200 are molded and pressed.
Firstly, a first positioning hole is formed in the circuit substrate 100, a second positioning hole is formed in the heat dissipation plate 200, so that the first positioning hole and the second positioning hole are positioned on a positioning column of processing equipment before lamination, vacant positions of the first positioning hole and the second positioning hole are aligned, and the circuit substrate 100 and the heat dissipation plate 200 are laminated on a set position.
It can be understood that, the heat dissipation plate 200 is used as an alignment reference point, the first positioning hole and the second positioning hole are aligned, then the circuit substrate 100 and the heat dissipation plate 200 are contacted with each other, then the circuit substrate 100 and the heat dissipation plate 200 are pre-pressed together through a fast pressing process, at this time, the adhesive force between the circuit substrate 100 and the heat dissipation plate 200 is not very large, a worker can firstly judge whether the bonding position of the circuit substrate 100 and the heat dissipation plate 200 is accurate, if the bonding position deviates, the circuit substrate 100 can be separated and re-bonded, then the circuit substrate 100 is placed on the original pre-bonded position, the pressing force is continuously increased, the heating temperature is increased, the pressing time is increased, and therefore the circuit substrate 100 and the heat dissipation plate 200 are bonded together more firmly.
In the above embodiment, referring to fig. 2 and 3, when pre-pressing the circuit substrate 100 and the heat dissipation plate 200, the method includes the following steps:
s121: heating the side of the insulating layer 120 facing away from the wiring layer 110;
s122: the size of the material is 8kg/cm 2 -15kg/cm 2 The pressing force of (2) presses the circuit board 100 and the heat sink 200 for 180 seconds.
It can be understood that, during the pressing, attention needs to be paid to control the pressing parameters, since the heat dissipation plate 200 is a hollow plate, the pressing time is too long, or the pressing time is too large, the heat dissipation plate 200 is easily subjected to too large pressure, and the heat dissipation plate 200 is cracked, for example, the pressing time is too small, or the pressing time is too short, so that the bonding force between the heat dissipation plate 200 and the circuit substrate 100 is low, and the two are easily separated.
Further, the worker first heats the side of the insulating layer 120 away from the circuit layer 110 with a soldering iron, and then heats the side with a size of 8kg/cm 2 -15kg/cm 2 The pressing force presses the circuit board 100 and the heat sink 200 for 180 seconds, so that the circuit board 100 and the heat sink 200 are pressed together.
In the above embodiment, referring to fig. 2 and fig. 3, when the circuit substrate 100 and the heat dissipation plate 200 are molded and pressed, the method includes the following steps:
s131: using 55kg/cm 2 -65kg/cm 2 The pressing force presses the circuit substrate 100 and the heat dissipation plate for 110 seconds, and the pressing temperature is 175-185 ℃.
Further, 55kg/cm is adopted by the staff 2 -65kg/cm 2 The pressing force presses the circuit substrate 100 and the heat dissipation plate 200 for 110 seconds, so that the circuit substrate 100 and the heat dissipation plate 200 are molded and pressed together, the circuit substrate 100 and the heat dissipation plate 200 are firmly pressed together, and the temperature of the bonding position in the molding and pressing process is 175-185 ℃.
In the above embodiment, before pre-pressing the circuit substrate 100 and the heat dissipation plate 200, the manufacturing method further includes the following steps:
s1201: a first silicone pad and a first release film are arranged on the side, away from the heat dissipation plate 200, of the circuit substrate 100, and the first release film is attached between the circuit substrate 100 and the first silicone pad;
s1202: set up second silica gel pad and second from the type membrane on the side of keeping away from circuit substrate 100 of heating panel 200 to the second is from type membrane subsides and is established between heating panel and second silica gel pad.
Further, before pre-pressing the circuit substrate 100 and the heat dissipation plate 200, a first release film and a second release film are respectively attached to the circuit substrate 100 and the heat dissipation plate 200, then a first silicone pad is arranged between the pressing device and the circuit substrate 100, and a second silicone pad is arranged between the pressing device and the heat dissipation plate 200, so that the risk of damage caused by direct contact of the pressing device with the heat dissipation plate 200 and the circuit substrate 100 is relieved in the pressing process.
In the above embodiment, referring to fig. 4, the etching of the circuit layer 110 includes the following steps:
s210: performing pretreatment cleaning on the surface of the circuit layer 110;
s220: performing silk-screen printing on the surface of the circuit layer 110 to form a wet film layer;
s230: pre-drying the wet film layer;
s240: exposing the pre-baked wet film layer;
s250: carrying out development treatment on the wet film layer;
s260: the wiring layer 110 is subjected to an etching process.
Further, the side of the circuit layer 110 that needs to be etched is pretreated and cleaned, so that the board surface of the circuit layer does not have serious oxidation, oil stain and wrinkle; then, printing the printed circuit layer 110 by using a silk screen to form a wet film layer on the surface of the printed circuit layer; then, prebaking the whole circuit substrate 100, and exposing the prebaked circuit substrate under ultraviolet rays; then, developing the wet film layer, wherein the developing is a process of removing the part of the wet film layer without exposure to obtain a required circuit pattern; finally, the whole conductor layer is etched to obtain a circuit pattern required by a user, and after the conductive circuit and the first through hole 111 are etched, the whole circuit layer 110 is subjected to film removal.
In another embodiment of the present application, referring to fig. 5, in the step of etching the insulating layer 120, a laser is used to ablate a portion of the insulating layer 120 corresponding to the first via hole 111 to form a second via hole 121.
Further, the insulating layer 120 needs to be subjected to a coarse glue removing process, and during the coarse glue removing process, CO is first used 2 The laser performs a laser etching process on the insulating layer 120, in which CO is present 2 The laser has the wavelength of 10.6um, the laser speed of 2700-2900 mm/s, the laser frequency of 200KHz and the laser energy of 50 percent, and the switch is delayed by 300us, so that the insulating layer 120 can be burnt by utilizing the heat accumulation of the laser; after the insulating layer 120 is burned off, black residues are left on the surface of the heat dissipation plate 200, and then the remaining residues need to be treated by using a fine removal adhesive, so that the surface of the heat dissipation plate 200 is exposed in the second through hole 121, and during the fine removal adhesive, CO 2 The laser has the wavelength of 1064nm, the laser speed of 2700-2900 mm/s, the laser frequency of 85KHz, the laser energy of 90 percent, the pulse width of 150ns and the switch delay of 300us, so that black residual substances can be swept away by utilizing the heat accumulation of the laser, and after the insulating layer 120 is removed, the heating element can be directly communicated with the heat dissipation plate 200.
In the above embodiment, after the step of etching the insulating layer 120, the manufacturing method further includes the following steps:
s400: plasma processing is performed at the first through hole 111 and the second through hole 121.
Further, after the above-mentioned rough glue removal and fine glue removal, there may still exist some glue residues that cannot be removed by laser on the inner side surfaces of the first through hole 111 and the second through hole 121 and other contaminants, and the worker cleans the first through hole 111 and the second through hole 121 by means of plasma treatment, thereby removing the remaining glue residues and other contaminants.
After the step S400, the heat dissipation structure of the circuit board may be further processed, specifically including the following steps:
s500: printing characters on a product;
s600: drilling conductive holes on the circuit substrate 100 according to the requirements of customers;
s700: performing solder mask processing on the circuit substrate 100, wherein the solder mask processing is not performed on the first through hole 111 and the second through hole 121 here;
s800: performing a short circuit test on the circuit layer on the circuit substrate 100, and performing an oxidation prevention treatment on copper on the circuit layer 110;
s900: and finally, the whole product is comprehensively inspected, and qualified products are packaged and delivered.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (10)
1. The utility model provides a circuit board heat radiation structure which characterized in that, circuit board heat radiation structure includes:
the circuit board comprises a circuit layer and an insulating layer which are mutually laminated, and a mounting hole is formed in the circuit board and penetrates through the circuit layer and the insulating layer;
the heat dissipation plate is connected with the circuit substrate in a stacked mode and is positioned on one side, away from the circuit layer, of the insulating layer;
and the heating element is arranged in the mounting hole and connected with the heat dissipation plate.
2. The circuit board heat dissipation structure of claim 1, wherein: the heat dissipation plate is a temperature equalization plate, wherein the temperature equalization plate is made of copper or aluminum.
3. A method for manufacturing a circuit board heat dissipation structure as claimed in claim 1 or 2, wherein the method comprises the following steps:
pressing the circuit substrate and the heat dissipation plate;
etching the circuit layer of the circuit substrate to form a first through hole in the circuit layer;
etching the insulating layer of the circuit substrate to form a second through hole in the insulating layer, wherein the second through hole is communicated with the first through hole to form a mounting hole;
and installing a heating element in the mounting hole, and connecting the heating element with a heat dissipation plate.
4. The method for manufacturing a heat dissipation structure of a circuit board according to claim 3, wherein the step of pressing the circuit board and the heat dissipation plate comprises the steps of:
a first positioning hole is pre-formed in the circuit substrate, and a second positioning hole is pre-formed in the heat dissipation plate;
aligning the first locating hole with the second locating hole;
pre-pressing the circuit substrate and the heat dissipation plate;
and molding and pressing the circuit substrate and the heat dissipation plate.
5. The method for manufacturing the heat dissipation structure of circuit board according to claim 4, wherein when the circuit substrate and the heat dissipation plate are pre-pressed, a side of the insulating layer away from the circuit layer is heated; then the size of the sample is 8kg/cm 2 -15kg/cm 2 The circuit board and the heat dissipation plate are pressed together for 180 seconds by the pressing force of (3).
6. The method for manufacturing a heat dissipating structure of a circuit board according to claim 4, wherein the size of the heat dissipating plate is 55kg/cm when the circuit board is molded and pressed with the heat dissipating plate 2 -65kg/cm 2 The circuit substrate and the heat dissipation plate are pressed for 110 seconds by the pressing force, and the pressing temperature is 175-185 ℃.
7. The method for manufacturing a heat dissipation structure of circuit board as defined in claim 4,
before the circuit substrate and the heat dissipation plate are pre-laminated, the manufacturing method further comprises the following steps:
arranging a first silica gel pad and a first release film on one side of the circuit substrate, which is far away from the heat dissipation plate, wherein the first release film is attached between the circuit substrate and the first silica gel pad;
one side of the heat dissipation plate, which deviates from the circuit substrate, is provided with a second silicone pad and a second release film, and the second release film is attached to and arranged between the heat dissipation plate and the second silicone pad.
8. The method for manufacturing a heat dissipation structure of a circuit board according to claim 3, wherein the step of etching the circuit layer comprises the steps of:
performing pretreatment cleaning on the surface of the circuit layer;
performing silk-screen printing on the surface of the circuit layer to form a wet film layer;
pre-baking the wet film layer;
exposing the pre-baked wet film layer;
carrying out development treatment on the wet film layer;
and etching the circuit layer.
9. The method for manufacturing a heat dissipation structure of a circuit board according to claim 3, wherein in the step of etching the insulating layer, the second via hole is formed by ablating a portion of the insulating layer corresponding to the first via hole with a laser.
10. The method for fabricating a heat dissipating structure of a circuit board according to any one of claims 4 to 9, wherein after the step of etching the insulating layer, the method further comprises the steps of:
and carrying out plasma treatment on the first through hole and the second through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202210512611.9A CN114980483A (en) | 2022-05-12 | 2022-05-12 | Circuit board heat dissipation structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210512611.9A CN114980483A (en) | 2022-05-12 | 2022-05-12 | Circuit board heat dissipation structure and manufacturing method thereof |
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| CN114980483A true CN114980483A (en) | 2022-08-30 |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178243A (en) * | 1996-10-15 | 1998-06-30 | Iwaki Electron Corp Ltd | Printed-circuit board provided with heat sink and its manufacture |
| KR20010057046A (en) * | 1999-12-17 | 2001-07-04 | 이형도 | Package substrate having cavity |
| JP2003060125A (en) * | 2001-08-16 | 2003-02-28 | Sumitomo Metal Electronics Devices Inc | Heat radiating bga package and method for manufacturing the same |
| JP2003060124A (en) * | 2001-08-13 | 2003-02-28 | Sumitomo Metal Electronics Devices Inc | Heat radiating bga package and method for manufacturing the same |
| JP2003152288A (en) * | 2001-11-14 | 2003-05-23 | Nissan Motor Co Ltd | Flexible board, circuit board and method for mounting electronic component |
| TW200608864A (en) * | 2004-08-19 | 2006-03-01 | Phoenix Prec Technology Corp | Heat dissipating circuit board and method for fabricating the same |
| KR20140013612A (en) * | 2012-07-25 | 2014-02-05 | 서호이노베이션(주) | Chip on metal type heat radiating printed circuit board and manufacturing the same |
| KR102055587B1 (en) * | 2018-06-08 | 2019-12-13 | 이종은 | Heat-Sink Substrate For High-Power Semiconductor, High-Power Semiconductor Module Comprising The Same, And Manufacturing Process Thereof |
-
2022
- 2022-05-12 CN CN202210512611.9A patent/CN114980483A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10178243A (en) * | 1996-10-15 | 1998-06-30 | Iwaki Electron Corp Ltd | Printed-circuit board provided with heat sink and its manufacture |
| KR20010057046A (en) * | 1999-12-17 | 2001-07-04 | 이형도 | Package substrate having cavity |
| JP2003060124A (en) * | 2001-08-13 | 2003-02-28 | Sumitomo Metal Electronics Devices Inc | Heat radiating bga package and method for manufacturing the same |
| JP2003060125A (en) * | 2001-08-16 | 2003-02-28 | Sumitomo Metal Electronics Devices Inc | Heat radiating bga package and method for manufacturing the same |
| JP2003152288A (en) * | 2001-11-14 | 2003-05-23 | Nissan Motor Co Ltd | Flexible board, circuit board and method for mounting electronic component |
| TW200608864A (en) * | 2004-08-19 | 2006-03-01 | Phoenix Prec Technology Corp | Heat dissipating circuit board and method for fabricating the same |
| KR20140013612A (en) * | 2012-07-25 | 2014-02-05 | 서호이노베이션(주) | Chip on metal type heat radiating printed circuit board and manufacturing the same |
| KR102055587B1 (en) * | 2018-06-08 | 2019-12-13 | 이종은 | Heat-Sink Substrate For High-Power Semiconductor, High-Power Semiconductor Module Comprising The Same, And Manufacturing Process Thereof |
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