CN114974760B - Chip resistor - Google Patents
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- CN114974760B CN114974760B CN202210778486.6A CN202210778486A CN114974760B CN 114974760 B CN114974760 B CN 114974760B CN 202210778486 A CN202210778486 A CN 202210778486A CN 114974760 B CN114974760 B CN 114974760B
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- 239000011241 protective layer Substances 0.000 claims abstract description 85
- 239000010410 layer Substances 0.000 claims abstract description 59
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 28
- 238000007747 plating Methods 0.000 claims description 48
- 238000007789 sealing Methods 0.000 claims description 27
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 17
- 238000005192 partition Methods 0.000 claims description 15
- 238000007373 indentation Methods 0.000 claims description 10
- 238000005253 cladding Methods 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims 2
- 238000012946 outsourcing Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 230000001186 cumulative effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 20
- 230000001681 protective effect Effects 0.000 description 10
- 230000003139 buffering effect Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Resistors (AREA)
Abstract
The application relates to the technical field of resistors, in particular to a chip resistor which comprises a resistor substrate and a resistor element, wherein the middle part of the upper end of the resistor substrate is provided with the resistor element by taking the use direction as a reference, the resistor substrate on the left side and the right side of the resistor element is provided with a first front electrode, and the two ends of the resistor element are respectively lapped on the end parts of the first front electrodes on the two sides; the upper end of the first front electrode is provided with a second front electrode, and one end of the inner side of the second front electrode is lapped on the end part of the resistance element; through with first positive electrode, second positive electrode and third positive electrode and resistance element, first protective layer and second protective layer overlap joint for the expansion of the tip of first protective layer is restricted by the third positive electrode, and then has reduced the volume of cumulative expansion, and then reduces nickel coating or tinning layer and by the risk of jack-up.
Description
Technical Field
The application relates to the technical field of resistors, in particular to a chip resistor.
Background
With the progress of science and technology, the development of age and the diversification of demands of people on electronic products, products with appreciation property are more and more needed, wherein the LED soft light bars are one type of the products, and the products add dazzling colors to night scenes of cities. The chip resistor, also called chip resistor, has the advantages of small volume, light weight, suitability for reflow soldering and wave soldering, stable electrical property, high reliability, low assembly cost, matching with automatic mounting and pasting equipment, high mechanical strength, excellent high-frequency characteristic and the like, and is widely applied.
Chinese patent (application number: 2019111489118) discloses a chip resistor for precision instruments, including the chip resistor body, the middle part fixed mounting of chip resistor body has the base plate, the upper surface of base plate has seted up flutedly, the through-hole has been seted up to the inside wall of recess, the inner chamber fixed mounting of base plate has resistance element, and resistance element includes conducting wire and single crystal, and single crystal's outer wall fixed mounting has the connecting block. But it has the following disadvantages: 1. when a customer performs wave soldering or reflow soldering on the chip resistor on the PCB, as the materials of the first protective film and the second protective film are generally thermosetting epoxy resin, and the protective sleeves are generally nickel-plated layers and tin-plated layers, the expansion coefficients of the protective sleeves are different from those of the protective sleeves, so that the protective sleeves overlapped on the edge of the second protective film are easily jacked up, and external gas can enter to corrode the resistance element, so that the resistance element cannot be normally used; 2. the resistive element is sealed under the second protective film to be protected from mechanical abrasion or impact damage, but the heat dissipation performance of the resistive element is also reduced, which is difficult to be compatible.
Therefore, the application designs the patch resistor, and the first front electrode, the second front electrode and the third front electrode are in staggered lap joint with the resistor element, the first protective layer and the second protective layer, so that the expansion of the end part of the first protective layer is limited by the third front electrode, the accumulated expansion amount is further reduced, and the risk that the nickel plating layer or the tin plating layer is jacked up is further reduced.
Disclosure of Invention
In order to make up for the defects of the prior art, the application provides the patch resistor which solves the problems that the existing patch resistor is easy to lead to the jacking of a protective sleeve lapped on the edge of a second protective film during welding, so that external gas can enter to corrode a resistance element and the resistance element cannot be normally used.
The technical scheme adopted for solving the technical problems is as follows: the patch resistor comprises a resistor substrate and a resistor element, wherein the middle part of the upper end of the resistor substrate is provided with the resistor element by taking the use direction as a reference, the resistor substrate on the left side and the right side of the resistor element is provided with first front electrodes, and the two ends of the resistor element are respectively lapped on the end parts of the first front electrodes on the two sides; the upper end of the first front electrode is provided with a second front electrode, and one end of the inner side of the second front electrode is lapped on the end part of the resistance element; the middle part of the upper end of the resistor element is provided with a first protective layer, and two ends of the first protective layer are respectively lapped on the end parts of the two front electrodes; a third front electrode is arranged at the upper end of the second front electrode, and one end of the inner side of the third front electrode is lapped on the end part of the first protective layer; the upper end of the first protective layer is provided with a second protective layer, and two ends of the second protective layer are respectively lapped on the end part of the third front electrode; the resistor substrate is characterized in that two sides of the resistor substrate are provided with side electrodes with vertical parts, the upper ends of the side electrodes are connected with one end of the outer side of the first front electrode, and the left side and the right side of the lower end of the resistor substrate are symmetrically provided with back electrodes connected with the lower end of the back electrode; the side electrode outside is provided with the nickel plating layer of cladding it, nickel plating layer upper end extends to second protective layer department and cladding second protective layer's tip along third front electrode surface, nickel plating layer lower extreme extends and cladding back electrode along back electrode surface, the cladding of nickel plating layer outside has a layer tin plating.
By staggering and overlapping the first front electrode, the second front electrode and the third front electrode with the resistor element, the first protective layer and the second protective layer, the expansion of the end part of the first protective layer is limited by the third front electrode, so that the accumulated expansion amount is reduced, and the risk of the nickel plating layer or the tin plating layer being jacked up is reduced; the staggered parts also achieve the purpose of prolonging the gas flow path, so that even if the nickel plating layer or the tin plating layer is propped up, gas is difficult to enter the resistance element from the bent path, thereby improving the performance stability of the chip resistor, avoiding the problem that the resistance element is corroded and damaged, enabling the chip resistor to be used normally, and avoiding the problem that the performance of the chip resistor is reduced due to welding.
Preferably, the first protective layer is made of elastic epoxy resin, and the second protective layer is made of wear-resistant epoxy resin.
Through the setting of first protective layer and second protective layer, can enough layer reduce mechanical wear and lead to the unusual problem of circuit, can realize certain buffering again under the circumstances of packaging structure stability, avoid resistance element to be damaged by the collision, consequently improved life.
Preferably, a plurality of non-penetrating first release holes are arranged on the lower side surface of the first protective layer at intervals along the left-right direction, and the first release holes are downwards and vertically arranged.
Through the setting of first release hole, can be used for releasing first protective layer because of external force impact or the elastic deformation that thermal expansion leads to, and then reduce its tip to the extrusion force of third positive electrode, further reduced tin-plating layer and nickel-plating layer by the top open and lead to the external gas entering and corrode resistance element's risk, and then prolonged resistance element's life.
Preferably, a plurality of non-penetrating second release holes are formed in the upper end of the second protection layer, and the second release holes are arranged vertically and upwards.
By arranging the second release holes, on one hand, the deformation of the second protective layer can be released, the probability of jacking up the tin plating layer and the nickel plating layer is further reduced, and the resistance element is protected from corrosion damage; on the other hand, the second release hole is matched with the first release hole, so that the heat dissipation area is increased while the heat dissipation distance is shortened, the heat dissipation path and the heat dissipation condition are improved under the condition of ensuring the air tightness, the heat dissipation performance is further improved, the further improvement of the power of the chip resistor is ensured, and the chip resistor is further realized in terms of wear resistance, buffering performance and heat dissipation performance; in addition, the second release holes can be combined and arranged to form patterns according to the requirement, so that the function of identification is realized.
Preferably, a step surface matched with the third front electrode is arranged at one end of the third front electrode facing the first protective layer, the step surface is vertically arranged and provided with an avoidance groove, a sealing film crossing the avoidance groove is arranged on the step surface, and two ends of the sealing film are sealed with the end surfaces of the step surface; the sealing film middle part is provided with reserved indentation, first protective layer terminal surface is contradicted with the sealing film and is provided with the slot that matches with the indentation position.
Through the arrangement of the avoidance groove and the sealing film, the end face of the first protective layer can expand to one side of the avoidance groove when welding is heated, so that the end part of the first protective layer is separated at a cutting seam and is jacked into the avoidance groove after the sealing film is torn from the middle part along an indentation, the release of pressure is further realized, and the nickel plating layer and the tin plating layer are jacked up due to collision of the pressure is avoided; meanwhile, the sealing film on the step surface can be pressed more tightly by the end part of the first protective layer, so that the effect of gas sealing is still achieved, and gas is prevented from entering the corrosion resistance element.
Preferably, a spare resistor is arranged at the lower end of the resistor substrate between the back electrodes, and an insulating protection layer is arranged at the lower end of the spare resistor; the middle parts of the standby resistor and the resistor element are respectively provided with a separation groove, and the separation grooves divide the standby resistor and the resistor element into two split resistor bodies which are separated left and right; the resistor substrate is provided with a chute matched with the partition groove, a connecting rod with the length smaller than the height of the resistor substrate is arranged in the chute, conductive blocks are arranged at the upper end and the lower end of the connecting rod, the upper conductive block is positioned in the partition groove of the resistor element and provided with a through hole which is penetrated left and right, and a fuse wire which is connected with the left and right sides of the fuse wire to divide the resistor body is arranged in the through hole.
Through the setting of fuse, it can be when instantaneous current is too big, and protection resistance element overheat damages, simultaneously when the fuse fracture, connecting rod and conducting block downwardly moving, because the length of connecting rod is less than resistance substrate height, consequently the conducting block of downside inserts the partition inslot of reserve resistance again after the partition groove that upper side conducting block breaks away from resistance element, because reserve resistance's both ends are connected with the reserve resistance of both sides respectively, consequently make the device still normally use, reduced the fault rate through reserve resistance's setting.
The beneficial effects of the application are as follows:
1. according to the chip resistor, the first front electrode, the second front electrode and the third front electrode are in staggered lap joint with the resistor element, the first protective layer and the second protective layer, so that the expansion of the end part of the first protective layer is limited by the third front electrode, the accumulated expansion amount is further reduced, and the risk that a nickel plating layer or a tin plating layer is jacked up is further reduced.
2. According to the chip resistor, the first release hole, the second release hole and the avoidance groove are arranged, so that the chip resistor has the advantages of being good in wear resistance, buffering performance and heat dissipation performance.
Drawings
The application is further described below with reference to the accompanying drawings.
FIG. 1 is a perspective view of the present application;
FIG. 2 is a cross-sectional view of the present application;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is a partial enlarged view at B in FIG. 2;
in the figure:
1. a resistor substrate; 11. a chute; 12. a connecting rod; 13. a conductive block; 14. a communication hole; 15. a fuse; 2. tinning; 21. a nickel plating layer; 3. a second protective layer; 31. a second release hole; 4. a first front electrode; 41. a side electrode; 42. a back electrode; 43. a second front electrode; 44. a third front electrode; 441. a step surface; 442. an avoidance groove; 443. a sealing film; 444. indentation; 5. a resistive element; 51. a standby resistor; 52. a partition groove; 6. a first protective layer; 61. a first release hole; 62. slotting; 7. and an insulating protective layer.
Detailed Description
The application is further described in connection with the following detailed description in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the application easy to understand.
As shown in fig. 1 to 4, a chip resistor includes a resistor substrate 1 and a resistor element 5, with a use direction as a reference, the middle part of the upper end of the resistor substrate 1 is provided with the resistor element 5, the resistor substrate 1 on the left and right sides of the resistor element 5 is provided with a first front electrode 4, and two ends of the resistor element 5 are respectively overlapped on the ends of the first front electrodes 4 on the two sides; the upper end of the first front electrode 4 is provided with a second front electrode 43, and one end of the inner side of the second front electrode 43 is lapped on the end part of the resistance element 5; the middle part of the upper end of the resistor element 5 is provided with a first protective layer 6, and two ends of the first protective layer 6 are respectively lapped on the end parts of the two front electrodes; a third front electrode 44 is arranged at the upper end of the second front electrode 43, and one end of the inner side of the third front electrode 44 is lapped on the end part of the first protective layer 6; the upper end of the first protective layer 6 is provided with a second protective layer 3, and two ends of the second protective layer 3 are respectively overlapped on the end parts of the third front electrode 44; the two sides of the resistor substrate 1 are provided with side electrodes 41 with vertical parts at the two sides, the upper ends of the side electrodes 41 are connected with one end of the outer side of the first front electrode 4, and the left and right sides of the lower end of the resistor substrate 1 are symmetrically provided with rear electrodes 42 connected with the lower end of the rear electrode 42; the outer side of the side electrode 41 is provided with a nickel plating layer 21 for coating the side electrode, the upper end of the nickel plating layer 21 extends to the position of the second protective layer 3 along the surface of the third front electrode 44 and coats the end part of the second protective layer 3, the lower end of the nickel plating layer 21 extends along the surface of the back electrode 42 and coats the back electrode 42, and a layer of tin plating layer 2 is coated outside the nickel plating layer 21.
When in use, the first front electrode 4, the second front electrode 43 and the third front electrode 44 are in staggered lap joint with the resistor element 5, the first protective layer 6 and the second protective layer 3, so that the expansion of the end part of the first protective layer 6 is limited by the third front electrode 44, the accumulated expansion amount is further reduced, and the risk that the nickel plating layer 21 or the tin plating layer 2 is jacked up is further reduced; the staggered parts also achieve the purpose of prolonging the gas flow path, so that even if the nickel plating layer 21 or the tin plating layer 2 is propped up, gas is difficult to enter the position of the resistor element 5 from the bent path, thereby improving the performance stability of the chip resistor, avoiding the problem that the resistor element 5 is corroded and damaged, enabling the chip resistor to be used normally, and avoiding the problem that the performance of the chip resistor is reduced due to welding.
The first protective layer 6 is made of elastic epoxy resin, and the second protective layer 3 is made of wear-resistant epoxy resin.
Through the setting of first protective layer 6 and second protective layer 3, can enough layer reduce mechanical wear and lead to the unusual problem of circuit, can realize certain buffering again under the circumstances of packaging structure stability, avoid resistance element 5 to be damaged by the collision, consequently improved life.
The lower side surface of the first protective layer 6 is provided with a plurality of non-penetrating first release holes 61 at intervals along the left-right direction, and the first release holes 61 are downwards opened and vertically arranged.
Through the setting of first release hole 61, can be used for releasing the elastic deformation that first protective layer 6 leads to because of external force impact or thermal expansion, and then reduce its tip and to the extrusion force of third positive electrode 44, further reduced tin-plating layer 2 and nickel-plating layer 21 by the top open lead to outside gas entering and corrode resistance element 5's risk, and then prolonged resistance element 5's life.
The upper end of the second protective layer 3 is provided with a plurality of non-penetrating second release holes 31, and the second release holes 31 are arranged vertically with openings upwards.
By providing the second release holes 31, on the one hand, the deformation of the second protective layer 3 can be released, the probability of the tin plating layer 2 and the nickel plating layer 21 being pushed up is further reduced, and the resistance element 5 is protected from corrosion damage; on the other hand, the second release hole 31 is matched with the first release hole 61, so that the heat dissipation area is increased while the heat dissipation distance is shortened, the heat dissipation path and the heat dissipation condition are improved under the condition of ensuring the air tightness, the heat dissipation performance is further improved, the further improvement of the power of the chip resistor is ensured, and the chip resistor is further realized in consideration of the wear resistance, the buffering performance and the heat dissipation performance; in addition, the second release holes 31 can be combined and arranged in a pattern as required to realize the function of identification.
A step surface 441 matched with the third front electrode 44 is arranged at one end of the third front electrode 44 facing the first protective layer 6, the step surface 441 is vertically arranged and provided with an avoidance groove 442, a sealing film 443 crossing the avoidance groove 442 is arranged on the step surface 441, and two ends of the sealing film 443 form end face sealing with the step surface 441; the middle part of the sealing film 443 is provided with reserved indentations 444, and the end face of the first protective layer 6 is abutted against the sealing film 443 and provided with slits 62 matched with the positions of the indentations 444.
Through the arrangement of the avoiding groove 442 and the sealing film 443, the end face of the first protective layer 6 can expand to one side of the avoiding groove 442 when welding is heated, so that the end of the first protective layer is separated at the cutting seam 62, and the sealing film 443 is torn from the middle along the indentation 444 and then is pushed into the avoiding groove 442, the release of pressure is further realized, and the nickel plating layer 21 and the tin plating layer 2 are prevented from being pushed open due to collision; at the same time, the sealing film 443 on the stepped surface 441 is pressed more tightly by the end of the first protective layer 6, and thus still has the effect of gas sealing, preventing gas from entering the corrosion resistance element 5.
A spare resistor 51 is arranged at the lower end of the resistor substrate 1 between the back electrodes 42, and an insulating protection layer 7 is arranged at the lower end of the spare resistor 51; a partition groove 52 is provided in the middle of each of the backup resistor 51 and the resistor element 5, and the partition groove 52 divides each of the backup resistor 51 and the resistor element 5 into two divided resistors separated from each other; the resistor substrate 1 is provided with a chute 11 matched with the partition groove 52, a connecting rod 12 with the length smaller than the height of the resistor substrate 1 is arranged in the chute 11, the upper end and the lower end of the connecting rod 12 are respectively provided with a conductive block 13, the upper conductive block 13 is positioned in the partition groove 52 of the resistor element 5 and is provided with a through hole 14 which penetrates left and right, and a fuse 15 which is connected with the left and right sides of the through hole 14 to divide the resistor body is arranged in the through hole 14. Through the setting of fuse 15, it can blow when the instantaneous current is too big, protection resistance element 5 overheat damages, simultaneously when fuse 15 breaks, connecting rod 12 and conducting block 13 downwardly moving, because the length of connecting rod 12 is less than resistance base plate 1 height, consequently the conducting block 13 of downside inserts in the partition groove 52 of reserve resistance 51 again after upper side conducting block 13 breaks away from the partition groove 52 of resistance element 5, because reserve resistance 51's both ends are connected with reserve resistance 51 of both sides respectively, consequently make the device still can normal use, the fault rate has been reduced through the setting of reserve resistance 51.
By interdigitating the first front electrode 4, the second front electrode 43, and the third front electrode 44 with the resistive element 5, the first protective layer 6, and the second protective layer 3, the expansion of the end portion of the first protective layer 6 is limited by the third front electrode 44, thereby reducing the amount of accumulated expansion and further reducing the risk of the nickel plating layer 21 or the tin plating layer 2 being lifted up; the staggered parts also achieve the purpose of prolonging the gas flow path, so that even if the nickel plating layer 21 or the tin plating layer 2 is propped up, gas is difficult to enter the resistance element 5 from the bent path, thereby improving the performance stability of the chip resistor, avoiding the problem that the resistance element 5 is corroded and damaged, enabling the chip resistor to be used normally, and avoiding the problem that the performance of the chip resistor is reduced due to welding; through the arrangement of the first protective layer 6 and the second protective layer 3, the problem of circuit abnormality caused by mechanical abrasion can be reduced, and certain buffering can be realized under the condition of the stability of a packaging structure, so that the resistor element 5 is prevented from being damaged by collision, and the service life is prolonged; by arranging the first release holes 61, the elastic deformation of the first protective layer 6 caused by external impact or thermal expansion can be released, so that the extrusion force of the end part of the first protective layer to the third front electrode 44 is reduced, the risk that external air enters to corrode the resistor element 5 due to the ejection of the tin-plated layer 2 and the nickel-plated layer 21 is further reduced, and the service life of the resistor element 5 is prolonged; by providing the second release holes 31, on the one hand, the deformation of the second protective layer 3 can be released, the probability of the tin plating layer 2 and the nickel plating layer 21 being pushed up is further reduced, and the resistance element 5 is protected from corrosion damage; on the other hand, the second release hole 31 is matched with the first release hole 61, so that the heat dissipation area is increased while the heat dissipation distance is shortened, the heat dissipation path and the heat dissipation condition are improved under the condition of ensuring the air tightness, the heat dissipation performance is further improved, the further improvement of the power of the chip resistor is ensured, and the chip resistor is further realized in consideration of the wear resistance, the buffering performance and the heat dissipation performance; in addition, the second release holes 31 can be combined and arranged in a pattern according to the requirement, so as to realize the function of identification; through the arrangement of the avoiding groove 442 and the sealing film 443, the end face of the first protective layer 6 can expand to one side of the avoiding groove 442 when welding is heated, so that the end of the first protective layer is separated at the cutting seam 62, and the sealing film 443 is torn from the middle along the indentation 444 and then is pushed into the avoiding groove 442, the release of pressure is further realized, and the nickel plating layer 21 and the tin plating layer 2 are prevented from being pushed open due to collision; meanwhile, the sealing film 443 on the step surface 441 is pressed more tightly by the end part of the first protective layer 6, so that the effect of gas sealing is still achieved, and gas is prevented from entering the corrosion resistance element 5; through the setting of fuse 15, it can blow when the instantaneous current is too big, protection resistance element 5 overheat damages, simultaneously when fuse 15 breaks, connecting rod 12 and conducting block 13 downwardly moving, because the length of connecting rod 12 is less than resistance base plate 1 height, consequently the conducting block 13 of downside inserts in the partition groove 52 of reserve resistance 51 again after upper side conducting block 13 breaks away from the partition groove 52 of resistance element 5, because reserve resistance 51's both ends are connected with reserve resistance 51 of both sides respectively, consequently make the device still can normal use, the fault rate has been reduced through the setting of reserve resistance 51.
The foregoing has shown and described the basic principles, principal features and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made without departing from the spirit and scope of the application, which is defined in the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.
Claims (6)
1. The patch resistor is characterized by comprising a resistor substrate (1) and a resistor element (5), wherein the resistor element (5) is arranged in the middle of the upper end of the resistor substrate (1) based on the use direction, first front electrodes (4) are arranged on the resistor substrate (1) on the left side and the right side of the resistor element (5), and two ends of the resistor element (5) are respectively lapped on the end parts of the first front electrodes (4) on the two sides; the upper end of the first front electrode (4) is provided with a second front electrode (43), and one end of the inner side of the second front electrode (43) is lapped on the end part of the resistor element (5); a first protective layer (6) is arranged in the middle of the upper end of the resistor element (5), and two ends of the first protective layer (6) are respectively lapped on the end parts of the two front electrodes; a third front electrode (44) is arranged at the upper end of the second front electrode (43), and one end of the inner side of the third front electrode (44) is lapped on the end part of the first protective layer (6); the upper end of the first protective layer (6) is provided with a second protective layer (3), and two ends of the second protective layer (3) are respectively lapped on the end part of the third front electrode (44); the resistor substrate (1) is provided with side electrodes (41) with vertical parts at two sides, the upper ends of the side electrodes (41) are connected with one end of the outer side of the first front electrode (4), and the left and right sides of the lower end of the resistor substrate (1) are symmetrically provided with back electrodes (42) connected with the lower end of the back electrode (42); the side electrode (41) outside is provided with nickel plating layer (21) of cladding it, nickel plating layer (21) upper end extends to second protective layer (3) department and cladding second protective layer (3) tip along third front electrode (44) surface, nickel plating layer (21) lower extreme extends and cladding back electrode (42) along back electrode (42) surface, nickel plating layer (21) outsourcing cladding has one deck tin plating layer (2).
2. A chip resistor according to claim 1, characterized in that the first protective layer (6) is made of an elastic epoxy resin and the second protective layer (3) is made of a wear-resistant epoxy resin.
3. A chip resistor according to claim 2, wherein a plurality of non-penetrating first release holes (61) are arranged on the lower side of the first protective layer (6) at intervals in the left-right direction, and the first release holes (61) are arranged vertically with the openings downward.
4. A chip resistor according to claim 3, characterized in that the upper end of the second protective layer (3) is provided with a plurality of non-penetrating second release holes (31), the second release holes (31) being arranged vertically with the opening upwards.
5. A chip resistor according to claim 4, wherein a step surface (441) matched with the third front electrode (44) is arranged towards one end of the first protective layer (6), the step surface (441) is vertically arranged and provided with an avoidance groove (442), a sealing film (443) crossing the avoidance groove (442) is arranged on the step surface (441), and two ends of the sealing film (443) form end face sealing with the step surface (441); the middle part of sealing membrane (443) is provided with reserved indentation (444), first protective layer (6) terminal surface is contradicted with sealing membrane (443) and is provided with slit (62) with indentation (444) position matching.
6. A chip resistor according to claim 5, characterized in that a backup resistor (51) is provided at the lower end of the resistive substrate (1) between the back electrodes (42), and an insulating protective layer (7) is provided at the lower end of the backup resistor (51); the standby resistor (51) and the middle part of the resistor element (5) are respectively provided with a separation groove (52), and the separation grooves (52) divide the standby resistor (51) and the resistor element (5) into two split resistor bodies which are separated left and right; the resistor substrate (1) is provided with a chute (11) matched with the partition groove (52), a connecting rod (12) with the length smaller than the height of the resistor substrate (1) is arranged in the chute (11), conductive blocks (13) are arranged at the upper end and the lower end of the connecting rod (12), the upper conductive blocks (13) are positioned in the partition groove (52) of the resistor element (5) and are provided with communication holes (14) which are communicated left and right, and fuse wires (15) which are connected with the left side and the right side of the communication holes (14) to divide the resistor body are arranged in the communication holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210778486.6A CN114974760B (en) | 2022-06-30 | 2022-06-30 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210778486.6A CN114974760B (en) | 2022-06-30 | 2022-06-30 | Chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114974760A CN114974760A (en) | 2022-08-30 |
| CN114974760B true CN114974760B (en) | 2023-11-17 |
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| CN202210778486.6A Active CN114974760B (en) | 2022-06-30 | 2022-06-30 | Chip resistor |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335106A (en) * | 1997-05-27 | 1998-12-18 | Taiyoushiya Denki Kk | Chip resistor |
| CN103165250A (en) * | 2013-04-09 | 2013-06-19 | 昆山厚声电子工业有限公司 | Thick-film anti-vulcanization paster resistor and manufacturing method thereof |
| CN203165596U (en) * | 2013-04-09 | 2013-08-28 | 昆山厚声电子工业有限公司 | Thick-film vulcanization-resisting patch resistor |
| CN209880842U (en) * | 2019-02-28 | 2019-12-31 | 四川健坤科技有限公司 | Flexible graphite grounding body connection structure |
| CN210713305U (en) * | 2019-09-06 | 2020-06-09 | 济南捷源新材料有限公司 | Assembled single-face composite wallboard |
-
2022
- 2022-06-30 CN CN202210778486.6A patent/CN114974760B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335106A (en) * | 1997-05-27 | 1998-12-18 | Taiyoushiya Denki Kk | Chip resistor |
| CN103165250A (en) * | 2013-04-09 | 2013-06-19 | 昆山厚声电子工业有限公司 | Thick-film anti-vulcanization paster resistor and manufacturing method thereof |
| CN203165596U (en) * | 2013-04-09 | 2013-08-28 | 昆山厚声电子工业有限公司 | Thick-film vulcanization-resisting patch resistor |
| CN209880842U (en) * | 2019-02-28 | 2019-12-31 | 四川健坤科技有限公司 | Flexible graphite grounding body connection structure |
| CN210713305U (en) * | 2019-09-06 | 2020-06-09 | 济南捷源新材料有限公司 | Assembled single-face composite wallboard |
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| CN114974760A (en) | 2022-08-30 |
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Effective date of registration: 20231023 Address after: 350003 No. 257, 54 Road, Gulou District, Fuzhou, Fujian Applicant after: STATE GRID FUJIAN ELECTRIC POWER Co.,Ltd. Applicant after: ZHANGZHOU ELECTRIC POWER SUPPLY COMPANY OF STATE GRID FUJIAN ELECTRIC POWER Co.,Ltd. Applicant after: State Grid Fujian Electric Power Co., Ltd. Nanjing County Power Supply Co. Address before: 233200 standardized workshop in Dingyuan Economic Development Zone, Chuzhou City, Anhui Province Applicant before: Anhui Lingbo Electronic Technology Co.,Ltd. |
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