CN114974760A - Chip resistor - Google Patents
Chip resistor Download PDFInfo
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- CN114974760A CN114974760A CN202210778486.6A CN202210778486A CN114974760A CN 114974760 A CN114974760 A CN 114974760A CN 202210778486 A CN202210778486 A CN 202210778486A CN 114974760 A CN114974760 A CN 114974760A
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- 239000011241 protective layer Substances 0.000 claims abstract description 73
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000011248 coating agent Substances 0.000 claims abstract description 14
- 238000000576 coating method Methods 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 57
- 238000007789 sealing Methods 0.000 claims description 28
- 238000007373 indentation Methods 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 238000005253 cladding Methods 0.000 claims 3
- 238000007747 plating Methods 0.000 description 30
- 230000017525 heat dissipation Effects 0.000 description 20
- 230000001681 protective effect Effects 0.000 description 11
- 230000003139 buffering effect Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 230000002035 prolonged effect Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000005489 elastic deformation Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/08—Cooling, heating or ventilating arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Details Of Resistors (AREA)
Abstract
The invention relates to the technical field of resistors, in particular to a chip resistor, which comprises a resistor substrate and a resistor element, wherein the resistor element is arranged in the middle of the upper end of the resistor substrate by taking the using direction as a reference, first front electrodes are arranged on the resistor substrate on the left side and the right side of the resistor element, and two ends of the resistor element are respectively lapped on the end parts of the first front electrodes on the two sides; a second front electrode is arranged at the upper end of the first front electrode, and one end of the inner side of the second front electrode is lapped on the end part of the resistance element; through with first positive electrode, second positive electrode and third positive electrode and resistance element, first protective layer and the crisscross overlap joint of second protective layer for the inflation of the tip of first protective layer is restricted by third positive electrode, and then has reduced the volume of accumulative total inflation, and then reduces the risk that nickel coating or tin coating were backed up.
Description
Technical Field
The invention relates to the technical field of resistors, in particular to a chip resistor.
Background
With the progress of science and technology, the development of times and the diversification of the requirements of people on electronic products, more and more products with appreciation properties are needed, wherein the LED soft light bars are one of the products, and the products add dazzling colors to the night scene of a city. Chip resistors, also known as chip resistors, are widely used because of their small size, light weight, suitability for reflow soldering and wave soldering, stable electrical performance, high reliability, low assembly cost, matching with automatic mounting equipment, high mechanical strength, superior high frequency characteristics, and the like.
Chinese patent (application number: 2019111489118) discloses a chip resistor for precision instruments, including the chip resistor body, the middle part fixed mounting of chip resistor body has the base plate, the upper surface of base plate is seted up flutedly, the through hole has been seted up to the inside wall of recess, the inner chamber fixed mounting of base plate has resistive element, and resistive element is including conducting wire and single crystal, and the outer wall fixed mounting of single crystal has the connecting block. But it has the following disadvantages: 1. when a customer wave-soldering or reflow soldering is carried out on the chip resistor on the PCB, the first protective film and the second protective film are made of thermosetting epoxy resin generally, and the protective sleeves are made of nickel plating and tin plating generally, so that the expansion coefficients of the first protective film and the second protective film are different from those of the protective sleeves, and the protective sleeves overlapped on the edges of the second protective films are easy to be jacked open, so that external gas can enter to corrode the resistor element, and the resistor element cannot be normally used; 2. the resistance element is sealed under the second protective film so as to be protected from mechanical wear or impact damage, but the heat dissipation performance of the resistance element is also reduced, and compatibility is difficult.
For this application has designed a chip resistor, through with first positive electrode, second positive electrode and third positive electrode and resistance element, first protective layer and the crisscross overlap joint of second protective layer for the inflation of the tip of first protective layer is restricted by third positive electrode, and then has reduced the volume of accumulative total inflation, and then reduces nickel coating or tin coating and is backed up the risk of opening.
Disclosure of Invention
In order to make up for the defects of the prior art and solve the problem that the protective sleeve overlapped on the edge of the second protective film is easy to be jacked open when the conventional chip resistor is welded, so that external gas can enter and corrode a resistance element, and the resistor element cannot be normally used.
The technical scheme adopted by the invention for solving the technical problems is as follows: a chip resistor comprises a resistor substrate and a resistor element, wherein the resistor element is arranged in the middle of the upper end of the resistor substrate by taking the using direction as a reference, first front electrodes are arranged on the resistor substrate on the left side and the right side of the resistor element, and two ends of the resistor element are respectively lapped on the end parts of the first front electrodes on the two sides; a second front electrode is arranged at the upper end of the first front electrode, and one end of the inner side of the second front electrode is lapped on the end part of the resistance element; a first protective layer is arranged in the middle of the upper end of the resistor element, and two ends of the first protective layer are respectively lapped on the end parts of the two front electrodes; a third front electrode is arranged at the upper end of the second front electrode, and one end of the inner side of the third front electrode is lapped on the end part of the first protective layer; a second protective layer is arranged at the upper end of the first protective layer, and two ends of the second protective layer are respectively lapped on the end part of the third front electrode; the two sides of the resistance substrate are provided with side electrodes with vertical parts, the upper ends of the side electrodes are connected with one end of the outer side of the first front electrode, and the left side and the right side of the lower end of the resistance substrate are symmetrically provided with back electrodes connected with the lower end of the back electrode; the side electrode is provided with a nickel plating layer covering the side electrode, the upper end of the nickel plating layer extends to the second protective layer along the surface of the third front electrode and covers the end part of the second protective layer, the lower end of the nickel plating layer extends along the surface of the back electrode and covers the back electrode, and the nickel plating layer is covered with a tin plating layer.
The first front electrode, the second front electrode and the third front electrode are in staggered lap joint with the resistance element, the first protective layer and the second protective layer, so that the expansion of the end part of the first protective layer is limited by the third front electrode, the accumulated expansion amount is reduced, and the risk that the nickel-plated layer or the tin-plated layer is jacked open is reduced; meanwhile, the purpose of prolonging the gas flow path is achieved by the staggered parts, so that even if the nickel plating layer or the tin plating layer is pushed open, gas is difficult to enter the resistance element from the bent path, the performance stability of the chip resistor is improved, the problem that the resistance element is corroded and damaged is solved, the chip resistor can be normally used, and the problem that the performance of the chip resistor is reduced due to welding is solved.
Preferably, the first protective layer is made of elastic epoxy resin, and the second protective layer is made of wear-resistant epoxy resin.
Through the setting of first protective layer and second protective layer, can enough layer reduce mechanical wear and lead to the unusual problem of circuit, can realize certain buffering again under the condition of packaging structure stability, avoid resistive element to be damaged by the collision, consequently improved life.
Preferably, a plurality of first non-through release holes are arranged on the lower side surface of the first protection layer at intervals in the left-right direction, and the openings of the first release holes are downward and vertically arranged.
Through the setting of first release hole, can be used for releasing the elastic deformation that first protective layer leads to because of external force impact or thermal expansion, and then reduce its tip to the extrusion force of third positive electrode, further reduced tin coating and nickel coating and pushed open the risk that leads to the outside gas to get into and corrode resistance element by the liftout, and then prolonged resistance element's life.
Preferably, the upper end of the second protective layer is provided with a plurality of non-through second release holes, and the second release holes are opened upwards and vertically arranged.
Through the arrangement of the second release holes, on one hand, the deformation of the second protective layer can be released, the probability that the tin-plated layer and the nickel-plated layer are pushed open is further reduced, and the resistance element is protected from being corroded and damaged; on the other hand, the second release holes are matched with the first release holes, so that the heat dissipation distance is shortened, the heat dissipation area is increased, the heat dissipation path and the heat dissipation condition are improved under the condition of ensuring the air tightness, the heat dissipation performance is further improved, the power of the chip resistor is further improved, and the chip resistor is further considered in the aspects of wear resistance, buffering performance and heat dissipation performance; in addition, the second release holes can be combined and arranged to form patterns according to needs, and the function of identification is achieved.
Preferably, a step surface matched with the third front electrode is arranged at one end, facing the first protective layer, of the third front electrode, the step surface is vertically arranged and provided with an avoiding groove, a sealing film crossing the avoiding groove is arranged on the step surface, and two ends of the sealing film and the step surface form end face sealing; the middle part of the sealing film is provided with a reserved indentation, and the end face of the first protection layer is abutted against the sealing film and is provided with a slot matched with the indentation.
Through the arrangement of the avoiding groove and the sealing film, the end face of the first protective layer can expand towards one side of the avoiding groove when being welded and heated, so that the end part of the first protective layer is separated at the cutting seam and is pushed into the avoiding groove after the sealing film is torn from the middle part along the indentation, the release of pressure is further realized, and the nickel plating layer and the tin plating layer are prevented from being pushed open due to collision; meanwhile, the sealing film on the surface of the step is pressed more tightly by the end part of the first protection layer, so that the gas sealing effect is still achieved, and gas is prevented from entering the corrosion resistance element.
Preferably, a spare resistor is arranged at the lower end of the resistor substrate between the back electrodes, and an insulating protective layer is arranged at the lower end of the spare resistor; the spare resistor and the resistor element are divided into two divided resistors which are separated from each other left and right by the separating grooves; the resistor comprises a resistor element and is characterized in that a sliding groove matched with a partition groove is formed in the resistor substrate, a connecting rod with the length smaller than the height of the resistor substrate is arranged in the sliding groove, conductive blocks are arranged at the upper end and the lower end of the connecting rod, the conductive block at the upper side is located in the partition groove of the resistor element and is provided with a communicating hole which is communicated with the left side and the right side, and a fuse wire which is connected with the left side and the right side of the communicating hole to divide the resistor body is arranged in the communicating hole.
Through the setting of fuse, it can be at the too big fusing of instantaneous current, protection resistance element overheat damages, simultaneously when the fuse is cracked, connecting rod and conducting block move down, because the length of connecting rod is less than the resistance substrate height, consequently the conducting block of downside reinserts spare resistance's wall inslot behind the last conducting block of upper side breaks away from resistive element's the wall groove, because spare resistance's both ends are connected with the spare resistance of both sides respectively, consequently make the device still can normal use, the fault rate has been reduced through spare resistance's setting.
The invention has the following beneficial effects:
1. according to the chip resistor, the first front electrode, the second front electrode and the third front electrode are in staggered lap joint with the resistance element, the first protection layer and the second protection layer, so that expansion of the end part of the first protection layer is limited by the third front electrode, the accumulated expansion amount is further reduced, and the risk that a nickel plating layer or a tin plating layer is jacked open is further reduced.
2. According to the chip resistor, the first release hole, the second release hole and the avoidance groove are arranged, so that the chip resistor is good in abrasion resistance, buffering performance and heat dissipation performance.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an enlarged view of a portion of FIG. 2 at A;
FIG. 4 is an enlarged view of a portion of FIG. 2 at B;
in the figure:
1. a resistance substrate; 11. a chute; 12. a connecting rod; 13. a conductive block; 14. a communicating hole; 15. fusing the wires; 2. plating a tin layer; 21. plating a nickel layer; 3. a second protective layer; 31. a second release hole; 4. a first front electrode; 41. a side electrode; 42. a back electrode; 43. a second front electrode; 44. a third front electrode; 441. a step surface; 442. an avoidance groove; 443. a sealing film; 444. indentation; 5. a resistance element; 51. a standby resistor; 52. a blocking groove; 6. a first protective layer; 61. a first release hole; 62. slotting; 7. and an insulating protective layer.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 4, a chip resistor includes a resistor substrate 1 and a resistor element 5, wherein the resistor element 5 is disposed in the middle of the upper end of the resistor substrate 1 based on the use direction, first front electrodes 4 are disposed on the resistor substrate 1 on the left and right sides of the resistor element 5, and two ends of the resistor element 5 are respectively connected to the ends of the first front electrodes 4 on the two sides in an overlapping manner; a second front electrode 43 is arranged at the upper end of the first front electrode 4, and one end of the inner side of the second front electrode 43 is lapped on the end part of the resistance element 5; a first protective layer 6 is arranged in the middle of the upper end of the resistor element 5, and two ends of the first protective layer 6 are respectively lapped on the end parts of the two front electrodes; a third front electrode 44 is arranged at the upper end of the second front electrode 43, and one end of the inner side of the third front electrode 44 is lapped on the end part of the first protective layer 6; the second protective layer 3 is arranged at the upper end of the first protective layer 6, and two ends of the second protective layer 3 are respectively lapped on the end part of the third front electrode 44; the two sides of the resistor substrate 1 are provided with side electrodes 41 with vertical parts, the upper ends of the side electrodes 41 are connected with one end of the outer side of the first front electrode 4, and the left and right sides of the lower end of the resistor substrate 1 are symmetrically provided with back electrodes 42 connected with the lower ends of the back electrodes 42; the outer side of the side electrode 41 is provided with a nickel plating layer 21 for coating the side electrode, the upper end of the nickel plating layer 21 extends to the second protective layer 3 along the surface of the third front electrode 44 and coats the end part of the second protective layer 3, the lower end of the nickel plating layer 21 extends along the surface of the back electrode 42 and coats the back electrode 42, and the nickel plating layer 21 is coated with a tin plating layer 2.
When the multilayer capacitor is used, the first front electrode 4, the second front electrode 43 and the third front electrode 44 are in staggered lap joint with the resistance element 5, the first protection layer 6 and the second protection layer 3, so that the expansion of the end part of the first protection layer 6 is limited by the third front electrode 44, the accumulated expansion amount is further reduced, and the risk that the nickel plating layer 21 or the tin plating layer 2 is jacked open is further reduced; meanwhile, the purpose of prolonging the gas flow path is achieved by the staggered parts, so that even if the nickel plating layer 21 or the tin plating layer 2 is pushed open, gas is difficult to enter the resistance element 5 from the bent path, the performance stability of the chip resistor is improved, the problem that the resistance element 5 is corroded and damaged is avoided, the chip resistor can be normally used, and the problem that the performance of the chip resistor is reduced due to welding is avoided.
The first protective layer 6 is made of elastic epoxy resin, and the second protective layer 3 is made of wear-resistant epoxy resin.
Through the setting of first protective layer 6 and second protective layer 3, can enough layer reduce mechanical wear and lead to the unusual problem of circuit, can realize certain buffering again under the condition of packaging structure stability, avoid resistive element 5 to be damaged by the collision, consequently improved life.
A plurality of first non-through release holes 61 are arranged at intervals along the left-right direction on the lower side of the first protective layer 6, and the first release holes 61 are opened downwards and vertically.
Through the setting of first release hole 61, can be used for releasing first protective layer 6 because of the elastic deformation that external force impact or thermal expansion lead to, and then reduce its tip to the extrusion force of third positive electrode 44, further reduced tin coating 2 and nickel coating 21 and pushed open and lead to the risk that outside gas got into and corrode resistive element 5 by the liftout, and then prolonged resistive element 5's life.
The upper end of the second protective layer 3 is provided with a plurality of non-through second release holes 31, and the second release holes 31 are opened upwards and vertically arranged.
Through the arrangement of the second release holes 31, on one hand, the deformation of the second protective layer 3 can be released, the probability that the tin-plated layer 2 and the nickel-plated layer 21 are pushed open is further reduced, and the resistance element 5 is protected from being damaged by corrosion; on the other hand, the second release holes 31 are matched with the first release holes 61, so that the heat dissipation distance is shortened, the heat dissipation area is increased, the heat dissipation path and the heat dissipation condition are improved under the condition of ensuring the air tightness, the heat dissipation performance is further improved, the power of the chip resistor is further improved, and the chip resistor is further considered in terms of wear resistance, buffering performance and heat dissipation performance; in addition, the second release holes 31 can be combined and arranged to form a pattern as required, so that the function of identification is realized.
The third front electrode 44 is provided with a step surface 441 matched with one end of the first protection layer 6, the step surface 441 is vertically arranged and provided with an avoiding groove 442, a sealing film 443 spanning the avoiding groove 442 is arranged on the step surface 441, and both ends of the sealing film 443 form end face sealing with the step surface 441; the middle part of the sealing film 443 is provided with a reserved indentation 444, and the end face of the first protection layer 6 is abutted against the sealing film 443 and is provided with a cut 62 matched with the indentation 444 in position.
Through the arrangement of the avoiding groove 442 and the sealing film 443, the end face of the first protective layer 6 can expand towards the avoiding groove 442 when the welding is heated, so that the end parts of the first protective layer are separated at the cutting seam 62 and are pushed into the avoiding groove 442 after the sealing film 443 is torn from the middle part along the indentation 444, the pressure is further released, and the nickel plating layer 21 and the tin plating layer 2 are prevented from being pushed away due to collision; meanwhile, the sealing film 443 on the step surface 441 is pressed more tightly by the end portion of the first protect layer 6, and thus the gas sealing effect is still achieved, and gas is prevented from entering the corrosion resistance element 5.
A spare resistor 51 is arranged at the lower end of the resistor substrate 1 between the back electrodes 42, and an insulating protective layer 7 is arranged at the lower end of the spare resistor 51; the spare resistor 51 and the resistor element 5 are respectively provided with a separating groove 52 in the middle, and the spare resistor 51 and the resistor element 5 are respectively divided into two divided resistors which are separated from each other left and right by the separating groove 52; the resistance element comprises a resistance substrate 1 and is characterized in that a sliding groove 11 matched with a partition groove 52 is formed in the resistance substrate 1, a connecting rod 12 with the length smaller than the height of the resistance substrate 1 is arranged in the sliding groove 11, conductive blocks 13 are arranged at the upper end and the lower end of the connecting rod 12, the conductive blocks 13 at the upper side are located in the partition groove 52 of the resistance element 5 and are provided with communicating holes 14 which are communicated from left to right, and fuse wires 15 which are connected with the left side and the right side of the communicating holes to divide the resistance element are arranged in the communicating holes 14. Through the setting of the fuse wire 15, it can be fused when the instantaneous current is too big, protect the overheated damage of resistance element 5, simultaneously when the fuse wire 15 breaks, connecting rod 12 and conducting block 13 move downwards, because the length of connecting rod 12 is less than the resistance base plate 1 height, consequently the conducting block 13 of downside breaks away from the wall groove 52 of resistance element 5 at last conducting block 13 and inserts in the wall groove 52 of spare resistance 51 again, because the both ends of spare resistance 51 are connected with the spare resistance 51 of both sides respectively, consequently make the device still can normal use, the fault rate has been reduced through the setting of spare resistance 51.
By overlapping the first front electrode 4, the second front electrode 43 and the third front electrode 44 with the resistive element 5, the first protective layer 6 and the second protective layer 3 in a staggered manner, the expansion of the end part of the first protective layer 6 is limited by the third front electrode 44, so that the amount of accumulated expansion is reduced, and the risk that the nickel plating layer 21 or the tin plating layer 2 is jacked open is reduced; meanwhile, the staggered parts also achieve the purpose of prolonging the gas flow path, so that even if the nickel-plated layer 21 or the tin-plated layer 2 is pushed open, gas is difficult to enter the resistance element 5 from the bent path, the performance stability of the chip resistor is improved, the problem that the resistance element 5 is corroded and damaged is avoided, the chip resistor can be normally used, and the problem that the performance of the chip resistor is reduced due to welding is avoided; through the arrangement of the first protective layer 6 and the second protective layer 3, the problem of circuit abnormity caused by mechanical abrasion can be reduced, certain buffering can be realized under the condition of stable packaging structure, and the resistance element 5 is prevented from being damaged by collision, so that the service life is prolonged; through the arrangement of the first release holes 61, the elastic deformation of the first protection layer 6 caused by external force impact or thermal expansion can be released, so that the extrusion force of the end part of the first protection layer to the third front electrode 44 is reduced, the risk that external gas enters the resistance element 5 to corrode the resistance element 5 due to the fact that the tin-plated layer 2 and the nickel-plated layer 21 are jacked open is further reduced, and the service life of the resistance element 5 is further prolonged; through the arrangement of the second release holes 31, on one hand, the deformation of the second protective layer 3 can be released, the probability that the tin-plated layer 2 and the nickel-plated layer 21 are pushed open is further reduced, and the resistance element 5 is protected from being damaged by corrosion; on the other hand, the second release holes 31 are matched with the first release holes 61, so that the heat dissipation distance is shortened, the heat dissipation area is increased, the heat dissipation path and the heat dissipation condition are improved under the condition of ensuring the air tightness, the heat dissipation performance is further improved, the power of the chip resistor is further improved, and the chip resistor is further considered in terms of wear resistance, buffering performance and heat dissipation performance; in addition, the second release holes 31 can be combined and arranged to form patterns as required, so that the function of identification is realized; through the arrangement of the avoiding groove 442 and the sealing film 443, the end face of the first protective layer 6 can expand towards the avoiding groove 442 when the welding is heated, so that the end parts of the first protective layer are separated at the cutting seam 62 and are pushed into the avoiding groove 442 after the sealing film 443 is torn from the middle part along the indentation 444, the pressure is further released, and the nickel plating layer 21 and the tin plating layer 2 are prevented from being pushed away due to collision; meanwhile, the sealing film 443 on the step surface 441 is pressed more tightly by the end of the first protective layer 6, so that the gas sealing effect is still achieved, and gas is prevented from entering the resistance element 5; through the setting of the fuse wire 15, it can be fused when the instantaneous current is too big, protect the overheated damage of resistance element 5, simultaneously when the fuse wire 15 breaks, connecting rod 12 and conducting block 13 move downwards, because the length of connecting rod 12 is less than the resistance base plate 1 height, consequently the conducting block 13 of downside breaks away from the wall groove 52 of resistance element 5 at last conducting block 13 and inserts in the wall groove 52 of spare resistance 51 again, because the both ends of spare resistance 51 are connected with the spare resistance 51 of both sides respectively, consequently make the device still can normal use, the fault rate has been reduced through the setting of spare resistance 51.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The chip resistor is characterized by comprising a resistor substrate (1) and a resistor element (5), wherein the resistor element (5) is arranged in the middle of the upper end of the resistor substrate (1) by taking the using direction as a reference, first front electrodes (4) are arranged on the resistor substrate (1) on the left side and the right side of the resistor element (5), and two ends of the resistor element (5) are respectively lapped on the end parts of the first front electrodes (4) on the two sides; a second front electrode (43) is arranged at the upper end of the first front electrode (4), and one end of the inner side of the second front electrode (43) is lapped on the end part of the resistance element (5); a first protective layer (6) is arranged in the middle of the upper end of the resistor element (5), and two ends of the first protective layer (6) are respectively lapped on the end parts of the two front electrodes; a third front electrode (44) is arranged at the upper end of the second front electrode (43), and one end of the inner side of the third front electrode (44) is lapped on the end part of the first protective layer (6); a second protective layer (3) is arranged at the upper end of the first protective layer (6), and two ends of the second protective layer (3) are respectively lapped on the end part of the third front electrode (44); side electrodes (41) with vertical parts are arranged on two sides of the resistor substrate (1), the upper ends of the side electrodes (41) are connected with one end of the outer side of the first front electrode (4), and back electrodes (42) connected with the lower ends of the back electrodes (42) are symmetrically arranged on the left side and the right side of the lower end of the resistor substrate (1); the side electrode (41) outside is provided with its nickel coating (21) of cladding, the tip of second protective layer (3) and cladding second protective layer (3) is extended to along third front electrode (44) surface to nickel coating (21) upper end, nickel coating (21) lower extreme extends and wraps back electrode (42) along back electrode (42) surface, nickel coating (21) outer cladding has one deck tin coating (2).
2. A chip resistor according to claim 1, characterized in that the first protective layer (6) is made of an elastic epoxy resin and the second protective layer (3) is made of a wear-resistant epoxy resin.
3. A chip resistor according to claim 2, characterized in that a plurality of non-through first release holes (61) are arranged at intervals in the left-right direction on the lower side of the first protective layer (6), and the first release holes (61) are opened downward and vertically.
4. A chip resistor according to claim 3, characterized in that the second protective layer (3) is provided at its upper end with a plurality of non-through second release holes (31), the second release holes (31) being open upwards and arranged vertically.
5. A chip resistor according to claim 4, wherein the third front electrode (44) is provided with a step surface (441) matching with the first protection layer (6) towards one end, the step surface (441) is vertically arranged and is provided with an avoiding groove (442), a sealing film (443) crossing the avoiding groove (442) is arranged on the step surface (441), and both ends of the sealing film (443) form end face sealing with the step surface (441); the middle of the sealing film (443) is provided with a reserved indentation (444), the end face of the first protective layer (6) is abutted to the sealing film (443) and is provided with a slot (62) matched with the indentation (444).
6. A chip resistor according to claim 5, characterized in that the lower end of the resistive substrate (1) between the back electrodes (42) is provided with a spare resistor (51), and the lower end of the spare resistor (51) is provided with an insulating protective layer (7); the middle parts of the spare resistor (51) and the resistor element (5) are respectively provided with a separating groove (52), and the spare resistor (51) and the resistor element (5) are respectively divided into two divided resistors which are separated from each other left and right by the separating grooves (52); the resistor is characterized in that a sliding groove (11) matched with the isolating groove (52) is formed in the resistor substrate (1), a connecting rod (12) with the length smaller than the height of the resistor substrate (1) is arranged in the sliding groove (11), conductive blocks (13) are arranged at the upper end and the lower end of the connecting rod (12), the conductive blocks (13) on the upper side are located in the isolating groove (52) of the resistor element (5) and are provided with communicating holes (14) which are communicated left and right, and fuse wires (15) which are connected with the left side and the right side of the communicating holes to divide the resistor body are arranged in the communicating holes (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210778486.6A CN114974760B (en) | 2022-06-30 | 2022-06-30 | Chip resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210778486.6A CN114974760B (en) | 2022-06-30 | 2022-06-30 | Chip resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114974760A true CN114974760A (en) | 2022-08-30 |
| CN114974760B CN114974760B (en) | 2023-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210778486.6A Active CN114974760B (en) | 2022-06-30 | 2022-06-30 | Chip resistor |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335106A (en) * | 1997-05-27 | 1998-12-18 | Taiyoushiya Denki Kk | Chip resistor |
| CN103165250A (en) * | 2013-04-09 | 2013-06-19 | 昆山厚声电子工业有限公司 | Thick-film anti-vulcanization paster resistor and manufacturing method thereof |
| CN203165596U (en) * | 2013-04-09 | 2013-08-28 | 昆山厚声电子工业有限公司 | Thick-film vulcanization-resisting patch resistor |
| CN209880842U (en) * | 2019-02-28 | 2019-12-31 | 四川健坤科技有限公司 | Flexible graphite grounding body connection structure |
| CN210713305U (en) * | 2019-09-06 | 2020-06-09 | 济南捷源新材料有限公司 | Assembled single-face composite wallboard |
-
2022
- 2022-06-30 CN CN202210778486.6A patent/CN114974760B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335106A (en) * | 1997-05-27 | 1998-12-18 | Taiyoushiya Denki Kk | Chip resistor |
| CN103165250A (en) * | 2013-04-09 | 2013-06-19 | 昆山厚声电子工业有限公司 | Thick-film anti-vulcanization paster resistor and manufacturing method thereof |
| CN203165596U (en) * | 2013-04-09 | 2013-08-28 | 昆山厚声电子工业有限公司 | Thick-film vulcanization-resisting patch resistor |
| CN209880842U (en) * | 2019-02-28 | 2019-12-31 | 四川健坤科技有限公司 | Flexible graphite grounding body connection structure |
| CN210713305U (en) * | 2019-09-06 | 2020-06-09 | 济南捷源新材料有限公司 | Assembled single-face composite wallboard |
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| Publication number | Publication date |
|---|---|
| CN114974760B (en) | 2023-11-17 |
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Effective date of registration: 20231023 Address after: 350003 No. 257, 54 Road, Gulou District, Fuzhou, Fujian Applicant after: STATE GRID FUJIAN ELECTRIC POWER Co.,Ltd. Applicant after: ZHANGZHOU ELECTRIC POWER SUPPLY COMPANY OF STATE GRID FUJIAN ELECTRIC POWER Co.,Ltd. Applicant after: State Grid Fujian Electric Power Co., Ltd. Nanjing County Power Supply Co. Address before: 233200 standardized workshop in Dingyuan Economic Development Zone, Chuzhou City, Anhui Province Applicant before: Anhui Lingbo Electronic Technology Co.,Ltd. |
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