CN218631695U - Combined capacitor - Google Patents
Combined capacitor Download PDFInfo
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- CN218631695U CN218631695U CN202222675863.1U CN202222675863U CN218631695U CN 218631695 U CN218631695 U CN 218631695U CN 202222675863 U CN202222675863 U CN 202222675863U CN 218631695 U CN218631695 U CN 218631695U
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Abstract
The application provides a combined capacitor, and relates to the field of capacitors. The combined capacitor includes: an electrically insulating housing, wherein a cavity with an opening is formed in the electrically insulating housing; the electrical insulation shell has electrical insulation; the capacitor combination body is arranged in the cavity; the electric insulation cover plate is provided with a lead hole and is fixed at the opening, and the shape and the size of the electric insulation cover plate are matched with those of the opening; and the lead is connected with the electrode of the capacitor combination main body and extends out of the electric insulation shell from the lead hole. Through using the electrical insulation shell and the electrical insulation cover plate, an isolation layer is not required to be arranged between the shell of the combined capacitor and the capacitor combined main body, the structure of the combined capacitor is simplified, and the volume of the combined capacitor is reduced.
Description
Technical Field
The application relates to the field of capacitors, in particular to a combined capacitor.
Background
The non-solid electrolyte tantalum capacitor can be combined in a mode that a plurality of capacitor monomers are connected in series to obtain a combined non-solid tantalum capacitor, so that the combined non-solid tantalum capacitor can be used in a high-voltage scene.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a conventional combined non-solid tantalum capacitor, in the conventional combined non-solid tantalum capacitor, a plurality of capacitor units are connected to form a capacitor combined main body through leads and are encapsulated in a housing, and the other ends of the leads extend out of the housing, wherein an isolation layer is disposed between the capacitor combined main body and the housing, and the isolation layer is made of an insulating material and is used for electrically isolating the capacitor units from the housing, so as to ensure that the capacitor combined main body is not interfered by electrical conditions in an external environment when working, and to prevent the capacitor combined main body from affecting the housing or an external circuit after being powered on.
However, the existence of the isolation layer makes the internal structure of the combined capacitor complicated, and the isolation layer has a certain volume, which occupies the internal space of the housing, resulting in that the combined capacitor is difficult to be miniaturized.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application is directed to a combined capacitor, so as to simplify the structure of the combined capacitor and reduce the volume of the combined capacitor.
The embodiment of the application provides a combined capacitor, includes: an electrically insulating housing, wherein a cavity with an opening is formed in the electrically insulating housing; the capacitor combination body is arranged in the cavity; the electric insulation cover plate is fixed at the opening, and the shape and the size of the electric insulation cover plate are matched with those of the opening; the electrical insulation shell and the electrical insulation cover plate are both provided with electrical insulation; and the lead is connected with the electrode of the capacitor combination main body and extends out of the electric insulation shell from the lead hole.
In the embodiment of the present application, since the electrical insulation housing and the electrical insulation cover plate both have electrical insulation properties, after the capacitor assembly main body is packaged by the electrical insulation housing and the electrical insulation cover plate (i.e., the capacitor assembly main body is disposed in the cavity of the electrical insulation housing and sealed by the electrical insulation cover plate), electrical isolation between the capacitor unit and the housing can be achieved to a certain extent, thereby reducing interference of electrical conditions in the external environment when the capacitor assembly main body is operated, and avoiding occurrence of conditions that influence is caused to the housing and the external environment when the capacitor assembly main body is operated. Compared with the prior art, the capacitor has the advantages that the effect of realizing electrical isolation between the capacitor single body and the shell can be achieved even if the isolation layer is not arranged, so that the structure of the combined capacitor can be simplified, the occupation of the isolation layer on the inner volume of the combined capacitor is avoided, and the volume of the combined capacitor is reduced.
In one embodiment, the edge of the electrically insulating cover plate is step-shaped; the length of the short side of the electrical insulation cover plate is smaller than or equal to the inner diameter of the electrical insulation shell, and the length of the long side of the electrical insulation cover plate is larger than or equal to the outer diameter of the electrical insulation shell.
In the embodiment of the application, the edge of the electrical insulation cover plate is set to be step-shaped, the length of the short side of the electrical insulation cover plate is less than or equal to the inner diameter of the electrical insulation shell, and the length of the long side of the electrical insulation cover plate is greater than or equal to the outer diameter of the electrical insulation shell.
In one embodiment, the electrically insulating housing and the electrically insulating cover plate are connected by a temperature-resistant inorganic adhesive.
In the embodiment of the application, combined type capacitor can use under the environment of high temperature, and inorganic glue through using tolerance temperature is connected, can avoid inorganic glue to receive the high temperature condition to influence the condition that makes electrical property insulating housing and electrical property insulating cover plate drop and take place, improves combined type capacitor's stability.
In one embodiment, the inorganic paste has a thermal expansion coefficient, and a difference between the thermal expansion coefficient of the inorganic paste and the thermal expansion coefficient of the electrically insulating housing is within a predetermined range.
In the embodiment of the application, the inorganic adhesive has a thermal expansion coefficient, and a difference value between the thermal expansion coefficient of the inorganic adhesive and the thermal expansion coefficient of the electrical insulation shell is within a preset range, that is, the thermal expansion coefficient of the inorganic adhesive is similar to the thermal expansion coefficient of the electrical insulation shell, so that the problem that the electrical insulation shell of the combined capacitor is cracked due to expansion of the inorganic adhesive in a high-temperature use environment can be effectively avoided.
In one embodiment, a potting resin is filled between the electrically insulating housing and the capacitor assembly body.
In the embodiment of the application, through filling potting resin between electrical property insulating housing and capacitor bank main part, from this, can be so that fill potting resin and seal capacitor bank main part to avoid capacitor bank main part and air contact to take place the oxidation, and then avoid the environment to the influence of combination formula capacitor electrical property, improve combination formula capacitor's life.
In one embodiment, the height of the potting resin is at least 1mm lower than the opening, and the height of the potting resin is higher than the height of the capacitor assembly body.
In this application embodiment, potting resin highly is less than the opening and at least 1mm, can reserve certain space for the insulating apron of electrical property, the installation of the insulating apron of electrical property of being convenient for. The height that potting resin highly is higher than capacitor combination main part can avoid external environment to cause the influence to capacitor combination main part, improves the reliability of condenser.
In one embodiment, the capacitor assembly body includes: the capacitor comprises a plurality of capacitor units, wherein the capacitor units are connected in series or in parallel, and an electrode of each capacitor unit is connected with the lead.
In the embodiment of the application, the plurality of capacitor units are connected in series or in parallel, and the voltage resistance of the capacitor units can be improved, so that the capacitor combination main body can be used under the condition of high voltage, and the application range of the combined capacitor is enlarged.
In one embodiment, the lead is a tin-plated nickel wire or a copper-core soft lead.
In the embodiment of the application, the electrical property of the tinned nickel wire or the copper core soft lead is less influenced by high temperature, so that the combined capacitor can be used at high temperature by using the tinned nickel wire or the copper core soft lead, and the use range of the combined capacitor is enlarged. Simultaneously, the soft lead wire of tin-plated nickel wire or copper core is flexible material, can take place deformation, consequently, the lead wire structural shape can carry out reasonable adjustment according to electrical property insulating casing inner space to avoid the lead wire to the too much occupation of combination formula condenser inner space.
In one embodiment, the electrically insulating housing is a ceramic housing and/or the electrically insulating cover plate is a ceramic cover plate.
In the embodiment of the application, the ceramic has the advantages of better strength, thermal stability, corrosion resistance, moisture resistance, thermal conductivity and the like while having the insulating property, so that the combined capacitor can have the advantages by using the ceramic shell and/or the ceramic cover plate, thereby improving the environment influence resistance of the combined capacitor and prolonging the service life of the combined capacitor. Meanwhile, the corrosion resistance of the ceramic can effectively avoid the situation that the electrolyte in the capacitor combined main body leaks to corrode a circuit where the capacitor is located.
In one embodiment, the ceramic cover plate and the ceramic housing are made of any one of zirconia, alumina and silicon nitride, and the materials of the ceramic cover plate and the ceramic housing are the same.
In the embodiment of the application, any one of the materials of zirconia, alumina and silicon nitride can meet the requirement of the electrical insulation cover plate and the electrical insulation shell on insulativity, and the electrical insulation cover plate and the electrical insulation shell can have the advantages of better strength, thermal stability, corrosion resistance, moisture resistance, thermal conductivity and the like. Meanwhile, the ceramic cover plate and the ceramic shell which are made of the same material are used, so that the phenomenon that the electrical insulation cover plate and the electrical insulation shell are deformed differently under the influence of the environment due to the fact that the electrical insulation cover plate and the electrical insulation shell are made of different materials can be effectively avoided, the condition of changing the structure of the combined capacitor is made to occur, and the reliability of the combined capacitor is improved.
Additional features and advantages of the disclosure will be set forth in the description which follows, or in part may be learned by the practice of the above-described techniques of the disclosure.
In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and that those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a conventional combined capacitor provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a combined capacitor according to an embodiment of the present disclosure;
fig. 3 is a cross-sectional view of a combined capacitor provided in an embodiment of the present application;
fig. 4 is a schematic structural diagram of an electrically insulating cover plate according to an embodiment of the present disclosure.
An icon: an electrically insulating housing 11; a capacitor assembly body 12; a capacitor cell 121; an electrically insulating cover plate 13; a cover step 131; a lead hole 132; a lead 14; and a potting resin 15.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
Referring to fig. 2 and fig. 3, fig. 2 is a schematic structural diagram of a combined capacitor provided in an embodiment of the present application, and fig. 3 is a cross-sectional diagram of the combined capacitor provided in the embodiment of the present application. The embodiment of the application provides a combined capacitor, includes: an electrically insulating case 11, a capacitor assembly body 12, an electrically insulating cover 13, and a lead 14.
The electrically insulating housing 11 has an insulating property.
In this embodiment, a cavity with an opening is formed in the inner periphery of the electrical insulation casing 11, and a certain thickness is provided between the inner wall of the cavity and the outer wall of the electrical insulation casing 11.
In this embodiment, the electrically insulating housing 11 may have a square structure, a cylindrical structure, a spherical structure, or the like, and may be reasonably produced and manufactured according to actual requirements, and the shape of the electrically insulating housing 11 shown in fig. 2 and 3 should not be a limitation to the present application.
The capacitor assembly body 12 is disposed in the cavity of the electrically insulating housing 11.
In an embodiment, the capacitor assembly body 12 may include a plurality of capacitor units 121, and the plurality of capacitor units 121 are connected in series or in parallel or in series-parallel. In the series-parallel connection, only some of the capacitor cells 121 of the plurality of capacitor cells 121 are connected in series, and some of the capacitor cells 121 are connected in parallel.
In this embodiment, the capacitor unit 121 may be various types of capacitors, for example, a non-solid electrolyte tantalum capacitor, a stacked conductive polymer aluminum capacitor, and the like, wherein the structure and implementation of the capacitor unit 121 may refer to a capacitor structure in the prior art, which is not described herein again.
The plurality of capacitor cells 121 may be used under high voltage after being combined, and therefore, in this embodiment, the capacitor combination body 12 may be combined by at least two capacitor cells 121, and the capacitor cells 121 are connected in series, parallel or series-parallel, for example, as shown in fig. 3, the capacitor cells 121 are connected in parallel, and in some other embodiments, the capacitor cells 121 may also be connected in series or series-parallel. The specific structure and implementation of the capacitor assembly body 12 can refer to the prior art, and are not described herein again.
Referring to fig. 4, fig. 4 is a schematic structural diagram of an electrically insulating cover plate 13 according to an embodiment of the present disclosure.
The electrically insulating cover 13 has electrical insulation. It is understood that electrical insulation, also referred to as electrical insulation or isolation in some literature, refers to the property of an object or material to be electrically non-conductive.
In this embodiment, the shape and size of the opening of the electrical insulating cover 13 and the electrical insulating housing 11 are matched, so as to cover the opening of the electrical insulating housing 11.
In one embodiment, the electrically insulating housing 11 may be a ceramic housing and/or the electrically insulating cover 13 may be a ceramic cover.
The ceramic has the characteristics of excellent strength, thermal stability, corrosion resistance, moisture resistance, thermal conductivity and the like while having electrical insulation. In this embodiment, ceramic housing and/or cover plate are selected for use, so that the combined capacitor can have characteristics such as better intensity, thermal stability, corrosion resistance, moisture resistance and thermal conductivity, and thus, the combined capacitor can be used in different environments, the range of the use scene of the combined capacitor is enlarged, and the service life of the combined capacitor is prolonged.
When the capacitor unit 121 is a capacitor using a non-solid electrolyte, the ceramic shell has corrosion resistance, so that the situation that the electrolyte corrodes a circuit board using the combined capacitor after the electrolyte in the capacitor unit 121 leaks can be effectively avoided.
In addition, compared with the insulating property of the existing isolating layer material, the ceramic has better insulating property, can further improve the insulating property of the combined capacitor, reduces the combined capacitor with poor insulation generated in the manufacturing process, improves the yield of the combined capacitor, and reduces the manufacturing cost of the combined capacitor.
In one embodiment, the ceramic cover plate and the ceramic housing may be made of any one of zirconia, alumina, and silicon nitride.
In this embodiment, the ceramic case and the ceramic cover plate made of zirconia, alumina, silicon nitride, or other materials have the above characteristics.
In one embodiment, the ceramic cover plate and the ceramic housing are made of the same material. Because ceramic cover plate and ceramic cover plate are independent part respectively, ceramic cover plate and ceramic cover plate all probably receive environmental impact to take place deformation to influence combined type capacitor's structure, consequently, in this application embodiment, ceramic cover plate with ceramic shell's material is the same, and from this, ceramic cover plate and ceramic shell are the same receiving the deformation volume that environmental impact took place, thereby avoid ceramic cover plate and ceramic shell to lead to combined type capacitor structural change's the condition to take place because of the deformation volume difference. Of course, in another embodiment, the materials of the ceramic cover plate and the ceramic housing may be different, and the embodiment of the present application is not limited thereto.
In some other embodiments, the electrically insulating cover 13 and the electrically insulating housing 11 may be made of other electrically insulating materials, for example, teflon, methyl methacrylate, etc. to make the electrically insulating cover 13 and the electrically insulating housing 11, which will not be described herein.
Referring to fig. 3, in an embodiment, the edge of the electrically insulating cover 13 is stepped; the length of the short side of the electrically insulating cover 13 is less than or equal to the inner diameter of the electrically insulating housing 11, and the length of the long side of the electrically insulating cover 13 is greater than or equal to the outer diameter of the electrically insulating housing 11.
In this embodiment, the electrically insulating housing 11 has a certain thickness, so the diameter of the cavity is different from the diameter of the electrically insulating housing 11, and therefore, the electrically insulating housing 11 has unequal inner and outer diameters.
In this embodiment, the electrically insulating cover plate 13 is arranged in a step shape, that is, the cover plate step 131 is arranged, so that when the length of the short side of the electrically insulating cover plate 13 is equal to the inner diameter of the electrically insulating housing 11, the length of the long side of the electrically insulating cover plate 13 is greater than or equal to the outer diameter of the electrically insulating housing 11, and the electrically insulating cover plate 13 can be embedded with the electrically insulating housing 11 through the step-shaped structure, thereby realizing the fixed connection between the electrically insulating housing 11 and the electrically insulating cover plate 13.
For example, in the embodiment, the heights of the two layers of steps of the electrically insulating cover plate 13 may be between 1mm and 2mm, respectively, but are not limited thereto.
In some embodiments, the electrically insulating housing 11 and the electrically insulating cover 13 are connected by a temperature-resistant inorganic adhesive.
In this embodiment, because there is an error in the manufacturing process, the size between the electrical insulation housing 11 and the electrical insulation cover plate 13 may not be completely matched, and the electrical insulation cover plate 13 is smaller than the inner diameter of the electrical insulation housing 11, so that the electrical insulation housing 11 and the electrical insulation cover plate 13 can be fixed by using an inorganic adhesive.
In this embodiment, the combined capacitor may be used in a high-temperature and high-pressure scenario, and therefore, the inorganic adhesive that is resistant to temperature may be used, so that the inorganic adhesive is not melted in the high-temperature scenario, and the electrical insulation shell 11 and the electrical insulation cover plate 13 are directly cracked.
In one embodiment, the inorganic paste has a thermal expansion coefficient, and the difference between the thermal expansion coefficient and the thermal expansion coefficient of the electrically insulating housing 11 is within a predetermined range.
The combined capacitor may be used in a high temperature scenario, and the inorganic adhesive may burst the electrically insulating case 11 if it expands at a high temperature, so that the expansion problem of the inorganic adhesive in the high temperature scenario can be considered to avoid the occurrence of the situation that the electrically insulating case 11 cracks due to the expansion of the inorganic adhesive. For this purpose, in the present embodiment, an inorganic paste having a difference between the thermal expansion coefficient and the thermal expansion coefficient of the electrically insulating housing 11 within a predetermined range may be selected, wherein the predetermined range may be 0 to 1. Therefore, the thermal expansion coefficient of the inorganic adhesive is similar to that of the electrical insulation shell, and therefore the problem that the electrical insulation shell of the combined capacitor is cracked due to expansion of the inorganic adhesive in a high-temperature use environment can be effectively solved. It can be understood that the thermal expansion coefficients of the different materials of the electrically insulating housing 11 are different, and the type of the inorganic adhesive is not limited herein, and can be reasonably selected according to the different materials of the electrically insulating housing 11.
The lead 14 has conductivity and is connected to the capacitor main body combined electrode.
Referring to fig. 4, in the present embodiment, the electrically insulating cover 13 has a lead hole 132, and the lead 14 extends out of the electrically insulating housing 11 from the lead hole 132.
In this embodiment, the diameter of the lead 14 may be between 0.7mm and 1.3mm, and the diameter of the lead hole 132 corresponds to the diameter of the lead 14. For example, the diameter of the lead 14 may be 1mm, and the diameter of the lead hole 132 is greater than 1mm.
In this embodiment, the leads 14 include a cathode lead and an anode lead, which are connected to the cathode and the anode of the capacitor assembly body 12, respectively.
In some embodiments, since the capacitor assembly body 12 is composed of a plurality of capacitor cells 121, the leads 14 may be respectively connected to the electrodes of the capacitor cells 121. When the capacitor cells 121 are connected in parallel, the lead wires 14 are connected to the electrodes of the capacitor cells 121, and when the capacitor cells 121 are connected in series, the lead wires 14 are connected to the capacitor electrodes at the front end and the rear end of the capacitor assembly body 12. The specific implementation manners are various, and are not described in detail herein.
In this embodiment, the lead 14 and the electrode of the capacitor assembly body 12 are connected by high temperature solder so that the capacitor assembly body 12 and the lead 14 are not disconnected from each other due to environmental influences.
In one embodiment, the leads 14 are tin-plated nickel wires or copper-cored soft leads.
In the present embodiment, the combined capacitor is used in a high temperature environment, and therefore, the lead 14 should have a high temperature resistance, and the tin-plated nickel wire or the copper core soft lead 14 can be used in a high temperature environment, and therefore, the tin-plated nickel wire or the copper core soft lead 14 can be used as the lead 14 of the capacitor.
In this embodiment, in order to facilitate the layout of each capacitor unit 121 in the combined capacitor in the electrically insulating housing 11, the lead 14 made of a flexible material may be selected, so that the lead 14 may be made into different shapes, thereby reducing the occupation of space by the lead and reducing the volume of the combined capacitor.
In one embodiment, the potting resin 15 may be filled between the electrically insulating housing 11 and the capacitor assembly body 12.
In this embodiment, the capacitor unit 121 is usually a silver shell package or a tantalum shell package structure, and the potting resin 15 is filled between the electrical insulation shell 11 and the capacitor assembly main body 12, so that the capacitor assembly main body 12 is prevented from being oxidized by contacting with the outside air, and the electrical performance of the combined capacitor is prevented from being changed by environmental influences, thereby prolonging the service life of the combined capacitor.
In this embodiment, the potting resin 15 may be one or more of bisphenol a epoxy resin, para-aminophenol epoxy resin, resorcinol epoxy resin, and the like, and may be reasonably selected according to various factors such as process requirements and cost.
In one embodiment, the height of the potting resin 15 may be at least 1mm below the opening, and the height of the potting resin 15 may be higher than the height of the capacitor assembly body 12.
In this embodiment, when the electrically insulating cover plate 13 is stepped, the electrically insulating cover plate 13 partially extends into the housing, so that a space can be reserved between the potting resin 15 and the opening for installing the electrically insulating cover plate 13. Here, the potting resin 15 is used to prevent the capacitor assembly body 12 from contacting the outside air, and therefore, the height of the potting resin 15 needs to be higher than that of the capacitor assembly body 12. In some alternative embodiments, the height of the potting resin 15 may be 1-3 mm below the opening.
In the embodiment of the present application, since the electrical insulation housing 11 and the electrical insulation cover plate 13 both have electrical insulation, after the capacitor assembly main body 12 is packaged by the electrical insulation housing 11 and the electrical insulation cover plate 13, electrical insulation between the capacitor unit and the housing can be achieved to a certain extent, thereby reducing interference of electrical conditions in the external environment received by the capacitor assembly main body during operation, and avoiding occurrence of conditions that influence is caused to the housing and the external environment during operation of the capacitor assembly main body.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article comprising a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article. Without further limitation, an element defined by the phrase "comprising one of 8230, and" comprising 8230does not exclude the presence of additional like elements in an article comprising the element.
Claims (10)
1. A modular capacitor, comprising:
an electrically insulating housing, wherein a cavity with an opening is formed in the electrically insulating housing;
the capacitor combination body is arranged in the cavity;
the electric insulation cover plate is provided with a lead hole and is fixed at the opening, and the shape and the size of the electric insulation cover plate are matched with those of the opening; the electrical insulation shell and the electrical insulation cover plate are both provided with electrical insulation;
and the lead is connected with the electrode of the capacitor combination main body and extends out of the electric insulation shell from the lead hole.
2. A combined capacitor according to claim 1, characterised in that the edge of the electrically insulating cover plate is stepped; the length of the short side of the electrical insulation cover plate is smaller than or equal to the inner diameter of the electrical insulation shell, and the length of the long side of the electrical insulation cover plate is larger than or equal to the outer diameter of the electrical insulation shell.
3. The combined capacitor of claim 1 wherein the electrically insulative housing and the electrically insulative cover plate are connected by a temperature resistant inorganic adhesive.
4. The combined capacitor of claim 3 wherein the inorganic paste has a coefficient of thermal expansion, and the difference between the coefficient of thermal expansion of the inorganic paste and the coefficient of thermal expansion of the electrically insulating housing is within a predetermined range.
5. The combined capacitor of claim 1, wherein a potting resin is filled between the electrically insulating case and the capacitor assembly body.
6. The combined capacitor of claim 5, wherein the height of the potting resin is at least 1mm lower than the opening and the height of the potting resin is higher than the height of the capacitor assembly body.
7. The combined capacitor of claim 1, wherein the capacitor assembly body comprises: the capacitor comprises a plurality of capacitor units, wherein the capacitor units are connected in series or in parallel, and an electrode of each capacitor unit is connected with the lead.
8. A combined capacitor according to claim 1, characterised in that the lead is a tin-plated nickel wire or a copper-cored soft lead.
9. A combined capacitor according to any one of claims 1-8, characteri sed in that the electrically insulating housing is a ceramic housing and/or the electrically insulating cover plate is a ceramic cover plate.
10. The combined capacitor of claim 9, wherein the ceramic cover plate and the ceramic case are made of any one of zirconia, alumina and silicon nitride, and the materials of the ceramic cover plate and the ceramic case are the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222675863.1U CN218631695U (en) | 2022-10-11 | 2022-10-11 | Combined capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222675863.1U CN218631695U (en) | 2022-10-11 | 2022-10-11 | Combined capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218631695U true CN218631695U (en) | 2023-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222675863.1U Active CN218631695U (en) | 2022-10-11 | 2022-10-11 | Combined capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218631695U (en) |
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2022
- 2022-10-11 CN CN202222675863.1U patent/CN218631695U/en active Active
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