CN220895348U - Chip capacitor packaged by MLCC chip and provided with pins - Google Patents

Chip capacitor packaged by MLCC chip and provided with pins Download PDF

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Publication number
CN220895348U
CN220895348U CN202322579725.8U CN202322579725U CN220895348U CN 220895348 U CN220895348 U CN 220895348U CN 202322579725 U CN202322579725 U CN 202322579725U CN 220895348 U CN220895348 U CN 220895348U
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China
Prior art keywords
capacitor
metal
layer
electrode
chip
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CN202322579725.8U
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Chinese (zh)
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董加银
康少敏
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Nanjing Xinyuyue Electronics Co ltd
Huai'an Yongjie Electronic Technology Co ltd
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Nanjing Xinyuyue Electronics Co ltd
Huai'an Yongjie Electronic Technology Co ltd
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Priority to CN202322579725.8U priority Critical patent/CN220895348U/en
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Abstract

The utility model relates to the technical field of capacitors, and provides a patch capacitor with pins, which is packaged by an MLCC chip, and comprises: the capacitor comprises a capacitor shell, wherein an internal electrode is fixedly arranged in the capacitor shell, two external electrodes are respectively arranged on two sides of the internal electrode, a plurality of pins are respectively arranged at one ends of the two external electrodes, a connector is respectively arranged between one end of each pin and the external electrode, and one end of each pin, far away from the connector, transversely penetrates through the capacitor shell. This take paster condenser of pin of MLCC chip encapsulation through setting up the inside electrode of capacitor case protection, and the protection electrode does not receive external force extrusion, reduces the impaired probability of paster condenser, improves the life of paster condenser, reduces the number of times of changing the paster condenser, reduce cost.

Description

Chip capacitor packaged by MLCC chip and provided with pins
Technical Field
The utility model relates to the technical field of capacitors, in particular to a chip capacitor with pins, which is packaged by an MLCC chip.
Background
MLCC (Multi-LAYER CERAMIC Capacitors) is a chip type multilayer ceramic capacitor for English abbreviation, which is formed by laminating ceramic dielectric films printed with electrodes (inner electrodes) in a staggered manner, forming a ceramic chip through one-time high-temperature sintering, and sealing metal layers (outer electrodes) at two ends of the chip, thereby forming a monolithic-like structure body, so the monolithic capacitor is also called.
The chip capacitor is an energy-storing electronic element and is fixed on a circuit board through welding, and is mainly used for storing the electric quantity of the circuit in the circuit, ensuring the normal and stable operation of the circuit, and is mainly composed of an internal metal electrode and two end electrodes, and the internal metal electrode is generally insulated through ceramics.
However, the traditional chip capacitor is directly connected into a circuit, and has no protection of a shell, so that the electrodes of the chip capacitor are easily damaged due to extrusion of external force, and the service life of the chip capacitor is influenced.
Disclosure of utility model
The utility model provides a chip capacitor with pins, which is packaged by an MLCC chip and aims to solve the existing problems.
The utility model is realized in such a way that a pinpointed patch capacitor packaged by an MLCC chip is adopted, and the pinpointed patch capacitor packaged by the MLCC chip comprises: the capacitor comprises a capacitor shell, wherein an internal electrode is fixedly arranged in the capacitor shell, two external electrodes are respectively arranged on two sides of the internal electrode, a dielectric body is filled between the shell and the internal electrode and between the internal electrode and the external electrode, the dielectric body is an electric insulator polarized by an external electric field, one ends of the two external electrodes are respectively provided with a plurality of pins, a connector for connecting the external electrode and the pins is respectively arranged between one end of each pin and the external electrode, and one end of each pin, far away from the connector, transversely penetrates through the capacitor shell and extends to the outside of the capacitor shell.
Preferably, the capacitor case is made of epoxy resin.
Preferably, the external electrode comprises a first layer of metal, a second layer of metal and a third layer of metal, wherein the first layer of metal is made of copper, the inner side of the first layer of metal is fixedly connected to the outer wall of the capacitor shell, the inner side of the second layer of metal is fixedly connected to the outer wall of the first layer of metal, the second layer of metal is made of nickel, the inner side of the third layer of metal is fixedly connected to the outer wall of the second layer of metal, and the third layer of metal is made of tin.
Preferably, the connector is made of Sn-Sb alloy.
Compared with the prior art, the utility model has the beneficial effects that:
This take paster condenser of pin of MLCC chip encapsulation through setting up the inside electrode of capacitor case protection, and the protection electrode does not receive external force extrusion, reduces the impaired probability of paster condenser, improves the life of paster condenser, reduces the number of times of changing the paster condenser, reduce cost.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic structural view of embodiment 1 of the present utility model;
FIG. 2 is a cross-sectional view of two structures of embodiment 1 of the present utility model;
The reference numerals in the drawings are: 1. a capacitor case; 2. an internal electrode; 3. a first layer of metal; 4. a second layer of metal; 5. a third layer of metal; 6. a connecting body; 7. pins; 8. a dielectric.
Detailed Description
In order to more fully understand the technical content of the present utility model, the following technical solutions of the present utility model will be further described and illustrated with reference to specific embodiments, but are not limited thereto. The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by a person skilled in the art without making any inventive effort, are based on embodiments of the present utility model, which are intended to be within the scope of the present utility model.
In the description of the embodiments of the present utility model, it should be noted that, if the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate an azimuth or a positional relationship based on that shown in the drawings, or an azimuth or a positional relationship in which the product of the present utility model is conventionally put when used, it is merely for convenience of describing the present utility model and simplifying the description, and it does not indicate or imply that the apparatus or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be attached, detached, or integrated, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
Referring to fig. 1 to 2, the leaded chip capacitor employing an MLCC chip package includes: the capacitor comprises a capacitor shell 1, an inner electrode 2, an outer electrode, a connector 6, pins 7 and a dielectric 8, wherein the capacitor shell 1 is made of epoxy resin, the inner electrode 2 is fixedly arranged in the capacitor shell 1, the two sides of the inner electrode 2 are respectively provided with the outer electrode, the dielectric 8 is filled between the shell 1 and the inner electrode 2 and between the inner electrode and the outer electrode, the dielectric 8 is an electric insulator polarized by an external electric field, the outer electrode comprises a first layer metal 3, a second layer metal 4 and a third layer metal 5, the first layer metal 3 is made of copper, the inner side of the first layer metal 3 is fixedly connected to the outer wall of the capacitor shell 1, the copper has good ductility, good heat conductivity and electrical conductivity, the cable, an electric element and an electronic element are the most commonly used materials, the inner side of the second layer metal 4 is fixedly connected to the outer wall of the first layer metal 3, the second layer metal 4 is made of nickel, the nickel has good ductility, the corrosion resistance to acid and alkali is very strong, the inner element can be prevented from being corroded, the inner side of the third layer metal 5 is fixedly connected to the outer wall of the second layer metal 4, the third layer metal 5 is made of tin, the tin has good oxidation resistance, and the inner element can be prevented from being oxidized. One end of each external electrode is provided with a plurality of pins 7 respectively, a connector 6 is arranged between one end of each pin 7 and the external electrode, the connector 6 is made of Sn-Sb alloy, the Sn-Sb alloy negative electrode material has the advantages of being high in theoretical capacity, capable of being charged and discharged rapidly and the like, the connector 6 is used for connecting the external electrode and the pins 7, and one end, far away from the connector 6, of each pin 7 transversely penetrates through the capacitor shell 1 to extend to the outside of the capacitor shell 1, so that a circuit can be conveniently accessed.
The above embodiments are only some embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto, and any person skilled in the art should be able to apply equivalents and modifications according to the technical solution and the inventive concept thereof within the scope of the present utility model.

Claims (4)

1. The utility model provides a take pin chip capacitor of adoption MLCC chip package which characterized in that, this take pin chip capacitor of adoption MLCC chip package includes: the capacitor comprises a capacitor shell (1), wherein an inner electrode (2) is fixedly arranged in the capacitor shell (1), a dielectric body (8) is filled between the shell (1) and the inner electrode (2) and between the outer electrode and the outer electrode, the dielectric body (8) is an electric insulator polarized by an external electric field, two sides of the inner electrode (2) are respectively provided with an outer electrode, one ends of the two outer electrodes are respectively provided with a plurality of pins (7), a connecting body (6) for connecting the outer electrode and the pins (7) is respectively arranged between one end of each pin (7) and the outer electrode, and one end of each pin (7) far away from the connecting body (6) transversely penetrates through the capacitor shell (1) to extend to the outside of the capacitor shell (1).
2. The leaded chip capacitor packaged with an MLCC chip according to claim 1, wherein the capacitor case (1) is made of epoxy.
3. The chip capacitor with pins of claim 1, wherein the external electrode comprises a first layer of metal (3), a second layer of metal (4) and a third layer of metal (5), the first layer of metal (3) is made of copper, the inner side of the first layer of metal (3) is fixedly connected to the outer wall of the capacitor shell (1), the inner side of the second layer of metal (4) is fixedly connected to the outer wall of the first layer of metal (3), the second layer of metal (4) is made of nickel, the inner side of the third layer of metal (5) is fixedly connected to the outer wall of the second layer of metal (4), and the third layer of metal (5) is made of tin.
4. The leaded chip capacitor of claim 1, wherein the connector (6) is made of Sn-Sb alloy.
CN202322579725.8U 2023-09-21 2023-09-21 Chip capacitor packaged by MLCC chip and provided with pins Active CN220895348U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322579725.8U CN220895348U (en) 2023-09-21 2023-09-21 Chip capacitor packaged by MLCC chip and provided with pins

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322579725.8U CN220895348U (en) 2023-09-21 2023-09-21 Chip capacitor packaged by MLCC chip and provided with pins

Publications (1)

Publication Number Publication Date
CN220895348U true CN220895348U (en) 2024-05-03

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322579725.8U Active CN220895348U (en) 2023-09-21 2023-09-21 Chip capacitor packaged by MLCC chip and provided with pins

Country Status (1)

Country Link
CN (1) CN220895348U (en)

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