CN114967292A - Refrigeration science camera with multiple heat radiation structure - Google Patents
Refrigeration science camera with multiple heat radiation structure Download PDFInfo
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- CN114967292A CN114967292A CN202210655183.5A CN202210655183A CN114967292A CN 114967292 A CN114967292 A CN 114967292A CN 202210655183 A CN202210655183 A CN 202210655183A CN 114967292 A CN114967292 A CN 114967292A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a refrigeration scientific camera with a multiple heat dissipation structure.A imaging circuit, an image sensor and a semiconductor refrigerator are placed in a refrigeration cabin, the semiconductor refrigerator absorbs the heat of the image sensor, the heat is conducted to a phase change material in a heat absorption cabin by a heat transfer pipe to absorb the heat, a water cooling head in a water cooling device transmits the heat to a circulating water channel to perform water cooling heat dissipation through cooling water, and an air cooling device performs air cooling heat dissipation on the heat absorption cabin. The invention is provided with a multiple heat dissipation structure, thereby enhancing the heat dissipation efficiency and simultaneously improving the safety.
Description
Technical Field
The invention belongs to the technical field of scientific cameras, and particularly relates to a refrigeration scientific camera with a multiple heat dissipation structure.
Background
In recent decades, with the technical development of machine vision, scientific cameras have been used in scientific fields, such as biological science, astronomy, chemical imaging, biological imaging, fluorescence microscopy, high-speed photography, to provide higher-performance image recording services. When the scientific camera is in a working state, internal electronic components continuously generate heat and accumulate thermal noise to cause image signals to be interfered by the thermal noise, in order to reduce the thermal noise, improve the image quality and realize long-time exposure, the electronic components in the scientific camera need to be kept at a proper working temperature, and in some application scenes, the scientific camera also needs to be used as a low-heat radiation source to reduce the temperature influence on other equipment, so the scientific camera generally needs to be adjusted and cooled.
Most of the existing scientific cameras adopt a semiconductor refrigeration mode to carry out deep refrigeration on an image sensor, the semiconductor refrigerator is divided into a cold end and a hot end, the working mechanism of the semiconductor refrigerator is that voltage is applied to two ends of a semiconductor, the two ends can generate temperature difference, if heat generated by the hot end of the semiconductor cannot be transferred in time, the temperature of the hot end is increased, and the temperature of the cold end is also increased, so that the heat generated by the hot end is transferred to maintain the temperature stability of the cold end in order to maintain the deep refrigeration effect of the cold end on the sensor.
In the prior art, most refrigeration scientific cameras adopt a water-cooling type heat dissipation structure (as the technical scheme disclosed in the literature ' HUXIN ' Shenguang III host X-ray fringe camera design [ J ] optics report, 2009 (10):2871-2875 ') to dissipate heat of a semiconductor refrigerator so as to ensure normal operation of the scientific cameras. When the water-cooling type heat dissipation structure works, besides the structural complexity of the scientific camera is increased due to the existence of the water pipe, the risk of circulating water leakage also exists, once the circulating water leaks, the scientific camera and other related equipment can be seriously damaged, and therefore great economic loss is caused. In addition, the heat dissipation efficiency of the single heat dissipation structure is not high, and the single water cooling or air cooling heat dissipation structure is difficult to meet the actual requirements in some application scenes with high requirements on temperature control.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a refrigeration scientific camera with a multiple heat dissipation structure, which is provided with the multiple heat dissipation structure, so that the heat dissipation efficiency is enhanced and the safety is improved.
In order to achieve the above object, the scientific camera with multiple heat dissipation structures of the present invention comprises a refrigeration compartment, a heat transfer pipe, a heat absorption compartment, a water cooling device, an air cooling device, an imaging circuit, an image sensor, a semiconductor refrigerator, an interface circuit, and a photoelectric conversion circuit, wherein:
the refrigeration cabin is used for placing an imaging circuit, an image sensor and a semiconductor refrigerator, and the rear end of the refrigeration cabin is connected with the front end of the heat absorption cabin, so that the refrigeration cabin is of a closed structure; the refrigeration cabin comprises a refrigeration cabin shell and an optical fiber panel, the optical fiber panel is arranged at an opening of a front cover of the refrigeration cabin shell, an imaging circuit is coupled with the optical fiber panel to jointly realize scientific imaging, and the image sensor is used for performing photoelectric conversion on a signal obtained by the imaging circuit to obtain image data and outputting the image data to the interface circuit; the semiconductor refrigerator is used for refrigerating the image sensor, and the hot end of the semiconductor refrigerator is attached to a water-cooling head front cover in a water-cooling device arranged at the front end of the heat absorption cabin;
the interface circuit and the photoelectric conversion circuit are arranged below the heat absorption cabin, the interface circuit is used for connecting the image sensor and the photoelectric conversion circuit, transmitting image data obtained by the image sensor to the photoelectric conversion circuit, and the photoelectric conversion circuit converts the image data into an electric signal and outputs the electric signal;
the heat absorption cabin is filled with phase change materials, the heat transfer heat pipe is positioned in the water cooling head and extends into the phase change materials from the front end of the heat absorption cabin, and the heat of the semiconductor refrigerator is transferred to the phase change materials;
the water cooling device comprises a water cooling head, a circulating water channel and a cooling water inlet and outlet, wherein the water cooling head is arranged at the front end of the heat absorption cabin and extends into the refrigeration cabin, the front cover of the water cooling head is attached to the hot end of the semiconductor refrigerator, the other end of the water cooling head is connected with a circulating water channel in the water cooling device, and the circulating water channel penetrates through the phase-change material and is connected with the cooling water inlet and outlet positioned at the rear end of the heat absorption cabin;
the air cooling device is arranged above the heat absorption cabin and adopts an air cooling mode to dissipate heat of the heat absorption cabin.
Further, a sealing gasket is arranged at the opening part of the front cover of the refrigeration cabin shell.
Furthermore, a heat conducting block is arranged between the image sensor and the semiconductor refrigerator, one surface of the heat conducting block is attached to the image sensor, and the other surface of the heat conducting block is attached to the cold end of the semiconductor refrigerator.
Furthermore, the melting point of the phase-change material is within the range of 20-30 ℃, and the phase-change heat absorption ratio is within the range of 200-250J/g.
Furthermore, a cross-shaped partition plate is arranged in the heat absorption cabin to uniformly divide the heat absorption cabin into 4 communicated sub-cabins, a plurality of radiating fins are added into each sub-cabin, the radiating fins are immersed in the phase change material, and one end of each radiating fin is attached to the heat transfer heat pipe.
Further, the radiating fins are provided with holes.
Furthermore, the heat transfer pipe is connected to the front cover of the water-cooling head in a low-temperature reflow soldering mode.
Further, the air cooling device comprises a blower and a heat dissipation device.
Furthermore, the scientific refrigeration camera further comprises a heat dissipation control module for controlling the heat dissipation work of the scientific refrigeration camera.
Further, the heat dissipation control module adopts the following control method:
s1: the working personnel set a working mode in the heat dissipation control module according to the application environment of the scientific refrigeration camera, and when the application environment is a closed environment, the working mode is set to be the closed environment working mode, otherwise, the working mode is set to be a conventional mode;
s2: starting the scientific refrigeration camera, and closing the default water cooling device and the air cooling device at the moment;
s3: detecting the temperature T1 of the refrigerating chamber in real time by using a temperature sensor;
s4: controlling the power of the semiconductor refrigerator by adopting a preset temperature control algorithm according to the temperature T1 obtained in the step S3 and a preset target temperature T0 of the refrigerating compartment;
s5: judging whether the temperature T1 is less than a preset target temperature T0 of the refrigeration compartment, if so, performing no operation, returning to the step S3, otherwise, entering the step S6;
s6: judging whether the temperature T1 is greater than a preset upper temperature limit T2 of the refrigeration cabin, if so, judging whether an overtemperature timer is started, if so, resetting the overtemperature timer, otherwise, not performing any operation; if the temperature is larger than or equal to the upper temperature limit T2, judging whether the overtemperature timer is started, if so, not doing any operation, otherwise, starting the overtemperature timer for timing; proceeding to step S7;
s7: judging whether the timing of the overtemperature timer is larger than a preset threshold value, if not, returning to the step S3, otherwise, entering the step S8;
s8: the heat dissipation control module carries out overtemperature alarm in a preset mode;
s9: the heat dissipation control module judges whether the current working mode is a closed environment working mode, if so, the step S10 is executed, otherwise, the step S13 is executed;
s10: judging whether the water cooling device is started according to actual needs, if so, entering a step S11, otherwise, entering a step S12;
s11: the heat dissipation control module starts a water cooling device and adopts a water cooling mode to dissipate heat;
s12: the heat dissipation control module controls the scientific refrigeration camera to stop image acquisition;
s13: the heat dissipation control module starts the air cooling device and adopts an air cooling mode to dissipate heat.
The invention relates to a refrigeration scientific camera with a multiple heat dissipation structure.A imaging circuit, an image sensor and a semiconductor refrigerator are placed in a refrigeration cabin, the semiconductor refrigerator absorbs the heat of the image sensor, the heat is conducted to a phase change material in a heat absorption cabin by a heat transfer pipe to absorb the heat, the heat is transmitted to a circulating water channel by a water cooling head in a water cooling device to be cooled and dissipated by cooling water, and the heat absorption cabin is cooled and dissipated by air cooling by an air cooling device.
The invention has the following beneficial effects:
1) the phase-change material is filled in the heat absorption cabin, so that the heat of the image sensor is quickly absorbed, the heat is stored in the camera, outward emission is reduced, the camera is in a stable working environment, especially when the camera works in a closed environment, the stability of the temperature of the closed environment can be effectively maintained, and the influence on the operation of other equipment is reduced;
2) the camera is also provided with a water cooling device and an air cooling device, and when the camera works under the permission of working conditions, the heat of the hot end face of the semiconductor refrigerator can be completely taken away by starting a water cooling heat dissipation mode, so that the camera can continuously work for a long time and is in a deep cooling mode; when the camera works, the phase change material continuously absorbs heat, so that the heat stored by the phase change material can be quickly taken away by water cooling heat dissipation and air cooling heat dissipation when the camera does not work, the phase change material is cooled to be a solid phase, and the working interval of the camera can be further shortened;
3) the invention adopts a multiple heat dissipation structure, can flexibly combine and select a proper heat dissipation mode according to an application scene, and improves the heat dissipation efficiency, prolongs the working time of the camera and shortens the working interval of the camera compared with the single heat dissipation modes of water cooling, air cooling and the like of the prior camera.
Drawings
FIG. 1 is a block diagram of an embodiment of a refrigeration science camera with a multiple heat dissipation structure according to the present invention;
FIG. 2 is an internal structural view of the heat absorption chamber in the present embodiment;
fig. 3 is a structural view of a heat dissipating fin in the present embodiment;
FIG. 4 is a schematic view showing the installation of the heat transfer heat pipe in the present embodiment;
FIG. 5 is a structural view of a water cooling apparatus according to the present invention;
FIG. 6 is a structural view of the air cooling apparatus in the present embodiment;
fig. 7 is a simulated infrared ray diagram of the heat radiation structure 1 in the present embodiment;
fig. 8 is a simulated infrared ray diagram of the heat radiation structure 2 in the present embodiment;
fig. 9 is a simulated infrared ray diagram of the heat dissipation structure 3 in the present embodiment;
fig. 10 is a flowchart of a heat dissipation control method in the present embodiment.
In the figure: 1-a refrigeration cabin, 101-a refrigeration cabin shell, 102-an optical fiber panel, 103-a sealing gasket, 2-a heat absorption cabin, 201-a cross-shaped partition plate, 202-a heat dissipation fin, 3-a water cooling device, 301-a water cooling head, 302-a circulating water channel, 303-a cooling water inlet and outlet, 4-an air cooling device, 401-an air blower, 402-a heat dissipation device, 5-a heat transfer pipe, 6-an imaging circuit, 7-an image sensor, 8-a heat conduction block, 9-a semiconductor refrigerator, 10-an interface circuit, 11-a photoelectric conversion circuit, 12-a camera lower cover, 13-a BNC connector, 14-a power supply interface, 15-a camera shell, 16-a camera upper cover and 17-a phase change material.
Detailed Description
The following description of the embodiments of the present invention is provided in order to better understand the present invention for those skilled in the art with reference to the accompanying drawings. It is to be expressly noted that in the following description, a detailed description of known functions and designs will be omitted when it may obscure the subject matter of the present invention.
Examples
Fig. 1 is a structural diagram of an embodiment of a refrigeration science camera with a multiple heat dissipation structure according to the present invention. As shown in fig. 1, the components of the refrigeration science camera with the multiple heat dissipation structure of the present invention can be divided into two major parts: one part is a structural part and comprises a refrigerating cabin 1, a heat absorption cabin 2, a water cooling device 3, an air cooling device 4 and a heat transfer heat pipe 5, and the other part is an electrical part and comprises an imaging circuit 6, an image sensor 7, a semiconductor refrigerator 9, an interface circuit 10 and a photoelectric conversion circuit 11. Each component will be described in detail below.
The refrigerating cabin 1 is used for placing an imaging circuit 6, an image sensor 7 and a semiconductor refrigerator 9, and the rear end of the refrigerating cabin 1 is connected with the front end of the heat absorption cabin 2, so that the refrigerating cabin 1 is of a closed structure. The refrigerating cabin 1 comprises a refrigerating cabin shell 101 and an optical fiber panel 102, the optical fiber panel 102 is arranged at an opening of a front cover of the refrigerating cabin shell 101, the imaging circuit 6 is coupled with the optical fiber panel 102 to jointly realize scientific imaging, and the image sensor 7 is used for performing photoelectric conversion on signals obtained by the imaging circuit 6 to obtain image data and outputting the image data to the interface circuit 10. The semiconductor refrigerator 9 is used for refrigerating the image sensor 7, and the hot end of the semiconductor refrigerator is attached to the front cover of the water cooling head 301 in the water cooling device 3 arranged at the front end of the heat absorption cabin 2.
In this embodiment, the sealing gasket 103 is disposed outside the front cover opening of the refrigeration compartment housing 101, because in practical use of the scientific refrigeration camera, the optical fiber panel 102 generally needs to be coupled with other external devices (such as an image intensifier or a scintillator), and the sealing gasket 103 is disposed to seal the opening of the refrigeration compartment housing 101 after the optical fiber panel 102 is coupled with other devices, so as to prevent external foreign matters from entering the refrigeration compartment to cause damage to optical devices; the gasket 103 may also serve as a buffer to protect the fiber optic faceplate 102 when the fiber optic faceplate is coupled to other devices.
In addition, a heat conduction block 8 can be arranged between the image sensor 7 and the semiconductor refrigerator 9, one surface of the heat conduction block 8 is attached to the image sensor 7, and the other surface of the heat conduction block 8 is attached to the cold end of the semiconductor refrigerator 9, so that heat exchange between the image sensor and the semiconductor refrigerator is accelerated, and the refrigeration efficiency is improved.
The interface circuit 10 and the photoelectric conversion circuit 11 are arranged below the heat absorption cabin 2, the interface circuit 10 is used for connecting the image sensor 7 and the photoelectric conversion circuit 11, transmitting image data obtained by the image sensor 7 to the photoelectric conversion circuit 11, and the photoelectric conversion circuit 11 converts the image data into an electric signal and then outputs the electric signal.
The heat absorption cabin 2 is filled with the phase change material 17, the heat transfer heat pipe 5 is positioned inside the water cooling head 301, extends into the phase change material 17 from the front end of the heat absorption cabin 2, and conducts the heat of the semiconductor refrigerator 9 to the phase change material 17. A Phase Change Material (PCM) refers to a substance that changes the state of a substance and provides latent heat at a constant temperature, and a process of changing physical properties is called a Phase Change process, and the Phase Change Material absorbs or releases a large amount of latent heat. The scientific refrigeration camera can work in a closed environment, and other scientific research equipment working simultaneously with the camera is also in the same closed working environment, so that the temperature rise of the closed environment is generally limited, heat generated by the camera is stored in the camera as much as possible, outward emission is reduced as much as possible, the temperature stability of the closed environment is maintained, and the influence on the operation of other equipment is reduced. The phase-change material has various types, and in order to better adapt to the working environment of a scientific camera, the phase-change material with the melting point in the range of 20 ℃ to 30 ℃ and the phase-change heat absorption ratio in the range of 200J/g to 250J/g is preferred, for example, paraffin is adopted in the embodiment.
In order to accelerate the heat conduction and improve the heat absorption efficiency of the phase change material, the specific structure of the heat absorption compartment 2 is also optimized in the embodiment. Fig. 2 is an internal structural view of the heat absorption chamber in the present embodiment. As shown in fig. 2, in the present embodiment, the heat absorption cabin 2 is provided with a cross-shaped partition 201 to divide the heat absorption cabin 2 into 4 communicated sub-cabins, each sub-cabin is added with a plurality of heat dissipation fins 202, the heat dissipation fins 202 are immersed in the phase change material, and one end of each heat dissipation fin is attached to the heat transfer pipe 5. The 4 sub-cabins are communicated to keep the fluidity of the phase-change material, so that the temperature of the whole heat absorption cabin 2 is kept uniform, and the overall reliability of the heat absorption cabin 2 is ensured. Because the area of the heat dissipation fin 202 is larger, compared with the heat transfer pipe 5 directly contacted with the phase change material 17, the heat dissipation fin can more quickly transfer the heat of the heat transfer pipe 5 to the phase change material 17, thereby quickly absorbing the heat at the hot end of the semiconductor refrigerator 9 and improving the heat dissipation efficiency. Fig. 3 is a structural view of the heat dissipating fin in the present embodiment. As shown in fig. 3, the heat dissipation fins 202 in this embodiment are further provided with openings to maintain the fluidity of the melted phase change material, so that the temperature rise of the phase change material is more uniform.
Fig. 4 is a schematic view showing the installation of the heat transfer heat pipe in the present embodiment. As shown in fig. 4, in the present embodiment, the heat transfer heat pipe 5 is embedded in the water cooling head 301, and extends into the phase change material 17 in the heat absorption compartment 2 through the front cover of the heat absorption compartment 2. In the invention, the heat transfer pipe 5 is adopted to transfer heat to the phase change material 17, so that the heat transfer efficiency is quicker and more efficient compared with the heat transfer efficiency of heat transfer silica gel, heat transfer silicone grease and other heat transfer materials. In this embodiment, the heat transfer pipe 5 is connected to the front cover of the water-cooling head 301 in a low-temperature reflow soldering manner, and compared with other processes directly attaching the heat conductive material, the low-temperature reflow soldering process can improve the heat conduction efficiency of the heat transfer pipe and ensure the connection stability between the heat transfer pipe and the front cover of the water-cooling head 301. When the heat absorption cabin 2 is uniformly divided into 4 sub-cabins by the aid of the cross-shaped partition plate 201, the part, extending into the phase change material 17, of the heat transfer heat pipe 5 can be fixed on the cross-shaped partition plate 201, so that the heat transfer heat pipe 5 is located in the center of the phase change material 17, heat absorbed by the phase change material 17 in the 4 sub-cabins is uniform, local overhigh temperature is avoided, and heat transfer heat pipe displacement caused by vibration in the use process of the scientific refrigeration camera can be avoided.
In addition, the heat absorption cabin adopts a compression-resistant design and carries out a compression-resistant test during design so as to ensure that the camera cannot leak when working in a closed environment and influence the working environment and other working equipment.
FIG. 5 is a schematic diagram of a water cooling apparatus according to the present invention. As shown in fig. 5, the water cooling device 3 of the present invention includes a water cooling head 301, a circulation water passage 302, and a cooling water inlet/outlet 303. Referring to fig. 1 and 5, the water cooling head 301 is disposed at the front end of the heat absorption chamber 2 and extends into the cooling chamber 1, the front cover of the water cooling head 301 is attached to the hot end of the semiconductor refrigerator, the other end of the water cooling head is connected to the circulating water channel 302 in the water cooling device 3, and the circulating water channel 302 passes through the phase change material 17 and is connected to the cooling water inlet/outlet 303 located at the rear end of the heat absorption chamber 2. In this embodiment, the water cooling head 301 uses a heat conducting copper block to improve the heat conducting effect. It can be seen that the water cooling head 301 absorbs heat of the semiconductor cooler 9 and circulates and transfers the heat to the outside through the cooling water in the circulation water passage 303. In addition to directly absorbing the heat of the semiconductor refrigerator 9 through the water cooling head 301, the water cooling device 3 of the present invention can indirectly assist the phase change material 17 to dissipate the heat of the semiconductor refrigerator 9 by absorbing the heat of the phase change material 17 because the circulating water channel 302 of the water cooling device 3 passes through the phase change material 17 in the heat absorption cabin 2, thereby improving the heat dissipation efficiency, delaying the temperature rise of the phase change material 17, and prolonging the working time of the scientific camera. In practical applications, the circulating water channel 302 may also be disposed in close proximity to the heat transfer heat pipe, so that heat can be taken away from the heat transfer heat pipe directly. The water cooling device 3 can also adopt a pressure-resistant design and perform a pressure-resistant test during design so as to ensure that the leakage cannot occur during work.
In consideration of the characteristic that heat flow rises from a low position to a high position, the air cooling device 4 is arranged above the heat absorption cabin, and the heat absorption cabin is cooled in an air cooling mode, so that heat dissipation is accelerated, temperature rise of the phase-change material is delayed, and the working time of the scientific camera is prolonged. Fig. 6 is a structural view of the air cooling device in the present embodiment. As shown in fig. 6, the air cooling device 4 of the present embodiment includes a blower 401 and a heat sink 402, and the two components cooperate to perform air cooling and heat dissipation.
When the scientific refrigeration camera stops working, the water cooling device and the air cooling device can be started to quickly take away heat stored by the phase-change material to cool the phase-change material into a solid phase, so that the working interval of the camera is shortened. In practical applications, the refrigeration science camera is also provided with other packaging structures, such as a camera lower cover 12, a BNC connector 13, a power interface 14, a camera housing 15, a camera upper cover and the like. This part is not the technical focus of the present invention and will not be described herein.
In order to illustrate the technical effects of the invention, the invention was experimentally verified by using specific examples. The heat-absorbing chamber 2 in this example has a volume of 1000 ml and contains 850 g of phase change material (phase change material density ratio 0.85 g/ml). Through practical test verification, the camera adopting the design is supposed to work below 0 ℃ in a closed environment under refrigeration, and under the condition of no water cooling or no air cooling, the phase-change material is completely melted after the camera works for 2 hours, and the refrigeration temperature of the camera begins to rise; under the condition of no water cooling and wind cooling, the refrigeration temperature of the camera begins to rise after the camera works for 4 hours; and in the case of water cooling and wind cooling, the camera can continuously work, and the refrigeration temperature is kept unchanged.
Next, comparative experiments were performed on different heat dissipation structures, and the environmental conditions of the experiments were as follows: the heat source is 30W, the environment is 30 ℃, the air temperature is 30 ℃, and the fan air volume is 3.5L/S. In this experimental verification, there are 2 heat dissipation structure schemes, the heat absorption cabin 2 of the heat dissipation structure 1 does not include heat dissipation fins, and the heat absorption cabin of the heat dissipation structure 2 includes heat dissipation fins. For comparison, a comparison experiment was performed with a heat absorption cabin lacking a heat transfer pipe and not including a heat dissipation fin as the heat dissipation structure 3, and an infrared chart after 2 hours of operation of the refrigeration science camera was compared. Fig. 7 is a simulated infrared ray diagram of the heat radiation structure 1 in the present embodiment. Fig. 8 is a simulated infrared ray diagram of the heat radiation structure 2 in the present embodiment. Fig. 9 is a simulated infrared ray diagram of the heat dissipation structure 3 in this embodiment. Table 1 shows the comparison of the heat dissipation effect data of the three heat dissipation structures in this embodiment.
TABLE 1
Comparing fig. 7 to fig. 9 and table 1, it can be seen that the heat dissipation structure 1 and the heat dissipation structure 2 have better heat dissipation effects than the heat dissipation structure 3, and it can be seen that the arrangement of the heat transfer heat pipe can more quickly conduct the heat of the image sensor 7 to the phase change material, so that the heat dissipation of the image sensor 7 is more quickly realized, and the working time of the scientific refrigeration camera is effectively prolonged. After the heat dissipation fins are arranged, the heat dissipation effect can be further improved, and the temperature in the heat absorption cabin can be more uniform. Meanwhile, due to the existence of the phase-change material, heat is stored in the camera, and the influence on the external environment temperature of the camera is small.
In addition, in order to improve management and control of the heat dissipation structure in the invention, the embodiment further provides a heat dissipation control module in the scientific refrigeration camera, and the heat dissipation control module is used for controlling heat dissipation work of the scientific refrigeration camera. The embodiment comprehensively considers the heat dissipation effectiveness and saves energy consumption, and provides a heat dissipation control method. Fig. 10 is a flowchart of a heat dissipation control method in the present embodiment. As shown in fig. 10, the heat dissipation control method of the heat dissipation control module in this embodiment includes the following steps:
s101: setting the working mode:
the staff sets up the mode according to the application environment of scientific refrigeration camera in heat dissipation control module, when the application environment is airtight environment, sets up to airtight environment mode, otherwise sets up to conventional mode. In practical application, a mode control switch can be arranged on a shell of the scientific refrigeration camera, and a heat dissipation control module can be connected with an upper computer through a wireless network for setting.
S102: starting a camera:
and starting the scientific refrigeration camera, and closing the default water cooling device and the air cooling device at the moment.
S103: temperature collection:
and a temperature sensor is adopted to detect the temperature T1 of the refrigerating chamber in real time. Since the temperature of the refrigerated compartment is mainly derived from the image sensor, the temperature sensor may be arranged in the vicinity of the image sensor when provided.
S104: adjusting the refrigeration power:
and controlling the power of the semiconductor refrigerator by adopting a preset temperature control algorithm according to the temperature T1 obtained in the step S103 and a preset target temperature T0 of the refrigerating compartment. In the present embodiment, the temperature control algorithm adopts a PID control algorithm, and when the temperature of the refrigerating compartment deviates from the target refrigerating compartment temperature T0, the refrigerating power of the semiconductor refrigerator is automatically increased or decreased, so that the temperature is stabilized.
S105: and (4) judging whether the temperature T1 is less than the preset target temperature T0 of the refrigeration compartment, if so, not performing any operation, returning to the step S103, otherwise, entering the step S106.
S106: starting and stopping the overtemperature timer:
judging whether the temperature T1 is greater than a preset upper temperature limit T2 of the refrigeration cabin, if so, judging whether an overtemperature timer is started, if so, resetting the overtemperature timer, otherwise, not performing any operation; if the temperature is larger than or equal to the upper temperature limit T2, judging whether the overtemperature timer is started, if so, not doing any operation, otherwise, starting the overtemperature timer for timing. The process advances to step S107.
By setting the overtemperature timer, whether the temperature exceeds the upper temperature limit temporarily can be determined, if the temperature exceeds the upper temperature limit temporarily, normal regulation is tried, and if the temperature exceeds the upper temperature limit for a long time, the phase change material is likely to be completely liquefied and invalid, and cannot continuously absorb heat, and corresponding measures need to be taken according to actual conditions.
S107: and judging whether the timing of the overtemperature timer is larger than a preset threshold value, if not, returning to the step S103, otherwise, entering the step S108.
S108: and (4) overtemperature alarm:
the heat dissipation control module adopts a preset mode to alarm over temperature, the alarm mode generally comprises modes of icon flashing, alarm sound prompting, temperature font changing to red, alarm information sending to an upper computer and the like, and an appropriate mode is selected in practical application.
S109: the heat dissipation control module judges whether the current working mode is a closed environment working mode, if so, the step S110 is executed, otherwise, the step S113 is executed.
S110: and judging whether the water cooling device is started according to actual needs, if so, entering step S111, otherwise, entering step S112. Generally speaking, whether the water cooling device is opened or not can be judged by whether cooling water is provided in the closed environment or not, if cooling water is provided, the water cooling device can be opened, and if the cooling water is not provided or is not allowed to be adopted in the closed environment, the water cooling device cannot be opened.
S111: water cooling and heat dissipation:
the heat dissipation control module starts the water cooling device and adopts a water cooling mode to dissipate heat. The mode can take away heat of the phase change material and the hot end of the semiconductor cooler, and the camera can continuously work for a long time after the water-cooling heat dissipation mode is started.
S112: stopping working:
the heat dissipation control module controls the scientific refrigeration camera to stop image acquisition work. The camera is taken out from the closed environment after stopping working and the scientific refrigeration camera, and then the air cooling device can be started to carry out air cooling heat dissipation, so that the dissipation of phase change materials and the heat inside the camera is accelerated, and the working interval of the camera is effectively shortened.
S113: air cooling and heat dissipation:
the heat dissipation control module starts the air cooling device and adopts an air cooling mode to dissipate heat. When the scientific refrigeration camera working mode is the conventional mode and the overtemperature alarm occurs, the mode that air cooling heat dissipation is directly adopted is a more convenient and effective mode.
In practical application, the heat dissipation control method can be set according to practical requirements, for example, under the condition that a closed environment and heat dissipation energy consumption are not considered, the scientific refrigeration camera can be directly started to completely open the air cooling device and the water cooling device, so that the heat dissipation efficiency is maximized, and the scientific refrigeration camera can continuously work for a long time at a lower temperature for a long time.
Although illustrative embodiments of the present invention have been described above to facilitate the understanding of the present invention by those skilled in the art, it should be understood that the present invention is not limited to the scope of the embodiments, and various changes may be made apparent to those skilled in the art as long as they are within the spirit and scope of the present invention as defined and defined by the appended claims, and all matters of the invention which utilize the inventive concepts are protected.
Claims (10)
1. The utility model provides a refrigeration science camera with multiple heat radiation structure which characterized in that includes refrigeration cabin, heat transfer pipe, heat absorption cabin, water cooling plant, air cooling plant, imaging circuit, image sensor, semiconductor cooler, interface circuit and photoelectric conversion circuit, wherein:
the refrigeration cabin is used for placing an imaging circuit, an image sensor and a semiconductor refrigerator, and the rear end of the refrigeration cabin is connected with the front end of the heat absorption cabin, so that the refrigeration cabin is of a closed structure; the refrigeration cabin comprises a refrigeration cabin shell and an optical fiber panel, the optical fiber panel is arranged at an opening of a front cover of the refrigeration cabin shell, an imaging circuit is coupled with the optical fiber panel to jointly realize scientific imaging, and the image sensor is used for performing photoelectric conversion on a signal obtained by the imaging circuit to obtain image data and outputting the image data to the interface circuit; the semiconductor refrigerator is used for refrigerating the image sensor, and the hot end of the semiconductor refrigerator is attached to a water-cooling head front cover in a water-cooling device arranged at the front end of the heat absorption cabin;
the interface circuit and the photoelectric conversion circuit are arranged below the heat absorption cabin, the interface circuit is used for connecting the image sensor and the photoelectric conversion circuit, transmitting image data obtained by the image sensor to the photoelectric conversion circuit, and the photoelectric conversion circuit converts the image data into an electric signal and outputs the electric signal;
the heat absorption cabin is filled with phase change materials, the heat transfer heat pipe is positioned in the water cooling head and extends into the phase change materials from the front end of the heat absorption cabin, and the heat of the semiconductor refrigerator is transferred to the phase change materials;
the water cooling device comprises a water cooling head, a circulating water channel and a cooling water inlet and outlet, wherein the water cooling head is arranged at the front end of the heat absorption cabin and extends into the refrigeration cabin, the front cover of the water cooling head is attached to the hot end of the semiconductor refrigerator, the other end of the water cooling head is connected with a circulating water channel in the water cooling device, and the circulating water channel penetrates through the phase-change material and is connected with the cooling water inlet and outlet positioned at the rear end of the heat absorption cabin;
the air cooling device is arranged above the heat absorption cabin and adopts an air cooling mode to dissipate heat of the heat absorption cabin.
2. The refrigeration science camera of claim 1, wherein a gasket is disposed outside the front cover opening of the refrigeration compartment housing.
3. The refrigeration science camera of claim 1, wherein a heat conducting block is disposed between the image sensor and the semiconductor refrigerator, one side of the heat conducting block is attached to the image sensor, and the other side of the heat conducting block is attached to the cold end of the semiconductor refrigerator.
4. The refrigeration science camera of claim 1, wherein the melting point of the phase change material in the heat absorption compartment is in the range of 20 ℃ to 30 ℃ and the phase change heat absorption ratio is in the range of 200J/g to 250J/g.
5. The refrigeration science camera of claim 1, wherein a cross-shaped partition is arranged in the heat absorption cabin to divide the heat absorption cabin into 4 communicated sub-cabins, a plurality of radiating fins are added to each sub-cabin, the radiating fins are immersed in the phase change material, and one end of each radiating fin is attached to the heat transfer pipe.
6. The refrigeration science camera of claim 5, wherein the heat dissipation fins are provided with apertures.
7. The refrigeration science camera of claim 1, wherein the heat transfer tube is attached to a front cover of the water cooling head by low temperature reflow soldering.
8. The refrigeration science camera as recited in claim 1 wherein the air cooling means includes an air blower and a heat sink.
9. The refrigeration science camera of claim 1, further comprising a heat dissipation control module for controlling heat dissipation operations of the science refrigeration camera.
10. The refrigeration science camera of claim 9, wherein the heat dissipation control module adopts the following control method:
s1: the working personnel set a working mode in the heat dissipation control module according to the application environment of the scientific refrigeration camera, and when the application environment is a closed environment, the working mode is set to be the closed environment working mode, otherwise, the working mode is set to be a conventional mode;
s2: starting the scientific refrigeration camera, and closing the default water cooling device and the air cooling device at the moment;
s3: detecting the temperature T1 of the refrigerating chamber in real time by using a temperature sensor;
s4: controlling the power of the semiconductor refrigerator by adopting a preset temperature control algorithm according to the temperature T1 obtained in the step S3 and a preset target temperature T0 of the refrigerating compartment;
s5: judging whether the temperature T1 is less than a preset target temperature T of the refrigeration compartment, if so, performing no operation, returning to the step S3, otherwise, entering the step S6;
s6: and judging whether the temperature T1 is greater than a preset upper temperature limit T2 of the refrigeration cabin, if so, judging whether the overtemperature timer is started, if so, resetting the overtemperature timer, otherwise, not performing any operation. If the temperature is larger than or equal to the upper temperature limit T2, judging whether the overtemperature timer is started, if so, not doing any operation, otherwise, starting the overtemperature timer for timing; proceeding to step S7;
s7: judging whether the timing of the overtemperature timer is larger than a preset threshold value, if not, returning to the step S3, otherwise, entering the step S8;
s8: the heat dissipation control module carries out overtemperature alarm in a preset mode;
s9: the heat dissipation control module judges whether the current working mode is a closed environment working mode, if so, the step S10 is carried out, and if not, the step S13 is carried out;
s10: judging whether the water cooling device is started according to actual needs, if so, entering a step S11, otherwise, entering a step S12;
s11: the heat dissipation control module starts a water cooling device and adopts a water cooling mode to dissipate heat;
s12: the heat dissipation control module controls the scientific refrigeration camera to stop image acquisition;
s13: the heat dissipation control module starts the air cooling device and adopts an air cooling mode to dissipate heat.
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