CN114967292B - Refrigeration science camera with multiple heat radiation structure - Google Patents
Refrigeration science camera with multiple heat radiation structure Download PDFInfo
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- CN114967292B CN114967292B CN202210655183.5A CN202210655183A CN114967292B CN 114967292 B CN114967292 B CN 114967292B CN 202210655183 A CN202210655183 A CN 202210655183A CN 114967292 B CN114967292 B CN 114967292B
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 54
- 230000005855 radiation Effects 0.000 title claims description 6
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 96
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 84
- 238000010521 absorption reaction Methods 0.000 claims abstract description 57
- 239000012782 phase change material Substances 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 45
- 238000012546 transfer Methods 0.000 claims abstract description 39
- 238000003384 imaging method Methods 0.000 claims abstract description 20
- 238000006243 chemical reaction Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 13
- 239000013307 optical fiber Substances 0.000 claims description 12
- 239000000498 cooling water Substances 0.000 claims description 11
- 238000005192 partition Methods 0.000 claims description 6
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- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 12
- 108010066114 cabin-2 Proteins 0.000 description 11
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- 230000003287 optical effect Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012984 biological imaging Methods 0.000 description 1
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- 238000000799 fluorescence microscopy Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
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- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a refrigeration scientific camera with a multiple heat dissipation structure, wherein an imaging circuit, an image sensor and a semiconductor refrigerator are placed in a refrigeration cabin, the semiconductor refrigerator absorbs heat of the image sensor, heat is absorbed by a phase change material in the heat absorption cabin through conduction of a heat transfer heat pipe, the heat is absorbed by the phase change material, the phase change material is conveyed to a circulating water channel through a water cooling head in a water cooling device to perform water cooling and heat dissipation, and the heat absorption cabin is subjected to air cooling and heat dissipation through an air cooling device. The invention provides a multiple heat dissipation structure, which enhances the heat dissipation efficiency and improves the safety.
Description
Technical Field
The invention belongs to the technical field of scientific cameras, and particularly relates to a refrigeration scientific camera with a multiple heat dissipation structure.
Background
In recent decades, with the development of machine vision technology, scientific cameras have been studied in the scientific field to find great application, such as bioscience, astronomy, chemical imaging, biological imaging, fluorescence microscopy imaging, high-speed photography, and other fields, to provide higher-performance image recording services. When the scientific camera is in an operating state, internal electronic components continuously generate heat and accumulate thermal noise to cause image signals to be interfered by the thermal noise, in order to reduce the thermal noise, improve the image quality and realize long-time exposure, the electronic components in the scientific camera need to be kept at a proper operating temperature, and in certain application scenes, the scientific camera also needs to be used as a low heat radiation source to reduce the temperature influence on other devices, so that the scientific camera usually needs to be adjusted and cooled.
Most of the existing scientific cameras adopt a semiconductor refrigeration mode to deeply refrigerate an image sensor, the semiconductor refrigerator is divided into a cold end and a hot end, the working mechanism is that voltage is applied to the two ends of the semiconductor, temperature difference can be generated at the two ends, if heat generated by the hot end of the semiconductor cannot be transferred in time, the temperature of the hot end is increased, and the temperature of the cold end is also increased along with the heat transfer, so that in order to maintain the deep refrigeration effect of the semiconductor cold end on the sensor, the heat generated by the hot end is also required to be transferred to maintain the temperature stability of the cold end.
In the prior art, most refrigeration scientific cameras use a water-cooled heat dissipation structure (such as document "Hu Xin. The design of a superoptical III host X-ray stripe camera [ J ]. The optical journal, 2009, (10): 2871-2875." discloses a technical scheme) to dissipate heat of a semiconductor refrigerator so as to ensure the normal operation of the scientific camera. When the water-cooled heat radiation structure works, besides the structural complexity of the scientific camera is increased due to the existence of the water pipe, the risk of circulating water leakage exists, and once the circulating water leaks, the scientific camera and other related equipment can be seriously damaged, so that great economic loss is caused. In addition, the heat dissipation efficiency of the single heat dissipation structure is not high, and in the application scene with high requirements on temperature control, the single water cooling or air cooling heat dissipation structure is difficult to meet the actual requirements.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, and provides a refrigeration scientific camera with a multiple heat dissipation structure, wherein the multiple heat dissipation structure is arranged, so that the heat dissipation efficiency is enhanced and the safety is improved.
In order to achieve the above object, the refrigeration science camera with multiple heat dissipation structures of the present invention comprises a refrigeration compartment, a heat transfer pipe, a heat absorption compartment, a water cooling device, an air cooling device, an imaging circuit, an image sensor, a semiconductor refrigerator, an interface circuit and a photoelectric conversion circuit, wherein:
the refrigerating cabin is used for placing the imaging circuit, the image sensor and the semiconductor refrigerator, and the rear end of the refrigerating cabin is connected with the front end of the heat absorption cabin, so that the refrigerating cabin is of a closed structure; the refrigerating cabin comprises a refrigerating cabin shell and an optical fiber panel, wherein the optical fiber panel is arranged at a front cover opening of the refrigerating cabin shell, an imaging circuit is coupled with the optical fiber panel to jointly realize scientific imaging, and the image sensor is used for carrying out photoelectric conversion on signals obtained by the imaging circuit to obtain image data and outputting the image data to the interface circuit; the semiconductor refrigerator is used for refrigerating the image sensor, and the hot end of the semiconductor refrigerator is attached to a front cover of a water cooling head in a water cooling device arranged at the front end of the heat absorption cabin;
the interface circuit and the photoelectric conversion circuit are arranged below the heat absorption cabin, and the interface circuit is used for connecting the image sensor and the photoelectric conversion circuit, transmitting image data obtained by the image sensor to the photoelectric conversion circuit, and converting the image data into electric signals by the photoelectric conversion circuit and then outputting the electric signals;
the heat absorption cabin is filled with phase change materials, the heat transfer heat pipe is positioned in the water cooling head, and extends into the phase change materials from the front end of the heat absorption cabin to conduct heat of the semiconductor refrigerator to the phase change materials;
the water cooling device comprises a water cooling head, a circulating water channel and a cooling water inlet and outlet, wherein the water cooling head is arranged at the front end of the heat absorption cabin and extends into the refrigerating cabin, the front cover of the water cooling head is attached to the hot end of the semiconductor refrigerator, the other end of the water cooling head is connected with the circulating water channel in the water cooling device, and the circulating water channel penetrates through the phase change material and is connected with the cooling water inlet and outlet at the rear end of the heat absorption cabin;
the air cooling device is arranged above the heat absorption cabin and is used for radiating heat of the heat absorption cabin in an air cooling mode.
Further, a sealing gasket is arranged at the front cover opening part of the refrigeration cabin shell.
Further, a heat conducting block is arranged between the image sensor and the semiconductor refrigerator, one surface of the heat conducting block is attached to the image sensor, and the other surface of the heat conducting block is attached to the cold end of the semiconductor refrigerator.
Further, the melting point of the phase change material is in the range of 20-30 ℃, and the phase change heat absorption ratio is in the range of 200-250J/g.
Further, a cross-shaped partition plate is arranged in the heat absorption cabin to uniformly divide the heat absorption cabin into 4 communicated sub-cabins, a plurality of radiating fins are added into each sub-cabin, the radiating fins are immersed in the phase change material, and one end of each radiating fin is attached to the heat transfer heat pipe.
Further, the radiating fins are provided with holes.
Further, the heat transfer pipe is connected to the front cover of the water cooling head in a low-temperature reflow soldering mode.
Further, the air cooling device comprises a blower and a heat dissipation device.
Further, the scientific refrigeration camera further comprises a heat dissipation control module for controlling heat dissipation work of the scientific refrigeration camera.
Further, the heat dissipation control module adopts the following control method:
s1: the working mode is set in the heat dissipation control module by a worker according to the application environment of the scientific refrigeration camera, when the application environment is a closed environment, the working mode is set as the closed environment working mode, otherwise, the working mode is set as the conventional mode;
s2: starting a scientific refrigeration camera, and closing a default water cooling device and an air cooling device at the moment;
s3: detecting the temperature T1 of the refrigerating cabin in real time by adopting a temperature sensor;
s4: according to the temperature T1 obtained in the step S3 and the preset target temperature T0 of the refrigerating cabin, a preset temperature control algorithm is adopted to control the power of the semiconductor refrigerator;
s5: judging whether the temperature T1 is smaller than the preset target temperature T0 of the refrigerating cabin, if so, not performing any operation, returning to the step S3, otherwise, entering into the step S6;
s6: judging whether the temperature T1 is greater than the preset upper temperature limit T2 of the refrigerating cabin, if so, judging whether an overtemperature timer is started, if so, resetting the overtemperature timer Wen Jishi, otherwise, not performing any operation; if the temperature is greater than or equal to the upper temperature limit T2, judging whether the overtemperature timer is started, if so, not performing any operation, otherwise, starting the overtemperature timer for timing; step S7 is entered;
s7: judging whether the timing of the overtemperature timer is greater than a preset threshold value, if not, returning to the step S3, otherwise, entering the step S8;
s8: the heat dissipation control module adopts a preset mode to carry out overtemperature alarm;
s9: the heat dissipation control module judges whether the current working mode is a closed environment working mode, if so, the step S10 is entered, otherwise, the step S13 is entered;
s10: judging whether to start the water cooling device according to actual needs, if so, entering a step S11, otherwise, entering a step S12;
s11: the heat dissipation control module starts a water cooling device and dissipates heat in a water cooling mode;
s12: the heat dissipation control module controls the scientific refrigeration camera to stop image acquisition;
s13: the heat dissipation control module starts the air cooling device and dissipates heat in an air cooling mode.
The invention relates to a refrigeration scientific camera with a multiple heat dissipation structure, wherein an imaging circuit, an image sensor and a semiconductor refrigerator are placed in a refrigeration cabin, the semiconductor refrigerator absorbs heat of the image sensor, heat is absorbed by a phase change material in a heat absorption cabin through conduction of a heat transfer heat pipe, the heat is absorbed by the phase change material, the heat is transferred to a circulating water channel through a water cooling head in a water cooling device, water cooling and heat dissipation are performed through cooling water, and the heat absorption cabin is subjected to air cooling and heat dissipation through an air cooling device.
The invention has the following beneficial effects:
1) The heat absorption cabin is filled with the phase change material, so that the heat of the image sensor is quickly absorbed, the heat is stored in the camera, the external divergence is reduced, the camera is in a stable working environment, and particularly when the camera works in a closed environment, the temperature stability of the closed environment can be effectively maintained, and the influence on the operation of other equipment is reduced;
2) The invention is also provided with the water cooling device and the air cooling device, and when the working condition allows, the camera is started in a water cooling heat dissipation mode during working, so that the heat of the hot end surface of the semiconductor refrigerator can be completely taken away, and the camera can continuously work for a long time and is in a deep refrigeration mode; the phase change material continuously absorbs heat when the camera works, so that the heat stored by the phase change material is rapidly taken away through water cooling heat dissipation and air cooling heat dissipation when the camera does not work, and is cooled into a solid phase, and the working interval of the camera can be shortened;
3) The invention adopts a multiple heat dissipation structure, and can flexibly combine and select proper heat dissipation modes according to application scenes, so that compared with the single water cooling, air cooling and other heat dissipation modes of the prior camera, the heat dissipation efficiency is improved, the working time of the camera is prolonged, and the working interval of the camera is shortened.
Drawings
FIG. 1 is a block diagram of an embodiment of a refrigeration science camera with multiple heat dissipation structures of the present invention;
fig. 2 is an internal structural view of the heat absorbing chamber in the present embodiment;
fig. 3 is a structural view of a heat radiating fin in the present embodiment;
FIG. 4 is a schematic view showing the installation of the heat transfer pipe in the present embodiment;
FIG. 5 is a block diagram of a water cooling apparatus according to the present invention;
FIG. 6 is a block diagram of a wind cooling device in the present embodiment;
fig. 7 is a simulated infrared ray diagram of the heat dissipation structure 1 in the present embodiment;
fig. 8 is a simulated infrared ray diagram of the heat dissipation structure 2 in the present embodiment;
fig. 9 is a simulated infrared ray diagram of the heat dissipation structure 3 in the present embodiment;
fig. 10 is a flowchart of a heat dissipation control method in the present embodiment.
In the figure: the device comprises a cooling cabin 1, a cooling cabin 101, a cooling cabin shell 102, an optical fiber panel 103, a sealing gasket 2, a heat absorption cabin 201, a cross-shaped partition board 202, a heat radiating fin 3, a water cooling device 301, a water cooling head 302, a circulating water channel 303, a cooling water inlet and outlet 303, an air cooling device 4, a blower 401, a heat radiating device 402, a heat transfer heat pipe 5, an imaging circuit 6, an imaging sensor 7, a heat transfer block 8, a semiconductor refrigerator 9, an interface circuit 10, a photoelectric conversion circuit 11, a camera lower cover 12, a BNC connector 13, a power interface 14, a camera housing 15, a camera upper cover 16 and a phase change material 17.
Detailed Description
The following description of the embodiments of the invention is presented in conjunction with the accompanying drawings to provide a better understanding of the invention to those skilled in the art. It is to be expressly noted that in the description below, detailed descriptions of known functions and designs are omitted here as perhaps obscuring the present invention.
Examples
Fig. 1 is a block diagram of an embodiment of a refrigeration science camera with multiple heat dissipation structures of the present invention. As shown in fig. 1, the components of the refrigeration science camera with multiple heat dissipation structures of the present invention can be divided into two major parts: one part is a structural part comprising a refrigerating cabin 1, a heat absorbing cabin 2, a water cooling device 3, an air cooling device 4 and a heat transfer heat pipe 5, and the other part is an electric part comprising an imaging circuit 6, an image sensor 7, a semiconductor refrigerator 9, an interface circuit 10 and a photoelectric conversion circuit 11. The respective components are described in detail below.
The refrigerating cabin 1 is used for placing the imaging circuit 6, the image sensor 7 and the semiconductor refrigerator 9, and the rear end of the refrigerating cabin 1 is connected with the front end of the heat absorbing cabin 2, so that the refrigerating cabin 1 is of a closed structure. The refrigerating cabin 1 comprises a refrigerating cabin shell 101 and an optical fiber panel 102, wherein the optical fiber panel 102 is arranged at a front cover opening of the refrigerating cabin shell 101, the imaging circuit 6 is coupled with the optical fiber panel 102 to jointly realize scientific imaging, and the image sensor 7 is used for carrying out photoelectric conversion on signals obtained by the imaging circuit 6 to obtain image data and outputting the image data to the interface circuit 10. The semiconductor refrigerator 9 is used for refrigerating the image sensor 7, and the hot end of the semiconductor refrigerator is attached to a front cover of a water cooling head 301 in the water cooling device 3 arranged at the front end of the heat absorption cabin 2.
In this embodiment, the sealing pad 103 is disposed outside the opening of the front cover of the refrigeration compartment housing 101, which is because in actual use of the scientific refrigeration camera, the optical fiber panel 102 needs to be coupled with other external devices (such as an enhancer or a scintillator), and the sealing pad 103 is disposed to seal the opening of the refrigeration compartment housing 101 after the optical fiber panel 102 is coupled with the other external devices, so as to prevent the external foreign matters from entering the refrigeration compartment to cause damage to the optical devices; the second gasket 103 may also act as a buffer to protect the fiber optic faceplate 102 when the fiber optic faceplate is coupled to other equipment.
In addition, can set up heat conduction piece 8 between image sensor 7 and semiconductor refrigerator 9, heat conduction piece 8 one side is laminated with image sensor 7, and the one side is laminated with the cold junction of semiconductor refrigerator 9 for heat exchange before accelerating the two improves refrigeration efficiency.
The interface circuit 10 and the photoelectric conversion circuit 11 are disposed below the heat absorption chamber 2, the interface circuit 10 is used for connecting the image sensor 7 and the photoelectric conversion circuit 11, transmitting the image data obtained by the image sensor 7 to the photoelectric conversion circuit 11, and the photoelectric conversion circuit 11 converts the image data into an electrical signal and outputs the electrical signal.
The heat absorption cabin 2 is filled with the phase change material 17, the heat transfer heat pipe 5 is positioned inside the water cooling head 301, and extends into the phase change material 17 from the front end of the heat absorption cabin 2, so that heat of the semiconductor refrigerator 9 is conducted to the phase change material 17. The phase change material (PCM, phase Change Material) refers to a substance that changes a state of a substance and provides latent heat without changing a temperature, and a process of transforming physical properties is called a phase change process, in which the phase change material absorbs or releases a large amount of latent heat. The scientific refrigeration camera can possibly work in a closed environment, other scientific research equipment which works simultaneously with the camera is also in the same closed working environment, so that the temperature rise of the closed environment is generally limited, heat generated by the camera is stored in the camera as much as possible, the external divergence is reduced as much as possible, the stability of the temperature of the closed environment is maintained, and the influence on the operation of other equipment is reduced. The phase-change materials are of various types, and in order to better adapt to the working environment of a scientific camera, the phase-change materials with melting points in the range of 20-30 ℃ and phase-change heat absorption ratios in the range of 200-250J/g are preferable, for example, paraffin is adopted in the embodiment.
In order to accelerate heat conduction and improve the heat absorption efficiency of the phase change material, the specific structure of the heat absorption cabin 2 is optimized in the embodiment. Fig. 2 is an internal structural view of the heat absorbing chamber in the present embodiment. As shown in fig. 2, in this embodiment, the heat absorption chamber 2 is provided with a cross-shaped partition 201 to divide the heat absorption chamber 2 into 4 communicating sub-chambers, each sub-chamber is added with a plurality of heat dissipation fins 202, and the heat dissipation fins 202 are immersed in the phase change material, and one end of each heat dissipation fin is attached to the heat transfer tube 5. The fluidity of the phase change material can be maintained by the communication of the 4 sub-cabins, so that the temperature of the whole heat absorption cabin 2 is kept uniform, and the overall reliability of the heat absorption cabin 2 is ensured. The heat dissipation fins 202 have larger areas, and compared with the heat transfer tube 5 directly contacted with the phase change material 17, the heat dissipation fins can transfer the heat of the heat transfer tube 5 to the phase change material 17 more quickly, thereby quickly absorbing the heat of the hot end of the semiconductor refrigerator 9 and improving the heat dissipation efficiency. Fig. 3 is a structural view of the heat radiating fin in the present embodiment. As shown in fig. 3, openings are further provided on the heat dissipation fins 202 in this embodiment, so as to maintain fluidity of the melted phase change material, and make temperature rise of the phase change material more uniform.
Fig. 4 is a schematic diagram of the installation of the heat transfer pipe in the present embodiment. As shown in fig. 4, in this embodiment, the heat transfer pipe 5 is embedded in the water cooling head 301, and extends into the phase change material 17 in the heat absorption chamber 2 through the front cover of the heat absorption chamber 2. In the invention, the heat transfer pipe 5 is used for transferring heat to the phase change material 17, so that the heat transfer efficiency is faster and more efficient compared with heat transfer efficiency of heat transfer silica gel, heat transfer silicone grease and other heat transfer materials. In this embodiment, the heat transfer tube 5 is connected to the front cover of the water cooling head 301 by low-temperature reflow soldering, and compared with other processes of directly bonding heat conducting materials, the low-temperature reflow soldering process can improve the heat conducting efficiency of the heat transfer tube and ensure the connection stability between the heat transfer tube and the front cover of the water cooling head 301. When the heat absorption cabin 2 is uniformly divided into 4 sub-cabins by the cross-shaped partition plate 201, the part of the heat transfer heat pipe 5 extending into the phase change material 17 can be fixed on the cross-shaped partition plate 201, so that the heat transfer heat pipe 5 is positioned at the center of the phase change material 17, the heat absorbed by the phase change material 17 in the 4 sub-cabins is more uniform, the local overhigh temperature is avoided, and meanwhile, the displacement of the heat transfer heat pipe caused by vibration in the use process of the scientific refrigeration camera can be avoided.
In addition, the heat absorption cabin adopts a compression-resistant design and performs compression-resistant test during design so as to ensure that a camera cannot leak when working in a closed environment and influence working environment and other working equipment.
Fig. 5 is a structural view of a water cooling apparatus according to the present invention. As shown in fig. 5, the water cooling device 3 of the present invention includes a water cooling head 301, a circulating water passage 302, and a cooling water inlet/outlet 303. As shown in fig. 1 and 5, the water cooling head 301 is disposed at the front end of the heat absorption chamber 2 and extends into the refrigerating chamber 1, the front cover of the water cooling head 301 is attached to the hot end of the semiconductor refrigerator, the other end of the water cooling head is connected with the circulating water channel 302 in the water cooling device 3, and the circulating water channel 302 passes through the phase change material 17 and is connected with the cooling water inlet and outlet 303 at the rear end of the heat absorption chamber 2. The water cooling head 301 in this embodiment adopts a heat conductive copper block to improve the heat conduction effect. It can be seen that the water cooling head 301 absorbs heat of the semiconductor refrigerator 9 and circulates the cooling water in the circulating water passage 303 to the outside. In the invention, the water cooling device 3 directly absorbs the heat of the semiconductor refrigerator 9 through the water cooling head 301, and the circulating water channel 302 of the water cooling device 3 passes through the phase change material 17 in the heat absorption cabin 2, so that the heat of the phase change material 17 can be absorbed to indirectly assist the phase change material 17 in radiating the heat of the semiconductor refrigerator 9, thereby improving the radiating efficiency, delaying the temperature rise of the phase change material 17 and prolonging the working time of a scientific camera. In practice, the circulating water channel 302 may also be disposed closely adjacent to the heat transfer tube, so that heat can also be directly removed from the heat transfer tube. The water cooling device 3 can also adopt a compression-resistant design and carry out compression-resistant test during design so as to ensure that the water cooling device cannot leak during operation.
Considering the characteristic that heat flow rises from low to high, the air cooling device 4 is arranged above the heat absorption cabin, and the heat absorption cabin is cooled in an air cooling mode, so that heat dissipation is quickened, the temperature rise of the phase change material is delayed, and the working time of the scientific camera is prolonged. Fig. 6 is a structural view of the cooling device in the present embodiment. As shown in fig. 6, the air cooling device 4 in this embodiment includes a blower 401 and a heat dissipation device 402, and the two components cooperate to perform air cooling heat dissipation.
When the scientific refrigeration camera stops working, the water cooling device and the air cooling device can be started to rapidly take away the heat stored by the phase change material to cool the phase change material into a solid phase, so that the working interval of the camera is shortened. In practical applications, the refrigeration camera may be further configured with other packaging structures, such as a lower camera cover 12, a BNC connector 13, a power interface 14, a camera housing 15, an upper camera cover, and the like. This part is not a technical point of the present invention and is not described herein.
In order to illustrate the technical effects of the invention, the invention is experimentally verified by adopting a specific example. The volume of the heat absorption chamber 2 in this embodiment is 1000 ml, and 850 g of phase change material (phase change material density ratio 0.85 g/ml) is accommodated. Actual tests prove that by adopting the designed camera, under the condition that the camera works at the temperature below 0 ℃ in a closed environment and is not cooled by water or air, after the camera works for 2 hours, the phase change material is completely melted, and the refrigerating temperature of the camera begins to rise; under the condition of no water cooling and air cooling, the refrigerating temperature of the camera starts to rise after the camera works for 4 hours; the camera can continuously work under the condition of water cooling and air cooling, and the refrigerating temperature is kept unchanged.
Next, comparative experiments were performed on different heat dissipation structures, and the environmental conditions of the experiments were as follows: the heat source is 30W, the environment is 30 ℃, the air is 30 ℃, and the fan air quantity is 3.5L/S. In the experimental verification, the number of the heat dissipation structure schemes is 2, the heat absorption cabin 2 of the heat dissipation structure 1 does not contain heat dissipation fins, and the heat absorption cabin of the heat dissipation structure 2 contains heat dissipation fins. For comparison, a comparison experiment was performed using a heat absorption cabin lacking a heat transfer pipe and containing no heat radiating fins as the heat radiating structure 3, and an infrared ray diagram after 2 hours of operation of a refrigeration science camera was compared. Fig. 7 is a simulated infrared ray diagram of the heat dissipation structure 1 in the present embodiment. Fig. 8 is a simulated infrared ray diagram of the heat dissipation structure 2 in the present embodiment. Fig. 9 is a simulated infrared ray diagram of the heat dissipation structure 3 in the present embodiment. Table 1 is a comparison of heat dissipation effect data of three heat dissipation structures in this embodiment.
TABLE 1
Comparing fig. 7 to fig. 9 and referring to table 1, the heat dissipation structure 1 and the heat dissipation structure 2 are better than the heat dissipation structure 3, so that the heat transfer heat pipe can transfer the heat of the image sensor 7 to the phase change material more quickly, thereby realizing the heat dissipation of the image sensor 7 more quickly and effectively prolonging the working time of the scientific refrigerating camera. After the radiating fins are arranged, the radiating effect can be further improved, and the temperature in the heat absorption cabin can be more uniform. Meanwhile, due to the existence of the phase change material, heat is stored inside the camera, and the influence on the environment temperature outside the camera is small.
In addition, in order to improve the management and control of the heat dissipation structure in the invention, the embodiment also provides a heat dissipation control module in the scientific refrigeration camera for controlling the heat dissipation work of the scientific refrigeration camera. The embodiment comprehensively considers the heat dissipation effectiveness and the energy consumption saving, and provides a heat dissipation control method. Fig. 10 is a flowchart of a heat dissipation control method in the present embodiment. As shown in fig. 10, the heat dissipation control method of the heat dissipation control module in this embodiment includes the following steps:
s101: setting a working mode:
the working mode is set in the heat dissipation control module by the staff according to the application environment of the scientific refrigeration camera, when the application environment is a closed environment, the working mode is set as the closed environment, otherwise, the working mode is set as the conventional mode. In practical application, a mode control switch can be arranged on the shell of the scientific refrigeration camera, and the heat dissipation control module can be connected with the upper computer through a wireless network for setting.
S102: and (3) starting a camera:
the scientific refrigeration camera is started, and the default water cooling device and the air cooling device are closed at the moment.
S103: and (3) temperature acquisition:
and detecting the temperature T1 of the refrigerating cabin in real time by adopting a temperature sensor. Since the temperature of the refrigerated compartment is mainly derived from the image sensor, it may be arranged in the vicinity of the image sensor when the temperature sensor is provided.
S104: and (3) refrigerating power adjustment:
and (3) controlling the power of the semiconductor refrigerator by adopting a preset temperature control algorithm according to the temperature T1 obtained in the step S103 and the preset target temperature T0 of the refrigerating cabin. In this embodiment, the temperature control algorithm adopts a PID control algorithm, and when the temperature of the cooling cabin deviates from the target temperature T0 of the cooling cabin, the cooling power of the semiconductor refrigerator is automatically increased or decreased, so that the temperature is stable.
S105: judging whether the temperature T1 is smaller than the preset target temperature T0 of the refrigerating cabin, if so, not performing any operation, returning to the step S103, otherwise, entering the step S106.
S106: the over-temperature timer is started and stopped:
judging whether the temperature T1 is greater than the preset upper temperature limit T2 of the refrigerating cabin, if so, judging whether an overtemperature timer is started, if so, resetting the overtemperature timer Wen Jishi, otherwise, not performing any operation; if the temperature is greater than or equal to the upper temperature limit T2, judging whether the overtemperature timer is started, if so, not performing any operation, otherwise, starting the overtemperature timer for timing. Step S107 is entered.
By setting the super Wen Jishi device, whether the temperature exceeds the upper temperature limit is temporary or not can be determined, if the temperature exceeds the upper temperature limit temporarily, normal regulation is tried first, if the temperature exceeds the upper temperature limit for a long time, the phase change material is likely to be completely liquefied and invalid, heat absorption cannot be continued, and corresponding countermeasures are needed according to actual conditions.
S107: judging whether the timing of the overtemperature timer is greater than a preset threshold, if not, returning to the step S103, otherwise, entering the step S108.
S108: overtemperature alarm:
the heat dissipation control module adopts a preset mode to carry out overtemperature alarm, and the alarm mode generally comprises icon flashing, alarm sound prompting, temperature font reddening, alarm information sending to an upper computer and the like, and a proper mode is selected in practical application.
S109: the heat dissipation control module determines whether the current working mode is a closed environment working mode, if so, the step S110 is entered, otherwise, the step S113 is entered.
S110: judging whether to start the water cooling device according to actual needs, if so, proceeding to step S111, otherwise proceeding to step S112. In general, whether the water cooling device is turned on or not can be determined by whether cooling water is supplied in a closed environment, if cooling water is supplied, the water cooling device can be turned on, and if the water cooling device is not supplied or is not allowed to be used in the closed environment, the water cooling device cannot be turned on.
S111: and (3) water cooling and heat radiation:
the heat dissipation control module starts the water cooling device and dissipates heat in a water cooling mode. The mode can take away the heat of the phase change material and the hot end of the semiconductor refrigerator, and the camera can continuously work for a long time after the water cooling heat dissipation mode is started.
S112: stop working:
the heat dissipation control module controls the scientific refrigeration camera to stop image acquisition. After stopping working and taking out the scientific refrigeration camera from the closed environment, the air cooling device can be started to cool and dissipate heat by air, so that the dissipation of phase change materials and heat in the camera is quickened, and the working interval of the camera is effectively shortened.
S113: air cooling heat dissipation:
the heat dissipation control module starts the air cooling device and dissipates heat in an air cooling mode. When the working mode of the scientific refrigeration camera is a conventional mode and overtemperature alarm occurs, the air cooling heat dissipation is adopted directly, so that the method is more convenient and effective.
In the practical application, the heat dissipation control method can be set according to the actual requirements, for example, the air cooling device and the water cooling device can be completely opened directly when the scientific refrigeration camera is started under the condition of not considering the closed environment and heat dissipation energy consumption, so that the heat dissipation efficiency is maximized, and the scientific refrigeration camera can be kept at a lower temperature for a long time to continuously work.
While the foregoing describes illustrative embodiments of the present invention to facilitate an understanding of the present invention by those skilled in the art, it should be understood that the present invention is not limited to the scope of the embodiments, but is to be construed as protected by the accompanying claims insofar as various changes are within the spirit and scope of the present invention as defined and defined by the appended claims.
Claims (8)
1. The utility model provides a refrigeration science camera with multiple heat radiation structure, its characterized in that includes refrigeration cabin, heat transfer pipe, heat absorption cabin, water-cooling plant, forced air cooling device, imaging circuit, image sensor, semiconductor refrigerator, interface circuit, photoelectric conversion circuit and heat dissipation control module, wherein:
the refrigerating cabin is used for placing the imaging circuit, the image sensor and the semiconductor refrigerator, and the rear end of the refrigerating cabin is connected with the front end of the heat absorption cabin, so that the refrigerating cabin is of a closed structure; the refrigerating cabin comprises a refrigerating cabin shell and an optical fiber panel, wherein the optical fiber panel is arranged at a front cover opening of the refrigerating cabin shell, an imaging circuit is coupled with the optical fiber panel to jointly realize scientific imaging, and the image sensor is used for carrying out photoelectric conversion on signals obtained by the imaging circuit to obtain image data and outputting the image data to the interface circuit; the semiconductor refrigerator is used for refrigerating the image sensor, and the hot end of the semiconductor refrigerator is attached to a front cover of a water cooling head in a water cooling device arranged at the front end of the heat absorption cabin;
the interface circuit and the photoelectric conversion circuit are arranged below the heat absorption cabin, and the interface circuit is used for connecting the image sensor and the photoelectric conversion circuit, transmitting image data obtained by the image sensor to the photoelectric conversion circuit, and converting the image data into electric signals by the photoelectric conversion circuit and then outputting the electric signals;
the heat absorption cabin is filled with phase change materials, the heat transfer heat pipe is positioned in the water cooling head, and extends into the phase change materials from the front end of the heat absorption cabin to conduct heat of the semiconductor refrigerator to the phase change materials;
the water cooling device comprises a water cooling head, a circulating water channel and a cooling water inlet and outlet, wherein the water cooling head is arranged at the front end of the heat absorption cabin and extends into the refrigerating cabin, the front cover of the water cooling head is attached to the hot end of the semiconductor refrigerator, the other end of the water cooling head is connected with the circulating water channel in the water cooling device, and the circulating water channel penetrates through the phase change material and is connected with the cooling water inlet and outlet at the rear end of the heat absorption cabin;
the air cooling device is arranged above the heat absorption cabin and is used for radiating the heat absorption cabin in an air cooling mode;
the heat dissipation control module is used for controlling the heat dissipation work of the scientific refrigeration camera, and the control method comprises the following steps:
s1: setting a working mode in the heat dissipation control module according to the application environment of the scientific refrigeration camera, setting the working mode as a closed environment working mode when the application environment is a closed environment, or setting the working mode as a conventional mode otherwise;
s2: starting a scientific refrigeration camera, and closing a default water cooling device and an air cooling device at the moment;
s3: detecting the temperature T1 of the refrigerating cabin in real time by adopting a temperature sensor;
s4: according to the temperature T1 obtained in the step S3 and the preset target temperature T0 of the refrigerating cabin, a preset temperature control algorithm is adopted to control the power of the semiconductor refrigerator;
s5: judging whether the temperature T1 is smaller than the preset target temperature T of the refrigerating cabin, if so, not performing any operation, returning to the step S3, otherwise, entering the step S6;
s6: judging whether the temperature T1 is greater than the preset upper temperature limit T2 of the refrigerating cabin, if so, judging whether an overtemperature timer is started, if so, resetting the overtemperature timer Wen Jishi, otherwise, not performing any operation; if the temperature is greater than or equal to the upper temperature limit T2, judging whether the overtemperature timer is started, if so, not performing any operation, otherwise, starting the overtemperature timer for timing; step S7 is entered;
s7: judging whether the timing of the overtemperature timer is greater than a preset threshold value, if not, returning to the step S3, otherwise, entering the step S8;
s8: the heat dissipation control module adopts a preset mode to carry out overtemperature alarm;
s9: the heat dissipation control module judges whether the current working mode is a closed environment working mode, if so, the step S10 is entered, otherwise, the step S13 is entered;
s10: judging whether to start the water cooling device according to actual needs, if so, entering a step S11, otherwise, entering a step S12;
s11: the heat dissipation control module starts a water cooling device and dissipates heat in a water cooling mode;
s12: the heat dissipation control module controls the scientific refrigeration camera to stop image acquisition;
s13: the heat dissipation control module starts the air cooling device and dissipates heat in an air cooling mode.
2. The refrigerated science camera of claim 1, wherein a gasket is provided outside the front cover opening of the refrigerated compartment housing.
3. The refrigeration science camera according to claim 1, wherein a heat conducting block is arranged between the image sensor and the semiconductor refrigerator, one surface of the heat conducting block is attached to the image sensor, and the other surface is attached to the cold end of the semiconductor refrigerator.
4. The refrigerated scientific camera of claim 1, wherein the melting point of the phase change material in the endothermic chamber is in the range of 20-30 ℃ and the phase change endothermic ratio is in the range of 200-250 joules/gram.
5. The refrigeration science camera according to claim 1, wherein a cross-shaped partition plate is arranged in the heat absorption cabin to uniformly divide the heat absorption cabin into 4 communicated sub-cabins, a plurality of radiating fins are added into each sub-cabin, the radiating fins are immersed in the phase change material, and one end of each radiating fin is attached to the heat transfer pipe.
6. The refrigeration science camera according to claim 5, wherein the radiating fin is provided with an opening.
7. The refrigeration science camera according to claim 1, wherein the heat transfer heat pipe is connected to the front cover of the water cooling head by means of low temperature reflow soldering.
8. The refrigeration science camera according to claim 1, wherein the air cooling device includes a blower and a heat sink.
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