CN114964725B

CN114964725B - Laser subassembly test automation equipment

Info

Publication number: CN114964725B
Application number: CN202210888477.2A
Authority: CN
Inventors: 陈晓华; 张恒峰; 惠宏超; 郎超
Original assignee: BWT Beijing Ltd
Current assignee: BWT Beijing Ltd
Priority date: 2022-07-27
Filing date: 2022-07-27
Publication date: 2022-11-04
Anticipated expiration: 2042-07-27
Also published as: CN114964725A

Abstract

The invention provides a laser assembly test automation device, which comprises: a machine platform; the rotating device is rotatably arranged on the machine table, a plurality of carriers are arranged on the edge side of the rotating device, and a plurality of laser assemblies are arranged on the carriers; the temperature testing device is arranged on the machine table and used for compressing and electrifying the laser component and heating the laser component within a preset temperature range; the identification and cooling device is arranged on the machine table and used for identifying the identifier of the laser assembly and cooling the laser assembly in a heat dissipation manner; the light receiving device is arranged above the machine table and used for carrying out optical test on light output by the laser assembly; and moving the laser assembly on the carrier to the temperature testing device and the recognition and cooling device through the rotation of the rotating device, and testing through the light receiving device. The invention can conveniently and easily control the plurality of laser assemblies in the carrier to rotate and move to the temperature testing device and the recognition and cooling device, and the testing is carried out through the light receiving device, thereby improving the testing efficiency.

Description

Laser subassembly test automation equipment

Technical Field

The invention relates to the technical field of optical test equipment, in particular to automatic test equipment for a laser assembly.

Background

Currently, with economic development and social progress, the application of laser is more and more extensive. Laser assemblies are subjected to a number of tests during the manufacturing process.

In the prior art, charts and parameters such as a power current voltage (PIV) curve, a spectral curve, a Numerical Aperture (NA) ratio and the like of a laser module are obtained by manual testing.

In the process of implementing the invention, the inventor finds that at least the following problems exist in the prior art: the graphs and parameters of the laser assemblies are tested manually, and only one laser assembly can be tested at a time, so that the mode is low in efficiency and not beneficial to large-scale production. Particularly, in order to meet the requirements of some special industries, the indexes are required to be obtained under the high-temperature condition, and the accuracy, the rapidness and the safety of the conventional test mode are difficult to meet the large-scale production.

Disclosure of Invention

The present invention is directed to solving, at least in part, one of the technical problems in the related art.

Therefore, the invention aims to provide laser assembly testing automation equipment which solves the problems of low efficiency, difficulty in large-scale production and low precision in the prior art.

In order to achieve the above object, the present invention provides an automatic testing apparatus for a laser module, comprising:

a machine platform;

the rotating device is rotatably arranged on the machine table, a plurality of carriers are arranged on the edge side of the rotating device, and a plurality of laser assemblies are arranged on the carriers;

the temperature testing device is arranged on the machine table and used for compressing and electrifying the laser component and heating the laser component within a preset temperature range;

the identification and cooling device is arranged on the machine table and used for identifying the identifier of the laser assembly and cooling the laser assembly in a heat dissipation manner;

the light receiving device is arranged above the machine table and used for carrying out optical test on the light output by the laser component;

and moving the laser assembly on the carrier to the temperature testing device and the recognition and cooling device through the rotation of the rotating device, and testing through the light receiving device.

According to the laser assembly test automation equipment, the rotatable rotating device is arranged on the machine table, so that the laser assemblies in the carrier can be conveniently and easily controlled to rotate and move to the temperature testing device and the recognition and cooling device, the test is carried out through the light receiving device, and the test efficiency is improved. The laser assembly test automation equipment integrates the temperature test, the light test, the identification and the cooling of the laser assembly on one equipment, reduces the number of the existing test equipment and saves the occupied space of the equipment. The automatic test equipment for the laser component can test simultaneously, and can better show the characteristics of shortening the test time, saving labor and improving the production efficiency.

According to one embodiment of the invention, the rotating means comprises:

a motor;

the carousel with the output shaft of motor is fixed, the top of carousel with the connection can be dismantled to the carrier.

According to an embodiment of the present invention, the temperature testing apparatus includes:

the first temperature testing device is used for compressing and electrifying the laser assembly and heating the laser assembly within a first preset temperature range;

the second temperature testing device is used for compressing and electrifying the laser assembly and heating the laser assembly within a second preset temperature range;

the lower limit value of the second preset temperature range is larger than the upper limit value of the first preset temperature range.

According to an embodiment of the present invention, the first temperature testing device includes:

a first frame;

the heating block is arranged on the machine table and used for heating the laser assembly;

the first pressing assembly is arranged on the first machine frame and used for pressing the laser assembly on the heating block along a first direction;

the first probe downward pressing and electrifying assembly is arranged on the first rack and used for electrifying the laser assembly;

the first hydraulic buffer is arranged on the first rack, is positioned below the first probe pressing-down electric component and is used for limiting the pressing-down distance of the first probe pressing-down electric component;

and the first thermistor is arranged on the bottom surface of the first pressing component and used for detecting the temperature of the laser component.

According to an embodiment of the present invention, the second temperature testing device includes:

a second machine frame, a first machine frame,

the heating furnace is arranged on the machine table and used for heating the laser assembly;

the second pressing assembly is arranged on the second rack and used for pressing the laser assembly on the heating furnace along the first direction;

the second probe downward pressing and powering assembly is arranged on the second rack and used for powering on the laser assembly;

the second hydraulic buffer is arranged on the second rack, is positioned below the second probe pressing-down and power-on component and is used for limiting the pressing-down distance of the second probe pressing-down and power-on component;

and the second thermistor is arranged on the bottom surface of the second pressing component and used for detecting the temperature of the laser component.

According to one embodiment of the invention, the identification and cooling device comprises:

a third frame;

the bottom surface fan assembly is arranged on the machine table and used for blowing air to the bottom of the laser assembly;

the side fan assembly is arranged on the third rack and used for blowing air to the side face of the laser assembly;

and the code scanning device is slidably arranged on the third rack and is used for identifying the identifier of the laser assembly.

According to an embodiment of the present invention, the light receiving device includes:

the first integrating sphere component is arranged on the machine table in a sliding mode along a second direction and used for abutting against the carrier at the temperature testing device and adjusting the luminous flux output by the laser component to the first integrating sphere component;

the second integrating sphere component is arranged on the machine table in a sliding manner along a third direction and is used for abutting against the carrier positioned at the temperature testing device and adjusting the luminous flux output to the second integrating sphere component by the laser component.

According to one embodiment of the invention, the first integrating sphere assembly comprises:

the first integrating sphere is used for acquiring the luminous flux output by the laser assembly;

the first spectrum receiving device is fixed on the first integrating sphere and is used for acquiring the spectral parameters of the laser assembly;

the first photocurrent receiving device is fixed on the first integrating sphere and used for acquiring the current and the power of the laser assembly;

the first integrating sphere support is fixedly connected with the machine table;

the first driver comprises a first base and a first sliding block, the first sliding block is fixed on the first base in a sliding mode, the first base is fixed with the first integrating sphere support, and the first sliding block is fixed with the first integrating sphere.

According to an embodiment of the present invention, the second integrating sphere assembly includes:

the second integrating sphere is used for acquiring the luminous flux output by the laser assembly;

the second spectrum receiving device is fixed on the second integrating sphere and is used for acquiring the spectral parameters of the laser component;

the second photocurrent receiving device is fixed on the second integrating sphere and used for acquiring the current and the power of the laser component;

the second integrating sphere support is fixedly connected with the machine table;

the second driver comprises a second base and a second sliding block, the second sliding block is fixed on the second base in a sliding mode, the second base is fixed with the second integrating sphere support, and the second sliding block is fixed with the second integrating sphere;

and the two-dimensional sliding table is arranged on the second integrating sphere support and used for adjusting the position of the second integrating sphere.

According to an embodiment of the present invention, further comprising:

the frame is fixed on the machine table, and the light receiving device is installed on the frame;

the carrier pressing assembly is arranged on the frame and used for pressing the carrier;

the correlation sensor comprises a transmitting end and a receiving end, and the transmitting end is arranged on the machine table; the receiving end and the transmitting end are arranged oppositely, and the receiving end is installed on the frame and used for detecting whether the carrier is located at a test position.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. Wherein:

fig. 1 is a schematic structural diagram of an automated laser device testing apparatus according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of another aspect of an automated laser component testing apparatus according to an embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of a rotating device according to an embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a first temperature measuring device according to an embodiment of the present invention.

Fig. 5 is a schematic structural diagram of a second temperature measuring device according to an embodiment of the present invention.

Fig. 6 is a schematic structural diagram of an identification and cooling device according to an embodiment of the present invention.

Fig. 7 is a schematic structural diagram of a light receiving device according to an embodiment of the present invention.

Fig. 8 is a schematic perspective view of a first integrating sphere assembly according to an embodiment of the present invention.

Fig. 9 is a schematic perspective view of a second integrating sphere assembly according to an embodiment of the present invention.

Fig. 10 is a schematic structural diagram of a panel according to an embodiment of the present invention.

Fig. 11 is a schematic diagram of a station of an automated laser assembly testing apparatus according to an embodiment of the present invention.

Description of reference numerals:

1-machine table, 2-rotating device, 3-first temperature testing device, 4-second temperature testing device, 5-identifying and cooling device, 6-light receiving device, 7-panel, 8-laser assembly, 21-motor, 22-turntable, 23-guide block, 24-pin, 25-carrier, 31-first frame, 32-heating block, 33-first pressing assembly, 34-first probe pressing-down electric assembly, 35-first hydraulic buffer, 36-first emitting end, 37-first receiving end, 38-first thermistor, 41-second frame, 42-heating furnace, 43-second pressing assembly, 44-second probe pressing-down electric assembly, 45-second hydraulic buffer, 46-second emitting end, 47-second receiving terminal, 48-second thermistor, 51-third frame, 52-bottom fan assembly, 53-side fan assembly, 54-code scanning device, 55-code scanning driver, 56-third emitting terminal, 57-third receiving terminal, 61-frame, 62-first integrating sphere assembly, 63-second integrating sphere assembly, 64-fourth emitting terminal, 65-fourth receiving terminal, 66-first carrier pressing assembly, 67-second carrier pressing assembly, 71-confirmation button, 72-lighting button, 73-fan button, 621-first integrating sphere, 622-first spectrum receiving device, 623-first photocurrent receiving device, 624-first integrating sphere support, 625-first driver, 631-a second integrating sphere, 632-a second spectrum receiving device, 633-a second photocurrent receiving device, 634-a second integrating sphere support, 635-a second driver, 637-a two-dimensional sliding table.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.

Fig. 1 is a schematic structural diagram of an automated laser component testing apparatus according to an embodiment of the present invention. Fig. 2 is a schematic structural diagram of another aspect of an automated laser component testing apparatus according to an embodiment of the present invention.

With reference to fig. 1 and fig. 2, the laser module test automation device in this embodiment is suitable for measuring graphs and parameters such as a PIV (power current voltage) curve, a spectral curve, and an NA (Numerical Aperture) ratio of a laser module. The laser assembly may be a laser diode or like type of semiconductor laser assembly.

The laser device assembly test automation equipment in the embodiment comprises a machine table 1, a rotating device 2, a temperature testing device and a recognition and cooling device 5. Wherein:

the machine table 1 mainly plays a supporting role and is used for supporting devices such as a rotating device 2, a temperature testing device, a recognition and cooling device 5 and the like.

The rotating device 2 is rotatably arranged on the machine table 1, a plurality of carriers 25 are arranged on the edge side of the rotating device 2, and a plurality of laser assemblies 8 are arranged on the carriers 25. In one embodiment, the carriers 25 are arranged along the circumference of the rotating device. The type and number of laser assemblies 8 mounted on the carrier 25 may be set according to actual requirements. The rotating device 2 can be driven by a manual or power source to complete the rotation. In this embodiment, the rotating means is rotated along the Z-axis.

The temperature testing device is arranged on the machine table 1 and used for compressing the laser assembly 8, electrifying the laser assembly and heating the laser assembly within a preset temperature range. The preset temperature range can be set according to actual test requirements. The number of temperature testing devices can also be set according to actual requirements.

And the recognition and cooling device 5 is arranged on the machine table 1 and used for recognizing the mark of the laser assembly 8 and cooling the laser assembly 8 by heat dissipation. It will be appreciated that the identification and cooling means 5 is a device that integrates identification means and cooling means. The laser assembly 8 has indicia thereon that can be recognized by a recognition device. The identification may be identified by optical, radio frequency, etc. Because laser instrument subassembly 8 is heated when passing through temperature testing arrangement test, need cool to the normal atmospheric temperature, cooling device can cool off the laser instrument subassembly through the physics cooling method.

And the optical testing device 6 is arranged above the machine table 1 and used for optically testing the light output by the laser assembly 8. Such as spectral parameter testing, NA proportion testing, etc.

By the rotation of the rotating device 2, the laser assembly 8 on the carrier 25 is moved to the temperature testing device and the recognition and cooling device 5, and the light receiving device 6 is used to test different items.

According to the laser assembly test automation equipment provided by the embodiment of the invention, the rotatable rotating device is arranged on the machine table, so that a plurality of laser assemblies in the carrier can be conveniently and easily controlled to rotate and move to the temperature testing device and the recognition and cooling device, tests of different projects are carried out through the light receiving device, and the testing efficiency is improved. The laser assembly test automation equipment integrates the temperature test, the light test, the identification and the cooling of the laser assembly on one equipment, reduces the number of the existing test equipment, and saves the occupied space of the equipment. The automatic laser assembly testing equipment can test simultaneously, and can better embody the characteristics of shortening the testing time, saving labor and improving the production efficiency.

In some embodiments, referring to fig. 3, the rotating device 2 comprises a motor 21 and a turntable 22. Wherein the motor 21, the housing of the motor 21 is mounted below the turntable 22. The turntable 22 is fixed with an output shaft of the motor 21, and the top end of the turntable 22 is detachably connected with the carrier 25.

In one example, the output shaft of the motor 21 is mounted with a flange, which is located above the machine table 1 and is fixedly connected with the turntable 22. In one example, the top surface of the turntable 22 is mounted with a number of guide blocks 23 and pins 24 that are compatible with the carriers 25. The guide blocks 23 can guide the mounting of the carrier 25 on the turntable 22 and the pins 24 can be used to position the carrier. In one example, the motor 21 is a stepper motor with an absolute encoder, and the guide block 23 is made of PTFE (polytetrafluoroethylene).

In some embodiments, in conjunction with fig. 1-2, the temperature testing device includes a first temperature testing device 3 and a second temperature testing device 4. Wherein: the first temperature testing device 3 is used for compressing the laser assembly 8, electrifying the laser assembly and heating the laser assembly within a first preset temperature range. And the second temperature testing device 4 is used for compressing and electrifying the laser assembly 8 and heating the laser assembly within a second preset temperature range.

The lower limit value of the second preset temperature range is larger than the upper limit value of the first preset temperature range. The first preset temperature range and the second preset temperature range may be determined according to actual requirements. For example: the first preset temperature range is 0-30 ℃; the second preset temperature range is 100-400 DEG C

In some embodiments, referring to fig. 1, 2 and 4, the first temperature testing device 3 includes a first frame 31, a heating block 32, a first pressing assembly 33, a first probe depressing electrical assembly 34, a first hydraulic buffer 35 and a first thermistor 38. Wherein:

the first frame 31 is installed on the machine platform 1 and mainly plays a supporting role.

And the heating block 32 is installed on the machine table 1 and used for heating the laser assembly 8. For example, the temperature of the heating block may be adjusted within a first preset temperature range.

And a first pressing assembly 33 mounted on the first frame 31 for pressing the laser assembly 8 against the heating block 32 in the first direction. Alternatively, the first pressing assembly 33 may be driven by an air cylinder. In the embodiment shown in fig. 4, the first direction is opposite to the z-axis, i.e. vertically downwards. The heating block 32 does not directly contact the laser assembly 8 for heating, but rather conducts heat to the laser assembly 8 via a thermal conductor.

A first probe downforce power assembly 34 is mounted on the first frame 31 for energizing the laser assembly 8. Optionally, the first probe hold-down power assembly 34 is driven by a pneumatic cylinder to move vertically downward. The laser assembly 8 has a positive electrode and a negative electrode, and in order to facilitate the energization, the positive electrode and the negative electrode of the laser assembly 8 are led out by a large-area conductive block, and when the first probe is pressed down to contact the electrical assembly 34 with the conductive block, the energization can be completed. The first probe depressing electric component 34 is provided with a spring, and the depressing force of the first probe depressing electric component 34 can be adjusted adaptively.

A first hydraulic buffer 35 is mounted on the first frame 31 below the first probe depressing electric assembly 34 for limiting the depressing distance of the first probe depressing electric assembly 34. The advantage of installing the first hydraulic buffer 35 is that the depression distance of the first probe depressing the electrical component 34 can be accurately defined, reducing contact noise.

And a first thermistor 38 mounted on the bottom surface of the first pressing member 33 for detecting the temperature of the laser assembly 8. Optionally, the first thermistor 38 is of the NTC (negative temperature coefficient) type. That is, when the laser assembly 8 is pressed against the heating block 32 in the first direction, the second thermistor 48 is in contact with the upper surface of the heat conductive block.

In some embodiments, with reference to fig. 1, 2, and 5, the second temperature testing device 4 includes a second frame 41, a heating furnace 42, a second pressing assembly 43, a second probe depressing and energizing assembly 44, a second hydraulic buffer 45, and a second thermistor 48.

The second frame 41 is mounted on the machine table 1 and mainly plays a supporting role.

And the heating furnace 42 is arranged on the machine table 1 and used for heating the laser assembly 8. For example, the temperature of the heating furnace may be adjusted within a second preset temperature range.

And a second pressing assembly 43 mounted on the second frame 41 for pressing the laser assembly 8 against the heating furnace 42 in the first direction. Alternatively, the second pressing assembly 43 may be driven by an air cylinder. In the embodiment shown in fig. 5, the first direction is opposite to the z-axis, i.e. vertically downwards. The heating furnace 42 does not directly contact-heat the laser module 8, but rather conducts heat into the laser module 8 via a heat conductor.

A second probe depression power-up assembly 44 is mounted on the second frame 41 for energizing the laser assembly 8. Optionally, the second probe hold-down power assembly 44 is driven by a pneumatic cylinder to move vertically downward. The laser assembly 8 has a positive electrode and a negative electrode, and for convenience of power-on, the positive electrode and the negative electrode of the laser assembly 8 are led out by large-area conductive blocks, and when the second probe is pressed down to enable the power-on assembly 44 to be in contact with the conductive blocks, the power-on can be completed. The second probe depressing electric component 44 is provided with a spring, and the depressing force of the second probe depressing electric component 44 can be adjusted adaptively.

And a second hydraulic buffer 45 mounted on the second frame 41 and located below the second probe pressing-down electric component 44 for limiting a pressing-down distance of the second probe pressing-down electric component 44. The advantage of installing the second hydraulic buffer 45 is that the depression distance of the second probe for depressing the electrical component 44 can be accurately defined, and the contact noise can be reduced.

And a second thermistor 48 mounted on the bottom surface of the second pressing member 43 for detecting the temperature of the laser assembly 8. That is, when the laser assembly 8 is pressed against the heating furnace 42 in the first direction, the second thermistor 48 is in contact with the upper surface of the heat conductive block. Optionally, the second thermistor 48 is of the NTC (negative temperature coefficient) type.

The embodiment of fig. 5 differs from the embodiment of fig. 4 in the temperature ranges for the heating block 32 and the heating furnace 42.

In some embodiments, in conjunction with fig. 1, 2 and 6, the identification and cooling device 5 includes a third housing 51, a bottom fan assembly 52, a side fan assembly 53 and a code scanner 54. Wherein:

the third frame 51 is mounted on the machine table 1 and mainly plays a supporting role.

And the bottom surface fan assembly 52 is installed on the machine table 1 and used for blowing air to the bottom of the laser assembly 8. The laser assembly 8 is located on a carrier 25. Optionally, the floor fan assembly 52 includes several fans.

And the side fan assembly 53 is installed on the third machine frame 51 and is used for blowing air to the side of the laser assembly 8. Optionally, the side fan assembly 53 comprises several fans.

And the code scanning device 54 is slidably arranged on the third frame 51 and used for identifying the mark of the laser assembly 8. Optionally, a code scanning driver 55 is mounted on the third housing 51. The code scanning driver 55 includes a linear rail and a slide table movably mounted on the linear rail. Specifically, the code scanning device 54 is fixed to the slide table and moves together with the slide table. The sliding table is driven by a stepping motor of the linear track.

In one example, the sweep device 54 is a sweep gun, which is a close-range, ultra-small auto sweep gun. Each laser assembly 8 has its own identification code on its surface and on each carrier 25. The identification code can be a bar code or a two-dimensional code. Sweep a yard rifle and be located laser instrument subassembly 8's top, the angle of sweeping a yard rifle is adjusted, makes to sweep the laser that a yard rifle jetted out and can shine on the identification code. The code scanning gun moves along the arrangement direction of the laser assembly 8 to sequentially acquire the identification codes.

In some embodiments, in conjunction with fig. 1, 2, and 7, light receiving device 6 includes a first integrating sphere assembly 62 and a second integrating sphere assembly 63. Wherein:

the first integrating sphere assembly 62 is slidably disposed on the machine platform 1 along the second direction, and is used for abutting against the carrier 25 at the temperature testing device to adjust the luminous flux output from the laser assembly 8 to the first integrating sphere assembly 62. Optionally, the second direction is the x-axis direction in fig. 1.

The second integrating sphere assembly 63 is slidably disposed on the machine platform 1 along the third direction, and is used for abutting against the carrier 25 located at the temperature testing device to adjust the luminous flux output from the laser assembly 8 to the second integrating sphere assembly 63. Optionally, the third direction is the y-axis direction in fig. 1.

The carrier 25 is provided with a shading sheet and a contact pin mounting seat which are oppositely arranged, the shading sheet is provided with a plurality of first light transmission holes, and the shading sheet is closer to the corresponding integrating sphere assembly than the contact pin mounting seat. The shading sheet is connected with the contact pin mounting seat through a tension spring and a linear bearing. Under the condition of not receiving external force, there is the distance between lens and the contact pin mount pad. When the light shield is pressed against the integrating ball assembly, the distance between the light shield and the pin mounting seat is reduced.

In some embodiments, in conjunction with fig. 1, 2, and 8, first integrating sphere assembly 62 comprises:

and a first integrating sphere 621 for obtaining the light flux output from the laser assembly 8. The first integrating sphere 621 is provided with a plurality of second light-transmitting holes coaxial with the first light-transmitting holes.

And a first spectrum receiving device 622 fixed on the first integrating sphere 621 for obtaining the spectrum parameters of the laser assembly 8.

And a first photocurrent receiving device 623 fixed to the first integrating sphere 621 and configured to obtain a current and a power of the laser assembly 8.

The first integrating sphere support 624 is fixedly connected with the machine 1.

First driver 625, including a first base and a first slider, is slidably fixed on the first base, the first base is fixed with first integrating sphere support 624, and the first slider is fixed with first integrating sphere 621.

In some embodiments, in conjunction with fig. 1, 2, and 9, second integrating sphere assembly 63 comprises:

and a second integrating sphere 631 for obtaining the luminous flux output from the laser assembly 8. The second integrating sphere 631 is provided with a plurality of third light holes coaxial with the first light holes.

And a second spectrum receiving device 632 fixed on the second integrating sphere 631 for obtaining the spectral parameters of the laser assembly 8.

And a second photocurrent receiving device 633 fixed to the second integrating sphere 631 and used for acquiring the current and power of the laser assembly 8.

The second integrating sphere support 634, the second integrating sphere support 634 is fixedly connected with the machine 1.

And a second driver 635 including a second base and a second slider, the second slider being slidably fixed to the second base, the second base being fixed to the second integrating sphere holder 634, and the second slider being fixed to the second integrating sphere 631.

And a two-dimensional slide 637 installed on the second integrating sphere holder 634 and used for adjusting the position of the second integrating sphere 631. Since second integrating sphere 631 is movable along the y-axis, it is necessary to adjust the position of second integrating sphere 631 along the x-axis and z-axis when the third aperture is aligned with the first aperture. Two-dimensional slide 637 may use a manual fine-tuning stage. The design of two-dimensional slipway 637 facilitates centering adjustment of the carrier and the second integrating sphere.

The embodiment shown in fig. 9 is different from the embodiment shown in fig. 8 in that a two-dimensional slide table 637 is added to the embodiment shown in fig. 9.

In some embodiments, in conjunction with fig. 1-9, the laser assembly testing automation device further comprises:

the frame 61, the frame 61 is fixed on the machine 1, and the light receiving device 6 is mounted on the frame 61. Optionally, the frame 61 is an aluminum profile frame. The first integrating sphere assembly 62 and the second integrating sphere assembly 63 are fixed to the top surface of the frame 61.

And a carrier pressing assembly mounted on the frame 61 for pressing the carrier 25 during the test.

The correlation sensor comprises a transmitting end and a receiving end, wherein the transmitting end is arranged on the machine table 1; the receiving end is disposed opposite to the transmitting end, and the receiving end is mounted on the frame 61 and used for detecting whether the carrier 25 is located at the testing position.

In one example, the carrier pressing assembly includes a first carrier pressing assembly 66 and a second carrier pressing assembly 67, the first carrier pressing assembly 66 is located in front of the second light-transmitting hole of the first integrating sphere assembly 62 for pressing the carrier 25 at the first temperature testing device 3. The second carrier pressing assembly 67 is located in front of the third light-transmitting hole of the second integrating sphere assembly 63, and is used for pressing the carrier 25 at the second temperature testing device 4.

In one example, there are 4 sets of correlation sensors, and the 4 sets are the first transmitting end 36 and the first receiving end 37, the second transmitting end 46 and the second receiving end 47, the third transmitting end 56 and the third receiving end 57, and the fourth transmitting end 64 and the fourth receiving end 65, respectively.

In some embodiments, the laser assembly testing automation device further includes an illumination lamp and a clean air blower. The cleaning fan is installed above the frame 61. The frame 61 is provided with a panel 7, and the panel 7 is provided with a confirmation button 71, an illumination button 72, and a blower button 73. The confirmation button 71 is used for confirming the rotary turntable and starting the test; the illumination button 72 is used to turn on illumination; the blower button 73 is used to turn on the cleaning blower.

The contents of the above embodiments will be described with reference to a preferred embodiment.

Referring to fig. 1 to 11, 4 carriers 25 are mounted on the turntable 22 along the circumferential direction of the turntable, and a first temperature testing device 3, a second temperature testing device 4 and a recognition and cooling device 5 are mounted on the machine base 1. The first integrating sphere assembly 62 and the second integrating sphere assembly 63 are suspended and fixed to the frame 61. The 4 carriers 25 are uniformly arranged along the turntable 22, the distance from each carrier 25 to the center of the turntable 22 is equal, and the included angle between every two adjacent carriers 25 is 90 degrees. The first temperature testing device 3, the second temperature testing device 4 and the identification and cooling device 5 are arranged at three edges of the machine table 1, and only the carrier is arranged at the rest edge. The first temperature testing device 3, the second temperature testing device 4 and the identification and cooling device 5 can be brought into opposition to the respective carrier 25 by rotating the turntable 22. Referring to fig. 11, according to the installation areas of the first temperature testing device 3, the second temperature testing device 4 and the identification and cooling device 5, the surface of the machine platform is divided into 4 stations, a feeding and discharging stations; b. testing the station at normal temperature; c. a high temperature test station; d. and a code scanning cooling station. A set of correlation sensors is installed at each station to detect whether the carrier 25 is at the testing position. The panel 7 is opposite to the feeding and discharging station, so that the operation of an operator is facilitated.

The following describes the workflow of the laser assembly test automation device:

step S102, feeding, discharging and confirming: and taking the tested carrier 25 off the turntable 22, mounting 8 laser assemblies 8 on the carrier 25, placing the carrier 25 filled with the laser assemblies 8 in an upper blanking station, pressing a confirmation button 71, rotating the turntable 22 by 90 degrees, and inputting the carrier 25 into a normal-temperature testing station for normal-temperature testing.

Step S104, normal temperature testing: after the turntable rotates to the position, the first carrier pressing assembly 66, the first pressing assembly 33 and the first probe pressing electric assembly 34 are pressed down in sequence; after the first thermistor 38 reaches a specified temperature, the first driver 625 drives the first integrating sphere 621 to move to a specified position, then sequentially energizes 8 laser assemblies to perform PIV test, and performs NA test after moving to the specified position; the first spectrum reception device 622 and the first photocurrent reception device 623 output the collected light parameters. Then, the first probe pressing electric component 34, the first pressing component 33, and the first carrier pressing component 66 are sequentially lifted.

Step S106, high-temperature testing: after the turntable rotates to the position, the second carrier pressing component 67, the second pressing component 43 and the second probe pressing and powering component 44 are pressed down in sequence; after the second thermistor 48 reaches a specified temperature, the second driver 635 drives the high-temperature integrating sphere 621 to move to a specified position, then sequentially energizes 8 laser assemblies to perform PIV test, and performs NA test after moving to the specified position; the second spectrum-receiving device 632 and the second photocurrent-receiving device 633 output the collected light parameters. Then the second probe pressing electric component 44, the second pressing component 43 and the second carrier pressing component 67 are sequentially lifted.

Step S108, code scanning and cooling: after rotating to the position, the code scanning gun is driven by the code scanning driver 55 to perform code scanning recognition on the carrier 25 and the laser assembly 8 on the carrier 25, and simultaneously, the bottom fan assembly 52 and the side fan assembly 53 rotate to cool the laser assembly 8.

And step S110, repeating the steps S102 to S108 until the laser assembly test is completed.

The advantages and positive effects of the embodiment of the invention are as follows: the device can test 8 groups of laser assemblies at one beat, thereby greatly improving the test efficiency; the equipment does not need manual high-temperature environment operation, so that the scalding risk is avoided; the equipment only needs one person to charge and discharge the product, so that the labor cost is saved; the device integrates PIV, NA and spectrum test, and saves space; two or many equipment simultaneous test, more can embody this equipment and shorten test time, use manpower sparingly, improve production efficiency's characteristics.

It should be noted that the terms "first," "second," and the like in the description of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims

1. A laser assembly testing automation device, comprising:

a machine table (1);

the rotating device (2) is rotatably arranged on the machine table (1), the rotating device (2) comprises a motor (21) and a rotating disc (22), the rotating disc (22) is fixed with an output shaft of the motor (21), a plurality of carriers (25) are installed on the edge side of the rotating disc (22), a plurality of laser assemblies (8) are installed on the carriers (25), and the top end of the rotating disc (22) is detachably connected with the carriers (25);

the temperature testing device comprises a first temperature testing device (3) and a second temperature testing device (4), is arranged on the machine table (1), and is used for compressing and electrifying the laser assembly (8) and heating the laser assembly within a preset temperature range;

the identification and cooling device (5) is arranged on the machine table (1) and used for identifying the identifier of the laser assembly (8) and cooling the laser assembly (8) in a heat dissipation manner;

the light receiving device (6) is arranged above the machine table (1) and used for carrying out optical test on light output by the laser assembly (8);

according to the installation areas of the first temperature testing device (3), the second temperature testing device (4) and the identification and cooling device (5), dividing the surface of the machine table (1) into 4 stations: the device comprises a loading and unloading station, a normal temperature testing station, a high temperature testing station and a code scanning cooling station;

-moving the laser assembly (8) on the carrier (25) to the temperature testing device and to the identification and cooling device (5) by rotation of the rotating device (2), testing being performed by the light receiving device (6); the loading and unloading station is used for installing the carrier (25) to be tested on the rotary table (22) and taking down the carrier (25) from the rotary table (22) after testing.

2. The laser assembly testing automation device of claim 1,

the first temperature testing device (3) is heated within a first preset temperature range;

the second temperature testing device (4) is heated within a second preset temperature range;

3. The laser assembly test automation device according to claim 2, characterized in that the first temperature test means (3) comprises:

a first chassis (31);

the heating block (32) is arranged on the machine table (1) and used for heating the laser assembly (8);

a first pressing assembly (33) mounted on the first frame (31) for pressing the laser assembly (8) against the heating block (32) in a first direction;

a first probe-pin-down energizing assembly (34) mounted on said first frame (31) for energizing said laser assembly (8);

a first hydraulic buffer (35) mounted on the first frame (31) below the first probe hold-down power-on assembly (34) for limiting a hold-down distance of the first probe hold-down power-on assembly (34);

and the first thermistor (38) is arranged on the bottom surface of the first pressing component (33) and is used for detecting the temperature of the laser component (8).

4. The laser assembly test automation device according to claim 2, characterized in that the second temperature test means (4) comprises:

a second frame (41),

the heating furnace (42) is arranged on the machine table (1) and used for heating the laser assembly (8);

a second pressing assembly (43) mounted on the second frame (41) for pressing the laser assembly (8) against the heating furnace (42) in a first direction;

a second probe-pin-down energizing assembly (44) mounted on the second frame (41) for energizing the laser assembly (8);

a second hydraulic buffer (45) mounted on the second frame (41) below the second probe depressing and energizing assembly (44) for limiting a depressing distance of the second probe depressing and energizing assembly (44);

and the second thermistor (48) is arranged on the bottom surface of the second pressing component (43) and is used for detecting the temperature of the laser component (8).

5. The laser assembly test automation device according to claim 1, characterised in that the identification and cooling means (5) comprise:

a third frame (51);

the bottom surface fan assembly (52) is arranged on the machine table (1) and used for blowing air to the bottom of the laser assembly (8);

a side fan assembly (53) mounted on the third frame (51) for blowing air to the side of the laser assembly (8);

a code scanning device (54) slidably mounted on the third frame (51) for identifying the identity of the laser assembly (8).

6. The laser assembly test automation device according to claim 1, characterized in that the light receiving means (6) comprises:

the first integrating sphere component (62) is slidably arranged on the machine table (1) along a second direction and is used for abutting against the carrier (25) at the temperature testing device and adjusting the luminous flux output to the first integrating sphere component (62) by the laser component (8);

the second integrating sphere component (63) is arranged on the machine table (1) in a sliding manner along a third direction and used for abutting against the carrier (25) at the temperature testing device and adjusting the luminous flux output to the second integrating sphere component (63) by the laser component (8).

7. The laser assembly testing automation device of claim 6, wherein the first integrating sphere assembly (62) comprises:

a first integrating sphere (621) for obtaining a luminous flux output by the laser assembly (8);

a first spectrum receiving device (622) fixed on the first integrating sphere (621) and used for acquiring the spectrum parameters of the laser assembly (8);

the first photocurrent receiving device (623) is fixed on the first integrating sphere (621) and used for acquiring the current and the power of the laser assembly (8);

the first integrating sphere support (624), the first integrating sphere support (624) is fixedly connected with the machine table (1);

and the first driver (625) comprises a first base and a first sliding block, the first sliding block is slidably fixed on the first base, the first base is fixed with the first integrating sphere support (624), and the first sliding block is fixed with the first integrating sphere (621).

8. The laser assembly testing automation device of claim 6, wherein the second integrating sphere assembly (63) comprises:

a second integrating sphere (631) for acquiring a luminous flux output from the laser assembly (8);

a second spectrum receiving device (632) fixed on the second integrating sphere (631) for obtaining the spectrum parameter of the laser component (8);

the second photocurrent receiving device (633) is fixed on the second integrating sphere (631) and is used for acquiring the current and the power of the laser component (8);

the second integrating sphere support (634), the second integrating sphere support (634) is fixedly connected with the machine table (1);

a second driver (635) comprising a second base and a second slider, the second slider slidably secured to the second base, the second base secured to the second integrating sphere support (634), the second slider secured to the second integrating sphere (631);

and the two-dimensional sliding table (637) is arranged on the second integrating sphere support (634) and is used for adjusting the position of the second integrating sphere (631).

9. The laser assembly test automation device according to any one of claims 1 to 8, further comprising:

a frame (61), wherein the frame (61) is fixed on the machine table (1), and the light receiving device (6) is installed on the frame (61);

a carrier pressing assembly mounted on the frame (61) for pressing the carrier (25);

the correlation sensor comprises a transmitting end and a receiving end, and the transmitting end is arranged on the machine table (1); the receiving end and the transmitting end are arranged oppositely, and the receiving end is installed on the frame (61) and used for detecting whether the carrier (25) is located at a testing position.