CN114958302A - Efficient grinding fluid and preparation method and application thereof - Google Patents
Efficient grinding fluid and preparation method and application thereof Download PDFInfo
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- CN114958302A CN114958302A CN202210580883.2A CN202210580883A CN114958302A CN 114958302 A CN114958302 A CN 114958302A CN 202210580883 A CN202210580883 A CN 202210580883A CN 114958302 A CN114958302 A CN 114958302A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1472—Non-aqueous liquid suspensions
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Abstract
The invention belongs to the technical field of grinding fluid, and provides high-efficiency grinding fluid, a preparation method and application thereof, wherein a main solvent containing polyalcohol and a cationic compound are used as main liquid components of the grinding fluid, the effect of repulsion between grinding materials is improved by virtue of repulsion between charges with the same polarity, the dispersion effect of the grinding materials is improved, and during working, the grinding efficiency of the grinding fluid is high, the material removal amount of the grinding fluid is increased by at least 18.78 percent compared with the conventional grinding fluid system, and can ensure that the surface roughness is in the nano-scale range of 15-25nm, firstly the pH value of the main solvent is adjusted to 4-8, then, the cation compound and the grinding material are sequentially added to prepare the grinding fluid.
Description
Technical Field
The invention relates to the technical field of grinding fluid, in particular to efficient grinding fluid and a preparation method and application thereof.
Background
The sapphire material has hardness second to that of diamond, has good strength, excellent scratch resistance and good optical performance, and has wide application prospect in the electronic consumer market and the wearable equipment market. However, in the processing process of sapphire material, generally, a rough grinding and finish grinding process and a CMP (chemical mechanical polishing) process are performed, and the rough grinding or finish grinding process is used as a previous process of the CMP process, and it is required to control the surface roughness (currently, the basic requirement is that the surface roughness value Ra is greater than 10nm) and simultaneously increase the material removal amount as much as possible to increase the work efficiency, increase the productivity and reduce the cost.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art described above. The grinding fluid provided by the invention can improve the material removal amount, can be applied to the rough grinding and fine grinding procedures, can control the surface roughness and simultaneously improve the grinding efficiency of the material, improves the material removal amount by at least 18.78 percent compared with the conventional grinding fluid system, and can ensure that the surface roughness is in a nano-scale range of 15-25 nm.
The first aspect of the present invention provides a highly effective polishing slurry.
Specifically, the efficient grinding fluid comprises a liquid component and an abrasive;
the liquid component includes a main solvent and a cationic compound;
the primary solvent comprises a polyol;
the mass of the polyhydric alcohol in the main solvent is more than 70% of the total mass of the grinding fluid;
the mass of the cationic compound is 0.15-15 wt% of the total mass of the grinding fluid;
the average grain diameter of the abrasive is more than 1Mic and less than or equal to 100 Mic.
The main solvent and the cationic compound are used as liquid components of the grinding fluid, the main solvent contains polyalcohol, the grinding fluid is an alkaline system and is prepared together with the grinding material, the grain diameter of the grinding material adopted by the grinding fluid reaches micron level and is difficult to disperse in the system, so the grinding fluid is added with the cationic compound, the grinding material and the cationic compound have the same positive charge, the grinding material and the cationic compound cannot generate charge neutralization, the cationic compound can be used as a synergist to improve the density of charges, the cationic compound provides strong static charge, the repulsive force between the grinding materials is improved, the dispersion effect of the grinding material is improved, the repulsive force between the grinding materials can be improved by virtue of the repulsive force between charges of the same polarity, and the action time of the grinding particles in the system is prolonged during work, so that the grinding efficiency is improved.
Preferably, the cationic compound is one or more of quaternary ammonium salt, tertiary amine salt, ammonium salt, alkali metal salt and alkaline earth metal salt.
More preferably, the cationic compound is a quaternary ammonium salt and/or a tertiary amine salt. The quaternary ammonium salt and tertiary amine salt are used as strong cation compound and can be used as ideal synergist.
Preferably, the quaternary ammonium salt is polyquaternium-10.
Preferably, the mass of the cationic compound is 0.15 to 10 wt% of the total mass of the polishing slurry.
Preferably, the mass of the main solvent is 70-99 wt% of the total mass of the grinding fluid;
preferably, the abrasive has an average particle size of 1 to 80 Mic.
Preferably, the mass of the polyhydric alcohol in the main solvent is 80% or more of the total mass of the polishing liquid.
Preferably, the main solvent further contains water.
Preferably, the mass of water in the main solvent is 3-30% of the total mass of the grinding fluid.
Preferably, the polyalcohol is one or more of ethylene glycol, glycerol and triethylene glycol.
Preferably, the pH of the polishing liquid is 7 to 10.
Preferably, the liquid component further comprises one or more of an acid solution, a defoaming agent, a thickening agent, a dispersing agent and a metal corrosion inhibitor.
Preferably, the polishing solution comprises the following components in percentage by mass based on the total mass of the polishing solution: 0.1-10 wt% of defoaming agent, 0.1-10 wt% of thickening agent, 0.1-10 wt% of dispersing agent and 0.1-10 wt% of metal corrosion inhibitor.
Preferably, the acid solution is one or more of boric acid, dilute hydrochloric acid and acetic acid. The acid solution functions to adjust the pH.
Preferably, the defoaming agent is a Si-containing, F-containing defoaming agent.
More preferably, the defoamer is dimethicone.
Preferably, the thickener is one or more of white carbon black, cellulose, polyacrylic acid, polyacrylate, organic bentonite and decadiene cross-linked copolymer.
More preferably, the thickener is hydroxyethyl cellulose.
Preferably, the dispersant is a hyperdispersant.
Preferably, the metal corrosion inhibitor is one or more of monoethanolamine, triethanolamine, borate, polyphosphate, betaine and benzotriazole derivatives.
Preferably, the mass of the abrasive is 0.2-20 wt% of the total mass of the grinding fluid.
Preferably, the abrasive is one or more of diamond agglomerated abrasive, polycrystalline diamond-like abrasive, single crystal diamond abrasive, modified diamond abrasive, alumina abrasive, silicon carbide abrasive, silicon dioxide abrasive, boron carbide abrasive, cerium oxide abrasive and calcium carbonate abrasive.
The second aspect of the invention provides a method for preparing the efficient grinding fluid.
The invention protects the preparation method of the grinding fluid, which comprises the following steps:
firstly, adjusting the pH value of the main solvent to 4-8 to obtain a first solution, then adding a cationic compound to obtain a second solution, adding an abrasive, and mixing to obtain the grinding fluid.
Preferably, the pH value of the main solvent is adjusted by using an acid solution.
Preferably, the cationic compound is pre-dissolved with water or an organic solvent to prepare a solution, and then the solution is added into the first solution.
Preferably, the method further comprises adding a dispersant at the same time as the cationic compound to obtain a second solution.
Preferably, the method further comprises the steps of adding a defoaming agent into the second solution, standing to obtain a third solution, adding a thickening agent and a metal corrosion inhibitor to obtain a fourth solution, adding an abrasive, and mixing to obtain the grinding fluid.
Preferably, before the adding of the abrasive, the method further comprises the steps of adding the abrasive into an acetic acid solution, uniformly stirring, and performing pretreatment.
Preferably, the mass fraction of the acetic acid solution is 5-8%.
The third aspect of the invention provides the application of a high-efficiency grinding fluid.
The invention protects the application of the grinding fluid in material processing.
Preferably, the material is a brittle and hard material.
More preferably, the material is silicon carbide, sapphire, ceramic material.
Preferably, the material is processed to produce a semiconductor component.
Preferably, the abrasive liquid is used in a rough grinding or finish grinding process in the preparation of semiconductor elements.
Preferably, the grinding fluid is a grinding fluid for a double-sided non-copper disc grinder or a single-sided grinder.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, the main solvent containing polyalcohol and the cationic compound are used as main liquid components of the grinding fluid, the cationic compound provides strong positive static force and has repulsive force with the grinding materials with positive charges, the cationic compound can be used as a synergist to improve the density of charges, the repulsive force between the grinding materials is improved, the dispersion effect of the grinding materials is improved, the effect of improving the repulsive force between the grinding materials can be achieved by virtue of the repulsive force between charges with the same polarity, during work, the grinding particles are ensured not to be settled as much as possible, the action time of the grinding particles in a system is prolonged, and the grinding efficiency is improved, the material removal amount of the grinding fluid is improved by at least 18.78% compared with that of a conventional grinding fluid system, and the surface roughness can be ensured to be within the nano-scale range of 15-25 nm;
(2) the pH value of the main solvent is adjusted to 4-8, then the cationic compound and the abrasive are sequentially added, and the main solvent contains the polyol, so that the pH value of the main solvent is adjusted, then the cationic compound is added, the stability of the whole system is ensured, the system failure caused by hydrogen generation is avoided, meanwhile, the cationic compound is conveniently further introduced, and the abrasive is added after the cationic compound is added, so that the uniform and stable grinding fluid can be prepared.
Detailed Description
In order to make the technical solutions of the present invention more apparent to those skilled in the art, the following examples are given for illustration. It should be noted that the following examples are not intended to limit the scope of the claimed invention.
The starting materials, reagents or apparatuses used in the following examples are conventionally commercially available or can be obtained by conventionally known methods, unless otherwise specified.
The examples of the invention and the comparative examples used the following starting materials:
grinding materials:
diamond micropowder A (standard type), average particle size 2 Mic;
diamond micropowder B (porous type), average particle size 2 Mic;
diamond micropowder C (super hard type), average particle size 2 Mic;
diamond micropowder D (standard type), average particle size 0.75 Mic;
the diamond micro powder A-D is diamond agglomerated micro powder produced by the Zhuhai Dymontes science and technology Limited company:
the boron carbide micro powder is purchased externally and has an average grain diameter of 10 Mic.
Polyol: triethylene glycol, mitsui.
Cationic compound: polyquaternium-10, dow.
Defoaming agent: dimethicone, dow corning.
Thickening agent: hydroxyethyl cellulose (HEC), dow.
Dispersing agent: a super dispersant, basf XL 40.
Metal corrosion inhibitors: triethanolamine, basf.
Acid solution: acetic acid with the mass fraction of 5 percent.
Example 1
A high-efficiency grinding liquid comprises a liquid component and an abrasive, wherein the liquid component comprises a main solvent and a cationic compound, the main solvent comprises polyhydric alcohol, and the pH value of the grinding liquid is 8-9.
The mass percentages of the components based on the total mass of the polishing slurry are shown in table 1.
Examples 2 to 12 and comparative examples 1 to 10
The components and amounts thereof of examples 2 to 12 and comparative examples 1 to 10 are shown in Table 1.
TABLE 1 Components and amounts thereof (based on the total mass of the polishing slurry, unit: wt%) of examples and comparative examples
The preparation method of the polishing solution of each embodiment includes the following steps:
(1) adding an acid solution into the main solvent, and adjusting the pH value to 7-8 to obtain a first solution;
(2) pre-dissolving quaternary ammonium salt with water to prepare a solution, adding the pre-dissolved quaternary ammonium salt and a dispersing agent into the first solution, and uniformly stirring to obtain a second solution;
(3) adding a defoaming agent into the second solution, uniformly stirring, and standing for 24 hours to obtain a third solution;
(4) adding a thickening agent and a metal corrosion inhibitor into the third solution, and uniformly stirring to obtain a fourth solution;
(5) uniformly stirring the abrasive with an acetic acid solution with the mass fraction of 5%, pretreating, adding the pretreated abrasive into the fourth solution, and uniformly stirring to obtain the grinding fluid.
Application example 1
The grinding fluid prepared in each of the above examples and comparative examples is applied to the rough grinding process of the sapphire material processing process. The equipment used in the relevant experiments is a ZYP230 type rotary swing single-side grinding machine, a lower disc is pasted with a grinding leather, a test workpiece is pasted on an upper disc, grinding liquid is pumped to the surface of the working disc by a peristaltic pump, and the grinding liquid is ensured to be continuously stirred during the test.
1. Test method
Testing equipment: model ZYP230 rotary oscillating single face grinder.
The rest used equipment: 2.2KW high speed disperser; a BWS-6-SN balance with an accuracy of 0.1 g; an HY-602 scale with 10g accuracy; PC-905A pH meter with accuracy of 0.01, weighing apparatus METTLER TOLEDO AB204S analytical balance; a MITUTOYO SJ210 roughness tester with the precision of 0.001 um; the polishing skin is a resin material of three-dimensional structure of SPHU manufactured by Suzuki Temminck.
Pressure in the heavy load test: 6 KG; the revolution of the grinding disc: 75RPM (briquetting revolution: 60RPM, swing 10 mm); flow rate of the polishing slurry: 4 mL/min; grinding time: 30 mins; materials: c to sapphire, diameter 25mm, 3 pieces/mill.
Pressure in light pressure test: 2.4 KG; the revolution of the grinding disc: 50RPM (briquetting revolution: 50RPM, swing 10 mm); flow rate of the polishing slurry: 3 mL/min; grinding time: 40 mins; materials: c to sapphire, diameter 25mm, 3 pieces/mill.
The test method comprises the following steps: before the experiment is carried out, the sample is roughly ground by adopting an SRD-20 diamond grinding pad produced by the Zhuhai Dymontes science and technology Limited company, the single-side removal amount is 80-100Mic, the surface condition of the processed workpiece before each experiment is basically consistent, and Ra is obtained after rough grinding (before accurate grinding): 0.35-0.40 Mic.
The removal amount of the experiment is calculated by adopting a weight reduction method, namely: before each experiment, cleaning and drying a processed workpiece, and weighing the processed workpiece by an analytical balance to obtain the weight before grinding; after the experiment, the machined workpiece was cleaned again, dried, and weighed with an analytical balance to obtain the ground weight.
Because the sapphire sample to be tested is replaced in the test process, the sizes of the sapphire sample to be tested are not completely consistent, and therefore in order to reduce errors, a benchmark is set when the sapphire sample to be tested is replaced every time. The polishing efficiency of the polishing liquid in the present invention is expressed by the material removal amount and the percentage increase from the reference, and the higher the material removal amount and the percentage increase from the reference, the higher the polishing efficiency of the polishing liquid.
The material removal (weight loss) is the pre-mill weight-post-mill weight, in g.
Percent increase is the weight loss of the test specimen/weight loss of the baseline x 100%.
2. Test results
Ra of all samples after finish grinding was in the region of 15-25nm, with surface roughness in the nanometer range, as measured by a MITUTOYO SJ210 roughness tester.
TABLE 2 Effect of different ratios of quats on grinding efficiency in the heavy pressure test
As is clear from the results in table 2, the polishing liquids of examples 1 to 3 according to the present invention, to which quaternary ammonium salt was added, had higher polishing efficiency than the polishing liquid of comparative example 1, which did not contain quaternary ammonium salt, in the heavy load test.
TABLE 3 Effect of different proportions of Quaternary ammonium salts on grinding efficiency in light pressure test
As is clear from the results in table 3, the polishing liquids of examples 1 to 3 according to the present invention, to which quaternary ammonium salt was added, had higher polishing efficiency than the polishing liquid of comparative example 1, which did not contain quaternary ammonium salt, in the light pressure test.
TABLE 4 Effect of different proportions of thickener on grinding efficiency in the heavy load test
As is clear from the results in Table 4, the polishing efficiency of the polishing slurries of examples 3 to 6 of the present invention was gradually improved as the amount of the thickener used was increased in the heavy load test.
TABLE 5 Effect of different proportions of thickener on grinding efficiency in light pressure test
As is clear from the results in Table 5, the polishing efficiency of the polishing slurries of examples 3 to 5 of the present invention was gradually improved as the amount of the thickener used was increased in the light pressure test. When 0.2% of the thickener is added in example 6, the improvement percentage is slightly reduced, because the viscosity is too high under the light pressure working condition, the fluidity of the grinding fluid is reduced, the grinding material is difficult to well enter the disk surface, the actual grinding amount of the disk surface is small, and the cutting force is reduced, so that the grinding effect of the grinding fluid added with 1% of the quaternary ammonium salt is the best in the light pressure test.
TABLE 6 Effect of different types of abrasives on grinding efficiency in the heavy load test
As can be seen from the results of table 6, in the heavy load test, the grinding efficiency of example 7 of the present invention is higher than that of comparative example 2 without adding the quaternary ammonium salt and the thickener, and example 7 is different from example 6 in that different kinds of abrasives are used, and the grinding efficiency is better, indicating that the grinding fluid system of the present invention is suitable for different kinds of abrasives.
TABLE 7 Effect of different types of abrasives on grinding efficiency in light pressure test
As can be seen from the results in table 7, the grinding efficiency of example 8 according to the present invention was higher than that of comparative example 3 in which the quaternary ammonium salt and the thickener were not added in the light pressure test, and example 8 was different from example 5 in that different kinds of abrasives were used, and the grinding efficiency was better, indicating that the grinding fluid system according to the present invention is suitable for different types of abrasive grains.
TABLE 8 Effect of different types of abrasives on grinding efficiency in heavy load testing
As can be seen from the results in table 8, in the heavy load test, the grinding efficiency of example 9 of the present invention is higher than that of comparative example 3 without adding the quaternary ammonium salt and the thickening agent, and example 9 is different from example 6 in that different kinds of abrasives are used, and the grinding efficiency is better, indicating that the grinding fluid system of the present invention is suitable for different kinds of abrasive grains.
TABLE 9 Effect of different types of abrasives on grinding efficiency in light pressure test
As can be seen from the results in table 9, the polishing efficiency of example 10 according to the present invention was higher than that of comparative example 4 in which the quaternary ammonium salt and the thickener were not added in the light pressure test, and example 10 was different from example 5 in that different kinds of abrasives were used, and the polishing efficiency was better, indicating that the polishing liquid system according to the present invention is suitable for different types of abrasive grains.
Application example 2
The grinding fluid prepared in each of the above examples and comparative examples is applied to the rough grinding process of the sapphire material processing process. The following tests of tables 10-12 used an SHJ6S-5L double side grinder, with the upper and lower plates being coated, the test pieces being held on the work surface by a spider, the slurry being pumped by a peristaltic pump onto the work surface, the slurry being kept under constant agitation during the test.
The rest used equipment: 2.2KW high speed disperser; a BWS-6-SN balance with an accuracy of 0.1 g; an HY-602 scale with 10g accuracy; PC-905A pH meter with accuracy of 0.01, METTLER TOLEDO AB204S analytical balance, and MITUTOYO SJ210 roughness tester with accuracy of 0.001 um.
And (3) testing conditions are as follows: 16KG pressure, upper/lower disk rotation number: 9/30RPM, flow: 3ml/min, grinding time: 50 min; sapphire workpiece: c to 25mm 15 PCS/disc.
The test method comprises the following steps: before the experiment, the samples are roughly ground by using SRD-20 diamond grinding pads produced by the Zhuhai Dymonte science and technology Limited company, the removal amount of the two sides is 100-150Mic, the surface conditions of the machined workpieces before each experiment are basically consistent, and Ra is obtained after rough grinding (before accurate grinding): 0.35-0.40 Mic;
the removal amount of the experiment is calculated by adopting a weight reduction method, namely: before each experiment, cleaning and drying a processed workpiece, and weighing the processed workpiece by an analytical balance to obtain the weight before grinding; after the experiment, the processed workpiece was cleaned again, dried, and weighed by an analytical balance to obtain the ground weight.
Material removal (weight loss) is the weight before grinding-the weight after grinding, in g.
Percent increase is the weight loss of the test specimen/weight loss of the baseline x 100%.
The polishing skin is a resin material of three-dimensional structure of SPHU manufactured by Suzuki Temminck.
TABLE 10 influence of different amounts of Quaternary ammonium salt on grinding efficiency
As can be seen from the results in table 10, the difference between the polishing slurry of comparative example 7 and example 11 is that the mass percentage of the quaternary ammonium salt of comparative example 7 is reduced to 0.1%, and the weight reduction of example 11 of the present invention is improved by about 50% compared to example 7, because the particle size of the abrasive used in the present invention reaches micron level, the dispersion effect is not good, and if the concentration of the quaternary ammonium salt is too low, the electrostatic acting force on the abrasive is too small, the effect is not obvious, and the polishing efficiency of the polishing slurry is reduced.
TABLE 11 Effect of different amounts of Water on grinding efficiency
From the results of Table 11, it is understood that the polishing slurry of comparative example 9 is different from that of example 12 in that the amount of triethylene glycol used in the polishing slurry is reduced and the water content is increased to 40%, resulting in a decrease in the polishing efficiency of comparative example 9, because the polyquaternium-10 is insoluble in water, the addition of water results in a decrease in the actual cationic charge density, a decrease in the repulsive force between the diamond fine powders and an easier settling, and a decrease in the effective time of the diamond fine powders during operation, resulting in a decrease in the polishing efficiency.
TABLE 12 Effect of different particle size abrasives on grinding efficiency
As can be seen from the results in table 12, the polishing liquid of example 11 is different from comparative example 10 in that the difference in the particle size of the diamond fine powder in the polishing liquid, and the particle size of the diamond fine powder of comparative example 10 is reduced to 0.75Mic, which results in a great reduction in the polishing efficiency of comparative example 10, and although the surface roughness of comparative example 10 is still at the nano level, the particle size of diamond itself is too small to improve the polishing efficiency, which indicates that in the fine grinding process, a balance between the polishing efficiency and the surface quality of the processed workpiece needs to be found, and the polishing efficiency can be improved while the control of the surface roughness to the nano level is ensured.
Claims (10)
1. An abrasive liquid, characterized by comprising a liquid component and an abrasive;
the liquid component includes a main solvent and a cationic compound;
the primary solvent comprises a polyol;
the mass of the polyhydric alcohol in the main solvent is more than 70% of the total mass of the grinding fluid;
the mass of the cationic compound is 0.15-15 wt% of the total mass of the grinding fluid;
the average grain diameter of the abrasive is more than 1Mic and less than or equal to 100 Mic.
2. The polishing solution according to claim 1, wherein the cationic compound is one or more of a quaternary ammonium salt, a tertiary amine salt, an ammonium salt, an alkali metal salt, and an alkaline earth metal salt.
3. The grinding fluid of claim 1, wherein the liquid component further comprises one or more of an acid solution, a defoaming agent, a thickening agent, a dispersing agent, and a metal corrosion inhibitor.
4. The grinding fluid according to claim 1, wherein the mass of the abrasive is 0.2 to 20 wt% of the total mass of the grinding fluid.
5. The grinding fluid according to claim 1, wherein the abrasive is one or more of diamond agglomerate abrasive, polycrystalline diamond-like abrasive, single crystal diamond abrasive, modified diamond abrasive, alumina abrasive, silicon carbide abrasive, silica abrasive, boron carbide abrasive, cerium oxide abrasive, and calcium carbonate abrasive.
6. The polishing slurry according to claim 1, wherein the pH of the polishing slurry is 7 to 10.
7. The method for preparing the polishing slurry according to any one of claims 1 to 6, comprising the steps of:
firstly, adjusting the pH value of the main solvent to 4-8 to obtain a first solution, then adding a cationic compound to obtain a second solution, adding an abrasive, and mixing to obtain the grinding fluid.
8. The method of claim 7, further comprising adding a dispersant simultaneously with the cationic compound to obtain a second solution.
9. The preparation method according to claim 8, further comprising adding an antifoaming agent to the second solution, standing to obtain a third solution, adding a thickener and a metal corrosion inhibitor to obtain a fourth solution, adding an abrasive, and mixing to obtain the grinding fluid.
10. Use of the abrasive liquid according to any one of claims 1 to 6 in the processing of materials.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115558426A (en) * | 2022-09-23 | 2023-01-03 | 无锡兴华衡辉科技有限公司 | Method for grinding chip surface, suspension grinding and polishing liquid for grinding chip surface and preparation method thereof |
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| US20150052822A1 (en) * | 2013-08-23 | 2015-02-26 | Diamond Innovations, Inc. | Lapping slurry having a cationic surfactant |
| US20180043497A1 (en) * | 2015-03-10 | 2018-02-15 | Hitachi Chemical Company, Ltd. | Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method |
| US20190352537A1 (en) * | 2017-02-08 | 2019-11-21 | Hitachi Chemical Company, Ltd. | Polishing liquid and polishing method |
| US20200017718A1 (en) * | 2017-03-14 | 2020-01-16 | Hitachi Chemical Company, Ltd. | Polishing agent, stock solution for polishing agent, and polishing method |
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| JP2003138248A (en) * | 2001-10-16 | 2003-05-14 | Ppt Research Inc | Cutting or polishing slurry composition and use thereof |
| US20150052822A1 (en) * | 2013-08-23 | 2015-02-26 | Diamond Innovations, Inc. | Lapping slurry having a cationic surfactant |
| US20180043497A1 (en) * | 2015-03-10 | 2018-02-15 | Hitachi Chemical Company, Ltd. | Polishing Agent, Stock Solution for Polishing Agent, and Polishing Method |
| US20190352537A1 (en) * | 2017-02-08 | 2019-11-21 | Hitachi Chemical Company, Ltd. | Polishing liquid and polishing method |
| US20200017718A1 (en) * | 2017-03-14 | 2020-01-16 | Hitachi Chemical Company, Ltd. | Polishing agent, stock solution for polishing agent, and polishing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115558426A (en) * | 2022-09-23 | 2023-01-03 | 无锡兴华衡辉科技有限公司 | Method for grinding chip surface, suspension grinding and polishing liquid for grinding chip surface and preparation method thereof |
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