JP2003138248A - Cutting or polishing slurry composition and use thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a slurry composition which contains abrasive grains but can be left for a long time with no hard sediment formed or no coagulation of grain brought about. SOLUTION: The cutting or polishing slurry composition comprises an abrasive grain and a carrier component for cutting or polishing a work piece made of a hard and brittle material, wherein the carrier component contains (a) a nonaqueous nonionic polar solvent at a content of from 80 wt.% to 99.5 wt.%, (b) an organic electrolyte adjusted to pH 4.5-8 at that of form 0.05 wt.% to 10 wt.%, and (c) water at that of from 0.5 wt.% to 10 wt.%.

Description

Detailed Description of the Invention TECHNICAL FIELD OF THE INVENTION

The present invention relates to a novel cutting or polishing slurry composition, and more specifically, in a cutting device using a wire, silicon, germanium, gallium arsenide,
Suitable for cutting or polishing workpieces made of brittle materials such as glass, titanium, tungsten or other granite blocks, ceramics, steels into many thin sheets, wafers, substrates or precision machined parts etc. It relates to a slurry composition.

[Prior art]

[0002] Conventionally, in processing a hard and brittle material such as a silicon ingot for semiconductors, a cutting device called "wire saw" or "wire web", a polishing device having a donut-shaped polishing pad or a rotary polishing pad has been used. Has been. The cutting device usually consists of thin wires that are parallel to one another and are regularly spaced. The workpieces to be cut are pressed onto fine wires of approximately 0.15-0.2 mm in diameter running parallel to each other in the same direction. During that time, a slurry in which the abrasive is suspended is supplied between the workpiece and the wire,
It is a method of cutting a workpiece into a wafer shape by the polishing force of an abrasive. By the liquid circulation system, by supplying the abrasive slurry composition in a "curtain" form immediately before the wire web hits the workpiece, the abrasive particles suspended in the slurry composition are applied to the running wire or "web". Is applied. The abrasive carried by the liquid in this manner is applied to the wire and moved to perform the function of polishing or cutting. On the other hand, the polishing device is a device that polishes a sheet, a wafer, or a substrate using a donut-shaped polishing pad or a rotary polishing pad. The slurry in which the abrasive is suspended is applied to the pad. The cutting or polishing apparatus described here is, for example, US Pat. No. 3,478,732, US Pat. No. 3,525,324, US Pat.
No. 9,275 and US Pat. No. 5,270,271.

It is also known to have a cutting or polishing device in which several wires are looped or wound together to form a braided loop. This format is used when cutting granite blocks or silicon ingots. In this case, the workpiece is pressed onto the braided wire and the cutting or polishing process is facilitated by the abrasive particles as described above.

The optimum cutting quality depends on cutting or polishing conditions,
It is determined by a combination of parameters such as the quality of the abrasive slurry and the pressing force on the wire or pad. Here, optimization of cutting or polishing quality during mass production will be described. Cutting or polishing quality refers to the exact smoothness of the surface without taper or thickness variation, suitable for semiconductor devices, solar cells, optical glass, and other applications. During mass production, for example, the wear rate of the wire and effective recovery and recycling of the abrasive slurry composition are also important. US Pat. No. 5,099,820
The publication describes an abrasive slurry in which silicon carbide is suspended in water or oil. However, these prior art slurry compositions have poor stability and are not sufficient in terms of uniform coatability on wires. Moreover, these slurry compositions require constant vigorous agitation to uniformly suspend the particles.
When the slurry composition is left as it is, it rapidly precipitates, and even during stirring, it easily precipitates during cutting or polishing.

There is a demand for the development of a new cutting or polishing slurry composition that solves the above problems found in conventional cutting or polishing slurry compositions. That is, the abrasive is uniformly suspended, the abrasive particles do not agglomerate with each other to form a hard precipitate, and the workpiece has the ability to be efficiently cut. Furthermore, excellent lubricity and It has excellent heat transfer characteristics for removing frictional heat generated during cutting, thereby prolonging the life of the wire and reducing downtime. Preferably, the abrasive particles are stably suspended, and even if the particles agglomerate during long-term storage, the original suspension property is restored by simple stirring.

In preparing the cutting or polishing slurry composition, a surfactant and an electrolyte are generally added,
Its role is described as the effect of wetting the particle powder with the medium liquid, and breaking the aggregation of the particles into a fine particle dispersion. Also, the role of the surfactant and the electrolyte in controlling colloidal stability is explained as the interaction force between particles. This interaction force is electrostatic force, van der
It is classified into the Waals force and the three-dimensional repulsive force. In the presence of electrolytes, stability results primarily from the combination of electrostatic forces and steric repulsion.

The inventor has found that the “charge particle” principle by the generally known “zeta potential” and “stern / diffuse layer” and the polar but non-ionic “carrier / lubrication”. Focusing on the new unique principle of creating an overall "repulsive charge medium" in the system, the combination of the surfactant and electrolyte in the cutting or polishing slurry composition makes the performance of the cutting or polishing slurry composition remarkable. The present invention has been completed and the present invention has been completed.

[Problems to be Solved by the Invention]

It is a primary object of the present invention to provide a cutting or polishing slurry composition for cutting or polishing hard and brittle materials with equipment having "multiple wires" or "polishing pads". It is intended to improve the production efficiency and quality of the obtained sheet or substrate. Another object is to provide a cutting slurry composition capable of uniformly supplying an abrasive to a cutting wire or a polishing pad. A further object is to provide fully water-soluble or water-miscible slurry compositions with very low toxicity. Still another object is to provide a slurry composition in which abrasive particles that are abrasive do not form a hard precipitate or cause particle agglomeration even when left standing for a long time. Yet another object is to provide components such as high quality sheets or substrates for use in semiconductors and solar cells. For other purposes and applications of the present invention, as well as for a more complete understanding of the present invention, please refer to the accompanying drawings and description.

[Means for Solving the Problems]

In order to achieve the object of the present invention, the first aspect of the present invention is to cut or polish a workpiece made of a hard and brittle material containing an abrasive and a carrier component. A slurry composition for cutting or polishing, wherein the carrier component is (a) a non-aqueous nonionic polar medium of 80% by weight or more and 99.5% by weight or less, and (b) 0.05% by weight or more and 10% by weight or less. , Preferably 0.1 wt% or more and 10 wt% or less, more preferably 0.5 wt% or more and 4 wt% or less, an organic electrolyte having a pH adjusted to 4.5 to 8 and (c) 0.5 wt% More than 10
There is provided a cutting or polishing slurry composition (hereinafter sometimes simply referred to as a slurry composition) containing water in an amount of 0.5% by weight or more and preferably 0.5% by weight or more and 5% by weight or less.

As a second invention, (a) a nonaqueous nonionic polar medium of 80% by weight or more and 99.5% by weight or less, and (b) a pH of 0.1% by weight or more and 10% by weight or less are 4 0.5 to 8 adjusted organic electrolyte and (c) 0.5
A carrier component for use in a cutting or polishing slurry containing 10% by weight or less of water is provided.

A third aspect of the present invention provides a method for cutting or polishing a hard and brittle workpiece, which uses the above-mentioned slurry composition for cutting or polishing as a cutting material.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will be described in more detail below. The slurry composition of the present invention contains an abrasive and a carrier component. Other particles may be included in addition to the abrasive.
The pH of the slurry composition is not particularly limited, but is preferably less than 7. The abrasives used in the present invention include diamond, silica, tungsten carbide, silicon carbide, boron carbide, silicon nitride, aluminum oxide and other hard abrasive particle materials. One of the most preferred abrasives is silicon carbide.
The center value or average value of the particle size distribution of the abrasive is "International F
Although it varies depending on the classification of grit powder of "EPA standard" or "JIS standard", it is usually in the range of 5 to 50 µm, preferably 10 to 30 µm. The content of the abrasive in the slurry composition is usually 70% by weight, preferably 20 to 70%.
%, More preferably 25 to 60% by weight, particularly preferably 35 to 55% by weight.

The carrier component constituting the slurry composition of the present invention comprises (a) 80% by weight or more and 99.5% by weight or less, preferably 86% by weight or more and 99.5% by weight or less, more preferably 91% by weight or more. 99.5 wt% or less, particularly preferably 93.5 wt% or more and 99 wt% or less non-aqueous nonionic polar medium, (b) 0.1 wt% or more and 10 wt% or less, preferably 0.1 wt% Or more and 4% by weight or less, more preferably 0.4% by weight or more and 3% by weight or less, and the pH is adjusted to 4.5 to 8, preferably 4.5 to 7, and more preferably 4.5 to 6 And (c) 0.5
It contains from 10 to 10% by weight, preferably from 0.5 to 5% by weight of water. The carrier component further comprises (d) 0.1% by weight or more and 10% by weight or less, preferably 0.1% by weight or more and 1% by weight.
Below, more preferably 0.1% by weight or more and 0.5% by weight or less of an ionized surfactant can also be contained. The pH of such a carrier component is not particularly limited, but is usually 4.6 to 8, and preferably 4.7 to 5.5. Furthermore, a thickener such as xanthan gum (Xanthan Gum), rhamsan gum (Rhamsan Gum), carboxymethyl cellulose, methyl cellulose, or polysaccharide can be added to the slurry composition of the present invention, if necessary. . Additionally or as an option, US Pat. No. 6,054,
422, such as alcohols,
Examples include amides, esters, ethers, ketones, glycol ethers, and sulfoxides.
Specific examples of polar solvents include dimethyl sulfoxide, dimethylacetamide (DMAC), N-methylpyrrolidone (NMP), gamma butyrolactone, diethylene glycol ethyl ether, dipropylene glycol methyl ether, tripropylene glycol monomethyl ether and the like. If necessary, a proper dispersant or suspending agent may be added to improve the viscosity and the washability of the slurry.

The non-aqueous nonionic polar medium may be a nonionic general organic solvent, and a preferable representative example is:
It is a polyalkylene glycol such as polyethylene glycol or a copolymer of alkylene glycols.

The pH is 4.5 to 8, preferably 4.5 to
As the organic electrolyte (neutralized organic electrolyte) adjusted to 7, more preferably 4.5 to 6, even if it is an anionic polyelectrolyte (anionic PE), a cationic polyelectrolyte (cationic PE). When a surfactant is used as one component of the carrier, it is desirable to use an organic electrolyte having a repeating side chain having the same charge as that of the repeating side chain of the surfactant. It is also desirable that the abrasive particles and the organic electrolyte have the same or opposite charges. When using a medium charged with a negative polyelectrolyte, the abrasive particles such as SiC not only repel each other, but are also constantly repelled by the charged polyelectrolytes present in the medium.
Here, the term "soft precipitation property" is defined as a property of keeping a suspension of particles without giving a "hard" precipitate of particles to the bottom of a container even when left standing for a long period of time. The presence of the included charged polyelectrolytes provides a significant improvement over the media alone, or the nonpolar media and the dispersion media alone.

Specific examples of anionic PE having negatively charged repeating monomer units and suitable for dispersing or dissolving in a nonionic medium include homopolymers or copolymers of the following monomers. Included are pH-neutralized polymeric acids such as polymers and copolymers. Specific examples of the monomer used in producing the polymer acid include unsaturated carboxylic acids such as acrylic acid and methacrylic acid; alkenylsulfonic acids, aromatic alkenylsulfonic acids (eg, styrenesulfonic acid), alkylacryloxysulfonic acids ( For example, 2-methacryloxyethyl sulfonic acid), sulfonic acid such as acrylamide sulfonic acid; and the like, and these acidic monomers can be used together with a copolymerizable monomer, if necessary.

Specific examples of particularly preferable anionic polyelectrolytes include polyacrylic acid (PAA) having a molecular weight of 1,000 to 10,000 and an acrylic acid-maleic acid copolymer (PACM) having a molecular weight of 2,000 to 6,000. )and so on.
Generally speaking, most of the neutralized products of polycarboxylic acid, phosphoric acid, sulfonic acid, sulfinic acid, etc., are non-ionic, non-aqueous polyethylene glycol (PEG) and appropriately high viscosity as negative charge components. It can be well dispersed, suspended or dissolved in a medium such as mineral oil. In the present invention, a monomer electrolyte having a polyfunctional group such as EDTA or its genus can be used, but a polymer electrolyte is functionally superior. The above “non-neutralized form” of anionic PE (eg, anionic PE free acid) is not useful for the present invention and does not improve the soft precipitation properties of SiC suspended in PEG. "Neutralizer" of anionic PE or electrolyte
Only works effectively.

Anionic polymer electrolyte (anionic P
Similarly, E) enhances the repulsive force between particle-particle and particle-charged media based on the concept of "zeta potential" between particles in PEG media and charged media. Polyelectrolytes (cationic PE) can also achieve the same principle. In this case, the polyelectrolyte with multiple charged cations with long chains is effectively pulled by the negatively charged SiC particles, forming a tight, electrostatically bound "shell" that surrounds the entire particle. To do. Like anionic PEs, cationic PEs have many charged side chain species along the polymer chain, so that the portion of the polymer that is not electrostatically adsorbed on the surface of the particle is a positively charged hair or It projects into a non-ionic PEG medium like a string.

The anionic polyelectrolyte is a metal salt such as sodium or potassium hydroxide, or a non-metal alkylammonium hydroxide such as tetraalkylammonium hydroxide, more preferably tetramethylammonium hydroxide (TMAH). Can be neutralized by. Non-metal alkyl ammonium hydroxides are preferred when low carrier or slurry viscosities are required.

When a metal hydroxide is used, the carrier component usually has a viscosity of 100 cps or more and a slurry viscosity of 35.
It becomes 0 cps or more.

Cationic PE shows the strongest charge under neutral to acidic conditions. This is because the most common type of cationic PE is a quaternary ammonium salt of polymers such as various acrylates, acryloamides and methacryloxy. This "poly salt" usually has a general repeating unit represented by the following formula. (R ₁ ) _α- N (R) _4-α X Here, R is an alkyl group or hydrogen, R ₁ is a monomer repeating unit of the PE-based polymer exemplified above, X is a halogen, a sulfate, a phosphate, a sulfonate, Alternatively, carboxy anion and α represent an integer of 1 to 3.

In the case of cationic PE, these polysalts electrostatically adhere strongly to the negatively charged abrasive particles, thereby neutralizing the negative charge on the particle surface. And, at some sufficient PE concentration, the non-adherent PE chain moieties form a "shell" around the particle with a strong secondary positive charge.

Generally speaking, in the case of cationic PE, a neutral or acidic pH is required to prevent ionic neutralization of the quaternary ammonium species plus charge, as described by the Rx mechanism of the equation below. To be done.

[Formula 1] Where R is a charge-separating polymer chain and R ₁ is H or an alkyl group. Similar results are obtained by adding metal salts of polyacrylic acid, especially sodium polyacrylic acid salt.

If desired, the carrier component of the present invention may further contain an ionized surfactant. Ionized surfactants are anionic or cationic surfactants. Examples of anionic surfactants used include Tegopren 58
Siloxane or polysiloxane such as 63 or 5840,
Alkyl metal salts of alkyl-substituted benzene sulfonic acids or more preferably non-metal salts, alkali metal salts or non-metal salts of long-chain aliphatic sulfonic acids, metal salts or non-metal salts of ether sulfonic acids derived from alcohols or alkali phenols. , Alkali metal or non-metal salts of sulphonated succinic acid, alkali metal or non-metal salts of sarcosinic acid (Sarcosinates), alkali metal or non-metal salts of tauridinic acid (Tauride)
s) etc.

[0025] Preferred anionic surfactants _{are, C 12} ~
C ₂₅ water-miscible or water-dispersible alkyldimethylamine oxide, examples of which are N, N-dimethyl-1-tetradecaneamine oxide, N, N-dimethyl-1-octadecaneamine oxide, sodium-
Lauroyl sarcosinate and alkali metal salts such as hexadecyl diphenyl ether disulfonic acid, dodecyl diphenyl ether disulfonic acid and decyl diphenyl ether disulfonic acid, more preferably diphenyl ether sulfonic acid salts such as non-metal salts, preferably C
_{10- C18} alkylbenzene sulfonates and the like. Here the anionic surfactant, commercially available to be used, a linear alkyl benzene sulfonic acid sodium salt of C ₁₀ -C ₁₃ of De Soto Inc. or Stepan Company sells (for C ₁₁ -C ₁₇ There is a linear alkylbenzene sulfonate). Calsoft (C
alsoft) _F90 (C 10 linear Al Kirari Rusuru sulfonic acid sodium salt of _{~C 13), C 12} Al Kirari Rusuru von containing Uitokoneto 90F (1.7% of the free oil and 3.0% of SO ₄ of Witco Acid sodium salt), Albright & Wilson (Al
bright &Wilson's Nansa
HS 80PF, Stepan Agent S-1 from Stepan S-1
509-65, fluorinated surfactants FC-170, FC-99, FC-95, DuPont (D
Fluorinated surfactant FSO sold by
-A series is suitable.

The cationic surfactant used in the present invention includes stearyl dimethyl benzyl ammonium chloride, coconut dimethyl benzyl ammonium chloride, cetyl pyridinium chloride, cetyl trimethyl ammonium chloride and the like.

Particularly preferred surfactants are the above-mentioned fluorinated surfactants, alkylnaphthalene sulfonic acid potassium salt having one or two alkyl groups each consisting of C _{1 to} C ₆ , paraffin sulfone represented by RSO ₃ M. Acid salts. Here, R is a primary or secondary alkyl group having about 8 to 22 carbon atoms (preferably about 12 carbon atoms), and M is an alkali metal. The alkylene glycol or glycol copolymer used in the present invention is commercially available from Aldrich, Union Carbide, and others.

The preferred carrier component composition is (a)
1% by weight or less of anionic surfactant, (b) 0.1 to 4
% Anion electrolyte, (c) 91-99.5% by weight
Of polyethylene glycol medium and (d) 5% by weight or less of water, and the electrolyte is neutralized to have a pH of 4.5 to 8, preferably 7 or less.

The most preferred carrier component is (a) 9
3.5-99 wt% polyethylene glycol (having a molecular weight of about 200-600), (b) 0.1-0.5 wt% fluorinated anionic surfactant, (c) 0.4-3 wt. % Anionic polyelectrolyte (pH is neutralized to 4.5 to 6) and (d) 0.5 to 5% by weight of water, and the system viscosity is room temperature (25 ° C.). At 5
0 to 300 cps.

As described above, the present invention is based on the generally known "zeta potential" and "stern / diffuse layer" principle of "charge (charged particle)" and the polar but non-ionic "charged particle". It combines a new and unique principle of creating an overall "repulsive charge medium" within a "carrier / lubrication" system. The concept of organic electrolytes, more preferably polyelectrolytes, is adopted here, whereby an electrostatic repulsion medium is created from a nonionic medium such as polyethylene glycol (PEG) or even mineral oil. . The charge repulsive force between two particles of the same kind in a nonpolar and uncharged medium is defined by the following classical equation. F = kq
(1) q (2) / d (E2)

Therefore, the higher the charge of the particle q, the greater the repulsive force generated as the particle approaches. The present invention deliberately imparts a charge to the nonionic medium by successfully dispersing or dissolving an electrolyte that has a "same" or "opposite" charge as the particles in the nonionic medium. By applying a charge with a negative polyelectrolyte of the same type as the particles, the repulsive force between the negatively charged dispersed SiC particles becomes larger than the above calculated value. Furthermore, since the size of the "free void" between the charged substances is extremely small, the repulsive force between the particles and between the particles and the medium is further increased. As a result, the abrasive particles such as SiC in the medium that are negatively charged are less likely to aggregate with each other, as compared with the case where particles are simply aggregated in a nonionic medium such as PEG or mineral oil.

PEG-400 as a carrier component,
When using anionic fluorinated surfactants or nonionic surfactants, it is preferable to use an anionic polyelectrolyte neutralized with a metal hydroxide, the composition thus prepared even at high temperatures. It exhibits excellent viscosity retention properties.

The preferred carrier component of the present invention is
(A) 5% by weight or less of a surfactant, (b) about 0.05 to
10% by weight of polyelectrolyte polymer having the same polar side chain charge (ie plus or minus) as the above surfactant, (c) about 80-99.5% by weight.
(D) 2% by weight or less of a dispersion or suspension medium other than polyalkylene glycol, and (e) less than 10% by weight of water. Here, the polyalkylene glycol has an alkylene group of 2 to 5 carbon atoms, and is preferably selected from polyethylene glycol, polypropylene glycol, polyisobutylene glycol, and glycol copolymers thereof. The glycol also comprises about 80-99.5% by weight of glycol having a molecular weight of 200-600, most preferably 200-400 (on a weight% basis of the total formulation) and has a viscosity range of 50-300 cp.
s. The dispersing or suspending medium of (d) is also as described in US Pat. No. 6,054,422, such as di- or triglycol monomethyl ether, NMP, DMAC.

The preferred carrier component in the present invention is one containing about 80-99% polyethylene glycol (PEG) having a molecular weight of 200-400, based on the total formulation weight. It is preferable to use a low molecular weight one and a high molecular weight one in combination with PEG.
~ 600 PEG about 80-92 wt% and molecular weight 100
0 to 2000 PEG in a proportion of about 1 to 6 wt% (based on total formulation weight percent), preferably about 8 PEG-400.
5 to 90% by weight and PEG-1500 about 2 to 10% by weight
Most preferably about 87-93% by weight of PEG-400 and about 3-8% by weight of PEG-1500.
It is included in the ratio of.

The slurry composition of the present invention is very stable and
In many cases, it is not necessary to stir before using it for wire cutting, even after long-term storage. However, even when the slurry composition is separated, simple stirring can return it to a uniform suspension. Usually, it is sufficient to operate a pump or spray to supply the cutting machine.

The "soft-precipitation" property of SiC slurry is PP
It can be measured by the following measuring devices manufactured by researchers and engineers of T Research. This device measures a resistance force when a rod having a blunt tip is made to enter a slurry in a normal container to a certain depth or a certain distance. By using a specially made conical standard tube to emphasize the "hard settling" tendency of the slurry, it is possible to distinguish between carriers with good suspending properties and those without. The tube contains 15% abrasive (SiC) as standard.
This abrasive concentration is arbitrarily selected and should be a concentration convenient for measurement. 15% is such a concentration.

By using this device, the "penetration cake entry resistance" can be measured accurately and with good reproducibility, and the characteristics are determined by measuring the entry depth of the standard rod and the device calibration over time. be able to. A slurry made of an excellent suspension carrier has a low "soft settling value (SSR value)" which is an entry resistance, and is 25 g or less under a certain condition even after long-term storage. Poor suspension carrier (eg standard PEG-200, PEG-3
00, PEG-400, etc.) has a high SSR value even after a fairly short storage period, ranging from 35 to 50 g. In other words, the lower the SSR value of a certain slurry after storage, the more stable, uniform and excellent the slurry in all of its performance, storage characteristics and recycling characteristics.

The carrier component of the present invention is obtained by slicing an ingot made of a hard and brittle material into a semiconductor, glass,
It is useful for improving the efficiency and productivity of a polishing type cutting machine for making wafers or sheets used for ceramics, photocells, etc. This component suspends the abrasive particles without agglomerating them and is evenly distributed across the wedge-shaped space created by the wire and the workpiece, or otherwise at the ends of the cut. This greatly improves cutting accuracy and efficiency. Furthermore, this carrier component provides lubricity to the cutting wire or braided wire,
Absorbs frictional heat generated on the cutting surface. As a result, it extends the life of the wire and minimizes unacceptable warpage, thickness variation, scratch depth, etc. in devices that use semiconductors, optical glass, or photocells.

[0039]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples as long as it is based on the technical idea described above. The percentages in the following description are based on weight unless otherwise specified.

Example 1 A carrier component of a cutting material used in a multi-wire saw for cutting a hard material was prepared by mixing the components shown in Table 1 below.

[0041]

[Table 1]

The composition had a pH of 4.7-5.5 and a viscosity of 60 to 90 cps at 25 ° C. Then 4
When a slurry composition was prepared by adding 7.1% of SiC, the viscosity thereof was 240 to 290 cps at 25 ° C. FIG. 1 compares the viscosity of this example composition, designated SSL-160, at different temperatures with PEG-200 and PEG-400.

Example 2 A carrier composition used in a multi-wire saw for cutting hard materials was prepared by mixing the components shown in Table 2 below, and further SiC was added as an abrasive to prepare a slurry composition.
In the case of this carrier component, the content of abrasive is about 1 /
3 or about 35%.

[0044]

[Table 2]

The pH of this carrier component is about 4.7-
5.5, the viscosity is about 175 to 250 cps at 25 ° C., and the slurry viscosity when 35% SiC is added is 400 to 500 cps at 25 ° C. FIG. 2 compares the viscosity of this example composition, designated SSL-162, at varying temperatures with PEG-200 and PEG-400.

Example 3 A lubricating composition containing an anionic surfactant and an anionic polyelectrolyte for use in a multi-wire saw for cutting hard materials was prepared by mixing the components of Table 3 below.

[0047]

[Table 3]

Example 4 The composition set forth in Table 4 below had an abrasive content of 47-50%,
The soft precipitation value (SSR value) after 35 days was 25 or less.

[0049]

[Table 4]

Comparative Example Table 5 below shows soft precipitation values (SSR values) of the sample in Example 4 at 25 ° C.

[0051]

[Table 5]

[0052]

【The invention's effect】

The slurry composition of the present invention is a semiconductor material,
It is suitable as a cutting material used in an apparatus for cutting a workpiece made of a hard and brittle material such as a magnetic material, ceramics, a granite block, and a solar cell component.
It can also be used for precision cutting or polishing of metal or ceramic parts used as parts of tools, automobiles, machines and other devices. For example, other applications would be readily apparent to one of ordinary skill in the art given the superior performance of the slurry compositions of the present invention when polishing hard support plates.

[Brief description of drawings]

FIG. 1 is a viscosity comparison of certain compositions in this invention.

FIG. 2 is a viscosity comparison of another composition in this invention.

Continued front page    (72) Inventor Daniel French             United States 18944 Pennsylvania             Jefferson Drive, State Parkercy               616 (72) Inventor Amy Heller             United States 18069 Pennsylvania             Olefield, Hoffmansville             Code 4781 (72) Inventor Il Eugene Ward             United States 18015 Pennsylvania             Amherst Court, Bethlehem, canton             1493 F-term (reference) 3C058 AA07 DA02 DA03

Claims (15)

[Claims] 1. A cutting or polishing slurry composition for cutting or polishing a workpiece made of a hard and brittle material, which comprises an abrasive and a carrier component.
The carrier component is (a) 80% by weight or more and 99.5% by weight or less of a non-aqueous nonionic polar medium, (b) 0.05.
Slurry composition for cutting or polishing, containing an organic electrolyte having a pH adjusted to 4.5 to 8 in an amount of 10% by weight or more and (c) 0.5% by weight or more and 10% by weight or less of water . 2. The slurry composition for cutting or polishing according to claim 1, wherein the carrier component further contains (d) 0.1% by weight or more and 10% by weight or less of an ionized surfactant. 3. The cutting or polishing slurry composition according to claim 2, wherein both the surfactant and the organic electrolyte are anionic. 4. The slurry composition for cutting or polishing according to claim 2, wherein the surfactant is a fluorinated alkyl-based surfactant. 5. The slurry composition for cutting or polishing according to claim 1, which further comprises 10% by weight or less of a non-polymeric polar suspension medium as a viscosity and suspension property adjusting agent. 6. The cutting or polishing slurry composition according to claim 1, wherein the organic electrolyte is cationic and is represented by the following general formula. (R _i ) _n- N (R) ⁺ _4-n X ^- wherein R is hydrogen or lower alkyl, R _i is a repeating unit of the monomer, and X is halogen, sulfate, phosphate, sulfonate or carboxy. Is an anion of rate, n is an integer from 1 to 3. 7. The cutting or polishing slurry composition according to claim 1, wherein the organic electrolyte is a neutralized polymer acid. 8. The slurry composition for cutting or polishing according to claim 7, wherein the polymer acid is a homopolymer of an unsaturated carboxylic acid or a copolymer of an unsaturated carboxylic acid and a monomer copolymerizable therewith. 9. The cutting according to claim 7, wherein the polymer acid is selected from the group consisting of polyacrylic acid, polymethacrylic acid, a copolymer of acrylic acid and methacrylic acid and maleic acid, and a mixture thereof. Alternatively, a polishing slurry composition. 10. The slurry composition for cutting or polishing according to claim 1, wherein the organic electrolyte is a polymer electrolyte having a molecular weight of about 1,000 to 1,000,000. 11. The cutting or polishing slurry composition according to claim 7, wherein the polymer electrolyte is neutralized with tetraalkylammonium hydroxide. 12. The carrier component has a pH of about 4.6-8.
The slurry composition for cutting or polishing according to claim 11. 13. The slurry composition for cutting or polishing according to claim 1, wherein the ratio of the abrasive and the carrier component is 20 to 70% by weight based on the total amount of both. 14. (a) 80% by weight or more and 99.5% by weight
The following non-aqueous nonionic polar medium, (b) 0.05 wt% or more and 10 wt% or less organic electrolyte having a pH adjusted to 4.5 to 8 and (c) 0.5 wt% or more and 10 wt% A carrier component used for a cutting or polishing slurry containing the following water. 15. A method for cutting or polishing a hard and brittle workpiece, which comprises using the slurry composition for cutting or polishing according to any one of claims 1 to 13 as a cutting material. Cutting or polishing method.