CN114928984A - Cold drawing subassembly, integrated territory controller and vehicle - Google Patents

Abstract

The invention relates to a cold plate component, which comprises a first side plate and a second side plate, a liquid inlet and a liquid outlet, wherein a plurality of guide plates are arranged in an inner cavity; and the two ends of each first partition plate are connected with the side walls of the first side plate and the second side plate. Wherein, a flow passage communicated with the inner cavities of the first side plate and the second side plate is formed on the first clapboard. The first partition plate of the cold plate assembly is used as a main cooling element and is used for being in contact with a device to be cooled, such as a circuit board shell, so as to dissipate heat of the device to be cooled, and the guide plates in the first side plate and the second side plate are used as flow guide devices of cooling liquid and guide the cooling liquid in the flow channels of the first partition plate to continuously flow so as to timely take away heat conducted from the device to be cooled and prevent the device to be cooled from being locally high in temperature. Because the first partition plate has a large contact area with the device to be cooled, the heat dissipation effect is better, and the utilization rate of the cold plate assembly is high.

Description

Cold drawing subassembly, integrated territory controller and vehicle

Technical Field

The present invention relates to a cold plate, and more particularly, to a cold plate assembly, an integrated domain controller using the same, and a vehicle.

Background

With the faster and faster iteration speed of vehicle-mounted products, the number of circuit boards used by a vehicle integrated domain controller is also continuously increased, the corresponding power consumption is higher, and the heat source distribution is more dispersed, so that the existing fin air cooling, heat pipes, VC (Vapor Chambers/planar heat pipes/temperature equalization plates) and fan heat dissipation can not meet the requirements of high power consumption and multi-wide-area heat dissipation.

Disclosure of Invention

The invention aims to provide a cold plate assembly capable of meeting the integrated heat dissipation requirements of a multi-circuit board.

A cold plate assembly, comprising: the hollow first side plate is internally provided with a plurality of guide plates; the hollow second side plate is internally provided with a plurality of guide plates; a liquid inlet and a liquid outlet which are respectively arranged on the first side plate and the second side plate or on one of the first side plate and the second side plate; and the two ends of each first partition plate are connected with the side walls of the first side plate and the second side plate. Wherein, a flow passage communicated with the inner cavities of the first side plate and the second side plate is formed on the first clapboard.

Preferably, at least a part of the baffles in the plurality of baffles are provided with notches or through holes for preventing laminar flow.

In one embodiment, the plurality of guide plates in the first side plate and the second side plate are parallel to the first partition plate and are arranged at intervals, and a flow passage is formed between the end part of each guide plate and the inner wall of the first side plate.

As an embodiment, the cold plate assembly further comprises a plurality of second partition plates dividing the inner cavity of the first side plate into spaces not directly communicated with each other, and a plurality of third partition plates dividing the inner cavity of the second side plate into spaces not directly communicated with each other; the number of the second partition plates and the number of the third partition plates are the same as the number of the first partition plates.

As an implementation manner, the second partition board and the third partition board respectively divide the inner cavity of the first side board and the inner cavity of the second side board into a plurality of spaces from bottom to top, the numbers of the spaces from bottom to top defining the first partition board and the second partition board are 1,2, … …, n, where n is an integer not zero, then the plurality of guide plates in the first side board are arranged in the space with the odd number, the plurality of guide plates in the second side board are arranged in the space with the even number, and two ends of the flow channel of the first partition board are respectively communicated with the space provided with the guide plates.

As an implementation mode, the liquid inlet is arranged at the lower end of the first side plate and is communicated with the space, numbered as 1, of the first side plate.

As an embodiment, the inner cavity defining the first side plate comprises a plurality of indirectly-communicated accommodating spaces from bottom to top, the inner cavity defining the second side plate also comprises at least one indirectly-communicated accommodating space from bottom to top, and the guide plate is arranged in the accommodating spaces; one end of the flow passage of the first partition board is communicated with one of the accommodating spaces of the first side board, and the other end of the flow passage of the first partition board is communicated with one of the accommodating spaces of the second side board.

As an implementation mode, the cold plate assembly further comprises a bottom plate disposed below the plurality of first partition plates and a top plate disposed above the plurality of first partition plates, and two ends of the bottom plate and the top plate are respectively connected with the first side plate and the second side plate.

The invention also provides an integrated domain controller which comprises a plurality of circuit boards and the cold plate assembly, wherein the circuit boards are arranged above or below the first partition plate, and the circuit boards or the circuit board shells are in surface contact with the first partition plate.

The invention also provides a vehicle which comprises the integrated domain controller, wherein the liquid inlet and the liquid outlet of the cold plate assembly of the integrated domain controller are connected with a vehicle cooling liquid tank.

The first partition board of the cold plate assembly is used as a main cooling element and is used for being in contact with a device to be cooled, such as a circuit board or a shell of the circuit board, so as to dissipate heat of the device to be cooled, and the flow guide boards in the first side board and the second side board are used as flow guide devices of cooling liquid and guide the cooling liquid in the flow channels of the first partition board to continuously flow so as to timely take away heat conducted from the device to be cooled and prevent the device to be cooled from being locally high in temperature. Because the first clapboard has large contact area with the device to be cooled, the heat dissipation effect is better, and the utilization rate of the cold plate component is high. The cold plate assembly is of a multilayer support structure, so that a plurality of circuit boards of the integrated domain controller can meet the distributed heat dissipation requirement of the circuit boards on the premise of centralized placement, and when a single circuit board of the integrated domain controller is subjected to iterative replacement, the replacement operation is also convenient. When the integrated domain controller needs to increase the circuit board, the number of the cooling assemblies can be increased, and the product extension is realized by connecting a plurality of cooling assemblies in series through the liquid inlet and the liquid outlet or connecting a plurality of cooling assemblies in parallel. And the product extension can be realized by increasing the length or the width of the first partition plate, so that the heat dissipation requirements of different integrated domain controllers can be easily met. Therefore, the cold plate assembly can meet the integrated heat dissipation requirement of a multi-circuit board of the conventional integrated domain controller and can also meet the expansion requirement of the cold plate assembly caused by product extension. In addition, the structure of the cold plate assembly enables the cold plate assembly to be formed by die casting, and the mass production is convenient.

Drawings

Fig. 1 is a perspective view of a cold plate assembly according to a first embodiment.

Fig. 2 is a partially sectional view of the cold plate assembly of fig. 1, wherein the first side plate is vertically sectioned by a plane parallel to the short side of the first partition plate.

Fig. 3 is a front view of the cross-section in fig. 2.

Fig. 4 is a partial cutaway view of the cold plate assembly of fig. 1, taken horizontally from below the first partition.

Fig. 5 is a partially sectional view of the cold plate assembly of fig. 1, in which the second side plate is vertically sectioned by a plane parallel to the short side of the first partition plate.

Detailed Description

The cold plate assembly of the present invention will be described in further detail below with reference to specific embodiments and accompanying drawings.

As shown in fig. 1, the cold plate assembly according to the first embodiment of the present invention mainly includes a bottom plate 10 at the bottom, a top plate 11 at the top, two first partition plates 12 between the bottom plate 10 and the top plate 11, and a first side plate 13 and a second side plate 14 at both sides. Wherein, bottom plate 10, polylith first baffle 12 and roof 11 interval set up, form the space that is used for supplying waiting to cool the device and insert between the adjacent board. The two ends of the bottom plate 10, the first partition plates 12 and the top plate 11 are connected with the side walls of the first side plate 13 and the second side plate 14, so that the cold plate assembly is wholly in a shelf shape.

As shown in fig. 2 to fig. 5, cavities (i.e., hollow cavities) are formed in the first side plate 13 and the second side plate 14, a flow channel 121 communicated with the cavities of the first side plate 13 and the second side plate 14 is formed on the first partition plate 12, a liquid inlet 15 is formed on a lower portion of a front end surface 131 of the first side plate 13, and a liquid outlet 16 is formed on an upper portion thereof. In operation, in order to rapidly cool the first partition plate 12, the cooling liquid needs to flow into the cavity of the first side plate 13 from the liquid inlet 15, then flow through the flow channel 121 of the first partition plate 12 below, flow through the first partition plate 12 below, enter the cavity of the second side plate 14, flow through the flow channel 121 of the first partition plate 12 above, flow through the first partition plate 12 above, enter the cavity of the first side plate 13, and finally flow out through the liquid outlet 16. In order to guide the coolant to flow in the above-mentioned manner, a plurality of baffles 17 are provided in the inner cavities of the first side plate 13 and the second side plate 14.

When the cold plate assembly is applied to the integrated domain controller, the plurality of circuit boards of the integrated domain controller are arranged above or below the first partition plate, and the circuit boards are in contact with the surface of one first partition plate, so that effective heat conduction is realized. In one embodiment, the circuit board may be housed in a housing, and the circuit board is in close contact with the housing, and the housing of the circuit board is in contact with a surface of the first partition, so that the first partition absorbs heat emitted from the circuit board through the housing of the circuit board. In the following, the surface contact between the circuit board and the first partition board includes the case where the circuit board itself is in contact with the surface of the first partition board or the case of the circuit board is in contact with the surface of the first partition board.

When the integrated domain controller is an integrated domain controller of a vehicle, the liquid inlet 15 and the liquid outlet 16 of the cold plate assembly are adjacent to a vehicle cooling liquid tank, and the liquid pump for controlling the flow rate and the flow rate of the cooling liquid can be controlled by the integrated domain controller or other vehicle-mounted controllers.

The main body (comprising the first partition board, the first side board and the second side board) of the cold board assembly can be manufactured in a die-casting forming mode, openings for placing the guide boards are reserved on the first side board and the second side board, the guide boards can be fixed in the first side board and the second side board in a welding mode, and then the openings in the first side board and the second side board are sealed. The whole cold plate assembly can be made of metal or alloy with good heat conducting performance. The first partition 12 of the cold plate assembly is used as a main cooling element for contacting with a device to be cooled, such as a circuit board of an integrated domain controller of a vehicle, to dissipate heat from the circuit board, and the flow guide plates 17 in the first side plate 13 and the second side plate 14 are used as flow guide devices for cooling liquid to guide the cooling liquid to continuously flow in a preset direction in the cold plate assembly, and to prevent the generation of laminar flow, so as to take away heat conducted from the circuit board in time, and to prevent the local high temperature of the circuit board from affecting the use of the circuit board. Because the contact area of the first clapboard 12 and the circuit board is large, the heat dissipation effect is better, and the overall utilization rate of the cold plate component is high. And the cold drawing subassembly is multilayer supporting structure, makes things convenient for the polylith circuit board of integrated domain controller to realize the distributed heat dissipation demand of circuit board under the prerequisite of placing in a concentrated way, when the iteration of single circuit board of integrated domain controller is changed, also conveniently changes the operation. When the integrated domain controller needs to add circuit boards, the number of cooling assemblies can be increased, and product extension is realized by connecting a plurality of cooling assemblies in series through the liquid inlet 15 and the liquid outlet 16 or by connecting a plurality of cooling assemblies in parallel. Product extension can also be achieved by increasing the length or width of the first partition 12, thereby easily meeting the heat dissipation requirements of different integrated domain controllers. Therefore, the cold plate assembly can meet the integrated heat dissipation requirement of a multi-circuit board of the conventional integrated domain controller and can also meet the expansion requirement of the cold plate assembly caused by product extension. In addition, the structure of the cold plate assembly can realize die-casting forming, and is convenient for mass production.

In this embodiment, the cold plate assembly further comprises two second partitions 18 and two third partitions 19. The second partition 18 divides the inner cavity of the first side plate 13 into three spaces from bottom to top, and for convenience of description, the three spaces are numbered 1,2 and 3 from bottom to top. The liquid inlet 15 is communicated with the lower part of the No. 1 space, the liquid outlet 16 is communicated with the upper part of the No. 3 space, and a plurality of guide plates 17 are arranged in the No. 1 space and the No. 3 space of the first side plate 13. These baffles 17 are arranged in parallel, spaced apart, space within the space, preferably parallel to the first partition 12. And two long sides of the deflector 17 are preferably connected to the inner wall of the first side plate 13 or have only a very small gap, while two short sides (i.e. two ends) have a larger gap with the inner wall of the first side plate 13 to form a flow passage. In this embodiment, since the width of the first partition board 12 (i.e. the two ends of the first partition board) is wide, two groups of guide plates 17 are arranged in the No. 1 space and the No. 3 space of the first side board 13 side by side, and a flow channel is also arranged between the two groups of guide plates 17. In order to prevent the coolant from generating a laminar flow, each baffle 17 is further formed with a notch or a through hole 171, so that when the coolant flows in the inner cavity of the first side plate 13, a flow speed difference is generated, the coolant can be sufficiently mixed, and heat can be effectively and sufficiently absorbed and taken away by the coolant. The flow channel 121 of the first partition plate 12 located below in the two first partition plates is communicated with the upper part of the No. 1 space of the first side plate 13, so that after the No. 1 space is filled with the cooling liquid, the cooling liquid can flow through the first partition plate 12 located below and enter the cavity of the second side plate 14.

Similarly, the third partition plate 19 divides the inner cavity of the second side plate 14 into three spaces from bottom to top, and for convenience of description, the three spaces from bottom to top are also numbered 1,2, and 3. The flow channel 121 of the first partition plate 12 positioned at the lower side communicates with the lower portion of the No. 2 space of the second side plate 14, the flow channel of the first partition plate 12 positioned at the upper side communicates with the upper portion of the No. 2 space of the second side plate 14, and a plurality of flow deflectors 17 are disposed in the No. 2 space of the second side plate 14. These baffles 17 are disposed in parallel and spaced apart in the space No. 2 of the second side plate 14, preferably in parallel with the first partition 12. And the two long sides of the baffle 17 are preferably connected to the inner wall of the second side plate 14 or have only a small gap, while the two short sides (i.e. both ends) have a larger gap with the inner wall of the second side plate 14 to form a flow channel. In order to prevent the coolant from generating a laminar flow, each baffle 17 is further formed with a notch or a through hole 171, so that when the coolant flows in the inner cavity of the second side plate 14, turbulence is generated due to a flow speed difference, the coolant can be sufficiently mixed, and heat can be effectively and sufficiently absorbed and carried away by the coolant. The coolant flows through the space 2 of the second side plate 14, then flows through the first partition plate 12 located above, enters the space 3 of the first side plate 13, is fully mixed, and then flows out from the liquid outlet 16.

In addition, the number of the flow channels 121 in the first partition plate 12 is plural, and the flow channels are arranged in the first partition plate 12 at intervals, so that the cooling liquid is divided in each flow channel 121, a laminar flow with a large area cannot be formed in the first partition plate, and the first partition plate 12 can be fully and uniformly cooled. Meanwhile, the strength of the first partition plate 12 is enhanced due to the arrangement of the plurality of flow channels, so that the product can be prepared by using aluminum materials which are processed better.

In essence, the second partition plate 18 and the third partition plate 19 can also be regarded as special guide plates for guiding the cooling liquid to flow and mix according to a preset passage, preventing the cooling liquid from mixing and flowing only in the first side plate 13, and preventing the laminar flow phenomenon from occurring in the first side plate 13, the second side plate 14 and the first partition plate 12, so as to take away the heat conducted from the circuit board in time, and prevent the local high temperature of the circuit board from influencing the use of the circuit board.

In addition, the liquid inlet 15 is located lower than the first partition 12 located at the lowest layer, which can effectively prevent the occurrence of the laminar flow phenomenon in the cold plate assembly.

When a double-board card (that is, a double-layer circuit board or two circuit boards are installed in one housing) needs to be placed, the distance between the adjacent first partition plates 12 can be increased, or the distance between the bottom plate 10 and the first partition plate 12 is increased, or the distance between the top plate 11 and the first partition plate 12 is increased. For example, in the first embodiment, the distance between the bottom plate 10 and the first partition plate 12 is greater than the distance between two first partition plates 12, so that a double board card can be placed between the bottom plate 10 and the first partition plates 12. At this time, the strength of the cold plate assembly can be increased by adding the reinforcing plate 20 in the No. 1 space of the first side plate, and meanwhile, the occurrence of the laminar flow phenomenon can also be prevented. The long side of the reinforcing plate 20 is connected with the side wall of the No. 1 space of the first side plate, and a flow channel is formed between the two ends of the reinforcing plate and the side wall of the No. 1 space of the first side plate. The guide plates 17 are respectively disposed above and below the reinforcing plate 20.

In addition, when the length of the first partition plate 12 is longer, a support plate may be disposed between two first partition plates, between the first partition plate and the bottom plate, and between the first partition plate and the top plate to increase the strength of the cold plate assembly. One end of the supporting plate is connected with the first partition plate or the bottom plate below, and the other end of the supporting plate is connected with the first partition plate or the top plate above.

In the first embodiment, each baffle 17 has a notch or through hole 171 formed thereon. It is understood that in other embodiments, the notches or through holes 171 may be formed only in a portion of the baffles 17, and the notches or through holes 171 of the baffles adjacent to each other may be staggered and have different sizes, so long as the laminar flow is effectively prevented.

In the first embodiment, the baffles 17 are parallel to the first partition 12. It is understood that in other embodiments, the plurality of baffles 17 may not be parallel to the first partition 12 and may not be parallel to each other to guide the cooling fluid to flow and mix sufficiently within the inner cavities of the first side plate 13 and the second side plate 14.

In the first embodiment, the cold plate assembly includes two first partition plates 12. It will be appreciated that in other embodiments, the cold plate assembly may include three or more first baffles. When including even first baffle of piece, inlet 15 and liquid outlet 16 can all set up on first curb plate, and when including odd first baffle of piece, inlet and liquid outlet need set up respectively on first curb plate and second curb plate to make the coolant liquid flow through first baffle in proper order from lower to upper, realize distributed heat dissipation. Correspondingly, the number of the second partition plates 18 and the third partition plates 19 which are special flow guide plates is also changed in the same way (the number is the same as that of the first partition plates), and the corresponding flow guide plates are arranged in the inner cavities of the first side plate and the second side plate through which the cooling liquid needs to flow so as to guide the flow of the cooling liquid and fully mix the cooling liquid.

In the first embodiment, the second partition plate 18 and the third partition plate 19 are used as special guide plates to divide the inner cavities of the first side plate and the second side plate into three spaces, respectively. It will be appreciated that in other embodiments, the spaces within the first and second side plates through which no coolant flows may be provided as a solid structure during the manufacturing stage. Therefore, the inner cavities of the first side plate and the second side plate only comprise a plurality of containing spaces which are not directly communicated, and guide plates are arranged in the containing spaces. One end of the flow channel of the first partition plate is communicated with one of the accommodating spaces of the first side plate, the other end of the flow channel of the first partition plate is communicated with one of the accommodating spaces of the second side plate, and cooling liquid can sequentially flow through the accommodating spaces and the first partition plate in a preset mode, so that a good heat dissipation effect is achieved.

In the first embodiment, the liquid inlet 15 is disposed at the lower portion of the cold plate assembly, the liquid outlet 16 is disposed at the upper portion of the cold plate assembly, the position of the liquid inlet 15 is lower than the position of the first partition plate located at the lowermost layer, and the cooling liquid flows in the cold plate assembly from bottom to top in a meandering manner, so as to conveniently and effectively control the flow direction of the cooling liquid, fully mix the cooling liquid, and prevent the occurrence of laminar flow. It is understood that in other embodiments, the liquid inlet may be disposed at an upper portion of the cold plate assembly, and the liquid outlet may be disposed at a lower portion of the cold plate assembly, so that the cooling liquid meanders in the cold plate assembly from top to bottom. For example, the periphery of the guide plate can be connected with the inner walls of the first side plate and the second side plate, and the size and the position of the notch or the through hole on the guide plate and the angle of the guide plate are reasonably set to realize the purpose.

In the first embodiment, the cold plate assembly comprises the bottom plate 10 and the top plate 11, the flow channels are not arranged in the bottom plate 10 and the top plate 11, but the bottom plate 10 and the top plate 11 are also made of metal materials with good heat conduction performance, so that the effects of strengthening the overall strength of the cold plate assembly and improving the heat dissipation efficiency can be realized. It will be appreciated that in other embodiments, one or both of the top and bottom plates may be eliminated.

In the description of the present invention, it is to be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate orientations or positional relationships, are used based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and for the simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims (10)

1. A cold plate assembly, comprising:

the hollow first side plate is internally provided with a plurality of guide plates;

the hollow second side plate is internally provided with a plurality of guide plates;

a liquid inlet and a liquid outlet which are respectively arranged on the first side plate and the second side plate or on one of the first side plate and the second side plate; and

the two ends of each first partition board are connected with the side walls of the first side plate and the second side plate;

wherein, a flow passage communicated with the inner cavities of the first side plate and the second side plate is formed on the first clapboard.

2. The cold plate assembly of claim 1, wherein at least some of the plurality of baffles have notches or holes formed therein to prevent laminar flow.

3. The cold plate assembly according to claim 2, wherein the plurality of flow deflectors in the first side plate and the second side plate are spaced apart from and parallel to the first baffle, and wherein flow passages are formed between ends of the plurality of flow deflectors and an inner wall of the first side plate.

4. The cold plate assembly of claim 1, further comprising a plurality of second partitions dividing the interior cavity of the first side plate into spaces that are not in direct communication with each other and a plurality of third partitions dividing the interior cavity of the second side plate into spaces that are not in direct communication with each other; the number of the plurality of second partition plates and the number of the plurality of third partition plates are the same as the number of the plurality of first partition plates.

5. The cold plate assembly of claim 4, wherein the second partition plate and the third partition plate respectively divide the inner cavity of the first side plate and the inner cavity of the second side plate into a plurality of spaces from bottom to top, and the number of the plurality of spaces from bottom to top defining the first partition plate and the second partition plate is 1,2, … …, n in sequence, where n is an integer not zero, so that the plurality of guide plates in the first side plate are disposed in the spaces with odd numbers, the plurality of guide plates in the second side plate are disposed in the spaces with even numbers, and two ends of the flow channel of the first partition plate are respectively communicated with the spaces provided with the guide plates.

6. The cold plate assembly of claim 5, wherein the liquid inlet is disposed at a lower end of the first side plate and communicates with a space numbered 1 of the first side plate.

7. The cold plate assembly of claim 1, wherein the cavity defining said first side plate comprises a plurality of receiving spaces from bottom to top that are not in direct communication, the cavity defining said second side plate also comprises at least one receiving space from bottom to top that is not in direct communication, and said baffle is disposed within said receiving spaces; one end of the flow passage of the first partition board is communicated with one of the accommodating spaces of the first side board, and the other end of the flow passage of the first partition board is communicated with one of the accommodating spaces of the second side board.

8. The cold plate assembly of claim 1 further comprising a bottom plate disposed below the plurality of first partitions and a top plate disposed above the plurality of first partitions, wherein the bottom plate and the top plate are connected at opposite ends to the first side plate and the second side plate, respectively.

9. An integrated domain controller comprising a plurality of circuit boards, wherein the integrated domain controller further comprises the cold plate assembly of claim 1, wherein the plurality of circuit boards are disposed above or below the first partition, and wherein a circuit board or circuit board housing is in surface contact with the first partition.

10. A vehicle comprising the integrated domain controller of claim 9, wherein the inlet and outlet of the cold plate assembly of the integrated domain controller are connected to a vehicle coolant tank.

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