CN114928963A - Manufacturing and processing equipment for circuit board of motor controller - Google Patents

Manufacturing and processing equipment for circuit board of motor controller Download PDF

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Publication number
CN114928963A
CN114928963A CN202210840539.2A CN202210840539A CN114928963A CN 114928963 A CN114928963 A CN 114928963A CN 202210840539 A CN202210840539 A CN 202210840539A CN 114928963 A CN114928963 A CN 114928963A
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China
Prior art keywords
circuit board
fixedly connected
fixed cover
cover
movable cover
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CN202210840539.2A
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Chinese (zh)
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CN114928963B (en
Inventor
郭颖
李斌
聂浩
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Jiangsu Huibo Electromechanical Technology Co ltd
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Jiangsu Huibo Electromechanical Technology Co ltd
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4611Manufacturing multilayer circuits by laminating two or more circuit boards

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention provides a manufacturing and processing device for a motor controller circuit board, and relates to the technical field of circuit board processing. The motor controller circuit board manufacturing and processing equipment comprises: a base; the fixed cover mechanism is connected with the upper surface of the base; the fixed cover mechanism comprises a supporting seat, the upper surface of the base is fixedly connected with the supporting seat, the upper surface of the supporting seat is fixedly connected with a fixed cover with an upper opening and a lower opening, and the upper surface of the fixed cover is fixedly connected with a sealing ring; the upper surface of the supporting seat is fixedly connected with an electric connecting seat with an upward opening, and the electric connecting seat is positioned in the fixed cover; the vacuumizing mechanism is connected with the upper surface of the base, and an air inlet of the vacuumizing mechanism is communicated with an air outlet on the outer surface of the fixed cover; the opening of the movable cover is arranged downwards, and the movable cover is positioned right above the fixed cover. The manufacturing and processing equipment for the motor controller circuit board provided by the invention has the advantage of high laminating quality.

Description

Manufacturing and processing equipment for circuit board of motor controller
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a manufacturing and processing device for a motor controller circuit board.
Background
The multilayer circuit board refers to a printed board having three or more conductive pattern layers laminated with insulating materials therebetween at intervals, and the conductive patterns therebetween interconnected as required. The multilayer circuit board is a product of the development of electronic information technology in the directions of high speed, multiple functions, large capacity, small volume, thinness and light weight.
When the multilayer circuit board is processed, the multilayer circuit board needs to be pressed, at present, when the multilayer circuit board is pressed, the multilayer circuit board sub-boards are generally heated and pressed from the upper side and the lower side through the two heat plates arranged from top to bottom, and because the distance between each layer of circuit board sub-board and the heat plates is different, the temperature difference is formed between the upper layer and the lower layer of the circuit board sub-boards stacked in a multilayer manner, the resin between the circuit board sub-boards is heated unevenly, and the quality of circuit board pressing is influenced.
Therefore, it is necessary to provide a new manufacturing and processing equipment for a circuit board of a motor controller to solve the above technical problems.
Disclosure of Invention
In order to solve the technical problem, the invention provides the manufacturing and processing equipment of the motor controller circuit board, which is used for improving the pressing quality.
The invention provides a manufacturing and processing device of a motor controller circuit board, which comprises: a base; the fixed cover mechanism is connected with the upper surface of the base; the fixed cover mechanism comprises a supporting seat, the upper surface of the base is fixedly connected with the supporting seat, the upper surface of the supporting seat is fixedly connected with a fixed cover with an upper opening and a lower opening, and the upper surface of the fixed cover is fixedly connected with a sealing ring; the upper surface of the supporting seat is fixedly connected with an electric connecting seat with an upward opening, and the electric connecting seat is positioned in the fixed cover; the vacuumizing mechanism is connected with the upper surface of the base, and an air inlet of the vacuumizing mechanism is communicated with an air outlet on the outer surface of the fixed cover; the opening of the movable cover is arranged downwards, and the movable cover is positioned right above the fixed cover; the movable cover is connected with the base through the lifting mechanism, and the use height of the movable cover is adjusted through the work of the lifting mechanism; the pressing plate is connected in the movable cover in a sliding mode, and the movable cover is provided with a hydraulic cylinder for driving the pressing plate to move in the vertical direction; one part of the wire guide mechanism is electrically connected with the electric connecting plate in the pressing plate, and the other part of the wire guide mechanism is electrically connected with the electric connecting seat in the fixed cover mechanism; the upper end of the spiral coil heating mechanism is electrically connected with the pressing plate; through the work of elevating system and pneumatic cylinder for spiral coil heating mechanism and electric connection seat electric connection.
Preferably, the fixed cover mechanism further comprises a fixing ring, the upper surface of the fixed cover is fixedly connected with a fixing ring, and the inner wall of the fixing ring is fixedly connected with a sealing gasket.
Preferably, the spiral coil heating mechanism comprises an elastic resistance wire, and the lower surface of the pressing plate is fixedly connected with the elastic resistance wire which is spirally arranged; the upper end of the elastic resistance wire is electrically connected with an electrical connection plate in the pressing plate, the lower end of the elastic resistance wire is connected with an electrical connector, and the electrical connector is positioned below the movable cover; the lower surface of the pressing plate is fixedly connected with a silicon rubber elastic sleeve in a spiral arrangement, the silicon rubber elastic sleeve is located on the outer side of the elastic resistance wire, a heat-resistant air bag is fixedly connected to the surface, opposite to the elastic resistance wire, of the silicon rubber elastic sleeve, and a heat radiation reflection coating is coated on the outer surface of the heat-resistant air bag.
Preferably, the upper surface of the movable cover is connected with an air pump mechanism; the air outlet of the air pump mechanism is communicated with the heat-resistant air bag, and the air pump mechanism further comprises an automatic exhaust assembly for exhausting air in the heat-resistant air bag.
Preferably, the air pump mechanism comprises an air pump, the upper surface of the movable cover is fixedly connected with the air pump, an air outlet of the air pump is connected with one end of a connecting pipe, the other end of the connecting pipe penetrates through the movable cover and is connected with one end of a corrugated pipe, and the other end of the corrugated pipe is communicated with the heat-resistant air bag; the outer surface of the connecting pipe is fixedly connected with an exhaust pipe which is communicated with the connecting pipe, the exhaust pipe is positioned above the movable cover, and an electric control valve is arranged on the exhaust pipe.
Preferably, the conducting wire mechanism comprises a conducting post, the upper surface of the pressing plate is fixedly connected with the conducting post, the conducting post is electrically connected with the electric connection plate in the pressing plate, and the conducting post is connected in the conducting slide rail seat in a sliding manner; the conductive slide rail seat penetrates through the movable cover, and the upper end of the conductive slide rail seat is connected with a connecting wire; the outer surface of the fixed cover is fixedly connected with a wire holder, and the wire holder is electrically connected with the electric connection seat.
Preferably, the vacuum pumping mechanism comprises a vacuum pump, the upper surface of the base is fixedly connected with the vacuum pump, an air inlet of the vacuum pump is connected with one end of the vacuum tube, the other end of the vacuum tube is connected with an air outlet of the fixed cover, and the vacuum tube is provided with a vacuum pressure gauge.
Preferably, the lifting mechanism comprises a stand column, the upper surface of the base is fixedly connected with the stand column, and the top of the stand column is connected with the mounting plate; the upper surface of the mounting plate is provided with a motor, the output end of the motor is connected with a threaded rod through a coupler, and the threaded rod penetrates through the movable plate and is in threaded connection with the movable plate; one end of the movable plate is connected with the upright column in a sliding mode, and the other end of the movable plate is fixedly connected with the movable cover.
Preferably, the upper surface of the upright post is fixedly connected with a limiting post, and the limiting post penetrates through the mounting plate and is in sliding connection with the mounting plate; the lower surface of mounting panel connection spring's upper end, the lower extreme of spring and the upper surface connection of stand.
Compared with the related art, the manufacturing and processing equipment for the circuit board of the motor controller provided by the invention has the following beneficial effects:
the elastic resistance wire is wound around the outer part of the multilayer circuit board daughter boards, and the resin between the circuit board daughter boards is heated from the side surface through the elastic resistance wire, so that the temperature difference between the upper layer and the lower layer of the multilayer stacked circuit board daughter boards is avoided when the circuit board daughter boards are heated from the upper side and the lower side, the resin is heated more uniformly, and the pressing quality of the circuit board is improved.
Drawings
FIG. 1 is a schematic structural diagram of a manufacturing apparatus for a circuit board of a motor controller according to a preferred embodiment of the present invention;
FIG. 2 is a schematic structural diagram of the lifting mechanism shown in FIG. 1;
FIG. 3 is a schematic rear view of the apparatus for manufacturing and processing a circuit board of a motor controller shown in FIG. 1;
FIG. 4 is a schematic structural view of the fixed cover mechanism shown in FIG. 3;
fig. 5 is a schematic view of a partial cross-sectional structure of the manufacturing equipment for the circuit board of the motor controller shown in fig. 1;
FIG. 6 is a schematic view of a partial structure of the manufacturing equipment for the circuit board of the motor controller shown in FIG. 1;
FIG. 7 is a schematic structural view of the air pump mechanism shown in FIG. 6;
FIG. 8 is a schematic cross-sectional structural view of the spiral coil heating mechanism shown in FIG. 6;
fig. 9 is a partial enlarged view of a portion a in fig. 8.
Reference numbers in the figures: 1. a lifting mechanism; 11. a spring; 12. a column; 13. a limiting post; 14. an electric motor; 15. mounting a plate; 16. a movable plate; 17. a threaded rod; 2. a movable cover; 3. an air pump mechanism; 31. an air pump; 32. a connecting pipe; 33. a bellows; 34. an electrically controlled valve; 35. an exhaust pipe; 4. a base; 5. a wire guide mechanism; 51. a conductive slide rail seat; 52. a conductive post; 53. a connecting wire; 54. a wire holder; 6. a fixed cover mechanism; 61. a fixed cover; 62. an electrical connection seat; 63. a fixing ring; 64. a supporting seat; 7. a vacuum pumping mechanism; 71. a vacuum pressure gauge; 72. a vacuum tube; 73. a vacuum pump; 8. a helical coil heating mechanism; 81. an electrical connector; 82. an elastic resistance wire; 83. a silicone rubber elastic sleeve; 84. a heat resistant air bag; 85. a thermal radiation reflective coating; 9. pressing a plate; 9a and a hydraulic cylinder.
Detailed Description
The invention is further described with reference to the following figures and embodiments.
Referring to fig. 1 to 9, the apparatus for manufacturing and processing a circuit board of a motor controller includes: a base 4; the fixed cover mechanism 6 is connected with the upper surface of the base 4; the vacuumizing mechanism 7 is connected with the upper surface of the base 4, and an air inlet of the vacuumizing mechanism 7 is communicated with an air outlet in the outer surface of the fixed cover 61; the opening of the movable cover 2 is arranged downwards, and the movable cover 2 is positioned right above the fixed cover 61; the movable cover 2 is connected with the base 4 through the lifting mechanism 1, and the use height of the movable cover 2 is adjusted through the work of the lifting mechanism 1; the pressing plate 9 is connected in the movable cover 2 in a sliding mode, and the movable cover 2 is provided with a hydraulic cylinder 9a used for driving the pressing plate 9 to move in the vertical direction; a wire mechanism 5, wherein one part of the wire mechanism 5 is electrically connected with the electrical connection board in the pressing board 9, and the other part of the wire mechanism 5 is electrically connected with the electrical connection seat 62 inside the fixed cover mechanism 6; the upper end of the spiral coil heating mechanism 8 is electrically connected with the pressing plate 9; the lifting mechanism 1 and the hydraulic cylinder 9a are operated to electrically connect the spiral coil heating mechanism 8 with the electrical connection base 62.
Need to explain: when the device is used, a circuit board daughter board to be pressed is placed in the fixed cover 61, and the lifting mechanism 1 works to enable the movable cover 2 and the fixed cover 61 to be combined in a sealing mode and form a sealing pressing cabin; then, the pressing plate 9 moves downwards through the work of the hydraulic cylinder 9a, and the circuit board sub-boards are extruded through the pressing plate 9, so that the circuit board sub-boards are pressed together;
it is also necessary to state: when the circuit board daughter boards are pressed, the spiral coil heating mechanism 8 is arranged around the circuit board daughter boards, and the spiral coil heating mechanism 8 is connected with an external power supply through the lead mechanism 5, so that the external spiral coil heating mechanism 8 generates heat, the sealed pressing bin is heated, and the prepreg (resin) between the circuit board daughter boards is further melted; the elastic resistance wire 82 in the spiral coil heating mechanism 8 is arranged around the circuit board daughter board, so that side heating is realized, and the temperature difference between the upper layer and the lower layer of the circuit board daughter boards stacked in multiple layers is avoided when heating is carried out from the upper side and the lower side, so that the prepreg is heated more uniformly, and the laminating quality of the circuit board is improved;
it is also necessary to state: when the multilayer circuit board daughter boards are pressed, after the multilayer circuit board daughter boards are placed in the fixed cover 61, the multilayer circuit board daughter boards do not need to move, so that the probability of displacement among the multilayer circuit board daughter boards is reduced, the probability of interlayer slippage of the circuit board is reduced, and the pressing quality of the circuit board is further improved;
it is also necessary to state: through the work of the vacuumizing mechanism 7, the fluidity of resin between the circuit boards and the daughter boards can be improved, the interlayer bonding force is increased, the circuit boards and the daughter boards can be prevented from being deformed due to thermal stress during cooling, and the quality of circuit board lamination is improved.
Referring to fig. 1, 3 and 4, the fixed cover mechanism 6 includes a supporting seat 64, the supporting seat 64 is fixedly connected to the upper surface of the base 4, a fixed cover 61 with an upper opening and a lower opening is fixedly connected to the upper surface of the supporting seat 64, and a sealing ring is fixedly connected to the upper surface of the fixed cover 61; the upper surface of the supporting base 64 is fixedly connected to the electrical connection base 62 with an upward opening, and the electrical connection base 62 is located in the fixing cover 61.
The following description is required: the circuit board daughter boards to be press-fitted are stacked in the fixed cover 61, and when the fixed cover 61 is fitted to the movable cover 2, the gap between the fixed cover 61 and the movable cover 2 can be sealed by the seal ring.
Referring to fig. 4, the fixed cover mechanism 6 further includes a fixed ring 63, the upper surface of the fixed cover 61 is fixedly connected with the fixed ring 63, and the inner wall of the fixed ring 63 is fixedly connected with a sealing gasket.
The following description is required: the contact area between the fixed ring 63 and the movable cover 2 can be increased, and the gasket can also play a role of sealing, thereby improving the reliability of sealing between the fixed cover 61 and the movable cover 2.
Referring to fig. 1, 5, 8 and 9, the spiral coil heating mechanism 8 includes an elastic resistance wire 82, and the lower surface of the pressing plate 9 is fixedly connected with the elastic resistance wire 82 which is spirally arranged; the upper end of the elastic resistance wire 82 is electrically connected with an electrical connection plate in the pressing plate 9, the lower end of the elastic resistance wire 82 is connected with an electrical connector 81, and the electrical connector 81 is positioned below the movable cover 2; the lower surface of the pressing plate 9 is also fixedly connected with a silicone rubber elastic sleeve 83 which is spirally arranged, the silicone rubber elastic sleeve 83 is positioned on the outer side of the elastic resistance wire 82, the surface of the silicone rubber elastic sleeve 83 opposite to the elastic resistance wire 82 is fixedly connected with a heat-resistant air bag 84, and the outer surface of the heat-resistant air bag 84 is coated with a heat radiation reflection coating 85.
Need to explain: two ends of the lead mechanism 5 are respectively connected with the positive electrode and the negative electrode of an external power supply, and when the pressing plate 9 moves downwards, the electric connector 81 is inserted into the electric connecting seat 62, so that power supply at two ends of the elastic resistance wire 82 is realized, and the elastic resistance wire 82 is heated; the elastic resistance wire 82 surrounds the outer part of the multilayer circuit board daughter boards, and the resin between the circuit board daughter boards is heated from the side surface through the elastic resistance wire 82, so that the temperature difference between the upper layer and the lower layer of the multilayer stacked circuit board daughter boards is avoided when the circuit board daughter boards are heated from the upper side and the lower side, the resin is heated more uniformly, and the circuit board lamination quality is improved;
it is also stated that: the silicon rubber elastic sleeve 83 and the heat-resistant air bag 84 can shield heat emitted by the elastic resistance wire 82, and the silicon rubber elastic sleeve 83 is positioned on the outer side of the elastic resistance wire 82, so that the heat can be better radiated towards the circuit board daughter board, and the heating effect of the device is improved;
it is also stated that: the silicone rubber elastic sleeve 83 has elasticity and heat resistance, so that when the silicone rubber elastic sleeve 83 is not stressed, the electrical connector 81 extends to the lower part of the movable cover 2, and the electrical connector 81 can be stably inserted into the electrical connection seat 62; meanwhile, the elastic silicone rubber sleeve 83 has elasticity, so that the fatigue rate of the elastic resistance wire 82 can be reduced and the service life of the elastic resistance wire 82 can be prolonged through the deformation of the elastic silicone rubber sleeve 83.
Referring to fig. 1, 5, 6 and 7, an air pump mechanism 3 is connected to the upper surface of the movable hood 2; the air outlet of the air pump mechanism 3 is communicated with the heat-resistant air bag 84, and the air pump mechanism 3 further comprises an automatic exhaust assembly for exhausting air in the heat-resistant air bag 84.
The following description is required: the air pump mechanism 3 can be operated to inflate the heat-resistant air bag 84 so as to inflate the heat-resistant air bag 84, so that the heat-resistant air bag 84 can form an air heat insulation layer; meanwhile, when the heat-resistant air bag 84 is inflated and expanded, the surface of the heat-resistant air bag 84 is tightened, the heat radiation reflecting coating 85 coated on the surface of the heat-resistant air bag 84 is completely expanded, and outward heat radiation is reflected back through the heat radiation reflecting coating 85, so that the heat radiation towards the circuit board daughter board is further facilitated, and the heating rate is improved;
when the gas in the heat-resistant air bag 84 is exhausted through the automatic exhaust assembly, an air insulation layer is not formed inside the heat-resistant air bag 84, and the heat radiation reflection coating 85 coated on the surface of the heat-resistant air bag 84 is not completely spread, so that the amount of heat radiated toward the circuit board sub-board is reduced, and the heating rate is reduced; the heat radiation reflective coating 85 may be a silver ion heat radiation reflective layer;
to sum up, the heating rate of the device can be adjusted by inflating and deflating the heat-resistant air bag 84, so that the melting speed of the resin between the circuit board sub-boards is adjusted, and the pressing quality of the circuit board is improved.
Referring to fig. 1, 5, 6 and 7, the air pump mechanism 3 includes an air pump 31, the upper surface of the movable cover 2 is fixedly connected with the air pump 31, an air outlet of the air pump 31 is connected with one end of a connecting pipe 32, the other end of the connecting pipe 32 penetrates through the movable cover 2 and is connected with one end of a corrugated pipe 33, and the other end of the corrugated pipe 33 is communicated with the heat-resistant air bag 84; the outer surface of the connecting pipe 32 is fixedly connected with an exhaust pipe 35 which is communicated with the connecting pipe, the exhaust pipe 35 is positioned above the movable cover 2, and an electric control valve 34 is arranged on the exhaust pipe 35.
Need to explain: by the operation of the air pump 31, the heat-resistant air bag 84 can be inflated, so that the heat-resistant air bag 84 is inflated and expanded, and the heat-resistant air bag 84 can form an air heat insulation layer; meanwhile, when the heat-resistant air bag 84 is inflated and expanded, the surface of the heat-resistant air bag 84 is tightened, the heat radiation reflecting coating 85 coated on the surface of the heat-resistant air bag 84 is completely expanded, and outward heat radiation is reflected back through the heat radiation reflecting coating 85, so that the heat radiation towards the circuit board daughter board is further facilitated, and the heating rate is improved;
when the electrically controlled valve 34 is opened, the gas passing through the heat resistant air bag 84 can be discharged through the gas discharge pipe 35; an air insulation layer is not formed inside the heat-resistant air bag 84, and the heat radiation reflection coating 85 coated on the surface of the heat-resistant air bag 84 is not completely spread, so that the heat radiated toward the circuit board daughter board is reduced, and the heating rate is reduced;
in summary, the heating rate of the device can be adjusted by inflating and deflating the heat-resistant air bag 84, so as to adjust the melting speed of the resin between the circuit board daughter boards and improve the pressing quality of the circuit board.
Referring to fig. 1, 3 and 6, the wire guiding mechanism 5 includes a conductive column 52, the conductive column 52 is fixedly connected to the upper surface of the pressing plate 9, the conductive column 52 is electrically connected to the electrical connection board in the pressing plate 9, and the conductive column 52 is slidably connected in the conductive sliding rail seat 51; the conductive slide rail seat 51 penetrates through the movable cover 2, and the upper end of the conductive slide rail seat 51 is connected with a connecting wire 53; the outer surface of the fixing cover 61 is fixedly connected with the wire holder 54, and the wire holder 54 is electrically connected with the electrical connection seat 62.
Need to explain: the connecting wire 53 is electrically connected with an electrical connecting plate in the pressing plate 9 through the conductive slide rail seat 51 and the conductive column 52, and the electrical connecting plate is electrically connected with one end of the elastic resistance wire 82, so that a path of the connecting wire 53, the conductive slide rail seat 51, the conductive column 52, the electrical connecting plate and one end of the elastic resistance wire 82 is formed; when the electrical connector 81 is plugged into the electrical connector base 62, the other end of the elastic resistance wire 82 is electrically connected to the electrical connector base 62, and the electrical connector base 62 is electrically connected to the wire holder 54, so as to form a path between the wire holder 54, the electrical connector base 62, and the other end of the elastic resistance wire 82, and since the wire holder 54 and the connecting wire 53 are respectively electrically connected to the positive and negative electrodes of the external power supply, a loop is formed at the two ends of the elastic resistance wire 82, so that the elastic resistance wire 82 generates heat;
it is also stated that: the conductive posts 52 can slide in the conductive slide rail seat 51, and when sliding, the conductive slide rail seat 51 can be stably electrically connected with the conductive posts 52, so as to ensure that the electrical connection board in the pressing board 9 is stably electrically connected with the connection line 53 when the pressing board 9 moves.
Referring to fig. 1 and 3, the vacuum pumping mechanism 7 includes a vacuum pump 73, the vacuum pump 73 is fixedly connected to the upper surface of the base 4, an air inlet of the vacuum pump 73 is connected to one end of a vacuum tube 72, the other end of the vacuum tube 72 is connected to an air outlet of the fixed cover 61, and a vacuum pressure gauge 71 is mounted on the vacuum tube 72.
Need to explain: when the fixed cover 61 and the movable cover 2 are combined to form a sealed pressing cabin, the vacuum pump 73 works to vacuumize the inside of the sealed pressing cabin, so that when the circuit board daughter boards are pressed, resin fluidity between the circuit board daughter boards can be improved due to the vacuum inside the sealed pressing cabin, interlayer bonding force is increased, the circuit board daughter boards can be prevented from being deformed due to thermal stress during cooling, and the quality of circuit board pressing is improved;
it is also stated that: the vacuum degree in the sealing and pressing bin can be visually displayed through the vacuum pressure gauge 71, and operation of operators is facilitated.
Referring to fig. 1 and 2, the lifting mechanism 1 includes a column 12, the column 12 is fixedly connected to the upper surface of the base 4, and the top of the column 12 is connected to a mounting plate 15; the upper surface of the mounting plate 15 is provided with a motor 14, the output end of the motor 14 is connected with a threaded rod 17 through a coupler, and the threaded rod 17 penetrates through the movable plate 16 and is in threaded connection with the movable plate 16; one end of the movable plate 16 is connected with the upright post 12 in a sliding manner, and the other end of the movable plate 16 is fixedly connected with the movable cover 2.
Need to explain: the movable plate 16 can move up and down along the threaded rod 17 by the operation of the motor 14, so as to drive the movable cover 2 to move up and down in the vertical direction; when the motor 14 rotates forwards and the movable cover 2 moves downwards, the movable cover and the fixed cover 61 are combined to form a sealed pressing cabin; when the circuit board is pressed, the motor 14 rotates reversely, and the movable cover 2 moves upwards, so that the circuit board can be taken conveniently after pressing.
Referring to fig. 2, a limiting column 13 is fixedly connected to the upper surface of the upright post 12, and the limiting column 13 penetrates through the mounting plate 15 and is slidably connected with the mounting plate 15; the lower surface of the mounting plate 15 is connected with the upper end of the spring 11, and the lower end of the spring 11 is connected with the upper surface of the upright post 12.
Need to explain: the vibration energy of the motor 14 during working can be absorbed, buffered and released through the spring 11, so that the influence of the working of the motor 14 on the circuit board daughter boards stacked in the fixed cover 61 is reduced, the probability of interlayer slippage of the circuit board daughter boards is reduced, and the pressing quality of the circuit board is improved.
The working principle of the motor controller circuit board manufacturing and processing equipment provided by the invention is as follows:
the invention works through the motor 14, so that the movable plate 16 can move up and down along the threaded rod 17, thereby driving the movable cover 2 to move up and down in the vertical direction; when the motor 14 rotates forwards and the movable cover 2 moves downwards, the movable cover and the fixed cover 61 are combined to form a sealed pressing cabin; the vacuum pump 73 is operated to vacuumize the inside of the sealed pressing cabin, so that when the circuit board daughter boards are pressed, the fluidity of resin between the circuit board daughter boards can be improved due to the vacuum inside the sealed pressing cabin, the interlayer bonding force is increased, the circuit board daughter boards can be prevented from being deformed due to thermal stress during cooling, and the pressing quality of the circuit board is improved;
two ends of the lead mechanism 5 are respectively connected with the positive electrode and the negative electrode of an external power supply, and when the pressing plate 9 moves downwards, the electric connector 81 is inserted into the electric connecting seat 62, so that power supply of two ends of the elastic resistance wire 82 is realized, and the elastic resistance wire 82 is heated; the elastic resistance wire 82 surrounds the outer part of the multilayer circuit board daughter boards, and the resin between the circuit board daughter boards is heated from the side surface through the elastic resistance wire 82, so that the temperature difference between the upper layer and the lower layer of the multilayer stacked circuit board daughter boards is avoided when the circuit board daughter boards are heated from the upper side and the lower side, the resin is heated more uniformly, and the circuit board lamination quality is improved;
the air pump 31 works to inflate the heat-resistant air bag 84, so that the heat-resistant air bag 84 is inflated and expanded, and the heat-resistant air bag 84 can form an air heat insulation layer; meanwhile, when the heat-resistant air bag 84 is inflated and expanded, the surface of the heat-resistant air bag 84 is tightened, the heat radiation reflecting coating 85 coated on the surface of the heat-resistant air bag 84 is completely expanded, and outward heat radiation is reflected back through the heat radiation reflecting coating 85, so that heat radiation towards the circuit board sub-board is further facilitated, and the heating rate is increased; when the electric control valve 34 is opened, the gas passing through the heat-resistant air bag 84 can be discharged through the exhaust pipe 35; an air insulation layer is not formed inside the heat-resistant air bag 84, and the heat radiation reflection coating 85 coated on the surface of the heat-resistant air bag 84 is not completely spread, so that the heat radiated toward the circuit board daughter board is reduced, and the heating rate is reduced; in summary, the heating rate of the device can be adjusted by inflating and deflating the heat-resistant air bag 84, so as to adjust the melting speed of the resin between the circuit board daughter boards and improve the pressing quality of the circuit board.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (9)

1. Machine controller circuit board manufacturing equipment, its characterized in that includes:
a base (4);
the fixed cover mechanism (6), the fixed cover mechanism (6) is connected with the upper surface of the base (4); the fixed cover mechanism (6) comprises a supporting seat (64), the supporting seat (64) is fixedly connected to the upper surface of the base (4), a fixed cover (61) with an upper opening and a lower opening is fixedly connected to the upper surface of the supporting seat (64), and a sealing ring is fixedly connected to the upper surface of the fixed cover (61); the upper surface of the supporting seat (64) is fixedly connected with an electrical connection seat (62) with an upward opening, and the electrical connection seat (62) is positioned in the fixed cover (61);
the vacuumizing mechanism (7), the vacuumizing mechanism (7) is connected with the upper surface of the base (4), and an air inlet of the vacuumizing mechanism (7) is communicated with an air outlet on the outer surface of the fixed cover (61);
the opening of the movable cover (2) is arranged downwards, and the movable cover (2) is positioned right above the fixed cover (61); the movable cover (2) is connected with the base (4) through the lifting mechanism (1), and the use height of the movable cover (2) is adjusted by working through the lifting mechanism (1);
the pressing plate (9) is connected in the movable cover (2) in a sliding mode, and a hydraulic cylinder (9 a) used for driving the pressing plate (9) to move in the vertical direction is installed on the movable cover (2);
the lead mechanism (5), one part of the lead mechanism (5) is electrically connected with the electrical connection plate in the pressing plate (9), and the other part of the lead mechanism (5) is electrically connected with the electrical connection seat (62) in the fixed cover mechanism (6);
the upper end of the spiral coil heating mechanism (8) is electrically connected with the pressing plate (9); the spiral coil heating mechanism (8) is electrically connected with the electric connection seat (62) through the work of the lifting mechanism (1) and the hydraulic cylinder (9 a).
2. The machine controller circuit board manufacturing and processing equipment according to claim 1, wherein the fixing cover mechanism (6) further comprises a fixing ring (63), the fixing ring (63) is fixedly connected to the upper surface of the fixing cover (61), and a sealing gasket is fixedly connected to the inner wall of the fixing ring (63).
3. The manufacturing and processing equipment for the motor controller circuit board as claimed in claim 2, wherein the spiral coil heating mechanism (8) comprises an elastic resistance wire (82), and the elastic resistance wire (82) which is spirally arranged is fixedly connected to the lower surface of the pressing plate (9); the upper end of the elastic resistance wire (82) is electrically connected with an electric connection plate in the pressing plate (9), the lower end of the elastic resistance wire (82) is connected with an electric connector (81), and the electric connector (81) is positioned below the movable cover (2); the lower surface of clamp plate (9) is fixedly connected with silicon rubber elastic sleeve (83) that the spiral set up still, and silicon rubber elastic sleeve (83) are located the outside of elastic resistance wire (82), and silicon rubber elastic sleeve (83) and the relative heat-resisting gasbag (84) of face fixedly connected with of elastic resistance wire (82), and the surface coating of heat-resisting gasbag (84) has heat radiation reflection coating (85).
4. The motor controller circuit board manufacturing and processing equipment according to claim 3, wherein an air pump mechanism (3) is connected to the upper surface of the movable cover (2); the air outlet of the air pump mechanism (3) is communicated with the heat-resistant air bag (84), and the air pump mechanism (3) further comprises an automatic exhaust assembly for exhausting air in the heat-resistant air bag (84).
5. The manufacturing and processing equipment of the motor controller circuit board according to claim 4, wherein the air pump mechanism (3) comprises an air pump (31), the upper surface of the movable cover (2) is fixedly connected with the air pump (31), an air outlet of the air pump (31) is connected with one end of a connecting pipe (32), the other end of the connecting pipe (32) penetrates through the movable cover (2) and is connected with one end of a corrugated pipe (33), and the other end of the corrugated pipe (33) is communicated with the heat-resistant air bag (84); the outer surface of the connecting pipe (32) is fixedly connected with an exhaust pipe (35) communicated with the connecting pipe, the exhaust pipe (35) is positioned above the movable cover (2), and an electric control valve (34) is installed on the exhaust pipe (35).
6. The manufacturing and processing equipment for the circuit board of the motor controller according to claim 3 or 5, wherein the wire guiding mechanism (5) comprises a conductive column (52), the conductive column (52) is fixedly connected to the upper surface of the pressing plate (9), the conductive column (52) is electrically connected to an electrical connection plate in the pressing plate (9), and the conductive column (52) is slidably connected in the conductive sliding rail seat (51); the conductive slide rail seat (51) penetrates through the movable cover (2), and the upper end of the conductive slide rail seat (51) is connected with a connecting wire (53); the outer surface of the fixed cover (61) is fixedly connected with a wire holder (54), and the wire holder (54) is electrically connected with the electrical connection seat (62).
7. The machine controller circuit board manufacturing and processing equipment according to claim 6, wherein the vacuum pumping mechanism (7) comprises a vacuum pump (73), the vacuum pump (73) is fixedly connected to the upper surface of the base (4), an air inlet of the vacuum pump (73) is connected to one end of a vacuum tube (72), the other end of the vacuum tube (72) is connected to an air outlet of the fixed cover (61), and a vacuum pressure gauge (71) is installed on the vacuum tube (72).
8. The manufacturing and processing equipment of the motor controller circuit board according to any one of claims 1-5, wherein the lifting mechanism (1) comprises a vertical column (12), the vertical column (12) is fixedly connected to the upper surface of the base (4), and the top of the vertical column (12) is connected with a mounting plate (15); the upper surface of the mounting plate (15) is provided with an electric motor (14), the output end of the electric motor (14) is connected with a threaded rod (17) through a coupler, and the threaded rod (17) penetrates through the movable plate (16) and is in threaded connection with the movable plate (16); one end of the movable plate (16) is connected with the upright post (12) in a sliding way, and the other end of the movable plate (16) is fixedly connected with the movable cover (2).
9. The manufacturing and processing equipment for the motor controller circuit board according to claim 8, characterized in that a limiting column (13) is fixedly connected to the upper surface of the upright column (12), and the limiting column (13) penetrates through the mounting plate (15) and is slidably connected with the mounting plate (15); the lower surface of the mounting plate (15) is connected with the upper end of the spring (11), and the lower end of the spring (11) is connected with the upper surface of the upright post (12).
CN202210840539.2A 2022-07-18 2022-07-18 Manufacturing and processing equipment for circuit board of motor controller Active CN114928963B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154922A (en) * 1997-07-31 1999-02-26 Matsushita Electric Works Ltd Manufacturing inner layer circuit-contg. laminate board
CN207118082U (en) * 2017-07-19 2018-03-16 江西凯强实业有限公司 A kind of flexible print circuit board press fit device
CN214960367U (en) * 2020-12-12 2021-11-30 深圳市仁创艺电子有限公司 A compression fittings for processing of multilayer circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154922A (en) * 1997-07-31 1999-02-26 Matsushita Electric Works Ltd Manufacturing inner layer circuit-contg. laminate board
CN207118082U (en) * 2017-07-19 2018-03-16 江西凯强实业有限公司 A kind of flexible print circuit board press fit device
CN214960367U (en) * 2020-12-12 2021-11-30 深圳市仁创艺电子有限公司 A compression fittings for processing of multilayer circuit board

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