CN114914331A - LED core particle arrangement method - Google Patents
LED core particle arrangement method Download PDFInfo
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- CN114914331A CN114914331A CN202210360599.4A CN202210360599A CN114914331A CN 114914331 A CN114914331 A CN 114914331A CN 202210360599 A CN202210360599 A CN 202210360599A CN 114914331 A CN114914331 A CN 114914331A
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- 239000007771 core particle Substances 0.000 title claims abstract description 95
- 238000000034 method Methods 0.000 title claims abstract description 17
- 235000012431 wafers Nutrition 0.000 abstract description 58
- 238000010586 diagram Methods 0.000 description 4
- 230000003321 amplification Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
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Abstract
The invention discloses a method for arranging LED core particles; s1: taking LED core particles which are from a wafer I and have a BIN value alpha, and sequentially arranging the LED core particles in the placing part along a first preset path; s2: taking LED core particles which come from a wafer II and have a BIN value alpha, and sequentially arranging the LED core particles in the placing part along a second preset path; repeating the above steps S1 and S2 in sequence to distribute the LED core particles having the BIN value alpha from the first wafer and the second wafer respectively in the whole placing part; the first preset path and the second preset path have the same direction; LED core particles from different wafers are uniformly distributed, and the LED core particles at the placement part are stable and reliable to use.
Description
Technical Field
The invention relates to an LED core particle arrangement method.
Background
The existing LED is used for an application scene, LED core particles from a plurality of wafers and having the same BIN value are integrated into an application module, and the LED core particles of each wafer are sequentially picked out, so that the LED core particles from the same wafer are integrated into one area of the application module; although the BIN values of all the LED dies are the same, the parameters (brightness, light intensity, wavelength, etc.) covered by the BIN values of the LED dies from different wafers still have differences due to the differences of the parameters of different wafers; therefore, the LED core particles from different wafers have regional display light intensity difference amplification on the application module, and the whole application module has poor display uniformity.
Disclosure of Invention
In order to at least improve the technical problem, the uniformity of the LED core particles on the application module is improved; the invention provides an LED core particle arrangement method.
The technical scheme of the invention is as follows: a method for arranging LED core particles is provided,
s1: taking LED core particles which are from a wafer I and have a BIN value alpha, and sequentially arranging the LED core particles in the placing part along a first preset path;
s2: taking LED core particles which come from a wafer II and have a BIN value alpha, and sequentially arranging the LED core particles in the placing part along a second preset path;
repeating the above steps S1 and S2 in sequence to distribute the LED core particles which are respectively from the first wafer and the second wafer and have the BIN value alpha to the whole placing part; the first preset path and the second preset path have the same direction.
Furthermore, the first preset path and the second preset path are both composed of a group of preset core grain position coordinates.
Further, the first preset path and the second preset path are both straight lines.
Furthermore, the first preset path and the second preset path both penetrate through the rows/columns of the placing part.
Furthermore, any two core particles from the same wafer are not adjacent to each other in the whole placement part.
Further, S3: taking LED core particles with a BIN value alpha from a wafer III, and sequentially arranging the LED core particles along a third preset path;
repeating the above steps S1, S2 and S3 in sequence to make the LED core particles respectively from the first wafer, the second wafer and the third wafer, and having the BIN value alpha, distributed on the whole placing part; the third preset path has the same direction as the first preset path.
Further, the LED core particle is a miniLED.
Further, the placing part is an LED backlight module.
Further, the first preset path and/or the second preset path cross the position coordinates outside the placing part.
Further, when the first preset path has a switching direction between a lower left position and a lower right position, the position coordinates corresponding to the switching direction are provided with position coordinates adjacent to each other along the downward direction.
The invention has the beneficial effects that: the LED core particles from different wafers are uniformly distributed, the LED core particles of the placement portion are stable and reliable to use, the LED crystal particles of the placement portion are uniform in light emitting effect, and the difference of light emitting and color caused by the fact that the LED crystal particles from the same wafer are concentrated in one area is avoided.
Drawings
FIG. 1 is a schematic flow chart of the technical solution of the present invention;
FIG. 2 is a schematic view of a circular placement portion;
FIG. 3 is a schematic view of a square placement portion;
FIG. 4 is a schematic view of the first predetermined path being a straight line;
FIG. 5 is a schematic diagram of the first predetermined path being a diagonal straight line;
FIG. 6 is a schematic view of a first predetermined path being a diagonal line where adjacent LED chips are not adjacent;
FIG. 7 is a schematic diagram of a first predetermined path with adjacent LED core particles;
FIG. 8 is a schematic diagram of the first predetermined path including the region outside the placement region;
FIG. 9 is a schematic diagram of the first predetermined path crossing the row number and the wafer number.
Detailed Description
In order to facilitate the understanding of the technical solutions of the present invention by those skilled in the art, the technical solutions of the present invention will be described in further detail with reference to specific examples.
As shown in fig. 1 to 8, the technical solution of the present invention is, an LED core particle arrangement method,
s1: taking LED core particles which come from a wafer I and have a BIN value alpha, sequentially arranging the LED core particles on the placing part 30 along a first preset path (21 a, 21b, 21c and 21 d), wherein the positions where the LED core particles are placed are regions indicated by grids of the placing part 30, the position coordinates are grid center coordinates/grid corner coordinates, limitation is not made, and only the values of the position coordinates need to be unified into the grid center coordinates, the grid corner coordinates or other coordinates; ensuring that the parameters from the wafer one, such as the luminous intensity of the LED core particles arranged along the first preset paths (21 a, 21b, 21c and 21 d), have consistency;
s2: taking LED core particles with a BIN value alpha from a wafer II, and sequentially arranging the LED core particles on the placing part 30 along second preset paths (22 a, 22b, 22c and 22 d); ensuring that the LED core particles placed along the second preset paths (22 a, 22b, 22c, 22 d) have consistent luminous intensity and other parameters from the wafer I;
the placing part 30 is a component or assembly for placing the LED core particles, the LED core particles arranged in the placing part 30 can be directly used for backlight display or direct light display, or can be used in an application scene after being packaged, and the functional structure of the placing part 30 is not limited herein; the position of the placing part 30 where the LED core particles are placed has a specific position coordinate, and is used for corresponding the LED core particles to the corresponding position coordinate;
repeating the above steps S1 and S2 in sequence, so that the LED chips from the first wafer and the second wafer, respectively, and having the BIN value α are distributed over the entire placement portion 30; the first preset path (21 a, 21b, 21c, 21 d) and the second preset path (22 a, 22b, 22c, 22 d) have the same direction, and the position coordinates of the first preset path (21 a, 21b, 21c, 21 d) and the position coordinates of the second preset path (22 a, 22b, 22c, 22 d) cannot be interpreted as the same; only the relative directions of the adjacent position coordinates along the first preset paths (21 a, 21b, 21c, 21 d) in the position coordinates forming the first preset paths (21 a, 21b, 21c, 21 d) are the same, and the relative direction is that at least one of the upper, lower, left and right directions is the same;
as shown in fig. 8, since the position coordinates covered by the placing portion 30 do not necessarily completely match the preset paths (the first preset path 21 and the second preset path 22), the position coordinates included in the existing preset paths (the first preset path 21 and the second preset path 22) do not belong to the placing portion 30, that is, the position (31) outside the domain of the preset paths (including but not limited to the first preset path 21 and the second preset path 22) does not need to place the LED core particles, and the first preset paths (21 a, 21b, 21c and 21 d) and/or the second preset paths (22 a, 22b, 22c and 22 d) are set to cross the position coordinates outside the placing portion 30, so as to improve the efficiency of transferring the LED core particles to the placing portion 30; although the out-of-domain position (31) causes the actual motion trajectory of the first preset path 21d to be different from the preset trajectory, the skilled person will certainly consider the preset path (including without limitation, the first preset path 21 and the second preset path 22) in this case to be the same, and this shall not be taken as a basis for the technical solution of the present patent application that the description is unclear and cannot be equivalent.
For the explanation of the LED core particle with the BIN value α, the BIN value in this patent application refers to a parameter of a wafer (including but not limited to wafer one and wafer two) test, the BIN value represents a set of grading parameters such as light intensity, wavelength, brightness, voltage, current, etc. preset for the LED core particle detection, and the same BIN value represents that the preset grading parameters for the LED core particle selection are the same, and the parameters are in a set range, i.e. the parameters are the same by default; the BIN value α is only used to indicate that all the LED core particles selected in the present patent application have the same grading parameters, and is used to describe the technical solution of the present patent application without any other explanation; for example, the BIN value α includes the brightness between 20-21, but due to the wafer difference, the actual parameter of the LED core particle of the first wafer is between 20.5-21.5, the actual parameter of the LED core particle of the second wafer is between 19.5-20.5, and the brightness difference between the single LED core particle of the first wafer and the single LED core particle of the second wafer is 0.5, when the LED core particle detected by the first wafer is placed on the left side of the placing portion 30, and the LED core particle detected by the second wafer is placed on the right side of the placing portion 30, the brightness difference is 0.5X, so as to form the brightness difference, thereby affecting the using effect of the LED core particle on the placing portion 30.
By adopting the technical scheme, the problem that the conventional LED core particles from the same wafer are concentrated in a partial area of the placing part 30, so that LEDs from different wafers are positioned in the placing part 30 to cause BIN value alpha amplification, and if the brightness difference of the placing part 30 is obvious due to the brightness difference detected by the wafers, the application of the LED core particles on the placing part 30 is influenced is solved; by adopting the technical scheme, the LED core particles from different wafers are uniformly distributed in the placing part 30, and the LED core particles with the BIN value alpha difference are uniformly distributed.
As shown in fig. 4-8, the first predetermined path (21 a, 21b, 21c, 21 d) and the second predetermined path (22 a, 22b, 22c, 22 d) are each composed of a set of predetermined core particle position coordinates; that is, the first predetermined paths (21 a, 21b, 21c, 21 d) and the second predetermined paths (22 a, 22b, 22c, 22 d) are required to be arranged based on the position coordinates of the placing portion 30 on which the LED chip is placed, so as to save time and improve efficiency.
As shown in fig. 4 and 5, the first preset paths (21 a, 21b, 21c, 21 d) and the second preset paths (22 a, 22b, 22c, 22 d) are all straight lines, the moving distances of any two adjacent LED core particles are the same, the setting is simple, and the program setting for placing the LED core particles is simplified, so that the efficiency and the stability are improved.
As shown in fig. 4 to 8, the first predetermined paths (21 a, 21b, 21c, 21 d) and the second predetermined paths (22 a, 22b, 22c, 22 d) both penetrate through the rows/columns of the placement portion 30, so that the first predetermined paths (21 a, 21b, 21c, 21 d) and the second predetermined paths (22 a, 22b, 22c, 22 d) are simplified in arrangement, and the operation is stable and reliable.
As shown in fig. 6, any two core particles from the same wafer are not adjacent to each other in the whole placement portion 30, so that the most uniform LED core particles from the first wafer and the second wafer are realized; the non-adjacency here is only used for explaining that two adjacent LED core particles from the wafer I/wafer II are not directly adjacent in any one of the four directions of up, down, left and right, and the lower left, upper right and lower right as shown in FIG. 6 do not belong to the adjacent range; as will be described herein.
As shown in fig. 1 to 7, S3: taking the LED core particles with the BIN value alpha from the wafer III, and sequentially arranging the LED core particles along a third preset path (23 a, 23b, 23c and 23 d); the third preset path (23 a, 23b, 23c, 23 d) is in the same direction as the first preset path (21 a, 21b, 21c, 21 d);
repeating the above steps S1, S2, and S3 in sequence, so that the LED chips from the first wafer, the second wafer, and the third wafer, which all have the BIN value α, are distributed on the entire placing portion 30, that is, the LED chips from the first wafer, the second wafer, and the third wafer are selected and distributed on the placing portion 30; of course, those skilled in the art can also take the LED chip with BIN value α detected by wafer four … wafer N, where N is greater than or equal to 4, which is not described herein again.
As shown in fig. 1-8, the LED core particle is a miniLED, and since the miniLED has a smaller geometric size and more sensitive photoelectric parameters, a larger number of minileds are required for a display screen with the same size; adopt the technical scheme of this patent application more to improve the result of use of LED core grain.
As shown in fig. 1-8, the placing portion 30 is an LED backlight module, and the backlight module has higher display requirements than the conventional direct light display, and the technical solution disclosed in this patent can improve the backlight application situation.
As shown in fig. 9, the number of rows crossed by the first predetermined path 21e is consistent with the number of LED die wafers with BIN value α; the LED core particles are uniformly distributed.
As shown in fig. 7 and 8, when the first preset path 21d has a switching direction between lower left and lower right, position coordinates corresponding to the switching direction are provided with position coordinates adjacent in a downward direction; when the LED core is placed along the first predetermined path 21d, as can be seen from fig. 7 and 8, two adjacent position coordinates in the downward direction are used for accepting the switching of the first predetermined path 21d from the left lower to the right lower or from the right lower to the left lower; two adjacent position coordinates are set for stabilizing the movement of the placed LED core particles, and the LED core particles are placed in a left-lower movement mode and then switched to a right-lower LED core particle placement mode; the technical scheme that the LED core particles are placed along the downward adjacent position coordinates is more stable, so that the LED core particles are placed more stably and reliably.
The above are preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. It should be recognized that non-inventive variations and modifications to the disclosed embodiments of the invention that may occur to those skilled in the art upon a reading of the foregoing teachings are also within the scope of the invention as claimed and disclosed.
Claims (10)
1. An LED core particle arrangement method is characterized in that:
s1: taking LED core particles which are from a wafer I and have a BIN value alpha, and sequentially arranging the LED core particles in the placing part along a first preset path;
s2: taking LED core particles which come from a wafer II and have a BIN value alpha, and sequentially arranging the LED core particles in the placing part along a second preset path;
repeating the above steps S1 and S2 in sequence to distribute the LED core particles which are respectively from the first wafer and the second wafer and have the BIN value alpha to the whole placing part; the first preset path and the second preset path have the same direction.
2. The LED core particle arrangement method according to claim 1, wherein:
the first preset path and the second preset path are both composed of a group of preset core grain position coordinates.
3. The LED core particle arrangement method according to claim 2, wherein:
the first preset path and the second preset path are both straight lines.
4. The LED core particle arrangement method according to claim 2, wherein:
the first preset path and the second preset path penetrate through the rows/columns of the placing part.
5. The LED core particle arrangement method according to claim 1, wherein:
any two core particles from the same wafer in the whole placing part are not adjacent.
6. The LED core particle arrangement method according to claim 1, wherein:
s3: taking LED core particles with a BIN value alpha from a wafer III, and sequentially arranging the LED core particles along a third preset path;
repeating the above steps S1, S2 and S3 in sequence to make the LED core particles respectively from the first wafer, the second wafer and the third wafer, and having the BIN value alpha, distributed on the whole placing part; the third preset path has the same direction as the first preset path.
7. The LED core particle arrangement method according to claim 1, wherein:
the LED core particles are miniLEDs.
8. The LED core particle arrangement method according to claim 1, wherein:
the placing part is an LED backlight module.
9. The LED core particle arrangement method according to claim 1, wherein:
the first preset path and/or the second preset path cross the position coordinates outside the placing part.
10. The LED core particle arrangement method according to claim 1, wherein:
when the first preset path has a switching direction between the lower left and the lower right, the position coordinates corresponding to the switching direction are provided with position coordinates adjacent along the lower direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210360599.4A CN114914331A (en) | 2022-04-07 | 2022-04-07 | LED core particle arrangement method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210360599.4A CN114914331A (en) | 2022-04-07 | 2022-04-07 | LED core particle arrangement method |
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| Publication Number | Publication Date |
|---|---|
| CN114914331A true CN114914331A (en) | 2022-08-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210360599.4A Pending CN114914331A (en) | 2022-04-07 | 2022-04-07 | LED core particle arrangement method |
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|---|---|
| CN (1) | CN114914331A (en) |
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- 2022-04-07 CN CN202210360599.4A patent/CN114914331A/en active Pending
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