CN114905829A - Electronic element composition for protecting internal information and preparation method thereof - Google Patents

Electronic element composition for protecting internal information and preparation method thereof Download PDF

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Publication number
CN114905829A
CN114905829A CN202210514928.6A CN202210514928A CN114905829A CN 114905829 A CN114905829 A CN 114905829A CN 202210514928 A CN202210514928 A CN 202210514928A CN 114905829 A CN114905829 A CN 114905829A
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layer
silicone rubber
internal information
heat insulation
protecting internal
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Inventor
方鹏
陈维林
刘鸿铭
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Shenzhen Dipu Material Technology Co ltd
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Shenzhen Dipu Material Technology Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/065—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of foam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/18—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer of foamed material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/4266—Polycondensates having carboxylic or carbonic ester groups in the main chain prepared from hydroxycarboxylic acids and/or lactones
    • C08G18/4269—Lactones
    • C08G18/4277—Caprolactone and/or substituted caprolactone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0066—Use of inorganic compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/065—Hydrides or carbides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18—Fireproof paints including high temperature resistant paints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2266/00—Composition of foam
    • B32B2266/02—Organic
    • B32B2266/0207—Materials belonging to B32B25/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/304—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/56—Damping, energy absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2265—Oxides; Hydroxides of metals of iron
    • C08K2003/2272—Ferric oxide (Fe2O3)

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  • Polymers & Plastics (AREA)
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  • Polyurethanes Or Polyureas (AREA)

Abstract

The invention discloses an electronic element composition for protecting internal information, which sequentially comprises an information recording device, a damping layer, a heat insulation layer, a restraint layer, a heat insulation layer, a protective layer and an ablation-resistant coating from inside to outside; the heat insulation layer is connected with the constraint layer through an adhesive and is a silicon rubber buffering heat insulation layer. The invention controls the ratio of diisocyanate and polycaprolactone diol (0.1-90) in polyurethane prepolymer: the addition ratio of 100 ensures that the electronic element composition has higher crystallinity at room temperature and good damping performance, can absorb partial heat when the environmental temperature changes, maintains the constant temperature of an internal information recording device and has good high temperature resistance, and adopts the synergistic effect of methyl vinyl silicone rubber with the molecular weight of 70-80 ten thousand and sepiolite to ensure that the heat-insulating layer has good buffer effect and the electronic element composition can resist severe external impact.

Description

Electronic element composition for protecting internal information and preparation method thereof
Technical Field
The invention relates to an electronic component composition for protecting internal information, relates to G07C, and particularly relates to the field of devices, systems or equipment for registering or indicating the operation of machines.
Background
The electronic component composition for protecting the internal information can be arranged on vehicles such as airplanes, ships, trains, automobiles and the like, is used for recording the operating parameters of the vehicles in the using process, and can properly store the electronic recording information for analyzing the accident cause if an accident occurs. After an accident of a vehicle occurs, huge impact force, even conditions such as high-temperature combustion and explosion can be generated, so that how to strictly protect internal information is very important.
Chinese invention patent CN110809378B discloses a damping heat insulation structure, a method for making the same, and an application thereof, wherein a polyurethane damping material is used to wrap electronic components in all directions, so as to achieve a good protection effect, but the material hardness of each layer of structure is high, and the effect of buffering the external pressure is not good when strong impact force is applied. The Chinese invention patent CN201510426848.5 discloses a flight data recorder shell and a preparation method thereof, polyurethane foam is used as a flame-retardant foam layer, the buffering effect on electronic components is improved, but a foam cell structure is easy to collapse when being subjected to high temperature, so that the high temperature resistance of the shell is obviously reduced.
Disclosure of Invention
In order to improve the protection effect of the electronic element composition on the internal information and reduce the damage to the electronic element composition under the action of a large impact force, the first aspect of the application provides an electronic element composition for protecting the internal information, which sequentially comprises an information recording device, a damping layer, a heat insulation layer, a constraint layer, a heat insulation layer, a protective layer and an ablation-resistant coating from inside to outside; the heat insulation layer is connected with the constraint layer through an adhesive and is a silicon rubber buffering heat insulation layer.
As a preferable embodiment, the damping layer is made of polyurethane damping material, and the damping coefficient is more than or equal to 0.3 in an environment with the temperature of 25-50 ℃.
As a preferable embodiment, the preparation raw materials of the polyurethane damping material comprise a polyurethane prepolymer and a curing component, wherein the polyurethane prepolymer is composed of diisocyanate and polycaprolactone diol with symmetrical structures.
In a preferred embodiment, the weight ratio of the polyurethane prepolymer to the curing component is (30-40): 100, the weight ratio of the diisocyanate to the polycaprolactone diol is (0.1-90): 100.
as a preferred embodiment, the weight ratio of the polyurethane prepolymer to the curing component is 35: 100, the weight ratio of diisocyanate to polycaprolactone diol is 43: 100.
as a preferred embodiment, the curing component comprises a chain extender and a catalyst, and the weight ratio of the chain extender to the catalyst is (40-100): (0.1-1).
As a preferred embodiment, the ablation-resistant coating is a silicone rubber ablation-resistant coating, the silicone rubber ablation-resistant coating is a room temperature vulcanized silicone rubber ablation-resistant coating, and the silicone rubber coating can stably exist in a high temperature environment of 500 ℃ and stably exist in an environment of 1000 ℃ for 5-20 min.
As a preferred embodiment, the silicone rubber burning-resistant coating is a two-component room temperature vulcanized silicone rubber coating, the preparation raw materials comprise a dual-phenyl room temperature vulcanized silicone rubber, a filler, a cross-linking agent and an accelerator, the dual-phenyl room temperature vulcanized silicone rubber and the filler form a component a, the cross-linking agent and the accelerator form a component B, and the weight ratio of the component a to the component B is 100: (2-20).
In a preferred embodiment, the silicone rubber buffer and thermal insulation layer is foamed silicone rubber, and the raw materials for preparing the foamed silicone rubber comprise 90-100 parts by weight of methyl vinyl silicone rubber and 45-55 parts by weight of mineral filler.
As a preferred embodiment, the preparation raw material of the foaming silicon rubber also comprises 2-5 parts by weight of foaming agent. Preferably, the foaming agent is silicon carbide.
In a preferred embodiment, the methyl vinyl silicone rubber is a vinyl-terminated methyl vinyl silicone rubber, the mole fraction of vinyl groups is 0.13 to 0.2%, and the weight average molecular weight of the methyl vinyl silicone rubber is 45 to 80 ten thousand.
In a preferred embodiment, the weight average molecular weight of the methyl vinyl silicone rubber is 70 to 80 ten thousand.
As a preferred embodiment, the mineral filler is selected from one or more of silica, sepiolite, silica micropowder, calcium carbonate, aluminum hydroxide and kaolin.
As a preferred embodiment, the mineral filler is sepiolite, the particle size of which is 1250 mesh.
In the experimental process, the applicant finds that the foamed silicon rubber used as the buffer heat-insulating layer has good high-temperature resistance and a good buffer effect, particularly the methyl vinyl silicon rubber with the molecular weight of 70-80 ten thousand is used as the rubber base material, so that the effect of resisting the high temperature of 700 ℃ can be achieved, and the suspected reason is that compared with the traditional methyl vinyl silicon rubber, the silicon rubber with the molecular weight of 45-80 ten thousand has higher pressure bearing capacity, when the silicon rubber bears the high temperature, the thicker foam cell wall of the foamed silicon rubber can play a good supporting role, a material framework is formed, and the foam cells are controlled to be not easy to collapse. And sepiolite is introduced in the preparation process of the silicone rubber buffer heat-insulating layer, has the structural characteristics of fluffiness, porosity and low density, can enter the foaming foam pores of the silicone rubber, plays a role in filling and supporting, and further avoids the foam pores of the foaming silicone rubber from collapsing. The applicant further discovers in the experimental process that a compact composite structure can be formed by combining vinyl-terminated methyl vinyl silicone rubber and sepiolite, the sepiolite can be uniformly dispersed in foamed silicone rubber to form compact small foaming pores, and the buffering and heat insulation effects of the silicone rubber are improved on the basis of ensuring that the silicone rubber has certain mechanical properties.
As a preferred embodiment, the preparation method of the silicone rubber buffer thermal insulation layer comprises the following steps:
(1) stirring and blending the methyl vinyl silicone rubber and the mineral filler to obtain a silicone rubber base material, and then adding a foaming agent, stirring and mixing uniformly;
(2) sending the mixture into an environment of 200 ℃ and 280 ℃ for foaming and vulcanizing, and shaping to obtain the product.
A second aspect of the present invention provides a method for preparing an electronic component composition for protecting internal information, comprising the steps of:
(1) coating an adhesive on the surface of the constraint layer, and adhering the heat insulation layer to the surface of the constraint layer;
(2) installing the information recording device in the heat insulation layer, pouring a damping layer between the heat insulation layer and the information recording device, and curing at room temperature;
(3) after the solidification is finished, coating an adhesive on the surface of the restraint layer to bond the heat insulation layer with the surface of the restraint layer;
(4) and placing the heat insulating layer into the protective layer, coating an adhesive between the heat insulating layer and the protective layer, coating an ablation-resistant coating on the outer surface of the protective layer, and drying to obtain the coating.
As a preferred embodiment, the adhesive is not particularly limited, and may be selected from one or a combination of a polyurethane adhesive, an acrylate adhesive, and a silicone rubber adhesive.
Compared with the prior art, the invention has the following beneficial effects:
(1) the electronic element composition for protecting the internal information controls the ratio of (0.1-90) of diisocyanate and polycaprolactone diol in a polyurethane prepolymer: the addition ratio of 100 ensures that the material has higher crystallinity at room temperature and good damping performance, can absorb partial heat when the ambient temperature changes, and maintains the constant temperature of the internal information recording device, so that the material has good high temperature resistance.
(2) According to the electronic element composition for protecting internal information, the diphenyl room temperature vulcanized silicone rubber is used as the base material and acts with the iron oxide red filler, so that the coating has good ablation resistance and a certain flame retardant effect when burning occurs.
(3) According to the electronic element composition for protecting internal information, the methyl vinyl silicone rubber with the molecular weight of 70-80 ten thousand and the sepiolite are adopted to act synergistically, so that the heat-insulating layer has a good buffering effect, and the electronic element composition can resist severe external impact.
Detailed Description
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Example 1
An electronic component composition for protecting internal information comprises an information recording device, a damping layer, a heat insulating layer, a constraining layer, a heat insulating layer, a protective layer and an ablation-resistant coating in sequence from inside to outside; the heat insulation layer is connected with the constraint layer through an adhesive and is a silicon rubber buffering heat insulation layer.
The damping layer is made of a polyurethane damping material, the damping coefficient is more than or equal to 0.3 in an environment at 45 ℃, the preparation raw materials of the polyurethane damping material comprise a polyurethane prepolymer and a curing component, and the weight ratio is 35: 100; the polyurethane prepolymer comprises diisocyanate and polycaprolactone diol, and the weight ratio is 43: 100, the curing component comprises a chain extender and a catalyst, and the weight ratio is 55: 0.5, wherein the polyurethane damping material is purchased from Shenzhen dysprosium material science and technology Limited.
The ablation-resistant coating is a double-component room temperature vulcanized silicone rubber coating, the preparation raw materials comprise a double-phenyl room temperature vulcanized silicone rubber, a filler, a cross-linking agent and an accelerator, the double-phenyl room temperature vulcanized silicone rubber and the filler form a component A, the cross-linking agent and the accelerator form a component B, and the weight ratio of the component A to the component B is 100: 15, the two-component room temperature vulcanized silicone rubber coating is purchased from Shenzhen dysprosium material science and technology Limited.
The silicone rubber buffer heat-insulating layer is foamed silicone rubber, and the preparation raw materials comprise, by weight, 95 parts of methyl vinyl silicone rubber, 50 parts of sepiolite and 4 parts of silicon carbide.
The methyl vinyl silicone rubber is vinyl-terminated methyl vinyl silicone rubber, the mole fraction of vinyl is 0.15%, the weight average molecular weight of the methyl vinyl silicone rubber is 75 ten thousand, and the methyl vinyl silicone rubber is purchased from Shenzhen Chuangyou silicone rubber science and technology Limited.
The particle size of the sepiolite is 1250 meshes and is purchased from tourmaline mineral products, Inc. of Shijiazhuang.
The preparation method of the silicone rubber buffer heat-insulating layer comprises the following steps:
(1) stirring and blending the methyl vinyl silicone rubber and the mineral filler to obtain a silicone rubber base material, and then adding a foaming agent, stirring and mixing uniformly;
(2) foaming and vulcanizing in an environment of 250 ℃, and shaping to obtain the product.
The adhesive is a silica gel adhesive and is purchased from Shenzhen dysprosium material science and technology Limited company.
A method for preparing an electronic component composition for protecting internal information, comprising the steps of:
(1) coating an adhesive on the surface of the constraint layer, and adhering the heat insulation layer to the surface of the constraint layer;
(2) installing the information recording device in the heat insulation layer, pouring a damping layer between the heat insulation layer and the information recording device, and curing at room temperature;
(3) after the curing is finished, coating an adhesive on the surface of the constraint layer to bond the heat insulation layer with the surface of the constraint layer;
(4) and placing the heat insulating layer into the protective layer, coating an adhesive between the heat insulating layer and the protective layer, coating an ablation-resistant coating on the outer surface of the protective layer, and drying to obtain the coating.
Example 2
The specific steps of an electronic element composition for protecting internal information and a preparation method thereof are the same as example 1, but the molecular weight of the methyl vinyl silicone rubber is 65 ten thousand.
Example 3
The specific steps of an electronic component composition for protecting internal information and a preparation method are the same as example 1, and the difference is that the particle size of the sepiolite is 200 meshes.
And (3) performance testing:
1. impact resistance: weights with different weights and a 6.35mm steel striker mounted on the bottom were dropped vertically from a height of 3m and hit the electronic component composition, and the weight was tested to what extent and caused a damage to the appearance of the electronic component composition.
2. High temperature resistance: the electronic component compositions for protecting internal information prepared in examples 1 to 3 were placed in a high temperature environment of 1000 ℃ for 10 minutes, taken out, cut open, and observed for destruction inside the composition.
The test was carried out according to the above criteria and the test results are shown in Table 1.
TABLE 1
Figure BDA0003639126560000051
Figure BDA0003639126560000061

Claims (10)

1. An electronic component composition for protecting internal information, which is characterized by comprising an information recording device, a damping layer, a heat insulating layer, a constraint layer, a heat insulating layer, a protective layer and an ablation-resistant coating in sequence from inside to outside; the heat insulation layer is connected with the constraint layer through an adhesive and is a silicon rubber buffering heat insulation layer.
2. The electronic component composition for protecting internal information as claimed in claim 1, wherein the damping layer is a polyurethane damping material, and the damping coefficient is not less than 0.3 in an environment of 25-50 ℃.
3. The electronic component composition for protecting internal information as claimed in claim 2, wherein the polyurethane damping material is prepared from a polyurethane prepolymer and a curing component, wherein the polyurethane prepolymer is composed of diisocyanate and polycaprolactone diol with symmetrical structures.
4. The electronic component composition for protecting internal information according to claim 3, wherein the curing component comprises a chain extender and a catalyst, and the weight ratio of the chain extender to the catalyst is (40-100): (0.1-1).
5. The electronic component composition for protecting internal information according to claim 1, wherein the ablation-resistant coating is a silicone rubber ablation-resistant coating, and the silicone rubber ablation-resistant coating is a room temperature vulcanized silicone rubber ablation-resistant coating.
6. The electronic component composition for protecting internal information according to claim 5, wherein the silicone rubber burning-resistant coating layer is a two-component room temperature vulcanized silicone rubber, the raw materials for preparation include a bis-phenyl room temperature vulcanized silicone rubber, a filler, a crosslinking agent and an accelerator, the bis-phenyl room temperature vulcanized silicone rubber and the filler form a component A, the crosslinking agent and the accelerator form a component B, and the weight ratio of the component A to the component B is 100: (2-20).
7. The electronic component composition for protecting internal information according to claim 1, wherein the silicone rubber cushioning and heat insulating layer is a foamed silicone rubber prepared from a material comprising a methyl vinyl silicone rubber and a mineral filler.
8. The composition for protecting an electronic part according to claim 7, wherein said methyl vinyl silicone rubber is a vinyl terminated methyl vinyl silicone rubber, the mole fraction of vinyl groups is 0.13 to 0.2%, and the weight average molecular weight of said methyl vinyl silicone rubber is 45 to 80 ten thousand.
9. The electronic component composition for protecting internal information as claimed in claim 8, wherein the mineral filler is selected from one or more of silica, sepiolite, silica micropowder, calcium carbonate, aluminum hydroxide, and kaolin.
10. A method for producing an electronic component composition for protecting internal information according to any one of claims 1 to 9, comprising the steps of:
(1) coating an adhesive on the surface of the constraint layer, and adhering the heat insulation layer to the surface of the constraint layer;
(2) installing the information recording device in the heat insulation layer, pouring a damping layer between the heat insulation layer and the information recording device, and curing;
(3) after the curing is finished, coating an adhesive on the surface of the constraint layer to bond the heat insulation layer with the surface of the constraint layer;
(4) and placing the heat insulating layer into the protective layer, coating an adhesive between the heat insulating layer and the protective layer, coating an ablation-resistant coating on the outer surface of the protective layer, and drying to obtain the coating.
CN202210514928.6A 2022-05-11 2022-05-11 Electronic element composition for protecting internal information and preparation method thereof Pending CN114905829A (en)

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Publication number Priority date Publication date Assignee Title
GB1498177A (en) * 1975-06-11 1978-01-18 Sperry Rand Ltd Data recorders
RU2004128271A (en) * 2004-09-21 2006-03-10 Открытое акционерное общество "Техприбор" (RU) ON-BOARD PROTECTIVE DEVICE FOR MICROELECTRONIC OBJECT
CN200997733Y (en) * 2007-01-24 2007-12-26 国营千山电子仪器厂 Comprehensive recorder casing of plane
CN106190007A (en) * 2016-07-22 2016-12-07 航天材料及工艺研究所 A kind of cold curing electrically insulating silicone rubber of resistance to ablation adhesive and preparation method thereof
CN109852238A (en) * 2019-01-09 2019-06-07 上海交通大学 A kind of sprayable resistance to ablative coatings of silicon rubber base lightweight and its application
CN110809378A (en) * 2019-10-23 2020-02-18 航天材料及工艺研究所 Damping/heat insulation structure and preparation method and application thereof
CN112480686A (en) * 2020-12-03 2021-03-12 常州市沃科科技有限公司 Foaming silicon rubber core material and foaming heat-insulation buffering composite material

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1498177A (en) * 1975-06-11 1978-01-18 Sperry Rand Ltd Data recorders
RU2004128271A (en) * 2004-09-21 2006-03-10 Открытое акционерное общество "Техприбор" (RU) ON-BOARD PROTECTIVE DEVICE FOR MICROELECTRONIC OBJECT
CN200997733Y (en) * 2007-01-24 2007-12-26 国营千山电子仪器厂 Comprehensive recorder casing of plane
CN106190007A (en) * 2016-07-22 2016-12-07 航天材料及工艺研究所 A kind of cold curing electrically insulating silicone rubber of resistance to ablation adhesive and preparation method thereof
CN109852238A (en) * 2019-01-09 2019-06-07 上海交通大学 A kind of sprayable resistance to ablative coatings of silicon rubber base lightweight and its application
CN110809378A (en) * 2019-10-23 2020-02-18 航天材料及工艺研究所 Damping/heat insulation structure and preparation method and application thereof
WO2021077404A1 (en) * 2019-10-23 2021-04-29 航天材料及工艺研究所 Damping and heat-insulation structure, preparation method therefor and application thereof
CN112480686A (en) * 2020-12-03 2021-03-12 常州市沃科科技有限公司 Foaming silicon rubber core material and foaming heat-insulation buffering composite material

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