CN114905357A

CN114905357A - Grinding device

Info

Publication number: CN114905357A
Application number: CN202210102464.8A
Authority: CN
Inventors: 児玉宗久
Original assignee: Tokyo Electron Ltd
Current assignee: Tokyo Electron Ltd
Priority date: 2021-02-10
Filing date: 2022-01-27
Publication date: 2022-08-16
Also published as: JP2022122763A

Abstract

The present invention relates to a grinding apparatus. Provided is a technique for improving the expandability of a grinding device. The grinding device comprises a grinding module and a cleaning module. The grinding module comprises: a holding section for holding a substrate; a tool driving unit that drives a grinding tool that grinds the substrate; a temporary placement unit that temporarily stores the substrate; and an internal conveying section that conveys the substrate between the temporary placement section and the holding section. The cleaning module comprises: a cleaning unit configured to clean the substrate ground by the grinding tool; and a1 st conveying part which conveys the substrate between the cleaning part and the grinding module. The temporary placement unit is disposed above a conveyance path along which the internal conveyance unit conveys the substrate between the temporary placement unit and the holding unit.

Description

Grinding device

Technical Field

The present disclosure relates to a grinding device.

Background

The polishing apparatus described in patent document 1 includes at least: an index table on which 4 chuck tables holding semiconductor wafers are arranged at 90 ° intervals; a wafer carry-in/out area for carrying in/out the wafer with respect to the chuck table; and a polishing region for polishing the wafer held by the chuck table. Two carry-in/out members for carrying in/out the wafer with respect to each chuck table when the two chuck tables are positioned are disposed in the wafer carry-in/out area. In addition, two polishing members for polishing the wafer held on each chuck table when the two chuck tables are positioned are disposed in the polishing region. The carry-in and carry-out section carries the wafer from the center alignment stage to a chuck stage located in the carry-in and carry-out region of the wafer. A temporary receiving table is provided below the conveying path. The temporary receiving table is used for avoiding the polished wafer before the wafer is stored in the box.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. H10-86048

Disclosure of Invention

Problems to be solved by the invention

One aspect of the present disclosure provides a technique for improving expandability of a grinding apparatus.

Means for solving the problems

The grinding device of one technical scheme of this disclosure includes grinding module and washing module. The grinding module comprises: a holding section for holding a substrate; a tool driving unit that drives a grinding tool that grinds the substrate; a temporary placement unit that temporarily stores the substrate; and an internal conveying section that conveys the substrate between the temporary placement section and the holding section. The cleaning module comprises: a cleaning unit configured to clean the substrate ground by the grinding tool; and a1 st conveying part which conveys the substrate between the cleaning part and the grinding module. The temporary placement unit is disposed above a conveyance path for conveying the substrate between the temporary placement unit and the holding unit by the internal conveyance unit.

ADVANTAGEOUS EFFECTS OF INVENTION

According to an technical scheme of this disclosure, can improve the expansibility of grinding device.

Drawings

Fig. 1 is a plan view showing a grinding apparatus according to an embodiment, and is a plan view showing a state in which a top plate of a housing included in a grinding module is removed.

Fig. 2 is a sectional view taken along line II-II of fig. 1.

Fig. 3 is an enlarged sectional view of a part of fig. 2.

Fig. 4 is a flowchart illustrating a grinding method according to an embodiment.

Fig. 5 is a plan view showing a grinding apparatus according to a modification.

Fig. 6 (a) is a cross-sectional view showing an example of thinning of the stacked substrate, and fig. 6 (B) is a cross-sectional view showing an example of thinned stacked substrate.

Detailed Description

Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same reference numerals, and description thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular directions. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.

First, a grinding apparatus 1 according to the present embodiment will be described with reference to fig. 1 to 3. The grinding apparatus 1 grinds the substrate W. In this specification, grinding includes lapping. The grinding device 1 comprises a feed-in and feed-out module 2, a cleaning module 3 and a grinding module 5. The feed-out module 2, the cleaning module 3, and the grinding module 5 are arranged in this order from the negative X-axis direction side to the positive X-axis direction side.

The carry-in/out module 2 includes a mounting portion 21, and the mounting portion 21 is used for mounting a cassette C for accommodating substrates W. The cassette C accommodates a plurality of substrates W aligned at intervals in the vertical direction horizontally. The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device layer formed on a surface of the semiconductor substrate or the glass substrate. The device layer contains electronic circuitry. The substrate W may be a stacked substrate formed by bonding a plurality of substrates.

As shown in fig. 1 and 2, the cleaning module 3 includes, for example,

cleaning units

31A and 31B for cleaning the ground substrate W,

etching units

32A and 32B for etching the cleaned substrate W, an inspection unit 33 for inspecting the etched substrate W, an inverting unit 34 for inverting the substrate W, and a temporary placement unit 35 for temporarily storing the substrate W. In addition, the cleaning module 3 comprises a1 st transport zone 36 and a2 nd transport zone 37. The 1 st conveying section 38 is provided in the 1 st conveying area 36, and the 2 nd conveying section 39 is provided in the 2 nd conveying area 37. The 1 st conveyance unit 38 conveys the substrate W between the

cleaning units

31A and 31B and the grinding module 5. The 2 nd conveying unit 39 conveys the substrate W between the cartridge C on the placing unit 21 and the cleaning module 3.

The

cleaning units

31A and 31B, the inspection unit 33, and the temporary placement unit 35 are stacked in the vertical direction, and are disposed at positions surrounded in three directions by the 1 st conveyance area 36, the 2 nd conveyance area 37, and the grinding module 5. The

cleaning units

31A and 31B, the inspection unit 33, and the temporary placement unit 35 are stacked in this order from top to bottom. However, the order is not particularly limited. The

etching portions

32A and 32B are stacked in the vertical direction and are disposed adjacent to the 1 st transport region 36 and the 2 nd transport region 37.

The 1 st transport unit 38 transports the substrate W in the 1 st transport region 36. That is, the 1 st transport unit 38 transports the substrate W between a plurality of devices disposed adjacent to the 1 st transport region 36. The 1 st transport unit 38 has a plurality of transport arms that move independently. Each of the transfer arms is capable of moving in a horizontal direction (both in an X-axis direction and a Y-axis direction) and in a vertical direction, and rotating about a vertical axis. Each of the transfer arms holds the substrate W from below. The number of the transfer arms is not particularly limited.

Similarly, the 2 nd conveying unit 39 conveys the substrate W in the 2 nd conveying area 37. That is, the 2 nd conveying unit 39 conveys the substrate W between a plurality of devices disposed adjacent to the 2 nd conveying area 37. The 2 nd transport unit 39 has a plurality of transport arms that move independently. Each of the transfer arms is capable of moving in a horizontal direction (both in an X-axis direction and a Y-axis direction) and in a vertical direction, and rotating about a vertical axis. Each of the transfer arms holds the substrate W from below.

As shown in fig. 1, the grinding module 5 includes, for example, 4

holding units

52A, 52B, 52C, 52D for holding the substrate W, two

tool driving units

53A, 53B for driving the grinding tool D for grinding the substrate W, and an internal conveyance unit 54 for conveying the substrate W in the grinding module 5. The grinding module 5 may further include a rotary table 51 that rotates about a rotation center line R1. The 4

holding portions

52A, 52B, 52C, and 52D are provided at intervals around the rotation center line R1, and rotate together with the rotation table 51. The 4

holding portions

52A, 52B, 52C, and 52D rotate about the respective rotation center lines R2.

The two holding

portions

52A and 52C are arranged symmetrically about the rotation center line R1 of the turntable 51. The holding

portions

52A and 52C move between the 1 st carry-in/out position A3 at which the substrate W is carried in and out by the internal conveyance portion 54 and the 1 st grinding position a1 at which the substrate W is ground by one tool driving portion 53A. Each time the rotary table 51 rotates by 180 °, the two holding

portions

52A, 52C move between the 1 st feed-in and feed-out position A3 and the 1 st grinding position a 1.

The other two holding

portions

52B and 52D are arranged symmetrically about the rotation center line R1 of the turntable 51. The holding

portions

52B and 52D move between the 2 nd carrying-in/out position a0 at which the substrate W is carried in/out by the internal conveyance portion 54 and the 2 nd grinding position a2 at which the substrate W is ground by the separate tool driving portion 53B. Every time the rotary table 51 rotates by 180 °, the other two holding

portions

52B, 52D move between the 2 nd feeding-out position a0 and the 2 nd grinding position a 2.

The 1 st carry-in and carry-out position A3, the 2 nd carry-in and carry-out position a0, the 1 st grinding position a1, and the 2 nd grinding position a2 are arranged in this order in the counterclockwise direction when viewed from above. In this case, the holding portion 52A, the holding portion 52B, the holding portion 52C, and the holding portion 52 are arranged at a pitch of 90 ° in the counterclockwise direction in this order when viewed from above.

Further, the positions of the 1 st carry-in and carry-out position A3 and the 2 nd carry-in and carry-out position a0 may be reversed, and the positions of the 1 st grinding position a1 and the 2 nd grinding position a2 may also be reversed. That is, the 1 st carrying-in and carrying-out position A3, the 2 nd carrying-in and carrying-out position a0, the 1 st grinding position a1, and the 2 nd grinding position a2 may be arranged in the clockwise direction in this order when viewed from above. In this case, the holding portion 52A, the holding portion 52B, the holding portion 52C, and the holding portion 52D are arranged at a pitch of 90 ° in the clockwise direction in this order when viewed from above.

However, the number of holding portions is not limited to 4. The number of tool driving portions is not limited to two. The turntable 51 may be omitted. For example, a slide table may be provided instead of the rotary table 51.

Next, the tool driving portion 53A will be described with reference to fig. 3. The tool driving portion 53B is configured similarly to the tool driving portion 53A, and therefore, illustration and description thereof are omitted. The tool driving portion 53A includes a movable portion 531 to which the grinding tool D is attached. The grinding tool D is pressed against the substrate W to grind the substrate W. The grinding tool D includes, for example, a disk-shaped grinding wheel D1 and a plurality of grinding stones D2 arranged in a ring shape on the lower surface of the grinding wheel D1.

The movable portion 531 includes a flange 532 to which the grinding tool D is attached, a spindle 533 provided with the flange 532 at a lower end thereof, and a spindle motor 534 for rotating the spindle 533. The flange 532 is horizontally disposed and has a grinding tool D mounted on a lower surface thereof. The main shaft 533 is vertically disposed. The spindle motor 534 rotates the spindle 533, and rotates the grinding tool D attached to the flange 532. The rotation center line R3 of the grinding tool D is the rotation center line of the spindle 533.

The tool driving unit 53A further includes an elevating unit 535 for elevating and lowering the movable unit 531. The lifting unit 535 includes, for example, a vertical Z-axis guide 536, a Z-axis slide 537 that moves along the Z-axis guide 536, and a Z-axis motor 538 that moves the Z-axis slide 537. The movable portion 531 is fixed to the Z-axis slider 537, and the movable portion 531 and the grinding tool D are moved up and down together with the Z-axis slider 537.

The lifting unit 535 lowers the grinding tool D from the standby position. The grinding tool D rotates while descending, and is in contact with the upper surface of the rotating substrate W to grind the entire upper surface of the substrate W. When the thickness of the substrate W reaches the set value, the elevating part 535 stops the descent of the grinding tool D. Then, the lifting unit 535 raises the grinding tool D to the standby position.

The grinding module 5 includes a housing 55 that houses the rotary table 51 and the 4

holding portions

52A, 52B, 52C, and 52D. The housing 55 suppresses grinding chips and grinding fluid from scattering to the outside. The grinding chips are powder or chips generated by grinding of the substrate W. The powder includes powder ground from the substrate W and abrasive grains detached from the grinding tool D.

The housing 55 includes a top plate 551 and a plurality of side plates 552. The top plate 551 has a rectangular shape and is horizontally disposed. The side plates 552 are provided on each of the four sides of the top plate 551 and are arranged vertically. The housing 55 may include a base, not shown, which receives the grinding chips and the grinding fluid below the rotary table 51.

The top panel 551 covers, for example, the 1 st carry-in/out position A3, the 2 nd carry-in/out position a0, the 1 st grinding position a1, and the 2 nd grinding position a 2. As compared with the case where the top panel 551 is open upward without covering the 1 st feeding and discharging position A3 and the 2 nd feeding and discharging position a0, the outflow of mist and fine particles from the inside to the outside of the case 55 can be suppressed.

One side plate 552 covers the sides of the 1 st carry-in and carry-out position A3 and the 2 nd carry-in and carry-out position a0, and has a carry-in and carry-out port 553 through which the substrate W passes. The feeding and discharging ports 553 are provided one on each side of the 1 st feeding and discharging position A3 and the 2 nd feeding and discharging position a 0. When the substrate W is carried in and out, the substrate W is held horizontally by the internal conveyance unit 54. Thus, when the substrate W is carried in and out, the size of the substrate W viewed from the side is smaller than the size of the substrate W viewed from above. Therefore, when the feeding/discharging port 553 is formed in the side plate 552, the size of the feeding/discharging port 553 can be made smaller than when the feeding/discharging port 553 is formed in the top plate 551. As a result, the outflow of the mist and the fine particles from the inside to the outside of the casing 55 through the delivery outlet 553 can be suppressed.

The top panel 551 may include a transparent portion 554 directly above the 1 st feeding position A3 and the 2 nd feeding position a0, respectively. The state of the holding

portions

52A, 52B, 52C, and 52D can be visually checked from above the top panel 551. At the 1 st carry-in and carry-out position A3 and the 2 nd carry-in and carry-out position a0, the grinding of the substrate W is not performed. Therefore, the transparent portion 554 may be formed of resin. The resin is inferior in durability to metal, but on the other hand, the resin is excellent in transparency.

The grinding module 5 may include a shutter 56 for opening and closing the feed-in/feed-out opening 553 of the side plate 552. The shutter 56 substantially closes the carry-in and carry-out port 553, and opens the carry-in and carry-out port 553 when the substrate W passes through. Compared with the case where the feed/discharge port 553 is always open, the outflow of mist and fine particles through the feed/discharge port 553 can be suppressed. A shutter 56 is provided at each of the in-feed outlets 553. The delivery outlet 553 can be opened and closed for each delivery outlet 553, and outflow of mist and fine particles can be further suppressed.

The internal conveyance unit 54 includes a chuck for holding the substrate W. The suction pad can move in the horizontal direction (both directions of the X-axis direction and the Y-axis direction) and the vertical direction, and can rotate about the vertical axis. The chuck holds the substrate W by suction from above.

As shown in fig. 2, the grinding module 5 includes

temporary placement units

57A, 57B, and 57C for temporarily storing the substrates W. The

temporary placement units

57A, 57B, and 57C deliver the substrates W between the internal conveyance unit 54 and the 1 st conveyance unit 38 of the cleaning module 3. The internal conveyance unit 54 receives the substrates W delivered to the

temporary placement units

57A and 57B by the 1 st conveyance unit 38 from the

temporary placement units

57A and 57B. Further, the 1 st conveyance unit 38 receives the substrate W delivered to the temporary placement unit 57C by the internal conveyance unit 54 from the temporary placement unit 57C.

The

temporary placement units

57A and 57B also serve as alignment units for adjusting the center position of the substrate W. The alignment section aligns the center position of the substrate W with a desired position by a guide or the like. Then, the substrate W is conveyed to a predetermined carry-in position by the internal conveyance unit 54, and the substrate W is delivered to the holding

portions

52A, 52B, 52C, and 52D at the carry-in position, so that the centers of the holding

portions

52A, 52B, 52C, and 52D can be aligned with the center of the substrate W when viewed from above.

The alignment unit may detect the center position of the substrate W by an optical system or the like. In this case, the control unit 9 corrects the previously set carry-in position based on the detection result of the alignment portion, and thereby can align the center of each of the holding

portions

52A, 52B, 52C, and 52D with the center of the substrate W when viewed from above. The alignment portion may also detect the crystal orientation of the substrate W by an optical system or the like, specifically, may also detect a notch or an orientation flat indicating the crystal orientation of the substrate W. The crystal orientation of the substrate W can be aligned with a desired orientation in the rotation coordinate system rotating together with the holding

portions

52A, 52B, 52C, and 52D.

The

temporary placement portions

57A and 57B may be stacked in the vertical direction to reduce the installation area of the grinding apparatus 1. The order of lamination is not limited to the illustrated order, and may be reversed. The

temporary placement units

57A and 57B preferably include guides instead of the optical system when they also serve as alignment units. Because, in the case where the

temporary placement sections

57A, 57B include guides, the dimension in the Z-axis direction of the

temporary placement sections

57A, 57B can be made smaller than in the case where the optical system is included.

The

temporary placement units

57B and 57C are disposed above the conveyance paths TR1 and TR2, and the internal conveyance units 54 convey the substrates W between the

temporary placement units

57B and 57C and the holding unit (e.g., the holding unit 52D) located at the 2 nd carry-in/out position a0 on the conveyance paths TR1 and TR 2. The

temporary placement sections

57B, 57C overlap the conveyance paths TR1, TR2 when viewed from above.

The

temporary placement units

57B and 57C are not disposed below the conveyance paths TR1 and TR2, but disposed above. A plurality of apparatuses can be stacked relatively freely in the vertical direction above the conveyance paths TR1, TR2, and the expandability of the grinding apparatus 1 can be improved. Further, since the

temporary placement units

57B and 57C overlap the conveyance paths TR1 and TR2 when viewed from above, the installation area of the grinding apparatus 1 can be reduced, and the grinding apparatus 1 can be downsized.

The grinding module 5 may include an inverting section 58 for inverting the substrate W. The reversing unit 58 is disposed above the conveyance paths TR1 and TR 2. The inverting portion 58 and the

temporary placement portions

57A, 57B, and 57C are stacked in the vertical direction. For example, the turning section 58, the temporary placement section 57C, the temporary placement section 57B, and the temporary placement section 57A are stacked in this order from the top down. The order of lamination is not particularly limited.

The grinding apparatus 1 further includes a control section 9. The control Unit 9 is, for example, a computer, and includes a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. A program for controlling various processes executed in the grinding apparatus 1 is stored in the storage medium 92. The control unit 9 controls the operation of the grinding apparatus 1 by causing the CPU91 to execute a program stored in the storage medium 92.

Next, a grinding method performed by the grinding apparatus 1 will be described with reference to fig. 4. The grinding method includes steps S101 to S111 shown in fig. 4, for example. Steps S101 to S111 are performed under the control of the control unit 9. The grinding method may not include all the steps shown in fig. 4, and may include steps not shown in fig. 4.

First, the 2 nd conveying unit 39 takes out the substrate W from the cassette C and conveys it to the temporary placement unit 35. Next, the 1 st conveyance unit 38 receives the substrate W from the temporary placement unit 35 and conveys the substrate W to the temporary placement unit 57A of the grinding module 5. The substrate W has a1 st main surface and a2 nd main surface facing opposite to each other, and is conveyed with the 1 st main surface facing upward.

Next, the temporary placement section 57A adjusts the center position of the substrate W (step S101). The temporary placement section 57A may detect the center position of the substrate W. In addition, the temporary placement section 57A can detect the crystal orientation of the substrate W in addition to the center position of the substrate W, and specifically, can also detect a notch or an orientation flat indicating the crystal orientation of the substrate W.

Next, the internal conveyance unit 54 receives the substrate W from the temporary placement unit 57A and conveys the substrate W to the holding unit (e.g., the holding unit 52C) located at the 1 st carry-in/out position a 3. The substrate W is placed on the holding portion 52C with the 1 st major surface facing upward. At this time, the center of the substrate W is aligned with the rotation center line R2 of the holding portion 52C. Then, the turntable 51 is rotated by 180 °, and the holder 52C is moved from the 1 st feed-in and feed-out position A3 to the 1 st grinding position a 1.

Next, the tool driving unit 53A drives the grinding tool D to grind the 1 st main surface of the substrate W (step S102). Then, the turntable 51 is rotated by 180 °, and the holder 52C is moved from the 1 st grinding position a1 to the 1 st feeding/discharging position A3. Next, the internal conveyance unit 54 receives the substrate W from the holding unit 52C located at the 1 st carry-in/out position a3, and conveys the substrate W to the reversing unit 58.

Next, the inverting unit 58 inverts the substrate W (step S103). The substrate W is turned upside down so that the 1 st main surface faces downward and the 2 nd main surface faces upward. Then, the 1 st transport unit 38 of the cleaning module 3 receives the substrate W from the inverting unit 58 and transports the substrate W to the cleaning unit 31A.

Next, the cleaning unit 31A cleans the 1 st main surface of the substrate W (step S104). The cleaning portion 31A can remove fine particles such as grinding chips. The cleaning unit 31A scrubs the substrate W, for example. The cleaning unit 31A may clean not only the 1 st main surface but also the 2 nd main surface of the substrate W. After the drying of the substrate W, the 1 st transport unit 38 receives the substrate W from the cleaning unit 31A and transports the substrate W to the temporary placement unit 57B of the grinding module 5.

Next, the temporary placement section 57B adjusts the center position of the substrate W (step S105). The temporary placement section 57B may detect the center position of the substrate W. In addition, the temporary placement section 57B may detect the crystal orientation of the substrate W in addition to the center position of the substrate W, and specifically, may detect a notch or an orientation flat indicating the crystal orientation of the substrate W.

Next, the internal conveyance unit 54 receives the substrate W from the temporary placement unit 57B and conveys the substrate W to the holding unit (e.g., the holding unit 52D) located at the 2 nd carry-in/out position a 0. The substrate W is placed on the holding portion 52D with the 2 nd main surface facing upward. At this time, the center of the substrate W is aligned with the rotation center line R2 of the holding portion 52D. Then, the turntable 51 is rotated by 180 °, and the holder 52C is moved from the 2 nd feeding-in and feeding-out position a0 to the 2 nd grinding position a 2.

Next, the tool driving unit 53B drives the grinding tool D to grind the 2 nd main surface of the substrate W (step S106). Then, the turntable 51 is rotated by 180 °, and the holder 52D is moved from the 2 nd grinding position a2 to the 2 nd feeding-out position a 0. Next, the internal conveyance unit 54 receives the substrate W from the holding unit 52D located at the 2 nd carrying-in/out position a0, and conveys the substrate W to the temporary placement unit 57C. Then, the 1 st conveyance unit 38 of the cleaning module 3 receives the substrate W from the temporary placement unit 57C and conveys the substrate W to the cleaning unit 31B.

Next, the cleaning unit 31B cleans the 2 nd main surface of the substrate W (step S107). The cleaning portion 31B can remove fine particles such as grinding chips. The cleaning unit 31B scrubs the substrate W, for example. The cleaning unit 31B may clean not only the 2 nd main surface but also the 1 st main surface of the substrate W. After the drying of the substrate W, the 2 nd conveying unit 39 receives the substrate W from the cleaning unit 31B and conveys the substrate W to the etching unit 32B.

Next, the etching unit 32B etches the 2 nd main surface of the substrate W (step S108). The grinding traces on the 2 nd main surface can be removed by the etching portion 32B. After the drying of the substrate W, the 2 nd transport unit 39 receives the substrate W from the etching unit 32B and transports the substrate W to the reversing unit 34.

Next, the inverting unit 34 inverts the substrate W (step S109). The substrate W is turned upside down so that the 1 st main surface faces upward and the 2 nd main surface faces downward. Then, the 2 nd transfer unit 39 receives the substrate W from the reversing unit 34 and transfers the substrate W to the etching unit 32A.

Next, the etching unit 32A etches the 1 st main surface of the substrate W (step S110). The grinding traces on the 1 st main surface can be removed by the etching portion 32A. After the drying of the substrate W, the 2 nd transport unit 39 receives the substrate W from the etching unit 32A and transports the substrate W to the inspection unit 33.

Next, the inspection unit 33 inspects the substrate W (step S111). For example, the inspection unit 33 measures the thickness of the substrate W after etching, and inspects whether the thickness of the substrate W and the variation in the thickness are within a predetermined allowable range. Then, the 2 nd transport unit 39 receives the substrate W from the inspection unit 33 and stores the received substrate W in the cassette C. Then, the process this time is ended.

In the description of fig. 4, the grinding method is described focusing on one substrate W. The grinding apparatus 1 can perform a plurality of processes at a plurality of positions at the same time to improve productivity. For example, the grinding apparatus 1 simultaneously grinds the substrate W at the 1 st grinding position a1 and the 2 nd grinding position a2, respectively. During this time, the grinding apparatus 1 sequentially performs, for example, the spray rinsing of the substrate W, the measurement of the thickness distribution of the substrate W, the feeding of the substrate W, the cleaning of the substrate suction surface (upper surface) of the holding portion, the feeding of the substrate W, and the like at the 1 st feeding and feeding position A3 and the 2 nd feeding and feeding position a0, respectively.

Then, the grinding apparatus 1 rotates the rotary table 51 by 180 °. Next, the grinding apparatus 1 simultaneously grinds the substrate W again at the 1 st grinding position a1 and the 2 nd grinding position a2, respectively. During this time, the grinding apparatus 1 again sequentially performs the spray cleaning of the substrate W, the measurement of the thickness distribution of the substrate W, the delivery of the substrate W, the cleaning of the substrate suction surface (upper surface) of the holding portion, the delivery of the substrate W, and the like at the 1 st delivery position A3 and the 2 nd delivery position a0, respectively.

Next, a grinding apparatus 1 according to a modification will be described with reference to fig. 5. Hereinafter, differences between the present modification and the above embodiment will be mainly described. The grinding module 5 may include an aligning portion 59 on the side opposite to the reversing portion 58 and the

temporary placement portions

57A, 57B, and 57C (see fig. 2) with reference to the internal conveying portion 54 when viewed from above.

The alignment section 59 detects the center position of the substrate W. The alignment portion 59 may detect the crystal orientation of the substrate W, specifically, a notch or an orientation flat indicating the crystal orientation of the substrate W, in addition to the center position of the substrate W. The alignment portion 59 doubles as the

temporary placement portions

57A, 57B.

According to the present modification, the aligning portion 59 does not overlap with the turning portion 58, the temporary placement portion 57C, and the like when viewed from above. This can reduce the stacking height of the inverting unit 58, the temporary placement unit 57C, and the like.

Next, referring to fig. 6, the stacked substrate T ground by the grinding apparatus 1 will be described. The stacked substrate T includes a1 st substrate W1 and a2 nd substrate W2 bonded to each other. Before bonding, a bonding film B1 is formed on the bonding surface of the 1 st substrate W1, and a bonding film B2 is formed on the bonding surface of the 2 nd substrate W2. The bonding films B1 and B2 are oxide films or the like.

As shown in fig. 6 (a), the modified layer E is formed by irradiating the predetermined dividing surface inside the 1 st substrate W1 with a laser beam LB. The modified layer E is formed in a plurality of dispersed layers on the planned dividing surface. As shown in fig. 6 (B), the 1 st substrate W1 is divided from the reformed layer E, thereby thinning the 1 st substrate W1. Traces of the modified layer E remained on the 1 st substrate W1.

The grinding apparatus 1 may grind only the 1 st main surface (the upper surface in fig. 6B) of the superimposed substrate T on which the trace of the modified layer E remains, without grinding the 2 nd main surface (the lower surface in fig. 6B) of the superimposed substrate T. In this case, the stacked substrate T is placed on the holding portion so that the 1 st main surface faces upward at both the 1 st carry-in and carry-out position A3 and the 2 nd carry-in and carry-out position a 0. In this case, the turning

sections

34, 58 are not required. The cleaning unit 31B may clean the 1 st main surface of the stacked substrate T, and the etching unit 32B may etch the 1 st main surface of the stacked substrate T.

While the embodiments of the grinding apparatus of the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations may be made within the scope of the claims. These are of course also within the technical scope of the present disclosure.

Claims

1. A grinding device, wherein,

the grinding device comprises:

a grinding module comprising: a holding section for holding a substrate; a tool driving unit that drives a grinding tool that grinds the substrate; a temporary placement unit that temporarily stores the substrate; and an internal conveying section that conveys the substrate between the temporary placement section and the holding section; and

a cleaning module comprising: a cleaning unit configured to clean the substrate ground by the grinding tool; and a1 st conveying part which conveys the substrate between the cleaning part and the grinding module,

the temporary placement unit is disposed above a conveyance path along which the internal conveyance unit conveys the substrate between the temporary placement unit and the holding unit.

2. A grinding apparatus according to claim 1,

the grinding module comprises a turning part which turns the substrate,

the inverting unit is disposed above the conveying path, and the inverting unit and the temporary placement unit are stacked in a vertical direction.

3. A grinding apparatus according to claim 1 or 2,

the grinding module includes a rotary table rotating around a rotation center line, the number of the holding portions is 4, the number of the tool driving portions is two, and the 4 holding portions rotate together with the rotary table,

the two holding portions are arranged symmetrically about the rotation center line and move between a1 st carry-in/out position where the substrate is carried in/out by the internal conveying portion and a1 st grinding position where the substrate is ground by one of the tool driving portions,

the other two holding portions are symmetrically arranged around the rotation center line and move between a2 nd carrying-in/out position where the substrate is carried in/out by the internal conveying portion and a2 nd grinding position where the substrate is ground by the other tool driving portion.

4. A grinding apparatus according to claim 3,

the grinding module includes a housing accommodating the rotary table and 4 of the holders,

the housing includes a top plate and a plurality of side plates,

the top plate covers the upper parts of the 1 st feeding-out position, the 2 nd feeding-out position, the 1 st grinding position and the 2 nd grinding position,

one side plate covers the side of the 1 st feeding-out position and the 2 nd feeding-out position and is provided with a feeding-in feeding-out port through which the substrate passes.

5. A grinding apparatus according to claim 4,

the grinding module includes a gate for opening and closing the feed-in and feed-out port of the side plate.

6. A grinding apparatus according to any one of claims 3 to 5,

the grinding device comprises a control part for controlling the internal conveying part,

the substrate has a1 st major surface and a2 nd major surface facing opposite each other,

the control unit places the substrate on the holding unit located at the 1 st carrying-in/out position so that the 1 st main surface faces upward, and places the substrate on the holding unit located at the 2 nd carrying-in/out position so that the 2 nd main surface faces upward.

7. A grinding apparatus according to any one of claims 1 to 6,

the temporary placement section doubles as an alignment section for adjusting the center position of the substrate.

8. A grinding apparatus according to any one of claims 1 to 6,

the grinding module includes an alignment portion that detects a center position of the substrate on a side opposite to the temporary placement portion with reference to the internal conveyance portion when viewed from above.

9. A grinding apparatus according to any one of claims 1 to 8,

the grinding device comprises a feeding-in and feeding-out module, the feeding-in and feeding-out module comprises a carrying part for carrying a box for accommodating the substrate,

the cleaning module includes a2 nd transport unit that transports the substrate between the cleaning module and the cassette placed on the placement unit by the 2 nd transport unit.

10. A grinding apparatus according to claim 9,

the cleaning module comprises: an etching unit configured to etch the substrate cleaned by the cleaning unit; and an inspection unit for inspecting the substrate etched by the etching unit,

the 2 nd transport unit transports the substrate from the etching unit to the inspection unit.