CN114905164A - A laser processing device and processing method thereof - Google Patents
A laser processing device and processing method thereof Download PDFInfo
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Abstract
Description
技术领域technical field
本发明涉及激光加工的技术领域,特别是涉及一种激光加工装置及其加工方法。The present invention relates to the technical field of laser processing, in particular to a laser processing device and a processing method thereof.
背景技术Background technique
目前,硬脆性材料的特点是硬度高,脆性大,材料的弹性极限和强度非常接近。对硬脆性材料进行加工时,其表面容易产生裂纹和破损,传统加工工艺效率低,工艺难度大。在激光技术高速发展的今天,激光加工应用在针对硬脆性材料加工的工艺中逐渐突显出优势,传统加工方式是通过伺服电机传动激光切割头的运动对加工件进行加工,在保证加工精度、加工质量的同时,伺服传动的运动效率对加工效率还具有更高的提升空间。At present, hard brittle materials are characterized by high hardness and brittleness, and the elastic limit and strength of the materials are very close. When processing hard and brittle materials, the surface is prone to cracks and breakage. The traditional processing technology is inefficient and difficult to process. With the rapid development of laser technology today, the application of laser processing has gradually highlighted its advantages in the process of processing hard and brittle materials. The traditional processing method is to process the workpiece through the motion of the laser cutting head driven by a servo motor, which ensures the processing accuracy and processing. While improving the quality, the motion efficiency of the servo drive also has a higher room for improvement in the processing efficiency.
发明内容SUMMARY OF THE INVENTION
本发明的目的是:提供一种激光加工装置及其加工方法,提升激光加工精度和加工速率。The purpose of the present invention is to provide a laser processing device and a processing method thereof, so as to improve the laser processing precision and processing speed.
为了实现上述目的,本发明提供了一种激光加工装置,夹具平台,所述夹具平台包括用于固定夹具的夹具板和用于驱动所述夹具板变更加工位置的位置驱动组件,所述夹具板安装与所述位置驱动组件的上端;In order to achieve the above object, the present invention provides a laser processing device and a fixture platform, the fixture platform includes a fixture plate for fixing a fixture and a position driving component for driving the fixture plate to change the processing position, the fixture plate Install the upper end of the drive assembly with the position;
光路组件,所述光路组件包括激光升降支架、激光发生组件和风刀,所述激光发生组件安装于所述激光升降支架,所述激光发生组件包括激光发生器、振镜和激光控制器,所述激光控制器与所述激光发生器通信连接,所述激光控制器与所述振镜驱动连接,所述风刀的上端开设有进光口,所述风刀内开设有缓气腔,所述风刀的外侧开设有进气口,所述进气口与所述缓气腔连通,所述风刀的下端开设有长条形的加工口,所述加工口朝向所述夹具板设置,所述进光口、所述缓气腔和所述加工口连通形成激光射出通道,所述进光口与所述振镜的出光口连通,所述激光控制器控制激光发生器朝向所述振镜射出激光,所述振镜反射激光通过激光射出通道射出,所述激光控制器控制振镜转动,以将激光沿所述加工口的延伸方向进行移动切割;an optical path assembly, the optical path assembly includes a laser lifting bracket, a laser generating assembly and an air knife, the laser generating assembly is mounted on the laser lifting bracket, the laser generating assembly includes a laser generator, a galvanometer and a laser controller, the The laser controller is connected in communication with the laser generator, and the laser controller is drivingly connected with the galvanometer. The upper end of the air knife is provided with a light inlet, and the air knife is provided with a slow air cavity. An air inlet is opened on the outside of the air knife, and the air inlet is communicated with the slow air cavity. The lower end of the air knife is provided with a long processing port, and the processing port is arranged towards the fixture plate, so The light inlet, the slow air cavity and the processing port are connected to form a laser emission channel, the light inlet is communicated with the light outlet of the galvanometer, and the laser controller controls the laser generator to face the galvanometer. The laser is emitted, the laser reflected by the galvanometer is emitted through the laser emission channel, and the laser controller controls the rotation of the galvanometer to move and cut the laser along the extension direction of the processing port;
供气压缩组件,所述供气压缩组件与所述进气口连通;an air supply compression assembly, the air supply compression assembly being communicated with the air inlet;
系统控制器,所述系统控制器分别与所述位置驱动组件、激光控制器和所述供气压缩组件通信连接。a system controller, which is respectively connected in communication with the position driving assembly, the laser controller and the air supply compression assembly.
作为优选方案,所述位置驱动组件包括均沿水平方向放置的左右移动组件和前后移动组件,所述夹具板滑动安装于所述前后移动组件的顶端,所述前后移动组件驱动所述夹具板前后移动,所述前后移动组件滑动安装于所述左右移动组件,所述左右移动组件驱动所述前后移动组件左右滑动。As a preferred solution, the position driving assembly includes a left and right moving assembly and a front and rear moving assembly that are placed in a horizontal direction, the clamp plate is slidably installed on the top of the front and rear moving assembly, and the front and rear moving assembly drives the clamp plate back and forth. To move, the front and rear moving components are slidably mounted on the left and right moving components, and the left and right moving components drive the front and rear moving components to slide left and right.
作为优选方案,所述位置驱动组件包括升降部和旋转部,所述旋转部与所述左右移动组件驱动连接,所述升降部与所述旋转部驱动连接。As a preferred solution, the position driving assembly includes a lifting part and a rotating part, the rotating part is drivingly connected with the left-right moving assembly, and the lifting part is drivingly connected with the rotating part.
作为优选方案,所述加工口的长度与所述加工口的宽度比设置在45-60。As a preferred solution, the ratio of the length of the processing port to the width of the processing port is set at 45-60.
作为优选方案,所述振镜为单轴扫描振镜,所述单轴扫描振镜包括微调反射镜、单轴扫描镜片和调节螺杆,所述调节螺杆与所述微调反射镜滑动连接,所述单轴扫描镜片位于所述微调反射镜的一侧。As a preferred solution, the galvanometer is a single-axis scanning galvanometer, and the single-axis scanning galvanometer includes a fine-tuning mirror, a single-axis scanning mirror, and an adjusting screw, the adjusting screw is slidably connected to the fine-tuning mirror, and the fine-tuning mirror is slidably connected. A single-axis scanning mirror is located on one side of the fine-tuning mirror.
作为优选方案,所述振镜与所述风刀的连接处固定有角度刻度环,所述角度刻度环的初始刻度与微调反射镜的初始位置对齐,所述角度刻度环套设所述风刀的外周,所述风刀相对角度刻度环转动。As a preferred solution, an angle scale ring is fixed at the connection between the galvanometer and the air knife, the initial scale of the angle scale ring is aligned with the initial position of the fine-tuning mirror, and the angle scale ring is sleeved on the air knife The outer circumference of the air knife rotates relative to the angle scale ring.
一种激光加工装置的加工方法,通过激光加工装置对加工件进行激光切割加工,所述激光切割加工包括直线切割加工,所述直线切割加工包括以下步骤:A processing method of a laser processing device, the laser processing device performs laser cutting processing on a workpiece, the laser cutting processing includes linear cutting processing, and the linear cutting processing includes the following steps:
系统控制器获取加工件的加工切割路径,所述加工切割路径包括N个直线加工路径,N≥1;The system controller obtains the processing and cutting path of the workpiece, the processing and cutting path includes N linear processing paths, N≥1;
所述激光加工装置内的红光指示器进行激光光路调试,红光通过所述振镜反射从所述加工口射出,所述激光控制器控制所述振镜中的反射镜片的转动,红光通过转动的所述反射镜片在加工口内移动形成激光切割路径,所述激光切割路径与所述加工口的延伸方向相同,所述激光切割路径位于所述加工口内;The red light indicator in the laser processing device is used to debug the laser light path. The red light is reflected from the galvanometer and emitted from the processing port. The laser controller controls the rotation of the reflecting mirror in the galvanometer. A laser cutting path is formed by moving the rotating mirror plate in the processing port, the laser cutting path is the same as the extending direction of the processing port, and the laser cutting path is located in the processing port;
所述加工件放置于所述夹具板,所述系统控制器根据所述加工切割路径控制位置驱动组件驱动所述夹具板移动,使加工件的第一个直线加工路径与激光切割路径方向重叠,激光控制器控制激光发生器发射激光并驱动所述反射镜片转动,激光沿激光切割路径切割,完成第一个直线切割加工;The workpiece is placed on the jig board, and the system controller controls the position driving component according to the processing and cutting path to drive the jig board to move, so that the first linear processing path of the workpiece overlaps the direction of the laser cutting path, The laser controller controls the laser generator to emit laser and drives the reflective lens to rotate, and the laser cuts along the laser cutting path to complete the first linear cutting process;
若N=1,则完成加工件的直线切割加工,若N>1,系统控制器根据所述加工切割路径控制位置驱动组件驱动所述夹具板移动,使加工件的下一个直线加工路径与激光切割路径重叠,激光控制器控制激光发生器发射激光并驱动所述反射镜片转动,激光沿激光切割路径切割,完成下一个直线切割加工,重复该步骤,直至完成所述加工件所有的直线切割加工。If N=1, the linear cutting process of the workpiece is completed. If N>1, the system controller controls the position driving component according to the processing and cutting path to drive the fixture plate to move, so that the next linear processing path of the workpiece is connected to the laser beam. The cutting paths overlap. The laser controller controls the laser generator to emit laser light and drives the mirror to rotate. The laser cuts along the laser cutting path to complete the next linear cutting process. Repeat this step until all linear cutting processes of the workpiece are completed. .
作为优选方案,所述激光加工装置包括用于对所述夹具板上的所述加工件加工信息的图像识别装置,所述图像识别装置与所述系统控制器通信连接;As a preferred solution, the laser processing device includes an image recognition device for processing information of the workpiece on the fixture board, and the image recognition device is connected in communication with the system controller;
所述图像识别装置的识别范围位于所述风刀的对应下方,所述夹具板上的所述加工件移动至所述识别范围时,所述图像识别装置将识别信号发送至系统控制器,系统控制器控制位置驱动组件停止传动;The recognition range of the image recognition device is located under the corresponding air knife, and when the workpiece on the fixture plate moves to the recognition range, the image recognition device sends the recognition signal to the system controller, and the system The controller controls the position drive assembly to stop transmission;
人工操作系统控制器控制位置驱动组件将所述加工件调整至加工位置,并获取所述加工件的图像加工路径,并在图像加工路径上标记加工起点。The manual operating system controller controls the position driving component to adjust the workpiece to the processing position, obtains the image processing path of the workpiece, and marks the processing starting point on the image processing path.
作为优选方案,所述图像识别装置为同轴相机。As a preferred solution, the image recognition device is a coaxial camera.
作为优选方案,在所述系统控制器中形成所述加工件的模型加工路径,通过系统控制器将模型加工路径与图像加工路径对应匹配形成加工路径,所述系统控制器根据所述图像加工路径标定加工初始点。As a preferred solution, the model processing path of the workpiece is formed in the system controller, and the model processing path is matched with the image processing path through the system controller to form a processing path, and the system controller is based on the image processing path. Calibration of the initial point of processing.
本发明实施例一种激光加工装置及其加工方法与现有技术相比,其有益效果在于:系统控制器分别与所述位置驱动组件、激光控制器和所述供气压缩组件通信连接。系统控制器通过位置驱动组件驱动夹具板移动,以调节加工件的加工位置。系统控制器通过供气压缩组件控制风刀的气体供应。系统控制器通过激光控制器控制激光开关、角度调节和移动加工。夹具平台用于固定加工件以及将加工件移动至加工位置。加工件放置于夹具板进行固定,通过位置驱动组件驱动夹具板变更加工位置,其中至少包括前后移动和左右移动。光路组件主要负责激光加工。其中,激光升降支架用于对激光发生组件和风刀作为支撑,时激光发生组件和风刀分别与夹具板保持一定加工距离,同时,调节激光发生组件和风刀垂直方向的高度,以调节激光焦距。通过激光控制器控制激光发生器射出激光。振镜用于将激光反射至风刀的加工口,并通过转动振镜以调节激光的射出位置和直线移动范围,激光发射至振镜,通过振镜将激光反射至风刀的加工口,通过转动振镜,调节激光反射角度,以保证激光从加工口射出,并使激光直线移动路径与加工口的延伸方向保持一致。激光控制器控制振镜转动,以使振镜反射的激光按照设定的直线加工路径移动,激光进行直线移动切割时,夹具平台将加工件的位置进行锁定,通过振镜、风刀与夹具平台的配合使用,风刀口为激光提供加工范围,利用振镜的移动精度和速度,以提高整体的激光直线切割加工效率。供气压缩组件通过进气口与缓冲腔连通,供气压缩组件向缓冲腔充入气体,气体和激光均从加工口射出,以使激光加工位置位于气体吹出的范围内,提升风刀除尘的精准度,提升除尘效果。Compared with the prior art, a laser processing device and a processing method thereof according to an embodiment of the present invention have the beneficial effect that the system controller is respectively connected in communication with the position driving component, the laser controller and the air supply compressing component. The system controller drives the fixture plate to move through the position drive assembly to adjust the processing position of the workpiece. The system controller controls the air supply to the air knife through the air supply compression assembly. The system controller controls the laser switch, angle adjustment and mobile processing through the laser controller. The fixture platform is used to hold the workpiece and move the workpiece to the machining position. The workpiece is placed on the fixture plate for fixing, and the fixture plate is driven by the position driving component to change the processing position, including at least forward and backward movement and left and right movement. The optical path component is mainly responsible for laser processing. Among them, the laser lifting bracket is used to support the laser generator assembly and the air knife. When the laser generator assembly and the air knife respectively maintain a certain processing distance from the fixture plate, at the same time, the height of the laser generator assembly and the air knife in the vertical direction is adjusted to adjust the laser focal length. The laser controller is used to control the laser generator to emit laser light. The galvanometer is used to reflect the laser to the processing port of the air knife, and by rotating the galvanometer to adjust the output position and linear movement range of the laser, the laser is emitted to the galvanometer, and the laser is reflected to the processing port of the air knife through the galvanometer. Rotate the galvanometer and adjust the laser reflection angle to ensure that the laser is emitted from the processing port, and the linear movement path of the laser is consistent with the extension direction of the processing port. The laser controller controls the rotation of the galvanometer, so that the laser reflected by the galvanometer moves according to the set linear processing path. When the laser moves and cuts in a straight line, the fixture platform locks the position of the workpiece. Through the galvanometer, air knife and fixture platform The air knife edge provides the processing range for the laser, and uses the moving accuracy and speed of the galvanometer to improve the overall laser linear cutting processing efficiency. The air supply compression assembly is communicated with the buffer cavity through the air inlet, and the air supply compression assembly fills the buffer cavity with gas, and both the gas and the laser are ejected from the processing port, so that the laser processing position is located within the range of the gas blowing, and the air knife dust removal efficiency is improved. Accuracy, improve dust removal effect.
附图说明Description of drawings
图1是本发明实施例的整体结构示意图。FIG. 1 is a schematic diagram of the overall structure of an embodiment of the present invention.
图2是本发明实施例光路组件的结构示意图。FIG. 2 is a schematic structural diagram of an optical path assembly according to an embodiment of the present invention.
图3是本发明实施例位置驱动组件的结构示意图。FIG. 3 is a schematic structural diagram of a position driving assembly according to an embodiment of the present invention.
图4是本发明实施例风刀的结构示意图。4 is a schematic structural diagram of an air knife according to an embodiment of the present invention.
图5是本发明实施例风刀的内部结构示意图。FIG. 5 is a schematic diagram of the internal structure of the air knife according to the embodiment of the present invention.
图6是本发明实施例风刀加工口的结构示意图。FIG. 6 is a schematic structural diagram of an air knife processing port according to an embodiment of the present invention.
图7是本发明实施例光路在振镜的传播路径结构示意图。FIG. 7 is a schematic structural diagram of a propagation path of an optical path in a galvanometer according to an embodiment of the present invention.
图8是本发明实施例调节螺杆的结构示意图。8 is a schematic structural diagram of an adjusting screw according to an embodiment of the present invention.
图中:In the picture:
10、夹具平台;11、夹具板;12、位置驱动组件;13、左右移动组件;14、前后移动组件;15、升降部;16、旋转部;10. Fixture platform; 11. Fixture plate; 12. Position drive assembly; 13. Left and right moving assembly; 14. Front and rear moving assembly; 15. Lifting part; 16. Rotating part;
20、光路组件;21、激光升降支架;20. Optical path components; 21. Laser lifting bracket;
30、激光发生组件;31、激光发生器;32、系统控制卡;30. Laser generating components; 31. Laser generator; 32. System control card;
40、风刀;41、进光口;42、缓气腔;43、进气口;44、加工口;45、角度刻度环;46、防尘透光镜;47、卡接凸台;48、密封圈;49、卡环;40, air knife; 41, light inlet; 42, slow air cavity; 43, air inlet; 44, processing port; 45, angle scale ring; 46, dust-proof light-transmitting mirror; 47, snap-on boss; 48 , sealing ring; 49, snap ring;
50、振镜;51、微调反射镜;52、单轴扫描镜片;53、调节螺杆;50. Galvanometer; 51. Fine-tuning mirror; 52. Single-axis scanning lens; 53. Adjusting screw;
60、激光控制器;61、图像识别装置;62、电脑主机;63、显示器。60. Laser controller; 61. Image recognition device; 62. Computer host; 63. Display.
具体实施方式Detailed ways
下面结合附图和实施例,对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明,但不用来限制本发明的范围。The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and embodiments. The following examples are intended to illustrate the present invention, but not to limit the scope of the present invention.
在本发明的描述中,应当理解的是,本发明中采用术语“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", The orientation or positional relationship indicated by "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that The device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.
在本发明的描述中,应当理解的是,本发明中采用术语“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是焊接连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系,除非另有明确的限定。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be understood that the terms "connected", "connected", "fixed" and other terms used in the present invention should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection, or It can be a mechanical connection or a welded connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between the two elements, unless otherwise expressly defined . For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
如图1至图8所示,本发明实施例优选实施例的一种激光加工装置,夹具平台10,夹具平台10包括用于固定夹具的夹具板11和用于驱动夹具板11变更加工位置的位置驱动组件12,夹具板11安装与位置驱动组件12的上端;As shown in FIGS. 1 to 8 , a laser processing device according to a preferred embodiment of the present invention, a
光路组件20,光路组件20包括激光升降支架21、激光发生组件30和风刀40,激光发生组件30安装于激光升降支架21,激光发生组件30包括激光发生器31、振镜50和激光控制器60,激光控制器60与激光发生器31通信连接,激光控制器60与振镜50驱动连接,风刀40的上端开设有进光口41,风刀40内开设有缓气腔42,风刀40的外侧开设有进气口43,进气口43与缓气腔42连通,风刀40的下端开设有长条形的加工口44,加工口44朝向夹具板11设置,进光口41、缓气腔42和加工口44连通形成激光射出通道,进光口41与振镜50的出光口连通,激光控制器60控制激光发生器31朝向振镜50射出激光,振镜50反射激光通过激光射出通道射出,激光控制器60控制振镜50转动,以将激光沿加工口44的延伸方向进行移动切割;The
供气压缩组件,供气压缩组件与进气口43连通;air supply compression assembly, the air supply compression assembly is communicated with the
系统控制卡32,系统控制卡32分别与位置驱动组件12、激光控制器60和供气压缩组件通信连接。The
本发明的激光加工装置,系统控制卡32分别与位置驱动组件12、激光控制器60和供气压缩组件通信连接。系统控制卡32通过位置驱动组件12驱动夹具板11移动,以调节加工件的加工位置。系统控制卡32通过供气压缩组件控制风刀40的气体供应。系统控制卡32通过激光控制器60控制激光开关、角度调节和移动加工。夹具平台10用于固定加工件以及将加工件移动至加工位置。加工件放置于夹具板11进行固定,通过位置驱动组件12驱动夹具板11变更加工位置,其中至少包括前后移动和左右移动。光路组件20主要负责激光加工。其中,激光升降支架21用于对激光发生组件30和风刀40作为支撑,时激光发生组件30和风刀40分别与夹具板11保持一定加工距离,同时,调节激光发生组件30和风刀40垂直方向的高度,以调节激光焦距。通过激光控制器60控制激光发生器31射出激光。振镜50用于将激光反射至风刀40的加工口44,并通过转动振镜50以调节激光的射出位置和加工口44中的直线移动范围,激光发射至振镜50,通过振镜50将激光反射至风刀40的加工口44,通过转动振镜50,调节激光反射角度,以保证激光从加工口44射出,并使激光直线移动路径与加工口44的延伸方向保持一致。激光控制器60控制振镜50转动,以使振镜50反射的激光按照设定的直线加工路径移动,激光进行直线移动切割时,夹具平台10将加工件的位置进行锁定,通过振镜50、风刀40与夹具平台10的配合使用,风刀40口为激光提供加工范围,利用振镜50的移动精度和速度,以提高整体的激光直线切割加工效率。供气压缩组件通过进气口43与缓冲腔连通,供气压缩组件向缓冲腔充入气体,气体和激光均从加工口44射出,以使激光加工位置位于气体吹出的范围内,提升风刀40除尘的精准度,提升除尘效果。其中,本发明的激光加工装置针对硬脆性材料加工效率提升尤为明显,硬脆性材料的特点是硬度高,脆性大,材料的弹性极限和强度非常接近。对硬脆性材料进行加工时,其表面容易产生裂纹和破损,传统加工工艺效率低,工艺难度大。当激光开始加工时,夹具平台10的所有传动机构不运行,通过振镜50高速扫描来进行激光加工,精度高,速度极快,降低了硬脆性材料的裂纹和破损的形成几率,有效提升硬脆性材料的加工成品率。加工过程中,利用振镜50的精度和速度替代伺服电机的运动以提高整体加工效率,同时本发明的激光加工系统和方法中的除渣风刀配合单轴振镜的激光切割路径进行清理切割粉尘,提升产品加工质量,同时保护激光切割光路和装置。In the laser processing device of the present invention, the
作为优选的,夹具板11朝向风刀40下端设置,夹具板11设置于风刀40的对应下方,缩短夹具板11的移动距离,提高生产效率。Preferably, the
供气压缩组件向缓冲腔吹入的气体一般为空气,按照工艺要求供气压缩装置吹入的气体为氩气、氮气等。The gas blown into the buffer chamber by the air supply compression assembly is generally air, and the gas blown into the air supply compression device according to the process requirements is argon, nitrogen, etc.
更为具体的,激光加工装置包括电脑主机62和显示器63,系统控制卡32与显示器63分别电脑主机62通信连接。More specifically, the laser processing device includes a
作为其中一实施例,振镜50为单轴振镜、双轴振镜或多轴振镜。作为优选的,振镜50为单轴振镜,满足使用需求,提升调节效率。As one embodiment, the
进一步的,位置驱动组件12包括均沿水平方向放置的左右移动组件13和前后移动组件14,夹具板11滑动安装于前后移动组件14的顶端,前后移动组件14驱动夹具板11前后移动,前后移动组件14滑动安装于左右移动组件13,左右移动组件13驱动前后移动组件14左右滑动,左右移动组件13和前后移动组件14通过夹具板11带动加工件前后左右移动,调节加工件的加工位置。具体的,左右移动组件13和前后移动组件14与系统控制卡32通信连接。系统控制卡32向左右移动组件13和前后移动组件14发送移动号,控制左右移动组件13驱动或前后移动组件14驱动。Further, the
更为具体的,左右移动组件13和前后移动组件14均为伸缩气缸,通过伸缩气缸的伸缩端驱动左右移动或前后移动。或者左右移动组件13和前后移动组件14均通过伺服电机的传动端与螺杆连接,螺杆上套设有螺母,伺服电机传动螺杆转动,螺母相对螺杆移动,进而实现左右移动或前后移动,伺服电机传动精度高,提升加工精度。More specifically, the left and right moving components 13 and the front and rear moving
进一步的,位置驱动组件12包括升降部15和旋转部16,旋转部16与左右移动组件13驱动连接,升降部15与旋转部16驱动连接。旋转部16驱动左右移动组件13旋转,左右移动组件13带动前后移动组件14和夹具板11旋转,进而实现加工件加工角度的调整,由于加工口44为长条形,激光只能沿加工口44的延伸方向移动,在加工过程中需要将激光切割路径与直线加工路径设置重叠,通过旋转部16、左右移动组件13和前后移动组件14的结合使用,提升激光切割路径与直线加工路径重叠设置的调整效率。升降部15驱动旋转部16、左右移动组件13、前后移动组件14和夹具板11的升降,调整加工件与风刀40之间的距离。虽然激光升降支架21也能调整加工件与风刀40支架的距离,由于升降部15所在位置相对交底,更便于对夹具板11的高度进行微调,提升调节效率,降低操作难度。其中,升降部15为伸缩气缸或通过电机带动螺杆,螺杆上套装螺母实现升降。Further, the
进一步的,加工口44的长度与加工口44的宽度比设置在45-60。加工口44设置在合适范围,有效降低加工口44的风阻,在保证加工口44出风速率的前提下降低能耗,激光在加工口44移动范围增大,提升加工效率和加工适用范围。Further, the ratio of the length of the
作为优选的,加工口44的长度与加工口44的宽度比设置在52-55。作为其中一实施例,加工口44的宽度设置在1.5mm。作为优选的,加工口44的长度设置在75-85mm。Preferably, the ratio of the length of the
风刀40的上端为圆筒型,进光口41的直径与加工口44的长度对应设置,以使在进光口41的尺寸内,加工口44能提供给激光更大的加工范围。The upper end of the
作为其中一优选实施例,缓冲腔的上端形状与风刀40上端的圆筒形相匹配,缓冲腔的下端形状与加工口44的形状相匹配,缓冲腔形成一从上端的圆筒状逐渐过渡至下端的长条形,以使气体在圆筒状部分得以缓冲后向加工口44流向过程中逐步形成挤压,提升气体流出的稳定性和流出速率。As one of the preferred embodiments, the shape of the upper end of the buffer cavity matches the cylindrical shape of the upper end of the
作为其中一实施例,加工口44为长方形,进气口43的轴线穿过加工口44的中心点,进气口43与缓冲腔同轴安装。As one embodiment, the
进一步的,进气口43与缓冲腔之间安装有防尘透光镜46,防尘透光镜46位于进气口43的上方。防尘透光镜46为平面玻璃片,激光透过防尘透光镜46后进入缓冲腔,防尘透光镜46用于确保风刀40结构将前端光学与光束加工区域完全密封隔离开,渣料不会倒流污染设备内部光学结构,延长激光发生器31的使用寿命。由于防尘透光镜46位于进风口的上方,进而保证主体的顺利出风。Further, a dust-proof light-transmitting
更为具体的,缓冲腔上方的内壁沿径向方向凸出形成卡接凸台47,卡接凸台47位于进气口43的上方,防尘透光镜46放置于卡接凸台47,进气口43内壁设有卡环49,通过卡环49将透光镜压紧与卡接凸台47,卡环49的外壁与进气口43的内壁抵贴安装,防止防尘透光镜46掉落。更为优选的,在防尘透光镜46与卡环49之间设有密封圈48,通过卡环49卡紧密封圈48和防尘透光镜46以提升进光口41的密封度,避免微小粉尘进入激光发生器31。More specifically, the inner wall above the buffer cavity protrudes in the radial direction to form a snap-on
进一步的,如图6-图7所示,振镜50为单轴扫描振镜50,单轴扫描振镜50包括微调反射镜51、单轴扫描镜片52和调节螺杆53,调节螺杆53与微调反射镜51滑动连接,单轴扫描镜片52位于微调反射镜51的一侧。振镜50为单轴扫描振镜50,结构设置简单,降低生产成本。通过转动调节螺杆53以调节激光通过微调反射镜51在加工口44射出的宽度位置,即图7中Y轴方向的位置,激光入射至微调反射镜51反射至单轴扫描镜片,再通过单轴扫描镜片反射从进光口41进入缓冲腔,再从加工口44射出。通过转动微调反射镜51使激光的摆动形成的激光切割路径与加工口44的延伸方向相同。图7中的箭头代表激光光束的传播路径,激光光束必须精准的在风刀40的加工口44沿X轴摆动对加工件进行切割加工口44在Y轴方向的宽度为1.5mm,通过单轴扫描镜片52中的调节螺杆53精准调节激光光束在加工口44内Y轴方向上的定位。Further, as shown in FIGS. 6-7 , the
进一步的,振镜50与风刀40的连接处固定有角度刻度环45,角度刻度环45的初始刻度与微调反射镜51的初始位置对齐,角度刻度环45套设风刀40的外周,风刀40相对角度刻度环45转动。风刀40沿进光口41的轴线转动,根据风刀40的角度标尺调整风刀40的加工口44的延伸方向与振镜50射出指引光形成模拟的激光切割路径方向重合,将指引光调整至从风刀40的加工口44射出,振镜50上的微调反射镜51无标尺,只有一个标记线或者箭头,风刀40上的角度刻度环45的标尺方便记忆位置。同时风刀40的角度刻度环45的最小刻度单位为0.1°,以提高微调时的标定位置精度。因为激光的扫描直线和加工口44一定要保持平行。角度刻度环45相当于微调反射镜51的外在调节标尺,将激光的扫描直线和加工口44设置保持平行后,即可保持在调节的角度使用,重新安装时按照原来调整好的角度重新安装上即可,避免每次安装均要调试,提升加工操作效率。Further, an
一种激光加工装置的加工方法,通过激光加工装置对加工件进行激光切割加工,激光切割加工包括直线切割加工,直线切割加工包括以下步骤:A processing method of a laser processing device, the laser processing device is used to perform laser cutting processing on a workpiece, the laser cutting processing includes linear cutting processing, and the linear cutting processing includes the following steps:
系统控制卡32获取加工件的加工切割路径,加工切割路径包括N个直线加工路径,N≥1;The
激光加工装置内的红光指示器进行激光光路调试,红光通过振镜50反射从加工口44射出,激光控制器60控制振镜50中反射镜片的转动,红光通过转动的反射镜片在加工口44内移动形成激光切割路径,激光切割路径与加工口44的延伸方向相同,激光切割路径位于加工口44内;The red light indicator in the laser processing device is used to debug the laser light path. The red light is reflected by the
加工件放置于夹具板11,系统控制卡32根据加工切割路径控制位置驱动组件12驱动夹具板11移动,使加工件的第一个直线加工路径与激光切割路径方向重叠,激光控制器60控制激光发生器31发射激光并驱动反射镜片转动,激光沿激光切割路径切割,完成第一个直线切割加工;The workpiece is placed on the
若N=1,则完成加工件的直线切割加工,若N>1,系统控制卡32根据加工切割路径控制位置驱动组件12驱动夹具板11移动,使加工件的下一个直线加工路径与激光切割路径重叠,激光控制器60控制激光发生器31发射激光并驱动反射镜片转动,激光沿激光切割路径切割,完成下一个直线切割加工,重复该步骤,直至完成加工件所有的直线切割加工。If N=1, the linear cutting process of the workpiece is completed. If N>1, the
本发明的激光加工装置的加工方法,传统的激光加工,是激光束固定,通过伺服电机传动放置于夹具板11上加工件的移动。The processing method of the laser processing device of the present invention, the traditional laser processing, is that the laser beam is fixed, and the movement of the workpiece placed on the
当激光开始直线加工切割时,夹具平台10的所有传递机构部运行,通过激光控制器60控制振镜50的微调反射镜51的摆动在加工口44中形成激光切割路径,激光切割路径与加工口44的延伸方向相同,通过高速扫描来进行激光加工,精度高,速度极快,有效提高激光直线切割加工效率,特别是降低了硬脆性材料的裂纹和破损的形成几率,有效提升硬脆性材料的加工成品率。夹具平台10的所有传动机构只在切换加工位置时运行变换位置。与传统加工效率相比大幅提高。When the laser starts to cut in a straight line, all the transmission mechanism parts of the
进一步的,激光加工装置包括用于对夹具板11上的加工件加工信息的图像识别装置61,图像识别装置61与系统控制卡32通信连接;Further, the laser processing device includes an
图像识别装置61的识别范围位于风刀40的对应下方,夹具板11上的加工件移动至识别范围时,图像识别装置61将识别信号发送至系统控制卡32,系统控制卡32控制位置驱动组件12停止传动;The recognition range of the
通过图像识别装置61初步识别加工件移动至风刀40的对应下方,系统控制卡32通过位置驱动组件12调节加工件更精准的加工位置和加工方向。通过图像识别装置61对加工件的加工位置进行自动粗定位,有效提升加工效率。其中,图像识别装置61为感应器或图像识别装置61。The
人工操作系统控制卡32控制位置驱动组件12将加工件调整至加工位置,并获取加工件的图像加工路径,并在图像加工路径上标记加工起点。更为具体的,人工在系统控制卡32上通过图像识别装置61反馈的识别信息控制旋转部16、左右移动组件13和前后移动组件14将加工件微调至精准的加工位置,使加工件在需要加工的最佳位置。The manual operating
作为其中一实施例,图像识别装置61为同轴相机,同轴相机的摄像范围位于风刀40的对应下方。同轴相机与系统控制卡32通信连接。As one embodiment, the
进一步的,在系统控制卡32中形成加工件的模型加工路径,通过系统控制卡32将模型加工路径与图像加工路径对应匹配形成加工路径,系统控制卡32根据图像加工路径标定加工初始点。通过系统控制卡32将模型加工路径与图像加工路径对应匹配形成加工路径,为激光切割做好加工前的准备。通过系统控制卡32与图像识别装置61的配合使用,通过在系统控制卡32编程,自动生成加工逻辑,加工时无需人为干预,智能化更高,位置驱动组件12的三轴传动变换加工件的加工位置,加工灵活度更高。Further, the model processing path of the workpiece is formed in the
综上,本发明实施例提供一种激光加工装置及其加工方法,系统控制卡32分别与位置驱动组件12、激光控制器60和供气压缩组件通信连接。系统控制卡32通过位置驱动组件12驱动夹具板11移动,以调节加工件的加工位置。系统控制卡32通过供气压缩组件控制风刀40的气体供应。系统控制卡32通过激光控制器60控制激光开关、角度调节和移动加工。夹具平台10用于固定加工件以及将加工件移动至加工位置。加工件放置于夹具板11进行固定,通过位置驱动组件12驱动夹具板11变更加工位置,其中至少包括前后移动和左右移动。光路组件20主要负责激光加工。其中,激光升降支架21用于对激光发生组件30和风刀40作为支撑,时激光发生组件30和风刀40分别与夹具板11保持一定加工距离,同时,调节激光发生组件30和风刀40垂直方向的高度,以调节激光焦距。通过激光控制器60控制激光发生器31射出激光。振镜50用于将激光反射至风刀40的加工口44,并通过转动振镜50以调节激光的射出位置和直线移动范围,激光发射至振镜50,通过振镜50将激光反射至风刀40的加工口44,通过转动振镜50,调节激光反射角度,以保证激光从加工口44射出,并使激光直线移动路径与加工口44的延伸方向保持一致。激光控制器60控制振镜50转动,以使振镜50反射的激光按照设定的直线加工路径移动,激光进行直线移动切割时,夹具平台10将加工件的位置进行锁定,通过振镜50、风刀40与夹具平台10的配合使用,风刀40口为激光提供加工范围,利用振镜50的移动精度和速度,以提高整体的激光直线切割加工效率。供气压缩组件通过进气口43与缓冲腔连通,供气压缩组件向缓冲腔充入气体,气体和激光均从加工口44射出,以使激光加工位置位于气体吹出的范围内,提升风刀40除尘的精准度,提升除尘效果。To sum up, the embodiments of the present invention provide a laser processing apparatus and a processing method thereof, wherein the
以上仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明技术原理的前提下,还可以做出若干改进和替换,这些改进和替换也应视为本发明的保护范围。The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the technical principle of the present invention, several improvements and replacements can be made, and these improvements and replacements should also be It is regarded as the protection scope of the present invention.
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