CN114905164A - Laser processing device and processing method thereof - Google Patents
Laser processing device and processing method thereof Download PDFInfo
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- CN114905164A CN114905164A CN202210605122.8A CN202210605122A CN114905164A CN 114905164 A CN114905164 A CN 114905164A CN 202210605122 A CN202210605122 A CN 202210605122A CN 114905164 A CN114905164 A CN 114905164A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
- B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to the technical field of laser processing, and discloses a laser processing device and a processing method thereof.A clamp platform comprises a clamp plate for fixing a clamp and a position driving assembly for driving the clamp plate to change a processing position, wherein the clamp plate is arranged at the upper end of the position driving assembly; the laser cutting device comprises a light path component, a cutter and a cutter, wherein the light path component comprises a laser lifting support, a laser generating component and an air knife, the laser generating component is arranged on the laser lifting support, the laser generating component comprises a laser generator, a vibrating mirror and a laser controller, and the laser controller controls the vibrating mirror to rotate so as to move and cut laser along the extending direction of a processing port; the air supply compression assembly is communicated with the air inlet; and the system controller is in communication connection with the position driving assembly, the laser controller and the air supply compression assembly respectively. The laser processing device and the processing method thereof improve the processing efficiency.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser processing device and a processing method thereof.
Background
At present, hard and brittle materials are characterized by high hardness, large brittleness and very close elastic limit and strength. When the hard and brittle material is processed, cracks and damages are easily generated on the surface of the hard and brittle material, and the traditional processing technology has low efficiency and great difficulty. Today at the high-speed development of laser technology, laser beam machining uses and shows the advantage in the technology to hard brittle material processing gradually suddenly, and traditional processing mode is processed the machined part through the motion of servo motor transmission laser cutting head, when guaranteeing machining precision, processingquality, servo drive's motion efficiency still has higher promotion space to machining efficiency.
Disclosure of Invention
The purpose of the invention is: a laser processing device and a processing method thereof are provided, which improve the laser processing precision and processing speed.
In order to achieve the above object, the present invention provides a laser processing apparatus, comprising a clamp platform, a clamp plate, a position driving assembly, a first clamping device and a second clamping device, wherein the clamp platform comprises a clamp plate for fixing a clamp and a position driving assembly for driving the clamp plate to change a processing position, and the clamp plate is mounted on the upper end of the position driving assembly;
the laser device comprises a light path component, the light path component comprises a laser lifting support, a laser generating component and an air knife, the laser generating component is installed on the laser lifting support, the laser generating component comprises a laser generator, a vibration mirror and a laser controller, the laser controller is in communication connection with the laser generator, the laser controller is in drive connection with the vibration mirror, the upper end of the air knife is provided with a light inlet, the air knife is internally provided with a gas buffering cavity, the outer side of the air knife is provided with an air inlet, the air inlet is communicated with the gas buffering cavity, the lower end of the air knife is provided with a strip-shaped processing port, the processing port faces the clamp plate, the light inlet, the gas buffering cavity and the processing port are communicated to form a laser ejection channel, the light inlet is communicated with a light outlet of the vibration mirror, and the laser controller controls the laser generator to eject laser towards the vibration mirror, the laser reflected by the galvanometer is emitted through the laser emitting channel, and the laser controller controls the galvanometer to rotate so as to cut the laser in a moving way along the extending direction of the processing port;
a gas supply compression assembly in communication with the gas inlet;
and the system controller is in communication connection with the position driving assembly, the laser controller and the air supply compression assembly respectively.
Preferably, the position driving assembly comprises a left-and-right moving assembly and a front-and-back moving assembly which are both arranged along the horizontal direction, the clamp plate is slidably mounted at the top end of the front-and-back moving assembly, the front-and-back moving assembly drives the clamp plate to move front and back, the front-and-back moving assembly is slidably mounted on the left-and-right moving assembly, and the left-and-right moving assembly drives the front-and-back moving assembly to slide left and right.
Preferably, the position driving assembly comprises a lifting part and a rotating part, the rotating part is in driving connection with the left-right moving assembly, and the lifting part is in driving connection with the rotating part.
Preferably, the ratio of the length of the processing opening to the width of the processing opening is set to be 45-60.
As preferred scheme, the mirror that shakes is the unipolar scanning mirror that shakes, unipolar scanning mirror that shakes includes fine setting speculum, unipolar scanning lens and adjusting screw, adjusting screw with fine setting speculum sliding connection, unipolar scanning lens is located one side of fine setting speculum.
As a preferred scheme, an angle scale ring is fixed at the joint of the vibrating mirror and the air knife, the initial scale of the angle scale ring is aligned with the initial position of the fine adjustment reflector, the periphery of the air knife is sleeved with the angle scale ring, and the air knife rotates relative to the angle scale ring.
A processing method of a laser processing device is used for carrying out laser cutting processing on a processed piece through the laser processing device, wherein the laser cutting processing comprises linear cutting processing, and the linear cutting processing comprises the following steps:
the method comprises the steps that a system controller obtains a machining cutting path of a machined part, wherein the machining cutting path comprises N linear machining paths, and N is more than or equal to 1;
the laser processing device comprises a laser processing device, a laser controller, a laser pointer, a vibration mirror, a laser cutting path and a laser cutting path, wherein the laser processing device is used for processing laser light path debugging of a red light indicator in the laser processing device, the red light is reflected by the vibration mirror and is emitted from a processing port, the laser controller controls the rotation of a reflection lens in the vibration mirror, the red light moves in the processing port through the rotating reflection lens to form the laser cutting path, the extending direction of the laser cutting path is the same as that of the processing port, and the laser cutting path is positioned in the processing port;
the processing part is placed on the clamp plate, the system controller controls the position driving assembly to drive the clamp plate to move according to the processing and cutting path, so that a first linear processing path of the processing part is overlapped with the laser cutting path, the laser controller controls the laser generator to emit laser and drives the reflecting lens to rotate, and the laser cuts along the laser cutting path to finish first linear cutting processing;
if N is equal to 1, linear cutting machining of the machined part is completed, if N is greater than 1, the system controller controls the position driving assembly to drive the clamp plate to move according to the machining cutting path, so that the next linear machining path of the machined part is overlapped with the laser cutting path, the laser controller controls the laser generator to emit laser and drive the reflecting lens to rotate, the laser cuts along the laser cutting path, the next linear cutting machining is completed, and the steps are repeated until all linear cutting machining of the machined part is completed.
Preferably, the laser processing device comprises an image recognition device for processing the workpiece on the clamp plate, and the image recognition device is in communication connection with the system controller;
the recognition range of the image recognition device is located below the corresponding air knife, when the workpiece on the clamp plate moves to the recognition range, the image recognition device sends a recognition signal to a system controller, and the system controller controls the position driving assembly to stop transmission;
and the manual operation system controller controls the position driving assembly to adjust the workpiece to a processing position, acquires an image processing path of the workpiece, and marks a processing starting point on the image processing path.
Preferably, the image recognition device is a coaxial camera.
Preferably, a model machining path of the workpiece is formed in the system controller, the model machining path is correspondingly matched with an image machining path through the system controller to form a machining path, and the system controller calibrates a machining initial point according to the image machining path.
Compared with the prior art, the laser processing device and the processing method thereof have the advantages that: and the system controller is respectively in communication connection with the position driving assembly, the laser controller and the air supply compression assembly. The system controller drives the clamp plate to move through the position driving assembly so as to adjust the machining position of the workpiece. The system controller controls the air supply of the air knife through the air supply compression assembly. The system controller controls the laser switch, the angle adjustment and the mobile processing through the laser controller. The fixture platform is used for fixing the workpiece and moving the workpiece to a machining position. The workpiece is placed on the clamp plate to be fixed, and the position driving assembly drives the clamp plate to change the machining position, wherein the machining position at least comprises front-back movement and left-right movement. The optical path component is mainly responsible for laser processing. The laser lifting support is used for supporting the laser generation assembly and the air knife, the laser generation assembly and the air knife keep a certain processing distance with the clamp plate respectively, and meanwhile the height of the laser generation assembly and the height of the air knife in the vertical direction are adjusted to adjust the laser focal length. And controlling the laser generator to emit laser by the laser controller. The mirror that shakes is used for with laser reflection to the processing mouth of air knife to shake the mirror through rotating and adjust the position and the rectilinear movement scope of penetrating of laser, laser emission to the mirror that shakes, shake the mirror with laser reflection to the processing mouth of air knife through shaking, shake the mirror through rotating, adjust laser reflection angle, jet out from the processing mouth with guaranteeing laser, and make the extension direction of laser rectilinear movement route and processing mouth keep unanimous. The laser controller controls the vibration mirror to rotate, so that laser reflected by the vibration mirror moves according to a set linear machining path, when the laser performs linear movement cutting, the clamp platform locks the position of a workpiece, the vibration mirror, the air knife and the clamp platform are matched for use, the air knife edge provides a machining range for the laser, and the moving precision and the speed of the vibration mirror are utilized to improve the integral laser linear cutting machining efficiency. The air supply compression assembly is communicated with the buffer cavity through the air inlet and is filled with air to the buffer cavity, and the air and laser are ejected out of the processing port, so that the laser processing position is located in the range blown out by the air, the dust removal accuracy of the air knife is improved, and the dust removal effect is improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the embodiment of the present invention.
Fig. 2 is a schematic structural diagram of an optical path component according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a position driving assembly according to an embodiment of the present invention.
Fig. 4 is a schematic structural diagram of an air knife according to an embodiment of the present invention.
Fig. 5 is a schematic view of the internal structure of the air knife according to the embodiment of the present invention.
Fig. 6 is a schematic structural view of an air knife processing opening according to an embodiment of the invention.
FIG. 7 is a schematic diagram of a structure of a propagation path of an optical path in a galvanometer according to an embodiment of the present invention.
FIG. 8 is a schematic structural diagram of an adjusting screw according to an embodiment of the present invention.
In the figure:
10. a clamp platform; 11. a clamp plate; 12. a position drive assembly; 13. a left-right moving component; 14. moving the assembly back and forth; 15. a lifting part; 16. a rotating part;
20. a light path component; 21. a laser lifting support;
30. a laser generating assembly; 31. a laser generator; 32. a system control card;
40. an air knife; 41. a light inlet; 42. a slow air cavity; 43. an air inlet; 44. processing a port; 45. an angle scale ring; 46. a dustproof light-transmitting mirror; 47. clamping the boss; 48. a seal ring; 49. a snap ring;
50. a galvanometer; 51. finely adjusting the reflector; 52. a uniaxial scanning optic; 53. adjusting the screw rod;
60. a laser controller; 61. an image recognition device; 62. a computer host; 63. a display.
Detailed Description
The following detailed description of embodiments of the present invention is provided in connection with the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. used herein are used to indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, it should be understood that the terms "connected," "fixed," and the like are used broadly, and for example, the terms "connected," "connected," or "fixed" may be fixed, or detachably connected, or integrated; the connection can be mechanical connection or welding connection; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
As shown in fig. 1 to 8, a laser processing apparatus according to a preferred embodiment of the present invention includes a jig platform 10, the jig platform 10 includes a jig plate 11 for fixing a jig and a position driving assembly 12 for driving the jig plate 11 to change a processing position, the jig plate 11 is mounted on an upper end of the position driving assembly 12;
the optical path component 20, the optical path component 20 includes a laser lifting support 21, a laser generating component 30 and an air knife 40, the laser generating component 30 is installed on the laser lifting support 21, the laser generating component 30 includes a laser generator 31, a vibrating mirror 50 and a laser controller 60, the laser controller 60 is in communication connection with the laser generator 31, the laser controller 60 is in driving connection with the vibrating mirror 50, a light inlet 41 is formed at the upper end of the air knife 40, a buffer air cavity 42 is formed in the air knife 40, an air inlet 43 is formed at the outer side of the air knife 40, the air inlet 43 is communicated with the buffer air cavity 42, a strip-shaped processing port 44 is formed at the lower end of the air knife 40, the processing port 44 is arranged towards the clamp plate 11, the light inlet 41, the buffer air cavity 42 and the processing port 44 are communicated to form a laser emitting channel, the light inlet 41 is communicated with a light outlet of the vibrating mirror 50, the laser controller 60 controls the laser generator 31 to emit laser towards the vibrating mirror 50, the galvanometer 50 reflects laser and emits the laser through the laser emitting channel, and the laser controller 60 controls the galvanometer 50 to rotate so as to move and cut the laser along the extending direction of the processing port 44;
a supply air compression assembly in communication with the air inlet 43;
and the system control card 32, wherein the system control card 32 is respectively in communication connection with the position driving assembly 12, the laser controller 60 and the air supply compression assembly.
In the laser processing device of the present invention, the system control card 32 is in communication connection with the position driving assembly 12, the laser controller 60 and the gas supply compression assembly, respectively. The system control card 32 drives the clamp plate 11 to move through the position driving assembly 12 so as to adjust the processing position of the workpiece. The system control card 32 controls the supply of air to the air knives 40 through the air supply compression assembly. The system control card 32 controls laser switching, angle adjustment and mobile processing through the laser controller 60. The fixture platform 10 is used to secure and move the workpiece to a machining position. The workpiece is placed on the clamp plate 11 for fixing, and the position driving assembly 12 drives the clamp plate 11 to change the machining position, wherein the machining position at least comprises front and back movement and left and right movement. The optical path assembly 20 is primarily responsible for laser machining. Wherein, laser lifting support 21 is used for taking place subassembly 30 and air knife 40 as the support to the laser, and the laser is taken place subassembly 30 and air knife 40 and is kept certain processing distance with clamp plate 11 respectively during, simultaneously, adjusts the laser and takes place the height of subassembly 30 and air knife 40 vertical direction to adjust laser focus. The laser generator 31 is controlled by the laser controller 60 to emit laser light. The galvanometer 50 is used for reflecting the laser to the processing port 44 of the air knife 40, and by rotating the galvanometer 50 to adjust the emitting position of the laser and the linear moving range in the processing port 44, the laser is emitted to the galvanometer 50, the laser is reflected to the processing port 44 of the air knife 40 through the galvanometer 50, and by rotating the galvanometer 50, the laser reflecting angle is adjusted to ensure that the laser is emitted from the processing port 44, and the linear moving path of the laser is consistent with the extending direction of the processing port 44. The laser controller 60 controls the vibration mirror 50 to rotate, so that laser reflected by the vibration mirror 50 moves according to a set linear machining path, when the laser moves linearly for cutting, the clamp platform 10 locks the position of a workpiece, the air knife 40 is matched with the clamp platform 10 for use, the opening of the air knife 40 provides a machining range for the laser, and the moving precision and speed of the vibration mirror 50 are utilized to improve the integral laser linear cutting machining efficiency. The air supply compression assembly is communicated with the buffer cavity through the air inlet 43 and charges air into the buffer cavity, and the air and laser are ejected out from the processing port 44, so that the laser processing position is located in the range blown out by the air, the dust removal accuracy of the air knife 40 is improved, and the dust removal effect is improved. The laser processing device disclosed by the invention is particularly obvious in improvement on the processing efficiency of hard and brittle materials, and the hard and brittle materials are characterized by high hardness and large brittleness, and the elastic limit and the strength of the materials are very close to each other. When the hard and brittle material is processed, cracks and damages are easily generated on the surface of the hard and brittle material, and the traditional processing technology has low efficiency and great difficulty. When laser begins to process, all transmission mechanisms of the clamp platform 10 do not operate, laser processing is carried out through high-speed scanning of the galvanometer 50, the precision is high, the speed is extremely high, the forming probability of cracks and damages of the hard and brittle materials is reduced, and the processing yield of the hard and brittle materials is effectively improved. In the processing process, the precision and the speed of the vibrating mirror 50 are used for replacing the movement of a servo motor so as to improve the overall processing efficiency, and meanwhile, the deslagging air knife in the laser processing system and the method is matched with the laser cutting path of the single-shaft vibrating mirror to clean cutting dust, so that the processing quality of products is improved, and meanwhile, the laser cutting light path and the device are protected.
Preferably, the clamp plate 11 is disposed toward the lower end of the air knife 40, and the clamp plate 11 is disposed below the air knife 40, so that the moving distance of the clamp plate 11 is shortened, and the production efficiency is improved.
The gas blown into the buffer cavity by the gas supply compression assembly is generally air, and the gas blown into the gas supply compression assembly according to the process requirements is argon, nitrogen and the like.
More specifically, the laser processing apparatus includes a computer host 62 and a display 63, and the system control card 32 is in communication connection with the display 63 via the computer host 62.
The galvanometer 50 is a single axis galvanometer, a dual axis galvanometer, or a multi-axis galvanometer, as one example. As preferred, the mirror that shakes 50 is the unipolar mirror that shakes, satisfies the user demand, promotes and adjusts efficiency.
Further, the position driving assembly 12 comprises a left-right moving assembly 13 and a front-back moving assembly 14 which are arranged along the horizontal direction, the clamp plate 11 is slidably mounted at the top end of the front-back moving assembly 14, the front-back moving assembly 14 drives the clamp plate 11 to move front and back, the front-back moving assembly 14 is slidably mounted on the left-right moving assembly 13, the left-right moving assembly 13 drives the front-back moving assembly 14 to slide left and right, and the left-right moving assembly 13 and the front-back moving assembly 14 drive the workpiece to move front and back and left and right through the clamp plate 11 to adjust the machining position of the workpiece. Specifically, the left-right moving component 13 and the front-back moving component 14 are in communication connection with the system control card 32. The system control card 32 sends a movement signal to the left-right movement assembly 13 and the front-back movement assembly 14, and controls the left-right movement assembly 13 to drive or the front-back movement assembly 14 to drive.
More specifically, the left-right moving assembly 13 and the front-back moving assembly 14 are both telescopic cylinders, and are driven to move left and right or front and back through telescopic ends of the telescopic cylinders. Or the left-right moving component 13 and the front-back moving component 14 are connected with a screw rod through a transmission end of a servo motor, a nut is sleeved on the screw rod, the servo motor drives the screw rod to rotate, the nut moves relative to the screw rod, then left-right moving or front-back moving is achieved, the transmission precision of the servo motor is high, and the machining precision is improved.
Furthermore, the position driving assembly 12 includes an elevating portion 15 and a rotating portion 16, the rotating portion 16 is in driving connection with the left-right moving assembly 13, and the elevating portion 15 is in driving connection with the rotating portion 16. The rotating part 16 drives the left and right moving component 13 to rotate, the left and right moving component 13 drives the front and back moving component 14 and the clamp plate 11 to rotate, and then the machining angle of the machined part is adjusted, because the machining opening 44 is in a long strip shape, laser can only move along the extending direction of the machining opening 44, a laser cutting path and a linear machining path need to be arranged and overlapped in the machining process, and the adjustment efficiency of the overlapping arrangement of the laser cutting path and the linear machining path is improved by the combined use of the rotating part 16, the left and right moving component 13 and the front and back moving component 14. The lifting unit 15 drives the rotary unit 16, the left-right moving unit 13, the front-back moving unit 14, and the jig plate 11 to move up and down, thereby adjusting the distance between the workpiece and the air knife 40. Although laser lifting support 21 also can adjust the distance of machined part and air knife 40 support, because the relative end of handing over in lift portion 15 position, be more convenient for finely tune the height of anchor clamps board 11, promote regulation efficiency, reduce the operation degree of difficulty. Wherein, lift portion 15 is telescopic cylinder or drives the screw rod through the motor, and the suit nut realizes going up and down on the screw rod.
Further, the ratio of the length of the processing opening 44 to the width of the processing opening 44 is set at 45 to 60. The machining opening 44 is arranged in a proper range, so that the wind resistance of the machining opening 44 is effectively reduced, the low energy consumption is reduced on the premise of ensuring the air outlet speed of the machining opening 44, the moving range of the laser at the machining opening 44 is enlarged, and the machining efficiency and the machining application range are improved.
Preferably, the ratio of the length of the working port 44 to the width of the working port 44 is set at 52 to 55. As one example, the width of the machining port 44 is set at 1.5 mm. Preferably, the length of the processing opening 44 is set to 75-85 mm.
The upper end of the air knife 40 is cylindrical, and the diameter of the light inlet 41 is set corresponding to the length of the processing port 44, so that the processing port 44 can provide a larger processing range for laser within the size of the light inlet 41.
As a preferred embodiment, the shape of the upper end of the buffer chamber matches the cylindrical shape of the upper end of the air knife 40, the shape of the lower end of the buffer chamber matches the shape of the processing port 44, and the buffer chamber forms a strip shape gradually changing from the cylindrical shape of the upper end to the elongated shape of the lower end, so that the gas gradually forms extrusion in the process of flowing to the processing port 44 after the cylindrical part is buffered, and the stability and the outflow rate of the gas are improved.
In one embodiment, the machining opening 44 is rectangular, the axis of the air inlet 43 passes through the center point of the machining opening 44, and the air inlet 43 and the buffer chamber are coaxially arranged.
Further, a dustproof light-transmitting mirror 46 is installed between the air inlet 43 and the buffer cavity, and the dustproof light-transmitting mirror 46 is located above the air inlet 43. Dustproof printing opacity mirror 46 is the plane glass piece, and the laser gets into the cushion chamber after seeing through dustproof printing opacity mirror 46, and dustproof printing opacity mirror 46 is used for guaranteeing that air knife 40 structure is sealed the isolation completely with front end optics and light beam machining region, and the inside optical structure of equipment is polluted in the sediment material can not flow backwards, prolongs laser generator 31's life. Because dustproof light-transmitting mirror 46 is located above the air inlet, smooth air outlet of the main body is ensured.
More specifically, the inner wall of cushion chamber top forms joint boss 47 along radial direction protrusion, and joint boss 47 is located the top of air inlet 43, and dustproof printing opacity mirror 46 is placed in joint boss 47, and air inlet 43 inner wall is equipped with snap ring 49, compresses tightly printing opacity mirror and joint boss 47 through snap ring 49, and the outer wall of snap ring 49 and the inner wall of air inlet 43 support the installation, prevent that dustproof printing opacity mirror 46 from dropping. More preferably, a sealing ring 48 is disposed between the dustproof transparent mirror 46 and the retaining ring 49, and the sealing ring 48 and the dustproof transparent mirror 46 are tightly clamped by the retaining ring 49 to improve the sealing degree of the light inlet 41, so as to prevent fine dust from entering the laser generator 31.
Further, as shown in fig. 6-7, the galvanometer 50 is a single-axis scanning galvanometer 50, the single-axis scanning galvanometer 50 includes a fine adjustment mirror 51, a single-axis scanning mirror 52 and an adjusting screw 53, the adjusting screw 53 is slidably connected with the fine adjustment mirror 51, and the single-axis scanning mirror 52 is located on one side of the fine adjustment mirror 51. The galvanometer 50 is a single-axis scanning galvanometer 50, and is simple in structure and production cost is reduced. By rotating the adjusting screw 53 to adjust the width position of the laser beam emitted from the processing opening 44 through the fine adjustment mirror 51, i.e. the position in the Y-axis direction in fig. 7, the laser beam enters the fine adjustment mirror 51 and is reflected to the single-axis scanning mirror, and then enters the buffer cavity from the light inlet 41 through the reflection of the single-axis scanning mirror, and then is emitted from the processing opening 44. The fine adjustment mirror 51 is rotated to make the laser cutting path formed by the oscillation of the laser identical to the extending direction of the machining port 44. The arrows in fig. 7 represent the propagation paths of the laser beams, the laser beams must be precisely swung along the X axis at the processing opening 44 of the air knife 40 to cut the workpiece, and the width of the processing opening 44 in the Y axis direction is 1.5mm, and the positioning of the laser beams in the Y axis direction in the processing opening 44 is precisely adjusted by the adjusting screw 53 in the uniaxial scanning mirror 52.
Further, an angle scale ring 45 is fixed at the joint of the galvanometer 50 and the air knife 40, the initial scale of the angle scale ring 45 is aligned with the initial position of the fine tuning reflector 51, the periphery of the air knife 40 is sleeved with the angle scale ring 45, and the air knife 40 rotates relative to the angle scale ring 45. The air knife 40 rotates along the axis of the light inlet 41, the extending direction of the processing port 44 of the air knife 40 is adjusted according to the angle scale of the air knife 40, the extending direction of the processing port 44 of the air knife 40 coincides with the direction of the simulated laser cutting path formed by the guiding light emitted by the galvanometer 50, the guiding light is adjusted to be emitted from the processing port 44 of the air knife 40, the fine adjustment reflector 51 on the galvanometer 50 has no scale and only has one marking line or arrow, and the scale of the angle scale ring 45 on the air knife 40 is convenient for memorizing the position. Meanwhile, the minimum scale unit of the angle scale ring 45 of the air knife 40 is 0.1 degrees, so that the calibration position precision during fine adjustment is improved. Since the scan line of the laser and the machining port 44 must be kept parallel. The angle scale ring 45 is equivalent to the external adjusting scale of the fine adjustment reflector 51, the scanning straight line of the laser and the processing port 44 are arranged to be parallel, the laser can be used at the adjusted angle, the laser can be installed again according to the original adjusted angle during reinstallation, the installation is prevented from being debugged every time, and the processing operation efficiency is improved.
A processing method of a laser processing device performs laser cutting processing on a workpiece through the laser processing device, wherein the laser cutting processing comprises linear cutting processing, and the linear cutting processing comprises the following steps:
the system control card 32 acquires a machining cutting path of the machined part, wherein the machining cutting path comprises N linear machining paths, and N is more than or equal to 1;
the red light indicator in the laser processing device carries out laser light path debugging, red light is reflected by the vibrating mirror 50 and is emitted from the processing port 44, the laser controller 60 controls the rotation of the reflecting mirror in the vibrating mirror 50, the red light moves in the processing port 44 through the rotating reflecting mirror to form a laser cutting path, the extending direction of the laser cutting path is the same as that of the processing port 44, and the laser cutting path is positioned in the processing port 44;
the processing piece is placed on the clamp plate 11, the system control card 32 controls the position driving component 12 to drive the clamp plate 11 to move according to the processing cutting path, so that the first linear processing path of the processing piece is overlapped with the laser cutting path, the laser controller 60 controls the laser generator 31 to emit laser and drives the reflection lens to rotate, the laser cuts along the laser cutting path, and the first linear cutting processing is completed;
if N is equal to 1, the linear cutting machining of the machined part is completed, if N is greater than 1, the system control card 32 controls the position driving assembly 12 to drive the clamp plate 11 to move according to the machining cutting path, so that the next linear machining path of the machined part is overlapped with the laser cutting path, the laser controller 60 controls the laser generator 31 to emit laser and drive the reflection lens to rotate, the laser cuts along the laser cutting path, the next linear cutting machining is completed, and the steps are repeated until all the linear cutting machining of the machined part is completed.
The processing method of the laser processing device of the invention is the traditional laser processing, wherein the laser beam is fixed, and the movement of the processing piece which is arranged on the clamp plate 11 is transmitted by the servo motor.
When the laser starts linear machining and cutting, all the transmission mechanism parts of the clamp platform 10 operate, the laser controller 60 controls the fine adjustment reflector 51 of the vibrating mirror 50 to swing to form a laser cutting path in the machining opening 44, the laser cutting path and the machining opening 44 extend in the same direction, laser machining is performed through high-speed scanning, the precision is high, the speed is extremely high, the laser linear cutting machining efficiency is effectively improved, particularly the forming probability of cracks and damages of the hard and brittle materials is reduced, and the machining yield of the hard and brittle materials is effectively improved. All the transmission mechanisms of the jig stage 10 operate the shift position only when the machining position is switched. Compared with the traditional processing efficiency, the processing efficiency is greatly improved.
Further, the laser processing device comprises an image recognition device 61 for processing information on the workpiece on the clamp plate 11, wherein the image recognition device 61 is in communication connection with the system control card 32;
the recognition range of the image recognition device 61 is located below the air knife 40, when the workpiece on the clamp plate 11 moves to the recognition range, the image recognition device 61 sends a recognition signal to the system control card 32, and the system control card 32 controls the position driving component 12 to stop transmission;
the workpiece is preliminarily recognized to move to the corresponding lower side of the air knife 40 by the image recognition device 61, and the system control card 32 adjusts the more accurate machining position and machining direction of the workpiece by the position drive assembly 12. The machining position of the machined part is automatically roughly positioned through the image recognition device 61, and machining efficiency is effectively improved. The image recognition device 61 is a sensor or an image recognition device 61.
The manual operation system control card 32 controls the position driving assembly 12 to adjust the workpiece to the machining position, acquires an image machining path of the workpiece, and marks a machining starting point on the image machining path. More specifically, the operator controls the rotating part 16, the left-right moving assembly 13, and the front-back moving assembly 14 on the system control card 32 through the identification information fed back from the image identification device 61 to finely adjust the workpiece to a precise machining position, so that the workpiece is at an optimal position to be machined.
As an embodiment, the image recognition device 61 is a coaxial camera, and the shooting range of the coaxial camera is located below the air knife 40. The coaxial camera is communicatively connected to system control card 32.
Further, a model processing path of the workpiece is formed in the system control card 32, the model processing path is correspondingly matched with the image processing path through the system control card 32 to form a processing path, and the system control card 32 calibrates a processing initial point according to the image processing path. The model processing path and the image processing path are correspondingly matched through the system control card 32 to form a processing path, so that preparation before processing is made for laser cutting. Through the cooperation of system control card 32 and image recognition device 61, through at system control card 32 programming, automatic generation processing logic does not need artificial intervention during processing, and is intelligent higher, and the machining position of the machined part is changed in the triaxial transmission of position drive assembly 12, and the processing flexibility is higher.
In summary, the embodiment of the present invention provides a laser processing apparatus and a processing method thereof, wherein the system control card 32 is respectively connected to the position driving assembly 12, the laser controller 60 and the air supply compression assembly in a communication manner. The system control card 32 drives the clamp plate 11 to move through the position driving assembly 12 so as to adjust the processing position of the workpiece. The system control card 32 controls the supply of air to the air knives 40 through the air supply compression assembly. The system control card 32 controls the laser switching, angle adjustment, and moving process through the laser controller 60. The fixture platform 10 is used to secure and move the workpiece to a machining position. The workpiece is placed on the clamp plate 11 for fixing, and the position driving assembly 12 drives the clamp plate 11 to change the machining position, wherein the machining position at least comprises front and back movement and left and right movement. The optical path assembly 20 is primarily responsible for laser machining. The laser lifting support 21 is used for supporting the laser generating assembly 30 and the air knife 40, the laser generating assembly 30 and the air knife 40 respectively keep a certain processing distance from the clamp plate 11, and meanwhile, the height of the laser generating assembly 30 and the height of the air knife 40 in the vertical direction are adjusted to adjust the laser focal length. The laser generator 31 is controlled by the laser controller 60 to emit laser light. The vibration mirror 50 is used for reflecting laser to the processing opening 44 of the air knife 40, the laser emitting position and the linear movement range are adjusted by rotating the vibration mirror 50, the laser is emitted to the vibration mirror 50, the laser is reflected to the processing opening 44 of the air knife 40 through the vibration mirror 50, and the laser reflection angle is adjusted by rotating the vibration mirror 50, so that the laser is emitted from the processing opening 44, and the linear movement path of the laser is consistent with the extending direction of the processing opening 44. The laser controller 60 controls the vibration mirror 50 to rotate, so that laser reflected by the vibration mirror 50 moves according to a set linear machining path, when the laser moves linearly for cutting, the clamp platform 10 locks the position of a workpiece, the air knife 40 is matched with the clamp platform 10 for use, the opening of the air knife 40 provides a machining range for the laser, and the moving precision and speed of the vibration mirror 50 are utilized to improve the integral laser linear cutting machining efficiency. The air supply compression assembly is communicated with the buffer cavity through the air inlet 43 and charges air into the buffer cavity, and the air and laser are ejected out from the processing port 44, so that the laser processing position is located in the range blown out by the air, the dust removal accuracy of the air knife 40 is improved, and the dust removal effect is improved.
The above is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and substitutions can be made without departing from the technical principle of the present invention, and these modifications and substitutions should also be regarded as the protection scope of the present invention.
Claims (10)
1. A laser processing apparatus, characterized in that:
the fixture platform comprises a fixture plate for fixing the fixture and a position driving assembly for driving the fixture plate to change the machining position, and the fixture plate is mounted at the upper end of the position driving assembly;
the laser device comprises a light path component, the light path component comprises a laser lifting support, a laser generating component and an air knife, the laser generating component is installed on the laser lifting support, the laser generating component comprises a laser generator, a vibration mirror and a laser controller, the laser controller is in communication connection with the laser generator, the laser controller is in drive connection with the vibration mirror, the upper end of the air knife is provided with a light inlet, the air knife is internally provided with a gas buffering cavity, the outer side of the air knife is provided with an air inlet, the air inlet is communicated with the gas buffering cavity, the lower end of the air knife is provided with a strip-shaped processing port, the processing port faces the clamp plate, the light inlet, the gas buffering cavity and the processing port are communicated to form a laser ejection channel, the light inlet is communicated with a light outlet of the vibration mirror, and the laser controller controls the laser generator to eject laser towards the vibration mirror, the laser reflected by the galvanometer is emitted through the laser emitting channel, and the laser controller controls the galvanometer to rotate so as to cut the laser in a moving way along the extending direction of the processing port;
a gas supply compression assembly in communication with the gas inlet;
and the system controller is in communication connection with the position driving assembly, the laser controller and the air supply compression assembly respectively.
2. The laser processing apparatus according to claim 1, wherein: the position driving assembly comprises a left-right moving assembly and a front-back moving assembly which are arranged along the horizontal direction, the clamp plate is slidably mounted at the top end of the front-back moving assembly, the front-back moving assembly drives the clamp plate to move front and back, the front-back moving assembly is slidably mounted on the left-right moving assembly, and the left-right moving assembly drives the front-back moving assembly to slide left and right.
3. The laser processing apparatus according to claim 2, wherein: the position drive assembly comprises a lifting part and a rotating part, the rotating part is in driving connection with the left-right moving assembly, and the lifting part is in driving connection with the rotating part.
4. The laser processing apparatus according to claim 1, wherein: the ratio of the length of the processing opening to the width of the processing opening is set to be 45-60.
5. The laser processing apparatus according to claim 1, wherein: the mirror that shakes is the single-axis scanning mirror that shakes, the single-axis scanning mirror that shakes includes fine setting speculum, single-axis scanning lens and adjusting screw, adjusting screw with fine setting speculum sliding connection, the single-axis scanning lens is located one side of fine setting speculum.
6. The laser processing apparatus according to claim 5, wherein: the utility model discloses a reflector of air knife, include the speculum that shakes, the speculum with the junction of air knife is fixed with angle scale ring, the initial scale of angle scale ring aligns with the initial position of fine setting speculum, angle scale ring cover is established the periphery of air knife, the relative angle scale ring of air knife rotates.
7. A processing method of a laser processing device is characterized in that: performing laser cutting processing on a workpiece by the laser processing device according to any one of claims 1 to 6, the laser cutting processing including linear cutting processing, the linear cutting processing including the steps of:
the method comprises the steps that a system controller obtains a machining cutting path of a machined part, wherein the machining cutting path comprises N linear machining paths, and N is more than or equal to 1;
the laser processing device comprises a laser processing device, a laser controller, a laser pointer, a vibration mirror, a laser cutting path and a laser cutting path, wherein the laser processing device is used for processing laser light path debugging of a red light indicator in the laser processing device, the red light is reflected by the vibration mirror and is emitted from a processing port, the laser controller controls the rotation of a reflection lens in the vibration mirror, the red light moves in the processing port through the rotating reflection lens to form the laser cutting path, the extending direction of the laser cutting path is the same as that of the processing port, and the laser cutting path is positioned in the processing port;
the processing part is placed on the clamp plate, the system controller controls the position driving assembly to drive the clamp plate to move according to the processing and cutting path, so that a first linear processing path of the processing part is overlapped with the laser cutting path, the laser controller controls the laser generator to emit laser and drives the reflecting lens to rotate, and the laser cuts along the laser cutting path to finish first linear cutting processing;
if N is equal to 1, linear cutting machining of the machined part is completed, if N is greater than 1, the system controller controls the position driving assembly to drive the clamp plate to move according to the machining cutting path, so that the next linear machining path of the machined part is overlapped with the laser cutting path, the laser controller controls the laser generator to emit laser and drive the reflecting lens to rotate, the laser cuts along the laser cutting path, the next linear cutting machining is completed, and the steps are repeated until all linear cutting machining of the machined part is completed.
8. The processing method of a laser processing apparatus according to claim 7, wherein: the laser processing device comprises an image recognition device for processing the processing piece processing information on the clamp plate, and the image recognition device is in communication connection with the system controller;
the recognition range of the image recognition device is located below the air knife correspondingly, when the workpiece on the clamp plate moves to the recognition range, the image recognition device sends a recognition signal to a system controller, and the system controller controls a position driving assembly to stop transmission;
and the manual operation system controller controls the position driving assembly to adjust the workpiece to a processing position, acquires an image processing path of the workpiece, and marks a processing starting point on the image processing path.
9. The processing method of a laser processing apparatus according to claim 8, wherein: the image recognition device is a coaxial camera.
10. The processing method of the laser processing apparatus according to claim 9, wherein: and forming a model processing path of the workpiece in the system controller, correspondingly matching the model processing path with the image processing path through the system controller to form a processing path, and calibrating a processing initial point by the system controller according to the image processing path.
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