CN114900997A

CN114900997A - PCB manufacturing method, PCB drilling method and PCB manufacturing system

Info

Publication number: CN114900997A
Application number: CN202210490797.2A
Authority: CN
Inventors: 陈长平; 杨朝辉
Original assignee: Shenzhen Hans CNC Technology Co Ltd
Current assignee: Shenzhen Hans CNC Technology Co Ltd
Priority date: 2022-05-07
Filing date: 2022-05-07
Publication date: 2022-08-12

Abstract

The invention relates to the technical field of PCB processing, and discloses a PCB manufacturing method, a PCB drilling method and a PCB manufacturing system, wherein the manufacturing method comprises the following steps: obtaining a plurality of core plates, and dividing each core plate into a plurality of preprocessing areas according to a preset partition mode; arranging a plurality of targets at the edge and/or inside of each preprocessing area according to preset target parameters, wherein the preset target parameters are used for determining the positions of the targets; overlapping a plurality of core plates, and fusing and fixing part of the area between two adjacent core plates in advance; and pressing the core boards to form the PCB. When the PCB is processed by the PCB manufacturing method provided by the embodiment of the invention, the alignment precision during PCB processing can be increased, and the processing quality is improved.

Description

PCB manufacturing method, PCB drilling method and PCB manufacturing system

Technical Field

The invention relates to the technical field of PCB (printed circuit board) processing, in particular to a PCB manufacturing method, a PCB drilling method and a PCB manufacturing system.

Background

In the manufacturing process of PCB board, the pressfitting process is with core board layer and prepreg and copper foil pressfitting form the multilayer structure together, along with the increase of the number of piles of superimposed core, because the atress influence of core and prepreg, degree of consistency change error between the core is big, and it is difficult to local expansion and whole harmomegathus management and control, leads to follow-up PCB board processing to inaccurate very easily, influences the processingquality of PCB board. In order to increase the alignment precision of the processing of the PCB, the existing processing method is to drill four target holes at four corners of a core board by using an X-RAY target drilling machine, when the PCB is subsequently processed, a post-stitching coordinate of the four target holes is grabbed by the target grabbing machine, the coordinate is compared with an initial coordinate before stitching to obtain an expansion and contraction coefficient, and alignment is performed according to the obtained expansion and contraction coefficient.

However, as the size of the PCB board increases, the error of the expansion and contraction values obtained by the target grabbing and positioning of the target holes by the target grabbing machine also increases with the increase of the distance between the target holes, and the alignment precision during the PCB board processing becomes low, thereby affecting the processing quality of the PCB board.

Disclosure of Invention

In view of the above, it is necessary to provide a PCB manufacturing method, a PCB drilling method and a PCB manufacturing system for increasing the alignment accuracy of the processed PCB.

In one aspect, an embodiment of the present invention provides a method for manufacturing a PCB, where the method includes:

obtaining a plurality of core plates, and dividing each core plate into a plurality of preprocessing areas according to a preset partition mode;

arranging a plurality of targets at the edge and/or inside of each preprocessing area according to preset target parameters, wherein the preset target parameters are used for determining the positions of the targets;

overlapping the core plates, and fusing and fixing part of the area between two adjacent core plates in advance;

and pressing the core boards to form the PCB.

In some embodiments of the PCB manufacturing method, the step of obtaining a plurality of core boards and dividing each core board into a plurality of pre-processing areas according to a preset partition manner includes:

and acquiring a processing layout of the core board, and dividing the core board into a functional area and the plurality of pre-processing areas according to the processing layout.

In some embodiments of the PCB manufacturing method, after the step of dividing each of the core boards into a plurality of preliminary processing areas in a predetermined divisional manner, the method further comprises:

determining a size of a target according to a distance between the pre-machining zone and an edge of the core plate, wherein the edge of the target does not exceed the edge of the core plate.

In some embodiments of the PCB manufacturing method, the step of laminating the plurality of core boards and fixing a partial region between two adjacent core boards by pre-fusion includes:

arranging a first graph on the outer edge of each pre-processing area according to preset graph parameters;

and aligning the areas of the first patterns on each two adjacent core boards in the plurality of core boards, and then fusing and fixing the areas.

In some embodiments of the PCB manufacturing method, the step of providing the first pattern at the outer edge of each of the pre-processing regions according to the preset pattern parameters includes:

and etching the first graph on the extension line of the overlapped edges of the two adjacent preprocessing areas, wherein the first graph is positioned between the side lines of the target and the core plate.

In some embodiments of the PCB manufacturing method, after the step of etching the first pattern on the extension line of the edge where two adjacent pre-processing areas coincide, the method further includes:

and etching at least one second pattern between two adjacent first patterns, wherein the positions of the at least one second pattern on each core board are in one-to-one correspondence.

In some embodiments of the PCB manufacturing method, after the step of aligning areas where the first patterns are located on two adjacent core boards of the plurality of core boards and then performing fusion fixing, the method further includes:

and aligning the areas of the second patterns corresponding to the two adjacent core plates, and fusing and fixing.

On the other hand, an embodiment of the present invention further provides a method for drilling a PCB, where the PCB is manufactured by the method for manufacturing a PCB described above, and the method for drilling a PCB includes:

comparing the position information of the targets on the core plates after lamination with the preset target parameters based on the position information of the targets on the core plates after lamination to determine expansion and contraction values;

and determining the position of the drilled through hole according to the expansion and contraction value so as to drill the through hole on the PCB.

In some embodiments of the PCB drilling method, the step of comparing the position information of the plurality of targets on each core board after lamination with the preset target parameters based on the position information of the plurality of targets on each core board after lamination to determine the expansion and contraction value includes:

identifying a plurality of targets on each core plate through X-RAY equipment to obtain a shadow area, wherein the shadow area is used for representing an area formed by overlapping each target at a corresponding position of each core plate;

and determining the gravity center of the shadow area, drilling a target hole on the PCB by taking the gravity center as the center of the drill bit, and comparing the position information of the target hole with the preset target parameters to determine the expansion and contraction value.

In another aspect, an embodiment of the present invention further provides a PCB manufacturing system, including:

the core plate processing device comprises an acquisition module, a processing module and a processing module, wherein the acquisition module is used for acquiring a plurality of core plates and dividing each core plate into a plurality of preprocessing areas according to a preset partition mode; arranging a plurality of targets at the edge and/or inside of each preprocessing area according to preset target parameters, wherein the preset target parameters are used for determining the positions of the targets;

the fusing module is used for superposing the core plates and fusing and fixing partial areas between two adjacent core plates in advance;

and the laminating module is used for laminating the plurality of core plates to form the PCB.

The embodiment of the invention has the following beneficial effects:

according to the PCB manufacturing method, the PCB drilling method and the PCB manufacturing system of the above embodiments, in the first aspect, by fusing and fixing the upper partial areas of the adjacent core boards in advance, when the core boards are pressed integrally in the subsequent process, the expansion and contraction of the core boards in one or more directions are obstructed, so that the expansion and contraction of the core boards in the one or more directions are reduced. In a second aspect, by dividing the core plate into a plurality of pre-processing areas and arranging a plurality of targets at the edge and/or inside of each pre-processing area, compared with arranging targets only at four corners of the core plate, the distance between adjacent target holes of each pre-processing area is reduced, and the precision of the obtained local expansion and contraction value of the core plate is higher.

When the PCB is processed by the PCB manufacturing method provided by the embodiment of the invention, compared with the existing target design scheme, the alignment precision of the PCB is increased, and the processing quality is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Wherein:

fig. 1 is a flowchart illustrating a method for manufacturing a PCB according to an embodiment of the present invention;

fig. 2 is a flowchart illustrating a PCB drilling method according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram illustrating a processed core board of a PCB board manufacturing method according to an embodiment of the present invention;

fig. 4 is a cross-sectional view illustrating a PCB board formed by processing according to a PCB board manufacturing method provided by an embodiment of the present invention.

Description of the main element symbols:

1. a core board; 2. a pre-processing zone; 3. a target; 4. a first graphic; 5. a second graphic; 6. a target hole; 7. a functional region.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

On one hand, the embodiment of the invention provides a method for manufacturing a PCB, and when the PCB is manufactured by the method for manufacturing the PCB, the expansion and contraction coefficient on the PCB can be obtained more accurately on the premise of limiting the expansion and contraction degree of the PCB as much as possible.

In one embodiment, referring to fig. 1, the method for manufacturing the PCB board includes the following steps:

s10, obtaining a plurality of core plates, and dividing each core plate into a plurality of pre-processing areas according to a preset partition mode;

s20, arranging a plurality of targets at the edge and/or inside of each preprocessing area according to preset target parameters, wherein the preset target parameters are used for determining the positions of the targets;

s30, overlapping the core plates, and fusing and fixing partial areas between two adjacent core plates in advance;

and S40, pressing the core boards to form the PCB.

Referring to fig. 3, when manufacturing a PCB, a corresponding pattern needs to be drawn on the surface of the copper layer of each core board 1 according to the requirements of a customer, and when drawing the pattern on the core board 1, the target 3 needs to be drawn, so that the target 3 can be conveniently etched when the copper layer on the surface of the core board 1 is etched in the following steps. It should be noted that the target 3 may be a copper ring left after etching the core board 1, or a circular copper sheet left after etching, and since there is expansion and contraction during pressing, the expansion and contraction degree can be reflected by the change of the position of the same target 3 before and after pressing the core board 1.

It should be noted that the same partition manner on each core board 1 means that the number of partitions on each core board 1 is the same, and when each core board 1 is laminated in a manner of pressing the core board 1 into a whole PCB, the pre-processing areas 2 on each core board 1 are overlapped one by one. It is worth mentioning that the preset target parameters used for forming the targets 3 in the corresponding preprocessing areas 2 on different core boards 1 are consistent, that is, the targets 3 inside the corresponding preprocessing areas 2 on different core boards 1 are etched according to the same set of preset target parameters, that is, when each core board 1 is laminated according to a subsequent mode of pressing the core boards 1 into a whole PCB, the targets 3 inside the corresponding preprocessing areas 2 on different core boards 1 are superposed one by one.

It should be noted that after the expansion and contraction coefficient is obtained by the above method, the expansion and contraction value of the core plate 1 after being pressed needs to be calculated by the system, and the actual position of the through hole to be drilled can be calculated by the expansion and contraction value. When the expansion and contraction values and the positions of the drilled through holes are calculated, the calculation is performed by using the existing pre-designed software, which is not described herein.

On one hand, the partial areas of the adjacent core plates 1 are fixed in advance, so that the two adjacent core plates 1 are fixed in advance, and when the core plates 1 are pressed, the expansion and contraction between the core plates 1 are hindered by the fixed positions in advance, and the expansion and contraction degree of the core plates 1 can be further reduced. On the other hand, the core plate 1 is divided into the plurality of preprocessing areas 2, the plurality of targets 3 are arranged at the edge and/or inside of each preprocessing area 2, the plurality of targets 3 can reflect the expansion and contraction degree of the core plate 1 in the preprocessing area 2, and after the lamination is completed, the expansion and contraction coefficient of the preprocessing area 2 can be obtained only by comparing the position information of the targets 3 in each preprocessing area 2 with the preset target parameters. Compared with the method that targets 3 are directly arranged at four corners of the whole core plate 1 to determine the expansion and contraction coefficients of the whole core plate 1, the core plate 1 is divided into a plurality of preprocessing areas 2, the distance between the targets 3 used for determining the expansion and contraction coefficients of each preprocessing area 2 is obviously smaller than the distance between the targets 3 arranged at four corners of the core plate 1, the obtained precision of the expansion and contraction coefficient of each preprocessing area 2 is higher than that of the expansion and contraction coefficient determined by the targets 3 arranged at four corners of the whole core plate 1, and the subsequent drilling precision of the PCB is facilitated. Therefore, through the arrangement, the expansion and contraction degree of the core plate 1 during pressing can be reduced as much as possible, a more accurate expansion and contraction coefficient can be obtained after the core plate 1 is pressed, and the alignment precision of the PCB during subsequent processing is more accurate.

In a specific embodiment, step S10 includes: and S11, acquiring a processing layout of the core plate, and dividing the core plate into a functional area and the plurality of pre-processing areas according to the processing layout.

Referring to fig. 3, in the process of processing the PCB, a corresponding processing layout needs to be etched on the core board 1 through a pre-designed pattern according to the customer requirement, a functional area 7 is provided between the edge of the processing layout and the edge of the core board 1, when designing the pre-processing area 2, the edge of the pre-processing area 2 is overlapped with the edge of the processing layout, and the functional area 7 is arranged outside the pre-processing area 2 along the edge of the pre-processing area 2. It should be noted that, in order to obtain the expansion and contraction coefficients of the core plate 1 uniformly, the plurality of pre-processing areas 2 arranged on the core plate 1 have the same size, the number of the pre-processing areas 2 may be set to be four, six or eight according to the size of the core plate 1, and the core plate 1 with a larger size needs a larger number of partitions. In the embodiment of the present invention, the core board 1 divided into four preliminary processing areas 2 is described as an example.

It should be noted that, referring to fig. 3, when dividing the core board 1 into a plurality of areas, it is preferable to set each of the pre-processing areas 2 to be rectangular, and the size of each of the pre-processing areas 2 is the same, so that the core board 1 can be uniformly divided into four pre-processing areas 2, and the edges of two adjacent pre-processing areas 2 are overlapped. One specific embodiment of the partition of the core plate 1 may be that a plurality of mutually parallel transverse lines and a plurality of mutually parallel vertical lines are provided on the core plate 1, and the vertical lines and the transverse lines intersect perpendicularly, thereby dividing the preprocessing section 2 into a plurality of sections. Specifically, for example, four pre-processing areas 2 are provided, three parallel and equally spaced horizontal lines and three parallel and equally spaced vertical lines are provided, the outermost horizontal line and the outermost vertical line are connected end to define a large processing area around the core plate 1, and the other horizontal lines and the other vertical lines are located in the large processing area to divide the processing area into a plurality of equal pre-processing areas 2, for example, when the core plate 1 is divided into four rectangular areas, the four pre-processing areas 2 are combined into a shape like a Chinese character 'tian' by the partitioning method.

It should be noted that, referring to fig. 3, the preprocessing area 2 is set to be rectangular, when the target 3 is set, the target 3 may be set inside the preprocessing area 2, or may be set at the edge of the preprocessing area 2, and the partial area of the target 3 set at the edge of the preprocessing area 2 coincides with the preprocessing area 2, and the target 3 is preferably set at four corners of each preprocessing area 2 in the embodiment of the present invention. When the target is set, the position parameters of four corners of the rectangular area of each pre-processing area 2 need to be determined, the targets 3 are set on the four corners of the pre-processing area 2 according to the position parameters, and each two adjacent pre-processing areas 2 have coincident edges and two common corners, so that the common corners of the two adjacent pre-processing areas 2 share one target 3.

It is to be noted that the target 3 is dimensioned according to the distance between the pre-machining zone 2 and the edge of the core plate 1, such that the extent of said target 3 does not exceed the edge of the core plate, i.e. the edge of the target 3 needs to be within the functional zone 7. It should be noted that, since the corresponding regions in the respective functional regions 7 are fused when the two adjacent core plates 1 are fused and fixed in advance, it is also necessary to consider that a space for the pre-fusion is reserved between the boundary lines of the target 3 and the core plates 1 when considering the size of the target 3. The shape of the target 3 is not limited depending on the actual processing conditions, and may be a circular shape, a square shape, an oval shape, or the like, and the embodiment of the present invention will be described by taking the target 3 as a circular shape as an example. In order to quickly capture the target 3 subsequently and avoid the size of the target 3 exceeding the range of the whole core plate 1, the diameter of the target 3 is set to be 0.25-0.5mm according to the actual situation of production, the distance between the edge of the preprocessing area 2 and the edge of the core plate 1 is larger, the diameter of the target 3 can also be correspondingly set to be larger, the distance between the edge of the preprocessing area 2 and the edge of the core plate 1 is smaller, and the diameter of the target 3 is correspondingly set to be smaller.

In a specific embodiment, step S30 includes: s31, arranging a first graph at the outer edge of each pre-processing area according to preset graph parameters;

and S32, aligning the areas of the first patterns on each two adjacent core boards in the plurality of core boards, and then fusing and fixing.

Referring to fig. 3, the first pattern 4 is disposed in the functional area 7, specifically, a corresponding processing layout needs to be etched on the core board 1 through a pre-designed pattern according to a customer requirement, and before the processing layout is etched, a position of the first pattern 4 needs to be drawn at a position corresponding to the processing layout, so that the first pattern 4 can be etched simultaneously when the processing layout is etched on the core board 1. The position of the first pattern 4 is set on the extension line of the overlapped side of the two adjacent pre-processing areas 2, and is positioned between the side lines of the target 3 and the core plate 1. It should be noted that the preset pattern parameters of the first patterns 4 formed on different core boards 1 are consistent, that is, when the core boards 1 are overlapped, the first patterns 4 on the core boards 1 can be overlapped in a one-to-one correspondence.

It should be noted that the first pattern 4 refers to a copper foil region with a certain shape left after etching the copper foil layer on the core board 1, and in order to avoid the first pattern 4 from affecting the layout on the core board 1, the first pattern 4 is etched in the functional region 7 of the core board 1, that is, the region between the edge of the pre-processing region 2 and the edge of the core board 1, so that when setting the size of the first pattern 4, the distance between the edge of the pre-processing region 2 and the edge of the core board 1 needs to be considered. It should be noted that it is preferable to arrange the position of the first pattern 4 on the extension of the edge coinciding between two adjacent preliminary working zones 2, so that the offset inside the core sheet 1 can be reduced.

In a more specific embodiment, step S31 further includes: and etching at least one second pattern between two adjacent first patterns, wherein the positions of the at least one second pattern on each core board are in one-to-one correspondence.

Referring to fig. 3, when designing the processing layout of the core board 1, in addition to the first patterns 4, at least one second pattern 5 may be disposed between two adjacent first patterns 4. Since the first figures 4 are arranged on the extension of the edge of two adjacent pre-processing zones 2 coinciding, there are two edges of one pre-processing zone 2 between two adjacent first figures 4, at least one second figure 5 being arranged on the extension of each edge. It should be noted that the second patterns 5 are also located between the edge of the pre-processing area 2 and the edge of the core board 1, and the second patterns 5 on each core board 1 can be correspondingly arranged one by one, that is, after the core boards 1 are overlapped, the second patterns 5 at corresponding positions are correspondingly overlapped.

After step S32, the method further includes: and aligning the areas where the second patterns are located on the two adjacent core plates, and then fusing and fixing the two adjacent core plates.

The area where the first pattern is located is fused and fixed firstly by utilizing electromagnetic fusion, and when a plurality of core plates are pre-fixed along the edge at one time, the expansion and contraction amount of the core plates along the length direction and the width direction during pressing can be consistent during pre-fixing at this time, and after the first pattern area is fixed, the deflection between two adjacent core plates during pressing can be prevented.

And then fusing and fixing the area where the second pattern is located. After the first patterns are fused and fixed, the core plates between two adjacent first patterns generate certain expansion and contraction, the second patterns are fused and fixed, the expansion and contraction between two adjacent first patterns can be released, and meanwhile, the deflection between two adjacent core plates can be further reduced when the core plates are pressed. It is worth mentioning that the region where the first pattern is located and the region where the second pattern is located can be fused simultaneously and can also be fused respectively in sequence, because if the region where the first pattern is located and the region where the second pattern is located are fused simultaneously, the area of one-time fusion is increased, which may cause deflection between two adjacent core boards during fusion, and therefore, generally, the region where the first pattern is located needs to be fused first, and then the region where the second pattern is located needs to be fused.

On the other hand, referring to fig. 2, an embodiment of the present invention further provides a PCB drilling method, including:

s100, comparing the position information of the targets on the core boards after lamination with the preset target parameters based on the position information of the targets on the core boards after lamination to determine a swelling and shrinking value;

s200, determining the position of drilling the through hole according to the expansion and contraction value so as to drill the through hole on the PCB.

The preset target parameters for determining the positions of the targets are stored before lamination, and after a plurality of core plates are laminated, the positions of the targets are determined. After the actual positions of the targets are obtained, the initial positions and the actual positions of the targets on the core board are input into software preset by a system, then expansion and contraction values can be calculated, initial position data used for drilling through holes are compensated through the expansion and contraction values, and then the accurate positions of the through holes drilled on the PCB are obtained.

In a specific embodiment, step S100 includes:

s101, identifying a plurality of targets on each core board through X-RAY equipment to obtain a shadow area, wherein the shadow area is used for representing an area formed by overlapping each target at a corresponding position of each core board;

s102, determining the gravity center of the shadow area, drilling a target hole on the PCB by taking the gravity center as the center of a drill cutter, and comparing the position information of the target hole with the preset target parameters to determine the expansion and contraction value.

Referring to fig. 4, the expansion and contraction degrees of the plurality of core plates 1 after lamination are different, that is, the offsets of the positions of the plurality of targets 3 determined by the same preset target parameter at the same position after lamination are also different, in the embodiment of the present invention, the position of the target 3 is irradiated by the X-RAY apparatus perpendicular to the surface of the PCB, so that a shadow region formed by the plurality of overlapped targets 3 after offset at the same position can be obtained, the gravity center of the shadow region, that is, the target center, is found out, and the expansion and contraction coefficient is calculated by comparing the coordinates of the target center with the preset target parameter when the corresponding target 3 is set. The center of gravity of the shaded area is determined as the target, and the average degree of expansion and contraction of the plurality of core plates 1 at the position of the target is obtained.

It should be noted that after the target center is found and the position of the target center is determined, the target drilling machine needs to drill the target hole 6 by using the target center as the center of the circle. Because in the subsequent PCB board processing process, the internal part of the core plate 1 can also generate the harmomegathus phenomenon, when the process of determining the alignment precision is carried out on the PCB board, the target holes 6 can be grabbed by using the CCD target grabbing mode, and the harmomegathus coefficient of the core plate 1 can be obtained in real time by arranging the target holes 6, so that the alignment precision in the subsequent PCB board processing process is increased. For example, after the PCB is drilled, the outer layer pattern of the PCB is transferred, at this time, the PCB needs to be first attached with the dry film for etching resistance and then exposed, it should be noted that the exposure is mainly performed according to the exposure step in the prior art, which is not described herein again, but in the embodiment of the present invention, the expansion and contraction coefficient obtained by the method is used to expose each of the pre-processing areas on the PCB one by one, so as to increase the alignment precision during the exposure.

It is worth mentioning that the target grabbing mode mainly utilizes visible light such as red light or blue light to irradiate the target hole 6, light passes through the target hole 6 to form light spots, at the moment, a CCD camera is utilized to shoot, the gravity center coordinate of the light spots is calculated by using visual recognition software, and the expansion and contraction coefficient at the moment can be obtained by comparing the gravity center coordinate with the preset target parameters.

In another aspect, an embodiment of the present invention further provides a PCB manufacturing system, which includes an obtaining module, a fusing module, and a stitching module. The acquisition module is used for acquiring a plurality of core plates and dividing each core plate into a plurality of preprocessing areas according to a preset partition mode; and arranging a plurality of targets at the edge and/or the interior of each preprocessing area according to preset target parameters, wherein the preset target parameters are used for determining the positions of the targets. The fusing module is used for superposing a plurality of core plates and pre-fusing and fixing partial areas between two adjacent core plates. The laminating module is used for laminating a plurality of core plates to form the PCB.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A PCB manufacturing method is characterized by comprising the following steps:

and pressing the core boards to form the PCB.

2. The method for manufacturing a PCB of claim 1, wherein the step of obtaining a plurality of core boards and dividing each core board into a plurality of pre-processing zones according to a predetermined partition manner comprises:

3. The method for manufacturing a PCB as recited in claim 1, further comprising, after the step of dividing each of the core boards into a plurality of preliminary processing areas in a predetermined divisional manner:

4. The method for manufacturing a PCB according to claim 1, wherein the step of laminating the plurality of core boards and fixing a partial area between two adjacent core boards by pre-fusion comprises:

5. The method for manufacturing a PCB of claim 4, wherein the step of providing the first pattern at the outer edge of each of the pre-processing regions according to the preset pattern parameters comprises:

6. The method for manufacturing a PCB according to claim 5, further comprising, after the step of etching the first pattern on an extension line of a side where two adjacent prepared regions coincide, the step of:

7. The method for manufacturing a PCB of claim 6, wherein after the step of aligning the areas of the first patterns on two adjacent core boards of the plurality of core boards and then performing the fusing and fixing, further comprising:

and aligning the areas where the second patterns are located on the two adjacent core plates, and then fusing and fixing the two adjacent core plates.

8. A PCB board drilling method for a PCB board manufactured by the PCB board manufacturing method of any one of claims 1 to 7, the drilling method comprising:

9. The PCB drilling method of claim 8, wherein the step of comparing the position information of the plurality of targets on each core board after lamination with the preset target parameters to determine the shrinkage value based on the position information of the plurality of targets on each core board after lamination comprises:

10. A PCB board manufacturing system, comprising: