CN114891480A - Novel white glue and preparation method and application thereof - Google Patents

Novel white glue and preparation method and application thereof Download PDF

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Publication number
CN114891480A
CN114891480A CN202210306423.0A CN202210306423A CN114891480A CN 114891480 A CN114891480 A CN 114891480A CN 202210306423 A CN202210306423 A CN 202210306423A CN 114891480 A CN114891480 A CN 114891480A
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CN
China
Prior art keywords
white glue
novel white
nano powder
titanium dioxide
nano
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Pending
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CN202210306423.0A
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Chinese (zh)
Inventor
郭政伟
肖浩
张�雄
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Silicon Energy Photoelectric Semiconductor Guangzhou Co ltd
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Silicon Energy Photoelectric Semiconductor Guangzhou Co ltd
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Priority to CN202210306423.0A priority Critical patent/CN114891480A/en
Publication of CN114891480A publication Critical patent/CN114891480A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/641—Heat extraction or cooling elements characterized by the materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2244—Oxides; Hydroxides of metals of zirconium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Silicon Compounds (AREA)

Abstract

The invention relates to the technical field of semiconductors, in particular to a novel white glue and a preparation method and application thereof. The novel white glue component comprises resin silica gel and nano powder; nano powder, by weight ratio: the resin silica gel is (0.01-0.6): 1; the nanometer powder comprises titanium dioxide and nanometer alumina, wherein the nanometer alumina accounts for 0.1-59% of the nanometer powder by mass, and the titanium dioxide accounts for 41-99.9% of the nanometer powder by mass. The nanometer alumina component added in the novel white glue improves the heat dissipation performance of the white glue, so that heat emitted by a chip can be conducted out through the bottom support, and part of the heat can be conducted out through the novel white glue, thereby increasing a heat dissipation channel and prolonging the service life of a lamp bead.

Description

Novel white glue and preparation method and application thereof
Technical Field
The invention relates to the technical field of semiconductors, in particular to a novel white glue and a preparation method and application thereof.
Background
A light Emitting diode (led) is a commonly used light Emitting device, which is made of compounds containing gallium (Ga), arsenic (As), phosphorus (P), and nitrogen (N), and emits light by energy released by recombination of electrons and holes, so that the light Emitting diode can be made. Wherein the gallium arsenide diode emits red light, the gallium phosphide diode emits green light, the silicon carbide diode emits yellow light, and the gallium nitride diode emits blue light. The initial LED is used as indicator light, display LED plate, etc; with the advent of white LEDs, they are increasingly being used as illumination. At present, white light LEDs are widely used in various illumination fields, such as mobile illumination, backlight, flash lamps, automobile illumination, and the like.
Traditional LED lamp pearl comprises LED support, LED chip, phosphor powder, lens, then through applying electric current, the LED chip can send normal white light like this. With the development of the technology, a plurality of technologies for improving the luminous efficiency of the white light LED appear. The LED light source comprises an LED chip, a dam, a light source and a light source, wherein the dam is packaged at the periphery of the LED chip by adopting white glue, so that the light efficiency is further improved. The technology has been widely applied in the packaging process of white light LEDs, such as the scheme described in CN 107546301. However, the above technique of white glue encapsulation also has some defects, for example, the heat dissipation performance of the lamp bead using the encapsulation technique is not ideal. The heat that the chip during operation produced usually passes through the support heat dissipation from the bottom, but this still is not enough to let whole lamp pearl be in best operating condition, and heat dissipation channel's not enough also leads to lamp pearl life-span to be influenced.
Disclosure of Invention
The applicant researches and discovers that one reason why the scheme of CN107546301 is not ideal in heat dissipation is that the heat dissipation performance of the phosphor layer is not ideal. The surface of the phosphor layer is rough, so that the phosphor layer in contact with the bracket can not effectively conduct heat to the bottom bracket. It is possible to improve the heat transfer effect if the phosphor layer in contact with the support is replaced with another substance. Since white paste is also used in the prior art for such packages, the applicant proposes to directly use white paste to provide better heat dissipation performance than phosphor. In order to realize the purpose, the premise is that the prepared novel white glue has good heat dissipation performance. In view of the above, there is a need to provide a novel white glue, and a preparation method and application thereof.
Therefore, in order to achieve the above object, the present invention adopts the following technical means:
in a first aspect, the present invention provides a novel white glue, the novel white glue component comprising a resin silicone glue and a nanopowder; nano powder, by weight ratio: the resin silica gel is (0.01-0.6): 1; the nano powder comprises titanium dioxide and nano alumina, wherein the mass percent of the nano alumina in the nano powder is 0.1-59%, and the mass percent of the titanium dioxide in the nano powder is 41-99.9%.
Further, the nanopowder comprises titanium dioxide, nanoscale aluminum oxide and zirconium dioxide; the mass percent of the zirconium dioxide in the nano powder is 0.1-20%, the mass percent of the nanoscale aluminum oxide in the nano powder is 0.1-58.9%, and the mass percent of the titanium dioxide in the nano powder is 41-99.8%.
Further, the nanopowder comprises titanium dioxide, nanoscale aluminum oxide, zirconium dioxide and silicon dioxide; the mass percent of the silicon dioxide in the nano powder is 0.1-20%, the mass percent of the zirconium dioxide in the nano powder is 0.1-20%, the mass percent of the nanoscale aluminum oxide in the nano powder is 0.1-58.8%, and the mass percent of the titanium dioxide in the nano powder is 41-99.7%.
Furthermore, the particle size of the titanium dioxide is 0.1-100 μm.
Further, the silicon dioxide is gas-phase nanoscale silicon dioxide, and the particle size is 10-100 nm.
Furthermore, the zirconium dioxide is nano-grade zirconium dioxide, and the particle size of the zirconium dioxide is 10-100 nm.
Furthermore, the nanoscale aluminum oxide is alpha-phase nano aluminum oxide, and the particle size of the nanoscale aluminum oxide is 30-80 nm.
In a second aspect, the invention provides a preparation method of novel white glue, which comprises the steps of mixing the components of the novel white glue according to the proportion, stirring in vacuum, and filtering.
Further, alumina ceramic round beads, steel round beads or glass round beads are placed in the glue preparation cup before vacuum stirring, and the diameter of each round bead is 0.8-1 mm.
Furthermore, the rotating speed of vacuum stirring is 2000-3000 r/min, and the stirring time is more than 5 min.
Furthermore, a gauze with 1800-2500 meshes is adopted for filtering.
In a third aspect, the invention provides an application of a novel white glue, which is used in the technical field of semiconductors.
The invention has the beneficial effects that:
the invention provides a novel white glue and a preparation method and application thereof. The titanium dioxide has a light reflecting effect and reflects the light of the LED; according to the invention, the heat dissipation performance of the white glue is improved by adding the nanometer alumina, so that the heat emitted by the chip can be conducted out through the bottom bracket, and part of the heat can be conducted out through the novel white glue, thus the heat dissipation channel is increased, and the service life of the lamp bead is prolonged.
In a preferred embodiment provided by the invention, the novel white glue further comprises zirconium dioxide. This is because the applicant has further considered to avoid this heat accelerating the oxidation of the silver coating on the substrate surface when conducting heat using the new white glue. Therefore, the applicant further proposes to add a zirconium dioxide component to the novel white glue, because the addition of the zirconium dioxide component can prevent the silver coating on the surface of the substrate from being oxidized, so that the silver coating is more stable at high temperature. In addition, the addition of zirconium dioxide can bring additional technical effects: because zirconium dioxide is a substance with metallic luster, the zirconium dioxide is added in the invention, so that the white glue has a stronger light reflection effect, and the light emitted by the chip is more emitted from the light-emitting device instead of being absorbed by the internal structure, thereby improving the light-emitting brightness of the device.
In another preferred scheme provided by the invention, the novel white glue also comprises silicon dioxide. Since the white gum prepared by the above formulation contains a plurality of granular substances in the above solution of the present invention, the applicant has to avoid the problem of precipitation caused thereby, and all of them further proposes that silica powder be added thereto, so that the granular substances and silica gel in the white gum can be better mixed and have an anti-precipitation effect. Silica has also brought extra technological effect simultaneously, because silica still has the effect that increases the smooth finish of white glue surface material, makes the white glue surface more smooth and exquisite, has strengthened the reflectance of white glue to the light for the light that the chip sent can launch from luminescent device more, thereby promotes the luminous luminance of whole device.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be further clearly and completely described below with reference to the embodiments of the present invention. It should be noted that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The resin silica gel of the present invention may be a conventional commercially available brand, and the present invention is not particularly limited.
Example 1
A novel white glue comprises a resin silica gel and nano powder; nano powder, by weight ratio: resin silica gel 0.6: 1; the nanopowder comprises titanium dioxide and nanoscale alumina. Wherein the nano powder comprises 99.5 percent of titanium dioxide and 0.5 percent of nano-alumina by mass percentage.
The particle size of the titanium dioxide is 10 mu m; the nano-alumina is alpha-phase nano-alumina with the particle size of 30 nm.
The preparation method of the novel white glue comprises the following steps:
mixing the components of the novel white glue according to the proportion, putting alumina ceramic round beads with the diameter of 0.8mm into a vacuum stirrer for vacuum stirring at the rotating speed of 2500 revolutions per minute for 6 minutes; and cooling the stirred white glue raw material, and then screening by using a 2000-mesh gauze, wherein the leaked white glue is a finished product.
Example 2
A novel white glue comprises a resin silica gel and nano powder; nano powder, by weight ratio: resin silica gel 0.4: 1; the nanopowder comprises titanium dioxide, zirconium dioxide and nanoscale aluminum oxide. Wherein the nano powder comprises 50% of titanium dioxide, 20% of zirconium dioxide and 30% of nano aluminum oxide by mass percentage.
Wherein the titanium dioxide particle size is 15 μm; the zirconium dioxide is nano-grade zirconium dioxide with the particle size of 50 nm; the nano-alumina is alpha-phase nano-alumina with the particle size of 40 nm.
The preparation method of the novel white glue comprises the following steps:
mixing the components of the novel white glue according to the proportion, putting alumina ceramic round beads with the diameter of 0.9mm, and then putting the round beads into a vacuum stirrer for vacuum stirring at the rotating speed of 2200 revolutions per minute for 8 min; and cooling the stirred white glue raw material, and screening by using a 1800-mesh gauze, wherein the leaked white glue is a finished product.
Example 3
A novel white glue comprises a resin silica gel and nano powder; nano powder, by weight ratio: resin silica gel 0.2: 1; the nanopowder includes titanium dioxide, silicon dioxide, zirconium dioxide and nanoscale aluminum oxide. The nano powder comprises 41% of titanium dioxide, 10% of silicon dioxide, 10% of zirconium dioxide and 39% of nano aluminum oxide in percentage by mass.
The particle size of the titanium dioxide is 5 mu m; the silicon dioxide is gas-phase nano-scale silicon dioxide with the particle size of 20 nm; the particle size of the zirconium dioxide is 30 nm; the nano-alumina is alpha-phase nano-alumina with the particle size of 30 nm.
The preparation method of the novel white glue comprises the following steps:
mixing the components of the novel white glue according to the proportion, putting alumina ceramic round beads with the diameter of 1mm into a vacuum stirrer for vacuum stirring at the rotating speed of 2800 revolutions per minute for 7 minutes; and cooling the stirred white glue raw material, and then screening by using a 2000-mesh gauze, wherein the leaked white glue is a finished product.
Example 4
A novel white glue comprises a resin silica gel and nano powder; nano powder, by weight ratio: resin silica gel 0.5: 1; the nanopowder includes titanium dioxide, silicon dioxide, zirconium dioxide and nanoscale aluminum oxide. Wherein the nano powder comprises 50% of titanium dioxide, 10% of silicon dioxide, 10% of zirconium dioxide and 30% of nano aluminum oxide by mass percentage.
Wherein the titanium dioxide particle size is 20 μm; the silicon dioxide is gas-phase nano-scale silicon dioxide with the particle size of 60 nm; the particle size of the zirconium dioxide is 10 nm; the nano-alumina is alpha-phase nano-alumina with the particle size of 50 nm.
The preparation method of the novel white glue comprises the following steps:
mixing the components of the novel white glue according to the proportion, putting alumina ceramic round beads with the diameter of 0.9mm into a vacuum stirrer for vacuum stirring at the rotating speed of 2500 revolutions per minute for 6 minutes; and cooling the stirred white glue raw material, and then screening by using a 2200-mesh gauze, wherein the leaked white glue is a finished product.
Example 5
A novel white glue comprises a resin silica gel and nano powder; nano powder, by weight ratio: resin silica gel 0.2: 1; the nanopowder includes titanium dioxide, silicon dioxide, zirconium dioxide and nanoscale aluminum oxide. Wherein the nano powder comprises 60% of titanium dioxide, 10% of silicon dioxide, 10% of zirconium dioxide and 20% of nano aluminum oxide in percentage by mass.
Wherein the titanium dioxide particle size is 5 μm; the silicon dioxide is gas-phase nano-scale silicon dioxide with the particle size of 30 nm; the particle size of the zirconium dioxide is 80 nm; the alumina is alpha-phase nano alumina with the particle size of 50 nm.
The preparation method of the novel white glue comprises the following steps:
mixing the components of the novel white glue according to the proportion, putting alumina ceramic round beads with the diameter of 0.9mm into a vacuum stirrer for vacuum stirring at the rotating speed of 3000 revolutions per minute for 10 minutes; and cooling the stirred white glue raw material, and then screening by using a 2200-mesh gauze, wherein the leaked white glue is a finished product.
Comparative example 1
A novel white glue comprises a resin silica gel and nano powder; nano powder, by weight ratio: resin silica gel 0.6: 1; the nano powder is titanium dioxide.
Wherein the titanium dioxide has a particle size of 10 μm. The preparation method of the white glue is the same as that of the example 1.
Due to poor heat dissipation, the light effect is about 170-180 lm/w under the conditions that the color temperature of a lamp bead using the white glue of the comparative example 1 is 4000K and the display index is 70, and the brightness of the white glue of the embodiment 1 can reach about 200 lm/w. Therefore, the white glue of the embodiment 1 can be applied under the same conditions to improve the brightness of the lamp beads.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The novel white glue is characterized in that the novel white glue comprises resin silica gel and nano powder; nano powder, by weight ratio: the resin silica gel is (0.01-0.6): 1; the nanometer powder comprises titanium dioxide and nanometer alumina, wherein the nanometer alumina accounts for 0.1-59% of the nanometer powder by mass, and the titanium dioxide accounts for 41-99.9% of the nanometer powder by mass.
2. The novel white glue of claim 1, wherein the nanopowders include titanium dioxide, nanoscale aluminum oxide and zirconium dioxide; the mass percent of the zirconium dioxide in the nano powder is 0.1-20%, the mass percent of the nanoscale aluminum oxide in the nano powder is 0.1-58.9%, and the mass percent of the titanium dioxide in the nano powder is 41-99.8%.
3. The novel white glue of claim 1, wherein the nanopowders include titanium dioxide, nanoscale aluminum oxide, zirconium dioxide and silicon dioxide; the mass percent of the silicon dioxide in the nano powder is 0.1-20%, the mass percent of the zirconium dioxide in the nano powder is 0.1-20%, the mass percent of the nanoscale aluminum oxide in the nano powder is 0.1-58.8%, and the mass percent of the titanium dioxide in the nano powder is 41-99.7%.
4. A novel white glue according to any one of claims 1 to 3, characterised in that the titanium dioxide has a particle size of 0.1 to 100 μm.
5. The novel white glue according to claim 3, characterized in that the silica is fumed nanoscale silica having a particle size of 10-100 nm.
6. A novel white glue according to claim 2 or 3, characterized in that the zirconium dioxide is nano-sized zirconium dioxide with a particle size of 10-100 nm.
7. A novel white glue according to any one of claims 1 to 3, characterized in that the nanoscale aluminum oxide is alpha-phase nano-alumina with a particle size of 30 to 80 nm.
8. A process for preparing the novel white glue according to any one of claims 1 to 7, characterized in that the ingredients and proportions of the novel white glue are mixed, stirred under vacuum and then filtered.
9. The preparation method of the novel white glue according to claim 8, characterized in that the rotation speed of vacuum stirring is 2000-3000 r/min, and the stirring time is more than 5 min; the filtering adopts 1800-2500 mesh gauze.
10. The use of the novel white glue according to any one of claims 1 to 7, characterized in that it is used in the field of semiconductor technology.
CN202210306423.0A 2022-03-25 2022-03-25 Novel white glue and preparation method and application thereof Pending CN114891480A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238767A (en) * 2011-05-12 2012-12-06 Mitsubishi Chemicals Corp Resin composition for semiconductor light-emitting device package, semiconductor light-emitting device package and manufacturing method of the same
CN107383879A (en) * 2017-06-20 2017-11-24 安徽燕青科技集团有限公司 A kind of LED wall wash lamp packaging silicon rubber
CN107546301A (en) * 2016-06-29 2018-01-05 江西省晶瑞光电有限公司 A kind of white glue, LED lamp bead and its method for packing
US20190128481A1 (en) * 2017-10-27 2019-05-02 GE Lighting Solutions, LLC Led filament lamps with white filament appearance
CN112608583A (en) * 2020-12-04 2021-04-06 东莞智昊光电科技有限公司 Thermosetting composite material, application, LED bracket, preparation method of LED bracket and LED product

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012238767A (en) * 2011-05-12 2012-12-06 Mitsubishi Chemicals Corp Resin composition for semiconductor light-emitting device package, semiconductor light-emitting device package and manufacturing method of the same
CN107546301A (en) * 2016-06-29 2018-01-05 江西省晶瑞光电有限公司 A kind of white glue, LED lamp bead and its method for packing
CN107383879A (en) * 2017-06-20 2017-11-24 安徽燕青科技集团有限公司 A kind of LED wall wash lamp packaging silicon rubber
US20190128481A1 (en) * 2017-10-27 2019-05-02 GE Lighting Solutions, LLC Led filament lamps with white filament appearance
CN112608583A (en) * 2020-12-04 2021-04-06 东莞智昊光电科技有限公司 Thermosetting composite material, application, LED bracket, preparation method of LED bracket and LED product

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Application publication date: 20220812