CN114891479A - Heat-resistant pressure-resistant rubber material and preparation method and application thereof - Google Patents
Heat-resistant pressure-resistant rubber material and preparation method and application thereof Download PDFInfo
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- CN114891479A CN114891479A CN202210570020.7A CN202210570020A CN114891479A CN 114891479 A CN114891479 A CN 114891479A CN 202210570020 A CN202210570020 A CN 202210570020A CN 114891479 A CN114891479 A CN 114891479A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/12—Unsaturated polyimide precursors
- C08G73/126—Unsaturated polyimide precursors the unsaturated precursors being wholly aromatic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a heat-resistant pressure-resistant rubber material which comprises the following raw materials in parts by weight: 50-80 parts of polyimide solution I, 10-40 parts of polyimide solution II, 3-5 parts of filler and 0.1-3 parts of cross-linking agent. According to the invention, 3', 4,4' -biphenyl tetracarboxylic dianhydride reacts with a diamine monomer, and ethynyl bis-phthalic anhydride is used as a capping agent, so that the high temperature resistance of the polyimide adhesive can be obviously improved; polyimide solutions with different viscosities are adopted for carrying out crosslinking reaction, the density of a polyimide crosslinking network is increased, the high temperature resistance of the polyimide sizing material is further improved, and the polyimide sizing material can be recycled for multiple times in a high-temperature environment of 400 ℃; meanwhile, the fumed silica with the particle size of 10-100nm is introduced, so that the mechanical property of the polyimide sizing material can be improved on the basis of maintaining the dispersion uniformity of the polyimide sizing material, and the polyimide sizing material has good peel strength and excellent tear strength and breaking elongation rate.
Description
Technical Field
The invention relates to a heat-resistant pressure-resistant rubber material, a preparation method and application thereof, relates to C09J, and particularly relates to the field of adhesives.
Background
The PCB is a printed circuit board, is an important component in the field of electronic machinery, and with the development trend of science and technology, along with the development trend of electronization, precision and integration, the single-layer printed circuit board can not meet the requirements of electronic equipmentDouble-layer or even multilayer circuit boards are increasingly used to meet the use requirements of increasingly complex functional electronic devices. Multilayer PCB board needs the fast-speed-like a lot of pressfitting process of high frequency in preparation process, need set up the pressfitting blotter on the upper and lower surface of PCB board in order to prevent that the PCB board from appearing damaging in the pressfitting process, prevents to damage the surface structure of PCB board under the high pressure. The common pressing cushion pad can only be at 250 ℃ and 35kg/cm 2 The pressing operation is performed in an environment of 400 deg.C, 100kg/cm when the filling material of the PCB board is PTFE 2 The cushion can be fully filled and cured by pressing under the condition, so that the development of a sizing material with higher heat resistance temperature and higher pressure resistance is important for being applied to a pressing cushion pad.
The Chinese invention patent CN201610344797.6 discloses a nano calcium titanate reinforced polyimide insulating tape, which leads the adhesive to have excellent bonding strength and high temperature resistance by introducing the synergistic effect of methyl vinyl silicone rubber, carboxyl nitrile rubber and chloroprene rubber, but the highest heat-resistant temperature is 250 ℃, and the effect of resisting the high temperature of 400 ℃ cannot be achieved. Chinese patent CN200810104459.0 discloses a high temperature resistant thermosetting polyimide adhesive and a preparation method thereof, wherein the polyamide adhesive can still have good bonding strength in an environment of 300 ℃ by introducing aromatic diamine containing fluorine groups, but gradually lose weight in an environment of higher temperature, and the application of the adhesive in a press cushion is influenced.
Disclosure of Invention
In order to improve the service life of the rubber compound in a high-temperature and high-pressure environment at 400 ℃, the first aspect of the invention provides a heat-resistant and pressure-resistant rubber compound, which comprises the following preparation raw materials in parts by weight: 50-80 parts of polyimide solution I, 10-40 parts of polyimide solution II, 3-5 parts of filler and 0.1-3 parts of cross-linking agent.
As a preferred embodiment, the absolute viscosity of the polyimide solution II in an environment at 25 ℃ is more than or equal to 20000 mPa.s; the absolute viscosity of the polyimide solution I is 5000-10000mPa.s in an environment at 25 ℃.
In a preferred embodiment, the cross-linking agent is selected from one or more of triethylynylbenzene, hexa (trimethylsilylethynyl) benzene, 9, 10-diphenylethynylanthracene, 3-phenyl-1-propyne, and 1-ethyl-4- [ (4-propylphenyl) ethynyl ] benzene.
As a preferred embodiment, the crosslinking agent is hexa (trimethylsilylethynyl) benzene.
As a preferred embodiment, the filler is a nanoscale filler, and is selected from one or a combination of more of fumed silica, precipitated silica, calcium carbonate, silicon nitride, titanium oxide and aluminum oxide.
As a preferred embodiment, the filler is fumed silica with a particle size of 10-100 nm.
As a preferred embodiment, the particle size of the fumed silica is 30-50 nm.
In a preferred embodiment, the polyimide solution i is prepared by a self-made method, and the polyimide solution i is prepared from the following raw materials in parts by weight: 40-50 parts of aromatic diamine, 30-40 parts of aromatic dianhydride, 70-100 parts of organic solvent and 10-15 parts of end capping agent.
As a preferred embodiment, the aromatic diamine is selected from one or more of tetramethyl-p-phenylenediamine, 3-methoxy-6-methyl-1, 2-phenylenediamine, methoxy-phenylenediamine, diaminodiphenyl sulfone, diaminobenzophenone, and diaminodiphenyl ether.
In a preferred embodiment, the aromatic diamine is tetramethyl-p-phenylenediamine.
In a preferred embodiment, the aromatic dianhydride is selected from one or more of 3,3', 4,4' -biphenyl tetracarboxylic dianhydride, 4,4 '-diphenyl ether dianhydride, 4,4' - (4,4 '-isopropyldiphenoxy) diphthalic anhydride, and 4,4' -hexafluoroisopropylphthalic anhydride.
In a preferred embodiment, the aromatic dianhydride is 3,3', 4,4' -biphenyltetracarboxylic dianhydride.
As a preferred embodiment, the end-capping reagent is alkynyl-containing phthalic anhydride, and preferably, the alkynyl-containing phthalic anhydride is one or a combination of phenyl ethynyl phthalic anhydride, ethynyl phthalic anhydride and ethynyl diphenyl anhydride.
As a preferred embodiment, the capping agent is ethynyl bis-phthalic anhydride.
In the experimental process, the applicant finds that the high-temperature resistance of the polyimide adhesive can be obviously improved by adopting the reaction of 3,3', 4,4' -biphenyl tetracarboxylic dianhydride and a diamine monomer and taking ethynyl bis-phthalic anhydride as a capping agent, so that the polyimide adhesive can be recycled for multiple times in a high-temperature and high-pressure environment. The possible reasons for guessing are: the introduction of 3,3', 4,4' -biphenyl tetracarboxylic dianhydride can improve the internal molecular structure of polyimide, so that the molecular structure of polyimide is more regular, and the polyimide has good high-temperature resistance. And the introduction of biphenyl group increases the hardness among molecular structures, and further improves the high temperature resistance effect of the polyimide. The applicant further finds that the pressure-resistant effect of polyimide in a high-temperature environment can be improved by using the ethynyl diphenyl anhydride as the end-capping reagent, and when the polyimide adhesive is compounded with the glass fibers, gaps among the glass fibers are relatively large, so that the polyimide adhesive and the glass fiber base cloth have a good wetting and compounding effect, and meanwhile, the high-temperature resistance is further improved by introducing the end-capping reagent alkynyl and the diphenyl group, so that the polyimide adhesive can still maintain a good bonding effect in an environment of 400 ℃.
As a preferred embodiment, the organic solvent is selected from one or a combination of several of N, N-dimethylformamide, methyl pyrrolidone, dimethyl sulfoxide and N, N-dimethylacetamide.
As a preferred embodiment, the preparation method of the polyimide solution i comprises the following steps: dissolving tetramethyl p-phenylenediamine in N, N-dimethylformamide, stirring for 0.5-2h, adding 3,3', 4,4' -biphenyl tetracarboxylic dianhydride and ethynyl diphenyl anhydride, stirring for reaction for 0.5-1h, heating to 70-90 ℃, stirring for reaction for 4-8h to obtain a homogeneous solution, and discharging to obtain the final product.
The second aspect of the invention provides a preparation method of a heat-resistant and pressure-resistant sizing material, which comprises the following steps:
(1) uniformly mixing the polyimide solution I and the polyimide solution II, adding a filler and a crosslinking agent, and uniformly mixing and stirring;
(2) coating at the temperature of 150 ℃ and 200 ℃, and standing for 0.5-1 h.
The third aspect of the invention provides application of a heat-resistant and pressure-resistant rubber material, which is applied to the field of high-temperature press-fit cushions.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the heat-resistant pressure-resistant sizing material, 3', 4,4' -biphenyl tetracarboxylic dianhydride reacts with a diamine monomer, and ethynyl diphenyl anhydride is used as a capping agent, so that the high-temperature resistance of the polyimide adhesive can be remarkably improved, and the polyimide adhesive can be recycled for multiple times in a high-temperature and high-pressure environment.
(2) According to the heat-resistant pressure-resistant rubber material, polyimide solutions with different viscosities are adopted for carrying out crosslinking reaction, the density of a polyimide crosslinking network is increased, the high-temperature resistance of the polyimide rubber material is further improved, and the polyimide rubber material can be recycled for multiple times in a high-temperature environment of 400 ℃.
(3) According to the heat-resistant pressure-resistant sizing material, the fumed silica with the particle size of 10-100nm is introduced, so that the mechanical property of the polyimide sizing material can be improved on the basis of maintaining the dispersion uniformity of the polyimide sizing material, the heat-resistant pressure-resistant sizing material has good peel strength with a glass fiber base material, and the cured sizing material has excellent tear strength and breaking elongation performance.
Detailed Description
The present invention will be specifically described below by way of examples. It should be noted that the following examples are only for illustrating the present invention and should not be construed as limiting the scope of the present invention, and that the insubstantial modifications and adaptations of the present invention by those skilled in the art based on the above disclosure are still within the scope of the present invention.
In addition, the starting materials used are all commercially available, unless otherwise specified.
Example 1
A heat-resistant pressure-resistant rubber material comprises the following preparation raw materials in parts by weight: 80 parts of polyimide solution I, 20 parts of polyimide solution II, 3 parts of filler and 0.5 part of cross-linking agent.
The polyimide solution II has an absolute viscosity of 20000mPa.s at 25 ℃, and is purchased from Sandebo Polymer materials GmbH of Dongguan City.
The cross-linking agent is hexa (trimethylsilylethynyl) benzene. The filler is fumed silica with a particle size of 50 nm.
The polyimide solution I is self-made, and the preparation raw materials comprise the following components in parts by weight: 45 parts of aromatic diamine, 35 parts of aromatic dianhydride, 80 parts of organic solvent and 10 parts of end capping agent.
The aromatic diamine is tetramethyl-p-phenylenediamine; the aromatic dianhydride is 3,3', 4,4' -biphenyl tetracarboxylic dianhydride; the end-capping reagent is ethynyl bis-phthalic anhydride; the organic solvent is N, N-dimethylformamide.
The preparation method of the polyimide solution I comprises the following steps: dissolving tetramethyl p-phenylenediamine in N, N-dimethylformamide, stirring for 1h, adding 3,3', 4,4' -biphenyl tetracarboxylic dianhydride and ethynyl diphenyl anhydride, stirring for reacting for 40min, heating to 90 ℃, stirring for reacting for 5h to obtain a homogeneous solution, and discharging to obtain the final product.
A preparation method of a heat-resistant and pressure-resistant sizing material comprises the following steps:
(1) uniformly mixing the polyimide solution I and the polyimide solution II, adding a filler and a crosslinking agent, and uniformly mixing and stirring;
(2) coating at 195 deg.C, and standing for 30 min.
Example 2
The heat-resistant and pressure-resistant rubber material comprises the specific steps as in example 1, and is characterized in that the particle size of the filler is 0.5 mm.
Example 3
The specific steps of the heat-resistant and pressure-resistant sizing material are the same as those of example 1, and the difference is that the end-capping agent is phenylethynyl phthalic anhydride.
Performance testing
1. The peel strength of the cured sizing prepared according to the GB/T2792-2014 standard test example is tested again after the sizing is placed in an environment at 400 ℃ for 10 hours, and the bonding substrate is glass fiber base cloth which is purchased from Guangdong Shuichi GmbH.
2. The cured tensile strength at break and elongation at break of the resulting compound were tested according to GB/T30776-.
3. The tear strength of the cured compound prepared in the examples was tested according to GB/T5573-1985.
The test results are shown in Table 1.
TABLE 1
Claims (10)
1. The heat-resistant and pressure-resistant rubber material is characterized by comprising the following raw materials in parts by weight: 50-80 parts of polyimide solution I, 10-40 parts of polyimide solution II, 3-5 parts of filler and 0.1-3 parts of cross-linking agent.
2. The heat-resistant and pressure-resistant rubber compound according to claim 1, wherein the absolute viscosity of the polyimide solution II in an environment at 25 ℃ is more than or equal to 20000 mPa.s.
3. The heat and pressure resistant sizing material according to claim 1, wherein the cross-linking agent is selected from one or a combination of triethynylbenzene, hexakis (trimethylsilylethynyl) benzene, 9, 10-diphenylethynylanthracene, 3-phenyl-1-propyne, 1-ethyl-4- [ (4-propylphenyl) ethynyl ] benzene.
4. The heat and pressure resistant rubber compound according to claim 1, wherein the filler is a nano-scale filler selected from one or more of fumed silica, precipitated silica, calcium carbonate, silicon nitride, titanium oxide and aluminum oxide.
5. The heat-resistant pressure-resistant rubber material as recited in claim 1, wherein the polyimide solution i is prepared by a self-made process, and the polyimide solution i is prepared from the following raw materials in parts by weight: 40-50 parts of aromatic diamine, 30-40 parts of aromatic dianhydride, 70-100 parts of organic solvent and 10-15 parts of end capping agent.
6. The heat and pressure resistant compound according to claim 5, wherein the aromatic dianhydride is selected from one or more of 3,3', 4,4' -biphenyl tetracarboxylic dianhydride, 4,4 '-diphenyl ether dianhydride, 4,4' - (4,4 '-isopropyldiphenoxy) diphthalic anhydride, and 4,4' -hexafluoroisopropylphthalic anhydride.
7. Heat and pressure resistant sizing material according to claim 5, wherein said end-capping agent is an alkynyl-containing phthalic anhydride, preferably said alkynyl-containing phthalic anhydride is selected from one or a combination of phenyl ethynyl phthalic anhydride, ethynyl phthalic anhydride and ethynyl diphenyl anhydride.
8. The heat and pressure resistant rubber compound according to claim 5, wherein the organic solvent is selected from one or more of N, N-dimethylformamide, methyl pyrrolidone, dimethyl sulfoxide and N, N-dimethylacetamide.
9. A method for preparing a heat and pressure resistant size according to any of claims 1-8, characterized in that it comprises the following steps:
(1) uniformly mixing the polyimide solution I and the polyimide solution II, adding a filler and a crosslinking agent, and uniformly mixing and stirring;
(2) coating at the temperature of 150 ℃ and 200 ℃, and standing for 0.5-1 h.
10. Use of a heat and pressure resistant size according to any of claims 1-8 in the field of high temperature press cushions.
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| CN114891479B CN114891479B (en) | 2023-05-26 |
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2022
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2004331801A (en) * | 2003-05-07 | 2004-11-25 | Jsr Corp | Polyamic acid oligomer, polyimide oligomer, solution composition, and fiber-reinforced composite material |
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