CN114885552A

CN114885552A - Electronic equipment, shell and preparation method thereof

Info

Publication number: CN114885552A
Application number: CN202210618215.4A
Authority: CN
Inventors: 于宗强; 吉斌
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-08-09
Anticipated expiration: 2042-05-31
Also published as: CN114885552B

Abstract

The application discloses an electronic device, a shell and a preparation method thereof. The shell comprises a substrate and a pattern layer, wherein the pattern layer is arranged on one side of the substrate and covers part of the surface of the substrate, the pattern layer is provided with a logo pattern, and the pattern layer comprises an adhesive layer, a first dispersion composite layer and a first UV texture layer. The bonding layer is bonded with the substrate, the first dispersion composite layer is arranged on one side, away from the substrate, of the bonding layer and used for generating dispersion on composite light rays, and the first UV texture layer is arranged on one side, away from the bonding layer, of the first dispersion composite layer. In this way, this application casing can reach dazzling various visual effect through first dispersion composite bed, has promoted the outward appearance expressive force.

Description

Electronic equipment, shell and preparation method thereof

Technical Field

The present disclosure relates to the field of electronic device housing manufacturing technologies, and in particular, to an electronic device, a housing, and a manufacturing method thereof.

Background

At present, a logo (abbreviation of logo type, generally referred to as trademark and logo) is generally required to be manufactured on a housing of an electronic device (for example, a rear cover of a mobile phone, etc.), the logo represents a brand and a value of an electronic product and is an important element of the electronic device, and the logo manufactured on the housing of the electronic device generally needs to have higher brightness, vivid effect, etc. so as to enhance the appearance expressive force of the electronic product and increase the identification degree of the electronic device.

However, the appearance performance of the housing of the current electronic device is more limited and still needs to be improved.

Disclosure of Invention

The technical problem that this application mainly solved is to provide electronic equipment, casing and preparation method thereof, can promote electronic equipment's expressive force.

In order to solve the technical problem, the application adopts a technical scheme that: providing a shell, which comprises a substrate and a pattern layer, wherein the pattern layer is arranged on one side of the substrate and covers part of the surface of the substrate, the pattern layer is provided with a logo pattern, and the pattern layer comprises:

an adhesive layer adhered to the substrate;

the first dispersion composite layer is arranged on one side, away from the substrate, of the bonding layer and is used for dispersing composite light rays;

and the first UV texture layer is arranged on one side of the first dispersion composite layer, which is far away from the bonding layer.

In order to solve the above technical problem, another technical solution adopted by the present application is: provided is a method for preparing a case, including;

providing a substrate and a base;

transferring a first UV texture layer on the substrate;

plating a first dispersion composite layer on the first UV texture layer, wherein the first dispersion composite layer is used for generating dispersion on composite light;

printing an adhesive layer on the first dispersion composite layer;

cutting all the materials into logo patterns;

and removing the substrate to obtain a pattern layer, and adhering the bonding layer of the pattern layer to the substrate.

In order to solve the above technical problem, the present application adopts another technical solution: the utility model provides an electronic equipment, electronic equipment includes display screen module, control circuit board and the casing that this application provided, the display screen module with the casing cooperation forms the accommodation space, control circuit board locates the accommodation space, and with display screen module electric connection.

The beneficial effect of this application is: unlike the case of the prior art, the case of the present application includes a substrate and a pattern layer. The pattern layer is provided with a logo pattern and comprises an adhesive layer, a first dispersion composite layer and a first UV texture layer. The first dispersion composite layer is arranged on one side, away from the substrate, of the bonding layer, the bonding layer is used for bonding, and the first UV texture layer is arranged on one side, away from the bonding layer, of the first dispersion composite layer. First dispersion composite bed can produce the dispersion to compound light for light sees through first dispersion composite bed and can produce the effect of dazzling various, and the outward appearance aesthetic feeling on pattern layer also can be promoted to the texture on first UV texture layer simultaneously, has promoted the outward appearance expressive force of casing.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device of the present application;

FIG. 2 is a schematic sectional view of the electronic device at A-A in the embodiment of FIG. 1;

FIG. 3 is a block diagram illustrating the structural components of an embodiment of the electronic device of the present application;

FIG. 4 is an enlarged view of the region I in the embodiment of FIG. 2;

FIG. 5 is a schematic structural diagram of a first dispersion composite layer in an embodiment of a housing of the present application;

FIG. 6 is a schematic structural view of a first dispersion composite layer in another embodiment of a housing of the present application;

FIG. 7 is a schematic structural view of another embodiment of the housing of the present application;

FIG. 8 is a schematic structural view of a second dispersive composite layer in the embodiment of the casing of FIG. 7;

FIG. 9 is a schematic flow chart diagram of one embodiment of a method of making the shell of the present application;

fig. 10 is a schematic flow chart diagram illustrating a method for manufacturing an electronic device according to another embodiment of the present disclosure.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an embodiment of an electronic device of the present application, and fig. 2 is a schematic structural cross-sectional view of the electronic device at a position a-a in the embodiment of fig. 1. The electronic device in the embodiment of the application may include a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like. The present embodiment is described with reference to a mobile phone as an example.

The electronic device in this embodiment may include a display module 30, a housing 10, and a control circuit board 20. Wherein, the casing 10 is the casing provided by the present application.

Optionally, the display screen module 30 and the housing 10 cooperate to form an accommodating space 101, the control circuit board 20 is disposed in the accommodating space 101, the control circuit board 20 is electrically connected to the display screen module 30, and the control circuit board 20 is configured to control the display screen module 30. The detailed technical features of other parts of the electronic device are within the understanding of those skilled in the art, and are not described herein.

Referring to fig. 3, fig. 3 is a block diagram illustrating a structural composition of an embodiment of an electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, and the like, and the embodiment illustrates a mobile phone as an example. The electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display screen module 30 in the above embodiments), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiments), a power supply 990, and the like. Wherein the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected with the processor 980; power supply 990 is used to provide power to the entire electronic device.

Specifically, the RF circuit 910 is used for transmitting and receiving signals; the memory 920 is used for storing data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941; the sensor 950 includes an infrared sensor, a laser sensor, etc. for detecting a user approach signal, a distance signal, etc.; a speaker 961 and a microphone 962 are connected to the processor 980 through the audio circuit 960 for emitting and receiving sound signals; the wifi module 970 is used for receiving and transmitting wifi signals, and the processor 980 is used for processing data information of the electronic device.

With regard to the housing 10 of the present application, reference is made to the following description of embodiments of the housing.

As shown in fig. 2 and 4, fig. 4 is an enlarged view of the structure of the region i in the embodiment shown in fig. 2.

In the present embodiment, the case 10 includes a substrate 100 and a pattern layer 200. The material of the substrate 100 is not particularly limited, and for example, the material of the substrate 100 may include at least one of Polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and Thermoplastic Polyurethane (TPU). Specifically, the substrate 100 may include a plurality of substrate sub-layers (not shown) stacked together, for example, the substrate 100 may be a composite substrate formed by stacking polycarbonate and polymethyl methacrylate. Specifically, the thickness of the substrate 100 is not particularly limited, and for example, the thickness of the substrate 100 may be 0.05 to 0.8mm, for example, 0.09mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, or the like. According to a specific embodiment of the present application, the substrate 100 may be a composite substrate formed by laminating polycarbonate and polymethyl methacrylate, and the total thickness of the composite substrate may be 0.5 to 0.7mm (for example, 0.65mm), wherein the thickness of the polycarbonate substrate sub-layer may be 0.5 to 0.6mm (for example, 0.55mm), and the thickness of the polymethyl methacrylate substrate sub-layer may be 0.02 to 0.08mm (for example, 0.04 mm).

The substrate 100 may be used as a protective case of an electronic device, and the pattern layer 200 is disposed on one side of the substrate 100. The pattern layer 200 has a logo pattern thereon, which can be used to show the brand and value of the electronic device. The logo pattern can be any shape such as characters, letters, images and the like.

Alternatively, the pattern layer 200 may be disposed on a side of the substrate 100 near the inside of the electronic device, covering a portion of the surface of the substrate 100, or disposed on a side of the substrate 100 near the outside of the electronic device. When the substrate 100 is disposed on a side of the substrate 100 close to the inside of the electronic device, the substrate 100 is a light-transmitting material. In the present embodiment, the pattern layer 200 is disposed on a side of the substrate 100 near the inside of the electronic device, i.e., a side near a battery of the electronic device.

Since the pattern layer 200 has a logo pattern, the pattern layer 200 is usually required to be arranged to be vivid and colorful so as to attract visual attention.

In the present embodiment, the pattern layer 200 includes a first UV texture layer 210, a first dispersion composite layer 220, and an adhesive layer 230.

Specifically, the adhesive layer 230 has adhesiveness, and the adhesive layer 230 is disposed on the first dispersion composite layer 220 on the side close to the substrate 100 and is adhered to the substrate 100. The adhesive layer 230 is used to adhere the first dispersion composite layer 220 and the substrate 100.

The first dispersion composite layer 220 is disposed on the other side of the adhesive layer 230, and is fixed to the substrate 100 by the adhesive layer 230. Generally, the projection of the adhesive layer 230 on the substrate 100 is the same as the projection area of the first dispersion composite layer 220 on the substrate 100, but the projection area of the adhesive layer 230 on the substrate 100 may be appropriately reduced.

The first dispersion composite layer 220 can disperse the composite light passing therethrough, wherein the composite light refers to a multi-color light composed of a plurality of monochromatic lights, such as white light and natural light.

After the composite light passes through the first dispersion composite layer 220, the composite light is dispersed into different monochromatic lights or polychromatic lights by the first dispersion composite layer 220, and human eyes can see colorful patterns through the first dispersion composite layer 220. The first dispersion composite layer 220 provides a colorful appearance effect to human eyes, and improves the appearance expressive force of the pattern layer 200.

The first UV texture layer 210 is disposed on a side of the first dispersion composite layer 220 away from the adhesive layer 230. The first UV texture layer 210 is provided with texture to enhance the aesthetic sense of the pattern layer 200.

The light reflected by the first UV texture layer 210 needs to pass through the first dispersion composite layer 220 and then exit from the pattern layer 200, so that in this embodiment, a colorful texture can be observed by combining the first UV texture layer 210 and the first dispersion composite layer 220, thereby improving the appearance expressive force of the housing 10.

In the present embodiment, the first dispersion composite layer 220 includes several dispersion layers stacked one on another. Wherein adjacent two of the dispersive layers have different refractive indices.

Since the composite light includes a plurality of monochromatic lights, and different monochromatic lights have different frequencies, the different frequencies of light have different refractive indices corresponding to the single dispersive layer, and thus the composite light is dispersed into a plurality of colors of light when passing through the first dispersive composite layer 220. Meanwhile, the two adjacent dispersion layers in this embodiment have different refractive indexes for light with the same frequency, so that light can be refracted many times in the first dispersion composite layer 220, the dispersion effect of the first dispersion composite layer 220 is improved, and the light emitted from the first dispersion composite layer 220 is more colorful.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a first dispersion composite layer in an embodiment of a housing of the present application.

Specifically, In one embodiment of the present application, the first dispersion composite layer 220 includes a first SiO2 layer 221a, an In2O3 layer 222, a second SiO2 layer 221b, a SnO layer 223, and a third SiO2 layer 221c, which are sequentially stacked.

The first SiO2 layer 221a may be bonded to the bonding layer 230, or the third SiO2 layer 221c may be bonded to the bonding layer 230, and the order of each dispersion layer may be appropriately adjusted by those skilled in the art.

As the first dispersion composite layer 220 applied to the electronic device shell, the total thickness of the first dispersion composite layer 220 is 50-150 nm, that is, the thickness of the first SiO2 layer 221a, the In2O3 layer 222, the second SiO2 layer 221b, the SnO layer 223 and the third SiO2 layer 221c which are stacked together is 50-150 nm, and preferably, the total thickness of the first dispersion composite layer 220 is 80-120 nm.

The first SiO2 layer 221a, the second SiO2 layer 221b and the third SiO2 layer 221c have a thickness of 5 to 10nm, such as 5nm, 6nm, 7nm, 8nm, 9nm and 10 nm. The thicknesses of the first SiO2 layer 221a, the second SiO2 layer 221b, and the third SiO2 layer 221c may be the same or different.

The thickness of the In2O3 layer 222 can be selected from 20-50 nm, such as 23nm, 25nm, 28nm, 32nm, 35nm, 39nm, 41nm, 44nm, 48nm, and 49 nm.

The thickness of the SnO layer 223 may be selected from 5 to 15nm, such as 6nm, 8nm, 9nm, 10nm, 12nm, and 14 nm.

In this embodiment, the first dispersion composite layer 220 includes a plurality of dispersion layers of metal oxide layers stacked in sequence, in which adjacent dispersion layers have different optical refractive indexes for the same frequency, so as to increase the refraction times of light and improve the dispersion effect.

In other embodiments, one skilled in the art can add more dispersion layers based on the dispersion layers to enhance the appearance of the housing 10.

With the first dispersion composite layer 220 in the embodiment of fig. 5, a high-brightness silver effect can be observed, visual attention can be attracted in appearance, and the appearance expressive force of the housing 10 is improved.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a first dispersion composite layer in another embodiment of a housing of the present application.

In this embodiment, the first dispersion composite layer 220 includes a fourth SiO2 layer 221d, a first ZrO2 layer 224a, a first TiO2 layer 225a, a fifth SiO2 layer 221e, a second TiO2 layer 225b, a sixth SiO2 layer 221f, and a third TiO2 layer 225c, which are sequentially stacked.

The fourth SiO2 layer 221d may be bonded to the bonding layer 230, or the third TiO2 layer 225c may be bonded to the bonding layer 230, and the order of each dispersion layer may be appropriately adjusted by those skilled in the art.

As the first dispersion composite layer 220 applied to the electronic device casing, the total thickness of the first dispersion composite layer 220 is 50 to 150nm, that is, the thickness of the fourth SiO2 layer 221d, the first ZrO2 layer 224a, the first TiO2 layer 225a, the fifth SiO2 layer 221e, the second TiO2 layer 225b, the sixth SiO2 layer 221f and the third TiO2 layer 225c which are stacked together is 50 to 150nm, and preferably, the total thickness of the first dispersion composite layer 220 is 80 to 120 nm.

The thickness of the fourth SiO2 layer 221d may be selected from 3 to 5nm, such as 3.1nm, 3.5nm, 3.9nm, 4.3nm, 4.5nm, and 4.8 nm.

The thickness of the first ZrO2 layer 224a may be selected from 3 to 16nm, such as 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm, and 16 nm.

The thickness of the first TiO2 layer 225a may be selected from 5 to 15nm, such as 4nm, 5nm, 7nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, and 15 nm.

The thickness of the fifth SiO2 layer 221e can be selected from 5-10 nm, such as 5nm, 6nm, 7nm, 8nm, 9nm, 10 nm.

The thickness of the second TiO2 layer 225b may be selected from 10 to 20nm, such as 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, and 20 nm.

The thickness of the sixth SiO2 layer 221f can be selected from 5-20 nm, such as 5nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, and 20 nm.

The thickness of the third TiO2 layer 225c is selected from 10-20 nm, such as 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, and 20 nm.

In this embodiment, the first dispersion composite layer 220 also includes a plurality of dispersion layers of metal oxide layers stacked in sequence, in which the refractive indexes of the adjacent dispersion layers to the light with the same frequency are different, so as to increase the refraction times of the light and improve the dispersion effect.

Through the first dispersion composite layer 220 in the embodiment of fig. 6, a multi-color dazzling effect can be observed, visual attention can be attracted in appearance, and the appearance expression of the housing 10 is improved.

With continued reference to fig. 4-6, the patterned layer 200 of the present embodiment may be separately prepared and then bonded to the substrate 100.

Specifically, a UV glue may be first coated on a substrate, and a texture may be transferred on the UV glue using a mold to form the first UV texture layer 210. The substrate may be a substrate of PET material.

Alternatively, the viscosity of the UV glue forming the first UV texture layer 210 may be 300-800 cps, such as 400cps, 500cps, 600cps, 700cps, 800 cps.

Optionally, the UV glue layer coated on the substrate has a thickness of 9-12 μm, such as 9 μm, 9.5 μm, 10 μm, 11 μm, 12 μm.

After the UV glue is coated, a mould is used for impressing textures on the UV glue on the substrate, then the state that the mould is attached to a UV glue layer is kept, the UV glue is subjected to ultraviolet lamp curing, the curing energy is about 500-1000 mJ/cm2, the UV glue is cured and molded to form a first UV texture layer 210, and finally the mould is removed.

After the mold is removed, the first dispersion composite layer 220 is prepared on the first UV texture layer 210.

The first dispersion composite layer 220 may have the structure shown in fig. 5 or 6 described above. The method of preparing the first dispersion composite layer 220 may be a method using Physical Vapor Deposition (PVD), such as a vacuum evaporation method, a vacuum ion method, a magnetron sputtering method, and the like.

For preparing the first dispersion composite layer 220 in the embodiments of fig. 5 and 6, magnetron sputtering may be preferably used for coating. Magnetron sputtering is one of the most common methods for preparing thin films of metals and their oxides. For most materials, sputtering can be achieved as long as the target can be prepared. The film obtained by magnetron sputtering is well connected with the substrate, and the film obtained by sputtering has high purity, good compactness and good uniformity of film shape; the deposition rate is high, a large ion flow can be formed, and the yield is high; the sputtering process has good repeatability, can obtain a film with uniform thickness on a large substrate, and different metals, alloys and oxides can be simultaneously mixed and sputtered for plating.

After the first dispersion composite layer 220 is prepared, the adhesive layer 230 is formed on the first dispersion composite layer.

Alternatively, the adhesive layer 230 may be formed using a screen printing method. The UV pressure sensitive adhesive can be particularly printed by silk screen, and the viscosity of the UV pressure sensitive adhesive is 800-2000 cps, such as 900cps, 1100cps, 1300cps, 1600cps, 1800cps and 1900 cps. And (4) curing after silk-screen printing, wherein the energy required by curing is about 600-2000 mJ/cm 2.

After the first UV texturing layer 210, the first dispersion composite layer 220 and the adhesive layer 230 are prepared, cnc (computer numerical control) cutting is performed on the whole of the first UV texturing layer 210, the first dispersion composite layer 220 and the adhesive layer 230. CNC is also called a numerical control machine, which is an automatic machine tool equipped with a program control system, and can process parts according to a programmed program. Therefore, the required logo drawing is guided into a computer to cut the material through CNC equipment, and the pattern layer 200 with the logo pattern can be obtained. Finally, the substrate is torn off, and the pattern layer 200 is obtained.

The method for forming the pattern layer is a feasible method in the embodiments of the housing of the present application, and the pattern layer of the housing of the present application is not excluded from being formed by other methods.

Referring to fig. 7 and 8, fig. 7 is a schematic structural diagram of another embodiment of the housing of the present application, and fig. 8 is a schematic structural diagram of a second dispersive composite layer in the embodiment of the housing of fig. 7.

Compared to the above embodiments, the housing 20 in the present embodiment further includes a second UV texture layer 300, a second dispersion composite layer 400, an ink layer 500, and an outer texture layer 600 in addition to the substrate 100 and the pattern layer 200.

For the substrate 100 and the pattern layer 200, reference may be made to the description of the above embodiments, which are not repeated herein.

The second UV texture layer 300 is disposed on a side of the substrate 100 adjacent to the patterning layer 200 and covers an area of the substrate 100 not covered by the patterning layer 200.

It is also understood that the second UV texturing layer 300 is disposed at one side of the substrate 100, and the pattern layer 200 is filled in the second UV texturing layer 300 and is adhered to the substrate 100.

Alternatively, the second UV texturing layer 300 may cover one side surface of the substrate 100 completely or partially.

Optionally, the thickness of the second UV texture layer 300 is 9-15 μm, such as 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.3 μm, 12 μm, 13.5 μm, 14 μm, 14.5 μm.

The second UV texture layer 300 is also textured to enhance the aesthetic appeal of the housing 10. In addition, the second UV texture layer 300 can also play a certain role in fixing the pattern layer 200.

The second UV texture layer 300 may be formed by UV glue transfer. After the pattern layer 200 is bonded, UV glue is dispensed to a side of the substrate 100 close to the pattern layer 200, then a corresponding mold is used to transfer texture to a side of the UV glue away from the substrate 100, and finally, the second UV texture layer 300 is formed by curing.

The second dispersion composite layer 400 is disposed on a side of the second UV texture layer 300 away from the substrate 100.

Second dispersion composite bed 400 can produce the dispersion to compound light, and compound light passes through second dispersion composite bed 400 after, is dispersed into the light of multiple colour, reaches the outward appearance effect of dazzling various, has promoted casing 10's outward appearance expressive force.

The second dispersive composite layer 400 includes several dispersive layers arranged in a stack. Specifically, the second dispersion composite layer 400 may include a seventh SiO2 layer 410a, a second ZrO2 layer 420, a fourth TiO2 layer 430a, an eighth SiO2 layer 410b, a fifth TiO2 layer 430b, a ninth SiO2 layer 410c, and a sixth TiO2 layer 430c, which are stacked on one side. Either the seventh SiO2 layer 410a or the sixth TiO2 layer 430c may be connected to the second UV texture layer 300.

Optionally, the total thickness of the second dispersion composite layer 400 is 150 to 400nm, preferably 200 to 300 nm.

The thickness of the seventh SiO2 layer 410a may be selected from 5 to 10nm, such as 5nm, 6nm, 7nm, 8nm, 9nm, and 10 nm.

The thickness of the second ZrO2 layer 420 may be selected from 3 to 15nm, such as 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm

The thickness of the fourth TiO2 layer 430a may be selected from 50-150 nm, such as 51nm, 55nm, 60nm, 65nm, 70nm, 78nm, 80nm, 90nm, 95nm, 100nm, 120nm, 130nm, 140nm, 145 nm.

The thickness of the eighth SiO2 layer 410b may be selected from 10 to 50nm, such as 11nm, 15nm, 18nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, and 48 nm.

The thickness of the fifth TiO2 layer 430b may be selected from 20-120 nm, such as 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, and 115 nm.

The thickness of the ninth SiO2 layer 410c is selected from 10-50 nm, such as 12nm, 18nm, 20nm, 25nm, 30nm, 40nm, 45nm, and 48 nm.

The thickness of the sixth TiO2 layer 430c may be selected from 20-120 nm, such as 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, and 115 nm.

Thus, in the present embodiment, the second dispersive composite layer 400 also includes a plurality of dispersive layers of metal oxide layers that are sequentially stacked. The appearance of glare can be observed through the second dispersive composite layer 400. The adjacent dispersion layers have different light refractive indexes with the same frequency, so that the refraction times of light are increased, and the dispersion effect is improved.

Alternatively, each of the dispersive layers of the second dispersive composite layer 400 may be prepared by a PVD method, such as a magnetron sputtering method.

In other embodiments, other dispersion layers may be added, or the order of the dispersion layers in this embodiment may be changed.

The ink layer 500 is disposed on a side of the second dispersion composite layer 400 away from the second UV texture layer 300.

Ink layer 500 can include a capping ink layer (not shown) and/or a fire-blocking ink layer (not shown).

The bottom ink layer can be black or gray or other colors, the thickness can be selected to be 5-10 mu m, and the bottom ink layer can be formed by adopting a screen printing method.

The fireproof printing ink layer has high temperature resistance, and under the condition that the printing ink layer and the fireproof printing ink layer are used at the bottom of the cover, the fireproof printing ink layer is arranged on one side, away from the second dispersion composite layer 400, of the printing ink layer at the bottom of the cover and is used for contacting with elements such as a battery and a circuit of electronic equipment, and the thickness of the fireproof printing ink layer can be selected to be 5-20 micrometers. The fireproof ink layer can also be formed by adopting a screen printing method.

The outer texture layer 600 is disposed on a side of the substrate 100 away from the patterned layer 200. The outer texture layer 600 has a certain texture, which can enhance the appearance of the housing 10.

Therefore, in the above embodiment of the present application, the pattern layer 200 having the logo pattern can provide a colorful and bright light expression effect to the pattern layer 200 due to the dispersion effect of the first dispersion composite layer 220 inside the pattern layer 200, and the appearance expression of the pattern layer 200 is improved. Meanwhile, the second dispersive composite layer 400 on the housing 10 can also have a dispersive effect on light, further enhancing the appearance expressive force of the housing 10, and making the CMF of the housing 10 diversified.

In another aspect of the present application, a method of manufacturing a housing is also provided.

Referring to fig. 9, fig. 9 is a schematic flow chart of an embodiment of a method for manufacturing a housing according to the present application. The preparation method comprises the following steps:

s100: a substrate and a base are provided.

The substrate is used for preparing a pattern layer with a logo pattern, and the base is used as a protective shell of the electronic equipment.

The material of the substrate may include at least one of Polycarbonate (PC), Polymethylmethacrylate (PMMA), polyethylene terephthalate (PET), and Thermoplastic Polyurethane (TPU). In particular, the substrate may comprise a plurality of substrate sub-layers arranged in a stack, for example the substrate may be a composite substrate formed by stacking polycarbonate and polymethylmethacrylate. Specifically, the thickness of the substrate is not particularly limited, and for example, the thickness of the substrate may be 0.05 to 0.8mm, for example, 0.09mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, or the like. According to the specific embodiment of the application, the base can be a composite substrate formed by laminating polycarbonate and polymethyl methacrylate, the total thickness of the composite substrate can be 0.5-0.7 mm (for example, 0.65mm), wherein the thickness of the polycarbonate substrate sub-layer can be 0.5-0.6 mm (for example, 0.55mm), and the thickness of the polymethyl methacrylate substrate sub-layer can be 0.02-0.08 mm (for example, 0.04 mm).

The substrate can be a PET substrate, the PET release film is adopted in the embodiment, the thickness of the substrate can be 40-60 mu m, and the release force gram weight of the PET release film is 25-40 g.

S200: a first UV texture layer is transferred onto the substrate.

A first UV textured layer having texture is prepared on the substrate.

Specifically, the UV glue is coated on the substrate, and then the texture on the mold is transferred to the UV glue by using a mold imprinting method.

The viscosity of the UV glue can be 300-800 cps, such as 400cps, 500cps, 600cps, 700cps, 800 cps. The UV glue layer formed on the substrate has a thickness of 9 to 12 μm, and may be 9 μm, 9.5 μm, 10 μm, 11 μm, or 12 μm, for example.

After the UV glue is coated, a mold with texture is used for imprinting on the UV glue on the substrate, then the state that the mold is attached to a UV glue layer is kept, ultraviolet lamp curing is carried out on the UV glue, the curing energy is about 500-1000 mJ/cm2, the UV glue is cured and molded, a first UV texture layer is formed, and finally the mold is removed.

S300: plating a first dispersion composite layer on the first UV texture layer.

Through the steps, the first UV texture layer with the texture is prepared, and then the first dispersion composite layer is plated on the textured side of the first UV texture layer.

The first dispersion composite layer is used for generating dispersion on the composite light rays penetrating through the first dispersion composite layer, and the effect of dazzling colors is achieved. The first dispersion composite layer can be prepared by sequentially plating dispersion layers formed of a plurality of metal oxide layers.

Specifically, the first dispersion composite layer may be plated by a PVD method, and the magnetron sputtering method is taken as an example in this embodiment.

In the magnetron sputtering process, firstly, a mechanical pump is used for vacuumizing a sputtering chamber to about 3Pa, then, the molecular pump sputtering chamber is used for continuously vacuumizing to about 0.001Pa, the size of gas flow and sputtering power are properly adjusted, and a film is deposited on the texture surface of the first UV texture layer.

In one embodiment, the magnetron sputtered target may include SiO2, In2O3, SnO. And a first SiO2 layer, an In2O3 layer, a second SiO2 layer, an SnO layer and a third SiO2 layer are sequentially plated on the first UV texture layer.

The first SiO2 layer, the second SiO2 layer and the third SiO2 layer have a thickness of 5-10 nm, such as 5nm, 6nm, 7nm, 8nm, 9nm and 10 nm. The thicknesses of the first SiO2 layer, the second SiO2 layer and the third SiO2 layer can be the same or different.

The thickness of the In2O3 layer can be selected from 20-50 nm, such as 23nm, 25nm, 28nm, 32nm, 35nm, 39nm, 41nm, 44nm, 48nm, and 49 nm.

The thickness of the SnO layer can be selected from 5-15 nm, such as 6nm, 8nm, 9nm, 10nm, 12nm and 14 nm.

The total thickness of the first dispersion composite layer prepared by the method is controlled within 50-150 nm.

The first dispersion composite layer prepared by the embodiment has an excellent high-brightness silver appearance effect, and the appearance is improved.

In another embodiment, the magnetron sputtered target may include SiO2, ZrO2, TiO 2. And a fourth SiO2 layer, a first ZrO2 layer, a first TiO2 layer, a fifth SiO2 layer, a second TiO2 layer, a sixth SiO2 layer and a third TiO2 layer are sequentially plated on the first UV texture layer.

The thickness of the fourth SiO2 layer can be selected from 3-5 nm, such as 3.1nm, 3.5nm, 3.9nm, 4.3nm, 4.5nm, 4.8 nm.

The thickness of the first ZrO2 layer may be selected from 3 to 16nm, such as 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm, 16 nm.

The thickness of the first TiO2 layer is selected from 5-15 nm, such as 4nm, 5nm, 7nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, and 15 nm.

The thickness of the fifth SiO2 layer can be selected from 5-10 nm, such as 5nm, 6nm, 7nm, 8nm, 9nm, 10 nm.

The thickness of the second TiO2 layer is 10-20 nm, such as 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20 nm.

The thickness of the sixth SiO2 layer is selected from 5-20 nm, such as 5nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, and 20 nm.

The thickness of the third TiO2 layer is 10-20 nm, such as 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20 nm.

The first dispersion composite layer prepared by the embodiment has colorful appearance effect and improves appearance.

In other embodiments, the first dispersive composite layer may further include more dispersive layers than the embodiments described above.

S400: printing an adhesive layer on the first dispersion composite layer.

After the first dispersion composite layer is prepared, an adhesive layer is printed on one side of the first dispersion composite layer, which is far away from the first UV texture layer.

The adhesive layer is used to adhere the first dispersion composite layer and the first UV texture layer to other components, and the adhesive layer may be formed using a screen printing method.

Specifically, a UV pressure sensitive adhesive may be screen printed on a side of the first dispersion composite layer away from the first UV texture layer.

The viscosity of the UV pressure-sensitive adhesive is 800-2000 cps, such as 900cps, 1100cps, 1300cps, 1600cps, 1800cps, 1900 cps.

The mesh number of the silk screen printing plate can be 800-3000 meshes, preferably 1000-2000 meshes, and the material of the silk screen printing plate can be polyester PC or stainless steel silk screen printing plate.

The glass transition temperature of the UV pressure-sensitive adhesive is generally selected from-40 ℃ to-10 ℃, the drawing force of the UV pressure-sensitive adhesive is generally required to be more than 20N for a PC/PMMA substrate, the UV pressure-sensitive adhesive can resist the temperature of 180-230 ℃ for 2 minutes, and the bonding strength of the UV pressure-sensitive adhesive is not reduced.

The wavelength of a curing lamp of the UV pressure-sensitive adhesive is 365nm, the power is 40-80 mW, and the required curing energy is 600-2000 mJ/cm 2. After curing, an adhesive layer is formed.

S500: all the above materials were cut into logo patterns.

After the above steps, a first UV texture layer, a first dispersion composite layer, and an adhesive layer formed on the substrate in this order are obtained.

And (3) introducing a required logo pattern drawing into a computer, and then cutting the substrate, the first UV texture layer, the first dispersion composite layer and the bonding layer through CNC equipment to obtain a logo pattern. The logo pattern can be any shape such as characters, letters, images and the like.

After CNC cutting, the positional relationship of the substrate, the first UV texture layer, the first dispersion composite layer and the bonding layer is unchanged.

And after CNC cutting, attaching a protective layer on one side of the bonding layer. In this embodiment, the protective layer on the side of the adhesive layer may be a PET release film similar to the substrate. In order to distinguish the substrate, the thickness of the protective layer is 25 μm, and the release liner has a lower release force gram weight than the substrate.

S600: and removing the substrate to obtain a pattern layer, and adhering the bonding layer of the pattern layer to the substrate.

And removing the substrate and the protective layer to obtain a pattern layer comprising the first UV texture layer, the first dispersion composite layer and the adhesive layer, and adhering the adhesive layer to the substrate.

The protective layer is used for in actual industrial production, and adhesive linkage and basement bond at different workstations, and the protective layer is used for preventing impurity entering adhesive linkage, also can not be at the attached protective layer of one side of adhesive linkage in fact, directly bonds the adhesive linkage in the basement.

Through the steps, the shell with the pattern layer with the colorful effect is obtained. The casing can regard as electronic equipment's protection casing to use, consequently, the logo pattern on the application casing has the excellent various effect of dazzling, can promote electronic equipment's outward appearance expressive force.

Referring to fig. 10, fig. 10 is a schematic flow chart of a manufacturing method of an electronic device according to another embodiment of the present application.

In order to enhance the appearance of the housing, step S600 may further include:

s700: and dispensing UV glue on the side, provided with the pattern layer, of the substrate, covering the pattern layer with the UV glue, and stamping the texture on the UV glue to obtain a second UV texture layer.

And dispensing UV glue on the substrate with the pattern layer, wherein the UV glue and the pattern layer are positioned on the same side of the substrate, and the UV glue covers the area of the substrate which is not covered by the pattern layer.

The UV glue is used to form a second UV texture layer having a texture, the texture on the second UV texture layer may also be imprinted using a mold, and then the second UV texture layer is UV cured.

Alternatively, the second UV texturing layer may cover one side surface of the substrate completely or partially.

Optionally, the second UV textured layer has a thickness of 9-15 μm, such as 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.3 μm, 12 μm, 13.5 μm, 14 μm, 14.5 μm.

Because the second UV texture layer has the texture, can promote the aesthetic feeling of casing, simultaneously, the second UV texture layer can also play certain fixed action to the pattern layer.

S800: plating a second dispersive composite layer on the second UV texture layer.

And after the second UV texture layer is cured, plating a second dispersion composite layer on the second UV texture layer.

The second dispersion composite layer is used for generating dispersion on the composite light penetrating through the second dispersion composite layer, and the effect of dazzling colors is achieved. The second dispersive composite layer can be prepared by sequentially plating dispersive layers formed by a plurality of metal oxide layers.

Specifically, the second dispersion composite layer may be plated by a PVD method, and the magnetron sputtering method is exemplified in this embodiment.

In the magnetron sputtering process, firstly, a mechanical pump is used for vacuumizing a sputtering chamber to about 3Pa, then, the molecular pump sputtering chamber is used for continuously vacuumizing to about 0.001Pa, the size of gas flow and sputtering power are properly adjusted, and a film is deposited on the texture surface of the second UV texture layer.

In one embodiment, the magnetron sputtered target may include SiO2, ZrO2, TiO 2. And a seventh SiO2 layer, a second ZrO2 layer, a fourth TiO2 layer, an eighth SiO2 layer, a fifth TiO2 layer, a ninth SiO2 layer and a sixth TiO2 layer are sputtered on the second UV texture layer in sequence.

Wherein, the thickness of the seventh SiO2 layer can be selected from 5-10 nm, such as 5nm, 6nm, 7nm, 8nm, 9nm, 10 nm.

The thickness of the second ZrO2 layer may be selected from 3 to 15nm, such as 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm

The thickness of the fourth TiO2 layer is selected from 50-150 nm, such as 51nm, 55nm, 60nm, 65nm, 70nm, 78nm, 80nm, 90nm, 95nm, 100nm, 120nm, 130nm, 140nm, 145 nm.

The thickness of the eighth SiO2 layer is selected from 10-50 nm, such as 11nm, 15nm, 18nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, and 48 nm.

The thickness of the fifth TiO2 layer is 20-120 nm, such as 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, and 115 nm.

The thickness of the ninth SiO2 layer is selected from 10-50 nm, such as 12nm, 18nm, 20nm, 25nm, 30nm, 40nm, 45nm, and 48 nm.

The thickness of the sixth TiO2 layer is selected from 20-120 nm, such as 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, and 115 nm.

The total thickness of the plated second dispersion composite layer is 150-400 nm, preferably 200-300 nm.

Obtain the second dispersion composite bed through above-mentioned mode preparation and can play dispersive effect to light for natural light sees through behind the second dispersion composite bed dispersion for richly dazzling various colour light, combines the texture on the second UV texture layer, can effectively promote the feel and the aesthetic feeling of electronic equipment casing.

S900: and printing an ink layer on one side of the second dispersion composite layer, which is far away from the second UV texture layer.

And after plating the second dispersion composite layer, printing an ink layer on one side of the second dispersion composite layer, which is far away from the second UV texture layer.

The ink layer can comprise a cover bottom ink layer and/or a fireproof ink layer, the cover bottom ink layer is used for coloring, and the fireproof ink layer is used for protecting the use safety of the electronic equipment.

Optionally, the bottom ink layer may be black or gray or other colors, and the thickness of the silk-screen bottom ink layer may be selected to be 5-10 μm.

Optionally, the thickness of the fireproof ink layer is 5-20 μm.

The fireproof ink layer has high temperature resistance and is used for contacting with elements such as batteries, circuits and the like of electronic equipment. The base ink layer may be first screen printed on the second discrete composite layer and then the fire-retardant ink layer may be screen printed on the base ink layer.

S1000: an outer texture layer is prepared on the side of the substrate away from the pattern layer.

And preparing an outer texture layer on one side of the substrate far away from the pattern layer, wherein the substrate is close to the pattern layer and faces the inside of the electronic equipment, and the side of the substrate far away from the pattern layer faces the outside.

Firstly, spraying and coating a dual-curing hardening liquid on one side of the substrate far away from the pattern layer, and then baking for 3-6 min at the temperature of 55-80 ℃ to volatilize a solvent in the dual-curing hardening liquid, so as to leave a resin, a monomer, a curing agent and the like to uniformly form a wet film on the surface of the substrate, thereby obtaining an uncured spraying coating. The thickness of the spray coating is preferably controlled to be about 4-30 mu m, the thickness of the spray coating is too thin, poor appearance is easily generated for stamping in a post process, and the thickness of the spray coating is too thick, so that the toughness of the cured coating is poor, and the coating is easy to crack in bending.

Optionally, the dual cure curtain coating liquid composition comprises: 20-40 parts of 2-4 functional polyurethane acrylic resin, 55-80 parts of 5-9 functional polyurethane acrylate, 3-5 parts of photoinitiator and 100-300 parts of solvent.

Secondly, pressing the uncured spray coating and the mold with the texture together, enabling the spray coating to be pressed out of the texture copied by the concave-convex structure of the texture mold, then enabling the texture mold and the spray coating to be irradiated by an LED lamp together, enabling the spray coating to be semi-cured, and removing the texture mold after curing. The die can be a transparent sheet with the thickness of 0.1-0.38 mm, if the thickness of the sheet is too thin, the embossing is easy to cause the abnormalities such as orange peel appearance, non-pressing texture and the like, and if the thickness of the sheet is too thick, the texture is difficult to prepare, and the cost is increased.

Alternatively, the transparent sheet material may be any one of PET, PC, PVC (polyvinyl chloride), PU (polyurethane), and TPU.

Optionally, the thickness of the texture layer on the mold is 5-25 um, the surface dyne value is less than 34dyn, and if the dyne value is too high, sticking of the semi-cured hardened layer may be caused, and deformation of the texture may be caused by pulling the hardened liquid from the mold after imprinting.

Optionally, the combination of the mould and the curtain coating layer can adopt vacuum lamination or rolling lamination, and the laminating pressure needs to be controlled at 0.5-8 Bar.

And curing the LED lamp after lamination, wherein the wavelength of the curing lamp is 365-400 nm, and the energy required by curing is 50-250mj/cm 2. The hardness of the pencil on the external texture surface after the LED is solidified is about 4B-2B, the elongation at break is 50% -200%, and the solidification rate is 32% -60%.

And after the LED lamp is cured, completely curing the outer texture by using an Hg lamp at a curing rate of 80-85% to finally form an outer texture layer.

The outer texture layer prepared by the method can further improve the appearance of the shell and the touch of the electronic equipment, so that the electronic equipment has market competitiveness.

After the shell is prepared by the method, the shell can be further subjected to a strength test to ensure the product quality of the shell, and the strength test data of the shell prepared by the preparation method of the shell are provided as follows:

the strength test proves that the shell obtained by the shell preparation method is good in strength and not easy to damage.

In summary, the present application provides an electronic device, a housing and a method for manufacturing the housing. The shell and the logo pattern with the colorful logo prepared by the preparation method can improve the appearance expressive force of the electronic equipment, so that the market competitiveness is improved.

The above description is only an example of the present application, and is not intended to limit the scope of the present application, and all equivalent structures or equivalent processes performed by the present application and the contents of the attached drawings, which are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A shell is characterized by comprising a substrate and a pattern layer, wherein the pattern layer is arranged on one side of the substrate and covers part of the surface of the substrate, the pattern layer is provided with a logo pattern, and the pattern layer comprises:

an adhesive layer adhered to the substrate;

the first dispersion composite layer is arranged on one side, away from the substrate, of the bonding layer and is used for generating dispersion on the composite light;

2. The housing of claim 1,

the first dispersion composite layer comprises a plurality of dispersion layers which are arranged in a stacked mode, and the refractive indexes of two adjacent dispersion layers are different.

3. The housing of claim 2,

the first dispersion composite layer comprises a first SiO2 layer, an In2O3 layer, a second SiO2 layer, an SnO layer and a third SiO2 layer which are sequentially stacked.

4. The housing of claim 2,

the first dispersion composite layer comprises a fourth SiO2 layer, a first ZrO2 layer, a first TiO2 layer, a fifth SiO2 layer, a second TiO2 layer, a sixth SiO2 layer and a third TiO2 layer which are sequentially stacked.

5. The housing of claim 1, further comprising:

the outer texture layer is arranged on one side, far away from the pattern layer, of the substrate;

the second UV texture layer is arranged on one side of the substrate and covers the area of the substrate which is not covered by the pattern layer;

the second dispersion composite layer is arranged on one side, away from the substrate, of the second UV texture layer and is used for generating dispersion on composite light;

and the ink layer is arranged on one side, away from the second UV texture layer, of the second dispersion composite layer.

6. The housing of claim 5,

the second dispersed composite layer comprises a seventh SiO2 layer, a second ZrO2 layer, a fourth TiO2 layer, an eighth SiO2 layer, a fifth TiO2 layer, a ninth SiO2 layer and a sixth TiO2 layer which are sequentially stacked.

7. A method for preparing a shell is characterized by comprising the following steps of;

providing a substrate and a base;

transferring a first UV texture layer on the substrate;

printing an adhesive layer on the first dispersion composite layer;

cutting all the materials into logo patterns;

8. The method of claim 7, wherein the step of plating a first dispersion composite layer on the first UV texture layer comprises:

plating a first SiO2 layer, an In2O3 layer, a second SiO2 layer, a SnO layer and a third SiO2 layer on the substrate In sequence by using a PVD (physical vapor deposition) coating method; alternatively, the first and second electrodes may be,

the steps include: and a fourth SiO2 layer, a first ZrO2 layer, a first TiO2 layer, a fifth SiO2 layer, a second TiO2 layer, a sixth SiO2 layer and a third TiO2 layer are sequentially plated on the substrate by using a PVD (physical vapor deposition) film plating method.

9. The method of manufacturing according to claim 7, further comprising:

dispensing UV glue on one side of the substrate provided with the pattern layer, and stamping textures on the UV glue to obtain a second UV texture layer;

plating a second dispersion composite layer on the second UV texture layer, wherein the second dispersion composite layer is used for generating dispersion on the composite light;

printing an ink layer on one side, far away from the second UV texture layer, of the second dispersion composite layer in a silk-screen mode;

preparing an outer texture layer on the side of the substrate away from the pattern layer.

10. An electronic device, comprising a display module, a control circuit board and the housing according to any one of claims 1 to 6, wherein the display module and the housing cooperate to form an accommodating space, and the control circuit board is disposed in the accommodating space and electrically connected to the display module.