CN114002872A

CN114002872A - Shell of electronic equipment, manufacturing method of shell and electronic equipment

Info

Publication number: CN114002872A
Application number: CN202010732354.0A
Authority: CN
Inventors: 金挺顺
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-07-27
Filing date: 2020-07-27
Publication date: 2022-02-01
Also published as: WO2022022156A1

Abstract

The application discloses a shell of electronic equipment, a manufacturing method of the shell and the electronic equipment, wherein the shell of the electronic equipment comprises a substrate and a liquid crystal layer; the liquid crystal layer is arranged on the substrate and comprises oriented liquid crystal, so that incident light entering the liquid crystal layer can be reflected out through the liquid crystal, and the wavelength of the reflected light is changed along with the change of the incident angle of the incident light. In this way, the present effect of electronic equipment's casing can be richened in this application, improves the aesthetic feeling of electronic equipment's casing, satisfies user's user demand.

Description

Shell of electronic equipment, manufacturing method of shell and electronic equipment

Technical Field

The present disclosure relates to the field of electronic device housings, and particularly to a housing of an electronic device, a manufacturing method thereof, and an electronic device.

Background

At present, electronic devices such as mobile phones and the like have become essential tools for daily work and life of people.

With the continuous development of the industry, the housings of electronic devices with single color effects, such as battery covers of mobile phones, have not been able to meet the increasing demands of users.

Disclosure of Invention

The technical problem mainly solved by the application is to provide the shell of the electronic equipment, the manufacturing method of the shell of the electronic equipment and the electronic equipment, which can enrich the presenting effect of the shell of the electronic equipment, improve the aesthetic feeling of the shell of the electronic equipment and meet the use requirements of users.

In order to solve the technical problem, the application adopts a technical scheme that: providing a shell of an electronic device, wherein the shell of the electronic device comprises a substrate and a liquid crystal layer; the liquid crystal layer is arranged on the substrate and comprises oriented liquid crystal, so that incident light entering the liquid crystal layer can be reflected out through the liquid crystal, and the wavelength of the reflected light is changed along with the change of the incident angle of the incident light.

In order to solve the above technical problem, another technical solution adopted by the present application is: a method for manufacturing a shell of an electronic device is provided, which comprises the following steps: providing a substrate; and forming a liquid crystal layer on the substrate, wherein the liquid crystal layer includes liquid crystal oriented so that incident light entering the liquid crystal layer can be reflected by the liquid crystal, and a wavelength of the reflected light is varied according to a change in an incident angle of the incident light.

In order to solve the above technical problem, the present application adopts another technical solution: provided is an electronic device including: the device comprises a shell and a functional device, wherein the shell is defined with an accommodating space; the functional device is accommodated in the accommodating space; wherein the housing is a housing of the electronic device.

The beneficial effect of this application is: be different from prior art's condition, this application electronic equipment's casing includes base member and liquid crystal layer, the liquid crystal layer sets up on the base member, because include the liquid crystal through the orientation in the liquid crystal layer, under the reflex action through the liquid crystal of orientation, make the liquid crystal layer can reflect the light that gets into via the base member, thereby improve the luminance of casing, and because the wavelength of reverberation changes along with the incident angle's of incident light change, make the casing can demonstrate the color, and change and take place the look along with the incident angle's of light change, thereby enrich the effect that presents of electronic equipment's casing, improve the aesthetic feeling of electronic equipment's casing, satisfy user's user demand.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:

FIG. 1 is a schematic structural diagram of an embodiment of an electronic device according to the present application;

FIG. 2 is a schematic structural diagram of an embodiment of a housing of an electronic device of the present application;

FIG. 3 is a schematic diagram of a substrate in an embodiment of a housing of an electronic device of the present application;

FIG. 4 is a schematic diagram of a path of light incident on a liquid crystal layer in an embodiment of a housing of an electronic device of the present application;

FIG. 5 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 6 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 7 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 8 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 9 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 10 is a schematic structural diagram of a light-shielding layer in an embodiment of a housing of an electronic device according to the present application;

fig. 11 is a structural diagram of a housing of an electronic device in the related art;

FIG. 12 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 13 is a schematic structural diagram of yet another embodiment of a housing for an electronic device of the present application;

fig. 14 is another structural schematic diagram of a housing of an electronic apparatus in the related art;

FIG. 15 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 16 is a schematic structural diagram of yet another embodiment of a housing for an electronic device of the present application;

FIG. 17 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 18 is a schematic structural diagram of yet another embodiment of a housing for an electronic device of the present application;

fig. 19 is a schematic view showing still another structure of a housing of an electronic apparatus in the related art;

FIG. 20 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 21 is a schematic structural diagram of another embodiment of a housing of an electronic device of the present application;

FIG. 22 is a schematic flow chart diagram illustrating an embodiment of a method for fabricating a housing of an electronic device according to the present application;

fig. 23 is a flowchart of step S20 in fig. 22;

fig. 24 is a flowchart of step S23 in fig. 23;

FIG. 25 is a schematic flow chart diagram illustrating a method of fabricating a housing for an electronic device according to another embodiment of the present application;

fig. 26 is a partial flow chart illustrating a method for manufacturing a housing of an electronic device according to still another embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Referring to fig. 1, in an embodiment, an electronic device includes a housing 10 and a functional device 20. The housing 10 defines an accommodating space 11, the functional device 20 is disposed in the accommodating space 11, and the housing 10 can protect the functional device 20 (e.g., a motherboard, a battery, etc.).

Specifically, the electronic device may be a mobile phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, and the like, which is not limited herein.

Referring to fig. 2, in one embodiment, the housing 10 may include a substrate 12 and a liquid crystal layer 13, wherein the liquid crystal layer 13 may be disposed on one side of the substrate 12.

The material of the substrate 12 may be glass, plastic, or the like. In the present embodiment, the material of the substrate 12 may be a composite plate of Polycarbonate (PC) and polymethyl methacrylate (PMMA), specifically, a composite plate made by co-extruding PC and PMMA particles, as shown in fig. 3, the substrate 12 may include a PC layer 121 and a PMMA layer 122. In some application scenarios, the substrate 12 may be made of a material with a certain color according to actual requirements.

Further, the thickness of the substrate 12 may be 0.5mm or 0.64mm, so as to meet the requirement of electronic equipment for being light and thin. The thickness of the PMMA layer 122 can be 40-55 μm, and the PMMA layer 122 with the thickness enables the substrate 12 and the protective layer 17 to be matched with each other to meet the wear-resistant requirement of the housing 10, and at the same time, the probability of cracking during the high-pressure molding process of the substrate 12 and under the conditions of electronic equipment falling and the like can be reduced. Specifically, the thickness of the PMMA layer 122 may be 40 μm, 45 μm, 50 μm, 55 μm, etc., and is not particularly limited herein.

The liquid crystal layer 13 includes liquid crystal, which may be cholesteric liquid crystal, and may specifically include polymerizable monomer, nematic liquid crystal, chiral compound, ultraviolet light absorber, photoinitiator, and the like.

The liquid crystal in the liquid crystal layer 13 in the present embodiment may include oriented liquid crystal, and incident light entering the liquid crystal layer 13 can be reflected by the oriented liquid crystal, thereby improving the brightness and glossiness of the housing 10; on the other hand, the oriented liquid crystal reflects light to make the reflected light show a certain color, and the incident light entering the liquid crystal layer 13 is reflected by the oriented liquid crystal to generate reflected light with different wavelengths according to the change of the incident angle of the incident light, so that when the observation angle of the user is different, the observed color of the liquid crystal layer 13 is red-shifted or blue-shifted according to the change of the observation angle, and the liquid crystal layer 13 has a dazzling effect.

Specifically, the above-described wavelength of the reflected light reflected by the aligned liquid crystal satisfies the following formula: λ is 2np sin θ, where λ is the wavelength of the reflected light, n is the average refractive index of the liquid crystal layer, p is the pitch of the aligned liquid crystal, and θ is the angle between the incident light and the surface of the liquid crystal layer 13, i.e., the complementary angle of the incident light, as shown in fig. 4. Wherein the aligned liquid crystals can be aligned according to the corresponding pitch p. As the angle of observation of the user changes, the angle of incidence of the incident light into the eye of the user changes, and θ changes, causing the wavelength λ of the reflected light to change accordingly, thereby changing the color of the reflected light.

Specifically, the thickness of the liquid crystal layer 13 may be 2-3 μm, such as 2 μm, 2.5 μm, 3 μm, and the like, and may be selected according to actual requirements.

In an application scenario, referring to fig. 5, an adhesive layer 19 may be further disposed between the liquid crystal layer 13 and the substrate 12, and the adhesive layer 19 may be a thin film, and the material may be polyethylene terephthalate (PET), Polyvinyl chloride (PVC), Thermoplastic polyurethane elastomer (TPU), and the like.

The liquid crystal layer 13 may be directly formed on the substrate 12 or the adhesive layer 19, or may be adhered to the substrate 12 or the adhesive layer 19 by an adhesive, specifically, an Ultraviolet (UV) curable resin may be used as the adhesive for adhesion, and of course, other adhesives may also be used, which is not limited herein.

In practical use, the liquid crystal layer 13 may be located on a side of the housing 10 facing the functional device 20 inside the electronic apparatus, and at this time, the substrate 12 and the adhesive layer 19 are made of materials with a certain light transmittance, so that external light can enter the liquid crystal layer 13 through the substrate 12; of course, the liquid crystal layer 13 may also be located on a side of the housing 10 away from the functional device 20 inside the electronic apparatus, and in this case, the material of the substrate 12 and the adhesive layer 19 may be a light-transmitting material, or a light-proof material, which may be specifically selected according to actual requirements.

Referring to fig. 6 and 7, in an embodiment, the housing 10 of the electronic device may further include a reflective layer 15, and the reflective layer 15 may be used to reflect incident light, so as to further improve the brightness of the housing 10, so that the housing 10 may present a high-brightness dazzling effect along with the change of the viewing angle of the user.

In this embodiment, the reflective layer 15 may be a metal film layer, may be made of at least one of indium and tin, and may have a thickness of 20 to 30nm, for example, 20nm, 25nm, 30nm, or the like. This kind of reflectivity of reflector layer 15 is strong, and it is effectual to brighten to make casing 10 can demonstrate the various effect of dazzling of more highlighting.

Of course, in other embodiments, the reflective layer 15 may also be an antireflection film, and the material may be ZrO₂、Nb₂O₅May be 40-80nm, such as 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, etc. The reflecting layer 15 has certain reflectivity and certain anti-reflection effect, so that different use requirements are met.

In an application scenario, referring to fig. 6, the reflective layer 15 may be disposed on a side of the liquid crystal layer 13 away from the substrate 12, and in practical use, the liquid crystal layer 13 and the reflective layer 15 may be disposed on a side of the substrate 12 facing an internal structure of the electronic device.

In another application scenario, referring to fig. 7, similar to the housing 10 corresponding to fig. 5, in the application scenario, the adhesive layer 19 is disposed on a side of the substrate 12 facing the liquid crystal layer 13, and the reflective layer 15 may be disposed between the liquid crystal layer 13 and the adhesive layer 19.

Further, referring to fig. 8 and 9, in an embodiment, the housing 10 of the electronic device may further include a texture layer 14, a light shielding layer 16, and a protection layer 17.

The texture layer 14 may be disposed between the liquid crystal layer 13 and the reflective layer 15, and has a texture pattern, so that the housing 10 can further exhibit a texture effect.

Specifically, the texture layer 14 may be made of UV curable glue, and the texture layer 14 may be formed by UV transfer printing or the like. It should be noted that if the texture layer 14 is too thin, the texture effect exhibited by the shell 10 is poor, and if the texture layer 14 is too thick, the texture layer 14 is more brittle, so that the adhesion is reduced, and the risk of cracking when the shell 10 is dropped is increased, and in view of these factors, the thickness of the texture layer 14 in the present embodiment may be 9 to 12 μm, and specifically, may be 9 μm, 10 μm, 11 μm, 12 μm, and the like.

The light shielding layer 16 may be disposed on a side of the reflective layer 15 away from the texture layer 14, and may include at least one ink layer, specifically, as shown in fig. 10, the light shielding layer 16 may include three white ink layers 161 and two gray ink layers 162 sequentially arranged along a direction away from the reflective layer 15, or may further include three black ink layers and two gray ink layers sequentially arranged along a direction away from the reflective layer 15, which is not specifically limited herein. Wherein, the grey printing ink layer can play the effect of shading and drawing of patterns.

Wherein, each ink layer can be formed by printing, and the thickness of each ink layer can be 5-8 μm, such as 5 μm, 6 μm, 7 μm, 8 μm, etc., and the total thickness of the light shielding layer 16 can be 25-40 μm, such as 25 μm, 30 μm, 35 μm, 40 μm, etc. Note that compared to the method of forming the light-shielding layer 16 by one-time printing, the ink layer formed in this embodiment is thin, has strong adhesion, and is less brittle, and thus the stability of the housing 10 can be improved.

The protective layer 17 may be formed by curtain coating a hardening liquid, and specifically, a hardening liquid of a UV system may be curtain coated. In the present embodiment, the thickness of the protective layer 17 may be 6 to 9 μm, such as 6 μm, 7 μm, 8 μm, 9 μm, and the like, the protective layer 17 can satisfy the requirements of wear resistance and scratch resistance, and the hardness of the case 10 of the electronic device satisfies not less than the pencil hardness 3H (1000 gf).

In one application scenario, referring to fig. 8, the protection layer 17 may be disposed on a side of the substrate 12 away from the liquid crystal layer 13. In actual use, the liquid crystal layer 13, the texture layer 14, the reflective layer 15, and the light-shielding layer 16 may be disposed on a side of the substrate 12 facing the internal structure of the electronic device, and the protective layer 17 may be disposed on a side of the substrate 12 facing away from the internal structure of the electronic device.

In another application scenario, referring to fig. 9, similar to the housing 10 corresponding to fig. 7, in the application scenario, the adhesive layer 19 is disposed on a side of the substrate 12 of the housing 10 facing the liquid crystal layer 13, the light shielding layer 16 is disposed between the reflective layer 15 and the adhesive layer 19, and the protective layer 17 may be disposed on a side of the liquid crystal layer 13 away from the substrate 12. In actual use, the base 12 side faces the internal structure of the electronic device, and the protective layer 17 side is disposed away from the internal structure of the electronic device.

In addition, in the embodiment, the protection layer 17 may also have a certain light transmittance, so that external light can enter other structural layers through the protection layer 17.

It should be noted that, in the related art, the housing 10 may not include the liquid crystal layer 13, as shown in fig. 11.

In one application scenario, the surface gloss of the case a in the embodiment corresponding to fig. 8 and the gloss of the case B corresponding to fig. 11 were respectively tested by a german BYK micro-tri-angle gloss meter, wherein the case B has the same structure as the case a except that it does not have the liquid crystal layer 13, and the test results are shown in table 1 below:

TABLE 1 gloss measurement results (I)

As can be seen from table 1 above, the case a having the liquid crystal layer 13 in the present embodiment has higher glossiness than the case B not having the liquid crystal layer 13 in the related art, so as to further illustrate that the arrangement of the liquid crystal layer 13 in the present embodiment can improve the brightness and glossiness of the case 10.

Further, in some embodiments, the housing 10 may further include a color layer, which may be formed by spraying, silk-screening, printing, offset printing, and the like. The color presented by the color layer may be selected according to actual requirements, which is not limited herein.

Specifically, referring to fig. 12 and 13, in one embodiment, the color layer 18 may be disposed between the liquid crystal layer 13 and the texture layer 14, and the thickness may be 9-13 μm, such as 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, and the like.

In the present embodiment, the color layer 18 is provided to overlap the color of the color layer 18 with the color of the liquid crystal layer 13 and the color changing effect with the angle, so that the color presented by the housing 10 can be richer.

It should be noted that, in an application scenario, as shown in fig. 12, the liquid crystal layer 13, the color layer 18, the texture layer 14, the reflective layer 15 and the light shielding layer 16 are sequentially disposed on the side of the substrate 12 away from the protective layer 17 in a direction away from the substrate 12.

In another application scenario, as shown in fig. 13, a light shielding layer 16, a reflective layer 15, a texture layer 14, a color layer 18, a liquid crystal layer 13, and a protective layer 17 are sequentially disposed on a side of the lamination layer 19 away from the substrate 12 along a direction away from the substrate 13.

In addition, other structures of the housing 10 in this embodiment, such as the substrate 12, the liquid crystal layer 13, the texture layer 14, the reflective layer 15, the light shielding layer 16, the protective layer 17 and the adhesive layer 19, may be the same as those in the above embodiment, and details thereof are please review the above embodiment, which is not repeated herein.

It should be noted that, in the related art, the housing 10 may not include the liquid crystal layer 13, as shown in fig. 14.

In one application scenario, the surface gloss of the case C in the embodiment corresponding to fig. 12 and the gloss of the case D corresponding to fig. 14 were respectively tested by a german BYK micro-tri-angle gloss meter, wherein the case D has the same structure as the case C except that it does not have the liquid crystal layer 13, and the test results are shown in the following table 2:

TABLE 2 gloss measurement results (II)

As can be seen from table 2 above, the case C having the liquid crystal layer 13 in the present embodiment has higher glossiness than the case D having no liquid crystal layer 13 in the related art, so that the arrangement of the liquid crystal layer 13 in the present embodiment can improve the brightness and glossiness of the case 10.

Of course, in other embodiments, the housing 10 may not include the texture layer 14, the light shielding layer 15, and the protective layer 17 in the above embodiments, for example, the housing structure in fig. 15 and 16, in fig. 15, the color layer 18 is provided between the liquid crystal layer 13 and the reflective layer 15, the housing 10 in fig. 16 further includes the adhesive layer 19 provided on the substrate 12 side, and similarly, the color layer 18 is provided between the liquid crystal layer 13 and the reflective layer 15.

Referring to fig. 17 and 18, in another embodiment, the color layer 18 may be disposed on a side of the reflective layer 15 away from the texture layer 14 and between the reflective layer 15 and the light shielding layer 16, and the thickness may be 9-13 μm, such as 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, and the like.

Note that the reflective layer 15 in this embodiment may be different from that in the above embodiments, and specifically may be an antireflection film, and the material may be ZrO₂、Nb₂O₅May be 40-80nm, such as 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, etc.

In this embodiment, the reflective layer 15 is an antireflection film, the color layer 18 is located on a side of the reflective film away from the substrate 12, and light entering the color layer 18 sequentially passes through the reflective film, the texture layer 14, the liquid crystal layer 13, the substrate 12 and the protective layer 17 and then enters eyes of a user, so that the color presented by the shell 10 is more bright and transparent; further, the color layer 18 cooperates with the liquid crystal layer 13 and the reflection layer 15 to reflect light, so that the housing 10 can be more bright, transparent and high-bright.

In an application scenario of the present embodiment, referring to fig. 17, a liquid crystal layer 13, a texture layer 14, a reflective layer 15, a color layer 18, and a light-shielding layer 16 are sequentially disposed on a side of the substrate 12 away from the protective layer 17 along a direction away from the substrate 12.

In another application scenario, as shown in fig. 18, a light shielding layer 16, a color layer 18, a reflective layer 15, a texture layer 14, a liquid crystal layer 13, and a protective layer 17 are sequentially disposed on a side of the lamination layer 19 away from the substrate 12 in a direction away from the substrate 12.

In addition, other structures of the housing 10 in this embodiment, such as the substrate 12, the liquid crystal layer 13, the texture layer 14, the reflective layer 15, the light shielding layer 16, the protective layer 17 and the adhesive layer 19, may be the same as those in the above embodiments, and details thereof are omitted herein for brevity.

It should be noted that, in the related art, the housing 10 may not include the liquid crystal layer 13, as described above, with reference to fig. 19.

In one application scenario, the surface gloss of the case E in the embodiment corresponding to fig. 17 and the gloss of the cases F and G corresponding to fig. 19 were respectively tested by a german BYK micro three-angle gloss meter, wherein the case F is the same as the case E except that the case F does not have the liquid crystal layer 13, the case G does not have the liquid crystal layer 13, the thickness of the reflective layer 15 is 280nm, and the other structures are the same as the case E, and the test results are shown in the following table 3:

table 3 gloss test results (iii)

As can be seen from table 3 above, the case E having the liquid crystal layer 13 in the present embodiment has significantly higher glossiness than the case F of the related art having no liquid crystal layer 13 and having the same structure as the case E in the present embodiment; in addition, the thickness of the reflective layer 15 of the case E in the present embodiment satisfies 40 to 80nm, and the same effect of glossiness as that of the case G having the thickness of 280nm of the reflective layer 15 in the related art can be achieved, so that it can be illustrated that the provision of the liquid crystal layer in the present embodiment can improve the brightness and glossiness of the case 10.

Of course, in other embodiments, the housing 10 may not include the texture layer 14, the light-shielding layer 15, and the protective layer 17 in the above embodiments. Referring to fig. 20 and 21, respectively, in fig. 20, the color layer 18 is disposed on a side of the reflective layer 15 away from the liquid crystal layer 13, the housing 10 in fig. 21 further includes an adhesive layer 19 disposed on a side of the substrate 12, and similarly, the color layer 18 is disposed on a side of the reflective layer 15 away from the liquid crystal layer 13.

For the housing 10 of the electronic device including the adhesive layer 19 in the above embodiments, the structural layers may be formed on the adhesive layer 19 to form a membrane structure, and then the base 12 is injection molded on the membrane structure by using a method such as in-mold injection molding. Of course, the material may be formed in other ways, and is not limited in particular.

The application also provides a manufacturing method of the shell of the electronic equipment. Referring to fig. 22, in an embodiment, a method for manufacturing a housing of an electronic device may include:

step S10: providing a substrate; and

step S20: forming a liquid crystal layer on the substrate;

it should be noted that the liquid crystal layer in this embodiment includes oriented liquid crystal, and incident light entering the liquid crystal layer can be reflected by the oriented liquid crystal, so as to improve the brightness and glossiness of the housing; on the other hand, the oriented liquid crystal can reflect light to enable the reflected light to present a certain color, and the incident light entering the liquid crystal layer is reflected by the oriented liquid crystal to generate reflected light with different wavelengths along with the change of the incident angle of the incident light, so that when the observation angles of users are different, the observed color presented by the shell can generate red shift or blue shift along with the change of the observation angles, and a colorful effect is generated.

As described above, the aligned liquid crystal can exhibit a dominant color under irradiation of light, and a color change phenomenon occurs according to a change in an observation angle. Note that the liquid crystal layer may be formed by selecting different types of liquid crystals depending on a desired main color.

Specifically, the liquid crystal layer may be formed on the substrate in various ways according to actual requirements. For example, the alignment agent may be coated on the substrate first, and then the liquid crystal may be further coated on the alignment agent, or other means may be used, which is not particularly limited herein.

Referring to fig. 23, in one embodiment, the step S20 of forming the liquid crystal layer on the substrate may include:

step S21: providing a bearing film;

the material of the carrier film may be a polymer material, such as PET.

Step S22: coating a liquid crystal orientation agent and liquid crystal on the bearing film in sequence to form oriented liquid crystal; and

wherein, the orientation agent can be polyvinyl alcohol orientation agent, and the coating thickness can be less than 1 μm. The composition of the liquid crystal can be selected and determined according to the desired color to be presented, and the like, and is not particularly limited herein.

Step S23: transferring the aligned liquid crystal to a substrate to form a liquid crystal layer, wherein the liquid crystal layer is adhered to the substrate through an adhesive layer.

The material of the adhesive layer may be a UV curable resin, and the thickness may be 4 to 6 μm, specifically, 4 μm, 5 μm, 6 μm, and the like, which is not limited herein.

Referring to fig. 24, step S23 may include:

step S231: coating ultraviolet curing resin between the oriented liquid crystal and the matrix by a roll coater;

specifically, a UV curable resin bath may be provided, and a UV curable resin may be scraped onto the liquid crystal on the carrier film by a doctor blade, and the liquid crystal may be coated on the substrate by a roll coater.

Step S232: carrying out ultraviolet light irradiation on the ultraviolet curing resin subjected to roller coating, so that the ultraviolet curing resin is cured to form a bonding layer, and bonding the oriented liquid crystal on a substrate to form a liquid crystal layer; and

in the embodiment, the UV curing resin can be irradiated by a mercury lamp, and the curing energy can be 100-1000 mj/cm². Of course, the irradiation may be performed in other manners, and is not particularly limited herein.

Step S233: and removing the carrier film.

After the liquid crystal layer is formed on the substrate, the carrier film is directly removed.

Further, referring to fig. 25, the method for manufacturing the housing of the electronic device may further include:

step S30: forming a reflecting layer on one side of the liquid crystal layer far away from the substrate;

in this embodiment, the reflective layer may be a metal film layer, and may be formed by magnetron sputtering, evaporation plating, or the like, and may be made of at least one of indium and tin, and may have a thickness of 20 to 30nm, for example, 20nm, 25nm, 30nm, or may be an antireflection film, and may be made of ZrO₂、Nb₂O₅May be 40-80nm, such as 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, etc. The reflective layer can be used for reflecting light incident through the substrate and the liquid crystal layer.

Further, referring to fig. 26, in an embodiment, the method for manufacturing the housing of the electronic device may further include, in addition to the steps S10, S20, and S30:

step S40: forming a texture layer on one side of the liquid crystal layer far away from the substrate;

the texture layer can be formed by adopting UV glue, and particularly can be formed by a UV transfer printing mode.

Specifically, a UV glue may be coated on the texture template, then one side of the substrate on which the liquid crystal layer is formed is attached to the mother substrate, after extrusion and attachment, curing is performed by irradiation of an ultraviolet lamp, specifically, curing may be performed by using a Light Emitting Diode (LED), if necessary, a mercury lamp may be added for secondary curing, and after curing, the mother substrate and the substrate are further separated, so that the UV glue with texture is retained on the liquid crystal layer of the substrate, thereby forming the texture layer with texture patterns.

Step S50: forming a light shielding layer on one side of the reflecting layer far away from the base body;

in this embodiment, three white ink layers and two gray ink layers, or three black ink layers and two gray ink layers, may be sequentially formed on one side of the reflective layer, which is far away from the substrate, along a direction far away from the substrate in a printing manner, where no specific limitation is made.

Step S60: after the light shielding layer is formed, carrying out three-dimensional forming treatment on the base body so as to enable the base body to have a preset three-dimensional shape;

wherein, can adopt high pressure forming equipment to carry out 3D high pressure forming to the base member to make the base member have predetermined radian.

Specifically, when the substrate is subjected to three-dimensional forming treatment, the infrared heating temperature of the high-pressure forming equipment can be 380 ℃, the heating time can be 36s +/-15 s, the air pressure can be 65kg +/-10 kg, the lower die temperature on the PC layer side of the substrate can be 130-140 ℃, the upper die temperature can be 110-120 ℃, the preforming time can be 10-20 s, the blowing-up time can be 5-10 s, and the pressure maintaining time can be 10-20 s. In the actual operation process, the parameters can be adjusted according to requirements.

Step S70: forming a protective layer on one side of the substrate far away from the liquid crystal layer; and

after the substrate is subjected to three-dimensional forming treatment, the protective layer can be formed on the side of the substrate far away from the liquid crystal layer by spraying the hardening liquid.

The hardening liquid can be a UV system hardening liquid, after a protective layer is formed, the surface hardness of the obtained shell is not lower than the pencil hardness of 3H, and the shell can play a role in resisting abrasion and scratches.

Step S80: and carrying out finish machining treatment on the base body to obtain the shell of the electronic device with preset size.

After the protective layer is formed, the substrate may be subjected to finish machining by using a numerical control machine, and the finish machining may be specifically performed according to the requirements of the shape, the size, and the like of the housing of each electronic device, so as to obtain the housing of the electronic device.

Further, in an embodiment, a color layer may be formed during the process of manufacturing the housing of the electronic device.

Specifically, in another embodiment, compared with the foregoing embodiment of the method for manufacturing a housing of an electronic device, the method for manufacturing a housing of an electronic device is different in that before step S40, the method for manufacturing a housing of an electronic device may further include: and forming a color layer on the side of the liquid crystal layer far away from the substrate.

The color layer can be formed by spraying, silk-screen printing, offset printing and other processes. The color presented by the color layer may be selected according to actual requirements, which is not limited herein.

The reflective layer in this embodiment is a metal film layer made of at least one of indium and tin, and has a thickness of 20 to 30nm, for example, 20nm, 25nm, 30 nm. This kind of reflectivity is strong, and the blast is effectual to make the casing can demonstrate the various effect of dazzling of brighter.

In another embodiment, compared with the foregoing embodiment of the method for manufacturing a housing of an electronic device without a color layer, the method for manufacturing a housing of an electronic device is different in that after step S30, the method for manufacturing a housing of an electronic device may further include: and forming a color layer on the side of the reflecting layer far away from the liquid crystal layer.

The color layer in this embodiment may be the same as the color layer in the previous embodiment.

The present embodiment is also different in that the reflective layer may be an antireflection film, and the thickness of the reflective layer may be 40 to 80nm, for example, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, and the like, and is not particularly limited herein.

In the above embodiment, the order of the steps is not limited, and in actual application, the steps can be made in an appropriate order according to the requirements such as the product structure.

It should be noted that the method for manufacturing the housing of the electronic device in the present application can be used to manufacture the housing of the electronic device in the embodiments of the housing of the electronic device that does not include the adhesive layer, and the position, material, size, function, and the like of the structures of the layers involved in the manufacturing method can be the same as those in the embodiments of the housing of the electronic device in the present application, and the details refer to the embodiments, and are not repeated herein.

The above embodiments are merely examples and are not intended to limit the scope of the present disclosure, and all modifications, equivalents, and flow charts using the contents of the specification and drawings of the present disclosure or those directly or indirectly applied to other related technical fields are intended to be included in the scope of the present disclosure.

Claims

1. A housing for an electronic device, comprising:

a substrate; and

the liquid crystal layer is arranged on the substrate and comprises oriented liquid crystal, so that incident light entering the liquid crystal layer can be reflected out through the liquid crystal, and the wavelength of the reflected light is changed along with the change of the incident angle of the incident light.

2. A casing for an electronic device according to claim 1, wherein the wavelength of the reflected light satisfies: λ ═ 2np sin θ, where λ is the wavelength of the reflected light, n is the average refractive index of the liquid crystal layer, p is the pitch of the aligned liquid crystal, and θ is the complement of the incident angle of the incident light.

3. The electronic device housing of claim 1, further comprising:

the reflecting layer is arranged on one side of the liquid crystal layer far away from the substrate or one side of the liquid crystal layer facing the substrate and is used for reflecting incident light;

when the reflecting layer is arranged on one side of the liquid crystal layer, which faces the base body, the shell further comprises a laminating layer arranged on one side of the base body, which faces the reflecting layer.

4. The casing of the electronic device according to claim 3, wherein the reflective layer is a metal film layer made of at least one of indium and tin, and the thickness of the reflective layer is 20-30 nm.

5. The electronic device housing of claim 4, further comprising:

and the color layer is arranged between the liquid crystal layer and the reflecting layer, and the thickness of the color layer is 9-13 mu m.

6. The electronic device housing of claim 3, further comprising:

the color layer is arranged on one side of the reflecting layer, which is far away from the liquid crystal layer, and the thickness of the color layer is 9-13 mu m;

wherein the reflecting layer is an antireflection film and is made of ZrO₂、Nb₂O₅The thickness of the reflecting layer is 40-80 nm.

7. The electronic device housing of claim 3, further comprising:

the texture layer is arranged between the liquid crystal layer and the reflecting layer and is provided with texture patterns;

the shading layer is arranged on one side of the reflecting layer, which is far away from the texture layer, and comprises at least one ink layer; and

the protective layer is arranged on one side of the substrate far away from the liquid crystal layer when the reflecting layer is arranged on one side of the liquid crystal layer far away from the substrate; when the reflecting layer is arranged on one side of the liquid crystal layer, which faces the base body, the protective layer is arranged on one side of the liquid crystal layer, which is far away from the base body.

8. The casing of the electronic device according to claim 7, wherein the thickness of the texture layer is 9-12 μm, and the texture layer is made of an ultraviolet light curing adhesive;

the shading layer comprises three white ink layers and two gray ink layers which are sequentially arranged along the direction far away from the reflecting layer, the thickness of each ink layer is 5-8 mu m, and the thickness of the shading layer is 25-40 mu m;

the thickness of the protective layer is 6-9 μm, and the hardness of the shell is not less than 3H of pencil hardness.

9. The electronic device case of claim 1, wherein the liquid crystal is a cholesteric liquid crystal comprising a polymerizable monomer, a nematic liquid crystal, a chiral compound, an ultraviolet light absorber, a photoinitiator, and the liquid crystal layer has a thickness of 2-3 μ ι η;

the material of the substrate is a composite plate of polycarbonate and polymethyl methacrylate, the composite plate comprises a polycarbonate layer and a polymethyl methacrylate layer, the thickness of the substrate is 0.5mm or 0.64mm, and the thickness of the polymethyl methacrylate layer is 40-55 μm.

10. A method for manufacturing a shell of an electronic device, comprising:

providing a substrate; and

and forming a liquid crystal layer on the substrate, wherein the liquid crystal layer comprises liquid crystal which is oriented so that incident light entering the liquid crystal layer can be reflected by the liquid crystal, and the wavelength of the reflected light is changed along with the change of the incident angle of the incident light.

11. The manufacturing method according to claim 10, wherein the step of forming a liquid crystal layer on the substrate includes:

providing a bearing film;

coating a liquid crystal aligning agent and liquid crystal on the bearing film in sequence to form the aligned liquid crystal on the bearing film; and

transferring the aligned liquid crystal onto the substrate to form the liquid crystal layer, wherein the liquid crystal layer is adhered to the substrate by an adhesive layer.

12. The manufacturing method of claim 11, wherein the material of the carrier film is polyethylene terephthalate, and the material of the bonding layer is ultraviolet curable resin;

a step of transferring the aligned liquid crystal onto the substrate and adhering it to the substrate through an adhesive layer to form the liquid crystal layer, comprising:

roll-coating an ultraviolet curable resin between the oriented liquid crystal and the substrate using a roll coater;

irradiating the ultraviolet curing resin subjected to roller coating with ultraviolet light, so that the ultraviolet curing resin is cured to form the bonding layer, and the oriented liquid crystal is bonded on the substrate to form the liquid crystal layer; and

and removing the carrier film.

13. The method of manufacturing according to claim 10, further comprising:

and forming a reflecting layer on one side of the liquid crystal layer far away from the substrate, wherein the reflecting layer is used for reflecting incident light.

14. The method according to claim 13, wherein the reflective layer is a metal film made of at least one of indium and tin, and has a thickness of 20-30 nm.

15. The manufacturing method according to claim 14, wherein before the step of forming a reflective layer on a side of the liquid crystal layer away from the substrate, the manufacturing method further comprises:

and forming a color layer on one side of the liquid crystal layer, which is far away from the substrate, wherein the thickness of the color layer is 9-13 μm.

16. The manufacturing method according to claim 13, wherein after the step of forming a reflective layer on a side of the liquid crystal layer remote from the substrate, the manufacturing method further comprises:

forming a color layer on one side of the reflecting layer far away from the base body, wherein the thickness of the color layer is 9-13 μm;

the reflection layer is an antireflection film, and the thickness of the reflection layer is 40-80 nm.

17. The method of manufacturing according to claim 15 or 16, further comprising:

performing three-dimensional forming treatment on the substrate to enable the substrate to have a preset three-dimensional shape; and

and carrying out finish machining treatment on the substrate to obtain the shell of the electronic equipment with preset size.

18. An electronic device, comprising:

a housing defining an accommodating space;

the functional device is accommodated in the accommodating space;

wherein the housing is a housing of an electronic device according to any of claims 1-9.