CN114885552B

CN114885552B - Electronic device, housing and preparation method thereof

Info

Publication number: CN114885552B
Application number: CN202210618215.4A
Authority: CN
Inventors: 于宗强; 吉斌
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2023-10-10
Anticipated expiration: 2042-05-31
Also published as: CN114885552A

Abstract

The application discloses an electronic device, a shell and a preparation method thereof. The shell comprises a substrate and a pattern layer, wherein the pattern layer is arranged on one side of the substrate and covers part of the surface of the substrate, the pattern layer is provided with logo patterns, and the pattern layer comprises an adhesive layer, a first dispersion composite layer and a first UV texture layer. The bonding layer is bonded with the substrate, the first dispersion composite layer is arranged on one side, far away from the substrate, of the bonding layer and is used for dispersing composite light rays, and the first UV texture layer is arranged on one side, far away from the bonding layer, of the first dispersion composite layer. Through the mode, the shell can achieve the colorful visual effect through the first dispersion composite layer, and the appearance expressive force is improved.

Description

Electronic device, housing and preparation method thereof

Technical Field

The application relates to the technical field of electronic equipment shell manufacturing processes, in particular to electronic equipment, a shell and a manufacturing method thereof.

Background

Currently, a logo (abbreviation generally refers to trademark and logo) is usually required to be manufactured on a housing (such as a mobile phone back cover) of an electronic device, the logo represents a brand and a value of the electronic product, the logo manufactured on the housing of the electronic device is usually required to have higher brightness, vivid effect and the like, so as to improve the appearance expressive force of the electronic product and increase the identification degree of the electronic device.

However, the housing appearance of the current electronic devices is relatively limited, and there is still a need for improvement.

Disclosure of Invention

The application mainly solves the technical problem of providing the electronic equipment, the shell and the preparation method thereof, and can improve the expressive force of the electronic equipment.

In order to solve the technical problems, the application adopts a technical scheme that: the utility model provides a casing, including basement and pattern layer, the pattern layer is located one side of basement, and cover the partial surface of basement, the pattern layer has logo pattern, the pattern layer includes:

an adhesive layer adhered to the substrate;

the first dispersion composite layer is arranged on one side of the bonding layer, which is far away from the substrate, and is used for generating dispersion for the composite light;

the first UV texture layer is arranged on one side, far away from the bonding layer, of the first dispersion composite layer.

In order to solve the technical problems, the application adopts another technical scheme that: provided is a method of manufacturing a case, including;

providing a substrate and a base;

transferring a first UV texture layer on the substrate;

plating a first dispersion composite layer on the first UV texture layer, wherein the first dispersion composite layer is used for generating dispersion for composite light rays;

printing an adhesive layer on the first dispersive composite layer;

cutting all the materials into logo patterns;

and removing the substrate to obtain a pattern layer, and adhering the adhesive layer of the pattern layer to the base.

In order to solve the technical problems, the application adopts another technical scheme that: the application provides electronic equipment, which comprises a display screen module, a control circuit board and a shell, wherein the display screen module and the shell are matched to form a containing space, and the control circuit board is arranged in the containing space and is electrically connected with the display screen module.

The beneficial effects of the application are as follows: the housing of the present application includes a substrate and a pattern layer, unlike the case of the related art. The pattern layer is provided with logo patterns, and comprises an adhesive layer, a first dispersion composite layer and a first UV texture layer. The first dispersion composite layer is arranged on one side, far away from the substrate, of the bonding layer, the bonding layer is used for bonding, and the first UV texture layer is arranged on one side, far away from the bonding layer, of the first dispersion composite layer. The first dispersion composite layer can disperse the composite light, so that the light can produce a colorful effect through the first dispersion composite layer, and meanwhile, the texture of the first UV texture layer can also improve the aesthetic feeling of the appearance of the pattern layer, and the appearance expressive force of the shell is improved.

Drawings

FIG. 1 is a schematic diagram of an embodiment of an electronic device of the present application;

FIG. 2 is a schematic cross-sectional view of the electronic device at A-A of the embodiment of FIG. 1;

FIG. 3 is a block diagram illustrating the structural components of an embodiment of the electronic device of the present application;

FIG. 4 is an enlarged view of the structure of region I of the embodiment of FIG. 2;

FIG. 5 is a schematic view of a first dispersion composite layer according to an embodiment of the housing of the present application;

FIG. 6 is a schematic view of a first dispersion composite layer according to another embodiment of the housing of the present application;

FIG. 7 is a schematic view of another embodiment of the housing of the present application;

FIG. 8 is a schematic diagram of a second dispersion composite layer in the embodiment of the housing of FIG. 7;

FIG. 9 is a schematic flow chart of an embodiment of a method for manufacturing a housing according to the present application;

fig. 10 is a schematic flow chart of another embodiment of a method for manufacturing an electronic device according to the present application.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, a device configured to receive/transmit communication signals via a wireline connection, such as via a public-switched telephone network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface, such as for example, for a cellular network, a Wireless Local Area Network (WLAN), a digital television network, such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal. A communication terminal configured to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal", or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellites or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; a PDA that can include a radiotelephone, pager, internet/intranet access, web browser, organizer, calendar, and/or a Global Positioning System (GPS) receiver; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. The mobile phone is the electronic equipment provided with the cellular communication module.

Referring to fig. 1 and fig. 2 together, fig. 1 is a schematic structural diagram of an embodiment of an electronic device according to the present application, and fig. 2 is a schematic structural sectional view of the electronic device at A-A in the embodiment of fig. 1. The electronic device in the embodiment of the application can comprise a mobile phone, a tablet personal computer, a notebook computer, a wearable device and the like. The present embodiment is described with reference to a mobile phone as an example.

The electronic device in this embodiment may include a display module 30, a housing 10, and a control circuit board 20. Wherein the housing 10 is provided by the application.

Optionally, the display screen module 30 cooperates with the housing 10 to form a accommodating space 101, the control circuit board 20 is disposed in the accommodating space 101, the control circuit board 20 is electrically connected to the display screen module 30, and the control circuit board 20 is used for controlling the display screen module 30. The detailed technical features related to the structures of other parts of the electronic device are within the understanding scope of those skilled in the art, and will not be described herein.

Referring to fig. 3, fig. 3 is a schematic block diagram illustrating the structural components of an embodiment of the electronic device according to the present application, where the electronic device may be a mobile phone, a tablet computer, a notebook computer, a wearable device, etc., and the embodiment illustrates the mobile phone as an example. The structure of the electronic device may include an RF circuit 910, a memory 920, an input unit 930, a display unit 940 (which may be the display module 30 in the above embodiment), a sensor 950, an audio circuit 960, a wifi module 970, a processor 980 (which may be the control circuit board 20 in the above embodiment), a power source 990, and the like. Wherein, the RF circuit 910, the memory 920, the input unit 930, the display unit 940, the sensor 950, the audio circuit 960, and the wifi module 970 are respectively connected to the processor 980; the power supply 990 is used to supply power to the entire electronic device.

Specifically, RF circuitry 910 is used to send and receive signals; memory 920 is used to store data instruction information; the input unit 930 is used for inputting information, and may specifically include a touch panel 931 and other input devices 932 such as operation keys; the display unit 940 may include a display panel 941, etc.; the sensor 950 includes an infrared sensor, a laser sensor, etc., for detecting a user proximity signal, a distance signal, etc.; a speaker 961 and a microphone 962 are coupled to the processor 980 by an audio circuit 960 for receiving and transmitting audio signals; the wifi module 970 is configured to receive and transmit wifi signals, and the processor 980 is configured to process data information of the electronic device.

With respect to the housing 10 of the present application, reference is made to the following description of the housing embodiments.

As shown in fig. 2 and 4, fig. 4 is an enlarged view of the structure of region i in the embodiment shown in fig. 2.

In the present embodiment, the case 10 includes a substrate 100 and a pattern layer 200. The material of the substrate 100 is not particularly limited, and for example, the material of the substrate 100 may include at least one of Polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and Thermoplastic Polyurethane (TPU). Specifically, the substrate 100 may include a plurality of substrate sublayers (not shown) disposed in a stacked manner, for example, the substrate 100 may be a composite substrate formed by stacking polycarbonate and polymethyl methacrylate. Specifically, the thickness of the substrate 100 is not particularly limited, and for example, the thickness of the substrate 100 may be 0.05 to 0.8mm, for example, 0.09mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, or the like. According to an embodiment of the present application, the base 100 may be a composite substrate formed by laminating polycarbonate and polymethyl methacrylate, and the total thickness of the composite substrate may be 0.5 to 0.7mm (for example, may be 0.65 mm), wherein the thickness of the polycarbonate substrate sub-layer may be 0.5 to 0.6mm (for example, may be 0.55 mm), and the thickness of the polymethyl methacrylate substrate sub-layer may be 0.02 to 0.08mm (for example, may be 0.04 mm).

The substrate 100 may be used as a protective case of an electronic device, and the pattern layer 200 is disposed at one side of the substrate 100. The pattern layer 200 has logo patterns thereon, which can be used to display branding and value of electronic devices. logo patterns can be any shape such as characters, letters, images and the like.

Alternatively, the pattern layer 200 may be disposed on a side of the substrate 100 near the inside of the electronic device, covering a portion of the surface of the substrate 100, or may be disposed on a side of the substrate 100 near the outside of the electronic device. When the substrate 100 is disposed on a side near the inside of the electronic device, the substrate 100 is made of a light-transmitting material. In the present embodiment, the pattern layer 200 is disposed on a side of the substrate 100 close to the inside of the electronic device, i.e., a side close to the battery of the electronic device.

Since the pattern layer 200 has logo patterns, the pattern layer 200 is generally required to be provided in vivid colors in order to attract visual attention.

In this embodiment, the pattern layer 200 includes a first UV texture layer 210, a first dispersion composite layer 220, and an adhesive layer 230.

Specifically, the adhesive layer 230 has an adhesive property, and the adhesive layer 230 is disposed on a side of the first dispersion composite layer 220 close to the substrate 100 and is adhered to the substrate 100. The adhesive layer 230 is used to adhere the first dispersion composite layer 220 to the substrate 100.

The first dispersion composite layer 220 is disposed on the other side of the adhesive layer 230, and is fixed to the substrate 100 by the adhesive layer 230. In general, the projection area of the adhesive layer 230 on the substrate 100 is the same as the projection area of the first dispersive composite layer 220 on the substrate 100, and of course, the projection area of the adhesive layer 230 on the substrate 100 may be reduced appropriately.

The first dispersive composite layer 220 is capable of dispersing a composite light transmitted therethrough, wherein the composite light refers to a composite light composed of a plurality of monochromatic lights, such as white light and natural light.

When the composite light passes through the first dispersive composite layer 220, the composite light is dispersed into different monochromatic light or polychromatic light by the first dispersive composite layer 220, and the human eyes can see colorful patterns through the first dispersive composite layer 220. The first dispersive composite layer 220 brings a colorful appearance effect to the human eye, and improves the appearance expressive force of the pattern layer 200.

The first UV texture layer 210 is disposed on a side of the first dispersive composite layer 220 remote from the adhesive layer 230. The first UV texture layer 210 is textured to enhance the aesthetic feeling of the pattern layer 200.

The light reflected by the first UV texture layer 210 needs to be emitted from the pattern layer 200 after passing through the first dispersion composite layer 220, so that the colorful texture can be observed by combining the first UV texture layer 210 with the first dispersion composite layer 220 in the embodiment, and the appearance expressive force of the housing 10 is improved.

In this embodiment, the first dispersion composite layer 220 includes a plurality of dispersion layers stacked. Wherein adjacent two of the dispersive layers have different refractive indices.

Since the composite light includes a plurality of monochromatic lights, and different monochromatic lights have different frequencies, the different frequencies of lights have different refractive indexes corresponding to the single dispersion layer, and thus the composite light is dispersed into a plurality of colors of light when passing through the first dispersion composite layer 220. Meanwhile, two adjacent dispersion layers in the embodiment have different refractive indexes for light with the same frequency, so that light rays can be refracted for many times in the first dispersion composite layer 220, the dispersion effect of the first dispersion composite layer 220 is improved, and light emitted by the first dispersion composite layer 220 is more colorful.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a first dispersion composite layer in an embodiment of a housing according to the present application.

Specifically, in one embodiment of the present application, the first dispersion composite layer 220 includes a first SiO2 layer 221a, an In2O3 layer 222, a second SiO2 layer 221b, a SnO layer 223, and a third SiO2 layer 221c, which are sequentially stacked.

The first SiO2 layer 221a may be bonded to the bonding layer 230, or the third SiO2 layer 221c may be bonded to the bonding layer 230, and the order of each of the dispersion layers may be appropriately adjusted by those skilled in the art.

As the first dispersion composite layer 220 applied to the electronic device case, the total thickness of the first dispersion composite layer 220 is 50 to 150nm, that is, the thickness of the first SiO2 layer 221a, the In2O3 layer 222, the second SiO2 layer 221b, the SnO layer 223, and the third SiO2 layer 221c superimposed together is 50 to 150nm, and preferably, the total thickness of the first dispersion composite layer 220 is 80 to 120nm.

The thicknesses of the first SiO2 layer 221a, the second SiO2 layer 221b, and the third SiO2 layer 221c are 5 to 10nm, and may be, for example, 5nm, 6nm, 7nm, 8nm, 9nm, or 10nm. The thicknesses of the first SiO2 layer 221a, the second SiO2 layer 221b, and the third SiO2 layer 221c may be the same or different.

The thickness of the In2O3 layer 222 may be selected to be 20 to 50nm, for example, 23nm, 25nm, 28nm, 32nm, 35nm, 39nm, 41nm, 44nm, 48nm, 49nm.

The thickness of the SnO layer 223 may be selected from 5 to 15nm, for example, 6nm, 8nm, 9nm, 10nm, 12nm, 14nm.

In this embodiment, the first dispersive composite layer 220 includes a plurality of dispersive layers of metal oxide layers stacked in sequence, wherein adjacent dispersive layers have different refractive indexes for light of the same frequency, increasing the number of times of refraction of light, and improving the dispersion effect.

In other embodiments, one skilled in the art may add more dispersion layers based on the dispersion layers described above to enhance the appearance of the housing 10.

By the first dispersion composite layer 220 in the embodiment of fig. 5, a highlight silver effect can be observed, visual attention can be attracted in appearance, and the appearance expressive force of the casing 10 is improved.

Referring to fig. 6, fig. 6 is a schematic structural diagram of a first dispersion composite layer according to another embodiment of the housing of the present application.

In this embodiment, the first dispersion composite layer 220 includes a fourth SiO2 layer 221d, a first ZrO2 layer 224a, a first TiO2 layer 225a, a fifth SiO2 layer 221e, a second TiO2 layer 225b, a sixth SiO2 layer 221f, and a third TiO2 layer 225c, which are sequentially stacked.

The fourth SiO2 layer 221d may be bonded to the bonding layer 230, or the third TiO2 layer 225c may be bonded to the bonding layer 230, and the order of each of the dispersion layers may be appropriately adjusted by those skilled in the art.

As the first dispersion composite layer 220 applied to the electronic device case, the total thickness of the first dispersion composite layer 220 is 50 to 150nm, that is, the thickness of the fourth SiO2 layer 221d, the first ZrO2 layer 224a, the first TiO2 layer 225a, the fifth SiO2 layer 221e, the second TiO2 layer 225b, the sixth SiO2 layer 221f, and the third TiO2 layer 225c, which are stacked together, is 50 to 150nm, and preferably, the total thickness of the first dispersion composite layer 220 is 80 to 120nm.

The thickness of the fourth SiO2 layer 221d may be selected to be 3 to 5nm, for example, 3.1nm, 3.5nm, 3.9nm, 4.3nm, 4.5nm, and 4.8nm.

The thickness of the first ZrO2 layer 224a may be selected to be 3 to 16nm, for example, 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm, 16nm.

The thickness of the first TiO2 layer 225a may be selected to be 5 to 15nm, for example, 4nm, 5nm, 7nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm.

The thickness of the fifth SiO2 layer 221e may be selected to be 5 to 10nm, for example, 5nm, 6nm, 7nm, 8nm, 9nm, 10nm.

The thickness of the second TiO2 layer 225b may be selected to be 10 to 20nm, for example, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20nm.

The thickness of the sixth SiO2 layer 221f may be selected from 5 to 20nm, for example, 5nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20nm.

The thickness of the third TiO2 layer 225c may be selected to be 10 to 20nm, for example, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20nm.

In this embodiment, the first dispersive composite layer 220 also includes a plurality of dispersive layers of metal oxide layers stacked in sequence, wherein adjacent dispersive layers have different refractive indexes for light of the same frequency, increasing the number of refractive times of light, and improving the dispersion effect.

Through the first dispersion composite layer 220 in the embodiment of fig. 6, a colorful effect of multiple colors can be observed, visual attention can be attracted in appearance, and the appearance expressive force of the housing 10 is improved.

With continued reference to fig. 4-6, further, the pattern layer 200 in this embodiment may be separately prepared and then bonded to the substrate 100.

Specifically, a substrate may be coated with UV glue and a mold may be used to transfer texture to the UV glue to form the first UV texture layer 210. The substrate may be a substrate of PET material.

Alternatively, the viscosity of the UV glue forming the first UV texture layer 210 may be 300 to 800cps, for example 400cps, 500cps, 600cps, 700cps, 800cps.

Alternatively, the thickness of the UV glue layer coated on the substrate is 9-12 μm, which may be, for example, 9 μm, 9.5 μm, 10 μm, 11 μm, 12 μm.

After the UV glue is coated, the texture is stamped on the UV glue on the substrate by using a die, then the state that the die is attached to the UV glue layer is kept, the UV glue is cured by an ultraviolet lamp, the curing energy is about 500-1000 mJ/cm < 2 >, so that the UV glue is cured and molded, a first UV texture layer 210 is formed, and finally the die is removed.

After the mold is removed, a first dispersive composite layer 220 is prepared on the first UV texture layer 210.

The first dispersive composite layer 220 may be of the construction shown in fig. 5 or 6 described above. The method of preparing the first dispersion composite layer 220 may be a method using physical vapor deposition (Physical Vapor Deposition, PVD), such as a vacuum evaporation method, a vacuum ion method, a magnetron sputtering method, or the like.

For preparing the first dispersion composite layer 220 in the embodiment of fig. 5 and 6, a magnetron sputtering method may be preferably used for coating. Magnetron sputtering is one of the most commonly used methods for preparing thin films of metals and their oxides. For most materials, sputtering can be achieved as long as the target can be prepared. The thin film obtained by magnetron sputtering is well connected with the base material, and the thin film obtained by sputtering has high purity, good compactness and good film shape uniformity; the deposition rate is high, a large ion flow can be formed, and the yield is high; the sputtering process has good repeatability, a film with uniform thickness can be obtained on a large substrate, and different metals, alloys and oxides can be mixed and sputtered simultaneously.

After the first dispersion composite layer 220 is prepared, an adhesive layer 230 is formed on the first dispersion composite layer.

Alternatively, the adhesive layer 230 may be formed using a screen printing method. The UV pressure-sensitive adhesive water can be silk-screened, and the viscosity of the UV pressure-sensitive adhesive water is 800-2000 cps, such as 900cps, 1100cps, 1300cps, 1600cps, 1800cps and 1900cps. And (3) after screen printing, curing, wherein the energy required by curing is about 600-2000 mJ/cm < 2 >.

After the first UV texture layer 210, the first dispersion composite layer 220, and the adhesive layer 230 are prepared, CNC (Computer numerical control) is cut on the first UV texture layer 210, the first dispersion composite layer 220, and the adhesive layer 230 as a whole. CNC is also called as numerical control machine tool, which is an automatic machine tool equipped with a program control system and can process parts according to the programmed program. Therefore, the required logo pattern drawing is led into a computer to cut the material through CNC equipment, so that the pattern layer 200 with logo patterns can be obtained. Finally, the substrate is torn off, and the pattern layer 200 is obtained.

The above-mentioned method for forming the pattern layer is a possible method in the embodiment of the housing of the present application, and the pattern layer of the housing of the present application is not excluded from being formed by other methods.

Referring to fig. 7 and 8, fig. 7 is a schematic structural diagram of another embodiment of the housing of the present application, and fig. 8 is a schematic structural diagram of a second dispersion composite layer in the embodiment of the housing of fig. 7.

In comparison with the above embodiment, the housing 20 in this embodiment further includes the second UV texture layer 300, the second dispersion composite layer 400, the ink layer 500, and the outer texture layer 600 in addition to the substrate 100 and the pattern layer 200.

For the substrate 100 and the pattern layer 200, reference may be made to the description of the above embodiments, and the description is omitted here.

The second UV texture layer 300 is disposed on a side of the substrate 100 adjacent to the pattern layer 200, and covers an area of the substrate 100 not covered by the pattern layer 200.

It is also understood that the second UV-textured layer 300 is disposed at one side of the substrate 100, and the pattern layer 200 is filled in the second UV-textured layer 300 and adhered to the substrate 100.

Alternatively, the second UV texture layer 300 may entirely cover one side surface of the substrate 100, or may partially cover it.

Alternatively, the thickness of the second UV texture layer 300 is 9-15 μm, for example 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.3 μm, 12 μm, 13.5 μm, 14 μm, 14.5 μm.

The second UV texture layer 300 is also textured to enhance the aesthetic appeal of the housing 10. In addition, the second UV texture layer 300 can also play a certain role in fixing the pattern layer 200.

The second UV texture layer 300 may be formed by UV glue transfer. After the pattern layer 200 is bonded, UV glue is dispensed to a side of the substrate 100 near the pattern layer 200, then a corresponding mold is used to transfer texture to a side of the UV glue far from the substrate 100, and finally the second UV texture layer 300 is formed by curing.

The second dispersion composite layer 400 is disposed on a side of the second UV texture layer 300 away from the substrate 100.

The second dispersion composite layer 400 can disperse the composite light, and after the composite light passes through the second dispersion composite layer 400, the composite light is dispersed into light with multiple colors, so that the appearance effect of colorful is achieved, and the appearance expressive force of the shell 10 is improved.

The second dispersion composite layer 400 includes a plurality of dispersion layers stacked. Specifically, the second dispersion composite layer 400 may include a seventh SiO2 layer 410a, a second ZrO2 layer 420, a fourth TiO2 layer 430a, an eighth SiO2 layer 410b, a fifth TiO2 layer 430b, a ninth SiO2 layer 410c, and a sixth TiO2 layer 430c, which are stacked on one side. Either one of the seventh SiO2 layer 410a or the sixth TiO2 layer 430c may be connected to the second UV texture layer 300.

Alternatively, the total thickness of the second dispersion composite layer 400 is 150 to 400nm, preferably 200 to 300nm.

The thickness of the seventh SiO2 layer 410a may be selected to be 5 to 10nm, for example, 5nm, 6nm, 7nm, 8nm, 9nm, 10nm.

The thickness of the second ZrO2 layer 420 may be selected from 3 to 15nm, such as 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm

The thickness of the fourth TiO2 layer 430a may be selected to be 50 to 150nm, for example, 51nm, 55nm, 60nm, 65nm, 70nm, 78nm, 80nm, 90nm, 95nm, 100nm, 120nm, 130nm, 140nm, 145nm.

The thickness of the eighth SiO2 layer 410b may be selected to be 10 to 50nm, for example, 11nm, 15nm, 18nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, 48nm.

The thickness of the fifth TiO2 layer 430b may be selected to be 20 to 120nm, for example 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 115nm.

The thickness of the ninth SiO2 layer 410c may be selected to be 10 to 50nm, for example, 12nm, 18nm, 20nm, 25nm, 30nm, 40nm, 45nm, 48nm.

The thickness of the sixth TiO2 layer 430c may be selected to be 20 to 120nm, for example 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 115nm.

Thus, in the present embodiment, the second dispersion composite layer 400 also includes a plurality of dispersion layers of metal oxide layers stacked in order. The effect of the appearance of the flare can be observed through the second dispersion composite layer 400. The adjacent dispersion layers have different refractive indexes for light with the same frequency, so that the refractive times of light rays are increased, and the dispersion effect is improved.

Alternatively, each of the above-described second dispersion composite layers 400 may be manufactured by PVD method, such as magnetron sputtering.

In other embodiments, other dispersion layers may be added, or the order of the dispersion layers in this embodiment may be changed.

The ink layer 500 is disposed on a side of the second dispersive composite layer 400 remote from the second UV-texture layer 300.

Ink layer 500 may include a underlayment ink layer (not shown) and/or a fire-resistant ink layer (not shown).

The ink layer of the cover bottom can be black, grey or other colors, the thickness can be 5-10 mu m, and the ink layer can be formed by adopting a screen printing method.

The fire-proof ink layer has high temperature resistance, and in the case of using the bottom ink layer and the fire-proof ink layer simultaneously, the fire-proof ink layer is arranged on one side of the bottom ink layer far away from the second dispersion composite layer 400 and is used for contacting with elements such as a battery and a circuit of the electronic equipment, and the thickness of the fire-proof ink layer can be selected to be 5-20 μm. The fire-resistant ink layer may also be formed by screen printing.

The outer texture layer 600 is disposed on a side of the substrate 100 away from the pattern layer 200. The outer texture layer 600 has a certain texture, which can enhance the appearance of the case 10.

Therefore, in the above embodiment of the housing of the present application, the pattern layer 200 with logo patterns can provide the pattern layer 200 with a colorful and bright light representing effect due to the dispersion effect of the first dispersion composite layer 220 inside the pattern layer, so as to enhance the appearance expressive force of the pattern layer 200. Meanwhile, the second dispersion composite layer 400 on the housing 10 can also have a dispersion effect on light, further enhancing the appearance expressive force of the housing 10, and making the CMF diversification of the housing 10 possible.

In another aspect of the application, a method of making a housing is also provided.

Referring to fig. 9, fig. 9 is a flow chart of an embodiment of a method for manufacturing a shell according to the present application. The preparation method comprises the following steps:

s100: a substrate and a base are provided.

The substrate is used for preparing a pattern layer with logo patterns, and the base is used as a protective shell of electronic equipment.

The material of the substrate may include at least one of Polycarbonate (PC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), and Thermoplastic Polyurethane (TPU). In particular, the substrate may comprise a plurality of substrate sublayers arranged in a stack, for example the substrate may be a composite substrate formed by stacking polycarbonate and polymethyl methacrylate. Specifically, the thickness of the substrate is not particularly limited, and for example, the thickness of the substrate may be 0.05 to 0.8mm, for example, 0.09mm, 0.1mm, 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, or the like. According to a specific embodiment of the present application, the base may be a composite substrate formed by laminating polycarbonate and polymethyl methacrylate, and the total thickness of the composite substrate may be 0.5 to 0.7mm (for example, may be 0.65 mm), wherein the thickness of the polycarbonate substrate sub-layer may be 0.5 to 0.6mm (for example, may be 0.55 mm), and the thickness of the polymethyl methacrylate substrate sub-layer may be 0.02 to 0.08mm (for example, may be 0.04 mm).

The substrate can be a PET material substrate, the embodiment adopts a PET release film, the thickness of the substrate can be selected to be 40-60 mu m, and the release force g of the PET release film is 25-40 g.

S200: a first UV texture layer is transferred onto the substrate.

A first UV textured layer having texture is prepared on the substrate.

Specifically, the UV glue is coated on the substrate, and then the texture on the mold is transferred to the UV glue by using a mold imprinting method.

The viscosity of the UV glue may be 300 to 800cps, for example 400cps, 500cps, 600cps, 700cps, 800cps. The thickness of the UV glue layer formed on the substrate is 9 to 12. Mu.m, for example, 9. Mu.m, 9.5. Mu.m, 10. Mu.m, 11. Mu.m, 12. Mu.m.

After the UV glue is coated, imprinting is carried out on the UV glue on the substrate by using a mould with textures, then the state that the mould is attached to the UV glue layer is kept, the UV glue is cured by an ultraviolet lamp, the curing energy is about 500-1000 mJ/cm < 2 >, so that the UV glue is cured and molded, a first UV texture layer is formed, and finally the mould is removed.

S300: plating a first dispersion composite layer on the first UV texture layer.

Through the steps, a first UV texture layer with textures is prepared, and then a first dispersion composite layer is plated on the textured side of the first UV texture layer.

The first dispersion composite layer is used for generating dispersion for the composite light transmitted through the first dispersion composite layer so as to achieve the effect of dazzling. The first dispersion composite layer can be prepared by plating dispersion layers formed by a plurality of metal oxide layers in sequence.

Specifically, the first dispersion composite layer may be plated by PVD, and in this embodiment, a magnetron sputtering method is taken as an example.

In the magnetron sputtering process, a mechanical pump is used for vacuumizing a sputtering chamber to about 3Pa, then a molecular pump sputtering chamber is used for continuously vacuumizing to about 0.001Pa, the size of the gas flow and the sputtering power are properly regulated, and a film is deposited on the texture surface of the first UV texture layer.

In one embodiment, the magnetron sputtered target may include SiO2, in2O3, snO. Plating a first SiO2 layer, an In2O3 layer, a second SiO2 layer, a SnO layer and a third SiO2 layer on the first UV texture layer In sequence.

The thicknesses of the first SiO2 layer, the second SiO2 layer and the third SiO2 layer are 5 to 10nm, and may be, for example, 5nm, 6nm, 7nm, 8nm, 9nm or 10nm. The thicknesses of the first SiO2 layer, the second SiO2 layer and the third SiO2 layer may be the same or different.

The thickness of the In2O3 layer may be selected to be 20 to 50nm, for example, 23nm, 25nm, 28nm, 32nm, 35nm, 39nm, 41nm, 44nm, 48nm, 49nm.

The thickness of the SnO layer may be selected from 5 to 15nm, for example, 6nm, 8nm, 9nm, 10nm, 12nm, 14nm.

The total thickness of the first dispersion composite layer prepared by the method is controlled within 50-150 nm.

The first dispersion composite layer prepared by the embodiment has excellent high-brightness silver appearance effect, and the appearance is improved.

In another embodiment, the magnetron sputtered target may comprise SiO2, zrO2, tiO2. And plating a fourth SiO2 layer, a first ZrO2 layer, a first TiO2 layer, a fifth SiO2 layer, a second TiO2 layer, a sixth SiO2 layer and a third TiO2 layer on the first UV texture layer in sequence.

Wherein the thickness of the fourth SiO2 layer is selected to be 3-5 nm, such as 3.1nm, 3.5nm, 3.9nm, 4.3nm, 4.5nm, 4.8nm.

The thickness of the first ZrO2 layer may be selected to be 3 to 16nm, for example, 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm, 16nm.

The thickness of the first TiO2 layer may be selected from 5 to 15nm, for example 4nm, 5nm, 7nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm.

The thickness of the fifth SiO2 layer may be selected to be 5 to 10nm, for example, 5nm, 6nm, 7nm, 8nm, 9nm, 10nm.

The thickness of the second TiO2 layer may be selected to be 10 to 20nm, for example 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20nm.

The thickness of the sixth SiO2 layer may be selected from 5 to 20nm, for example, 5nm, 6nm, 7nm, 8nm, 9nm, 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20nm.

The thickness of the third TiO2 layer may be selected to be 10 to 20nm, for example 10nm, 11nm, 12nm, 13nm, 14nm, 15nm, 16nm, 17nm, 18nm, 19nm, 20nm.

The first dispersion composite layer prepared by the embodiment has colorful appearance effect, and the appearance is improved.

In other embodiments, the first dispersive composite layer may also include more dispersive layers than the embodiments described above.

S400: and printing an adhesive layer on the first dispersion composite layer.

After the first dispersive composite layer is prepared, an adhesive layer is printed on one side of the first dispersive composite layer far away from the first UV texture layer.

The adhesive layer is used to adhere the first dispersion composite layer and the first UV texture layer to other components, and may be formed using a screen printing method.

Specifically, the UV pressure sensitive adhesive water may be screen printed on the side of the first dispersive composite layer remote from the first UV texture layer.

The viscosity of the UV pressure-sensitive adhesive water is 800-2000 cps, such as 900cps, 1100cps, 1300cps, 1600cps, 1800cps, 1900cps.

The screen mesh number can be selected to be 800-3000 mesh, preferably 1000-2000 mesh, and the screen mesh material can be polyester PC or stainless steel screen.

The water glass transition temperature of the UV pressure-sensitive adhesive is generally selected to be-40 to-10 ℃, and the drawing force of the PC/PMMA substrate is generally required to be more than 20N, and meanwhile, the UV pressure-sensitive adhesive has the function of resisting the temperature of 180-230 ℃ for 2 minutes, so that the adhesive strength of the pressure-sensitive adhesive is not reduced.

The curing lamp wavelength of the UV pressure-sensitive adhesive water is acted at 365nm, the power is 40-80 mW, and the required curing energy is 600-2000 mJ/cm < 2 >. After curing, an adhesive layer is formed.

S500: all the materials are cut into logo patterns.

After the steps, a first UV texture layer, a first dispersion composite layer and an adhesive layer which are sequentially formed on the substrate are obtained.

And importing a required logo pattern drawing into a computer, and then cutting the substrate, the first UV texture layer, the first dispersion composite layer and the bonding layer through CNC equipment to obtain a logo pattern. logo patterns can be any shape such as characters, letters, images and the like.

After CNC cutting, the positional relationship among the substrate, the first UV texture layer, the first dispersion composite layer and the bonding layer is unchanged.

After CNC cutting, a protective layer is attached to one side of the adhesive layer. In this embodiment, the protective layer on one side of the adhesive layer may be similar to the substrate, and is a PET release film. To distinguish from the substrate, the protective layer had a thickness of 25 μm and the release film had a release force gram weight less than that of the substrate.

S600: and removing the substrate to obtain a pattern layer, and adhering the adhesive layer of the pattern layer to the substrate.

And removing the substrate and the protective layer to obtain a pattern layer comprising the first UV texture layer, the first dispersion composite layer and the bonding layer, and bonding the bonding layer on the substrate.

The protective layer is used in actual industrial production, the bonding layer and the substrate are bonded at different stations, the protective layer is used for preventing impurities from entering the bonding layer, and the bonding layer can be directly bonded to the substrate without attaching the protective layer on one side of the bonding layer.

Through the steps, the shell with the pattern layer with the colorful effect is obtained. The shell can be used as a protective shell of the electronic equipment, so that logo patterns on the shell have an excellent colorful effect and can improve the appearance expressive force of the electronic equipment.

Referring to fig. 10, fig. 10 is a flow chart of another embodiment of a method for manufacturing an electronic device according to the present application.

In order to enhance the appearance of the case, step S600 may further include:

s700: and dispensing UV glue on one side of the substrate provided with the pattern layer, covering the pattern layer by the UV glue, and embossing textures on the UV glue to obtain a second UV texture layer.

And dispensing UV glue on the substrate with the pattern layer, wherein the UV glue and the pattern layer are positioned on the same side of the substrate, and the UV glue covers the area of the substrate which is not covered by the pattern layer.

The UV glue is used to form a second UV textured layer having texture, the texture on the second UV textured layer can likewise be imprinted using a mold, and then UV curing the second UV textured layer.

Alternatively, the second UV texture layer may cover one side surface of the substrate entirely or may cover part of the substrate.

Alternatively, the thickness of the second UV texture layer is 9 to 15 μm, for example 9.5 μm, 10 μm, 10.5 μm, 11 μm, 11.3 μm, 12 μm, 13.5 μm, 14 μm, 14.5 μm.

Because the second UV texture layer has the texture, can promote the aesthetic feeling of casing, simultaneously, the second UV texture layer can also play certain fixed action to the pattern layer.

S800: and plating a second dispersion composite layer on the second UV texture layer.

And after the second UV texture layer is solidified, plating a second dispersion composite layer on the second UV texture layer.

The second dispersion composite layer is used for generating dispersion for the composite light transmitted through the second dispersion composite layer so as to achieve the effect of dazzling. The second dispersion composite layer can be prepared by plating dispersion layers formed by a plurality of metal oxide layers in sequence.

Specifically, the second dispersion composite layer may be plated by PVD, and this embodiment is exemplified by magnetron sputtering.

In the magnetron sputtering process, a mechanical pump is used for vacuumizing the sputtering chamber to about 3Pa, then a molecular pump is used for continuously vacuumizing the sputtering chamber to about 0.001Pa, the size of the gas flow and the sputtering power are properly regulated, and a film is deposited on the texture surface of the second UV texture layer.

In one embodiment, the magnetron sputtered target may include SiO2, zrO2, tiO2. And sequentially sputtering and plating a seventh SiO2 layer, a second ZrO2 layer, a fourth TiO2 layer, an eighth SiO2 layer, a fifth TiO2 layer, a ninth SiO2 layer and a sixth TiO2 layer on the second UV texture layer.

Wherein the thickness of the seventh SiO2 layer is selected from 5 to 10nm, such as 5nm, 6nm, 7nm, 8nm, 9nm, and 10nm.

The second ZrO2 layer may have a thickness of 3 to 15nm, such as 4nm, 5nm, 7nm, 8nm, 9nm, 11nm, 13nm, 14nm, 15nm

The thickness of the fourth TiO2 layer may be selected from 50 to 150nm, for example 51nm, 55nm, 60nm, 65nm, 70nm, 78nm, 80nm, 90nm, 95nm, 100nm, 120nm, 130nm, 140nm, 145nm.

The thickness of the eighth SiO2 layer may be selected from 10 to 50nm, for example, 11nm, 15nm, 18nm, 20nm, 25nm, 30nm, 35nm, 40nm, 45nm, 48nm.

The thickness of the fifth TiO2 layer may be selected from 20 to 120nm, for example 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 115nm.

The thickness of the ninth SiO2 layer may be selected from 10 to 50nm, for example 12nm, 18nm, 20nm, 25nm, 30nm, 40nm, 45nm, 48nm.

The thickness of the sixth TiO2 layer may be selected from 20 to 120nm, for example 25nm, 30nm, 40nm, 50nm, 60nm, 70nm, 80nm, 90nm, 100nm, 110nm, 115nm.

The total thickness of the plated second dispersion composite layer is 150 to 400nm, preferably 200 to 300nm.

The second dispersion composite layer prepared by the method can play a role in dispersing light, so that natural light can be dispersed into various colorful lights after penetrating through the second dispersion composite layer, and texture on the second UV texture layer is combined, so that the texture and aesthetic feeling of the electronic equipment shell can be effectively improved.

S900: and (3) silk-screen printing the ink layer on the side of the second dispersion composite layer away from the second UV texture layer.

After plating the second dispersion composite layer, screen printing the ink layer on a side of the second dispersion composite layer away from the second UV texture layer.

The ink layer may include a primer ink layer for coloring and/or a fire-resistant ink layer for protecting the safety of the electronic device.

Alternatively, the underlayment ink layer may be black or gray or other colors, and the thickness of the silk-screen underlayment ink layer may be selected to be 5-10 μm.

Optionally, the thickness of the fire-resistant ink layer is 5 to 20 μm.

The fireproof ink layer has high temperature resistance and is used for contacting with elements such as batteries, circuits and the like of electronic equipment. The underlaying ink layer may be screen printed on the second dispersion composite layer and the fire-resistant ink layer may be screen printed on the underlaying ink layer.

S1000: an outer texture layer is prepared on the side of the substrate remote from the pattern layer.

And preparing an outer texture layer on one side of the substrate far away from the pattern layer, wherein the substrate near the pattern layer faces the inside of the electronic equipment, and one side of the substrate far away from the pattern layer faces the outside.

Firstly, spraying a dual-curing hardening liquid on one side of a substrate far from a pattern layer, and then baking for 3-6 min at the temperature of 55-80 ℃ to volatilize a solvent in the dual-curing hardening liquid, so as to leave resin, monomer, curing agent and the like to uniformly form a wet film on the surface of the substrate, thereby obtaining an uncured spray coating. The thickness of the coating is controlled to be about 4-30 mu m, the thickness of the coating is too thin, poor appearance is easy to be generated for later procedure stamping, and the thickness of the coating is too thick, so that the toughness of the cured coating is poor, and the bending is easy to crack.

Optionally, the dual cure shower composition includes: 20-40 parts of 2-4 functional polyurethane acrylic resin, 55-80 parts of 5-9 functional polyurethane acrylic ester, 3-5 parts of photoinitiator and 100-300 parts of solvent.

Secondly, pressing the uncured shower coating and a die with textures together to enable the shower coating to be pressed out of the textures of mirror surface replication by the concave-convex structure of the texture die, then radiating the texture die and the shower coating together by an LED lamp to enable the shower coating to be semi-cured, and removing the texture die after curing. The mold can adopt a transparent sheet with the thickness of 0.1-0.38 mm, if the thickness of the sheet is too thin, the appearance orange peel, the texture pressure is not reduced and other anomalies are easily caused by embossing, and if the thickness of the sheet is too thick, the texture preparation is difficult, and the cost is increased.

Optionally, the transparent sheet material may be any one of PET, PC, PVC (polyvinyl chloride), PU (polyurethane) and TPU.

Optionally, the thickness of the texture layer on the mold is 5-25 um, the surface dyne value is less than 34dyn, if the dyne value is too high, the semi-cured hardened layer may be stuck to the mold, and the release pulling hardening liquid after imprinting may cause texture deformation.

Optionally, the mold and the spray coating can be laminated by vacuum lamination or roll lamination, and the lamination pressure is controlled to be 0.5-8Bar.

And (3) curing the LED lamp after lamination, wherein the wavelength of the curing lamp is 365-400 nm, and the energy required by curing is 50-250mj/cm < 2 >. The pencil hardness of the outer texture surface after the LED is solidified is about 4B-2B, the breaking elongation is 50% -200%, and the solidification rate is 32% -60%.

After the LED lamp is cured, the Hg lamp is used for completely curing the outer texture, the curing rate is 80-85%, and finally the outer texture layer is formed.

The outer texture layer prepared by the method not only can further improve the appearance of the shell, but also can improve the touch feeling of the electronic equipment, so that the electronic equipment has market competitiveness.

After the shell is prepared by the method, the shell can be further subjected to strength test to ensure the product quality of the shell, and the strength test data of the shell prepared by the preparation method of the shell are provided as follows:

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the strength test proves that the shell obtained by the shell preparation method has good strength and is not easy to damage.

In summary, the application provides an electronic device, a housing and a method for manufacturing the same. According to the shell and the logo pattern with the colorful shell, which are prepared by the preparation method, the appearance expressive force of electronic equipment can be improved, so that the market competitiveness is improved.

The foregoing description is only illustrative of the present application and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present application.

Claims

1. The utility model provides a casing, its characterized in that includes base and pattern layer, the pattern layer is located one side of base, and cover the partial surface of base, the pattern layer has logo pattern, the pattern layer includes:

an adhesive layer adhered to the substrate;

the first UV texture layer is arranged on one side, far away from the bonding layer, of the first dispersion composite layer;

the housing further includes:

the outer texture layer is arranged on one side of the substrate far away from the pattern layer;

the second UV texture layer is arranged on one side of the substrate and covers the area of the substrate which is not covered by the pattern layer;

the second dispersion composite layer is arranged on one side of the second UV texture layer, which is far away from the substrate, and is used for generating dispersion for the composite light;

and the ink layer is arranged on one side of the second dispersion composite layer far away from the second UV texture layer.

2. The housing of claim 1, wherein the housing is configured to receive the cartridge,

the first dispersion composite layer comprises a plurality of dispersion layers which are stacked, and the refractive indexes of two adjacent dispersion layers are different.

3. The housing of claim 2, wherein the housing is configured to receive the cartridge,

the first dispersion composite layer comprises a first SiO2 layer, an In2O3 layer, a second SiO2 layer, a SnO layer and a third SiO2 layer which are sequentially stacked.

4. The housing of claim 2, wherein the housing is configured to receive the cartridge,

the first dispersion composite layer comprises a fourth SiO2 layer, a first ZrO2 layer, a first TiO2 layer, a fifth SiO2 layer, a second TiO2 layer, a sixth SiO2 layer and a third TiO2 layer which are sequentially stacked.

5. The housing of claim 1, wherein the housing is configured to receive the cartridge,

the second dispersion composite layer comprises a seventh SiO2 layer, a second ZrO2 layer, a fourth TiO2 layer, an eighth SiO2 layer, a fifth TiO2 layer, a ninth SiO2 layer and a sixth TiO2 layer which are sequentially stacked.

6. An electronic device, comprising a display screen module, a control circuit board and the housing of any one of claims 1-5, wherein the display screen module and the housing cooperate to form a containing space, and the control circuit board is disposed in the containing space and electrically connected with the display screen module.