CN114883356A - Micro LED chip transfer method, device and system - Google Patents
Micro LED chip transfer method, device and system Download PDFInfo
- Publication number
- CN114883356A CN114883356A CN202110160434.8A CN202110160434A CN114883356A CN 114883356 A CN114883356 A CN 114883356A CN 202110160434 A CN202110160434 A CN 202110160434A CN 114883356 A CN114883356 A CN 114883356A
- Authority
- CN
- China
- Prior art keywords
- transfer
- chip
- micro led
- led chip
- chips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 238000003860 storage Methods 0.000 claims description 10
- 238000001179 sorption measurement Methods 0.000 claims description 8
- 239000003566 sealing material Substances 0.000 claims description 7
- 239000011796 hollow space material Substances 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 4
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000004364 calculation method Methods 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 238000009423 ventilation Methods 0.000 claims description 3
- 238000004590 computer program Methods 0.000 description 6
- 239000011324 bead Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920003225 polyurethane elastomer Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a micro LED chip transfer method, a device and a system, wherein the micro LED chip transfer method comprises the following steps: setting the chip spacing on the substrate; cutting the wafer into a plurality of chips with the same size according to the set chip spacing, wherein the width or the length of each chip is integral multiple of the chip spacing; picking up the chip after adjusting the distance between the transfer heads; the diced chips are transferred onto a substrate by a transfer head. The step of picking up the chip after adjusting the spacing between the transfer heads further comprises: adjusting the distance between a plurality of transfer heads to the distance of the chip spacing on the substrate; the chips are picked up directly or at intervals of several unit chips on the wafer according to the chip pitch on the substrate. The invention improves the chip transfer method and the chip transfer device, effectively reduces the complexity of the micro LED chip transfer device process, reasonably configures the working flow and improves the chip transfer efficiency and the transfer yield.
Description
Technical Field
The invention belongs to the technical field of chip transfer, and particularly relates to a micro LED chip transfer method, device and system.
Background
Micro LEDs are a new generation of display technology, and have higher luminous brightness, better luminous efficiency and lower power consumption compared with the existing OLED technology. After the chip is cut, the traditional LED display screen directly packages the whole LED lamp bead, and a driving circuit is connected with the anode and the cathode of the chip to drive the packaged lamp bead; and after the photoetching step, the Micro LED chip can not be directly packaged, because the packaging material can increase the volume of the lamp beads, the microspur between the lamp beads can not be realized. The cut or etched Micro LED chip is transferred from the original wafer to the substrate, and the electrode of the Micro LED chip is connected to the circuit on the substrate.
The main problems in the transfer process of the Micor LED chip at present are as follows: the pitch between the Micro LED chips is changed from the pitch on the original sheet to the pitch on the final substrate. The commonly used transfer method in the prior art is to add an intermediate substrate, and finally transfer the Micro LED chip to the substrate by adjusting the spacing on the intermediate substrate, so that the production period of the whole process is long, the manufacturing cost is increased, and the operation is complex. Therefore, a solution with high efficiency, simple operation and feasibility needs to be further provided.
Disclosure of Invention
The invention aims to provide a micro LED chip transfer method, a micro LED chip transfer device and a micro LED chip transfer system, so as to solve the technical problems.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a micro LED chip transfer method, which comprises the following steps:
setting the chip spacing on the substrate;
cutting the wafer into a plurality of chips with the same size according to the set chip spacing, wherein the width or the length of each chip is integral multiple of the chip spacing;
picking up the chip after adjusting the distance between the transfer heads;
the diced chips are transferred onto a substrate by a transfer head.
Preferably, the step of picking up the chip after adjusting the distance between the transfer heads includes:
adjusting the distance between a plurality of transfer heads to the distance of the chip spacing on the substrate;
the chips are picked up directly or at intervals of several unit chips on the wafer according to the chip pitch on the substrate.
Preferably, the step of transferring the diced chips onto the substrate by the transfer head further comprises:
the substrate is heated during the transfer.
Preferably, the step of picking up the chip by the transfer head further includes: the transfer heads may pick up all or at least more than one transfer head apart the chips on the master.
The present invention also provides a micro LED chip transfer device, including:
the transfer heads are used for picking up the chips after being attached to the chips;
the transfer board is used for controlling the transfer heads to pick up the chips and controlling and adjusting the spacing among the plurality of transfer heads;
the transfer heads are arranged on the transfer plate in an array manner;
the transfer plate also comprises a controller and an electromagnetic valve, wherein the controller is used for controlling and adjusting the transfer head to be attached to and transferred with the chip, and the electromagnetic valve is used for controlling the transfer head to adsorb the chip;
the micro LED chip transfer device is used for implementing the micro LED chip transfer method of any one of the above embodiments; the Micro LED chip comprises a Micro LED chip or a Mini LED chip.
Preferably, the transfer head is a hollow structure.
Preferably, the transfer plate is a hollow structure, and an inner hollow space of the transfer plate communicates with a hollow space of the transfer head.
Preferably, the transfer plate comprises an upper transfer plate half and a lower transfer plate half after being opened, the lower transfer plate half is connected with the transfer head, and a protrusion is further arranged inside the transfer head to prevent particles from blocking the transfer head.
Preferably, the transfer head further comprises an elastic sealing material, and the elastic sealing material is arranged at the top end of the transfer head and used for reducing hard contact in the transfer process and protecting the chip from being damaged.
The application of the invention also provides a micro LED chip transfer system, which comprises:
the vacuum pump is used for vacuumizing to enable the transfer head to generate adsorption force;
the air storage tank is used for ventilating to enable the transfer head to stop adsorbing the chip;
the electronic valve is used for controlling the switch of air suction and ventilation;
the control module is used for controlling the electronic valve so as to control the gas inlet and outlet and movement of the micro LED chip transfer device;
the micro LED chip transfer device of any one of the above embodiments.
The vacuum pumping pump and the gas storage tank are connected with the control module, the electronic valves are used for controlling the vacuum pumping pump and the gas storage tank to be opened and closed respectively, and the control module is connected with the micro LED chip transfer device.
Preferably, the control module further comprises:
the receiving unit is used for receiving signals sent by the image identification module in the micro LED chip transfer device;
and the calculation moving unit is used for calculating a moving route of the micro LED chip transfer device in the chip adsorption process.
From the above, the present invention has the following advantages: directly cutting chips with the same size on the original wafer, directly picking up the chips or transferring the chips according to the spacing between the chips on the final substrate by taking one chip as a unit, and directly transferring the chips to the final substrate without transferring the substrate or a second substrate, thereby improving the chip transfer efficiency; by the transfer device, damage of the transfer head to the chip in the chip transfer process is reduced.
Drawings
FIG. 1 is a flow chart of a micro LED chip transfer method according to an embodiment of the present invention;
FIG. 2 is a schematic view of a micro LED chip transfer device according to an embodiment of the present invention;
FIG. 3 is a schematic view of a micro LED chip transfer device according to another embodiment of the present invention;
FIG. 4 is a schematic view of a transfer head of a micro LED chip transfer device according to an embodiment of the present invention;
FIG. 5 is a schematic view of a transfer head of a micro LED chip transfer device according to another embodiment of the present invention;
fig. 6 is a schematic view of a transfer head of a micro LED chip transfer device according to an embodiment of the present invention.
FIG. 7 is a schematic view of a transfer plate in a micro LED chip transfer device according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a micro LED chip transfer system according to an embodiment of the present invention.
Detailed Description
In order that the manner in which the above recited objects, features and advantages of the present application can be more clearly understood, a more particular description of the present application will be rendered by reference to the appended drawings. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention application.
Referring to fig. 1, fig. 1 is a flowchart illustrating a micro LED chip transfer method according to an embodiment of the present invention; the micro LED chip transfer method comprises the following steps:
s110, setting the chip spacing on the substrate;
s120, cutting the wafer into a plurality of chips with the same size according to the set chip spacing, wherein the width or the length of each chip is integral multiple of the chip spacing; specifically, one chip after dicing is set as a unit chip, and the chip pitch on the substrate is an integral multiple of the width or length of the unit chip;
s130, adjusting the distance between the transfer heads and then adsorbing the chips by the transfer heads;
and S140, transferring the cut chip to a substrate through a transfer head.
In some optional embodiments, the step of adsorbing the chip after adjusting the distance between the transfer heads includes:
adjusting the distance between a plurality of transfer heads to the distance of the chip spacing on the substrate;
the chips are adsorbed on the wafer directly or at intervals of a plurality of unit chips according to the chip spacing on the substrate. Specifically, assuming that the pitch of chips on the substrate is 0.1mm, chips having a width of 0.05mm can be cut; when the chip is adsorbed by the transfer head, 2 chips are arranged between the adsorbed first chip and the second chip at intervals; the chip pitch requirement is 0.1mm, the chips can be cut to be 0.02mm, 0.05mm or 0.1mm in width, and the transfer head adsorbs the chips at intervals of 5, 2 or 1.
In other optional embodiments, the step of transferring the diced chips onto the substrate by the transfer head further comprises: heating the substrate during the transfer; the transfer heads may be all or at least one or more than one transfer head at intervals to adsorb the chips on the original sheet, and specifically, the transfer plate may adsorb the chips by controlling the transfer heads at different intervals according to the intervals between the transfer heads. For example, the chip pitch is required to be 0.1mm, the pitch between the transfer heads is 0.05mm, and when the transfer heads adsorb the chips, 2 transfer heads are spaced between the adsorbed first chip and the second chip; for devices with other spacing requirements, a plurality of transfer heads are arranged according to a sub-principle to adsorb the chips, and the chips suitable for the transfer method comprise Micro LED and/or Mini LED chips. In some alternative embodiments, the substrate is heated during the transfer process so that the solder paste on the substrate conforms to the micro LED chips.
The chip is transferred by using the method of the embodiment, the chip is cut according to the chip spacing on the final device, the chip-to-chip spacing is the required chip spacing when the transfer head adsorbs the chip, and the chip spacing does not need to be adjusted again through a sacrificial layer or a transfer substrate, so that the complexity of the transfer process steps is reduced, and the transfer efficiency is improved.
Referring to fig. 2, 7 and 8, fig. 2 is a schematic diagram illustrating a micro LED chip transfer device according to an embodiment of the present invention, including:
a plurality of transfer heads 2 for adsorbing the chips after being attached to the chips;
the transfer plate 1 is used for controlling the transfer heads 2 to adsorb the chips and controlling and adjusting the intervals among the plurality of transfer heads;
the transfer heads 2 are arranged on the transfer plate 1 in an array mode, and the transfer heads are of hollow structures.
The transfer plate 1 further comprises a controller 13 and an electromagnetic valve 12, wherein the controller 13 is used for controlling and adjusting the transfer head 2 to be attached to and transferred from the chip, and the electromagnetic valve 12 is used for controlling the transfer head to adsorb the chip;
the micro LED chip transferring device 30 is used for implementing the micro LED chip transferring method according to any one of the above embodiments;
the inner hollow space 3 of the transfer plate 1 communicates with the hollow space of the transfer head 2.
In other alternative embodiments, referring to fig. 2 to 6, the opened transfer plate comprises an upper transfer plate half and a lower transfer plate half, and the lower transfer plate half is connected with the inside of the transfer head and is provided with a protrusion 7 for preventing particles from blocking the transfer head 2. Referring to fig. 2 and 3, the transfer device 2 further includes an elastic sealing material 4, and the elastic sealing material 4 is disposed at a top end of the transfer head 2 to reduce hard contact during the transfer process and protect the chip from being damaged. Elastomeric sealing materials include, but are not limited to, silicone rubber, liquid polysulfide rubber, polyurethane elastomers, fluoro-rubber type and polyisobutylene rubbers, and the like. The elastic sealing materials 4, 4a and 4b are generally provided at a height not more than half the height 2, 2a and 2b of the transfer heads. The hollow part inside the transfer head 2 is set to funnel shapes 6, 6a and 6b, the suction force of the transfer head is enhanced, and the chip is prevented from falling off when the chip is adsorbed.
Referring to fig. 7, the transfer plate 1 further includes:
the camera 11 is used for shooting the chip to be transferred;
and the image identification module 14 is used for identifying and positioning the chip in the picture shot by the camera and sending a signal to the controller. In other optional embodiments, an electromagnetic valve is arranged at each row and/or column of the transfer heads, the electromagnetic valve is controlled by the controller, and the controller receives a signal sent by the image recognition module, controls the on-off of the electromagnetic valve, and separates a plurality of transfer head adsorption chips.
When the micro LED transfer device implements the corresponding transfer method, the working procedure and the complexity of chip transfer devices can be reduced, and the transfer efficiency and the chip yield are improved.
Referring to fig. 8, fig. 8 is a micro LED chip transfer system 70 according to the present invention, which includes:
a vacuum pump 61 for generating a vacuum to make the transfer head generate an adsorption force;
an air tank 60 for introducing air to stop the transfer head from adsorbing the chips;
a control module 40 for controlling the electronic valves 50 and 51, and further controlling the gas inlet and outlet and movement of the micro LED chip transfer device 30;
the micro LED chip transfer device 30 according to any of the above embodiments.
The vacuum pump 61 and the air storage tank 60 are connected to the control module 40, the electronic valves 51 and 50 are used to control the vacuum pump 61 and the air storage tank 60 to be opened or closed, and the control module 40 is connected to the micro LED chip transfer device 30.
In some optional embodiments, the control module 40 further comprises:
a receiving unit 42, configured to receive a signal sent by the image recognition module in the micro LED chip transfer device;
and the calculation moving unit 41 is used for calculating a moving route of the micro LED chip transfer device in the chip adsorption process. The chips transferred by the Micro LED chip transferring device 30 include, but are not limited to, Micro LED and/or Mini LED chips.
The distance between every two transfer heads in the micro LED chip transfer system is controllable, chip adsorption and transfer routes are automatically calculated, chip transfer efficiency is improved, and complexity of chip transfer process procedures is reduced.
The present invention can also be implemented by a computer program instructing related hardware to implement all or part of the processes in the method of the above embodiments, where the computer program is stored in a computer-readable storage medium, and when the computer program is executed by a processor, the steps of the above method embodiments can be implemented. Wherein the computer program comprises computer program code, which may be in the form of source code, object code, an executable file or some intermediate form, etc. The computer-readable storage medium may include: any entity or device capable of carrying the computer program code, recording medium, usb disk, removable hard disk, magnetic disk, optical disk, computer Memory, Read-Only Memory (ROM), Random Access Memory (RAM), electrical carrier wave signals, telecommunications signals, software distribution medium, and the like. It should be noted that the computer readable medium may contain content that is subject to appropriate increase or decrease as required by legislation and patent practice in jurisdictions, for example, in some jurisdictions, computer readable media does not include electrical carrier signals and telecommunications signals as is required by legislation and patent practice.
The invention is not the best known technology.
In the several embodiments provided in this patent application, it should be understood that the disclosed systems and methods may be implemented in other ways. For example, the system embodiments described above are merely illustrative, and for example, the division of the components is only one logical division, and other divisions may be realized in practice.
In addition, each functional module/component in the embodiments of the present invention may be integrated into the same processing module/component, or each functional module/component may exist alone physically, or two or more functional modules/components may be integrated into the same processing module/component. The integrated modules/components can be implemented in the form of hardware, or can be implemented in the form of hardware plus software functional modules/components.
It will be evident to those skilled in the art that the claimed embodiments of the present invention are not limited to the details of the foregoing illustrative embodiments, and that the claimed embodiments of the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the embodiments of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned. Furthermore, it is obvious that the word "comprising" does not exclude other elements or steps, and the singular does not exclude the plural. Several units, modules or means recited in the system, apparatus or terminal claims may also be implemented by one and the same unit, module or means in software or hardware. The terms first, second, etc. are used to denote names, but not any particular order.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes and modifications can be made, which are within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (11)
1. A micro LED chip transfer method is characterized by comprising the following steps:
setting the chip spacing on the substrate;
cutting the wafer into a plurality of chips with the same size according to the set chip spacing, wherein the width or the length of each chip is integral multiple of the chip spacing;
picking up the chip after adjusting the distance between the transfer heads;
the diced chips are transferred onto a substrate by a transfer head.
2. The micro LED chip transfer method according to claim 1, wherein the step of picking up the chip after adjusting the pitch between the transfer heads comprises:
adjusting the distance between a plurality of transfer heads to the distance of the chip spacing on the substrate;
the chips are picked up directly or at intervals of several unit chips on the wafer according to the chip pitch on the substrate.
3. The micro LED chip transfer method of claim 2, wherein the step of transferring the diced chips onto the substrate by the transfer head further comprises:
the substrate is heated during the transfer.
4. The micro LED chip transfer method according to claim 3, wherein the step of picking up the chip by the transfer head further comprises: the transfer heads may pick up all or at least more than one transfer head apart the chips on the master.
5. A micro LED chip transfer device, comprising:
the transfer heads are used for picking up the chips after being attached to the chips;
the transfer board is used for controlling the transfer heads to pick up the chips and controlling and adjusting the spacing among the plurality of transfer heads;
the transfer heads are arranged on the transfer plate in an array manner;
the transfer plate also comprises a controller and an electromagnetic valve, wherein the controller is used for controlling and adjusting the transfer head to be attached to and transferred with the chip, and the electromagnetic valve is used for controlling the transfer head to adsorb the chip;
the micro LED chip transfer device is used for implementing the micro LED chip transfer method of any one of claims 1 to 4; the Micro LED chip comprises a Micro LED chip or a Mini LED chip.
6. The micro LED chip transfer device of claim 5, wherein said transfer head is a hollow structure.
7. The micro LED chip transfer device of claim 8, wherein the transfer plate is a hollow structure, and an inner hollow space of the transfer plate is communicated with the hollow space of the transfer head.
8. The micro LED chip transfer device of claim 7, wherein the transfer plate comprises an upper transfer plate half and a lower transfer plate half when opened, the lower transfer plate half is connected to the transfer head, and the transfer head is further provided with a protrusion inside to prevent particles from blocking the transfer head.
9. A micro LED chip transfer device according to claim 8, wherein the transfer head further comprises an elastic sealing material disposed on the top end of the transfer head to reduce hard contact during transfer and protect the chip from damage.
10. A micro LED chip transfer system, comprising:
the vacuum pump is used for vacuumizing to enable the transfer head to generate adsorption force;
the air storage tank is used for ventilating to enable the transfer head to stop adsorbing the chip;
the electronic valve is used for controlling the switch of air suction and ventilation;
the control module is used for controlling the electronic valve so as to control the gas inlet and outlet and movement of the micro LED chip transfer device;
the micro LED chip transfer device of any one of claims 5-9.
The vacuum pumping pump and the gas storage tank are connected with the control module, the electronic valves are used for controlling the vacuum pumping pump and the gas storage tank to be opened and closed respectively, and the control module is connected with the micro LED chip transfer device.
11. The micro LED chip transfer system of claim 10, wherein said control module further comprises:
the receiving unit is used for receiving signals sent by the image identification module in the micro LED chip transfer device;
and the calculation moving unit is used for calculating a moving route of the micro LED chip transfer device in the chip adsorption process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110160434.8A CN114883356A (en) | 2021-02-05 | 2021-02-05 | Micro LED chip transfer method, device and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110160434.8A CN114883356A (en) | 2021-02-05 | 2021-02-05 | Micro LED chip transfer method, device and system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114883356A true CN114883356A (en) | 2022-08-09 |
Family
ID=82667226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110160434.8A Pending CN114883356A (en) | 2021-02-05 | 2021-02-05 | Micro LED chip transfer method, device and system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114883356A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140159065A1 (en) * | 2012-12-11 | 2014-06-12 | LuxVue Technology Corporation | Stabilization structure including sacrificial release layer and staging cavity |
| US20190189487A1 (en) * | 2017-12-20 | 2019-06-20 | Point Engineering Co., Ltd. | Transfer head for micro led |
| KR20190098329A (en) * | 2018-02-14 | 2019-08-22 | 주식회사 루멘스 | Method for arraying micro LED chips for manufacturing a LED display panel |
| CN110212079A (en) * | 2019-05-17 | 2019-09-06 | 深圳市华星光电半导体显示技术有限公司 | The transfer method and Micro-LED display panel of Micro-LED chip |
| CN111244012A (en) * | 2018-11-29 | 2020-06-05 | 昆山工研院新型平板显示技术中心有限公司 | Transfer device and method for transferring micro-component |
| US20200220042A1 (en) * | 2019-01-07 | 2020-07-09 | Point Engineering Co., Ltd. | Micro led transfer head |
-
2021
- 2021-02-05 CN CN202110160434.8A patent/CN114883356A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140159065A1 (en) * | 2012-12-11 | 2014-06-12 | LuxVue Technology Corporation | Stabilization structure including sacrificial release layer and staging cavity |
| US20190189487A1 (en) * | 2017-12-20 | 2019-06-20 | Point Engineering Co., Ltd. | Transfer head for micro led |
| KR20190098329A (en) * | 2018-02-14 | 2019-08-22 | 주식회사 루멘스 | Method for arraying micro LED chips for manufacturing a LED display panel |
| CN111244012A (en) * | 2018-11-29 | 2020-06-05 | 昆山工研院新型平板显示技术中心有限公司 | Transfer device and method for transferring micro-component |
| US20200220042A1 (en) * | 2019-01-07 | 2020-07-09 | Point Engineering Co., Ltd. | Micro led transfer head |
| CN110212079A (en) * | 2019-05-17 | 2019-09-06 | 深圳市华星光电半导体显示技术有限公司 | The transfer method and Micro-LED display panel of Micro-LED chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3598492B1 (en) | Method for manufacturing display device | |
| CN101276777B (en) | Substrate mounting stage and substrate processing apparatus | |
| CN203910868U (en) | Laser lift-off device | |
| CN110349989B (en) | Light emitting diode, display substrate and transfer method | |
| CN110581203A (en) | Mass transfer method and device for Micro-LED Micro element | |
| CN111129245B (en) | LED chip, display panel and display panel's equipment | |
| KR20150082414A (en) | Led die dispersal in displays and light panels with preserving neighboring relationship | |
| CN112531092B (en) | Miniature light-emitting diode display panel, manufacturing method and display device | |
| CN105256283A (en) | Base plate fixing carrier, base plate fixing and separating method and base plate evaporation method | |
| CN112713167A (en) | Display panel and preparation method thereof | |
| CN103311150B (en) | Semiconductor-fabricating device and the control method of semiconductor-fabricating device | |
| CN114883356A (en) | Micro LED chip transfer method, device and system | |
| CN215731721U (en) | Mini/Micro LED chip transfer device and system | |
| KR102258524B1 (en) | A method for manufacturing the electronic device using microled | |
| CN203850267U (en) | Integrated circuit pick-and-place device | |
| CN109300886B (en) | Hexagonal chip plane cascade display screen and production process thereof | |
| CN113764326B (en) | Micro light emitting diode and transfer device and transfer method thereof | |
| CN113130458A (en) | Light-emitting unit, backlight structure, display panel and manufacturing method of light-emitting source | |
| CN111146163A (en) | Chip module and preparation method | |
| CN211320073U (en) | Huge transfer device based on magnetic suspension and system thereof | |
| CN108279552B (en) | Substrate stage and exposure machine | |
| CN212570957U (en) | Adsorption device | |
| CN114582782A (en) | Micro LED chip transfer device, display panel, preparation method of display panel and display device | |
| KR20090039592A (en) | Plasma display panel and manufacturing method | |
| CN114730814A (en) | Mass transfer method of micro light-emitting diode and display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |