CN114875366B - Evaporation source device, cover body thereof and evaporation source equipment - Google Patents
Evaporation source device, cover body thereof and evaporation source equipment Download PDFInfo
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- CN114875366B CN114875366B CN202210728035.1A CN202210728035A CN114875366B CN 114875366 B CN114875366 B CN 114875366B CN 202210728035 A CN202210728035 A CN 202210728035A CN 114875366 B CN114875366 B CN 114875366B
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- 238000001704 evaporation Methods 0.000 title claims abstract description 109
- 230000008020 evaporation Effects 0.000 title claims abstract description 102
- 238000010438 heat treatment Methods 0.000 claims description 14
- 230000000712 assembly Effects 0.000 claims description 11
- 238000000429 assembly Methods 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 6
- 239000002346 layers by function Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 4
- 238000005507 spraying Methods 0.000 claims 3
- 238000007740 vapor deposition Methods 0.000 abstract description 56
- 239000000463 material Substances 0.000 abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 230000002159 abnormal effect Effects 0.000 abstract description 9
- 238000009825 accumulation Methods 0.000 abstract description 9
- 230000009286 beneficial effect Effects 0.000 description 22
- 238000002347 injection Methods 0.000 description 10
- 239000007924 injection Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000009834 vaporization Methods 0.000 description 7
- 230000008016 vaporization Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000002349 favourable effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The embodiment of the application provides a cover body of an evaporation source device, which comprises: the flow guide assembly comprises two inclined hole flow guide parts positioned at two ends; the middle of the inclined hole flow guiding part is provided with an inclined hole outlet, and the direction of the inclined hole outlet is obliquely upwards along a first direction parallel to the flow guiding component; the inclined hole diversion part comprises two inclined hole sub diversion parts which are positioned at two sides of the inclined hole exit along the second direction, and the second direction is mutually perpendicular to the first direction and is perpendicular to the thickness direction of the diversion component; the flow limiting assembly comprises two flow limiting structures, and the flow limiting structures are arranged on the outer sides of the inclined hole diversion parts along the first direction. According to the embodiment of the application, the flow limiting component is added, so that the direction of vapor deposition airflow is limited, the accumulation of vapor deposition materials on the periphery of the cover body is reduced or avoided, the situation that the temperature of the evaporation source device is abnormal can be avoided, the production risk can be reduced, the yield ratio can be ensured, and the income can be increased.
Description
Technical Field
The application relates to the technical field of evaporation, in particular to an evaporation source device, a cover body of the evaporation source device and evaporation source equipment.
Background
At present, an organic light-emitting functional layer is generally prepared by adopting an evaporation method, and the evaporation method is to evaporate a material to be evaporated into atoms or molecules in vacuum by adopting heating methods such as current heating, electron beam bombardment heating, laser heating and the like, and make the material to be evaporated move linearly in a larger free path, collide with the surface of a substrate and condense to form a film.
However, when the organic light-emitting functional layer is evaporated, the evaporation source device is prone to temperature abnormality, and thus, production line downtime, productivity, yield reduction and the like are caused.
Disclosure of Invention
The application provides an evaporation source device, a cover body of the evaporation source device and evaporation source equipment aiming at the defects of the existing mode, and aims to solve the technical problem that the evaporation source device in the prior art is easy to have abnormal temperature.
In a first aspect, an embodiment of the present application provides a cover of an evaporation source device for evaporating an organic light-emitting functional layer, the cover including: the flow guide assembly and the two flow limiting assemblies;
the flow guide assembly comprises two inclined hole flow guide parts positioned at two ends; an inclined hole outlet is formed in the middle of the inclined hole flow guiding part, and the direction of the inclined hole outlet is obliquely upward along a first direction parallel to the flow guiding assembly; the inclined hole diversion part comprises two inclined hole sub diversion parts which are positioned at two sides of the inclined hole exit along a second direction, and the second direction is mutually perpendicular to the first direction and is perpendicular to the thickness direction of the diversion component;
the flow limiting assembly comprises two flow limiting structures, and the flow limiting structures are arranged on the outer sides of the inclined hole diversion parts along the first direction.
Optionally, the size of the flow restricting structure along the second direction gradually decreases with gradually moving away from the inclined hole diversion part along the first direction.
Optionally, the flow limiting structure is hexahedral, and includes a first surface and a second surface which are oppositely arranged, a third surface and a fourth surface which are oppositely arranged, and a fifth surface and a sixth surface which are oppositely arranged;
the first surface is connected with the body of the cover body;
the fourth surface is closer to the inclined hole sub-flow guiding part than the third surface, and the fourth surface is connected with the inclined hole sub-flow guiding part;
the fifth surface is closer to the central axes of the two inclined hole flow guide parts than the sixth surface, and an included angle between the fifth surface and a plane where the body of the cover body is located is not larger than 90 degrees.
Optionally, the second surface is trapezoidal, including top edge, base and hypotenuse, the length of top edge is less than the length of base, the hypotenuse is close to two the axis of inclined hole water conservancy diversion portion, the base with inclined hole water conservancy diversion portion connects.
Optionally, the flow limiting assembly further includes a connection structure, where the connection structure is used to connect two ends of the flow limiting structure away from the inclined hole diversion portion.
Optionally, the dimension of the flow restricting structure along the second direction is constant as it gradually moves away from the inclined hole deflector along the first direction.
Optionally, the cover comprises at least one of:
the guide assembly further comprises a straight hole guide part positioned between the two inclined hole guide parts, and the straight hole guide part is provided with a plurality of straight hole outlet openings;
the two flow limiting assemblies are symmetrically arranged about the central axes of the two inclined hole flow guiding parts;
the two flow limiting structures are symmetrically arranged about the central axes of the two inclined hole diversion parts;
the flow limiting structure and the inclined hole diversion part are integrally formed;
the thickness of the flow limiting structure is not less than 2 mm.
In a second aspect, an embodiment of the present application provides an evaporation source device, including a plurality of evaporation sources, the evaporation source including a nozzle assembly and the cover of the first aspect;
the cover body is used for being arranged on one side of the nozzle assembly, and the nozzle assembly comprises two inclined hole nozzles positioned at two ends and a plurality of straight hole nozzles positioned between the two inclined hole nozzles; the inclined hole nozzle is communicated with the inclined hole exit opening of the cover body, and the straight hole nozzle is communicated with the straight hole exit opening of the cover body.
Optionally, the evaporation source device comprises at least one of the following:
the evaporation source also comprises a crucible and a heat insulation plate; the crucible is arranged on one side of the nozzle assembly, which is far away from the cover body, and comprises a plurality of injection holes, wherein one injection hole is communicated with one inclined hole nozzle, and one injection hole is communicated with one straight hole nozzle; the heat insulation plate surrounds the periphery of the nozzle assembly;
the evaporation source device further comprises a mounting assembly and a heating assembly, wherein the mounting assembly comprises a plurality of embedded grooves, and the evaporation source is placed in the embedded grooves; the heating component is arranged on the outer side of the mounting component and is used for heating the crucible of the evaporation source.
In a third aspect, an embodiment of the present application provides an evaporation apparatus, including the evaporation source device according to the second aspect.
The technical scheme provided by the embodiment of the application has the beneficial technical effects that:
through set up the current limiting structure in the outside of inclined hole son water conservancy diversion portion, the current limiting structure can do benefit to the restriction from the direction of inclined hole outlet spun coating by vaporization air current for coating by vaporization air current skew upward flow, and the current limiting structure can restrict coating by vaporization air current flow to the both sides of lid and flow, be favorable to avoiding causing the peripheral accumulation of coating by vaporization material on the second direction of lid because of coating by vaporization air current flows to the both sides of lid along the second direction, and then can do benefit to as far as avoiding coating by vaporization material to take place to contact with the lid, thereby be favorable to reducing the evaporation source device and appear the unusual probability of temperature, and can be favorable to guaranteeing the normal operating of production line, can improve productivity and yield and can promote the utilization ratio of coating by vaporization material.
In summary, the application can limit the direction of vapor deposition air flow and reduce or avoid the accumulation of vapor deposition materials on the periphery of the cover body by improving the cover body, namely adding the flow limiting assembly, thereby being beneficial to avoiding the abnormal temperature condition of the evaporation source device, reducing the production risk, ensuring the yield ratio and increasing the income.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The foregoing and/or additional aspects and advantages of the application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is a schematic top view of a cover according to an embodiment of the present application;
FIG. 2 is a schematic view of the left-hand structure of FIG. 1;
FIG. 3 is a schematic structural diagram of a current limiting structure according to an embodiment of the present application;
FIG. 4 is a schematic view illustrating an included angle between the fifth surface and a plane of the body of the cover in FIG. 3;
FIG. 5 is a schematic structural view of a current limiting assembly according to an embodiment of the present application;
FIG. 6 is a schematic diagram of another flow restrictor assembly according to an embodiment of the present application;
FIG. 7 is a schematic view of a flow restrictor assembly according to an embodiment of the present application;
FIG. 8 is a schematic top view of a cover and heat shield assembly according to an embodiment of the present application;
FIG. 9 is a schematic cross-sectional view of a crucible and nozzle assembly according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of an evaporation source device according to an embodiment of the present application.
Reference numerals illustrate:
1-a cover body;
11-a flow guiding assembly; 111-inclined hole guide parts; 1111-inclined hole diversion part; 1112-inclined hole exit; 112-straight hole flow guide; 1121-a straight hole exit;
12-a flow restricting assembly; 121-a flow restricting structure; 1211-a first side; 1212-a second face; 1212 a-top edge; 1212 b-bottom edge; 1212 c-beveled edge; 1213-a third face; 1214-fourth sides; 1215-fifth side; 1216-sixth face; 122-connection structure;
a 2-nozzle assembly; 21-a canted hole nozzle; 22-straight orifice nozzles;
3-crucible; 31-injection holes;
4-heat insulation board;
100-evaporating source device; 101-evaporating source; 102-mounting an assembly; 103-heating assembly.
Detailed Description
Embodiments of the present application are described below with reference to the drawings in the present application. It should be understood that the embodiments described below with reference to the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and the technical solutions of the embodiments of the present application are not limited.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless expressly stated otherwise, as understood by those skilled in the art. It should be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of other features, information, data, steps, operations, elements, components, and/or groups thereof, all of which may be included in the present application. The term "and/or" as used herein refers to at least one of the items defined by the term, e.g., "a and/or B" may be implemented as "a", or as "B", or as "a and B".
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail with reference to the accompanying drawings.
The development idea of the application comprises the following steps: at present, the problem that the accumulated evaporation material is easy to have abnormal temperature after contacting with the cover body of the evaporation source device is caused by the gradual accumulation of the evaporation material on the heat insulation plate of the evaporation source device due to the thicker hole transport layer and longer evaporation time of the organic light-emitting functional layer. Specifically, in the existing evaporation source device, because the vapor deposition gas sprayed from the inclined hole outlet flows to two sides of the cover body, the vapor deposition material is accumulated continuously on two sides of the cover body, when the production time is longer and the vapor deposition material is accumulated more and more, the vapor deposition material is contacted with the cover body, so that the evaporation source device has abnormal temperature, and further the problems of downtime of a production line, reduction of productivity and yield, waste of the vapor deposition material and the like are caused.
The application provides an evaporation source device, a cover body of the evaporation source device and evaporation source equipment, and aims to solve the technical problems in the prior art.
The following describes the technical scheme of the present application and how the technical scheme of the present application solves the above technical problems in detail with specific embodiments. It should be noted that the following embodiments may be referred to, or combined with each other, and the description will not be repeated for the same terms, similar features, similar implementation steps, and the like in different embodiments.
The embodiment of the application provides a cover body 1 of an evaporation source device 100, the evaporation source device 100 is used for evaporating an organic light-emitting functional layer, a schematic structural diagram of the cover body 1 is shown in fig. 1 to 7, and the cover body comprises: a flow directing assembly 11 and two flow restricting assemblies 12.
The diversion assembly 11 comprises two inclined hole diversion parts 111 positioned at two ends; a slant hole exit 1112 is formed in the middle of the slant hole guiding part 111, and the direction of the slant hole exit 1112 is inclined upwards along a first direction parallel to the guiding component 11; the inclined hole guide portion 111 includes two inclined hole sub-guide portions 1111 located at both sides of the inclined hole exit 1112 along a second direction, which is perpendicular to the first direction and perpendicular to the thickness direction of the guide assembly 11.
The flow-limiting assembly 12 includes two flow-limiting structures 121, and the flow-limiting structures 121 are disposed outside the inclined hole sub-flow-guiding portion 1111 along the first direction.
In this embodiment, the flow limiting structure 121 is disposed on the outer side of the inclined hole diversion portion 1111, so that the flow limiting structure 121 can be beneficial to limiting the direction of vapor deposition air flow sprayed from the inclined hole outlet 1112, so that the vapor deposition air flow can flow obliquely upwards, and the flow limiting structure 121 can limit the flow of vapor deposition air to two sides of the cover body 1, which is beneficial to avoiding the peripheral accumulation of vapor deposition material in the second direction of the cover body 1 caused by the flow of vapor deposition air flow to two sides of the cover body 1 along the second direction, so that the contact between the vapor deposition material and the cover body 1 can be avoided as much as possible, thereby being beneficial to reducing the probability of abnormal temperature of the evaporation source device 100, ensuring the normal operation of the production line, improving the productivity and yield and improving the utilization rate of the vapor deposition material.
In summary, the present application improves the cover 1, i.e. increases the flow limiting component 12, thereby limiting the direction of vapor deposition airflow, and reducing or avoiding accumulation of vapor deposition material around the cover 1, so as to be beneficial to avoiding abnormal temperature of the evaporation source device 100, reducing production risk, ensuring yield ratio and increasing income.
It should be noted that, as shown in fig. 2, the two inclined hole sub-flow guiding portions 1111 are located at two sides of the inclined hole exit 1112 along the second direction, that is, the inclined hole sub-flow guiding portions 1111 may not block the evaporation gas flow from exiting from the inclined hole exit 1112, which may be beneficial to ensure the exiting of all evaporation gas flows, thereby improving the utilization rate of the evaporation material and reducing the cost.
Alternatively, the size of the flow restricting structure 121 in the second direction gradually decreases as it gradually moves away from the inclined hole sub-guide 1111 in the first direction.
In this embodiment, the size of the flow limiting structure 121 along the second direction gradually decreases along with gradually moving away from the inclined hole diversion portion 1111 along the first direction, so that the flow limiting structure 121 can ensure that the evaporation gas flow is limited to flow along the second direction to both sides of the cover 1, and simultaneously can allow the evaporation gas flow to pass through to a greater extent, which can facilitate improving the utilization rate of the evaporation material and further can facilitate reducing the cost.
Alternatively, the size of the flow restricting structure 121 in the second direction is constant as it gradually moves away from the inclined hole sub-flow guide 1111 in the first direction.
In this embodiment, the orthographic projection of the current limiting structure 121 on the body of the cover 1 is rectangular, which is beneficial to preparing the current limiting structure 121 and reducing the difficulty of the preparation process.
Alternatively, as shown in fig. 3 and 4, the flow restricting structure 121 is hexahedral, including a first face 1211 and a second face 1212 disposed opposite each other, a third face 1213 and a fourth face 1214 disposed opposite each other, and a fifth face 1215 and a sixth face 1216 disposed opposite each other; the first face 1211 is connected to the body of the cover 1; fourth surface 1214 is closer to inclined hole sub-guide section 1111 than third surface 1213, and fourth surface 1214 is connected to inclined hole sub-guide section 1111; the fifth surface 1215 is closer to the central axes of the two inclined hole guide parts 111 than the sixth surface 1216, and the included angle A between the fifth surface 1215 and the plane of the body of the cover body 1 is not more than 90 degrees.
In this embodiment, the vapor deposition gas flows along the guiding direction of the fifth surface 1215, and the included angle a between the fifth surface 1215 of the flow limiting structure 121 and the plane of the body of the cover 1 is not greater than 90 degrees, which is beneficial for the vapor deposition gas to flow upwards; and because the included angle a is different, that is, the angle of inclination of the fifth surface 1215 is different, the vapor deposition position of vapor deposition air flow can be adjusted, and further, the flatness of the film thickness can be adjusted, and the optical performance of the optical device can be improved.
Note that, when the first surface 1211 is connected to the body of the cover 1, the first surface 1211 may be attached to the body of the cover 1.
Alternatively, as shown in fig. 5, the second face 1212 is trapezoidal and includes a top edge 1212a, a bottom edge 1212b, and a bevel edge 1212c, the top edge 1212a being shorter than the bottom edge 1212b, the bevel edge 1212c being adjacent to the central axis of the two inclined hole guides 111, the bottom edge 1212b being connected to the inclined hole sub-guides 1111.
In this embodiment, the second surface 1212 is trapezoidal, wherein the bottom edge 1212b is connected to the inclined hole guiding portion 1111, that is, the included angle between the inclined edge 1212c and the bottom edge 1212b is not greater than 90 degrees, which is beneficial to blocking the vapor deposition airflow flowing around the two sides of the cover 1, and is beneficial to more vapor deposition airflows passing therethrough, so as to improve the utilization rate of the vapor deposition material.
Optionally, the flow restrictor assembly 12 further comprises a connecting structure 122, the connecting structure 122 being configured to connect two ends of the flow restrictor structure 121 remote from the inclined bore sub-flow guide 1111.
In this embodiment, the connection structures 122 are disposed at two ends of the two flow limiting structures 121 far away from the inclined hole diversion portion 1111, so as to further block the vapor deposition air flow from flowing along the front side of the cover body 1 along the first direction, and further facilitate avoiding the vapor deposition air flow from accumulating on the front side periphery of the cover body 1, so that the flow limiting assembly 12 provided by the application can facilitate limiting the vapor deposition air flow from accumulating on the front side and the two side periphery of the cover body 1, thereby ensuring the normal temperature of the evaporation source device 100 and ensuring the normal operation of the production line, and further improving the production efficiency.
Alternatively, as shown in fig. 6 and 7, the second face 1212 is trapezoidal and includes a top edge 1212a, a bottom edge 1212b, and a bevel edge 1212c, the length of the top edge 1212a is smaller than the length of the bottom edge 1212b, the bevel edge 1212c is near the central axis of the two inclined hole flow directors 111, the top edge 1212a is connected to the inclined hole sub-flow directors 1111, and the two flow restricting structures 121 are connected away from the two ends of the inclined hole sub-flow directors 1111.
In this embodiment, the second surface 1212 is trapezoidal, and the top edge 1212a is connected to the inclined hole guiding portion 1111, that is, the angle between the inclined edge 1212c and the bottom edge 1212b is not smaller than 90 degrees, which is beneficial to increasing the range of blocking the flow of evaporation gas to the periphery of the cover 1, so as to ensure the normal temperature of the evaporation source device 100 in the evaporation process. And two ends of the two flow limiting structures 121 far away from the inclined hole diversion part 1111 are connected, and can be connected through a connecting piece or directly connected, so that the range of blocking the flow of evaporation gas to the periphery of the cover body 1 can be further increased, and the temperature of the evaporation source device 100 in the evaporation process is further ensured to be normal.
Optionally, as shown in fig. 1, the flow guiding assembly 11 further includes a straight hole flow guiding portion 112 located between the two inclined hole flow guiding portions 111, and the straight hole flow guiding portion 112 is provided with a plurality of straight hole exit ports 1121.
In this embodiment, by providing the straight hole outlet 1121 and the inclined hole outlet 1112, vapor deposition can be performed at different positions by the vapor deposition gas flow, and uniformity of the film thickness of vapor deposition can be ensured.
Alternatively, the two flow restricting assemblies 12 are symmetrically disposed about the central axes of the two inclined hole flow directors 111.
In this embodiment, the two flow-limiting assemblies 12 are symmetrically disposed about the central axes of the two inclined hole flow-guiding portions 111, so that the flow-limiting assemblies 12 guide the vapor deposition of the vapor deposition airflow to be symmetrical in position, which is beneficial to the flatness of the film thickness of the vapor deposition.
Optionally, the two current limiting assemblies 12 may be asymmetrically disposed about the central axes of the two inclined hole diversion portions 111, and the current limiting assemblies are disposed according to the requirement of evaporation according to actual needs; specifically, the shape or angle of installation, etc., of both flow restricting assemblies 12 may be different.
Optionally, the two flow restricting structures 121 are symmetrically disposed about the central axis of the two inclined bore sub-flow guides 1111.
In this embodiment, the two flow limiting structures 121 are symmetrically disposed about the central axes of the two inclined hole sub-flow guiding portions 1111, so that the flow limiting structures 121 can guide the vapor deposition of the vapor deposition airflow to be symmetrical in position, and can be beneficial to uniformity of the film thickness of the vapor deposition.
Optionally, the flow restricting structure 121 and the inclined bore sub-flow guide 1111 are integrally formed.
In this embodiment, by integrally providing the flow limiting structure 121 and the inclined hole diversion portion 1111, the process can be simplified, and the overall stability of the cover 1 can be enhanced.
Alternatively, the thickness of the flow restricting structure 121 is not less than 2 millimeters.
In this embodiment, the thickness of the current limiting structure 121 is not less than 2 mm, so that the current limiting structure 121 can prevent evaporation gas from flowing to two sides of the cover 1 and accumulating, and further can ensure that the temperature of the evaporation source device 100 is normal.
Based on the same inventive concept, the present embodiment provides an evaporation source apparatus 100, and as shown in fig. 8 to 10, the evaporation source apparatus 100 includes a plurality of evaporation sources 101, and the evaporation sources 101 include a nozzle assembly 2 and a cap 1 provided in the above embodiment.
The cover 1 is arranged on one side of the nozzle assembly 2, and the nozzle assembly 2 comprises two inclined hole nozzles 21 positioned at two ends and a plurality of straight hole nozzles 22 positioned between the two inclined hole nozzles 21; the inclined hole nozzle 21 communicates with the inclined hole outlet 1112 of the cover 1, and the straight hole nozzle 22 communicates with the straight hole outlet 1121 of the cover 1.
In this embodiment, by providing the inclined hole nozzle 21 to communicate with the inclined hole outlet 1112 of the cover 1, and the straight hole nozzle 22 to communicate with the straight hole outlet 1121 of the cover 1, the spray assembly 2 and the cover 1 both have a flow guiding effect on vapor deposition air flow, which can facilitate uniformity of vapor deposition.
It should be noted that, the evaporation source device 100 includes a plurality of evaporation sources 101, and the evaporation sources 101 include the cover 1 provided in the above embodiment, so that the beneficial effects of the evaporation source device 100 also include the beneficial effects of the cover 1, which are not described herein.
Optionally, the evaporation source 101 further comprises a crucible 3 and a heat shield 4; the crucible 3 is arranged on one side of the nozzle assembly 2 away from the cover body 1, the crucible 3 comprises a plurality of injection holes 31, one injection hole 31 is communicated with one inclined hole nozzle 21, and one injection hole 31 is communicated with one straight hole nozzle 22; the heat shield 4 is disposed around the perimeter of the nozzle assembly 2.
In this embodiment, the vapor deposition gas flows through the injection hole 31 of the crucible 3, the inclined hole nozzle 21 or the straight hole nozzle 22 of the nozzle assembly 2, and the inclined hole injection port 1112 or the straight hole injection port 1121 of the cover 1 in this order, which can be advantageous for ensuring uniformity of vapor deposition. And the heat shield 4 is disposed around the periphery of the nozzle assembly 2, the flow restricting member 12 of the cover 1 can facilitate restricting the accumulation of vapor deposition gas flow on the heat shield 4.
Optionally, the evaporation source device 100 further includes a mounting assembly 102 and a heating assembly 103, the mounting assembly 102 includes a plurality of embedded grooves, and the evaporation source 101 is placed in the embedded grooves; the heating assembly 103 is provided outside the mounting assembly 102 for heating the crucible 3 of the evaporation source 101.
In this embodiment, the mounting assembly 102 includes a plurality of embedded grooves, and the evaporation source 101 is placed in the embedded grooves, so that the evaporation efficiency can be improved by providing a plurality of evaporation sources 101. The heating unit 103 heats the crucible 3 of the evaporation source 101 to evaporate the material to be evaporated into atoms or molecules, that is, vapor deposition gas flow.
Based on the same inventive concept, the embodiment of the present application provides an evaporation apparatus including the evaporation source device 100 provided in the above embodiment.
In this embodiment, the evaporation apparatus includes the evaporation source device 100 provided in the foregoing embodiment, and the beneficial effects of the evaporation apparatus also include the beneficial effects of the evaporation source device 100, which are not described herein again.
By applying the embodiment of the application, at least the following beneficial effects can be realized:
1. according to the embodiment of the application, the flow limiting structure is arranged on the outer side of the inclined hole diversion part, so that the flow limiting structure can be beneficial to limiting the direction of vapor deposition air flow sprayed out from the inclined hole outlet, the vapor deposition air flow can flow obliquely upwards, the flow limiting structure can be beneficial to limiting the flow of the vapor deposition air to the two sides of the cover body, the accumulation of vapor deposition materials on the periphery of the cover body caused by the flow of the vapor deposition air to the two sides of the cover body can be avoided, the contact of the vapor deposition materials and the cover body can be avoided, the abnormal temperature condition of the evaporation source device can be avoided, the normal operation of a production line can be ensured, the productivity and the yield can be improved, and the utilization rate of the vapor deposition materials can be improved. According to the evaporation source device, the cover body is improved, namely the flow limiting component is added, so that the direction of vapor deposition airflow is changed, the accumulation of vapor deposition materials on the periphery of the cover body is reduced or avoided, the situation that the temperature of the evaporation source device is abnormal can be avoided, the production risk can be reduced, the yield ratio can be guaranteed, and the income can be increased.
2. According to the embodiment of the application, the evaporation position of the evaporation airflow can be adjusted by setting the difference of the inclination angles of the fifth surfaces, so that the flatness of the film thickness can be adjusted, and the optical performance of the optical device can be improved.
3. According to the embodiment of the application, the connecting structures are arranged at the two ends of the two flow limiting structures, which are far away from the inclined hole sub-flow guiding part, so that the flow of vapor deposition gas to the front side of the cover body is further blocked, and further the vapor deposition gas is prevented from accumulating at the periphery of the front side of the cover body, so that the flow limiting assembly can be beneficial to limiting the vapor deposition gas to accumulate at the periphery of the cover body, the temperature of the evaporation source device can be ensured to be normal, the normal operation of a production line can be ensured, and the production efficiency can be improved.
4. According to the embodiment of the application, the included angle between the inclined edge and the bottom edge is not smaller than 90 degrees, so that the range of blocking the evaporation gas from flowing to the periphery of the cover body is increased, and the temperature of the evaporation source device in the evaporation process can be ensured to be normal. And two ends of the two flow limiting structures, which are far away from the inclined hole diversion part, are connected through a connecting piece or directly connected, so that the range of blocking the peripheral flow of vapor deposition gas to the cover body can be further increased, and the temperature of the evaporation source device in the vapor deposition process is further ensured to be normal.
Those of skill in the art will appreciate that the various operations, methods, steps in the flow, acts, schemes, and alternatives discussed in the present application may be alternated, altered, combined, or eliminated. Further, other steps, means, or steps in a process having various operations, methods, or procedures discussed herein may be alternated, altered, rearranged, disassembled, combined, or eliminated. Further, steps, measures, schemes in the prior art with various operations, methods, flows disclosed in the present application may also be alternated, altered, rearranged, decomposed, combined, or deleted.
In the description of the present application, directions or positional relationships indicated by words such as "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on exemplary directions or positional relationships shown in the drawings, are for convenience of description or simplification of describing embodiments of the present application, and do not indicate or imply that the devices or components referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the order in which the steps are performed is not limited to the order indicated by the arrows. In some implementations of embodiments of the application, the steps in each flow may be performed in other orders as desired, unless explicitly stated herein. Moreover, some or all of the steps in the flowcharts may include multiple sub-steps or multiple stages based on the actual implementation scenario. Some or all of the sub-steps or stages may be performed at the same time, or may be performed at different times, where the execution sequence of the sub-steps or stages may be flexibly configured according to the requirements, which is not limited by the embodiment of the present application.
The foregoing is only a part of the embodiments of the present application, and it should be noted that, for those skilled in the art, other similar implementation means based on the technical idea of the present application may be adopted without departing from the technical idea of the solution of the present application, which is also within the protection scope of the embodiments of the present application.
Claims (6)
1. A cover of an evaporation source device for evaporating an organic light-emitting functional layer, the cover comprising: the flow guide assembly and the two flow limiting assemblies;
the flow guide assembly comprises two inclined hole flow guide parts positioned at two ends; an inclined hole outlet is formed in the middle of the inclined hole flow guiding part, and the direction of the inclined hole outlet is obliquely upward along a first direction parallel to the flow guiding assembly; the inclined hole diversion part comprises two inclined hole sub diversion parts which are positioned at two sides of the inclined hole exit along a second direction, and the second direction is mutually perpendicular to the first direction and is perpendicular to the thickness direction of the diversion component;
the flow limiting assembly comprises two flow limiting structures, and the flow limiting structures are arranged on the outer sides of the inclined hole diversion parts along the first direction;
the flow limiting structure is hexahedral and comprises a first surface and a second surface which are oppositely arranged, a third surface and a fourth surface which are oppositely arranged, and a fifth surface and a sixth surface which are oppositely arranged; the first surface is connected with the body of the cover body; the fourth surface is closer to the inclined hole sub-flow guiding part than the third surface, and the fourth surface is connected with the inclined hole sub-flow guiding part; the fifth surface is closer to the central axes of the two inclined hole flow guide parts than the sixth surface, and the included angle between the fifth surface and the plane of the body of the cover body is not more than 90 degrees;
the size of the flow limiting structure along the second direction gradually decreases along the first direction gradually away from the inclined hole diversion part;
the second surface is trapezoid and comprises a top edge, a bottom edge and a bevel edge, the length of the top edge is smaller than that of the bottom edge, the bevel edge is close to the central axes of the two inclined hole diversion parts, and the bottom edge is connected with the inclined hole diversion parts.
2. The cover of claim 1, wherein the flow restricting assembly further comprises a connecting structure for connecting two ends of the flow restricting structure away from the inclined hole deflector.
3. The cover of claim 1, comprising at least one of:
the guide assembly further comprises a straight hole guide part positioned between the two inclined hole guide parts, and the straight hole guide part is provided with a plurality of straight hole outlet openings;
the two flow limiting assemblies are symmetrically arranged about the central axes of the two inclined hole flow guiding parts;
the two flow limiting structures are symmetrically arranged about the central axes of the two inclined hole diversion parts;
the flow limiting structure and the inclined hole diversion part are integrally formed;
the thickness of the flow limiting structure is not less than 2 mm.
4. An evaporation source device comprising a plurality of evaporation sources, the evaporation sources comprising a nozzle assembly and the cap of any one of claims 1-3;
the cover body is used for being arranged on one side of the nozzle assembly, and the nozzle assembly comprises two inclined hole nozzles positioned at two ends and a plurality of straight hole nozzles positioned between the two inclined hole nozzles; the inclined hole nozzle is communicated with the inclined hole exit opening of the cover body, and the straight hole nozzle is communicated with the straight hole exit opening of the cover body.
5. The evaporation source device according to claim 4, comprising at least one of:
the evaporation source further comprises a crucible and a heat insulation plate, the crucible is arranged on one side, far away from the cover body, of the nozzle assembly, the crucible comprises a plurality of spraying holes, one spraying hole is communicated with one inclined hole nozzle, and one spraying hole is communicated with one straight hole nozzle; the heat insulation plate surrounds the periphery of the nozzle assembly;
the evaporation source device further comprises a mounting assembly and a heating assembly, the mounting assembly comprises a plurality of embedded grooves, the evaporation source is placed in the embedded grooves, and the heating assembly is arranged on the outer side of the mounting assembly and is used for heating the crucible of the evaporation source.
6. An evaporation apparatus comprising the evaporation source device according to any one of claims 4 to 5.
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| CN202210728035.1A CN114875366B (en) | 2022-06-23 | 2022-06-23 | Evaporation source device, cover body thereof and evaporation source equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210728035.1A CN114875366B (en) | 2022-06-23 | 2022-06-23 | Evaporation source device, cover body thereof and evaporation source equipment |
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| CN114875366B true CN114875366B (en) | 2023-11-24 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110057604A (en) * | 2009-11-24 | 2011-06-01 | 한국과학기술연구원 | Vacuum evaporating sources with heaters deposited directly on the surface of crucible, the method of manufacturing and evaporator |
| CN102168250A (en) * | 2010-02-26 | 2011-08-31 | 绿阳光电股份有限公司 | Evaporation source device |
| JP2014070969A (en) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | Rate sensor, linear source and vapor deposition device |
| CN107299321A (en) * | 2017-07-28 | 2017-10-27 | 武汉华星光电半导体显示技术有限公司 | Evaporation source and evaporator |
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- 2022-06-23 CN CN202210728035.1A patent/CN114875366B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20110057604A (en) * | 2009-11-24 | 2011-06-01 | 한국과학기술연구원 | Vacuum evaporating sources with heaters deposited directly on the surface of crucible, the method of manufacturing and evaporator |
| CN102168250A (en) * | 2010-02-26 | 2011-08-31 | 绿阳光电股份有限公司 | Evaporation source device |
| JP2014070969A (en) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | Rate sensor, linear source and vapor deposition device |
| CN107299321A (en) * | 2017-07-28 | 2017-10-27 | 武汉华星光电半导体显示技术有限公司 | Evaporation source and evaporator |
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| CN114875366A (en) | 2022-08-09 |
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