CN114864512B - 基于htcc的k波段射频微系统三维收发组件 - Google Patents
基于htcc的k波段射频微系统三维收发组件 Download PDFInfo
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- CN114864512B CN114864512B CN202210515104.0A CN202210515104A CN114864512B CN 114864512 B CN114864512 B CN 114864512B CN 202210515104 A CN202210515104 A CN 202210515104A CN 114864512 B CN114864512 B CN 114864512B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
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- Ceramic Engineering (AREA)
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CN202210515104.0A CN114864512B (zh) | 2022-05-12 | 2022-05-12 | 基于htcc的k波段射频微系统三维收发组件 |
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CN114864512A CN114864512A (zh) | 2022-08-05 |
CN114864512B true CN114864512B (zh) | 2023-06-13 |
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Citations (1)
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US11152707B1 (en) * | 2020-07-02 | 2021-10-19 | International Business Machines Corporation | Fast radio frequency package |
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Publication number | Priority date | Publication date | Assignee | Title |
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US20060071316A1 (en) * | 2004-09-24 | 2006-04-06 | Emory Garth | Three-dimensional stack manufacture for integrated circuit devices and method of manufacture |
CN105514566B (zh) * | 2015-12-07 | 2018-02-23 | 中国电子科技集团公司第十研究所 | 毫米波瓦式相控阵天线tr组件 |
CN110034095B (zh) * | 2019-02-28 | 2021-01-01 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | 三维堆叠封装集成tr模组 |
CN211831630U (zh) * | 2020-03-21 | 2020-10-30 | 宁波吉品科技有限公司 | 散热式射频测试平台 |
CN211829444U (zh) * | 2020-04-23 | 2020-10-30 | 宁波吉品科技有限公司 | 一种高密度芯片封装盒 |
CN111785691B (zh) * | 2020-05-13 | 2022-03-11 | 中国电子科技集团公司第五十五研究所 | 一种射频微系统三维封装外壳结构以及制作方法 |
CN112019229A (zh) * | 2020-08-27 | 2020-12-01 | 成都天锐星通科技有限公司 | 一种k频段瓦片式金属封装组件 |
CN112992887B (zh) * | 2021-02-05 | 2023-06-16 | 中国船舶重工集团公司第七二三研究所 | 一种双层堆叠微互联高密度集成组件 |
CN113451732B (zh) * | 2021-08-30 | 2021-11-23 | 成都雷电微力科技股份有限公司 | 一种新型气密瓦片式相控阵天线 |
CN113838845B (zh) * | 2021-11-26 | 2022-02-11 | 成都雷电微力科技股份有限公司 | 一种基于三维堆叠气密封装的tr组件及组装方法 |
CN114334865B (zh) * | 2022-03-07 | 2022-07-26 | 成都雷电微力科技股份有限公司 | 一种三维堆叠大功率tr气密封装组件 |
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US11152707B1 (en) * | 2020-07-02 | 2021-10-19 | International Business Machines Corporation | Fast radio frequency package |
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Effective date of registration: 20230109 Address after: No. 113, Gongye street, Ningjin County, Xingtai City, Hebei Province 055550 Applicant after: HEBEI DINGCI ELECTRONIC TECHNOLOGY CO.,LTD. Address before: 611730 1st floor, building 1, No. 6, Kexin Road, high tech Zone (West District), Chengdu, Sichuan Applicant before: CHENGDU RAXIO SHENGTONG ELECTRONIC TECHNOLOGY CO.,LTD. Applicant before: HEBEI DINGCI ELECTRONIC TECHNOLOGY CO.,LTD. Applicant before: Shijiazhuang fengci Electronic Technology Co.,Ltd. |
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Effective date of registration: 20230522 Address after: 050025 22b06, No. 21, zone 2, future science and Technology City, No. 165, Yuxiang street, Luancheng District, Shijiazhuang City, Hebei Province Applicant after: Shijiazhuang fengci Electronic Technology Co.,Ltd. Address before: No. 113, Gongye street, Ningjin County, Xingtai City, Hebei Province 055550 Applicant before: HEBEI DINGCI ELECTRONIC TECHNOLOGY CO.,LTD. |
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Inventor after: Shu Shiwei Inventor after: Li Xiaosa Inventor after: Lai Qiuliang Inventor before: Shu Shiwei Inventor before: Li Xiaosa Inventor before: Lai Qiuliang |