CN114859636A - Manufacturing method of heat dissipation structure, heat dissipation structure and projection equipment - Google Patents

Abstract

A manufacturing method of a heat dissipation structure, the heat dissipation structure and projection equipment are provided, and the manufacturing method comprises the following steps: setting target brightness of the light-emitting component; acquiring the corresponding relation between the brightness and the reference temperature of the light-emitting component when the heat dissipation structure is not arranged; determining target temperature and thermal power corresponding to the light-emitting component according to the corresponding relation and the target brightness; manufacturing a heat dissipation structure according to the target temperature and the thermal power of the light emitting assembly; the radiating structure comprises radiating fins which are manufactured into an integrated structure and comprise a plurality of radiating parts, and the radiating area of each radiating part is calculated according to the target temperature and the thermal power of the light-emitting component; the heat dissipation structure manufactured by the method has high heat dissipation efficiency and low cost.

Description

Manufacturing method of heat dissipation structure, heat dissipation structure and projection equipment

Technical Field

The disclosure relates to the field of projection technologies, and in particular, to a manufacturing method of a heat dissipation structure, a heat dissipation structure and a projection device.

Background

A projector is a device that projects an image or video onto a curtain, and is widely used in homes, offices, schools, and entertainment venues. Because the temperature has obvious influence on the luminous efficiency of a Light Emitting Diode (LED) and the brightness is an important index for evaluating the quality of a projector, the heat dissipation structure of the projector needs to be reasonably designed to improve the luminous efficiency of the LED so as to achieve the aim of improving the brightness.

Disclosure of Invention

The application discloses a manufacturing method of a heat dissipation structure, the heat dissipation structure and projection equipment.

In a first aspect, the present disclosure provides a method for manufacturing a heat dissipation structure, including: setting target brightness of the light-emitting component; acquiring the corresponding relation between the brightness of the light-emitting component and the reference temperature when the heat dissipation structure is not arranged; determining a target temperature and thermal power corresponding to the light-emitting component according to the corresponding relation and the target brightness; manufacturing the heat dissipation structure according to the target temperature and the thermal power of the light emitting assembly; the heat dissipation structure comprises heat dissipation fins, the heat dissipation fins are made into an integrated structure and comprise a plurality of heat dissipation parts, and the heat dissipation area of each heat dissipation part is calculated according to the target temperature and the heat power of the light emitting assembly.

Compared with the existing radiator manufacturing method, the method considers the influence of the target temperature on the brightness of the light-emitting component before manufacturing, takes the target temperature as a reference variable, obtains the target temperature through the corresponding relation between the brightness and the temperature, combines the target temperature and the thermal power of the light-emitting component, and has higher calculation accuracy.

In a second aspect, the present disclosure further provides a heat dissipation structure, where the heat dissipation structure is used to dissipate heat of a light emitting component, the heat dissipation structure includes heat dissipation fins, the heat dissipation fins are of an integrated structure, the heat dissipation fins include a plurality of heat dissipation portions, and heat dissipation areas of the plurality of heat dissipation portions are the same or not all the same; and calculating the heat dissipation area of each heat dissipation part according to the target temperature and the thermal power of the light emitting assembly.

The radiating fins of the integrated structure are designed into a plurality of radiating parts, and the radiating area of each radiating part is calculated according to the heat required to be radiated by the light-emitting component and the target temperature, so that the fins can be reasonably divided, and each radiating part can provide a proper radiating area to radiate the light-emitting component. Compared with the existing heat dissipation mode, the mode of carrying out accurate heat dissipation through different heat dissipation parts can have higher heat dissipation efficiency; and the mode of dividing the heat dissipation part on the integrated heat dissipation fins can ensure that the heat dissipation structure has more compact layout, and the manufacturing cost of the heat dissipation structure can be reduced. Meanwhile, the heat dissipation areas of the plurality of heat dissipation parts can be set to be the same or not completely the same according to the heat dissipation requirements of the light-emitting assembly, so that the redundancy of the heat dissipation performance can be avoided, and the size and the cost can be reduced.

In a third aspect, the present disclosure further provides a projection apparatus, including a housing, a light emitting device, and the heat dissipation structure as described in any embodiment of the second aspect, where the light emitting device and the heat dissipation structure are accommodated in the housing, and the heat dissipation structure is configured to dissipate heat from the light emitting device.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

FIG. 1 is a schematic diagram of a projection apparatus according to an embodiment;

FIG. 2 is a schematic diagram of a structure within a projection device, according to one embodiment;

FIG. 3 is a schematic structural diagram of a heat dissipation structure according to an embodiment;

FIG. 4 is a schematic view of another embodiment of a heat dissipation structure;

FIG. 5 is a schematic diagram illustrating a structural division of a heat sink in an embodiment of a heat sink fin;

FIG. 6 is a schematic diagram illustrating a structural division of a heat sink in an embodiment of a heat sink fin;

FIG. 7 is a schematic diagram illustrating a structural division of a heat sink in an embodiment of a heat sink fin;

FIG. 8 is a schematic diagram illustrating a structural division of a heat sink in an embodiment of a heat sink fin;

FIG. 9 is a schematic diagram of a fan according to one embodiment;

FIG. 10 is a flow chart of a method of fabricating a heat dissipation structure according to one embodiment;

fig. 11 is a supplementary view of step S102 in the method for fabricating a heat dissipation structure according to an embodiment;

FIG. 12 is a flowchart of step S103 of a method for fabricating a heat dissipation structure according to an embodiment;

FIG. 13 is a flowchart of step S104 of a method for fabricating a heat dissipation structure according to one embodiment;

fig. 14 is a flowchart of step S1042 in the method for manufacturing the heat dissipation structure according to the embodiment.

Description of reference numerals: 100-projection device, 110-housing, 120-light emitting assembly, 130-heat dissipation structure, 140-motherboard, 141-control circuit, 142-power supply circuit, 121-light emitting element, 121A-red light source, 121B-green light source, 121C-blue light source, 121D-supplemental light source, 131-heat dissipation fin, 131A-first face, 131B-second face, 1311-heat dissipation portion, 1311A-red light dissipation portion, 1311B-green light dissipation portion, 1311C-first blue light dissipation portion, 1311D-second blue light dissipation portion, 1312-heat insulation through hole, 1312A-transverse through hole, 1312B-first longitudinal through hole, 1312C-second longitudinal through hole, 1313-connection hole, 132-heat pipe, 133-heat conduction substrate, 134-electronic refrigeration piece, 135-fan, 1351-air inlet surface, 1351A-air inlet, 1352-air outlet surface and 1352A-air outlet.

Detailed Description

Technical solutions in embodiments of the present disclosure will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present disclosure, and it is apparent that the described embodiments are only some embodiments of the present disclosure, not all embodiments. All other embodiments, which can be derived by one of ordinary skill in the art from the embodiments disclosed herein without making any creative effort, shall fall within the protection scope of the present disclosure.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

It should be noted that the terms "first", "second", and the like in the present disclosure are only used for distinguishing different devices, modules or units, and are not used for limiting the order or interdependence relationship of the functions performed by the devices, modules or units.

Fig. 1 is a schematic structural diagram of a projection apparatus 100 according to an embodiment of the present application, where the projection apparatus 100 may be selected from a long-focus projector, an ultra-short-focus projector, and the like, where the main structure of the ultra-short-focus projector is composed of a light source, a light modulation system, and a plane mirror. Light generated by the light source is modulated to form an image through a light modulation system of the projector, then is emitted to the plane reflector, and is reflected to the screen through the plane reflector, so that the function of projection is realized.

In one embodiment, referring to fig. 2, the projection apparatus 100 includes a housing 110, a light emitting device 120 and a heat dissipation structure 130, the light emitting device 120 and the heat dissipation structure 130 are accommodated in the housing 110, and the heat dissipation structure 130 is used for dissipating heat from the light emitting device 120. Specifically, the light emitting assembly 120 is a light source in the above embodiments, and the housing 110 may be made of plastic or metal, and at least includes a light outlet through which the projection apparatus 100 emits a picture to be projected. In one embodiment, the projection apparatus 100 is provided with a main board 140, the main board 140 is provided with a control circuit 141 and a power supply circuit 142, the light emitting device 120 is electrically connected to the control circuit 141 and the power supply circuit 142, and the control circuit 141 can be configured to process and receive a control signal issued by a user, and transmit the control signal to the light emitting device 120. The control signal may be a projected still/moving picture or a text message. The power supply circuit 142 may supply power to the light emitting assembly 120, and the power supply circuit 142 may include a battery, a transformer, a voltage regulator, and the like.

In one embodiment, referring to fig. 2, the light emitting assembly 120 includes a plurality of light emitting elements 121, wherein the plurality of light emitting elements 121 at least include a red light source 121A, a green light source 121B, a blue light source 121C and a supplemental light source 121D, the red light source 121A can be an LED lamp emitting red light, the green light source 121B can be an LED lamp emitting green light, and the blue light source 121C can be an LED lamp emitting blue light; the supplementary light source 121D may be a BP-LED lamp emitting blue light, which can form green light after being excited by fluorescence, thereby achieving the effect of supplementing the green light.

In one embodiment, referring to fig. 2 to 4, the heat dissipation structure 130 is connected to the light emitting device 120, the heat dissipation structure 130 is used for dissipating heat of the light emitting device 120, the heat dissipation structure 130 includes heat dissipation fins 131, the heat dissipation fins 131 are an integrated structure, the heat dissipation fins 131 include a plurality of heat dissipation portions 1311, and the heat dissipation areas of the heat dissipation portions 1311 are the same or not all the same; wherein, the heat dissipation area of each heat dissipation portion 1311 is calculated by the thermal power of the light emitting assembly 120 and the target temperature. Specifically, the heat dissipating fins 131 may be formed by a plurality of single fins, and the single fins may be made of metal, including but not limited to all aluminum, all copper, half copper and half aluminum, and copper-clad. And the dimensions of each fin may be the same, the specific dimensions of the fins may include weight, length, width, thickness, and surface area. The heat sink fin 131 may be divided into a plurality of heat sink portions 1311, and it is understood that the division may be performed by dividing the heat sink fin 131 into a plurality of at least partially connected heat sink portions 1311 by a stamping or welding process; the heat dissipation portions 1311 may be divided into only space portions, and may not be divided by a process technique.

The plurality of heat dissipation parts 1311 may be divided by calculating the amount of heat to be dissipated and the target temperature to be achieved by each light emitting member 121 of the light emitting assembly 120. Because, in the actual operation of the projection apparatus 100, the color of the emitted light, the material and the operating parameters of each light-emitting member 121 are different, so that the actually generated heat of each light-emitting member 121 is different. Without the heat dissipation structure 130, the sum of the heat generated by each light emitting element 121 is too much, the heat dissipation efficiency is low, a large amount of heat is collected inside the projection apparatus 100, which causes a high temperature, and the service life of the projection apparatus is greatly affected when the projection apparatus works in an environment with a high temperature for a long time. The purpose of connecting the heat dissipation structure 130 to the light emitting device 120 is to dissipate the heat generated by the light emitting device 120 to the surrounding air more quickly, so as to avoid over-temperature. To ensure that projection device 100 is capable of operating at a suitable temperature to ensure its operational life, a target temperature may be set. The projection apparatus 100 can operate normally at the target temperature and can have a long life span. For example, the heat dissipation fins 131 may be divided into two heat dissipation portions 1311; the red light source 121A can dissipate heat through a heat dissipating part 1311, and the heat dissipating area of the heat dissipating part 1311 can be obtained according to the heat that needs to be dissipated by the red light source 121A to reach the target temperature; another heat dissipation part 1311 may be used to dissipate heat from the green light source 121B, the blue light source 121C, and the supplemental light source 121D, and the heat dissipation area of the heat dissipation part 1311 may be obtained by the sum of the amounts of heat that the three light sources need to dissipate to reach the target temperature. Of course, in other embodiments, the number of the heat dissipation portions 1311 may also be three or four, and is not particularly limited.

The heat dissipation fins 131 of the integrated structure are designed into a plurality of heat dissipation portions 1311, and the heat dissipation area of each heat dissipation portion 1311 is calculated according to the heat quantity to be dissipated by the light emitting assembly 120 and the target temperature, so that the fins can be reasonably divided, and each heat dissipation portion 1311 can provide a proper heat dissipation area to dissipate heat of the light emitting assembly 120. Meanwhile, the heat dissipation areas of the plurality of heat dissipation portions 1311 may be set to be the same or not completely the same according to the heat dissipation requirements of the light emitting assembly 120, which may avoid redundancy of heat dissipation performance, and is beneficial to reducing the volume and reducing the cost. Compared with the existing heat dissipation mode, the mode of carrying out accurate heat dissipation through different heat dissipation parts 1311 can have higher heat dissipation efficiency; and the way of dividing the heat dissipation portion 1311 on the integrated heat dissipation fins 131 can make the heat dissipation structure 130 have a more compact layout, and can also reduce the manufacturing cost of the heat dissipation structure 130.

In one embodiment, referring to fig. 4 and 5, the heat dissipation fins 131 are formed with a plurality of insulating through holes 1312, and at least two adjacent heat dissipation portions 1311 are separated by the insulating through holes 1312. Specifically, the finstock 131 can be cuboidal in shape, including first and second opposing faces 131A, 131B, with an insulating via 1312 passing through from the first face 131A to the second face 131B. It is understood that the radiator fin 131 is formed by a plurality of individual fins arranged side by side in one direction. I.e., each fin is perpendicular to the direction, and the plurality of fins together enclose the insulating via 1312, it can be understood that the insulating via 1312 should be formed in a macroscopic manner, i.e., each fin has an opening, and the plurality of openings combine to form the insulating via 1312. For example, the number of the thermal insulation through holes 1312 may be three, i.e., a transverse through hole 1312A, a first longitudinal through hole 1312B, and a second longitudinal through hole 1312C, respectively, and the three thermal insulation through holes 1312 divide the heat dissipation fin 131 into four heat dissipation parts 1311. Specifically, the heat dissipation fins 131 on the lateral through holes 1312A are divided into upper and lower two regions; the first longitudinal through hole 1312B is on an upper region and divides the region into two heat dissipation portions 1311; the second longitudinal through hole 1312C is on a lower region and divides the region into two heat dissipation portions 1311. In the present embodiment, the extending directions of the first vertical through hole 1312B and the second vertical through hole 1312C on the first surface 131A are both perpendicular to the extending direction of the horizontal through hole 1312A; of course, in other embodiments, please refer to fig. 6, the extending directions of the first longitudinal through hole 1312B and the second longitudinal through hole 1312C on the first surface 131A may form an included angle with the transverse through hole 1312A, and are not perpendicular to each other, which is not limited in particular. It is to be understood that, in order to ensure that the heat dissipation areas of the plurality of heat dissipation parts 1311 are not completely the same, the way of dividing the heat dissipation fins 131 by the heat insulation through holes 1312 is not a completely symmetrical dividing way, and a specific dividing way should be defined according to the amount of heat to be dissipated from each of the light emitting members 121. Of course, in other embodiments, the number of the heat dissipation portions 1311 may be three, and only the transverse punching and the longitudinal punching may be included.

Through the design of forming the heat insulation through holes 1312 in the heat dissipation fins 131 and separating the heat dissipation portions 1311 by the heat insulation through holes 1312, the turbulence of air flowing through the heat dissipation fins 131 can be increased, the heat dissipation area of the heat dissipation fins 131 can be increased, and the heat exchange efficiency can be improved.

In one embodiment, referring to fig. 5 and 6, a plurality of insulating vias 1312 communicate with each other. For example, on the basis of the above embodiment, the lateral through hole 1312A may communicate with the first longitudinal through hole 1312B and the second longitudinal through hole 1312C, respectively. It is understood that the insulating through hole 1312 is designed to increase the turbulence of air flowing through the radiator fin 131 and to increase the heat exchange efficiency of the radiator fin 131. The interconnected insulating through holes 1312 may further increase the size of the insulating through holes 1312 in the radiator fin 131, thereby improving heat exchange efficiency.

In one embodiment, referring to fig. 7, the plurality of insulating vias 1312 are independent and spaced apart from each other. For example, on the basis of the above embodiment, the lateral through hole 1312A, the first longitudinal through hole 1312B and the second longitudinal through hole 1312C may be in a disconnected state with a spacing distance. Compared with a design mode that the plurality of heat insulation through holes 1312 are communicated, in the design mode, the number of connecting sites among the plurality of heat dissipation parts 1311 is more, and the connecting relation among the plurality of heat dissipation parts 1311 is firmer, so that the stability of the heat dissipation fins 131 can be enhanced.

In one embodiment, the distance between the thermal insulation through hole 1312 and the edge of the radiator fin 131 is greater than or equal to 1 mm. Specifically, the edge of the radiator fin 131 is an outer circumferential surface where the radiator fin 131 is connected to the first surface 131A and the second surface 131B, the insulation through hole 1312 extends inside the radiator fin 131, and when the insulation through hole 1312 extends in the direction of the outer circumferential surface, the insulation through hole 1312 does not pass through the outer circumferential surface and communicates with the external space, and the insulation through hole 1312 and the outer circumferential surface (edge) should maintain a distance of at least 1 mm. Because, when the distance is too small, the connection point of the adjacent two heat dissipation portions 1311 is too thin, so that the connection strength is insufficient, which may result in poor stability of the heat dissipation fins 131.

In one embodiment, referring to fig. 3 and 5, the plurality of heat dissipation parts 1311 are connected to the plurality of light emitting members 121 in a one-to-one correspondence manner, wherein the size of the heat dissipation area of the heat dissipation part 1311 is positively correlated to the thermal power of the light emitting member 121. Specifically, the number of the heat sink members 1311 may be four, and the four heat sink members 1311 are a red heat sink member 1311A, a green heat sink member 1311B, a first blue heat sink member 1311C, and a second blue heat sink member 1311D, respectively. The red light heat sink 1311A is connected to the red light source 121A and dissipates heat from the red light source 121A; the green light heat dissipation portion 1311B is connected to the green light source 121B, and dissipates heat from the green light source 121B; the first blue light heat dissipation part 1311C is connected to the blue light source 121C, and dissipates heat from the blue light source 121C; the second blue light heat sink 1311D is connected to the supplemental light source 121D, and dissipates heat from the supplemental light source 121D. Furthermore, the heat dissipation areas of the four heat dissipation portions 1311 are not all the same, the size of the heat dissipation area of the heat dissipation portion 1311 should be positively correlated with the thermal power of the light emitting element 121, the light emitting element 121 with higher thermal power can be correspondingly connected with the heat dissipation portion 1311 with larger heat dissipation area during operation, and the light emitting element 121 with lower thermal power can be correspondingly connected with the heat dissipation portion 1311 with smaller heat dissipation area. For example, the thermal power of the red light source 121A is X1, and the heat dissipation area of the red light heat dissipation portion 1311A is Y1; the thermal power of the green light source 121B is X2, and the heat dissipation area of the green light heat dissipation portion 1311B is Y2; the heat power of the blue light source 121C is X3, and the heat dissipation area of the first blue light heat dissipation part 1311C is Y3; the heat power of the supplementary light source 121D is X4, and the heat dissipation area of the second blue light heat dissipation part 1311D is Y4; y1 > Y2 > Y3 > Y4 if X1 > X2 > X3 > X4. It is understood that the above example is only one possible implementation, and not all of the heat dissipation area sequences of projection device 100 are the above examples.

By connecting the plurality of heat dissipation parts 1311 and the plurality of light emitting members 121 in a one-to-one correspondence manner, each light emitting member 121 has a corresponding heat dissipation part 1311 connected thereto for heat dissipation, thereby improving the heat dissipation efficiency of the heat dissipation fins 131 for each light emitting member 121.

In one embodiment, referring to fig. 8, the light emitting assembly 120 includes a plurality of light emitting elements 121, and at least one heat dissipation portion 1311 is connected to the plurality of light emitting elements 121, wherein the size of the heat dissipation area of the heat dissipation portion 1311 is positively correlated to the thermal power of the connected light emitting elements 121. Specifically, the number of the heat dissipation members 1311 may be three, and the three heat dissipation members 1311 are a red heat dissipation member 1311A, a green heat dissipation member 1311B, and a blue heat dissipation member 1311E, respectively. The red light radiating part 1311A is connected to the red light source 121A and radiates the red light source 121A; the green light heat dissipation part 1311B is connected to the green light source 121B and the supplemental light source 121D, and dissipates heat from the green light source 121B and the supplemental light source 121D; the blue light heat dissipation portion 1311E is connected to the blue light source 121C, and dissipates heat from the blue light source 121C. The heat dissipation areas of the three heat dissipation portions 1311 are not all the same, and the size of the heat dissipation area of the heat dissipation portion 1311 should be positively correlated with the thermal power of the light emitting element 121. Since the supplemental light source 121D and the green light source 121B have similar thermal powers, the supplemental light source 121D and the green light source 121B can be connected to the same green light heat sink 1311B, and the heat sink 1311B should have a heat sink area determined by the sum of the thermal powers of the supplemental light source 121D and the green light source 121B.

Due to the design that the at least one heat dissipation part 1311 is connected with the plurality of light emitting parts 121, the division of the heat dissipation parts 1311 in the heat sink sheet can be reduced, the number of the heat insulation through holes 1312 can be reduced, and the stability of the heat dissipation fins 131 can be improved.

In one embodiment, referring to fig. 3 and fig. 4, the heat dissipation structure 130 further includes a plurality of heat pipes 132, and the plurality of heat dissipation portions 1311 are connected to the plurality of light emitting elements 121 through the plurality of heat pipes 132 in a one-to-one correspondence manner, wherein the size of the heat conduction area of the heat pipe 132 is positively correlated to the thermal power of the light emitting element 121. Specifically, the heat conductive pipe 132 may be a solid metal pipe or a hollow metal pipe. Preferably, this embodiment adopts hollow copper pipe, has the capillary structure in hollow copper pipe to it has some heat-conducting liquid to fill, compares in solid metal pipe, and hollow copper pipe light in weight is favorable to the installation, and the mode that combines together through heat-conducting liquid and capillary structure is favorable to the evaporation and the liquefaction of heat-conducting liquid, strengthens heat conductivility of heat pipe 132. In the present embodiment, the number of the heat pipes 132 is four, one ends of the four heat pipes 132 are respectively connected to the red light source 121A, the green light source 121B, the blue light source 121C and the supplemental light source 121D in a one-to-one correspondence, and the other ends of the four heat pipes 132 are connected to the heat dissipation fins 131. Preferably, the four heat conductive pipes 132 are not exactly the same size, the light emitting members 121 generating heat with higher heat may be correspondingly connected with the heat conductive pipes 132 with larger size, and the light emitting members 121 generating heat with lower heat may be correspondingly connected with the heat conductive pipes 132 with smaller size. It is understood that the above dimensions can be understood as the total length, or the total surface area (heat conducting area), the cross-sectional size of any one of the heat conducting pipes 132; it may be a hollow volume inside thereof, or the quality or property of the heat transfer liquid filled inside thereof. By designing that the size of the heat conducting area of the heat conducting pipe 132 is in positive correlation with the thermal power of the luminescent part 121, the heat conducting capacity of the heat conducting pipe 132 can be reasonably distributed to different luminescent parts 121, so that the heat conducting efficiency of each heat conducting pipe 132 is improved; compared with the same size of the heat conducting pipe 132, the reasonable design of the heat conducting area or other sizes of the heat conducting pipe 132 is beneficial to better optimize the internal space of the projection apparatus 100, and the projection apparatus 100 with a more compact structure can be manufactured.

In one embodiment, referring to fig. 3 and 4, the heat dissipation structure 130 may further include a heat conducting medium (not shown) and a plurality of heat conducting substrates 133, the heat conducting substrates 133 are connected to the light emitting members 121 through the heat conducting medium, and the heat conducting pipes 132 are connected to the heat conducting substrates 133. Specifically, the heat conducting medium may be heat conducting silicone grease, a heat conducting silicone pad, a heat conducting phase change material, or a carbon fiber heat conducting pad. It is understood that the reason for using the heat transfer medium is to increase the heat transfer efficiency, so the material used for the heat transfer medium is not particularly limited. The heat conductive medium may cover a position where the light emitting member 121 generates a high amount of heat, and the heat conductive substrate 133 covers the heat conductive medium. In this embodiment, the heat conducting substrate 133 is a metal plate having two opposite surfaces, one surface of the heat conducting substrate 133 faces the light emitting element 121 and is connected to the heat conducting medium, and the heat conducting pipe 132 is connected to the other opposite surface. Further, the heat conducting pipe 132 and the heat conducting substrate 133 may be connected by welding or gluing, and may be formed as an integral structure. The heat generated when the light emitting member 121 operates can be better conducted out by adding the heat conducting medium between the light emitting member 121 and the heat conducting substrate 133; the heat generated by the light emitting member 121 can be more uniformly transferred by the connection of the heat pipe 132 to the heat conductive substrate 133 by using the large contact surface of the heat conductive substrate 133.

In one embodiment, referring to fig. 5, the heat dissipation portion 1311 is formed with a connection hole 1313, and the heat pipe 132 extends into the heat dissipation portion 1311 through the connection hole 1313. Specifically, the connection hole 1313 penetrates from the first face 131A to the second face 131B, and the heat conductive pipe 132 may extend from the first face 131A into the connection hole 1313 and from the second face 131B out of the connection hole 1313. It is understood that the radiator fin 131 is formed by a plurality of individual fins arranged side by side in one direction. That is, each fin is perpendicular to the direction, and the plurality of fins together enclose the connection hole 1313, it can be understood that the connection hole 1313 should be formed in a macroscopic manner, that is, each fin has one opening, and the plurality of openings are combined to form the connection hole 1313. The connection holes 1313 may extend linearly inside the heat dissipation fins 131, that is, the portions of the heat pipe 132 received in the connection holes 1313 are linear. In other embodiments, the portion of the heat pipe 132 extending into the connection hole 1313 may also be a curved shape, for example, the portion extending into the connection hole 1313 may be an "S" shape or a "Z" shape, and is not limited in particular. It can be understood that the heat conducting pipe 132 conducts heat through the contact area with the heat dissipating fins 131, so the larger the contact area between the heat conducting pipe 132 and the heat dissipating fins 131, the better the heat conducting effect; the shape of the connection hole 1313 should be determined according to the shape of the heat pipe 132. In other embodiments, the connection hole 1313 may be opened from the first surface 131A and not penetrate through to the second surface 131B, that is, the heat conducting pipe 132 may not penetrate through the inside of the heat dissipating fin 131, and is not limited in particular.

In one embodiment, referring to fig. 5, the cross-sectional shape of the connection hole 1313 is a gourd shape, and the portion of the heat pipe 132 extending into the connection hole 1313 is attached to the inner wall of the connection hole 1313. It is understood that the cross-sectional shape of the portion of the heat pipe 132 extending into the connection hole 1313 may also be a gourd shape, so as to enhance the connection relationship between the heat pipe 132 and the heat dissipating fins 131, so that the heat pipe 132 is more stable in the heat dissipating fins 131, and the rotation or loosening of the heat pipe 132 is prevented.

In one embodiment, referring to fig. 4, the heat dissipation structure 130 further includes an electronic cooling element 134, the electronic cooling element 134 is located between the heat conducting pipe 132 and the light emitting element 121, and the electronic cooling element 134 is used for cooling the light emitting element 121. Specifically, the electronic cooling element 134 may be a semiconductor thermoelectric cooling chip (TEC), and the electronic cooling element 134 is located between the heat conducting substrate 133 and the light emitting element 121, and is configured to further dissipate heat of the light emitting element 121. Preferably, in the present embodiment, the electronic cooling member 134 is connected between the red light source 121A and the heat conducting substrate 133 connected thereto, and it can be understood that the light emitted by the red light source 121A is red light, so that the heat generation amount thereof is higher than that of the other light emitting members 121, and when the heat generation amount of the red light source 121A is too high, the heat thereof affects the emission efficiency of the red light, thereby reducing the brightness of the light emitting assembly 120. The electronic cooling element 134 can effectively dissipate heat and cool the red light source 121A, so as to improve the overall brightness of the light emitting assembly 120.

In one embodiment, referring to fig. 9, the projection apparatus 100 may further include a fan 135, and the fan 135 is accommodated in the casing 110 and connected to the heat dissipation structure 130. Specifically, the fan 135 may include an air inlet surface 1351 and an air outlet surface 1352, the air inlet surface 1351 is provided with an air inlet 1351A, and the air outlet surface 1352 is provided with an air outlet 1352A; the heat dissipation fins 131 may be connected to the air inlet surface 1351 and/or the air outlet surface 1352 of the fan 135. Preferably, the heat dissipation fins 131 cover the inlet 1351A and/or the outlet 1352A of the fan 135, and it is understood that, during the operation of the fan 135, the wind direction thereof flows from the outside to the inside of the fan 135 and then flows out, so the positions of the fan 135 where the airflow density is high are the inlet 1351A and the outlet 1352A. The heat dissipation fins 131 are disposed at the air inlet 1351A and/or the air outlet 1352A of the fan 135, so that the distribution of the airflow density can be utilized to the maximum extent to achieve the purpose of rapid heat dissipation. Moreover, the heat dissipation fins 131 may be fixed on the air inlet surface 1351 and/or the air outlet surface 1352 by means of a snap, a staple, or an adhesive, or may be connected by means of a screw thread.

The present application further provides a method for manufacturing the heat dissipation structure 130 in the above embodiment, which aims to manufacture the heat dissipation structure 130 meeting the heat dissipation requirement of the light emitting assembly 120, so that the heat dissipation structure 130 can dissipate heat more efficiently, reduce the working temperature of the projection apparatus 100, and prolong the service life of the projection apparatus 100. In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description.

Fig. 10 is a flowchart of a method for manufacturing a heat dissipation structure 130 according to an embodiment of the present invention, and as shown in fig. 10, the method for manufacturing the heat dissipation structure 130 includes:

in step S101, a target brightness of the light emitting element 120 is set.

Specifically, the target brightness of the light emitting assembly 120 is preferably the highest brightness that the light emitting assembly 120 can provide when the projection device 100 is in operation, and the target brightness should be set according to product requirements or usage requirements. Moreover, under the target brightness, the current required by the light emitting element 120 is relatively large, and the relatively large current also increases the electric power of the light emitting element 120, and correspondingly increases the thermal power, so that the internal temperature of the light emitting element 120 is relatively high, and therefore, when the heat cannot be rapidly conducted out, the heat dissipation structure 130 needs to be added to assist the light emitting element 120 to rapidly dissipate the heat, thereby preventing the internal temperature of the light emitting element 120 from being too high, and further preventing the service life of the light emitting element 120 from being affected.

Step S102, obtaining a corresponding relationship between the luminance of the light emitting element 120 and the reference temperature when the heat dissipation structure 130 is not disposed.

Specifically, when the projection apparatus 100 is in operation, the brightness of the image projected by the light emitting assembly 120 may vary with the content of the image, or the light emitting assembly 120 needs to project images with different brightness under different working environments. For example, the light emitting assembly 120 requires a higher brightness of the projected image during the daytime than during the night. Therefore, at least three colors of LED lamps are required to contribute different brightness in real time, thereby completing sufficient projection of the picture. However, the internal temperature of the LED lamp with different colors at different brightness is different, and the higher the brightness of the LED lamp is, the higher the temperature reached inside the LED lamp is. Therefore, in the present embodiment, the purpose of this step is to obtain the reference temperatures of different LEDs and the like at different light-emitting luminances by a one-to-one measurement method when the heat dissipation structure 130 is not provided and no other heat dissipation device is connected, and define the relationship between the reference temperature and the variation of the light-emitting luminance as a corresponding relationship.

Step S103, determining a target temperature and thermal power corresponding to the light emitting element 120 according to the corresponding relationship and the target brightness.

Specifically, according to the target brightness set in step S101, a target temperature, which is the highest temperature that the light emitting device 120 can bear when operating at the target brightness, can be located in the correspondence relationship between the light emitting brightness of the light emitting device 120 obtained in step S102 and the reference temperature. When the operating temperature of the light emitting element 120 exceeds the target temperature, the lifetime of the light emitting element 120 is shortened, and the efficiency of light emission is affected. Meanwhile, the obtained thermal power is the speed of the heat generated by the light emitting element 120 at the target brightness. When the light emitting device 120 is continuously turned on and the heat dissipation efficiency thereof cannot reach the thermal power thereof, that is, when a large amount of heat generated inside the light emitting device 120 is accumulated, the temperature inside the light emitting device 120 is continuously increased and is increased to exceed the target temperature thereof. Therefore, the objective of this step is to obtain the target temperature and thermal power of the light emitting element 120 at the target brightness, and calculate the heat value of the light emitting element 120 from the target temperature and thermal power, and the heat value required to be dissipated by the light emitting element 120 to maintain the target temperature.

Step S104, a heat dissipation structure 130 is fabricated according to the target temperature and thermal power of the light emitting assembly 120.

In step S103, the heat dissipation structure 130 provided in the present application can be manufactured by the heat generated by the light emitting element 120 and the heat required to be dissipated to maintain the target temperature. The heat dissipation structure 130 includes heat dissipation fins 131, the heat dissipation fins 131 are made into an integrated structure and include a plurality of heat dissipation portions 1311, and a heat dissipation area of each heat dissipation portion 1311 is calculated according to a target temperature and a thermal power of the light emitting assembly 120. Of course, the heat dissipation structure 130 may further include a heat conducting pipe 132, and the heat conducting area of the heat conducting pipe 132 may also be calculated according to the target temperature and the heating power of the light emitting component 120.

Compared with the existing radiator manufacturing method, the method considers the influence of the target temperature on the brightness of the light-emitting component 120 before manufacturing, takes the target temperature as a reference variable, obtains the target temperature through the corresponding relation between the brightness and the temperature, combines the target temperature and the thermal power of the light-emitting component 120, and obtains the radiating area of the radiating structure 130 with higher calculation accuracy, the radiating structure 130 manufactured by the method has higher radiating efficiency, the influence of errors of the radiating structure 130 on the light-emitting component 120 is smaller, the influence of the temperature on the brightness of the light-emitting component 120 is avoided, and the service life of the projection device 100 can be prolonged.

In one embodiment, the step S101 of setting the target brightness of the light emitting assembly 120 includes:

the target brightness of each light emitting member 121 is set according to the target brightness of the light emitting assembly 120. Specifically, the target brightness of the light emitting assembly 120 should be the sum of the brightness emitted by the plurality of light emitting members 121, so that after the target brightness of the light emitting assembly 120 is set, the target brightness of each light emitting member 121 can be set in turn. In this embodiment, the light emitting assembly 120 includes four light emitting members 121, which are a red light source 121A, a green light source 121B, a blue light source 121C, and a supplemental light source 121D. The target brightness of the four light emitting members 121 may be set by the total target brightness of the light emitting assembly 120, respectively, and the target brightness of the light emitting members 121 may be recorded. The purpose of this step is to facilitate the determination of the correspondence relationship between the reference temperature and the light emission luminance of each light emitting member 121 in the subsequent steps.

In one embodiment, referring to fig. 11, step S101, setting the target brightness of the light emitting element 120 further includes:

setting target color coordinates of the light emitting assembly 120; the target color coordinates of each of the light emitting members 121 are obtained based on the target color coordinates of the light emitting assembly 120. Specifically, the color coordinates can determine the light emitting brightness of each light emitting element 121 of the light emitting assembly 120 in a specific light emitting color. Since a specific light emitting color is formed by combining light rays having different brightness provided by the light emitting members 121 of the respective colors. The target brightness to be provided by each light emitting member 121 can be more precisely determined by setting the color coordinates.

In one embodiment, in step S102, obtaining a corresponding relationship between the light-emitting brightness of the light-emitting component 120 and the reference temperature when the heat dissipation structure 130 is not disposed includes: the correspondence between the light emitting brightness of each light emitting member 121 at different currents and the reference temperature is obtained. Specifically, since the light emitting element 121 has a higher light emitting luminance, the current required by the light emitting element 121 is increased accordingly, and the electric power of the light emitting element 121 is increased accordingly after the current is increased. Meanwhile, the thermal power of the light emitting member 121 is also correspondingly increased, the speed of generating heat inside the light emitting member 121 is increased, and when the heat dissipation structure is not provided, the heat dissipation efficiency of the light emitting member 121 through itself is low, and most of heat is accumulated inside the light emitting member 121, resulting in the temperature inside the light emitting member 121 being increased. Of course, when the temperature inside the light emitting member 121 rises to exceed the maximum temperature that the light emitting member can withstand, the light emitting efficiency of the light emitting member 121 is affected, and thus the light emitting luminance is decreased. The purpose of this step is to determine the relationship of the changes in the current, the light emission luminance, and the temperature, thereby facilitating the determination of the target temperature of the light emitting member 121 in step S103.

In one embodiment, referring to fig. 12, in step S103, determining the target temperature and the thermal power corresponding to the light emitting element 120 according to the corresponding relationship and the target brightness includes:

step S1031, obtaining a target temperature, a target current and a target duty ratio corresponding to each light emitting member 121 according to the corresponding relationship, the target brightness and the target color coordinate of each light emitting member 121.

Specifically, according to the target luminance of each light emitting member 121 set in step S101, and the target color coordinates, the target temperature, the target current, and the target duty ratio corresponding to the target luminance may be determined in the correspondence relationship of the current, the light emission luminance, and the reference temperature of the light emitting member 121.

In step S1032, the electric power of each light emitting member 121 is obtained according to the target current and the target duty ratio of each light emitting member 121.

In step S1033, a thermal power of each light emitting element 121 is obtained according to the electric power and the target temperature.

Specifically, when the light emitting element 121 is powered, the current applied thereto mainly plays a role in emitting light and heat. That is, the electric power includes a light emitting power and a thermal power, and when the light emitting element 121 operates for a long time, the accumulated heat is too high and cannot be rapidly dissipated through the light emitting element 121 itself, so the accumulated heat may cause the internal temperature of the light emitting element 121 to exceed its target temperature. Therefore, the accumulated heat is the heat to be dissipated by the manufactured heat dissipation structure 130.

In one embodiment, referring to fig. 13, in step S104, the manufacturing of the heat dissipation structure 130 according to the target temperature and the thermal power of the light emitting element 120 includes:

step S1041, obtaining a heat exchange coefficient of the heat dissipation structure 130.

Specifically, since the heat exchange coefficients of different materials are different, the heat exchange coefficient of the material can be obtained when the material of the radiator fin 131 used is determined. And, the heat dissipation area of the heat dissipation fins 131 can be calculated by the heat exchange coefficient.

Step S1042, calculating a heat dissipation area corresponding to the heat dissipation portion 1311 according to the heat exchange coefficient, the target temperature of each light emitting element 121, and the thermal power.

Specifically, since the target brightness provided by each of the light emitting members 121 is different, it is finally obtained that the target temperature and the heating power of each of the light emitting members 121 are not all the same. The heat dissipation surface of the heat dissipation portion 1311 corresponding to each light emitting member 121 can be obtained by using the target temperature and the thermal power of each light emitting member 121, respectively, and by combining the heat exchange coefficients of the materials used.

In step S1043, the heat dissipation fins 131 are manufactured according to the heat dissipation areas of the heat dissipation portions 1311, and the heat dissipation fins 131 are divided into a plurality of heat dissipation portions 1311 that are insulated from each other.

Specifically, in this step, after the heat dissipation area of each heat dissipation portion 1311 is calculated, the heat dissipation areas of the heat dissipation portions 1311 are summed to obtain the heat dissipation area of the heat dissipation fins 131 required by the heat dissipation assembly. A plurality of heat dissipation portions 1311 may be formed on the heat dissipation fins 131 by physical separation, and the actual heat dissipation areas of the heat dissipation portions 1311 may satisfy the calculated heat dissipation area.

In one embodiment, referring to fig. 14, in step S1042, calculating a heat dissipation area corresponding to the heat dissipation portion 1311 according to the heat exchange coefficient, the target temperature of each light emitting element 121, and the thermal power includes:

in step S421, the total heat dissipation area of the heat dissipation fins 131 is calculated by the heat dissipation area of each heat dissipation portion 1311.

In step S422, each heat dissipation portion 1311 of the heat dissipation fins 131 is simulated.

Specifically, this step may be a test check of the calculated heat dissipation portion 1311 by simulation software. For example, the simulation software may use the heat dissipation area of the heat dissipation portion 1311, the target temperature and the thermal power of the light emitting element 121 as input terminals, and check whether the heat dissipation area can satisfy the requirement of performing effective heat dissipation on the light emitting element 121 at the target temperature.

In step S423, it is verified whether the heat dissipation fins 131 and each heat dissipation portion 1311 meet the temperature requirement.

Specifically, when the heat dissipation fins 131 cannot meet the required temperature of the light emitting assembly 120, or any one of the heat dissipation portions 1311 cannot meet the required temperature of the corresponding light emitting member 121, it may be determined that the verification fails, and the user may continue to step S422 after adaptively adjusting the total heat dissipation area or the heat dissipation area of the heat dissipation portion 1311. When the heat dissipation fins 131 and each heat dissipation portion 1311 satisfy the temperature requirement, it may be determined that the verification is successful, and the user may manufacture the heat dissipation structure 130 according to the data as the input end in step S423.

The above description is only an embodiment of the present disclosure, and not intended to limit the scope of the present disclosure, and all equivalent structures or equivalent processes performed by the present disclosure and the contents of the attached drawings, which are directly or indirectly applied to other related technical fields, are also included in the scope of the present disclosure.

Claims (18)

1. A manufacturing method of a heat dissipation structure is characterized by comprising the following steps:

setting target brightness of the light-emitting component;

acquiring the corresponding relation between the brightness of the light-emitting component and the reference temperature when the heat dissipation structure is not arranged;

determining a target temperature and thermal power corresponding to the light-emitting component according to the corresponding relation and the target brightness;

manufacturing the heat dissipation structure according to the target temperature and the thermal power of the light emitting assembly;

the heat dissipation structure comprises heat dissipation fins, the heat dissipation fins are made into an integrated structure and comprise a plurality of heat dissipation parts, and the heat dissipation area of each heat dissipation part is calculated according to the target temperature and the heat power of the light emitting assembly.

2. The method as claimed in claim 1, wherein the light-emitting assembly includes a plurality of light-emitting elements, and when the heat-dissipating structure is not disposed, the reference temperatures and the luminances of the plurality of light-emitting elements do not all have the same correspondence, and the plurality of heat-dissipating portions are correspondingly connected to the plurality of light-emitting elements.

3. The method for manufacturing the heat dissipation structure according to claim 2, wherein the setting of the target brightness of the light emitting assembly comprises:

and setting the target brightness of each luminous piece according to the target brightness of the luminous assembly.

4. The method for manufacturing the heat dissipation structure according to claim 2, wherein the setting of the target brightness of the light emitting assembly further comprises:

setting a target color coordinate of the light-emitting assembly;

and setting the target color coordinate of each luminous piece according to the target color coordinate of the luminous assembly.

5. The method for manufacturing the heat dissipation structure of claim 2, wherein the obtaining of the correspondence between the luminance of the light emitting element and the reference temperature when the heat dissipation structure is not disposed includes:

and acquiring the corresponding relation between the luminous brightness of each luminous element under different currents and the reference temperature.

6. The method for manufacturing the heat dissipation structure according to claim 5, wherein the determining the target temperature and the thermal power corresponding to the light emitting component according to the correspondence and the target brightness comprises:

obtaining a target temperature, a target current and a target duty ratio corresponding to each luminous piece according to the corresponding relation, the target brightness and the target color coordinate of each luminous piece;

obtaining electric power of each luminous element according to the target current and the target duty ratio of each luminous element;

based on the electrical power and the target temperature, a thermal power for each of the light emitting elements is obtained.

7. The method of claim 2, wherein the step of fabricating the heat dissipation structure according to the target temperature and thermal power of the light emitting assembly comprises:

acquiring the heat exchange coefficient of the heat dissipation structure;

calculating the heat dissipation area corresponding to the heat dissipation part according to the heat exchange coefficient, the target temperature of each luminous element and the thermal power;

and manufacturing the radiating fins according to the radiating areas of the radiating parts, and dividing the radiating fins into a plurality of radiating parts which are mutually insulated.

8. A heat radiation structure is used for radiating a light emitting component and is characterized in that the heat radiation structure comprises heat radiation fins which are of an integrated structure, each heat radiation fin comprises a plurality of heat radiation parts, and the heat radiation areas of the heat radiation parts are the same or not all the same; and calculating the heat dissipation area of each heat dissipation part according to the target temperature and the thermal power of the light emitting assembly.

9. The heat dissipation structure of claim 8, wherein the light emitting assembly comprises a plurality of light emitting elements, and the plurality of heat dissipation portions are connected to the plurality of light emitting elements in a one-to-one correspondence manner, wherein the size of the heat dissipation area of the heat dissipation portion is positively correlated to the thermal power of the light emitting elements.

10. The heat dissipation structure of claim 8, wherein the light emitting assembly comprises a plurality of light emitting elements, and at least one of the heat dissipation portions is connected to a plurality of the light emitting elements, wherein the size of the heat dissipation area of the heat dissipation portion is positively correlated to the thermal power of the connected light emitting elements.

11. The heat dissipating structure of claim 8, wherein the heat dissipating fins have a plurality of heat insulating through holes, and at least two adjacent heat dissipating portions are separated by the heat insulating through holes.

12. The heat dissipation structure of claim 11, wherein a plurality of the thermally insulating through-holes communicate with each other.

13. The heat dissipating structure of claim 11, wherein the plurality of thermally insulated through-holes are independent of each other and have a spacing distance.

14. The heat dissipating structure of claim 11, wherein the thermal isolation via is spaced from the edge of the heat dissipating fin by a distance of 1mm or more.

15. The heat dissipation structure of claim 9, further comprising a plurality of heat pipes, wherein the plurality of heat dissipation portions are connected to the plurality of light emitting elements in a one-to-one correspondence manner through the plurality of heat pipes, and the size of the heat conduction area of the heat pipe is positively correlated to the thermal power of the light emitting elements.

16. The heat dissipating structure of claim 15, wherein the heat dissipating portion has a connection hole, and the heat pipe extends into the heat dissipating portion through the connection hole.

17. The heat dissipating structure of claim 15, further comprising an electronic cooling member located between the heat conducting tube and the light emitting member, the electronic cooling member configured to cool the light emitting member.

18. A projection device comprising a housing, a light emitting assembly and the heat dissipation structure of any of claims 8 to 17, the light emitting assembly and the heat dissipation structure being housed in the housing, the heat dissipation structure being configured to dissipate heat from the light emitting assembly.

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