CN114855268A - 一种用于多片生长氮化镓及其合金的hvpe设备 - Google Patents

一种用于多片生长氮化镓及其合金的hvpe设备 Download PDF

Info

Publication number
CN114855268A
CN114855268A CN202210492043.0A CN202210492043A CN114855268A CN 114855268 A CN114855268 A CN 114855268A CN 202210492043 A CN202210492043 A CN 202210492043A CN 114855268 A CN114855268 A CN 114855268A
Authority
CN
China
Prior art keywords
air
pipe
shell
hcl
boat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210492043.0A
Other languages
English (en)
Other versions
CN114855268B (zh
Inventor
张纪才
李旭
谭庶欣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Ganna Photoelectric Technology Co ltd
Original Assignee
Beijing Ganna Photoelectric Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Ganna Photoelectric Technology Co ltd filed Critical Beijing Ganna Photoelectric Technology Co ltd
Priority to CN202210492043.0A priority Critical patent/CN114855268B/zh
Publication of CN114855268A publication Critical patent/CN114855268A/zh
Application granted granted Critical
Publication of CN114855268B publication Critical patent/CN114855268B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/08Reaction chambers; Selection of materials therefor
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/301AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/301AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C23C16/303Nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563Gas nozzles
    • C23C16/45568Porous nozzles
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • C23C16/4582Rigid and flat substrates, e.g. plates or discs
    • C23C16/4583Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
    • C23C16/4584Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally the substrate being rotated
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/12Substrate holders or susceptors
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/16Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

本发明公开了一种用于多片生长氮化镓及其合金的HVPE设备,包括底座、壳体、反应器、衬托机构、多个温控加热器、防护壳和动力机构;衬托机构包括衬托架、内齿圈、传动轴、大托盘、多个小托盘和驱动电机。本发明通过在衬托机构设置衬托架、内齿圈、传动轴、大托盘、多个小托盘和驱动电机;当驱动电机带动大托盘转动,从而带动小托盘随大托盘转动(公转);小托盘在转动过程中与内齿圈发生啮合,使得小托盘能够绕自己的中心自转,达到改进衬底的生长的均匀性;通过将衬托机构滑动设置在壳体的下端,并设置动力机构移动衬托机构,达到实现不同氮化物适宜的生长距离;通过设置多个温控加热器,便于单独调节Al源区、Ga源区和生长区的温度。

Description

一种用于多片生长氮化镓及其合金的HVPE设备
技术领域
本发明涉及半导体材料技术领域,具体涉及一种可批量生产氮化镓及其合金的HVPE设备。
背景技术
氮化镓是第三代半导体的核心材料之一,其禁带宽度为3.4eV,与氮化铝和氮化铟的合金可以实现禁带宽度从1.2~6.2eV的连续可调,理论上可以覆盖从红光至紫外光在内的整个可见光谱,是制作发光二极管、激光二极管以及高温、高频、大功率电子器件的优良材料。
GaN衬底的生长方法有很多种,如高温高压法、升华法、Na熔融结晶法和氢化物气相外延法(HVPE)等。其中前三种方法对设备和工艺都有较苛刻要求,且难以实现大尺寸GaN单晶,无法满足商业化的要求。HVPE法是目前研究的主流,大多数可以商业化提供的GaN同质衬底都是使用HVPE法生产的。HVPE技术具有设备简单、成本低、生长速度快等优点,可以生长均匀、大尺寸GaN厚膜,作为进一步用MOCVD生长器件结构的衬底。
由于二英寸GaN衬底的有效使用面积小以及工业量产等要求,目前工业GaN衬底逐渐向大尺寸(衬底尺寸越大,芯片可利用面积也越大)、多片发展。然而目前4英寸多片机仍然面临许多挑战,由于衬底尺寸和数量的增加,对气流的均匀性提出了更高的要求,然而目前的多片HVPE设备仅提供衬底托盘的转动(公转),难以同时对多片衬底进行自轴旋转(自转),无法保证各衬底片上氮化镓的均衡生长。因此需要引入衬底片的自转来补偿气流的平衡性,然而目前尚未有良好的设计可以解决这个问题。此外,如何在大尺寸(如4英寸)生长下,实现异质衬底和GaN及其合金单晶材料的分离,也是一个极为困难的技术难题。引入二维材料(如Gr、MoS2和h-BN等)以实现外延层的范德华外延有望成为一种行之有效的解决思路,然而目前尚处于研究阶段。进一步,随着产业化的推进,业界对多功能设备的要求逐渐提高,然而目前产业界采用的HVPE设备,功能单一,通常只能生长一种材料,比如GaN或者AlN,还没有一种设备可以同时生产GaN、AlN、BN和BxAlyGa(1-x-y)N(其中0≤x≤1,0≤y≤1,x+y≤1)单晶衬底材料。需要针对以上问题进行优化。
因此,针对以上不足,本发明提供了一种用于多片生长四英寸氮化镓及其合金的HVPE设备,同时可实现单晶材料与异质衬底的分离技术。
发明内容
本发明的目的在于提供一种用于多片生长四英寸氮化镓及其合金的HVPE设备,以解决现有技术中氮化镓生产设备效率不高且产品有效利用面积低的问题
本发明通过以下技术方案实现:
一种用于多片生长氮化镓及其合金的HVPE设备,包括底座、壳体、反应器、衬托机构、多个温控加热器、防护壳和动力机构;
所述壳体的下端与所述底座相连,所述壳体的内腔上部设置有反应器、下端滑动设置有所述衬托机构;所述动力机构的下端与所述底座相连、上端与所述衬托机构相连,所述动力机构用于上下移动所述衬托机构;
多个所述温控加热器从上到下依次套装在所述壳体的外壁,所述防护壳套装在多个所述温控加热器的外壁;
所述壳体的上端设置有上法兰、下部的一侧外壁设置有出气孔;所述反应器的上端与所述上法兰相连;
所述反应器包括半圆筒体、Al舟、Ga舟、三条HCl气管、BCl3气管、NH3气管、N2气管、两个管道卡盘和配气盘;
所述半圆筒体的上端与所述上法兰相连、下端与所述配气盘相连;三条所述HCl气管、所述BCl3气管、所述NH3气管和所述N2气管均通过两个管道卡盘与所述半圆筒体相连;
所述NH3气管从上到下依次穿过所述上法兰、所述半圆筒体与所述配气盘上的多个NH3出气口K1连通;
所述N2气管从上到下依次穿过所述上法兰、所述半圆筒体与所述配气盘上的多个N2出气口K2连通;
三条所述HCl气管包括两条主HCl气管和副HCl气管;
两条主HCl气管分别穿过所述上法兰在所述半圆筒体的中部下侧汇合为第一混合管,所述第一混合管在所述半圆筒体的下部与所述BCl3气管汇合为第二混合管,所述第二混合管的下端与所述配气盘上的多个主HCl出气口K3连通;
所述Al舟设置在一条所述主HCl气管上,且所述Al舟位于所述半圆筒体的上部;
所述Ga舟设置在另一条所述主HCl气管上;且所述Ga舟位于所述半圆筒体的中部;
所述BCl3气管穿过所述上法兰后沿所述半圆筒体一侧的外部设置,并在所述半圆筒体的下部进入所述半圆筒体与所述第一混合管汇合;
所述副HCl气管从上到下依次穿过所述上法兰、所述半圆筒体与所述配气盘上的多个副HCl出气口K4连通;
所述衬托机构包括衬托架、内齿圈、传动轴、大托盘、多个小托盘和驱动电机;
所述衬托架的下部与所述壳体的下端内壁滑动相连、上端连接有所述内齿圈;所述转到轴与所述衬托架的芯部转动相连;所述驱动电机设置的外壳与所述衬托架相连、输出轴与所述传动轴传动相连;所述传动轴的上端与所述大托盘相连;所述大托盘的上端转动连接有多个所述小托盘,所述小托盘的外壁设置有与所述内齿圈相啮合的外齿环。
进一步的,所述配气盘从边缘到心部依次呈圆周阵列分布有16个NH3出气口K1、16个N2出气口K2、16个主HCl出气口K3、8个副HCl出气口K4、4个N2出气口K2和一个N2出气口K2;
16个所述NH3出气口K1与16个所述主HCl出气口K3径向对齐布置;
16个所述NH3出气口K1与相邻内侧的16个所述N2出气口K2交错布置;
16个所述主HCl出气口K3与相邻内侧的8个所述副HCl出气口K4交错布置;
8个所述副HCl出气口K4与相邻内侧的4个所述N2出气口K2交错布置。
进一步的,所述衬托架包括衬托盘、多个第一连接柱、传动筒、滑盘、第二连接柱和连接盘;
所述衬托盘的上端外侧连接有多个所述第一连接柱;多个所述第一连接柱呈圆周阵列分布;所述传动筒的上端与所述衬托盘的下端相连、下端与所述滑盘的上端相连,所述传动轴套装在所述传动筒中,所述滑盘的下端外侧连接有多个所述第二连接柱;多个所述第二连接柱呈圆周阵列分布;所述驱动电机与所述滑盘的下端相连。
进一步的,所述温控加热器为6个,所述温控加热器包括电加热管和多个热电偶;
上部的两个所述温控加热器对应的壳体内部区域为Al源区;其温度控制在500~600℃间;
中部的两个所述温控加热器对应的壳体内部区域为Ga源区;其温度控制在800~900℃间;
下部的两个所述温控加热器对应的壳体内部区域为生长区;其温度控制在1000~2200℃间。
进一步的,所述动力机构为电动缸。
进一步的,所述衬托盘上设置有精密测温热偶。
进一步的,所述Al舟的上端设置有石英盖;所述Al舟的外侧壁的中下部设置有与对应的所述主HCl气管连通的两个第一进气管,两个第一进气管对称布置在所述Al舟上,所述Al舟的底部设置有第一出气管,所述第一出气管的上端伸入所述Al舟的内腔的上部、下端与所述第一混合管连通。
进一步的,所述Ga舟的顶部设置有第二进气管,所述第二进气管的上端与对应的所述主HCl气管连通、下端伸入所述的内腔的下部;所述述Ga舟的底部设置有第二出气管,所述第二出气管的上端伸入所述Ga舟的内腔的上部、下端与所述第一混合管连通。
进一步的,所述壳体的内壁设置有用于支撑所述反应器的卡环。
本发明的有益效果在于:
1、通过在衬托机构设置衬托架、内齿圈、传动轴、大托盘、多个小托盘和驱动电机;当驱动电机带动大托盘转动,从而带动小托盘随大托盘转动(公转);小托盘在转动过程中与内齿圈发生啮合,使得小托盘能够绕自己的中心自转,达到改进衬底的生长的均匀性。
2、通过将衬托机构滑动设置在壳体的下端,并设置动力机构移动衬托机构,达到实现不同氮化物适宜的生长距离。
3、通过设置多个温控加热器,便于单独调节Al源区、Ga源区和生长区的温度。
附图说明
图1为本发明的结构示意图:
图2为本发明的衬托机构的结构示意图;
图3为本发明的内齿圈与小托盘的布置结构示意图;
图4为本发明的配气盘上的出气口的布置结构示意图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本发明一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本发明实施例的组件可以以各种不同的配置来布置和设计。
因此,以下对在附图中提供的本发明的实施例的详细描述并非旨在限制要求保护的本发明的范围,而是仅仅表示本发明的选定实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。
在本发明的上述描述中,需要说明的是,术语“一侧”、“另一侧”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该发明产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”等仅用于区分描述,而不能理解为指示或暗示相对重要性。
此外,术语“相同”等术语并不表示要求部件绝对相同,而是可以存在微小的差异。术语“垂直”仅仅是指部件之间的位置关系相对“平行”而言更加垂直,并不是表示该结构一定要完全垂直,而是可以稍微倾斜。
如图1至图4所示,一种用于多片生长氮化镓及其合金的HVPE设备,包括底座1、壳体2、反应器、衬托机构、多个温控加热器、防护壳3和动力机构4;
壳体2的下端与底座1相连,壳体2的内腔上部设置有反应器、下端滑动设置有衬托机构;动力机构4的下端与底座1相连、上端与衬托机构相连,动力机构用于上下移动衬托机构;
多个温控加热器从上到下依次套装在壳体2的外壁,防护壳3套装在多个温控加热器的外壁;
壳体2的上端设置有上法兰5、下部的一侧外壁设置有出气孔;上法兰与壳体间设置有密封垫,避免气体泄漏;通过设置出气孔,用于将生产废气通入尾气处理装置,避免污染环境;反应器的上端与上法兰5相连;
反应器包括半圆筒体6、Al舟7、Ga舟8、三条HCl气管、BCl3气管9、NH3气管10、N2气管11、两个管道卡盘12和配气盘13;
半圆筒体6的上端与上法兰5相连、下端与配气盘13相连;三条HCl气管、BCl3气管、NH3气管和N2气管均通过两个管道卡盘12与半圆筒体相连;
NH3气管从上到下依次穿过上法兰、半圆筒体与配气盘上的多个NH3出气口K1连通;
N2气管从上到下依次穿过上法兰、半圆筒体与配气盘上的多个N2出气口K2连通;
三条HCl气管包括两条主HCl气管14和副HCl气管15;
两条主HCl气管分别穿过上法兰在半圆筒体的中部下侧汇合为第一混合管,第一混合管在半圆筒体的下部与BCl3气管汇合为第二混合管,第二混合管的下端与配气盘上的多个主HCl出气口K3连通;
Al舟7设置在一条主HCl气管上,且Al舟7位于半圆筒体的上部;
Ga舟8设置在另一条主HCl气管上;且Ga舟8位于半圆筒体的中部;
BCl3气管穿过上法兰后沿半圆筒体一侧的外部设置,并在半圆筒体的下部进入半圆筒体与第一混合管汇合;
副HCl气管从上到下依次穿过上法兰、半圆筒体与配气盘上的多个副HCl出气口K4连通;
衬托机构包括衬托架、内齿圈16、传动轴17、大托盘18、多个小托盘19和驱动电机20;
衬托架的下部与壳体的下端内壁滑动相连、上端连接有内齿圈;转到轴与衬托架的芯部转动相连;驱动电机设置的外壳与衬托架相连、输出轴与传动轴传动相连;传动轴的上端与大托盘相连;大托盘的上端转动连接有多个小托盘,小托盘的外壁设置有与内齿圈相啮合的外齿环;通过驱动电机带动大托盘转动,从而带动小托盘随大托盘转动(公转);小托盘在转动过程中与内齿圈发生啮合,使得小托盘能够绕自己的中心自转。
本实施例中,配气盘13从边缘到心部依次呈圆周阵列分布有16个NH3出气口K1、16个N2出气口K2、16个主HCl出气口K3、8个副HCl出气口K4、4个N2出气口K2和一个N2出气口K2;
16个NH3出气口K1与16个主HCl出气口K3径向对齐布置;
16个NH3出气口K1与相邻内侧的16个N2出气口K2交错布置;
16个主HCl出气口K3与相邻内侧的8个副HCl出气口K4交错布置;
在16个主HCl出气口K3的内侧设置、8个副HCl出气口K4的作用是使主路HCl输气口中的金属前驱物气体进一步转化为三氯化物;
8个副HCl出气口K4与相邻内侧的4个N2出气口K2交错布置;
心部的4个N2出气口K2和一个N2出气口K2的目的是加强源气体在衬底上方的混合,使源气体在衬底上方充分混合从而在异质衬底材料上大量结晶,实现GaN衬底的快速生产。
本实施例中,衬托架包括衬托盘21、多个第一连接柱22、传动筒23、滑盘24、第二连接柱25和连接盘26;
衬托盘的上端外侧连接有多个第一连接柱,第一连接柱至少为3个,呈圆周阵列分布在衬托盘上,内齿圈对应第一连接柱处设置有便于插入第一连接柱的第一插孔;多个第一连接柱呈圆周阵列分布;传动筒的上端与衬托盘的下端相连、下端与滑盘的上端相连,传动轴套装在传动筒中,滑盘的下端外侧连接有多个第二连接柱,第二连接柱至少为3个;多个第二连接柱呈圆周阵列分布;驱动电机与滑盘的下端相连;滑盘的外侧设置有密封环,避免尾气泄漏。
本实施例中,温控加热器为6个,温控加热器包括电加热管27和多个热电偶28;每个温控加热器至少设置两个热电偶;热电偶用于测量对应区域的温度;
上部的两个温控加热器对应的壳体内部区域为Al源区;其温度控制在500~600℃间;
中部的两个温控加热器对应的壳体内部区域为Ga源区;其温度控制在800~900℃间;
下部的两个温控加热器对应的壳体内部区域为生长区;其温度控制在1000~2200℃间。
本实施例中,动力机构4为电动缸;用于调节小托盘与配气盘间的距离;同时,还可以将小托盘从壳体中滑出,便于取出样品。
本实施例中,衬托盘21上设置有精密测温热偶29;通过设置精密测温热偶,用以精确测量生长区的温度。
本实施例中,Al舟7的上端设置有石英盖;Al舟7的外侧壁的中下部设置有与对应的主HCl气管连通的两个第一进气管,两个第一进气管对称布置在Al舟7上,Al舟7的底部设置有第一出气管,第一出气管的上端伸入Al舟7的内腔的上部、下端与第一混合管连通。
本实施例中,Ga舟8的顶部设置有第二进气管,第二进气管的上端与对应的主HCl气管连通、下端伸入的内腔的下部;述Ga舟8的底部设置有第二出气管,第二出气管的上端伸入Ga舟8的内腔的上部、下端与第一混合管连通。
本实施例中,壳体2的内壁设置有用于支撑反应器的卡环30;用于固定反应器。
最后说明的是,以上实施例仅用以说明本发明的技术方案而非限制,尽管参照较佳实施例对本发明进行了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的宗旨和范围,其均应涵盖在本发明的权利要求范围当中。

Claims (9)

1.一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:包括底座、壳体、反应器、衬托机构、多个温控加热器、防护壳和动力机构;
所述壳体的下端与所述底座相连,所述壳体的内腔上部设置有反应器、下端滑动设置有所述衬托机构;所述动力机构的下端与所述底座相连、上端与所述衬托机构相连,所述动力机构用于上下移动所述衬托机构;
多个所述温控加热器从上到下依次套装在所述壳体的外壁,所述防护壳套装在多个所述温控加热器的外壁;
所述壳体的上端设置有上法兰、下部的一侧外壁设置有出气孔;所述反应器的上端与所述上法兰相连;
所述反应器包括半圆筒体、Al舟、Ga舟、三条HCl气管、BCl3气管、NH3气管、N2气管、两个管道卡盘和配气盘;
所述半圆筒体的上端与所述上法兰相连、下端与所述配气盘相连;三条所述HCl气管、所述BCl3气管、所述NH3气管和所述N2气管均通过两个管道卡盘与所述半圆筒体相连;
所述NH3气管从上到下依次穿过所述上法兰、所述半圆筒体与所述配气盘上的多个NH3出气口K1连通;
所述N2气管从上到下依次穿过所述上法兰、所述半圆筒体与所述配气盘上的多个N2出气口K2连通;
三条所述HCl气管包括两条主HCl气管和副HCl气管;
两条主HCl气管分别穿过所述上法兰在所述半圆筒体的中部下侧汇合为第一混合管,所述第一混合管在所述半圆筒体的下部与所述BCl3气管汇合为第二混合管,所述第二混合管的下端与所述配气盘上的多个主HCl出气口K3连通;
所述Al舟设置在一条所述主HCl气管上,且所述Al舟位于所述半圆筒体的上部;
所述Ga舟设置在另一条所述主HCl气管上;且所述Ga舟位于所述半圆筒体的中部;
所述BCl3气管穿过所述上法兰后沿所述半圆筒体一侧的外部设置,并在所述半圆筒体的下部进入所述半圆筒体与所述第一混合管汇合;
所述副HCl气管从上到下依次穿过所述上法兰、所述半圆筒体与所述配气盘上的多个副HCl出气口K4连通;
所述衬托机构包括衬托架、内齿圈、传动轴、大托盘、多个小托盘和驱动电机;
所述衬托架的下部与所述壳体的下端内壁滑动相连、上端连接有所述内齿圈;所述转到轴与所述衬托架的芯部转动相连;所述驱动电机设置的外壳与所述衬托架相连、输出轴与所述传动轴传动相连;所述传动轴的上端与所述大托盘相连;所述大托盘的上端转动连接有多个所述小托盘,所述小托盘的外壁设置有与所述内齿圈相啮合的外齿环。
2.根据权利要求1所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:所述配气盘从边缘到心部依次呈圆周阵列分布有16个NH3出气口K1、16个N2出气口K2、16个主HCl出气口K3、8个副HCl出气口K4、4个N2出气口K2和一个N2出气口K2;
16个所述NH3出气口K1与16个所述主HCl出气口K3径向对齐布置;
16个所述NH3出气口K1与相邻内侧的16个所述N2出气口K2交错布置;
16个所述主HCl出气口K3与相邻内侧的8个所述副HCl出气口K4交错布置;
8个所述副HCl出气口K4与相邻内侧的4个所述N2出气口K2交错布置。
3.根据权利要求1所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:所述衬托架包括衬托盘、多个第一连接柱、传动筒、滑盘、第二连接柱和连接盘;
所述衬托盘的上端外侧连接有多个所述第一连接柱;多个所述第一连接柱呈圆周阵列分布;所述传动筒的上端与所述衬托盘的下端相连、下端与所述滑盘的上端相连,所述传动轴套装在所述传动筒中,所述滑盘的下端外侧连接有多个所述第二连接柱;多个所述第二连接柱呈圆周阵列分布;所述驱动电机与所述滑盘的下端相连。
4.根据权利要求1所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:所述温控加热器为6个,所述温控加热器包括电加热管和多个热电偶;
上部的两个所述温控加热器对应的壳体内部区域为Al源区;其温度控制在500~600℃间;
中部的两个所述温控加热器对应的壳体内部区域为Ga源区;其温度控制在800~900℃间;
下部的两个所述温控加热器对应的壳体内部区域为生长区;其温度控制在1000~2200℃间。
5.根据权利要求1所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:所述动力机构为电动缸。
6.根据权利要求3所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:所述衬托盘上设置有精密测温热偶。
7.根据权利要求1所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:所述Al舟的上端设置有石英盖;所述Al舟的外侧壁的中下部设置有与对应的所述主HCl气管连通的两个第一进气管,两个第一进气管对称布置在所述Al舟上,所述Al舟的底部设置有第一出气管,所述第一出气管的上端伸入所述Al舟的内腔的上部、下端与所述第一混合管连通。
8.根据权利要求1所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:所述Ga舟的顶部设置有第二进气管,所述第二进气管的上端与对应的所述主HCl气管连通、下端伸入所述的内腔的下部;所述述Ga舟的底部设置有第二出气管,所述第二出气管的上端伸入所述Ga舟的内腔的上部、下端与所述第一混合管连通。
9.根据权利要求1所述的一种用于多片生长氮化镓及其合金的HVPE设备,其特征在于:
所述壳体的内壁设置有用于支撑所述反应器的卡环。
CN202210492043.0A 2022-05-07 2022-05-07 一种用于多片生长氮化镓及其合金的hvpe设备 Active CN114855268B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210492043.0A CN114855268B (zh) 2022-05-07 2022-05-07 一种用于多片生长氮化镓及其合金的hvpe设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210492043.0A CN114855268B (zh) 2022-05-07 2022-05-07 一种用于多片生长氮化镓及其合金的hvpe设备

Publications (2)

Publication Number Publication Date
CN114855268A true CN114855268A (zh) 2022-08-05
CN114855268B CN114855268B (zh) 2023-06-30

Family

ID=82635050

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210492043.0A Active CN114855268B (zh) 2022-05-07 2022-05-07 一种用于多片生长氮化镓及其合金的hvpe设备

Country Status (1)

Country Link
CN (1) CN114855268B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957997A (ja) * 1982-09-27 1984-04-03 Agency Of Ind Science & Technol 窒化ガリウム単結晶膜の製造法
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
WO2006015915A1 (de) * 2004-08-06 2006-02-16 Aixtron Ag Vorrichtung und verfahren zur chemischen gasphasenabscheidung mit hohem durchsatz
CN104141116A (zh) * 2013-05-08 2014-11-12 理想晶延半导体设备(上海)有限公司 金属有机化学气相沉积装置、气体喷淋组件及其气体分配的控制方法
CN108914202A (zh) * 2018-08-10 2018-11-30 北京索提斯科技有限公司 一种可批量生产氮化镓的hvpe设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5957997A (ja) * 1982-09-27 1984-04-03 Agency Of Ind Science & Technol 窒化ガリウム単結晶膜の製造法
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
WO2006015915A1 (de) * 2004-08-06 2006-02-16 Aixtron Ag Vorrichtung und verfahren zur chemischen gasphasenabscheidung mit hohem durchsatz
CN104141116A (zh) * 2013-05-08 2014-11-12 理想晶延半导体设备(上海)有限公司 金属有机化学气相沉积装置、气体喷淋组件及其气体分配的控制方法
CN108914202A (zh) * 2018-08-10 2018-11-30 北京索提斯科技有限公司 一种可批量生产氮化镓的hvpe设备

Also Published As

Publication number Publication date
CN114855268B (zh) 2023-06-30

Similar Documents

Publication Publication Date Title
CN103456593B (zh) 一种改进多片式外延材料厚度分布均匀性的氢化物气相沉积装置与方法
KR101369282B1 (ko) 고생산성 박막 증착 방법 및 시스템
CN102421934A (zh) 高产量多晶片外延反应器
CN103074606A (zh) 石墨盘、具有上述石墨盘的反应腔室和对衬底的加热方法
TW201137159A (en) Metal-organic chemical vapor deposition apparatus
EP2984678B1 (en) Method of producing epitaxial layer of binary semiconductor material
JP2006114547A (ja) 気相成長装置
CN114855268B (zh) 一种用于多片生长氮化镓及其合金的hvpe设备
TWI490367B (zh) 金屬有機化合物化學氣相沉積方法及其裝置
JPS61127696A (ja) 有機金属気相成長装置
JPS6090894A (ja) 気相成長装置
KR102666098B1 (ko) 흑연 웨이퍼 캐리어 및 이를 포함하는 mocvd반응 장치
US11885018B2 (en) High pressure spatial chemical vapor deposition system and related process
CN103088414A (zh) 可实现氮化物晶体同质外延的气相外延沉积装置
CN103603038B (zh) 具有水平式多孔喷淋装置的光辅助mocvd反应器
US20120321790A1 (en) Rotation system for thin film formation
CN117165925A (zh) 一种可多片生长的载台及hvpe设备
JPH0226893A (ja) 気相成長装置
CN103205731A (zh) 一种mocvd新反应系统
JP2658213B2 (ja) 気相エピタキシャル成長方法
JP2004103708A (ja) 半導体装置製造用治具
CN105779970B (zh) 气体喷淋头和沉积装置
CN105779970A (zh) 气体喷淋头和沉积装置
JP2006041419A (ja) 成膜装置
SU1074161A1 (ru) Устройство дл газовой эпитаксии полупроводниковых соединений

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant