CN114850490B - Manufacturing method of electronic radiator based on 3D printing - Google Patents
Manufacturing method of electronic radiator based on 3D printing Download PDFInfo
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- CN114850490B CN114850490B CN202210346241.6A CN202210346241A CN114850490B CN 114850490 B CN114850490 B CN 114850490B CN 202210346241 A CN202210346241 A CN 202210346241A CN 114850490 B CN114850490 B CN 114850490B
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- 238000010146 3D printing Methods 0.000 title claims abstract description 85
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 58
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 238000007639 printing Methods 0.000 claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 claims abstract description 52
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000005245 sintering Methods 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims description 59
- 239000002184 metal Substances 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 23
- 239000002002 slurry Substances 0.000 claims description 7
- 239000002082 metal nanoparticle Substances 0.000 claims description 4
- 238000011049 filling Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000013110 organic ligand Substances 0.000 claims description 3
- 230000005855 radiation Effects 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 17
- 238000013461 design Methods 0.000 abstract description 5
- 238000012545 processing Methods 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 7
- 238000004512 die casting Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/10—Formation of a green body
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention relates to the technical field of radiator processing and manufacturing, and provides a manufacturing method of an electronic radiator based on 3D printing, which comprises the following steps: s1, directly printing a substrate on the surface of an electronic device by using a 3D printing technology; s2, printing a heat dissipation structure on the substrate by using a 3D printing technology; and S3, heating, sintering and solidifying the printed substrate and the heat dissipation structure to form an integrated structure. According to the manufacturing method of the electronic radiator based on 3D printing, which is provided by the invention, the electronic radiator can be directly molded and manufactured on an electronic device through a 3D printing technology, an integrated structure is formed with the electronic device, adhesion or fixation is not needed, and no gap exists between the radiator formed by printing and the electronic device, and other mediums exist; the dimension design is highly free, the manufacturing of the small electronic radiator is realized, the manufacturing efficiency is improved, and the radiating effect of the radiator is good.
Description
Technical Field
The invention relates to the technical field of radiator processing and manufacturing, in particular to a manufacturing method of an electronic radiator based on 3D printing.
Background
With the continuous development of the computer industry and the microelectronic technology, the operation speed and the capability of the required computer processor are continuously improved, the integration level of the electronic chip is gradually improved, under the trend, the heat generated by the processor and the chip is greatly increased, so that the heat problem of the electronic component caused by overhigh temperature is more and more prominent. At present, a radiator is used outside the box body of the electronic component or directly on the electronic component so as to reduce the working temperature of the electronic component and improve the working capacity.
There are various types of conventional heat sinks, such as the integral extruded fin type heat sink of US5592363 and US5594623, or the insert fin type heat sink of US5509465 and US5038858, or the bent fin type heat sink of US5375655, and the column type heat sink of JPH09283666 a. Different radiator sizes and designs can meet the space requirement of the working environment and the requirement of the radiating effect.
there are various methods for manufacturing related heat sinks, such as die casting, inserting sheets, etc. The die-cast radiator is a radiator that is manufactured by directly die-casting a metal into a liquid state and then filling the liquid state into a mold by a die-casting machine, and a conventional integral fin radiator is usually manufactured by die-casting. The insert manufacturing method is to manufacture the substrate and the fins separately, manufacture the substrate and the fins by stamping or casting, and combine the fins on the substrate by using a heat-conducting glue or slot method. With the improvement of the heat dissipation effect of the radiator, the width of the fins and the density of the fins of the fin type radiator are required to be higher, so that the whole heat dissipation surface area of the radiator is improved, and the heat exchange is increased. To reduce fin width and distribution density, an additional cutting or machining process is now often added to the conventional heat spreader after fabrication to achieve the desired structure.
The existing radiator manufacturing method has the following defects:
① The height of the radiator formed by integral forming die casting is limited by the die and the manufacturing level, the higher fin structure is difficult to form, the ratio of the width to the height of the fins is also influenced by the manufacturing level, the manufacturing height of the radiator is greatly reduced while the width of the fins is reduced, and the radiating effect of the manufactured radiator is poor.
② The manufacturing method of the inserted radiator can produce higher fins, but the heat conduction glue or the slot is used for connecting the substrate and the fins, so that the substrate and the fins are in a non-integrated structure, and the heat conduction glue or the gap in the middle of the substrate and the fins can cause the heat resistance of the radiator to be larger, thereby reducing the heat dissipation effect of the radiator.
③ because of the limitation of the existing manufacturing level, only few manufacturers can manufacture extra-thin fin radiators with the width smaller than 0.7mm, when the fin width is extremely thin, the structure is extremely fragile, the radiator cannot bear the impact and vibration during cutting, and the radiator has extremely high reject ratio and is difficult to mass production no matter die casting, insert sheet forming or extra-thin fin manufacturing by machining.
④ The existing radiator and the electronic device are combined by adopting heat conduction glue, or the structure such as a slot and a bolt is used for fixing the radiator and the electronic device on the surface of the electronic device, the heat resistance value of the heat conduction glue is larger, the heat dissipation effect is affected by the heat resistance of the heat conduction glue between the radiator and the electronic device, if other attaching and fixing modes are used, the radiator bottom plate is difficult to be tightly combined on the electronic device, and the air in the middle has larger heat resistance as well, so that the heat dissipation effect is affected.
⑤ The existing radiator is mainly made of aluminum or aluminum alloy, and a small amount of copper is used as the material. The aluminum or aluminum alloy material is adopted, so that the heat conductivity coefficient is lower, and the heat dissipation effect is poorer.
⑥ Because of the existing manufacturing level limitation, small-sized radiators cannot be manufactured, the length and width dimensions of the existing radiator base and the height dimensions of the fins cannot be difficult to be smaller than 5mm, larger radiator dimensions are difficult to install in the radiator working space, and the larger radiator dimensions can influence air flow and the overall working temperature. If can directly produce the splendid small-size radiator of radiating effect, alright use together with electronic device in the workspace inside, every electronic device can independent supporting radiator, and reasonable overall arrangement dispels the heat, improves space utilization, improves the radiating effect.
Disclosure of Invention
The invention provides a manufacturing method of an electronic radiator based on 3D printing, which is used for solving the defects of difficult manufacturing and poor radiating effect of a small-sized radiator in the prior art, and the manufacturing of the small-sized radiator is realized by directly printing on an electronic device through a 3D printing technology, so that the manufacturing efficiency is improved, and the radiating effect of the radiator is good.
The invention provides a manufacturing method of an electronic radiator based on 3D printing, which comprises the following steps:
s1, directly printing a substrate on the surface of an electronic device by using a 3D printing technology;
s2, printing a heat dissipation structure on the substrate by using a 3D printing technology;
And S3, heating, sintering and solidifying the printed substrate and the heat dissipation structure to form an integrated structure.
According to the method for manufacturing the electronic radiator based on 3D printing provided by the invention, the S1 specifically comprises the following steps:
s11, the electronic device moves to the position below a 3D printing needle containing the metal paste, the metal paste is extruded by the 3D printing needle, and meanwhile, the electronic device is moved, so that the metal paste is printed out of a first layer of substrate on the surface of the electronic device;
s12, repeating the step S11 on the first layer of substrate to print out a plurality of layers of substrates.
According to the method for manufacturing the electronic radiator based on 3D printing provided by the invention, the specific steps of S11 are as follows:
s111, extruding metal paste by using a 3D printing needle head, and moving the electronic device along the length direction of the electronic device, so that the 3D printing needle head prints from one end of the electronic device to the other end of the electronic device to print out a first metal wire;
S112, moving the electronic device along the width direction of the electronic device by a set distance, repeating the step S111, printing out a second metal wire, and enabling the printed second metal wire to be closely attached to the first metal wire;
S113, repeating the step S112, thereby printing out the first layer of substrate.
According to the method for manufacturing the electronic radiator based on 3D printing provided by the invention, the S2 specifically comprises the following steps:
And printing a fin type heat dissipation structure or a column type heat dissipation structure on the substrate by utilizing a 3D printing needle head filled with metal slurry.
According to the method for manufacturing the electronic radiator based on 3D printing provided by the invention, the S2 specifically comprises the following steps:
S211, extruding metal paste by using a 3D printing needle head, reciprocating along the length direction of the electronic device, and descending the electronic device layer by layer, so that the 3D printing needle head prints from one end of the substrate to the other end of the substrate for multiple times, and the printed metal paste is overlapped along the height direction to form a first fin;
S212, moving the electronic device along the width direction of the electronic device for a set distance and lifting the electronic device, repeating the step S211, printing out a second fin, and enabling the second fin and the first fin to be arranged at intervals along the width direction of the electronic device;
S213, repeating the step S212, so that a plurality of fins are printed on the substrate.
According to the manufacturing method of the electronic radiator based on 3D printing, the width of the fin is in the range of 0.03-1mm.
According to the method for manufacturing the electronic radiator based on 3D printing provided by the invention, the S2 specifically comprises the following steps:
s221, extruding metal paste by using a 3D printing needle head, enabling the electronic device to descend layer by layer along the height direction, stopping feeding by the 3D printing needle head when the electronic device descends to a set height, and enabling the electronic device to descend rapidly to enable the 3D printing needle head to be separated from the metal paste, so that a first upright post is printed;
S222, horizontally moving the electronic device and lifting the electronic device, repeating the step S221, printing out a second upright post, and enabling the second upright post and the first upright post to be arranged at intervals along the horizontal direction of the electronic device;
S223, repeating the step S222, so that a plurality of upright posts are printed on the substrate.
according to the manufacturing method of the electronic radiator based on 3D printing, the diameter of the upright post ranges from 0.01mm to 1mm, and the height ranges from 0.01mm to 3mm.
According to the manufacturing method of the electronic radiator based on 3D printing, the metal slurry is a mixture of metal nano particles and organic ligands.
According to the manufacturing method of the electronic radiator based on 3D printing, the inner diameter of the 3D printing needle head is larger than 0.001mm.
According to the manufacturing method of the electronic radiator based on 3D printing, which is provided by the invention, the electronic radiator can be directly molded and manufactured on an electronic device through a 3D printing technology, an integrated structure is formed with the electronic device, adhesion or fixation is not needed, and no gap exists between the radiator formed by printing and the electronic device, and other mediums exist; the dimension design is highly free, the manufacturing of the small electronic radiator is realized, the manufacturing efficiency is improved, and the radiating effect of the radiator is good.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
fig. 1 is a schematic flow chart of a method for manufacturing an electronic radiator based on 3D printing;
Fig. 2 is a schematic diagram of a manufacturing process of a fin type heat dissipation structure according to the present invention;
Fig. 3 is a schematic diagram of a manufacturing process of the column type heat dissipation structure provided by the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The following describes a method for manufacturing an electronic heat sink based on 3D printing according to the present invention with reference to fig. 1 to 3. The manufacturing method comprises the following steps:
s1, directly printing a substrate on the surface of an electronic device by using a 3D printing technology;
S2, printing a heat dissipation structure on the substrate by using a 3D printing technology;
And S3, heating, sintering and solidifying the printed substrate and the heat dissipation structure, and forming an integrated structure with the electronic device without additional clamping or pasting.
specifically, the method further comprises the following preparation steps before printing:
filling metal paste into a 3D printing needle cylinder, connecting the metal paste with a pneumatic dispensing machine, fixing an electronic device on a moving table, and enabling the table to perform horizontal movement and lifting movement;
Starting automatic control software, mechanically zeroing an ultrahigh-precision motion control system through a computer automatic control program, moving a machine to the position below a height measurement system (namely a height sensor) through the ultrahigh-precision motion control system of the automatic control program, scanning the surface of an electronic device on the machine, and recording the height position data of the surface of the electronic device;
And the 3D printing needle head is positioned at the printing starting position by the automatic control program ultrahigh-precision motion control system moving table.
Further, by using a direct-writing 3D printing technology, under certain air pressure and speed parameters, extruding metal slurry through an extrusion method to form a linear plane structure, forming a heat dissipation structure on the surface of an electronic device in a layer-by-layer superposition mode, and performing fine adjustment on the height of the surface of the electronic device according to the height data of the surface of the electronic device measured by a height sensor by a machine table in the printing process, so that the printed heights of all layers are the same, and no gap and compactness of the heat dissipation structure between a substrate and the surface of the electronic device are ensured. After printing, the electronic device is taken down, the substrate and the heat dissipation structure are heated, sintered and solidified to form an integrated structure, the bonding strength between the heat dissipation structure and the substrate is improved, and the heat dissipation structure is not applicable to bonding by heat conducting glue, so that the heat dissipation effect is improved.
Further, the inner diameter of the 3D printing needle head is larger than 0.001mm, the range of the optimal selection value is 0.001-1.5 mm, the linear structure printing of the metal wire with the thickness of 0.001-0.5 m can be realized, and the printing needle heads with different inner diameters can be used for realizing the line width printing of the metal wire with various sizes under specific technological parameters. The 3D printer can integrate a plurality of pinheads, a multi-Z-axis controller and multiple stations, and a plurality of pinheads on one device form a heat dissipation structure on one or a plurality of electronic devices at the same time, so that the printing efficiency is greatly improved.
in one embodiment of the present invention, S1 specifically includes:
S11, the electronic device moves to the position below a 3D printing needle containing the metal paste, the metal paste is extruded by the 3D printing needle, and meanwhile, the electronic device is moved, so that the metal paste is printed out of a first layer of substrate on the surface of the electronic device; s12, repeating the step S11 on the first layer of substrate to print out a plurality of layers of substrates. In this embodiment, step S11 is performed by moving the electronic device, matching with the vision and positioning system, so that the 3D printing needle head and the electronic device form a relative motion, and a first layer of substrate is printed on the surface of the electronic device, then step S12 is performed by repeatedly printing a plurality of layers of substrates above the first layer of substrate, and the required substrate is formed by stacking multiple layers of substrates. Further, in this embodiment, two layers of substrates may be printed for stacking, and according to the actual size requirement, multiple layers of substrates may be printed for stacking, which is not limited to this. Further, the movement precision of the machine is 50nm, and the precision of the molding structure is 0.001mm.
In one embodiment of the present invention, the metal paste is a mixture of metal nanoparticles and organic ligands, and the metal nanoparticles may be silver or copper.
in one embodiment of the present invention, the specific steps of S11 are:
S111, extruding metal paste by using a 3D printing needle head, and moving the electronic device along the length direction of the electronic device, so that the 3D printing needle head prints from one end of the electronic device to the other end of the electronic device to print out a first metal wire; s112, moving the electronic device along the width direction of the electronic device by a set distance, repeating the step S111, printing out a second metal wire, and enabling the printed second metal wire to be closely attached to the first metal wire; s113, repeating the step S112, thereby printing out the first layer of substrate. In this embodiment, the substrate has a rectangular structure, so that a first metal line is printed on the electronic device, then a second metal line is printed beside the first metal line, and a plurality of metal lines are printed in the similar way, so that the substrate is tiled to form a whole.
In one embodiment of the present invention, S2 specifically includes:
And printing a fin type heat dissipation structure or a column type heat dissipation structure on the substrate by using a 3D printing needle head filled with metal slurry. In this embodiment, printing of different forms of the heat dissipation structure is completed by the mobile platform, so that a fin type or column type heat dissipation structure can be formed, and corresponding printing processing is performed according to the actual use environment.
The following two examples illustrate the steps of printing the fin and post heat dissipating structures, respectively:
Example 1:
Firstly, printing a substrate on an electronic device by using the method of the embodiment, then printing a heat dissipation structure, and finally heating, sintering and curing, as shown in fig. 2, wherein the specific printing steps comprise:
S211, extruding metal paste by using a 3D printing needle head, reciprocating along the length direction of the electronic device, and descending the electronic device layer by layer, so that the 3D printing needle head prints from one end of the substrate to the other end of the substrate for multiple times, and the printed metal paste is overlapped along the height direction to form a first fin;
S212, moving the electronic device along the width direction of the electronic device for a set distance and lifting the electronic device, repeating the step S211, printing out a second fin, and enabling the second fin and the first fin to be arranged at intervals along the width direction of the electronic device;
S213, repeating the step S212, so that a plurality of fins are printed on the substrate.
And after printing, heating, sintering and solidifying the printed substrate and the heat dissipation structure to form an integrated structure.
It will be appreciated that in step S211, the 3D printing head is moved from one end of the substrate to the other end, a metal wire is printed, then the machine is lowered, printing is repeated on the metal wire, and the first fin having a certain height is formed by a plurality of metal wires stacked in the height direction. In step S212, the second fins are printed at a certain pitch of the first fins according to the above method by moving the machine, and in step S213, a plurality of fins with equal pitch are printed on the substrate to form a fin type heat dissipation structure.
Further, the width of the printed fins is 0.03-1mm, the width is preferably 30-200 μm, the height is 0.01-1 mm, the length and width of the heat dissipation structure formed by the fins can be smaller than 1mm, but the length and width of the general fin structure are designed to be 5mm, and of course, the size of the fin structure can be correspondingly designed according to the size of an actual chip.
example 2:
firstly, printing a substrate on an electronic device by using the method of the embodiment, then printing a heat dissipation structure, and finally heating, sintering and curing, as shown in fig. 3, wherein the specific printing steps comprise:
s221, extruding metal paste by using a 3D printing needle head, enabling the electronic device to descend layer by layer along the height direction, stopping feeding by the 3D printing needle head when the electronic device descends to a set height, and enabling the electronic device to descend rapidly to enable the 3D printing needle head to be separated from the metal paste, so that a first upright post is printed;
S222, horizontally moving the electronic device and lifting the electronic device, repeating the step S221, printing out a second upright post, and enabling the second upright post and the first upright post to be arranged at intervals along the horizontal direction of the electronic device;
S223, repeating the step S222, so that a plurality of upright posts are printed on the substrate.
And after printing, heating, sintering and solidifying the printed substrate and the heat dissipation structure to form an integrated structure.
it can be appreciated that in step S221, the machine is gradually lowered to print the cylindrical structure by the 3D printing needle, and after the printing is completed, the machine is quickly lowered to separate the 3D printing needle from the metal paste, so as to form the first upright post. In step S222, by the horizontal movement and the vertical movement of the machine, the second pillars are printed at the spacing distance of the first pillars by the printing method, and in step S223, a plurality of pillars with equal spacing are printed on the substrate, so as to form a pillar-type heat dissipation structure.
Further, the diameter of the upright post is 0.01-1 mm, and the height is 0.01-3 mm.
According to the manufacturing method of the electronic radiator based on 3D printing, which is provided by the invention, the electronic radiator can be directly molded and manufactured on an electronic device through a 3D printing technology, an integrated structure is formed with the electronic device, adhesion or fixation is not needed, and no gap exists between the radiator formed by printing and the electronic device, and other mediums exist; the dimension design is highly free, the manufacturing of the small electronic radiator is realized, the manufacturing efficiency is improved, and the radiating effect of the radiator is good.
Example 3:
The printing of the heat dissipation structure can be directly printed on electronic devices, and can be printed on metal substrates, silicon wafers or sacrificial materials. The printing method is the same as in the two embodiments, but the small heat sink can be removed later by wire cutting, laser cutting, or the sacrificial material substrate can be removed chemically, thereby obtaining a separate small heat sink. The small-sized heat radiator can be used as a traditional electronic heat radiator, namely, the heat conducting adhesive is used for adhesion, and the small-sized heat radiator is different from the traditional electronic heat radiator in the aspects of ultra-small size and fin width, ultra-high precision and micron-sized manufacturing precision.
The electronic radiator based on 3D printing manufactured by the manufacturing method of the above embodiment includes: the substrate and the heat dissipation structure are manufactured through a 3D printing technology.
The substrate is positioned on the surface of the electronic device, and the substrate is directly printed on the surface of the electronic device by utilizing a 3D printing technology. The substrate is of a planar rectangular structure and is used for printing a heat dissipation structure. The heat dissipation structure is arranged on the substrate, the heat dissipation structure is directly printed on the substrate through a 3D printing technology, and after printing, the heat dissipation structure and the substrate are integrated by heating, sintering and solidifying.
The substrate and the heat radiation structure can be printed by utilizing the 3D printing technology, so that the miniaturized manufacturing of the radiator can be realized, the surface of the electronic device can be directly processed and manufactured, the preparation process is simple, and the heat radiation structure with any shape or form can be printed by utilizing the 3D printing technology, thereby meeting the requirements of different electronic devices. In addition, by adopting the 3D printing technology, proper metal slurry can be selected for printing, so that a good heat dissipation effect is achieved.
The electronic radiator based on 3D printing provided by the invention is based on a high-precision 3D printing direct-writing technology, has high freedom in dimension design, and realizes the manufacture of small-sized and ultrathin radiators; the radiator can be directly manufactured on the electronic device, an integrated structure is formed with the electronic device, adhesion or fixation is not needed, gaps and other mediums are not needed between the printed radiator and the electronic device, and the radiator has a good radiating effect.
As shown in fig. 2, if the heat dissipation structure adopts a fin type heat dissipation structure, the fin type heat dissipation structure includes a plurality of fins, the fins are vertically fixed on the substrate, and the fins are arranged in parallel; the distance between the adjacent fins is equal and the substrate is fully distributed.
as shown in fig. 3, if the heat dissipation structure adopts a column heat dissipation structure, the column heat dissipation structure includes a plurality of columns, and the columns are vertically fixed on the substrate; the spaces between adjacent upright posts are equal and are fully distributed with the substrate.
From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on this understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the respective embodiments or some parts of the embodiments.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (5)
1. the manufacturing method of the electronic radiator based on 3D printing is characterized by comprising the following steps of:
filling metal paste into a 3D printing needle cylinder, connecting the metal paste with a pneumatic dispensing machine, fixing an electronic device on a moving table, and enabling the table to perform horizontal movement and lifting movement;
starting automatic control software, mechanically zeroing an ultrahigh-precision motion control system through a computer automatic control program, moving a machine table to the position below a height sensor through the ultrahigh-precision motion control system of the automatic control program, scanning the surface of an electronic device on the machine table, and recording the surface height position data of the electronic device;
The 3D printing needle head is positioned at a printing starting position by an automatic control program ultrahigh-precision motion control system moving table;
s111, extruding metal paste by using a 3D printing needle head, and moving the electronic device along the length direction of the electronic device, so that the 3D printing needle head prints from one end of the electronic device to the other end of the electronic device to print out a first metal wire;
S112, moving the electronic device along the width direction of the electronic device by a set distance, repeating the step S111, printing out a second metal wire, and enabling the printed second metal wire to be closely attached to the first metal wire;
S113, repeating the step S112, so as to print out a first layer of substrate;
S12, repeating the steps S111 to S113 on the first layer of substrate to print out a plurality of layers of substrates;
S2, printing a fin type heat dissipation structure or a column type heat dissipation structure on the substrate by utilizing a 3D printing needle head filled with metal slurry;
S3, heating, sintering and solidifying the printed substrate and the heat dissipation structure to form an integrated structure;
Wherein, utilize the 3D print head that holds metal thick liquids to print out fin formula heat radiation structure on the basement, include:
S211, extruding metal paste by using a 3D printing needle head, reciprocating along the length direction of the electronic device, and descending the electronic device layer by layer, so that the 3D printing needle head prints from one end of the substrate to the other end of the substrate for multiple times, and the printed metal paste is overlapped along the height direction to form a first fin;
S212, moving the electronic device along the width direction of the electronic device for a set distance and lifting the electronic device, repeating the step S211, printing out a second fin, and enabling the second fin and the first fin to be arranged at intervals along the width direction of the electronic device;
s213, repeating the step S212, so as to print a plurality of fins on the substrate;
The method for printing the column type heat dissipation structure on the substrate by using the 3D printing needle head filled with metal slurry comprises the following steps:
s221, extruding metal paste by using a 3D printing needle head, enabling the electronic device to descend layer by layer along the height direction, stopping feeding by the 3D printing needle head when the electronic device descends to a set height, and enabling the electronic device to descend rapidly to enable the 3D printing needle head to be separated from the metal paste, so that a first upright post is printed;
S222, horizontally moving the electronic device and lifting the electronic device, repeating the step S221, printing out a second upright post, and enabling the second upright post and the first upright post to be arranged at intervals along the horizontal direction of the electronic device;
S223, repeating the step S222, so that a plurality of upright posts are printed on the substrate;
The machine platform performs fine adjustment on the height of the surface of the electronic device according to the height data measured by the height sensor in the printing process, so that the printed heights of each layer are the same, and the compactness of the substrate, the heat dissipation structure and the surface of the electronic device is ensured without gaps.
2. The method for manufacturing the electronic radiator based on 3D printing according to claim 1, wherein the width of the fin ranges from 0.03 mm to 1mm.
3. The method for manufacturing the electronic radiator based on 3D printing according to claim 1, wherein the diameter of the upright post ranges from 0.01mm to 1mm, and the height ranges from 0.01mm to 3mm.
4. The method for manufacturing an electronic heat sink based on 3D printing according to claim 1, wherein the metal paste is a mixture of metal nanoparticles and organic ligands.
5. The method for manufacturing a 3D printing-based electronic heat sink according to any one of claims 1 to 4, wherein the inner diameter of the 3D printing needle is larger than 0.001mm.
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